TPS3809K33DBVR - PDB1

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TPS3809J25, TPS3809L30, TPS3809K33, TPS3809I50

www.ti.com TPS3809J25, TPS3809L30,


SLVS228D TPS3809K33,
– AUGUST 1999 TPS3809I50
– REVISED DECEMBER 2020
SLVS228D – AUGUST 1999 – REVISED DECEMBER 2020

TPS3809x 3-Pin Supply Voltage Supervisors

1 Features 3 Description
• 3-pin SOT-23 package The TPS3809 family of supervisory circuits provides
• Supply current of 9 μA (typical) circuit initialization and timing supervision, primarily
• Precision supply voltage monitor for DSPs and processor-based systems. The newer
2.5 V, 3 V, 3.3 V, 5 V TLV809E device is an alternative with the same pins,
• Pin-for-pin compatible with MAX 809 functions and electrical parameters.
• Temperature range: –40°C to +85°C During power-on, RESET is asserted when the supply
voltage VDD becomes higher than 1.1 V. Thereafter,
2 Applications the supervisory circuit monitors VDD and keeps
• Factory automation RESET active as long as VDD remains below the
• Wireless speakers threshold voltage VIT. An internal timer delays the
• Motor drives return of the output to the inactive state (high) to
• Servers ensure proper system reset. The delay time, td(typ) =
200 ms, starts after VDD has risen above the threshold
• Appliances
voltage VIT. When the supply voltage drops below the
• Electricity meters threshold voltage VIT, the output becomes active (low)
• Building automation again. No external components are required. All the
devices of this family have a fixed sense-threshold
voltage VIT set by an internal voltage divider.
The product spectrum is designed for supply voltages
of 2.5 V, 3 V, 3.3 V, and 5 V. The circuits are available
in a 3-pin SOT-23. The TPS3809 devices are
characterized for operation over a temperature range
of –40°C to 85°C.
Device Information
PART NUMBER PACKAGE (1) BODY SIZE (NOM)
TPS3809 SOT-23 (3), DBV 2.90 mm × 1.60 mm

(1) For all available packages, see the orderable addendum at


the end of the data sheet.

TPS76333
3.3 V
5V IN OUT
GND VDD

VDD TMS320LC54x

TPS3809K33
RESET RESET
GND
GND

Typical Application

An©IMPORTANT
Copyright NOTICEIncorporated
2020 Texas Instruments at the end of this data sheet addresses availability, warranty, changes, use in safety-critical
Submit Document applications,
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intellectual property matters and other important disclaimers. PRODUCTION DATA.
Product Folder Links: TPS3809J25 TPS3809L30 TPS3809K33 TPS3809I50
TPS3809J25, TPS3809L30, TPS3809K33, TPS3809I50
SLVS228D – AUGUST 1999 – REVISED DECEMBER 2020 www.ti.com

Table of Contents
1 Features............................................................................1 7.3 Dissipation Ratings..................................................... 5
2 Applications..................................................................... 1 7.4 Electrical Characteristics.............................................5
3 Description.......................................................................1 7.5 Timing Requirements.................................................. 6
4 Revision History.............................................................. 2 7.6 Switching Characteristics............................................6
5 Device Comparison......................................................... 3 7.7 Timing Diagram...........................................................6
6 Pin Configuration and Functions...................................4 7.8 Typical Characteristics................................................ 7
7 Specifications.................................................................. 5 8 Detailed Description........................................................9
7.1 Absolute Maximum Ratings (1) (2) ...............................5 9 Electrostatic Discharge Caution.................................... 9
7.2 Recommended Operating Conditions.........................5

4 Revision History
Changes from Revision C (October 2013) to Revision D (January 2021) Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
• Added new sentence regarding the new TLV809E to the Description section................................................... 1
• Added the pinout and pin function table............................................................................................................. 4
• Changed VDD from 7 to 6.5 in Absolute Maximum Ratings ..............................................................................5
• Changed VOL @ 500μA from 0.2 to 0.3V and corrected header of the table from TPS3800-xx, TPS3801-xx,
TPS3802-xx to TPS3809xx in Electrical Characteristics ................................................................................... 5
• Changed tw pulse duration from 3 to 10μs in Timing Requirements ..................................................................6
• Changed tPHL from 1 to 10μs in Switching Characteristics ................................................................................ 6

Changes from Revision B (July 2012) to Revision C (October 2013) Page


• Changed front page and page flow to match current standard look and feel..................................................... 1
• Changed "Operating junction temperature range" to "Operating free-air temperature range" in Absolute
Maximum Ratings (typo).....................................................................................................................................5

