Datasheet

RAA223010
700V AC/DC Buck Regulator with Ultra-Low Standby Power

The RAA223010 is a universal input AC/DC switching Features

buck regulator with ultra-low standby power that
▪ Ultra-low standby power (<15mW)
features a 700V integrated MOSFET capable of
delivering 10W output power. It supports output ▪ No audible noise
voltage as low as 3.3V. ▪ Low quiescent current (<75µA)

The RAA223010 combines constant off-time control ▪ Output voltage as low as 3.3V
for heavy load and Pulse Frequency Modulation ▪ Low EMI with frequency dithering
(PFM) for light-load operation. Constant off-time ▪ 7 Ld SOIC package
controls switching frequency above the audible ▪ Programmable PFM allows optimization of COUT
frequency around 45kHz. PFM eliminates any
for various standby power requirements
potential noises while offering superior light-load
▪ Protection features: Short-Circuit Protection (SCP),
efficiency and ultra-low power consumption (<15mW
at no load). The efficiency is achieved up to 80%. The Overload Protection (OLP), Overvoltage Protection
built-in frequency dithering further reduces the EMI (OVP), open feedback protection, and
Over-Temperature Protection (OTP).
noise spectrum.
The RAA223010 features input brownout protection Applications
that prevents input circuitry from overcurrent at low
▪ Home appliances
input voltage. The device also features hiccup
protections for output fault conditions such as ▪ Home automation, IoT, and sensors
short-circuit, overload, overvoltage, and open ▪ Metering and Industry control
feedback. ▪ Bias power
The RAA223010 is available in a small 7 Ld SOIC
package.
Table 1. Maximum Output Current (Maximum Ambient 85°C)

Output Setting Voltage (V) 120VAC 230VAC 90VAC~265VAC

3.3 0.49A 0.5A 0.47A

5 0.5A 0.5A 0.5A

9 0.5A 0.5A 0.49A

12 0.5A 0.49A 0.46A

15 0.48A 0.5A 0.46A

24 0.42A 0.45A 0.4A

R2 D4

L1
DRAIN VCC
C3
RFB1 D3
RAA223010 FB
CFB1
FR CVCC
D1 +C1 + C2 RFB2
SOURCE SOURCE
VIN
CFB2 L2 V OUT
85VAC~265VAC
D2 COUT
R1

Figure 1. Typical RAA223010 Buck Application Circuit

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RAA223010 Datasheet

Contents
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Pin Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 ESD Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3 Thermal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.5 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4. Typical Characterization Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5. Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1 Constant Off-Time Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2 PFM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.3 Output Voltage Sampling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4 Soft Start-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.5 Overload Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.6 Short-Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6. Application Topologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7. Design Guidance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.1 Feedback Resistor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.2 Output Inductor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.3 Feedback Capacitor (CFB1) Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.4 Output Capacitor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.5 Bias Capacitor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.6 Dummy Resistor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.7 Power Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.8 PCB Layout Guidance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8. EMI Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9. Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
10. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
11. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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RAA223010 Datasheet

1. Overview
1.1 Block Diagram
E/A -
Minimum Off-Time
22µs - 300µs +

-
Minimum DRAIN
Off E/A+

FB E/A+

10x PFM S Q DRV

2.5V E/A -

R Qb

Maximum
Soft-Start On
Logic
Current
Overload Comparator
1.7V

IPK
Blank IPK
Overvoltage Fault Logic
2.5V
3V

4V UVLO
OT E/A+

DRAIN +
VCC LDO and Ref
-
SOURCE
E/A -

Figure 2. Block Diagram of RAA223010

2. Pin Information
2.1 Pin Assignments

VCC 1 8 SOURCE

FB 2 7 SOURCE

6 SOURCE

DRAIN 4 5 SOURCE

Top View

2.2 Pin Descriptions

Pin Number Pin Name Description

1 VCC IC supply voltage

2 FB Feedback pin

4 DRAIN Internal power MOSFET drain

5, 6, 7, 8 SOURCE Internal power MOSFET source

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3. Specifications
3.1 Absolute Maximum Ratings
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such
conditions can adversely impact product reliability and result in failures not covered by warranty.

