2SK2885 (L), 2SK2885 (S) : Silicon N Channel MOS FET High Speed Power Switching
2SK2885 (L), 2SK2885 (S) : Silicon N Channel MOS FET High Speed Power Switching
2SK2885 (L), 2SK2885 (S) : Silicon N Channel MOS FET High Speed Power Switching
Outline
LDPAK
4 4
D 1 1 G 2 3
2SK2885(L), 2SK2885(S)
Absolute Maximum Ratings (Ta = 25C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Notes: 1. PW 10s, duty cycle 1 % 2. Value at Tc = 25C Symbol VDSS VGSS ID I D(pulse)* I DR Pch* Tch Tstg
2 1
Unit V V A A A W C C
2SK2885(L), 2SK2885(S)
Electrical Characteristics (Ta = 25C)
Item Drain to source breakdown voltage Gate to source breakdown voltage Zero gate voltege drain current Gate to source leak current Symbol V(BR)DSS V(BR)GSS I DSS I GSS Min 30 20 1.0 20 Typ 10 15 30 1570 1100 410 32 300 180 200 1.0 75 Max 10 10 2.0 14 25 Unit V V A A V m m S pF pF pF ns ns ns ns V ns I F = 45A, VGS = 0 I F = 45A, VGS = 0 diF/ dt = 50A/s Test Conditions I D = 10mA, VGS = 0 I G = 100A, VDS = 0 VDS = 30 V, VGS = 0 VGS = 16V, VDS = 0 I D = 1mA, VDS = 10V I D = 20A, VGS = 10V*1 I D = 20A, VGS = 4V*1 I D = 20A, VDS = 10V*1 VDS = 10V VGS = 0 f = 1MHz VGS = 10V, ID = 20A RL = 0.5
Gate to source cutoff voltage VGS(off) Static drain to source on state RDS(on) resistance Forward transfer admittance Input capacitance Output capacitance RDS(on) |yfs| Ciss Coss
Reverse transfer capacitance Crss Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Note: 1. Pulse test t d(on) tr t d(off) tf VDF t rr
2SK2885(L), 2SK2885(S)
Main Characteristics
Power vs. Temperature Derating 100 Pch (W) 1000 I D (A) 300 100 30 10 3 1 10 s
10
75
Channel Dissipation
Drain Current
DC
PW
50
25
Op 10 m (T erat s c = io 25 n C )
50
100
150 Tc (C)
200
Case Temperature
0.3 Ta = 25C 1 shot pulse 0.1 3 30 0.1 0.3 1 10 100 Drain to Source Voltage V DS (V)
Normalized Transient Thermal Impedance vs. Pulse Width 3 Normalized Transient Thermal Impedance s (t) Tc = 25C 1 D=1 0.5
0.3
0.2
0.1
0.1
0.05
0.03
D=
PW T
0.01 10
100
1m
10
2SK2885(L), 2SK2885(S)
Switching Time Test Circuit Vin Monitor D.U.T. RL Vin Vin 10 V 50 V DD = 10 V Vout 10% 10% 90% td(on) tr 90% td(off) tf 10% Vout Monitor Switching Time Waveforms
90%
2SK2885(L), 2SK2885(S)
Package Dimensions
Unit: mm
10.2 0.3
(1.4)
4.44 0.2
1.3 0.2
11.3 0.5
10.2 0.3
(1.4)
4.44 0.2
1.3 0.2
(1.5)
(1.5)
(1.5)
0.76 0.1
11.0 0.5
1.27 0.2
2.59 0.2
1.2 0.2
L type
S type
1.27 0.2
LDPAK
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachis or any third partys patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third partys rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachis sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachis sales office for any questions regarding this document or Hitachi semiconductor products.
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URL
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