Changes from Revision A (October 2010) to Revision B (July 2012) Page


• Changed the Pull-up resistor value, RESET To: RESET current sink during startup in the Recommended
Operating Conditions Table................................................................................................................................ 5

Changes from Revision * (August 1999) to Revision A (October 2010) Page


• Added Pull-up resistor value, RESET to the Recommended Operating Conditions Table................................. 5

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TPS3809J25, TPS3809L30, TPS3809K33, TPS3809I50
www.ti.com SLVS228D – AUGUST 1999 – REVISED DECEMBER 2020

5 Device Comparison
Table 5-1. Device Comparison Table
TA DEVICE NAME THRESHOLD VOLTAGE MARKING
TPS3809J25DBVR TPS3809J25DBVT 2.25 V PCZI
TPS3809L30DBVR TPS3809L30DBVT 2.64 V PDAI
–40°C to 85°C
TPS3809K33DBVR TPS3809K33DBVT 2.93 V PDBI
TPS3809I50DBVR TPS3809I50DBVT 4.55 V PDCI

FUNCTION/TRUTH TABLE, TPS3809 ORDERING INFORMATION

VDD>VIT RESET TPS380 9 J 25 DBV R


0 L Reel
1 H
Package
Nominal Supply Voltage
Nominal Threshold Voltage
Functionality
Family

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TPS3809J25, TPS3809L30, TPS3809K33, TPS3809I50
SLVS228D – AUGUST 1999 – REVISED DECEMBER 2020 www.ti.com

6 Pin Configuration and Functions

GND 1

3 VDD

RESET 2

Figure 6-1. Pin configuration

Table 6-1. Pin Functions


PIN
I/O(1) DESCRIPTION
NAME NO.
GND 1 - This pin should be connected to ground with a low-impedance connection.
RESET is an active low signal, asserting when VDD is below the threshold voltage. When VDD rises
RESET 2 O above VIT, there is a delay time (td) until RESET deasserts.
RESET is a push-pull output stage.
Supply voltage pin. A 0.1-µF ceramic capacitor from this pin to ground is recommended to improve
VDD 3 -
stability of the threshold voltage

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TPS3809J25, TPS3809L30, TPS3809K33, TPS3809I50
www.ti.com SLVS228D – AUGUST 1999 – REVISED DECEMBER 2020

7 Specifications
7.1 Absolute Maximum Ratings (1) (2)
Over operating free-air temperature range (unless otherwise noted).
UNIT
Supply voltage, VDD 6.5 V
All other pins –0.3 V to 6.5 V
Maximum low-output current, IOL 5 mA
Maximum high-output current, IOH –5 mA
Input-clamp current, IIK (VI < 0 or VI > VDD) ±20 mA
Output-clamp current, IOK (VO < 0 or VO > VDD) ±20 mA
Continuous total power dissipation See Dissipation Rating Table
Operating free-air temperature range, TA –40°C to 85°C
Storage temperature range, Tstg –65°C to 150°C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND. For reliable operation, the device should not be operated at 6.5 V for more than t = 1000h
continuously.

7.2 Recommended Operating Conditions


MIN MAX UNIT
Supply voltage, VDD 2 6 V
RESET current sink during startup 50 µA
Operating free-air temperature range, TA –40 +85 °C

7.3 Dissipation Ratings


TA < 25°C DERATING FACTOR TA = 70°C TA = 85°C
PACKAGE
POWER RATING ABOVE TA < 25°C POWER RATING POWER RATING
DBV 437 mW 3.5 mW/°C 280 mW 227 mW

7.4 Electrical Characteristics


Over recommended operating free-air temperature range (unless otherwise noted).
TPS3809xx
PARAMETER TEST CONDITIONS
MIN TYP MAX UNIT
VDD = 2.5 V to 6 V IOH = –500 μA VDD –0.2
VOH High-level output voltage VDD = 3.3 V IOH = –2 mA VDD –0.4 V
VDD = 6 V IOH = –4 mA VDD –0.4
VDD = 2 V to 6 V, IOL = 500 μA 0.3
VOL Low-level output voltage VDD = 3.3 V, IOL = 2 mA 0.4 V
VDD = 6 V, IOL = 4 mA 0.4
Power-up reset voltage(1) VDD ≥ 1.1 V, IOL = 50 μA 0.2 V
TPS3809J25 2.2 2.25 2.3

Negative-going input TPS3809L30 2.58 2.64 2.7


VIT– TA = –40°C to 85°C V
threshold voltage(2) TPS3809K33 2.87 2.93 2.99
TPS3809I50 4.45 4.55 4.65
TPS3809J25 30
TPS3809L30 35
Vhys Threshold hysteresis mV
TPS3809K33 40
TPS3809I50 60

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TPS3809J25, TPS3809L30, TPS3809K33, TPS3809I50
SLVS228D – AUGUST 1999 – REVISED DECEMBER 2020 www.ti.com

Over recommended operating free-air temperature range (unless otherwise noted).