Parameter Minimum Maximum Unit

VCC -0.3 +6.5 V

VFB -0.3 +6.5 V

DRAIN (to SOURCE) - 0.3 700V V

Continuous Power Dissipation (TA = +25°C) 1 W

3.2 ESD Ratings

ESD Model/Test Rating Unit

Human Body Model (Tested per JS-001-2017) 1.2 kV

Charged Device Model (Tested per JS-002-2018) 1 kV

Latch-Up (Tested per JESD78E; Class 2, Level A) 100 mA

3.3 Thermal Information

Thermal Resistance (Typical) θJA (°C/W)[1] θJC (°C/W)[2]

7 Ld SOIC 63 24
1. θJAis measured in free air with the component mounted on a 1-layer test board with thermal copper 280mm2.
2. For θJC, the case temperature location is taken at the package top center.

Parameter Minimum Maximum Unit

Maximum Junction Temperature +150 °C

Maximum Storage Temperature Range -60 +150 °C

Pb-Free Reflow Profile See TB493

3.4 Recommended Operating Conditions

Parameter Minimum Maximum Unit

Supply Voltage, VDRAIN 375 V

Ambient Temperature -40 +85 °C

Output Voltage 3.3 V

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3.5 Electrical Specifications

Typical operating conditions at 25°C, VDRAIN = 100V, VCC = 5.6V, TJ = -40 to +125°C, unless otherwise specified.

Parameter Symbol Test Conditions Min[1] Typ Max[1] Unit

Startup and Power FET

Internal VCC Startup Current IVCC_START VCC = 4V 1.5 mA

Drain Leakage Current ID_LEAK VCC = 0V, VDRAIN = 375V, VFB = 2.6V 1 10 µA

IDRAIN Bias ID_BIAS VCC = 5.9V, VDRAIN = 375V 1 10 µA

Power FET Breakdown Voltage VDS(BR) TJ = 25°C 700 V

TJ = 25°C, IDS = 30mA, VCC = 5.8V 6.8 8.5 Ω

Power FET On-Resistance rDS(ON)
TJ = 125°C 11.9 13.3 Ω

VCC Supply

VCC Start (Rising) VCC_START 5.5 5.9 6.2 V

VCC when Internal Regulator Off VCC_OFF 5.5 5.9 6.2 V

VCC (Falling) Regulator On at

VCC_ON 5.1 5.6 5.9 V
Startup

Internal VCC On/Off Hysteresis VCC_HYS 0.3 0.35 0.45 V

VCC (Falling) Regulator On after

VCC_ON_SS 4.25 4.6 4.8 V
Startup

VCC Undervoltage Threshold

VCC_UVLO IC stop switching 3.7 4 4.4 V
(Falling)

VCC Shunt Regulator On (Rise) VCC_SON External VCC supply, internal shunt on 6.1 6.5 V

VCC Shunt Regulator Off (Fall) VCC_SOFF External VCC supply, internal shunt off 6.0 6.4 V

VCC Quiescent Current IVCC_Q VFB > 2.5V, no switching 75 103 µA

VFB < 2.5V, switching frequency = 45kHz,

VCC Current During Switching IVCC 175 230 µA
D = 0.5, VCC = VCC_ON + 0.1V

VCC Discharging Current Hiccup

IQVCC3 VCC discharge timing for fault hiccup delay 20 33 µA
Timing

Current Sense

Peak Current Limit IPK di/dt = 100mA/µs, VCC = 5.8V 685 810 915 mA

SCP Threshold[2] ISC_TH 1.4 A

Minimum Peak Current IPKMIN VIN = 85VAC, IOUT = 0, VCC = 5.8V 120 mA

Leading Edge Blank Time tLEB TJ = 25°C, VCC = 5.8V 220 280 ns

Feedback

Feedback Voltage VFB TJ = 25°C, VCC = 5.8V 2.39 2.5 2.64 V

Transconductance GM IPK GM, VCC = 5.8V 15 S

Feedback Undervoltage
VFBUV VCC = 5.7V 1.6 1.7 1.8 V
Threshold

Feedback Threshold for Increased

VFB_TOFFMIN VCC = 5.0V 0.67 0.85 0.98 V
Off-Time

Feedback Overvoltage VFBOV 2.7 3 3.3 V

Timing

Minimum Off-Time tOFF_MIN VCC = 5.0V 19 22 26 µs

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RAA223010 Datasheet

Typical operating conditions at 25°C, VDRAIN = 100V, VCC = 5.6V, TJ = -40 to +125°C, unless otherwise specified.

