TPS70345, TPS70348

TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

DUAL-OUTPUT, LOW DROPOUT VOLTAGE REGULATORS

WITH INTEGRATED SVS FOR SPLIT VOLTAGE SYSTEMS
Check for Samples: TPS70345, TPS70348, TPS70351, TPS70358, TPS70302

1FEATURES DESCRIPTION
23 • Dual Output Voltages for Split-Supply The TPS703xx family of devices is designed to
Applications provide a complete power management solution for
• Independent Enable Functions (See Part TI DSP, processor power, ASIC, FPGA, and digital
Number TPS704xx for Independent Enabling of applications where dual output voltage regulators are
Each Output) required. Easy programmability of the sequencing
function makes this family ideal for any TI DSP
• Output Current Range of 1 A on Regulator 1 application with power sequencing requirements.
and 2A on Regulator 2 Differentiated features, such as accuracy, fast
• Fast Transient Response transient response, SVS supervisory circuit (power-on
• Voltage Options: 3.3 V/2.5 V, 3.3 V/1.8 V, 3.3 reset), manual reset inputs, and enable function,
provide a complete system solution.
V/1.5 V, 3.3 V/1.2 V, and Dual Adjustable
Outputs PWP PACKAGE
(TOP VIEW)
• Open Drain Power-On Reset with 120 ms Delay
• Open Drain Power Good for Regulator 1 GND/HEATSINK 1 24 GND/HEATSINK
• Ultralow 185 mA (typ) Quiescent Current VIN1 2 23 VOUT1

• 2 mA Input Current During Standby VIN1 3 22 VOUT1

• Low Noise: 78 mVRMS Without Bypass NC 4 21 VSENSE1/FB1

Capacitor MR2 5 20 NC

• Quick Output Capacitor Discharge Feature MR1 6 19 PG1

EN 7 18 RESET
• Two Manual Reset Inputs
SEQ 8 17 NC
• 2% Accuracy Over Load and Temperature
GND 9 16 VSENSE2/FB2
• Undervoltage Lockout (UVLO) Feature
VIN2 10 15 VOUT2
• 24-Pin PowerPAD™ TSSOP Package VIN2 11 14 VOUT2
• Thermal Shutdown Protection GND/HEATSINK 12 13 GND/HEATSINK

NC = No internal connection

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 PowerPAD is a trademark of Texas Instruments.
3 All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

TPS70351 PWP
DSP
3.3 V I/O
5V VIN1 VOUT1

0.22 mF 22 mF
VSENSE1
250 kW
PG1
PG1
MR2 MR2 >2 V
VIN2
<0.7 V 250 kW
0.22 mF RESET RESET

EN MR1 MR1 >2 V

>2 V EN
<0.7 V VSENSE2 <0.7 V

SEQ VOUT2 1.8 V

Core
47 mF

The TPS703xx family of voltage regulators offers very low dropout voltage and dual outputs with power up
sequence control, designed primarily for DSP applications. These devices have low noise output performance
without using any added filter bypass capacitors, and are designed to have a fast transient response and be
stable with 47 mF low ESR capacitors.
These devices have fixed 3.3 V/2.5 V, 3.3 V/1.8 V, 3.3 V/1.5 V, 3.3 V/1.2 V, and adjustable voltage options.
Regulator 1 can support up to 1 A, and regulator 2 can support up to 2 A. Separate voltage inputs allow the
designer to configure the source power.
Because the PMOS pass element behaves as a low-value resistor, the dropout voltage is very low (typically
160mV on regulator 1) and is directly proportional to the output current. Additionally, since the PMOS pass
element is a voltage-driven device, the quiescent current is very low and independent of output loading
(maximum of 250 mA over the full range of output current). This LDO family also features a sleep mode; applying
a high signal to EN (enable) shuts down both regulators, reducing the input current to 1 mA at TJ = +25°C.
The device is enabled when the EN pin is connected to a low-level input voltage. The output voltages of the two
regulators are sensed at the VSENSE1 and VSENSE2 pins respectively.
The input signal at the SEQ pin controls the power-up sequence of the two regulators. When the device is
enabled and the SEQ terminal is pulled high or left open, VOUT2 turns on first and VOUT1 remains off until VOUT2
reaches approximately 83% of its regulated output voltage. At that time VOUT1 is turned on. If VOUT2 is pulled
below 83% (that is, in an overload condition) of its regulated voltage, VOUT1 is turned off. Pulling the SEQ
terminal low reverses the power-up order and VOUT1 is turned on first. The SEQ pin is connected to an internal
pull-up current source.
For each regulator, there is an internal discharge transistor to discharge the output capacitor when the regulator
is turned off (disabled).
The PG1 pin reports the voltage condition at VOUT1. The PG1 pin can be used to implement an SVS (POR, or
power-on reset) for the circuitry supplied by regulator 1.
The TPS703xx features a RESET (SVS, POR, or power-on reset). RESET is an active low, open drain output
and requires a pull-up resistor for normal operation. When pulled up, RESET goes to a high impedance state
(that is, logic high) after a 120 ms delay when all three of the following conditions are met. First, VIN1 must be
above the undervoltage condition. Second, the manual reset (MR) pin must be in a high impedance state. Third,
VOUT2 must be above approximately 95% of its regulated voltage. To monitor VOUT1, the PG1 output pin can be
connected to MR1 or MR2. RESET can be used to drive power-on reset or a low-battery indicator. If RESET is
not used, it can be left floating.
Internal bias voltages are powered by VIN1 and require 2.7V for full functionality. Each regulator input has an
undervoltage lockout circuit that prevents each output from turning on until the respective input reaches 2.5 V.

2 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION (1)

(2)
VOLTAGE (V) PACKAGE- SPECIFIED
LEAD TEMPERATURE ORDERING TRANSPORT
PRODUCT VOUT1 VOUT2 (DESIGNATOR) RANGE (TJ) NUMBER MEDIA, QUANTITY
TPS70302PWP Tube, 60
TPS70302 Adjustable Adjustable HTSSOP-24 (PWP) -40°C to +125°C
TPS70302PWPR Tape and Reel, 2000
TPS70345PWP Tube, 60
TPS70345 3.3 V 1.2 V HTSSOP-24 (PWP) -40°C to +125°C
TPS70345PWPR Tape and Reel, 2000
TPS70348PWP Tube, 60
TPS70348 3.3 V 1.5 V HTSSOP-24 (PWP) -40°C to +125°C
TPS70348PWPR Tape and Reel, 2000
TPS70351PWP Tube, 60
TPS70351 3.3 V 1.8 V HTSSOP-24 (PWP) -40°C to +125°C
TPS70351PWPR Tape and Reel, 2000
TPS70358PWP Tube, 60
TPS70358 3.3 V 2.5 V HTSSOP-24 (PWP) -40°C to +125°C
TPS70358PWPR Tape and Reel, 2000

(1) For the most current package and ordering information see the Package Option Addendum located at the end of this document, or see
the TI web site at www.ti.com.
(2) For fixed 1.20V operation, tie FB to OUT.

ABSOLUTE MAXIMUM RATINGS (1)

Over operating free-air temperature range (unless otherwise noted).
TPS703xx UNIT
Input voltage range: VIN1, VIN2 (2) –0.3 to +7 V
Voltage range at EN –0.3 to +7 V
Output voltage range (VOUT1, VSENSE1) 5.5 V
Output voltage range (VOUT2, VSENSE2) 5.5 V
Maximum RESET, PG1 voltage 7 V
Maximum MR1, MR2, and SEQ voltage VIN1 V
Peak output current Internally limited —
Continuous total power dissipation See Dissipation Ratings Table —
Operating virtual junction temperature range, TJ –40 to +150 °C
Storage temperature range, TSTG –65 to +150 °C
ESD rating, HBM 2 kV

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are tied to network ground.

