Apl5325 Anpec
Apl5325 Anpec
Apl5325 Anpec
• Wide Operating Voltage: 3~6V The APL5325 is a P-channel low dropout linear regulator
APL5325
VIN VOUT
3 VIN VOUT 4
CIN 1 COUT
SHDN SET 5
GND
2
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Thermal Characteristics
Symbol Parameter Typical Value Unit
(Note 2)
Thermal Resistance-Junction to Ambient
θJA
o
240 C/W
SOT-23-5
Thermal Resistance-Junction to Case
θJC
o
130 C/W
SOT-23-5
Note 2 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Electrical Characteristics
Unless otherwise specified, these specifications apply over VIN = VOUT+1V, IOUT=0~300mA, CIN = 1µF, COUT = 2.2µF, TA = -40 to 85oC.
Typical values are at TA = 25oC.
APL5325
Symbol Parameter Test Conditions Unit
Min. Typ. Max.
Quiescent Current vs. Supply Voltage Quiescent Current vs. Junction Temperature
160 138
80 132
60
130
40
128
20
0 126
0 1 2 3 4 5 6 7 -50 -25 0 25 50 75 100 125
Supply Voltage, V IN (V) Junction Temperature, T J (o C)
COUT=2.2µF,IOUT=300mA
o
300 TJ=125oC TJ=75 C
-20
-30 250
PSRR(dB)
-40 200
-50 150
-60 100
TJ=-50oC
-70 50
TJ=25oC
-80 0
1000 10000 100000 0 100 200 300
Frequency(Hz) Output Current, I OUT(mA)
Dropout Voltage vs. Output Current Current Limit vs. Junction Temperature
700 600
VOUT=2.5V VIN=5V
600
Dropout Voltage, VDROP(mV)
TJ=75oC
Current Limit, ILIMIT(mA)
550
500 TJ=125oC
400
500
300
VIN=3.3V
200 o 450
TJ=-50 C
100 TJ=25oC
0 400
0 100 200 300 -50 -25 0 25 50 75 100 125
Output Current, IOUT(mA) Junction Temperature, T J(oC)
30 IOUT=100mA IOUT=300mA
120
Phase (degree)
20 100
Loop Gain (dB)
10
80
0
60
-10
40 IOUT=100mA
-20 IOUT=300mA
20
-30
-40 0
1000 10000 100000 1000000 1000 10000 100000 1000000
Frequency (Hz)
Frequency (Hz)
Operating Waveforms
Enable Shutdown
SHDN SHDN
CH1 CH1
VIN VIN
CH2 CH2
VOUT VOUT
CH3 CH3
IOUT I OUT
CH4 CH4
I OUT VOUT
CH2
CH2 CH1
VIN VIN
CH1 CH1
VOUT VOUT
CH2 CH2
I OUT IOUT
CH3 CH3
Pin Description
PIN
FUNCTION
NO. NAME
1 SHDN Shutdown control pin, logic high: enable; logic low: shutdown.
2 GND Ground pin.
3 VIN Voltage supply input pin.
4 VOUT Regulator output pin.
5 SET Connect this pin to an external resistor divider to adjust output voltage.
Block Diagram
Thermal
Foldback
Shutdown - Current
+ Limit
0.8V
3MΩ
VOUT
SET
GND
VIN VOUT
3 4
VIN VOUT
1 5
CIN SHDN SET R1
COUT
1µF GND
2.2µF
2
Enable R2
Shutdown
R1
VOUT = 0.8 ⋅ 1 +
R2
Function Description
R1
VOUT = 0.8 ⋅ 1 +
R2
Thermal Shutdown
Shutdown Control
Application Information
The APL5325 requires proper input capacitors to supply The APL5325 maximum power dissipation depends on
surge current during stepping load transients to prevent the thermal resistance and temperature difference be-
the input rail from dropping . Because the parasitic induc- tween the die junction and ambient air. The power dissi-
tor from the voltage sources or other bulk capacitors to pation PD across the device is:
the VIN limit the slew rate of the surge current, place the PD = (TJ - TA) / θJA
Input capacitors near VIN as close as possible. Input ca-
where (TJ-TA) is the temperature difference between the
pacitors should be larger than 1µF and a minimum ce-
junction and ambient air. θ JA is the thermal resistance
ramic capacitor of 1µF is necessary.