Parameter Symbol Test Conditions Min[1] Typ Max[1] Unit

Maximum On-Time tON_MAX VCC = 5.0V 19 22 25 µs

Minimum Off-Time in Short-Circuit tOFFMIN_SC VCC = 5.0V 156 µs

Hiccup Restart Delay tHICC CVCC = 1µF 100 ms

OLP Timer tOLP fSW = 45kHz, VFB < 1.7V, VCC = 5.0V 1024 cycle

Thermal

Over-Temperature Threshold OTPTH 150 °C

Over-Temperature Hysteresis OTPHYS 30 °C

1. Compliance to datasheet limits is assured by one or more methods: production test, characterization, and/or design.
2. Compliance to limits is established by design.

4. Typical Characterization Graphs

Typical operating conditions at 25°C, VDRAIN = 100V, VCC = 5.6V, VOUT = 12V, IOUT = 500mA, L2 = 1000µH, COUT = 330µF, unless
otherwise specified.

2.510 5.90

2.505 5.89

5.88
2.500
VCC_OFF (V)
VFB (V)

5.87
2.495
5.86
2.490
5.85
2.485 5.84

2.480 5.83
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)

Figure 3. Feedback Voltage vs Temperature Figure 4. VCC Start/Upper Limit vs Temperature

200 4.020

190
Supply Current (μA)

4.015
VCC_UVLO (V)

180
4.010
170

4.005
160

150 4.000
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)

Figure 5. IC Supply Current vs Temperature Figure 6. VCC Undervoltage Threshold vs Temperature

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RAA223010 Datasheet

Typical operating conditions at 25°C, VDRAIN = 100V, VCC = 5.6V, VOUT = 12V, IOUT = 500mA, L2 = 1000µH, COUT = 330µF, unless
otherwise specified. (Cont.)

100 12
Quiescent Current (μA)

90 10

rDS(ON) (Ω)
80 8

70 6

60 4
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)

Figure 7. IC Quiescent Current vs Temperature Figure 8. On-Resistance vs Temperature

23.5 22.6

23.3 22.4

23.1 22.2
tON_MAX (μs)
tOFF_MIN (μs)

22.9 22.0

22.7 21.8

22.5 21.6
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)

Figure 9. Minimum Off-Time vs Temperature Figure 10. Maximum On-Time vs Temperature

VOUT 5V/Div VOUT 5V/Div

IL 500mA/Div IL 500mA/Div

10ms/Div 5ms/Div

Figure 11. Startup (VIN = 230VAC) Figure 12. Startup (VIN = 230VAC, No Load)

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RAA223010 Datasheet

Typical operating conditions at 25°C, VDRAIN = 100V, VCC = 5.6V, VOUT = 12V, IOUT = 500mA, L2 = 1000µH, COUT = 330µF, unless
otherwise specified. (Cont.)

VOUT 5V/Div
VCC 2V/Div

VOUT 5V/Div

IL 500mA/Div

IL 500mA/Div

50ms/Div 1s/Div

Figure 13. Short-Circuit Protection (VIN = 230VAC) Figure 14. Over-Temperature Protection (VIN = 230VAC)

VCC 2V/Div

15

12
PIN_STBY (mW)

VOUT 5V/Div
9

IOUT 500mA/Div
0
75 125 175 225 275
50ms/Div Vin_AC (V)

Figure 15. Overload Protection (VIN = 230VAC) Figure 16. No Load Power Loss

85 76
83 74
81 72
79 70
Efficiency (%)
Efficiency (%)

77 68
75 66
73 64
71 62
69 90Vac 110Vac 60 90Vac 110Vac
67 220Vac 265Vac 58 220Vac 265Vac
65 56
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
Load Current (A) Load Current (A)

Figure 17. Efficiency with 12V Output Figure 18. Efficiency with 5V Output

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RAA223010 Datasheet

Typical operating conditions at 25°C, VDRAIN = 100V, VCC = 5.6V, VOUT = 12V, IOUT = 500mA, L2 = 1000µH, COUT = 330µF, unless
otherwise specified. (Cont.)