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 3

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

DISSIPATION RATINGS
DERATING
PACKAGE AIR FLOW (CFM) TA ≤ +25°C TA = +70°C TA = +85°C
FACTOR
0 3.067 W 30.67 mW/°C 1.687 W 1.227 W
PWP (1)
250 4.115 W 41.15 mW/°C 2.265 W 1.646 W

(1) This parameter is measured with the recommended copper heat sink pattern on a 4-layer PCB, 1 oz. copper on a 4-in by 4-in ground
layer. For more information, refer to TI technical brief SLMA002.

RECOMMENDED OPERATING CONDITIONS

Over operating temperature range (unless otherwise noted).
MIN MAX UNIT
Input voltage, VI (1) (regulator 1 and 2) 2.7 6 V
Output current, IO (regulator 1) 0 1 A
Output current, IO (regulator 2) 0 2 A
Output voltage range (for adjustable option) 1.22 5.5 V
Operating virtual junction temperature, TJ –40 +125 °C

(1) To calculate the minimum input voltage for maximum output current, use the following equation: VI(min) = VO(max) + VDO(max load).

4 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

ELECTRICAL CHARACTERISTICS
Over recommended operating junction temperature range (TJ = –40°C to +125°C), VIN1 or VIN2 = VOUTX(nom) + 1V, IOUTX = 1mA,
EN = 0V, COUT1 = 22mF, and COUT2 = 47mF (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
2.7 V < VIN < 6 V,
Reference FB connected to VO 1.224
TJ = +25°C
voltage
2.7 V < VIN < 6 V, FB connected to VO 1.196 1.248
1.2 V output 2.7 V < VIN < 6 V, TJ = +25°C 1.2
(VOUT2) 2.7 V < VIN < 6 V, 1.176 1.224
1.5 V output 2.7 V < VIN < 6 V, TJ = +25°C 1.5
Output (VOUT2) 2.7 V < VIN < 6 V, 1.47 1.53
VO (1) (2) V
voltage
1.8 V output 2.8 V < VIN < 6 V, TJ = +25°C 1.8
(VOUT2) 2.8 V < VIN < 6 V, 1.764 1.836
2.5 V output 3.5 V < VIN < 6 V, TJ = +25°C 2.5
(VOUT2) 3.5 V < VIN < 6 V, 2.45 2.55
3.3 V output 4.3 V < VIN < 6 V, TJ = +25°C 3.3
(VOUT1) 4.3 V < VIN < 6 V, 3.234 3.366
(2)
Quiescent current (GND current) for See TJ = +25°C 185
regulator 1 and regulator 2, EN = 0 V (1) (2)
mA
See 250
Output voltage line regulation (∆VO/VO) VO + 1 V < VIN ≤ 6 V, TJ = +25°C (1) 0.01
for regulator 1 and regulator 2 (3) (1)
%V
VO + 1 V < VIN ≤ 6 V 0.1
Load regulation for VOUT 1 and VOUT2 TJ = +25°C 1 mV
Output noise Regulator 1 79
Vn voltage BW = 300 Hz to 50 kHz, CO = 33 mF, TJ = +25°C mVRMS
(TPS70351) Regulator 2 77
Regulator 1 1.75 2.2
Output current limit VOUT = 0 V A
Regulator 2 3.8 4.5
Thermal shutdown junction temperature +150 °C
II EN1 = VIN, EN2 = VI TJ = +25°C 1 2
Standby current mA
(standby) EN1 = VIN, EN2 = VI 10
Power-supply Regulator 1 f = 1 kHz, TJ = +25°C (1) 65
ripple
PSRR f = 1 kHz, dB
rejection Regulator 2 TJ = +25°C (1) 60
(TPS70351)
RESET Terminal
Minimum input voltage for valid RESET IRESET = 300 mA, V(RESET) ≤ 0.8 V 1.0 1.3 V
Trip threshold voltage VO decreasing 92 95 98 %VOUT
Hysteresis voltage Measured at VO 0.5 %VOUT
t (RESET) RESET pulse duration 80 120 160 ms
tr (RESET) Rising edge deglitch 30 ms
Output low voltage VIN = 3.5 V, I(RESET) = 1 mA 0.15 0.4 V
Leakage current V(RESET) = 6 V 1 mA

(1) Minimum input operating voltage is 2.7 V or VO(typ) + 1V, whichever is greater. Maximum input voltage = 6V, minimum output
current = 1 mA.
(2) IO = 1 mA to 1 A for Regulator 1 and 1mA to 2A for Regulator 2.
(VImax - 2.7)
Line regulation (mV) = (%/V) x Vo x 1000
(3) If VO < 1.8 V then VImax = 6 V, VImin = 2.7 V: 100
[ VImax - (Vo + 1) ]
Line regulation (mV) = (%/V) x Vo x 1000
If VO > 2.5 V then VImax = 6 V, VImin = VO + 1 V: 100

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 5

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

ELECTRICAL CHARACTERISTICS (continued)

Over recommended operating junction temperature range (TJ = –40°C to +125°C), VIN1 or VIN2 = VOUTX(nom) + 1V, IOUTX = 1mA,
EN = 0V, COUT1 = 22mF, and COUT2 = 47mF (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PG Terminal
Minimum input voltage for valid PG I(PG) = 300 mA, V(PG1) ≤ 0.8 V 1.0 1.3 V
Trip threshold voltage VO decreasing 92 95 98 %VOUT
Hysteresis voltage Measured at VO 0.5 %VOUT
tr(PG1) Rising edge deglitch 30 ms
Output low voltage VIN = 2.7 V, I(PG) = 1 mA 0.15 0.4 V
Leakage current V(PG1) = 6 V 1 mA
EN Terminal
High-level EN input voltage 2 V
Low-level EN input voltage 0.7 V
Input current (EN) –1 1 mA
SEQ Terminal
High-level SEQ input voltage 2 V
Low-level SEQ input voltage 0.7 V
SEQ pull-up current source 6 mA
MR1/MR2 Terminal
High-level input voltage 2 V
Low-level input voltage 0.7 V
Pull-up current source 6 mA
VOUT2 Terminal
VOUT2 UV comparator: positive-going
input threshold voltage at VOUT1 UV 80 83 86 %VOUT
comparator
%VOUT,
VOUT2 UV comparator: hysteresis 3
mV
VOUT2 UV comparator: falling edge
VSENSE2 decreasing below threshold 140 ms
deglitch
Peak output current 2 ms pulse width 3 A
Discharge transistor current VOUT2 = 1.5 V 7.5 mA

6 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

ELECTRICAL CHARACTERISTICS (continued)

Over recommended operating junction temperature range (TJ = –40°C to +125°C), VIN1 or VIN2 = VOUTX(nom) + 1V, IOUTX = 1mA,
EN = 0V, COUT1 = 22mF, and COUT2 = 47mF (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOUT1 Terminal
VOUT1 UV comparator: positive-going
input threshold voltage at VOUT2 UV 80 83 86 %VOUT
comparator
%VOUT,
VOUT1 UV comparator: hysteresis 3
mV
VOUT1 UV comparator: falling edge
VSENSE1 decreasing below threshold 140 ms
deglitch
IO = 1 A, VIN1 = 3.2 V TJ = +25°C 160
Dropout voltage (4) mV
IO = 1 A, VIN1 = 3.2 V 250
Peak output current 2ms pulse width 1.2 A
Discharge transistor current VOUT1 = 1.5 V 7.5 mA
VIN1/VIN2 Terminal
UVLO threshold 2.3 2.65 V
UVLO hysteresis 110 mV
FB Terminal
Input current: TPS70302 FB = 1.8 V 1 mA

(4) Input voltage (VIN1 or VIN2) = VO(typ) – 100mV. For 1.5 V, 1.8 V and 2.5 V regulators, the dropout voltage is limited by input voltage
range. The 3.3 V regulator input is set to 3.2 V to perform this test.

TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTION
NAME NO.
EN 7 I Active low enable
GND 9 — Regulator ground
GND/HEATSI
1, 12, 13, 24 — Ground/heatsink
NK
MR1 6 I Manual reset input 1, active low, pulled up internally
MR2 5 I Manual reset input 2, active low, pulled up internally
NC 4, 17, 20 — No connection
PG1 19 O Open drain output, low when VOUT1 voltage is less than 95% of the nominal regulated voltage
RESET 18 O Open drain output, SVS (power-on reset) signal, active low
Power-up sequence control: SEQ = High, VOUT2 powers up first; SEQ = Low, VOUT1 powers up
SEQ 8 I
first. SEQ terminal pulled up internally.
VIN1 2, 3 I Input voltage of regulator 1
VIN2 10, 11 I Input voltage of regulator 2
VOUT1 22, 23 O Output voltage of regulator 1
VOUT2 14, 15 O Output voltage of regulator 2
VSENSE2/FB2 16 I Regulator 2 output voltage sense/regulator 2 feedback for adjustable
VSENSE1/FB1 21 I Regulator 1 output voltage sense/regulator 1 feedback for adjustable

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 7

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

DEVICE INFORMATION
Adjustable Voltage Version

VIN1 (2 Pins) VOUT1 (2 Pins)

UVLO1
Comp Current
-
Sense ENA_1 FB1
2.5 V + (see Note A)
- + ENA_1
GND Reference Vref
Thermal
Vref
Shutdown
PG1

FB1 -
Rising Edge
0.95 x Vref + Deglitch VIN1
PG
Comp
MR2
Reset
Comp RESET
FB2 - 120ms
Rising Edge
0.95 x Vref + Deglitch Delay
VOUT2 UV Comp
VIN1
FB2 -
Falling Edge
0.83 x Vref + Deglitch Power ENA_1
MR1
Sequence
FB1 - Logic ENA_2
Falling Edge
Vref
0.83 x Vref + Deglitch

VOUT1 UV Comp - +
EN ENA_2
VIN1 UVLO2
2.5 V + Comp FB2
Current ENA_2 (see Note A)
-
SEQ Sense
(see Note B)
VIN2 (2 Pins) VOUT2 (2 Pins)

A. For most applications, VSENSE1 and VSENSE2 should be externally connected to VOUT1 and VOUT2, respectively, as close as possible to the
device. For other implementations, refer to SENSE terminal connection discussion in the Application Information section.

8 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

Fixed Voltage Version

VIN1 (2 Pins) VOUT1 (2 Pins)

UVLO1
Comp Current 10 kW
-
Sense ENA_1 VSENSE1
2.5 V + (see Note A)
- + ENA_1
GND Reference Vref FB1
Thermal
Vref
Shutdown
PG1

FB1 -
Rising Edge
0.95 x Vref + Deglitch VIN1
PG
Comp
MR2
Reset
Comp RESET
FB2 - 120ms
Rising Edge
0.95 x Vref + Deglitch Delay
VOUT2 UV Comp
VIN1
FB2 -
Falling Edge
0.83 x Vref + Deglitch Power ENA_1
MR1
Sequence
FB1 - Logic ENA_2
Falling Edge
Vref
0.83 x Vref + Deglitch

VOUT1 UV Comp - +
EN ENA_2
VIN1 UVLO2
2.5 V + Comp VSENSE2
Current ENA_2 (see Note A)
-
SEQ Sense 10 kW
(see Note B)
VIN2 (2 Pins) VOUT2 (2 Pins)

A. For most applications, FB1 and FB2 should be externally connected to resistor dividers as close as possible to the device. For other
implementations, refer to FB terminals connection discussion in the Application Information section.

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 9

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

RESET Timing Diagram

with VIN1 Powered Up, MR1 and MR2 at Logic High
VIN2

VRES VRES
(see Note A)
t

VOUT2 VIT+ (see Note B) VIT +(see Note B)

Threshold
Voltage
VIT- VIT-
(see Note B) (see Note B)

t
RESET
Output 120 ms 120 ms
Delay Delay

Output Output
Undefined Undefined

NOTES: A. VRES is the minimum input voltage for a valid RESET. The symbol VRES is not currently listed within EIA or JEDEC
standards for semiconductor symbology.
B. VIT- trip voltage is typically 5% lower than the output voltage (95%VO). VIT- to VIT+ is the hysteresis voltage.

PG1 Timing Diagram

VIN1

VUVLO
VUVLO
VPG1 VPG1
(see Note A)
t

VOUT2 VIT +(see Note B) VIT+ (see Note B)

Threshold
Voltage
VIT- VIT-
(see Note B) (see Note B)

PG1
Output

Output Output
Undefined Undefined

NOTES: A. VPG1 is the minimum input voltage for a valid PG1. The symbol VPG1 is not currently listed within EIA or JEDEC
standards for semiconductor symbology.
B. VIT- trip voltage is typically 5% lower than the output voltage (95%VO). VIT- to VIT+ is the hysteresis voltage.

10 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

Detailed Description
The TPS703xx low dropout regulator family provides dual regulated output voltages for DSP applications that
require a high-performance power management solution. These devices provide fast transient response and high
accuracy, while drawing low quiescent current. Programmable sequencing provides a power solution for DSPs
without any external component requirements. This reduces the component cost and board space while
increasing total system reliability. The TPS703xx family has an enable feature that puts the device into sleep
mode, reducing the input current to 1 mA. Other features are the integrated SVS (power-on reset, RESET) and
power good (PG1). These differential features monitor output voltages and provide logic output to the system,
and provide a complete DSP power solution.
The TPS703xx, unlike many other LDOs, features very low quiescent current that remains virtually constant even
with varying loads. Conventional LDO regulators use a PNP pass element, the base current of which is directly
proportional to the load current through the regulator (IB = IC/b). The TPS703xx uses a PMOS transistor to pass
current. Because the gate of the PMOS is voltage driven, operating current is low and stable over the full load
range.

Pin Functions
Enable (EN)
The EN terminal is an input that enables or shuts down the device. If EN is at a logic high signal, the device is in
shutdown mode. When EN goes to voltage low, then the device is enabled.

Sequence (SEQ)
The SEQ terminal is an input that programs the output voltage (VOUT1 or VOUT2) that turns on first. When the
device is enabled and the SEQ terminal is pulled high or left open, VOUT2 turns on first and VOUT1 remains off until
VOUT2 reaches approximately 83% of its regulated output voltage. If VOUT2 is pulled below 83% (that is, goes to
an overload) VOUT1 is turned off. This terminal has a 6 mA pull-up current to VIN1.
Pulling the SEQ terminal low reverses the power-up order and VOUT1 turns on first. For detailed timing diagrams,
see Figure 33 through Figure 39.

Power-Good (PG1)
The PG1 terminal is an open drain, active high output terminal that indicates the status of the VOUT1 regulator.
When VOUT1 reaches 95% of its regulated voltage, PG1 goes to a high impedance state. PG1 goes to a low
impedance state when VOUT1 is pulled below 95% (that is, goes to an overload condition) of its regulated voltage.
The open drain output of the PG1 terminal requires a pull-up resistor.

Manual Reset Pins (MR1 and MR2)

MR1 and MR2 are active low input terminals used to trigger a reset condition. When either MR1 or MR2 is pulled
to logic low, a POR (RESET) occurs. These terminals have a 6mA pull-up current to VIN1. It is recommended that
these pins be pulled high to VIN when they are not used..

Sense (VSENSE1 and VSENSE2)

The sense terminals of fixed-output options must be connected to the regulator output, and the connection
should be as short as possible. Internally, the sense terminals connect to high-impedance wide-bandwidth
amplifiers through resistor-divider networks and noise pickup feeds through to the regulator output. It is essential
to route the sense connections in such a way to minimize or avoid noise pickup. Adding RC networks between
the VSENSE terminals and VOUT terminals to filter noise is not recommended because these networks can cause
the regulators to oscillate.

