Stf7N80K5, Stfi7N80K5: N-Channel 800 V, 0.95 Ω Typ., 6 A Mdmesh™ K5 Power Mosfets In To-220Fp And I²Pakfp Packages
Stf7N80K5, Stfi7N80K5: N-Channel 800 V, 0.95 Ω Typ., 6 A Mdmesh™ K5 Power Mosfets In To-220Fp And I²Pakfp Packages
Stf7N80K5, Stfi7N80K5: N-Channel 800 V, 0.95 Ω Typ., 6 A Mdmesh™ K5 Power Mosfets In To-220Fp And I²Pakfp Packages
STFI7N80K5
N-channel 800 V, 0.95 Ω typ., 6 A MDmesh™ K5
Power MOSFETs in TO-220FP and I²PAKFP packages
Datasheet - production data
Features
Order code VDS RDS(on) max. ID PTOT
STF7N80K5
800 V 1.2 Ω 6A 25 W
STFI7N80K5
Applications
Switching applications
G(1) Description
These very high voltage N-channel Power
MOSFETs are designed using MDmesh™ K5
technology based on an innovative proprietary
vertical structure. The result is a dramatic
reduction in on-resistance and ultra-low gate
S(3) charge for applications requiring superior power
AM01476v1_No_tab density and high efficiency.
Table 1: Device summary
Order code Marking Package Packing
STF7N80K5 TO-220FP
7N80K5 Tube
STFI7N80K5 I²PAKFP (TO-281)
Contents
1 Electrical ratings ............................................................................. 3
2 Electrical characteristics ................................................................ 4
2.1 Electrical characteristics (curves) ...................................................... 6
3 Test circuits ..................................................................................... 9
4 Package information ..................................................................... 10
4.1 TO-220FP package information ...................................................... 11
4.2 I²PAKFP (TO-281) package information ......................................... 13
5 Revision history ............................................................................ 15
1 Electrical ratings
Table 2: Absolute maximum ratings
Symbol Parameter Value Unit
VGS Gate-source voltage ±30 V
ID(1) Drain current (continuous) at TC = 25 °C 6 A
ID(1) Drain current (continuous) at TC = 100 °C 3.8 A
IDM(2) Drain current (pulsed) 24 A
PTOT Total dissipation at TC = 25 °C 25 W
(3)
dv/dt Peak diode recovery voltage slope 4.5
V/ns
(4) MOSFET dv/dt ruggedness
dv/dt 50
Insulation withstand voltage (RMS) from all three leads to external
VISO 2500 V
heat sink (t=1 s; TC= 25 °C)
Tj Operating junction temperature range
- 55 to 150 °C
Tstg Storage temperature range
Notes:
(1)Limited by package.
(2)Pulse width limited by safe operating area
(3)I
SD ≤6 A, di/dt ≤100 A/μs, VDS(peak) ≤V(BR)DSS
(4)V
DS ≤ 640 V
2 Electrical characteristics
TC = 25 °C unless otherwise specified
Table 5: On/off-state
Symbol Parameter Test conditions Min. Typ. Max. Unit
Drain-source breakdown
V(BR)DSS VGS = 0 V, ID = 1 mA 800 V
voltage
VGS = 0 V, VDS = 800 V 1 µA
Zero gate voltage drain
IDSS VGS = 0 V, VDS = 800 V
current 50 µA
TC = 125 °C (1)
IGSS Gate body leakage current VDS = 0 V, VGS = ±20 V ±10 µA
VGS(th) Gate threshold voltage VDD = VGS, ID = 100 µA 3 4 5 V
Static drain-source
RDS(on) VGS = 10 V, ID = 3 A 0.95 1.2 Ω
on-resistance
Notes:
(1)Defined by design, not subject to production test.
Table 6: Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Ciss Input capacitance - 360 - pF
Coss Output capacitance VDS = 100 V, f = 1 MHz, - 30 - pF
VGS = 0 V
Reverse transfer
Crss - 1 - pF
capacitance
Equivalent capacitance time
Co(tr)(1) - 47 - pf
related
VDS = 0 to 640 V, VGS = 0 V
Equivalent capacitance
Co(er)(2) - 20 - pf
energy related
Rg Intrinsic gate resistance f = 1 MHz, ID=0 A - 6 - Ω
Qg Total gate charge VDD = 640 V, ID = 6 A - 13.4 - nC
Qgs Gate-source charge VGS= 0 to 10 V - 3.7 - nC
(see Figure 16: "Test circuit
Qgd Gate-drain charge for gate charge behavior") - 7.5 - nC
Notes:
(1)C is a constant capacitance value that gives the same charging time as Coss while VDS is rising from 0 to
o(tr)
80% VDSS.
(2)C is a constant capacitance value that gives the same stored energy as Coss while VDS is rising from 0 to
o(er)
80% VDSS.
Notes:
(1)Pulse width limited by safe operating area
(2)Pulsed: pulse duration = 300 µs, duty cycle 1.5%
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD
performance of the device. The Zener voltage facilitates efficient and cost-effective device
integrity protection, thus eliminating the need for additional external componentry.
Figure 10: Normalized gate threshold voltage vs Figure 11: Normalized on-resistance vs temperature
temperature
Figure 12: Normalized V(BR)DSS vs temperature Figure 13: Maximum avalanche energy vs starting TJ
3 Test circuits
Figure 15: Test circuit for resistive load Figure 16: Test circuit for gate charge
switching times behavior
Figure 17: Test circuit for inductive load Figure 18: Unclamped inductive load test
switching and diode recovery times circuit
Figure 19: Unclamped inductive waveform Figure 20: Switching time waveform
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
7012510_Rev_12_B
8291506 Re v. C
5 Revision history
Table 12: Document revision history
Date Revision Changes
First release. Part numbers previously included in datasheet
11-Oct-2013 1
DocID023448
Modified features on cover page.
Modified Table 2: "Absolute maximum ratings", Table 7: "Switching
05-Jul-2017 2
times" and Table 9: "Gate-source Zener diode".
Minor text changes.
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