WPM2015 KPM2025 (A1shb)
WPM2015 KPM2025 (A1shb)
WPM2015 KPM2025 (A1shb)
P-Channel MOSFET
WPM2015 (KPM2015)
SOT-23 Unit: mm
2.9 -0.1
+0.1
0.4 -0.1
+0.1
0.4
■ Features
+0.1
2.4 -0.1
+0.1
1.3 -0.1
● VDS (V) =-20V
● ID =-2.4 A
0.55
1 2
1.9 -0.1
+0.1
+0.1
0.97 -0.1
● Supper high density cell design
1. Gate
2. Source
+0.1
0.38 -0.1
0-0.1
D 3. Drain
3
1 2
G S
Note.1: Surface mounted on FR-4 Board using 1 square inch pad size, 1oz copper
Note.2: Surface mounted on FR-4 board using minimum pad size, 1oz copper
Note.3: Pulse width<380μs, Duty Cycle<2%
1
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SMD Type MOSFET
P-Channel MOSFET
WPM2015 (KPM2015)
■ Electrical Characteristics Ta = 25℃
Parameter Symbol Test Conditions Min Typ Max Unit
Drain-Source Breakdown Voltage VDSS ID=-250μA, VGS=0V -20 V
Zero Gate Voltage Drain Current IDSS VDS=-16V, VGS=0V -1 uA
Gate-Body leakage current IGSS VDS=0V, VGS=±8V ±100 nA
Gate Threshold Voltage VGS(th) VDS=VGS , ID=-250μA -0.4 -0.81 V
VGS=-4.5V, ID=-2.7A 110
Static Drain-Source On-Resistance RDS(On) mΩ
VGS=-2.5V, ID=-2.2A 150
Input Capacitance Ciss 534
Output Capacitance Coss VGS=0V, VDS=-10V, f=1MHz 62 pF
Reverse Transfer Capacitance Crss 54
Total Gate Charge Qg 7.3
Threshold Gate Charge Qg(th) 0.5
VGS=-4.5V, VDS=-10V, ID=-2.7A nC
Gate Source Charge Qgs 1.25
Gate Drain Charge Qgd 1.15
Turn-On DelayTime td(on) 8
Turn-On Rise Time tr VGS=-4.5V, VDS=-10V, 6.4
ns
Turn-Off DelayTime td(off) ID=-1.2A, RG=6Ω 41
Turn-Off Fall Time tf 7
Maximum Body-Diode Continuous Current IS -0.9 A
Diode Forward Voltage VSD IS=-0.9A,VGS=0V -1.5 V
■ Marking
Marking A1SHB
2
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SMD Type MOSFET
P-Channel MOSFET
WPM2015 (KPM2015)
■ Typical Characterisitics
10 5
o
VGS=-4.5V VGS=-4V V DS=-5V T=-50 C
-IDS-Drain to Source Current(A)
6 VGS=-2.5V
3 T=125 C
o
4 2
VGS=-1.5V
2 1
0 0
0.0 0.4 0.8 1.2 1.6 2.0
0.0 0.5 1.0 1.5 2.0
-V GS-Gate to Source Voltage(V)
-VDS-Drain to Source Voltage(V)
160 280
VGS=-1.8V
RDS(ON)-Reistance(m )
120 200
VGS=-2.5V
100 160
80 VGS=-4.5V
120
60 80
40 40
1 2 3 4 5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
-IDS-Drain to Source Current(A) -VGS-Gate to Source Voltage(V)
ID=-250uA
120
RDS(ON)-On Resistance(m )
0.8
100
80 0.6
60
0.4
40
0.2
20 -50 0 50 100 150
-50 0 50 100 150 o
o Temperature( C)
Temperature( C)
On-Resistance vs. Junction temperature Threshold voltage vs. Temperature
3
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SMD Type MOSFET
P-Channel MOSFET
WPM2015 (KPM2015)
■ Typical Characterisitics
800 5
o
F=1MHZ T=125 C
500 3 o
T=25 C
400
300 2
200
Coss 1
100
Crss
0 0
0 2 4 6 8 10 0.0 0.3 0.6 0.9 1.2 1.5
-VDS-Drain to Source Voltage(V) -VSD-Source to Drain Voltage(V)
10 10 100 µs
Limitedby R DS(on)
8
1 ms
- ID - Drain Current (A)
1
6 10 ms
Power (W)
4 100 ms
0.1
1s
T A = 25 °C
10 s
2 T A = 25 °C Single Pulse
DC
B V DSS Limited
0 0.01
.
0.01 0.1 1 10 100 1000 0.1 1 10 100
-V DS - Drain-to-So
urce V oltage (V )
Time (s)
4.5
ID=-2.7A
4.0
-VGS-Gate to Source Voltage
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0 2 4 6 8 10
Qg (nc)
Gate Charge Characteristics
4
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SMD Type MOSFET
P-Channel MOSFET
WPM2015 (KPM2015)
■ Typical Characterisitics
1
Duty Cycle = 0.5
Normalized Effective Transient
Thermal Impedance
0.2
0.1 Notes:
0.1
0.05 PDM
t1
0.02 t2
t1
1. Duty Cycle, D =
t2
2. Per Unit Base = RthJA = 1 2 0 ° C / W
3. TJM - TA = PDMZthJA(t)
Single Pulse 4. Surface Mounted
0.01
10 -4 10 -3 10 -2 10 -1 1 10 100 1000
Square Wave Pulse Duration (s)
5
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