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 11

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

FB1 and FB2

FB1 and FB2 are input terminals used for adjustable-output devices and must be connected to the external
feedback resistor divider. FB1 and FB2 connections should be as short as possible. It is essential to route them
in such a way as to minimize or avoid noise pickup. Adding RC networks between the FB terminals and the VOUT
terminals to filter noise is not recommended because these networks can cause the regulators to oscillate.

RESET Indicator
RESET is an active low, open drain output that requires a pull-up resistor for normal operation. When pulled up,
RESET goes to a high impedance state (that is, logic high) after a 120 ms delay when all three of the following
conditions are met. First, VIN1 must be above the undervoltage condition. Second, the manual reset (MR) pin
must be in a high impedance state. Third, VOUT2 must be above approximately 95% of its regulated voltage. To
monitor VOUT1, the PG1 output pin can be connected to MR1 or MR2.

VIN1 and VIN2

VIN1 and VIN2 are inputs to each regulator. Internal bias voltages are powered by VIN1.

VOUT1 and VOUT2

VOUT1 and VOUT2 are output terminals of each regulator.

12 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

TYPICAL CHARACTERISTICS

Table of Graphs
FIGURE
vs Output current Figure 1, Figure 2
VO Output voltage
vs Junction temperature Figure 3, Figure 4
Ground current vs Junction temperature Figure 5
PSRR Power-supply rejection ratio vs Frequency Figure 6 to Figure 9
Output spectral noise density vs Frequency Figure 10 to Figure 13
ZO Output impedance vs Frequency Figure 14 to Figure 17
vs Temperature Figure 18, Figure 19
Dropout voltage
vs Input voltage Figure 20, Figure 21
Load transient response Figure 22, Figure 23
Line transient response (VOUT1) Figure 24
Line transient response (VOUT2) Figure 25
VO Output voltage vs Time (start-up) Figure 26, Figure 27
Equivalent series resistance (ESR) vs Output current Figure 29 to Figure 32

TPS70351 TPS70351
OUTPUT VOLTAGE OUTPUT VOLTAGE
vs vs
OUTPUT CURRENT OUTPUT CURRENT
3.33 1.815

VIN1 = 4.3 V VIN2 = 2.8 V

3.32 1.81 TJ = 25°C
TJ = 25°C
VOUT1 VOUT2
VO - Output Voltage - V

VO - Output Voltage - V

3.31 1.805

3.30 1.8

3.29 1.795

3.28 1.79

3.27 1.785
0 200 400 600 800 1000 0 500 1000 1500 2000
IO - Output Current - mA IO - Output Current - mA
Figure 1. Figure 2.

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 13

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

TYPICAL CHARACTERISTICS (continued)

TPS70351 TPS70351
OUTPUT VOLTAGE OUTPUT VOLTAGE
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
1.834
VIN1 = 4.3 V VIN2 = 2.8 V
3.354
VOUT1 VOUT2
1.824
3.334
VO - Output Voltage - V

1.814

VO - Output Voltage - V
3.314
IO = 1 mA
1.804 IO = 2 A

3.294
1.794 IO = 1 mA
IO = 1 A
3.274
1.784

3.254
1.774

3.234 1.764
40 25 10 5 20 35 50 65 80 95 110 125 40 25 10 5 20 35 50 65 80 95 110 125
TJ - Junction Temperature - °C
TJ - Junction Temperature - °C
Figure 3. Figure 4.

TPS70351
GROUND CURRENT
vs
JUNCTION TEMPERATURE
210
Regulator 1 and Regulator 2

200
IOUT1 = 1 mA
IOUT2 = 1 mA
Ground Current - mA

190

180 IOUT1 = 1 A
IOUT2 = 2 A

170

160

150
40 25 10 5 20 35 50 65 80 95 110 125
TJ - Junction Temperature - °C
Figure 5.

14 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

TYPICAL CHARACTERISTICS (continued)

TPS70351 TPS70351
POWER-SUPPLY REJECTION RATIO POWER-SUPPLY REJECTION RATIO
vs vs
FREQUENCY FREQUENCY
10 0
VIN1 = 4.3 V VIN1 = 4.3 V
PSRR - Power Supply Rejection Ratio - dB

PSRR - Power Supply Rejection Ratio - dB

VOUT1 = 3.3 V 10 VOUT1 = 3.3 V
20
IO = 10 mA IO = 1 A
Co = 22 mF 20 Co = 22 mF
30
30
40
40

50 50

60
60
70
70
80
80
90
90 100
10 100 1k 10 k 100 k 1M 10 100 1k 10 k 100 k 1M
f - Frequency - Hz f - Frequency - Hz
Figure 6. Figure 7.

TPS70351 TPS70351
POWER-SUPPLY REJECTION RATIO POWER-SUPPLY REJECTION RATIO
vs vs
FREQUENCY FREQUENCY
0 0
VIN2 = 2.8 V VIN2 = 2.8 V
PSRR - Power Supply Rejection Ratio - dB

PSRR - Power Supply Rejection Ratio - dB

10 VOUT2 = 1.8 V 10 VOUT2 = 1.8 V

IO = 10 mA IO = 2 A
20 Co = 47 mF 20 Co = 47 mF

30 30

40 40

50 50

60 60

70 70

80 80

90 90
100 100
10 100 1k 10 k 100 k 1M 10 100 1k 10 k 100 k 1M
f - Frequency - Hz f - Frequency - Hz
Figure 8. Figure 9.

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 15

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

TYPICAL CHARACTERISTICS (continued)

OUTPUT SPECTRAL NOISE DENSITY OUTPUT SPECTRAL NOISE DENSITY
vs vs
FREQUENCY FREQUENCY
10 10
VIN1 = 4.3 V VIN2 = 2.8 V
Output Spectral Noise Density - mV/ÖHz

Output Spectral Noise Density - mV/ÖHz

VOUT1 = 3.3 V VOUT2 = 1.8 V
COUT1 = 22 mF COUT2 = 47 mF
IO = 10 mA IO = 10 mA
TJ = 25°C TJ = 25°C
1 1

0.1 0.1

0.01 0.01
100 1k 10 k 100 k 100 1k 10 k 100 k
f - Frequency - Hz f - Frequency - Hz
Figure 10. Figure 11.

OUTPUT SPECTRAL NOISE DENSITY OUTPUT SPECTRAL NOISE DENSITY

vs vs
FREQUENCY FREQUENCY
10 10
VIN1 = 4.3 V VIN2 = 2.8 V
Output Spectral Noise Density - mV/ÖHz

Output Spectral Noise Density - mV/ÖHz

VOUT1 = 3.3 V VOUT2 = 1.8 V

COUT1 = 22 mF COUT2 = 47 mF
IO = 1 A IO = 2 A
TJ = 25°C TJ = 25°C
1 1

0.1 0.1

0.01 0.01
100 1k 10 k 100 k 100 1k 10 k 100 k
f - Frequency - Hz f - Frequency - Hz
Figure 12. Figure 13.

16 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

TYPICAL CHARACTERISTICS (continued)

OUTPUT IMPEDANCE OUTPUT IMPEDANCE
vs vs
FREQUENCY FREQUENCY

VOUT1 = 3.3 V VOUT1 = 3.3 V

IO = 10 mA IO = 1 A
Co = 22 mF Co = 22 mF

ZO - Output Impedance - W
ZO - Output Impedance - W

1 1

0.1 0.1

0.01 0.01

10 100 1k 10 k 100 k 1M 10 M 10 100 1k 10 k 100 k 1M 10 M

f - Frequency - Hz f - Frequency - Hz

Figure 14. Figure 15.