TPS3809xx
PARAMETER TEST CONDITIONS
MIN TYP MAX UNIT
VDD = 2 V, output unconnected 9 12
IDD Supply current μA
VDD = 6 V, output unconnected 20 25
Ci Input capacitance VI = 0 V to VDD 5 pF

(1) The lowest supply voltage at which RESET becomes active. tr, VDD ≥ 15 μs/V.
(2) To ensure the best stability of the threshold voltage, a bypass capacitor (0.1-μF ceramic) should be placed near the supply terminals.

7.5 Timing Requirements


at RL = 1 MΩ, CL = 50 pF, TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tw Pulse width at VDD VDD = VIT– + 0.2 V, VDD = VIT– –0.2 V 10 μs

7.6 Switching Characteristics


at RL = 1 MΩ, CL = 50 pF, TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDD ≥ VIT– + 0.2 V,
td Delay time 120 200 280 ms
See timing diagram
Propagation (delay) time, high-to-low-level VIL = VIT– – 0.2 V,
tPHL VDD to RESET delay 10 μs
output VIH = VIT– + 0.2 V

7.7 Timing Diagram


VDD
V(NOM)
VIT

1.1 V
t

RESET

1
aaaa aaaaa
aaaa aaaaa
aaaa aaaaa
aaaa aaaaa
0
aaaa aaaaa t

td td

For VDD< 1.1 V Undefined


Behavior of RESET Output

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TPS3809J25, TPS3809L30, TPS3809K33, TPS3809I50
www.ti.com SLVS228D – AUGUST 1999 – REVISED DECEMBER 2020

7.8 Typical Characteristics


2.75 50
VDD = 2.5 V o
TA = 25 C
2.50 40
VOL – Low-Level Output Voltage – V

2.25
30

IDD – Supply Current – mA


2.00
TA = 25 C
o
20
1.75
10 TPS3809J25
1.50
o 0
1.25 TA = 85 C

1.00 TA = 0 C
o –10

0.75 –20
o
TA = –40 C
0.50 –30

0.25 –40
0
0 2.5 5.0 7.5 10.0 12.5 –50
–2 0 2 4 6
IOL – Low-Level Output Current – mA
VDD – Supply Voltage – V
Figure 7-1. LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL
Figure 7-2. SUPPLY CURRENT vs SUPPLY VOLTAGE
OUTPUT CURRENT

6.5 3.00
VDD = 6 V VDD = 2.5 V
6.0 2.75
VOH – High-Level Output Voltage – V
VOH – High-Level Output Voltage – V

5.5 2.50
5.0 2.25
o
4.5 TA = –40 C 2.00
o
4.0 TA = –40 C
1.75
3.5 o
TA = 0 C 1.50 TA = 0 C
o

3.0
o
1.25
2.5 TA = 85 C
1.00 o
TA = 85 C
2.0
0.75
1.5
o
1.0 o 0.50 TA = 25 C
TA = 25 C
0.5 0.25

0 0
0 –10 –20 –30 –40 –50 0 –2 –4 –6 –8 –10
IOH – High-Level Output Current – mA IOH – High-Level Output Current – mA
Figure 7-3. HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL Figure 7-4. HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL
OUTPUT CURRENT at VDD=6V OUTPUT CURRENT at VDD=2.5V

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SLVS228D – AUGUST 1999 – REVISED DECEMBER 2020 www.ti.com

7.8 Typical Characteristics (continued)


1.001

Normalized Threshold Voltage VIT (TA), VIT (25oC)


VDD = 2.3 V

1.000

0.999

0.998

0.997

0.996

0.995
–40 –20 0 20 40 60 85
o
TA – Free-Air Temperature – C
Figure 7-5. NORMALIZED INPUT THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE AT VDD=2.3V

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TPS3809J25, TPS3809L30, TPS3809K33, TPS3809I50
www.ti.com SLVS228D – AUGUST 1999 – REVISED DECEMBER 2020

