HD74HC240: Octal Buffers/Line Drivers/Line Receivers (With Inverted 3-State Outputs)
HD74HC240: Octal Buffers/Line Drivers/Line Receivers (With Inverted 3-State Outputs)
HD74HC240: Octal Buffers/Line Drivers/Line Receivers (With Inverted 3-State Outputs)
Description
The HD74HC240 is an inverting buffer and has two active low enables (1G and 2G ). Each enable independently controls 4 buffers. This device does not have schmitt trigger inputs.
Features
High Speed Operation: tpd = 10 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 A max Low Quiescent Supply Current: ICC (static) = 4 A max (Ta = 25C)
Function Table
Inputs G H L L H L X Z : : : : A X H L high level low level irrelevant off (high-impedance) state of a 3-state output Output Y Z L H
HD74HC240
Pin Arrangement
1 2 3 4 5 6 7 8 9
20 VCC 19 2G 18 1Y1 17 2A4 16 1Y2 15 2A3 14 1Y3 13 2A2 12 1Y4 11 2A1 (Top view)
GND 10
HD74HC240
Logic Diagram
To three other 7 inverters One of 8 inverters
VCC Input A
Strobe G
HD74HC240
DC Characteristics
Ta = 25C Item Input voltage Symbol VIH Ta = 40 to +85C Max 0.5 1.35 1.8 0.1 0.1 0.1 0.33 0.33 5.0 1.0 40 A A A I OL = 6 mA I OL = 7.8 mA Vin = VIH or VIL, Vout = VCC or GND Vin = VCC or GND Vin = VCC or GND, Iout = 0 A V I OH = 6 mA I OH = 7.8 mA Vin = VIH or VIL I OL = 20 A V Vin = VIH or VIL I OH = 20 A V Unit V Test Conditions
VCC (V) Min Typ Max Min 2.0 4.5 6.0 1.5 3.15 4.2 0.5 1.5 3.15 4.2
VIL
Output voltage
VOH
VOL
I OZ Iin I CC
HD74HC240
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25C Item Symbol Ta = 40 to +85C Max 115 23 20 115 23 20 190 38 33 190 38 33 190 38 33 190 38 33 75 15 13 10 pF ns ns ns ns ns ns Unit ns Test Conditions
t PLH
t ZL
150 30 26
t ZH
150 30 26
t LZ
150 30 26
t HZ
150 30 26 60 12 10 10
t TLH t THL
Input capacitance
Cin
Unit: mm
0.51 Min
2.54 0.25
0.48 0.10
0.25 0.05 0 15
+ 0.11
Unit: mm
12.6 13 Max
20
11
10
5.5
0.80 Max
2.20 Max
1.15
0.10 0.10
0 8
0.70 0.20
0.15
0.12 M
*Dimension including the plating thickness Base material dimension
Unit: mm
12.8 13.2 Max 20 11 7.50 1 0.935 Max 10
2.65 Max
1.45 0 8
0.57 0.70 + 0.30
1.27
*0.42 0.08 0.40 0.06
0.12 M
*Dimension including the plating thickness Base material dimension
Unit: mm
6.50 6.80 Max 20 11 4.40 1 10 0.65 0.20 0.06 *0.22+0.08 0.07 0.13 M 0.65 Max *0.17 0.05 0.15 0.04 1.10 Max 0.07 +0.03 0.04 0 8 0.50 0.10 1.0 6.40 0.20 0.10
TTP-20DA 0.07 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachis or any third partys patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third partys rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachis sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachis sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
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URL
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Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
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