OUTPUT IMPEDANCE OUTPUT IMPEDANCE

vs vs
FREQUENCY FREQUENCY

VOUT2 = 1.8 V VOUT2 = 1.8 V

IO = 10 mA IO = 2 A
Co = 47 mF Co = 47 mF
ZO - Output Impedance - W

ZO - Output Impedance - W

1 1

0.1 0.1

0.01 0.01

10 100 1k 10 k 100 k 1M 10 M 10 100 1k 10 k 100 k 1M 10 M

f - Frequency - Hz f - Frequency - Hz
Figure 16. Figure 17.

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 17

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

TYPICAL CHARACTERISTICS (continued)

DROPOUT VOLTAGE DROPOUT VOLTAGE
vs vs
TEMPERATURE TEMPERATURE
250 25
VOUT1 VOUT1
VIN1 = 3.2 V VIN1 = 3.2 V
200 20
IO = 1 A
IO = 100 mA
Dropout Voltage - mV

Dropout Voltage - mV
150 15

100 10

50 5 IO = 1 mA
IO = 10 mA

0 0
40 25 10 5 20 35 50 65 80 95 110 125 40 25 10 5 20 35 50 65 80 95 110 125
T - Temperature - °C T - Temperature - °C
Figure 18. Figure 19.

TPS70302 TPS70302
DROPOUT VOLTAGE DROPOUT VOLTAGE
vs vs
INPUT VOLTAGE INPUT VOLTAGE
300 300
VOUT1 VOUT2
IO = 1 A IO = 2 A
250 250 TJ = 125°C
TJ = 125°C
Dropout Voltage - mV

Dropout Voltage - mV

200 200
TJ = 25°C
TJ = 25°C
150 150

TJ = -40°C
100 100
TJ = -40°C

50 50

0 0
2.5 3 3.5 4 4.5 5 5.5 2.5 3 3.5 4 4.5 5 5.5

VI - Input Voltage - V VI - Input Voltage - V

Figure 20. Figure 21.

18 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

TYPICAL CHARACTERISTICS (continued)

LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE
IO - Output Current - A

IO - Output Current - A
VIN1 = 4.3 V VOUT2 = 1.8 V
1 VOUT1 = 3.3 V 2 IO = 2 A
Co = 22 mF Co = 22 mF
TJ = 25°C TJ = 25°C
0.5 1

0 0

50
Output Voltage - mV

Output Voltage - mV
DVO - Change in

DVO - Change in
0 50

50 0

100 50

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
t - Time - ms t - Time - ms
Figure 22. Figure 23.

LINE TRANSIENT RESPONSE LINE TRANSIENT RESPONSE

VIN - Input Voltage - V
VIN - Input Voltage - V

VOUT1 = 3.3 V VOUT2 = 1.8 V

5.3 IO = 1 A 3.8 IO = 2 A
Co = 22 mF Co = 47 mF

4.3 2.8
Output Voltage - mV
Output Voltage - mV

DVO - Change in
DVO - Change in

50 100

0 0

50 100

100 200
0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 20
t - Time - ms t - Time - ms

Figure 24. Figure 25.

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 19

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

TYPICAL CHARACTERISTICS (continued)

OUTPUT VOLTAGE AND ENABLE VOLTAGE OUTPUT VOLTAGE AND ENABLE VOLTAGE
vs vs
TIME (START-UP) TIME (START-UP)
4

VO - Output Voltage - V
VO - Output Voltage - V

3
VOUT1 = 3.3 V
IO = 1 A
2 2
Co = 22 mF
VIN1 = 4.3 V
1 SEQ = Low 1

0 0
VOUT2 = 1.8 V

Enable Voltage - V
Enable Voltage - V

IO = 2 A
Co = 47 mF
VIN2 = 2.8 V
5 5 SEQ = High

0 0

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
t - Time (Start-Up) - ms t - Time (Start-Up) - ms

Figure 26. Figure 27.

VIN IN To Load
OUT

+
COUT
EN RL
GND
ESR

Figure 28. Test Circuit for Typical Regions of Stability

20 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

TYPICAL CHARACTERISTICS (continued)

TYPICAL REGION OF STABILITY TYPICAL REGION OF STABILITY
EQUIVALENT SERIES RESISTANCE(1) EQUIVALENT SERIES RESISTANCE(1)
vs vs
OUTPUT CURRENT OUTPUT CURRENT
10 10
VOUT1 = 3.3 V VOUT1 = 3.3 V
Co = 22 mF Co = 220 mF
ESR - Equivalent Series Resistance - W

ESR - Equivalent Series Resistance - W

REGION OF INSTABILITY REGION OF INSTABILITY
1 1

0.1 0.1
50 mW

15 mW

0.01 0.01
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
IO - Output Current - A IO - Output Current - A
Figure 29. Figure 30.

TYPICAL REGION OF STABILITY TYPICAL REGION OF STABILITY

EQUIVALENT SERIES RESISTANCE(1) EQUIVALENT SERIES RESISTANCE(1)
vs vs
OUTPUT CURRENT OUTPUT CURRENT
10 10
REGION OF INSTABILITY REGION OF INSTABILITY
ESR - Equivalent Series Resistance - W
ESR - Equivalent Series Resistance - W

VOUT2 = 1.8 V
VOUT2 = 1.8 V
Co = 47 mF
1 1 Co = 680 mF

0.1 0.1
50 mW

15 mW

0.01 0.01
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
IO - Output Current - A IO - Output Current - A

Figure 31. Figure 32.

(1)
Equivalent series resistance (ESR) refers to the total series resistance, including the ESR of the capacitor, any
series resistance added externally, and PWB trace resistance to CO.

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 21

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

THERMAL INFORMATION

Thermally-Enhanced TSSOP-24 (PWP— PowerPAD™)

The thermally-enhanced PWP package is based on the 24-pin TSSOP, but includes a thermal pad [see
Figure 33(c)] to provide an effective thermal contact between the IC and the printed wiring board (PWB).
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down
TO220-type packages have leads formed as gull wings to make them applicable for surface-mount applications.
These packages, however, suffer from several shortcomings: they do not address the very low profile
requirements (<2 mm) of many of today’s advanced systems, and they do not offer a pin-count high enough to
accommodate increasing integration. On the other hand, traditional low-power surface-mount packages require
power-dissipation derating that severely limits the usable range of many high-performance analog circuits.
The PWP package (thermally-enhanced TSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PWP package is designed to optimize the heat transfer to the PWB. Because of the very small size and
limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths
that remove heat from the component. The thermal pad is formed using a lead-frame design (patent pending)
and manufacturing technique to provide the user with direct connection to the heat-generating IC. When this pad
is soldered or otherwise coupled to an external heat dissipator, high power dissipation in the ultrathin, fine-pitch,
surface-mount package can be reliably achieved.

DIE

Side View (a)

Thermal
Pad

DIE

End View (b)

Bottom View (c)

Figure 33. Views of Thermally-Enhanced PWP Package

Because the conduction path has been enhanced, power-dissipation capability is determined by the thermal
considerations in the PWB design. For example, simply adding a localized copper plane (heat-sink surface),
which is coupled to the thermal pad, enables the PWP package to dissipate 2.5 W in free air (reference
Figure 35(a), 8 cm2 of copper heat sink and natural convection). Increasing the heat-sink size increases the
power dissipation range for the component. The power dissipation limit can be further improved by adding airflow
to a PWB/IC assembly (see Figure 34 and Figure 35). The line drawn at 0.3 cm2 in Figure 34 and Figure 35
indicates performance at the minimum recommended heat-sink size, illustrated in Figure 36.

22 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

The thermal pad is directly connected to the substrate of the IC, which for the TPS703xx series is a secondary
electrical connection to device ground. The heat-sink surface that is added to the PWP can be a ground plane or
left electrically isolated. In TO220-type surface-mount packages, the thermal connection is also the primary
electrical connection for a given terminal which is not always ground. The PWP package provides up to 24
independent leads that can be used as inputs and outputs (Note: leads 1, 12, 13, and 24 are internally
connected to the thermal pad and the IC substrate).