VOUT 100mV/Div, AC Coupled

13.0
12.8 90Vac 110Vac
12.6 220Vac 265Vac

Output Voltage (V)

12.4
12.2
IL 200mA/Div
12.0
11.8
11.6
11.4
11.2
11.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
20ms/Div Load Current (A)

Figure 19. Dynamic Load (VIN = 230VAC) Figure 20. Load Regulation

5. Detailed Description
The RAA223010 adopts the high-side float switching topology, as shown in Figure 1. A floating VCC supplies IC
operation. The output voltage is sensed on the FB pin from an RC sampling network connected to the output and
compared with the internal reference through an error amplifier that controls the peak current accordingly.

5.1 Constant Off-Time Mode

In heavy load, the power FET is turned on after a constant off-time. Because the on-time is comparably much
smaller than the off-time, the IC operates with quasi-constant frequency. When the load current goes lower, the
peak current lowers while still switching around 45kHz until it hits the minimum peak current limit. No audible
noises can be heard because the switching frequency is always kept around 45kHz during operation.

5.2 PFM Mode

When the load current decreases below a specific value, the peak current is kept at the minimum level, while the
off-time is gradually increased to maintain the output regulation. The IC goes into Pulse Frequency Modulation
(PFM) operation, as Figure 21 shows. Therefore, losses are reduced because of switching frequency reduction.

Ipkmin

No Load

Ipkmin

Light load

Ipkmin

Upper limit load of PFM operation (fSW = 45kHz)

Figure 21. PFM Operation in Light Load

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During this mode, while the switching frequency is reduced below 1kHz at no load, the audible noise is minimized
by keeping the peak current at the minimum level. In the meantime, because of the low IC biasing current and
small peak current, the standby power can be achieved below 15mW. The previous operation is shown in
Figure 22 and Figure 23.

IL

fSW IPK
45kHz Audible
Noise

IPKMIN
1kHz

IOUT fSW
2
POUT_STBY/VOUT 0.5LI PKMIN fSW/VOUT 1kHz 45kHz

Figure 22. Switching Frequency vs IOUT Figure 23. Peak Current vs Switching Frequency

5.3 Output Voltage Sampling

The RC sampling network samples the output voltage through a forward-biased D3 when D2 is free-wheeling.
When the D2 cathode goes high and D2 stops conducting current, the sampled voltage across CFB1 is discharged
by RFB1 and RFB2. In constant off-time operation, the FB pin voltage is slightly below the internal reference. The
power FET is set on after a constant off-time. In PFM mode, when the sampled voltage on FB pin drops to internal
reference, the power FET is clocked on. In this way, the light-load switching is set by the CFB1, RFB1, and RFB2 for
the corresponding load. Therefore, the required no-load standby power is achieved by choosing CFB1, allowing
you the flexibility to design your circuit for various standby power requirements. For detailed design guidance, see
Feedback Capacitor (CFB1) Selection.

5.4 Soft Start-Up

The RAA223010 starts up with the VCC capacitor charged by an internal HV current source. When the VCC
reaches up to 5.9V, the IC begins switching, the internal HV current source is turned off, and a start-up timer
begins. When VCC drops below 5.6V, the HV current source is on again, which is determined by the actual IC
supply current. During the start-up, the output voltage ramps up gradually, which is controlled by a variable off-
time set by the feedback voltage. After the timer expires (start-up is finished), the HV current source is on again
only when VCC drops to 4.6V. When VOUT is established, VCC can be supplied by VOUT (optional) to save power
consumption for high-efficiency and low-standby power, as Figure 24 shows.

R2 D4

L1
DRAIN VCC
C3
RFB1 D3
FB
RAA223010 CFB1
FR C1 C2 CVCC
D1 + + RFB2
SOURCE SOURCE

85VAC~265VAC CFB2 L2 V OUT

D2 COUT
R1

Figure 24. RAA223010 Low Standby Power Buck Regulator

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Figure 25 shows the start-up diagram.

VIN

5.9V
5.6V
4.6V
VCC

IPK
IL

VOUT

Start-Up Blanking

Figure 25. RAA223010 Start-Up Diagram

5.5 Overload Protection

With the fixed minimum off-time (when VFB ≥ 0.85V), the maximum load current that the RAA223010 allows is
limited for a given output voltage and inductor, and therefore, is the maximum output current. However, when the
output voltage continues to drop during the overload, the FET power losses increase and can cause potential IC
overheating. Therefore, when VFB reaches 1.7V, an internal comparator is triggered and starts an Overload
Protection (OLP) timer. When the timer is expired, the overload situation is identified, and the IC shuts off. VCC is
discharged by a 20µA internal current source to 4V, and then charged up to 5.9V to resume switching (the interval
without switching is the hiccup time). The overload protection time sequence is shown in Figure 26.