between Junction and ambient air. Assuming the
Output Capacitor TA=25 oC and maximum TJ=160 oC (typical thermal limit
The APL5325 needs a proper output capacitor to main- threshold), the maximum power dissipation is calcu-
tain circuit stability and to improve transient response over lated as:
temperature and current. In order to insure the circuit PD(max)=(160-25)/240
stability, the proper output capacitor value should be larger = 0.56(W)
than 2.2µF. With X5R and X7R dielectrics, 2.2µF is suffi- For normal operation, do not exceed the maximum junc-
cient at all operating temperatures. Large output capaci- tion temperature rating of TJ = 125 oC. The calculated power
tor value can reduce noise and improve load-transient dissipation should less than:
response and PSRR, however, it also affects power on PD =(125-25)/240
issue. Equation (1) shows the relationship between the = 0.41(W)
maximum COUT value and the VOUT. The GND provides an electrical connection to the ground
19.5
and channels heat away. Connect the GND to the ground
C OUT(max) = 101 −
VOUT by using a large pad or a ground plane.
Layout Consideration
Where the unit of COUT is µF and VOUT is V. Figure 1 shows
the curve of maximum output capacitor over the output Figure 2 illustrates the layout. Below is a checklist for
voltage. The output voltage range is from 0.8 to 5.5V and your layout:
the output capacitor value should under the line. Output 1. Please place the input capacitors close to the VIN.
capacitors must be placed at the load and the ground pin 2. Ceramic capacitors for load must be placed near the
as close as possible and the impedance of the layout load as close as possible.
must be minimized. 3. To place APL5325 and output capacitors near the load
is good for performance.
120
4. Large current paths, the bold lines in figure 2, must
110 have wide tracks.
Output Capacitor (µF)
80
70
60
0 1 2 3 4 5 6
Output Voltage (V)
Figure 1
CIN
APL5325
VIN
3
VIN
VOUT
4
VOUT
5
SET R1 COUT
GND
2 LOAD
R2
Figure 2
SOT-23-5
0.076
0.1
0.05
0.038 0.02
Unit : Inch
Package Information
SOT-23-5
D
e
SEE
E1 VIEW A
E
b c
e1
0.25
A2
GAUGE PLANE
SEATING PLANE
A1
L
0
VIEW A
S SOT-23-5
Y
M MILLIMETERS INCHES
B
O
L MIN. MAX. MIN. MAX.
A 1.45 0.057
A1 0.00 0.15 0.000 0.006
A2 0.90 1.30 0.035 0.051
b 0.30 0.50 0.012 0.020
c 0.08 0.22 0.003 0.009
D 2.70 3.10 0.106 0.122
E 2.60 3.00 0.102 0.118
E1 1.40 1.80 0.055 0.071
e 0.95 BSC 0.037 BSC
e1 1.90 BSC 0.075 BSC
L 0.30 0.60 0.012 0.024
0 0° 8° 0° 8°
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
OD0 P0 P2 P1 A
E1
F
W
B0
K0 A0 OD1 B A
B
SECTION A-A
T
SECTION B-B
d
H
A
T1
Application A H T1 C d D W E1 F
8.4+2.00 13.0+0.50
178.0±2.00 50 MIN. 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
-0.00 -0.20
SOT-23-5 P0 P1 P2 D0 D1 T A0 B0 K0
1.5+0.10 0.6+0.00
4.0±0.10 4.0±0.10 2.0±0.05 1.0 MIN. 3.20±0.20 3.10±0.20 1.50±0.20
-0.00 -0.40
(mm)
TP tp
Critical Zone
TL to TP
Ramp-up
TL
tL
Temperature
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25°C to Peak
Time
Reliability Test Program
Test item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec
HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C
PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C
TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V
Latch-Up JESD 78 10ms, 1tr > 100mA
Customer Service
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838