THERMAL RESISTANCE
vs COPPER HEATSINK AREA
150

125 Natural Convection

RqJA - Thermal Resistance - °C/W

50 ft/min

100 ft/min

100 150 ft/min

200 ft/min

75

50
250 ft/min

300 ft/min

25
0 0.3 1 2 3 4 5 6 7 8
2
Copper Heatsink Area - cm

Figure 34.

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 23

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

3.5 3.5
TA = 25°C TA = 55°C
300 ft/min
3 3
PD - Power Dissipation Limit - W

PD - Power Dissipation Limit - W

150 ft/min
2.5 2.5 300 ft/min

2 2 150 ft/min
Natural Convection

1.5 1.5
Natural Convection

1 1

0.5 0.5

0 0
0 2 4 6 8 0 2 4 6 8
0.3 2 0.3 2
Copper Heatsink Size - cm Copper Heatsink Size - cm
(a) (b)

3.5
TA = 105°C

3
PD - Power Dissipation Limit - W

2.5

1.5
150 ft/min
300 ft/min
1

Natural Convection
0.5

0
0 2 4 6 8
0.3 2
Copper Heatsink Size - cm
(c)

Figure 35. Power Ratings of the PWP Package at Ambient Temperatures of +25°C, +55°C, and +105°C

24 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

Figure 36 is an example of a thermally-enhanced PWB layout for use with the new PWP package. This board
configuration was used in the thermal experiments that generated the power ratings shown in Figure 34 and
Figure 35. As discussed earlier, copper has been added on the PWB to conduct heat away from the device. RqJA
for this assembly is illustrated in Figure 34 as a function of heat-sink area. A family of curves is included to
illustrate the effect of airflow introduced into the system.

Heatsink Area
1 oz Copper

Board thickness 62 mils

Board size 3.2 in ´ 3.2 in
Board material FR4
Copper trace/heat sink 1 oz
Exposed pad mounting 63/67 tin/lead solder

Figure 36. PWB Layout (Including Copper Heatsink Area) for Thermally-Enhanced PWP Package

From Figure 34, RqJA for a PWB assembly can be determined and used to calculate the maximum
power-dissipation limit for the component/PWB assembly, with the equation:
TJmax - TA
PD(max) =
RqJA(system)

where:
• TJmax is the maximum specified junction temperature (+150°C absolute maximum limit, +125°C recommended
operating limit) and TA is the ambient temperature. (1)
PD(max) should then be applied to the internal power dissipated by the TPS703xx regulator. The equation for
calculating total internal power dissipation of the TPS703xx is:
PD(total) = VIN1 - VOUT1 ´ IOUT1 + VIN1 ´ IQ + VIN2 - VOUT2 ´ IOUT2 + VIN2 ´ IQ
( ( ( (
2 2 (2)
Since the quiescent current of the TPS703xx is very low, the second term is negligible, further simplifying the
equation to:

( ( (
PD(total) = VIN1 - VOUT1 ´ IOUT1 + VIN2 - VOUT2 ´ IOUT2 ( (3)
2
For the case where TA = +55°C, airflow = 200 ft/min, copper heat-sink area = 4 cm , the maximum
power-dissipation limit can be calculated. First, from Figure 34, we find the system RqJA is +50°C/W; therefore,
the maximum power-dissipation limit is:
TJmax - TA +125°C - 55°C
PD(max) = = = 1.4 W
RqJA(system) +50°C/W (4)
If the system implements a TPS703xx regulator, where VIN1 = 5.0V, VIN2 = 2.8 V, IOUT1 = 500 mA, and IOUT2 =
800 mA, the internal power dissipation is:

( ( (
PD(total) = VIN1 - VOUT1 ´ IOUT1 + VIN2 - VOUT2 ´ IOUT2 (
= (5.0 - 3.3) ´ 0.5 + (2.8 - 1.8) ´ 0.8 = 1.65 W (5)

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 25

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

Comparing PD(total) with PD(max) reveals that the power dissipation in this example does not exceed the calculated
limit. When it does, one of two corrective actions should be made: raising the power-dissipation limit by
increasing the airflow or the heat-sink area, or lowering the internal power dissipation of the regulator by reducing
the input voltage or the load current. In either case, the above calculations should be repeated with the new
system parameters. This parameter is measured with the recommended copper heat sink pattern on a 4-layer
PWB, 2 oz. copper traces on 4-in × 4-in ground layer. Simultaneous and continuous operation of both regulator
outputs at full load may exceed the power dissipation rating of the PWP package.

Mounting Information
The primary requirement is to complete the thermal contact between the thermal pad and the PWB metal. The
thermal pad is a solderable surface and is fully intended to be soldered at the time the component is mounted.
Although voiding in the thermal-pad solder-connection is not desirable, up to 50% voiding is acceptable. The data
included in Figure 34 and Figure 36 are for soldered connections with voiding between 20% and 50%. The
thermal analysis shows no significant difference resulting from the variation in voiding percentage.
Figure 37 shows the solder-mask land pattern for the PWP package. The minimum recommended heat-sink area
is also illustrated. This is simply a copper plane under the body extent of the package, including metal routed
under terminals 1, 12, 13, and 24.
Minimum Recommended Location of Exposed
Heatsink Area Thermal Pad on
PWP Package

Figure 37. PWP Package Land Pattern

26 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

APPLICATION INFORMATION
MR1 and MR2 (tied to PG1) are at logic high,
Sequencing Timing Diagrams RESET is pulled to logic high after a 120 ms
delay. When EN returns to a logic high, both
This section provides a number of timing diagrams devices power down and both PG1 (tied to MR2)
showing how this device functions in different and RESET return to logic low.
configurations.
TPS703xxPWP
Application conditions not shown in block (Fixed Output Option)
diagram: VOUT1
VI
VIN1 and VIN2 are tied to the same fixed input VIN1 VOUT1
voltage greater than VUVLO; SEQ is tied to logic
low; PG1 is tied to MR2; MR1 is not used and is 0.22 mF 22 mF
VSENSE1
connected to VIN.
Explanation of timing diagrams: PG1 250 kW

EN is initially high; therefore, both regulators are VIN2 MR2 MR2

off and PG1 and RESET are at logic low. With
SEQ at logic low, when EN is taken to logic low, 0.22 mF RESET
RESET
VOUT1 turns on. VOUT2 turns on after VOUT1
reaches 83% of its regulated output voltage.
When VOUT1 reaches 95% of its regulated output MR1 MR1
EN EN VIN
voltage, PG1 (tied to MR2) goes to logic high. >2 V
When both VOUT1 and VOUT2 reach 95% of their <0.7 V VSENSE2
respective regulated output voltages and both
SEQ
VOUT2 VOUT2

47 mF

EN

SEQ

VOUT2 95%
83%

95%
VOUT1
83%

PG1

MR1

MR2
(MR2 tied to PG1)

RESET

t1
(see Note A) 120 ms

NOTE A: t1: Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.

Figure 38. Timing When SEQ = Low

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 27

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

Application conditions not shown in block

TPS703xxPWP
diagram: (Fixed Output Option)
VIN1 and VIN2 are tied to the same fixed input VI VOUT1
VIN1 VOUT1
voltage greater than VUVLO; SEQ is tied to logic
high; PG1 is tied to MR2; MR1 is not used and is
0.22 mF 22 mF
connected to VIN. VSENSE1

Explanation of timing diagrams: 250 kW

PG1
EN is initially high; therefore, both regulators are MR2
MR2
off and PG1 and RESET are at logic low. With VIN2
SEQ at logic high, when EN is taken to logic low,
0.22 mF RESET
VOUT2 turns on. VOUT1 turns on after VOUT2 RESET
reaches 83% of its regulated output voltage.
When VOUT1 reaches 95% of its regulated output MR1 MR1
VIN
EN EN
voltage, PG1 (tied to MR2) goes to logic high.
>2 V
When both VOUT1 and VOUT2 reach 95% of their VSENSE2
<0.7 V
respective regulated output voltages and both
MR1 and MR2 (tied to PG1) are at logic high, SEQ
VOUT2
RESET is pulled to logic high after a 120 ms VOUT2
delay. When EN returns to logic high, both 47 mF
devices turn off and both PG1 (tied to MR2) and
RESET return to logic low.