VOUT
0.68VOUT

5.9V
5.6V
VCC 4.6V
4V

IL

Start-Up Start-Up
OLP Timer Hiccup Time Timer Hiccup Time Timer

Figure 26. RAA223010 Overload Protection Diagram

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5.6 Short-Circuit Protection

When the output is shorted (VOUT = 0), VFB drops to zero because of the feedback network, introducing a delay.
Before VFB drops to VFB_TOFFMIN, the RAA223010 operates with tON_MAX and tOFF_MIN, which quickly builds up a
high current (>0.9A) because the inductor peak current does not get reset. When the current reaches ISC_TH, a
timer is started. If the inductor current reaches ISC_TH for four consecutive cycles, the RAA223010 determines that
a short-circuit is present and immediately shuts off switching. The IC quickly charges VCC up to 5.9V and
discharges it with a 20µA current source to 4V. When VCC drops to 4V, a 1.5mA current source charges VCC back
to 5.9V where the IC resumes switching.
When the RAA223010 resumes switching, assuming VFB drops to zero, the IC operates with the increased
tOFFMIN_MAX so the inductor current can fully reset below the maximum peak limit. The RAA223010 operates in
CCM with the inductor peak current limited at 810mA. The part remains in hiccup mode until the short is removed.
When the short is removed, VOUT returns to normal. This procedure is shown in Figure 27.

5.9V
VCC
5.6V
4.6V
4V

VFB

VFB_TOFFMIN

VOUT

ISC_TH

IL

Hiccup Time Start-Up Hiccup Time

Timer

Figure 27. RAA223010 Short-Circuit Protection Diagram

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RAA223010 Datasheet

6. Application Topologies
L1
R2
DRAIN VCC

RFB1 D3
FB
RAA223010 CFB1
FR
D1 + C1 + C2 CVCC
RFB2
CFB2
SOURCE SOURCE
VIN
L2 VOUT
85VAC~265VAC D2 COUT
R1

Figure 28. RAA223010 Buck with VCC Backfeed from CFB1

R2
L1
DRAIN VCC
C3
RFB1 D3
FB CFB1
FR RAA223010
+ C1 + C2 CVCC
D1 RFB2
SOURCE SOURCE
VIN L2
CFB2 VOUT
85VAC~265VAC D2 COUT R1

Figure 29. RAA223010 Buck with 5V Output

L1
DRAIN VCC
RFB1 D3
FB
C2 RAA223010 CFB1
FR
D1 + C1 + CVCC
RFB2
CFB2
SOURCE SOURCE
VIN
L2 VOUT
85VAC~265VAC D2 COUT
R1

Figure 30. RAA223010 Buck with 3.3V Output

L1 R2
DRAIN VCC
RFB1 D3
FB CFB1
FR RAA223010
+ C1 + C2 CVCC
D1 CFB2 RFB2 D2 COUT
SOURCE SOURCE
VIN
VOUT
85VAC~265VAC
L2 R1

Figure 31. RAA223010 Buck/Boost

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RAA223010 Datasheet

7. Design Guidance
To simplify the analysis, the following design guidelines are based on the circuit shown in Figure 1.

7.1 Feedback Resistor Selection

The output voltage is set by the resistor divider of RFB1 and RFB2. Because of the diode forward voltage mismatch
between the feedback diode D3 and free-wheeling diode D2, an additional 0.5V offset is added in Equation 1 to
calculate the resistor values of RFB1 and RFB2. A series resistor with D3 can help decrease the mismatch effect.

R FB1 V OUT + 0.5

(EQ. 1) --------------- = ------------------------------ –1
R FB2 V FB

7.2 Output Inductor Selection

Because the buck regulator is designed with a constant off-time of 22µs at full load, design the output inductor
according to Equation 2:
V OUT t OFF_MIN
(EQ. 2) L  --------------------------------------------
2  I PK – I O_MAX 

–6
12  22  10
For example, if VOUT = 12V, if IO_MAX = 500mA, L  2-------------------------------------------
  0.685 – 0.5 
= 713H

7.3 Feedback Capacitor (CFB1) Selection

The feedback capacitor CFB1 determines the pulse frequency at no load condition. The corresponding inductor
current is shown in Figure 32.

Figure 32. The Inductor Current at No Load Operation

The average output current can be written as Equation 3.

(EQ. 3) I PKMIN  t ON + t OFF 

----------------------------------------------------- = I OUT_MIN
2T

Because tON<<tOFF, IOUT_MIN can be written as:

I PKMIN t OFF PKMIN LI

-------------------------------- = I OUT_MIN
2T , where t OFF = ---------------------
V OUT
-

Therefore:
2
L  I PKMIN 
(EQ. 4) I OUT_MIN = -----------------------------
-
2V OUT T

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RAA223010 Datasheet

To have the required input standby power, PIN_STBY, the power delivered to the output should satisfy Equation 5
where ƞ is the light-load efficiency.

(EQ. 5) V OUT I OUT_MIN = P IN_STBY 

Replacing IOUT_MIN with Equation 4 gives you Equation 6.

2
(EQ. 6)  L  I PKMIN  
V OUT  ------------------------------ = P IN_STBY 
 2V OUT T 

The required time interval T is calculated using Equation 7:

2
(EQ. 7) L  I PKMIN 
T = ---------------------------------
-
2P IN_STBY 

Because the time interval T is primarily determined by the sampling network, it is related to CFB1 in Equation 8
where ∆VOUT is the output voltage increase above the nominal VOUT at no load.

V OUT T
(EQ. 8) C FB1 = -------------------------------------------------------------
V OUT  R FB1 + R FB2 

From Equation 8, it can be seen that a bigger sampling capacitor leads to a smaller ∆VOUT, but CFB1 can not be
too big as it calls for a huge COUT. A small ∆VOUT can cause erratic logic function of the internal PFM comparator
in mode transition. Therefore, choose ∆VOUT properly according to the highest VOUT allowed in the applications.
When ∆VOUT is picked, CFB1 is calculated by using Equation 8.

7.4 Output Capacitor Selection

The output capacitor needs to meet the requirement of the output ripple voltage and load transient response. Also,
it needs to ensure the slew rate of the output voltage is slower than the discharging rate of the sampling capacitor
(CFB1) in a defined step load transient, as shown in Figure 33.

Figure 33. Output Capacitor Discharging at Step Load

Therefore, COUT is first calculated according to VOUT discharging by Equation 9.

C FB1 I OUT  R FB1 + R FB2 

(EQ. 9) C OUT  ---------------------------------------------------------------------------
V OUT

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RAA223010 Datasheet

However, the output capacitor should also be large enough to provide sufficient transient voltage support to load
step (if any), as with the pulses being separated with a big time interval at no load the controller most likely cannot
detect the voltage change and take action promptly.
I OUT T
(EQ. 10) C OUT  ----------------------------
0.07V OUT

where 7% voltage drop is used in this example.

7.5 Bias Capacitor Selection

7.5.1 VCC Hold Up Capacitor C3 Selection
The C3 capacitor holds up the VCC voltage during PFM mode. In PFM mode, this capacitor provides hold up
energy from the output to the IC during off-time. This can achieve better light-load efficiency instead of taking
energy from the input side. Renesas recommends setting the output ripple voltage smaller than 1V at no load
condition with maximum input voltage, which is the worst case with the output capacitor keeping the no-load
output voltage from getting too high. Its value is calculated from Equation 11.

P IN_STBY  T  2
(EQ. 11) C 3 = ------------------------------------------------------
2
-
2
V OUT –  V OUT – 1 

7.5.2 VCC Capacitor CVCC Selection

The CVCC capacitor filters the VCC voltage and sets the hiccup time when OLP is triggered. After OLP is triggered,
the VCC capacitor is discharged by a discharge current, IQVCC3. When the voltage of CVCC drops to 4.0V, the IC
restarts, and CVCC is charged by IVCC_START to VCC_OFF again. Therefore, choose CVCC based Equation 12.

1 1
(EQ. 12) t hiccup = C VCC  2   --------------------- + -----------------------------------
I I 
QVCC3 VCC – START

However, CVCC also protects the VCC voltage from overshoot from C3 when the chip is shut down. Therefore, for
design consideration, the CVCC capacitance should be at least doubled to C3.

7.5.3 Input Capacitor Selection

Typically, the input capacitance affects the inrush current, and therefore the input fuse and bridge selection. When
using a bridge rectifier, the input capacitor is chosen as 1.5 ~ 2μF/W for the universal input condition (Equation 13)
where ƞ = 0.75.