8 Detailed Description

TPS3809

Reset
Logic RESET
R1
VDD _ +
Timer
+
R2

GND

Oscillator

Reference
Voltage
of 1.137 V

9 Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

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Product Folder Links: TPS3809J25 TPS3809L30 TPS3809K33 TPS3809I50
PACKAGE OPTION ADDENDUM

www.ti.com 18-Dec-2023

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

TPS3809I50DBVR ACTIVE SOT-23 DBV 3 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDCI Samples

TPS3809I50DBVRG4 ACTIVE SOT-23 DBV 3 3000 TBD Call TI Call TI -40 to 85 Samples

TPS3809I50DBVT ACTIVE SOT-23 DBV 3 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDCI Samples

TPS3809J25DBVR ACTIVE SOT-23 DBV 3 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PCZI Samples

TPS3809J25DBVT ACTIVE SOT-23 DBV 3 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PCZI Samples

TPS3809K33DBVR ACTIVE SOT-23 DBV 3 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDBI Samples

TPS3809K33DBVRG4 ACTIVE SOT-23 DBV 3 3000 TBD Call TI Call TI -40 to 85 Samples

TPS3809K33DBVT ACTIVE SOT-23 DBV 3 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDBI Samples

TPS3809L30DBVR ACTIVE SOT-23 DBV 3 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDAI Samples

TPS3809L30DBVRG4 ACTIVE SOT-23 DBV 3 3000 TBD Call TI Call TI -40 to 85 Samples

TPS3809L30DBVT ACTIVE SOT-23 DBV 3 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDAI Samples

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Addendum-Page 1
PACKAGE OPTION ADDENDUM

www.ti.com 18-Dec-2023

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TPS3809 :

• Automotive : TPS3809-Q1
• Enhanced Product : TPS3809-EP

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications

Addendum-Page 2
PACKAGE MATERIALS INFORMATION

www.ti.com 14-Dec-2023

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS


K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)


QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal


Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS3809I50DBVR SOT-23 DBV 3 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
TPS3809I50DBVT SOT-23 DBV 3 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
TPS3809J25DBVR SOT-23 DBV 3 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
TPS3809J25DBVT SOT-23 DBV 3 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
TPS3809K33DBVR SOT-23 DBV 3 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
TPS3809K33DBVT SOT-23 DBV 3 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
TPS3809L30DBVR SOT-23 DBV 3 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
TPS3809L30DBVT SOT-23 DBV 3 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3

Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION

www.ti.com 14-Dec-2023

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal


Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS3809I50DBVR SOT-23 DBV 3 3000 180.0 180.0 18.0
TPS3809I50DBVT SOT-23 DBV 3 250 180.0 180.0 18.0
TPS3809J25DBVR SOT-23 DBV 3 3000 180.0 180.0 18.0
TPS3809J25DBVT SOT-23 DBV 3 250 180.0 180.0 18.0
TPS3809K33DBVR SOT-23 DBV 3 3000 180.0 180.0 18.0
TPS3809K33DBVT SOT-23 DBV 3 250 180.0 180.0 18.0
TPS3809L30DBVR SOT-23 DBV 3 3000 180.0 180.0 18.0
TPS3809L30DBVT SOT-23 DBV 3 250 180.0 180.0 18.0

Pack Materials-Page 2
PACKAGE OUTLINE
DBV0003A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR

C
3.0
2.6 0.1 C
1.75 1.45
B A
1.45 0.90
PIN 1
INDEX AREA

(0.1)
(0.15)
3.05
1.9
3 2.75

0.95

0.5 2
3X
0.3
0.15
0.2 C A B (1.1) TYP
0.00
NOTE 5

0.25
GAGE PLANE 0.22
TYP
0.12

8
TYP 0.6
0 TYP SEATING PLANE
0.3

4220743/B 03/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
5. Support pin may differ or may not be present.

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EXAMPLE BOARD LAYOUT
DBV0003A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR

PKG
3X (1.1)

3X (0.6) 1

SYMM

3
2X (0.95)

(R0.05) TYP (2.6)

LAND PATTERN EXAMPLE


EXPOSED METAL SHOWN
SCALE:15X

SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK

EXPOSED METAL EXPOSED METAL

0.07 MAX 0.07 MIN


ARROUND ARROUND

NON SOLDER MASK SOLDER MASK


DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4220743/B 03/2023

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.


7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

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EXAMPLE STENCIL DESIGN
DBV0003A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR

PKG
3X (1.1)

3X (0.6) 1

SYMM
3
2X(0.95)

(R0.05) TYP
(2.6)

SOLDER PASTE EXAMPLE


BASED ON 0.125 mm THICK STENCIL
SCALE:15X

4220743/B 03/2023

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

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