EN

SEQ

VOUT2 95%
83%

VOUT1 95%
83%

PG1

MR1

MR2
(MR2 tied to PG1)

RESET

t1
(see Note A) 120ms
NOTE A: t1: Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.

Figure 39. Timing When SEQ = High

28 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

Application conditions not shown in block

TPS703xxPWP
diagram: (Fixed Output Option)
VIN1 and VIN2 are tied to the same fixed input VI VOUT1
voltage greater than VUVLO; SEQ is tied to logic VIN1 VOUT1
high; PG1 is tied to MR2; MR1 is initially at logic 0.22 mF
high but is eventually toggled. 22 mF
VSENSE1

Explanation of timing diagrams: 250 kW

EN is initially high; therefore, both regulators are PG1
MR2
off and PG1 and RESET are at logic low. With VIN2 MR2
SEQ at logic high, when EN is taken low, VOUT2
turns on. VOUT1 turns on after VOUT2 reaches 83% 0.22 mF RESET
RESET
of its regulated output voltage. When VOUT1
reaches 95% of its regulated output voltage, PG1 MR1
(tied to MR2) goes to logic high. When both EN MR1
EN 2V
VOUT1 and VOUT2 reach 95% of their respective >2 V
0.7 V
regulated output voltages and both MR1 and <0.7 V VSENSE2
MR2 (tied to PG1) are at logic high, RESET is SEQ
pulled to logic high after a 120 ms delay. When VOUT2
VOUT2
MR1 is taken low, RESET returns to logic low but 47 mF
the outputs remain in regulation. When MR1
returns to logic high, because both VOUT1 and
VOUT2 remain above 95% of their respective
regulated output voltages and MR2 (tied to PG1)
remains at logic high, RESET is pulled to logic
high after a 120 ms delay.

EN

SEQ

VOUT2 95%
83%

VOUT1 95%
83%

PG1

MR1

MR2
(MR2 tied to PG1)

RESET

t1
120 ms 120 ms
(see Note A)

NOTE A: t1: Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.

Figure 40. Timing When MR1 is Toggled

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 29

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

Application conditions not shown in block

TPS703xxPWP
diagram: (Fixed Output Option)
VIN1 and VIN2 are tied to the same fixed input VI VOUT1
voltage greater than VUVLO; SEQ is tied to logic VIN1 VOUT1
high; PG1 is tied to MR2; MR1 is not used and is
0.22 mF 22 mF
connected to VIN. VSENSE1

Explanation of timing diagrams: 250 kW

PG1
EN is initially high; therefore, both regulators are
MR2 MR2
off and PG1 and RESET are at logic low. With VIN2
SEQ at logic high, when EN is taken low, VOUT2
turns on. VOUT1 turns on after VOUT2 reaches 83% 0.22 mF RESET RESET
of its regulated output voltage. When VOUT1
reaches 95% of its regulated output voltage, PG1 MR1 MR1
EN EN VIN
(tied to MR2) goes to logic high. When both
VOUT1 and VOUT2 reach 95% of their respective >2 V
<0.7 V VSENSE2
regulated output voltages and both MR1 and
MR2 (tied to PG1) are at logic high, RESET is SEQ
VOUT2 VOUT2
pulled to logic high after a 120 ms delay. When a
fault on VOUT1 causes it to fall below 95% of its 47 mF
regulated output voltage, PG1 (tied to MR2) goes
to logic low.

EN

SEQUENCE

VOUT2 95%
83%

95%
VOUT1
83%
Fault on VOUT1

PG1

MR1

MR2
(MR2 tied to PG1)

RESET

t1
(see Note A) 120 ms

NOTE A: t1: Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.

Figure 41. Timing When a Fault Occurs on VOUT1

30 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

Application conditions not shown in block

TPS703xxPWP
diagram: (Fixed Output Option)
VIN1 and VIN2 are tied to the same fixed input VI VOUT1
voltage greater than VUVLO; SEQ is tied to logic VIN1 VOUT1
high; PG1 is tied to MR2; MR1 is not used and is
0.22 mF 22 mF
connected to VIN. VSENSE1

Explanation of timing diagrams: 250 kW

PG1
EN is initially high; therefore, both regulators are
MR2 MR2
off and PG1 and RESET are at logic low. With VIN2
SEQ at logic high, when EN is taken low,
VOUT2turns on. VOUT1 turns on after VOUT2 0.22 mF RESET RESET
reaches 83% of its regulated output voltage.
When VOUT1 reaches 95% of its regulated output MR1 MR1
EN EN VIN
voltage, PG1 (tied to MR2) goes to logic high.
When both VOUT1 and VOUT2 reach 95% of their >2 V
<0.7 V VSENSE2
respective regulated output voltages and both
MR1 and MR2 (tied to PG1) are at logic high, SEQ
VOUT2 VOUT2
RESET is pulled to logic high after a 120 ms
delay. When a fault on VOUT2 causes it to fall 47 mF
below 95% of its regulated output voltage,
RESET returns to logic low and VOUT1 begins to
power down because SEQ is high. When VOUT1
falls below 95% of its regulated output voltage,
PG1 (tied to MR2) returns to logic low.

ENABLE

SEQUENCE

95%
VOUT2 83%
Fault on VOUT2

95%
VOUT1
83%

PG1

MR1

MR2
(MR2 tied to PG1)

RESET
t1
(see Note A) 120 ms

NOTE A: t1: Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.

Figure 42. Timing When a Fault Occurs on VOUT2

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 31

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

APPLICATION INFORMATION

Split Voltage DSP Application

Figure 43 shows a typical application where the TPS70351 is powering up a DSP. In this application, by
grounding the SEQ pin, VOUT1 (I/O) powers up first, and then VOUT2 (core).

TPS70351 PWP
DSP I/O
3.3 V
5V VIN1 VOUT1

0.22 mF 22 mF 250 kW
VSENSE1

PG1
PG1
MR2 MR2
VIN2
250 kW
0.22 mF RESET RESET

>2 V EN MR1 MR1

EN
<0.7 V
VSENSE2

SEQ
1.8 V Core
VOUT2
47 mF

EN

SEQ

VOUT2 95%
(Core)
83%

VOUT1 95%
(I/O)
83%

PG1

RESET

t1
120ms
(see Note A)

NOTE A: t1: Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.

Figure 43. Application Timing Diagram (SEQ = Low)

32 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

Figure 44 shows a typical application where the TPS70351 is powering up a DSP. In this application, by pulling
up the SEQ pin, VOUT2 (core) powers up first, and then VOUT1 (I/O).

TPS70351 PWP
DSP I/O
5V 3.3 V
VIN1 VOUT1

0.22 mF 22 mF 250 kW
VSENSE1

PG1
PG1
MR2 MR2
VIN2
250 kW
0.22 mF RESET RESET

>2 V EN MR1 MR1

EN
<0.7 V
VSENSE2

SEQ
1.8 V Core
VOUT2
47 mF

EN

SEQ

VOUT2 95%
(Core)
83%

VOUT1 95%
(I/O) 83%

PG1

RESET

t1 120ms
(see Note A)

NOTE A: t1: Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.