(EQ. 13) C IN = V OUT  I OUT  1.5F/W  

7.6 Dummy Resistor Selection

At a no-load condition, the system standby power is determined by the IC quiescent current, feedback resistor
bleeding current. If the required standby power is not low and to keep the no-load output voltage from getting too
high, a dummy resistor can be added in parallel with the output capacitor. Its value is calculated using Equation 14
where ƞ = 0.4.
V OUT
R 0 = ------------------------------------------------------------------
-
(EQ. 14) P
 IN_STBY  VFB 
 ----------------------------- – I q – ---------------
 V OUT R FB2

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RAA223010 Datasheet

7.7 Power Capability

The maximum power that the RAA223010 can deliver depends on the ambient temperature, output voltage, input
voltage, and even PCB thermal design. In general, higher input voltage with lower ambient temperature allows
more power than a low input voltage at a higher ambient temperature. Also, it delivers more power at higher
output voltages. Table 1 summarizes the maximum power the RAA223010 can deliver with ambient temperature
up to 85°C. This table should be used as a reference and may vary because of actual PCB thermal design power
capability.

7.8 PCB Layout Guidance

Proper layout is important to ensure a stable operation, good thermal behavior, EMI performance, and reliable
operation for various operating environments. Pay attention to the following layout recommendations.
▪ Leave proper spacing (minimum 1.4mm) between high voltage (max 400V) traces and low voltage traces.
▪ Keep a small loop from the input filter capacitor to the IC, switching inductor, output capacitor, and to the ground
of the input capacitor. Also, a small loop consisting of a switching inductor, output capacitor, and freewheeling
diode.
▪ Keep sufficient copper area on the IC drain and/or source pin for better thermal performance
▪ Keep the switching inductor away from the input EMI inductor to avoid noise coupling, especially when an
unshielded switching inductor is used.
▪ Place the VCC decoupling capacitor and the FB pin decoupling capacitor close to the pins. A single-sided PCB
layout example is shown in Figure 34.

Figure 34. Example PCB Layout

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RAA223010 Datasheet

8. EMI Performance
Conducted EMI compliance for EN55022/CISPR22 (12V/500mA output)

Figure 35. CE Line, 220VAC Figure 36. CE Neutral, 220VAC

Figure 37. RE, Vertical 220VAC Figure 38. RE, Horizontal, 220VAC

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RAA223010 Datasheet

9. Package Outline Drawing

For the most recent package outline drawing, see M7.15A.
M7.15A
7 Lead Narrow Body Small Outline Plastic Package (SOIC)
Rev 1,12/20

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RAA223010 Datasheet

10. Ordering Information

Part Package Description
Part Number[1][2] Pkg. Dwg. # Carrier Type[3] Temp Range
Marking (RoHS Compliant)

RAA2230104GSP#HA1 223010 7 Ld SOIC M7.15A Reel, 2.5k -40 to +125°C

RTKA223010DE0030BU Evaluation Board with RAA223010 in 7 Ld SOIC package

1. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering
operations). Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J-STD-020.
2. For Moisture Sensitivity Level (MSL), see the RAA223010 device page. For more information about MSL, see TB363.
3. See TB347 for details about reel specifications.

Table 2. Key Differences between Family of Parts

Device rDS(ON) (Ω) IPK (mA) tOFF_MIN (µs) Package Options

RAA223021 4 1100 23 7 Ld SOIC

RAA223010 6.8 810 22 7 Ld SOIC

RAA223011 14.5 520 32 8 Ld SOIC, 7 Ld SOIC, 5 Ld TSOT

RAA223012 14.5 335 19 8 Ld SOIC, 5 Ld TSOT

Table 3. 12V Output Current at 25°C

85-265VAC
Device
DCM CCM

RAA223021 437mA at L2 = 320µH 690mA at L2 = 680µH

RAA223010 342mA at L2 = 400µH 560mA at L2 = 1mH

RAA223011 222mA at L2 = 860µH 270mA at L2 = 1mH

RAA223012 130mA at L2 = 820µH 180mA at L2 = 1.5mH

11. Revision History

Rev. Date Description

1.01 Dec 7, 2022 Updated the output power listed on page 1 from 6W to 10W.

1.00 May 17, 2022 Initial release

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