SY8286
SY8286
SY8286
Typical Applications
VIN
IN PG PG (Open Drain Output)
CIN BS CBS
GND
VOUT
LX
L
High/Floating/Low ILMT C1 COUT
R1
ON/OFF EN R3
FB
3.3V Bias
BYP VCC
CBYP CVCC
R2
Figure1 Schematic
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SY8286
Pinout (top view)
GND
VCC
NC
LX
LX
20 19 18 17 16
BS 1 15 BYP
IN 2 14 FB
IN 3 GND 13 ILMT
IN 4 12 NC
IN 5 11 EN
6 7 8 9 10
LX
GND
PG
NC
GND
(QFN3×3-20)
Top Mark: BAAxyz, (Device code: BAA, x=year code, y=week code, z= lot number code)
Pin Name Pin Number Pin Description
Boot-strap pin. Supply high side gate driver. Decouple this pin to the LX pin with
BS 1
a 0.1μF ceramic capacitor.
Input pin. Decouple this pin to the GND pin with at least a 10μF ceramic
IN 2,3,4,5
capacitor.
LX 6,19,20 Inductor pin. Connect this pin to the switching node of the inductor.
GND 7,8,18,EP Ground pin.
Power good Indicator. Open drain output when the output voltage is within 90% to
PG 9
120% of regulation point.
EN 11 Enable pin. Pull this pin high to turn on the IC. Do not leave this pin floating.
NC 10,12,16 Not connected.
ILMT 13 Output current limit threshold selection.
FB 14 Output feedback pin. Connect to the center point of the resistor divider.
External 3.3V bypass power supply input. Decouple this pin to GND with a 1μF
BYP 15
ceramic capacitor. Leave this pin floating if it is not used.
Internal 3.3V LDO output. Power supply for internal analog circuits and driving
VCC 17
circuit. Decouple this pin to GND with a 2.2μF ceramic capacitor.
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SY8286
Block Diagram
IN
Input
UVLO
Current Sense
PG
BS
EN
ILMT
Internal
SST PWM LX
Control &
Protection Current Sense
OTP
Logic
0.6V
FB
GND
IN
BYP 3.1V
3.3V LDO VCC
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SY8286
Electrical Characteristics
(VIN = 12V, COUT = 100uF, TA = 25°C, IOUT = 1A unless otherwise specified)
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SY8286
Note 1: Stresses beyond the “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability
Note 2: θ JA is measured in the natural convection at T A = 25°C on a low effective single layer thermal conductivity
test board of JEDEC 51-3 thermal measurement standard.
Note 3: The device is not guaranteed to function outside its operating conditions.
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SY8286
Bottom view
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SY8286
Notes: All dimension in millimeter and exclude mold flash & metal burr.
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SY8286
Taping & Reel Specification
Feeding direction
Reel
Size
Package Tape width Pocket Reel size Trailer Leader length Qty per
types (mm) pitch(mm) (Inch) length(mm) (mm) reel
3. Others: NA
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