Figure 44. Application Timing Diagram (SEQ = High)

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 33

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

Input Capacitor
For a typical application, a ceramic input bypass capacitor (0.22 mF to 1 mF) is recommended to ensure device
stability. This capacitor should be as close as possible to the input pin. Because of the impedance of the input
supply, large transient currents cause the input voltage to droop. If this droop causes the input voltage to drop
below the UVLO threshold, the device turns off. Therefore, it is recommended that a larger capacitor be placed in
parallel with the ceramic bypass capacitor at the regulator input. The size of this capacitor depends on the output
current, response time of the main power supply, and the main power supply distance to the regulator. At a
minimum, the capacitor should be sized to ensure that the input voltage does not drop below the minimum UVLO
threshold voltage during normal operating conditions.

Output Capacitor
As with most LDO regulators, the TPS703xx requires an output capacitor connected between OUT and GND to
stabilize the internal control loop. The minimum recommended capacitance value for VOUT1 is 22 mF and the ESR
(equivalent series resistance) must be between 50 mΩ and 800 mΩ. The minimum recommended capacitance
value for VOUT2 is 47mF and the ESR must be between 50 mΩ and 2 Ω. Solid tantalum electrolytic, aluminum
electrolytic, and multilayer ceramic capacitors are all suitable, provided they meet the requirements described
above. Larger capacitors provide a wider range of stability and better load transient response. Table 1 gives a
partial listing of surface-mount capacitors suitable for use with the TPS703xx for fast transient response
applications.
This information, along with the ESR graphs, is included to assist in selection of suitable capacitance for user
applications. When necessary to achieve low height requirements along with high output current and/or high load
capacitance, several higher ESR capacitors can be used in parallel to meet the guidelines above.

Table 1. Partial Listing of TPS703xx-Compatible Surface-Mount Capacitors

VALUE MANUFACTURER MFR PART NO.
680 mF Kemet T510X6871004AS
470 mF Sanyo 4TPB470M
150 mF Sanyo 4TPC150M
220 mF Sanyo 2R5TPC220M
100 mF Sanyo 6TPC100M
68 mF Sanyo 10TPC68M
68 mF Kemet T495D6861006AS
47 mF Kemet T495D4761010AS
33 mF Kemet T495C3361016AS
22 mF Kemet T495C2261010AS

34 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H – AUGUST 2000 – REVISED APRIL 2010

Programming the TPS70302 Adjustable LDO Regulator

The output voltage of the TPS70302 adjustable regulators is programmed using external resistor dividers as
shown in Figure 45.
Resistors R1 and R2 should be chosen for approximately a 50 mA divider current. Lower value resistors can be
used, but offer no inherent advantage and waste more power. Higher values should be avoided as leakage
currents at the sense terminal increase the output voltage error. The recommended design procedure is to
choose R2 = 30.1 kΩ to set the divider current at approximately 50 mA, and then calculate R1 using Equation 6:
VOUT
R1 = (
VREF
- 1 ´ R2 ( (6)
where:
• VREF = 1.224 V typ (the internal reference voltage)
OUTPUT VOLTAGE
TPS70302 PROGRAMMING GUIDE
OUTPUT
VI IN R1 R2 UNIT
VOLTAGE
0.1 mF
>2.0 V 2.5 V 31.6 30.1 kW
EN OUT VO 3.3 V 51.1 30.1 kW
<0.7 V + 3.6 V 59.0 30.1 kW
R1
FB
GND
R2

Figure 45. TPS70302 Adjustable LDO Regulator Programming

Regulator Protection
Both TPS703xx PMOS-pass transistors have built-in back diodes that conduct reverse currents when the input
voltage drops below the output voltage (for example, during power-down). Current is conducted from the output
to the input and is not internally limited. When extended reverse voltage is anticipated, external limiting may be
appropriate.
The TPS703xx also features internal current limiting and thermal protection. During normal operation, the
TPS703xx regulator 1 limits output current to approximately 1.75 A (typ) and regulator 2 limits output current to
approximately 3.8 A (typ). When current limiting engages, the output voltage scales back linearly until the
overcurrent condition ends. While current limiting is designed to prevent gross device failure, care should be
taken not to exceed the power dissipation ratings of the package. If the temperature of the device exceeds
+150°C (typ), thermal-protection circuitry shuts it down. Once the device has cooled below +130°C (typ),
regulator operation resumes.

Copyright © 2000–2010, Texas Instruments Incorporated Submit Documentation Feedback 35

TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
SLVS285H – AUGUST 2000 – REVISED APRIL 2010 www.ti.com

REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (December 2009) to Revision H Page

• Changed Tube transport media, quantity value from 70 to 60 in Ordering Information table .............................................. 3

Changes from Revision F (September 2009) to Revision G Page

• Changed Dissipation Ratings table ....................................................................................................................................... 4

36 Submit Documentation Feedback Copyright © 2000–2010, Texas Instruments Incorporated

 PACKAGE OPTION ADDENDUM

www.ti.com 13-Jul-2022

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

TPS70302PWP ACTIVE HTSSOP PWP 24 60 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70302 Samples

TPS70302PWPG4 ACTIVE HTSSOP PWP 24 60 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70302 Samples

TPS70302PWPR ACTIVE HTSSOP PWP 24 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70302 Samples

TPS70302PWPRG4 ACTIVE HTSSOP PWP 24 2000 TBD Call TI Call TI -40 to 125 Samples

TPS70345PWP ACTIVE HTSSOP PWP 24 60 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70345 Samples

TPS70345PWPG4 ACTIVE HTSSOP PWP 24 60 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70345 Samples

TPS70345PWPR ACTIVE HTSSOP PWP 24 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70345 Samples

TPS70348PWP ACTIVE HTSSOP PWP 24 60 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70348 Samples

TPS70348PWPR ACTIVE HTSSOP PWP 24 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70348 Samples

TPS70351PWP ACTIVE HTSSOP PWP 24 60 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70351 Samples

TPS70351PWPG4 ACTIVE HTSSOP PWP 24 60 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70351 Samples

TPS70351PWPR ACTIVE HTSSOP PWP 24 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70351 Samples

TPS70358PWP ACTIVE HTSSOP PWP 24 60 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70358 Samples

TPS70358PWPR ACTIVE HTSSOP PWP 24 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT70358 Samples

TPS70358PWPRG4 ACTIVE HTSSOP PWP 24 2000 TBD Call TI Call TI -40 to 125 Samples

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 13-Jul-2022

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS70302PWPR HTSSOP PWP 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
TPS70345PWPR HTSSOP PWP 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
TPS70348PWPR HTSSOP PWP 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
TPS70351PWPR HTSSOP PWP 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
TPS70358PWPR HTSSOP PWP 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS70302PWPR HTSSOP PWP 24 2000 350.0 350.0 43.0
TPS70345PWPR HTSSOP PWP 24 2000 350.0 350.0 43.0
TPS70348PWPR HTSSOP PWP 24 2000 350.0 350.0 43.0
TPS70351PWPR HTSSOP PWP 24 2000 350.0 350.0 43.0
TPS70358PWPR HTSSOP PWP 24 2000 350.0 350.0 43.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

TUBE

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
TPS70302PWP PWP HTSSOP 24 60 530 10.2 3600 3.5
TPS70302PWPG4 PWP HTSSOP 24 60 530 10.2 3600 3.5
TPS70345PWP PWP HTSSOP 24 60 530 10.2 3600 3.5
TPS70345PWPG4 PWP HTSSOP 24 60 530 10.2 3600 3.5
TPS70348PWP PWP HTSSOP 24 60 530 10.2 3600 3.5
TPS70351PWP PWP HTSSOP 24 60 530 10.2 3600 3.5
TPS70351PWPG4 PWP HTSSOP 24 60 530 10.2 3600 3.5
TPS70358PWP PWP HTSSOP 24 60 530 10.2 3600 3.5

Pack Materials-Page 3
 GENERIC PACKAGE VIEW
TM
PWP 24 PowerPAD TSSOP - 1.2 mm max height
4.4 x 7.6, 0.65 mm pitch PLASTIC SMALL OUTLINE

This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4224742/B

www.ti.com
 IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated