Wood glue
Wood glue
Wood glue
Wood adhesive or wood glue are polymeric material that are interacting physically and
chemically between the wood surface and stress is transferred in such a way between the
membranes are bonded without detachment and breaking of the bonds.
Physic chemical phenomenon of adhesion plays an important role not only in wood products but
also in paper products. The largest amount of adhesive is used to manufacture building materials
such as plywood and other laminated veneer products, particle board fiber board, laminated
beam sand timbers, products, windows and their frames, and fiberglass insulations.
Adhesives allow us the manufacture of useful products from residues and waste wood by
minimizing natural defects by reassembly of small wood to from a verity of new composites by
blending wood materials with non wood materials such as plastics and cement.
In future wood glue is becoming a major factor not only utilizing forest as a source of raw
material and recycling wood which is waste
Efficiency in converting trees and waste wood to useful iproducts will help to ensure the
continual conservation of forest resources.
Epoxy resin:
Epoxy resin is two part mix system, cures under elevate temperatures and water content
than other glues does not require high pressure while curing, and having good gap-filling
properties:. Use of epoxy requires careful attention to the mixing ratio of the two parts. It
bonds to most cured wood glues Two part epoxy adhesive is very resistant to salt water
and UV light , epoxy is heat resistant up to 177 °C the formulations containing powdered
metal and rubber or plasticizers are very tough and shock resistant. Epoxy can trigger
long-term sensitivity (allergies) from over exposure, and expensive.
Cyanoacrylate :
Trade name (Crazy glue, Superglue, CA or CyA)
is used mainly for small repairs like wood turners. It bonds instantly, including to skin.
Cured Cyano Acrylate is essentially a plastic material that are able to wick into tight
Name Sidra Arshad (S2016140024) MS chemistry ( Green chemistry CH 523)
joints but bond with reduced strength because drips out and soaks into the wood leaving
very little on the surface for the bond or thicker formulation called gel which can fill
very small gaps, do not flow out of the joint, fix it and do not soak so quickly into wood.
Thinner cyanoacrylate glue does not bond more quickly and not form shorter polymer
chains than the gel version when used on wood. The chemical nature of wood
significantly delays polymerization of cyanoacrylate. When it finally polymerizes in a
wood joint, enough gel remains for a better bond than with the thin version. When using
the gel, too much glue will weaken the resulting bond.
Casein is type of glue was used to make a strong joints in early aviation, but fell out of
favor due to its susceptibility to attack by bacteria.
Phenol formaldehyde resin are major adhesive used for bonding wood panels and for the
production of soft ply wood , and wafer board .
The PF resin formed by the reaction of formaldehyde with phenol by changing the reaction
condition such as temperature, time and catalyst to from a hydroxyl methyl group to from methyl
linkage at aromatic ring . High ortho novolac resin form under week acidic condition with
divalent metal salts to from polymeric resin is produced.iii
condition , like hardening , low temperature , micro organism , water solubility and thermal
resistance.
The major drawback of UF resin is compare with PF resin is to lack of resistance to moist
condition Specially in combination with heat .Synthesis of UE resin takes place in two stages
1. Urea is hydro methylated by addition of formaldehyde hydroxyl methyl urethane. At PH
of 8-9 basic conditions.
2. In second step reaction condition made it acidic (PH 5) and condensation takes place until
the desire viscosity is achieved.
WOOD bonding :
The bonding of adhesive material on surface of the wood depends on surface properties of wood
and also physical properties such as density , moisture content , and dimensional movement.
Density is a crude indicator of bond ability of wood high density wood is difficult to bond but
low density wood bonded quite easily because of thinner cell wall
Name Sidra Arshad (S2016140024) MS chemistry ( Green chemistry CH 523)
and elevated
temperatures
Soybean, Protein Mixed with Moderate to low Softwood plywood for
protein Powder with cold water, dry strength interior use,now
added lime, caustic replaced byphenolic
chemicals; soda, and resin.
white to tan, other
similar color chemicals
in bond line
Epoxy completely reactive with High dry and wet assembly of wood
resins reactive limited pot- strength to wood, components in aircraft.
leaving no life, cured at metal, glass, and lamination of
free solvent, room or plastic. architectural railings
clear to elevated and posts repair of
amber, temperatures, laminated wood beams
colorless and architectural
bond line building components
Hot melts ribbons, Solid form Develops strength Edge banding of panels
rods, or melted for quickly on cooling plastic lamination,
films spreading lower strength patching.
bond formed than conventional
on wood adhesives
solidification moderate
requires resistance to
special moisture.
application
equipment for
controlling
melt and flow.
Isocyanate Liquid resin Resin applied High dry and wet Flakeboards
containing directly by strength; very strandwood products
isomers and spray or resistant to water lamination of
oligomers of coating by and damp components.
methylene user reactive atmosphere
diphenyl with water, adheres to metals
diisocyanate but requires and plastics.
reactive with high
water; light. temperature
and high
pressure for
best bond
development.
Name Sidra Arshad (S2016140024) MS chemistry ( Green chemistry CH 523)
Conclusion :
Adhesive bonding of wood is not only key to the efficient utilization of wood but also it is
an important factor in the development and growth of forests product industries. The demand of
wood and wood products increases as the population of the world increases to overcome this
demand the utilization of wood in fragile ecosystem in which wood grow is maximized.
adhesives will continue to be important to both the consumer and manufacturer of wood and
wood products . Adhesive system is expected to improve because of adhesive to utilization of
wood Future areas for the improvement of adhesive systems will concentrate on increased
durability, faster cure, and cure in the presence of higher moisture contents .These types meet the
needs of the consumer of wood products and the forest products industry very well. It is expected
that these adhesive systems, or new adhesive systems based on the same basic types of chemistry
will continue to be the primary adhesive types used to bond wood for beneficial purpose for
utilization of wood.
Name Sidra Arshad (S2016140024) MS chemistry ( Green chemistry CH 523)
i
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atneutral conditions .In:Hemingway,R.W.,Conner,A.H..
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