btw69 800

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BTW69-800

Datasheet

50 A 800 V SCR in TOP3 insulated

A Features
• Max. repetitive blocking voltage = VDRM, VRRM = 800 V
G
• IGT maximum = 80 mA
K
• ECOPACK®2 component (RoHS and HF compliance)
• Complies with UL 1557 standard (File ref : E81734)

Application
K • Solid state relays
A
G • Welding equipment
TOP3 Isolated • High power motor control
• Heating systems
• Controlled AC/DC bridge

Description
Product status link
Available in a high power package TOP3-I, the BTW69-800 is suitable in applications
BTW69-800 where power handling and power dissipation are critical, such as solid state relays,
welding equipment, high power motor control and power converters.
This device offers a superior performance in surge current handling capabilities,
Product summary
allowing usage in industrial environment.
IT(RMS) 50 A
Thanks to its internal ceramic pad, it provide high voltage insulation (2500VRMS),
VDRM/VRRM 800 V complying with UL standards (file ref: E81734).
IGT 80 mA

DS13093 - Rev 2 - July 2023 www.st.com


For further information contact your local STMicroelectronics sales office.
BTW69-800
Characteristics

1 Characteristics

Table 1. Absolute maximum ratings

Symbol Parameters Value Unit

IT(RMS) RMS on-state current (180° conduction angle) Tc = 75 °C 50 A

Average on-state current


IT(AV) Tc = 75 °C 32 A
(180° conduction angle)
tp = 8.3 ms 610
ITSM Non repetitive surge peak on-state current (full cycle, Tj initial = 25 °C, VR = 0 V) A
tp = 10 ms 580

I2t I2t value for fusing tp = 10 ms, Tj = 25°C 1680 A2s


Critical rate of rise of on-state current
dl/dt F = 60 Hz Tj = 125 °C 50 A/µs
IG = 2 x IGT , tr ≤ 100 ns

IGM Peak gate current tp = 20 µs Tj = 125 °C 8 A

PG(AV) Average gate power dissipation Tj = 125 °C 1 W

Tstg Storage junction temperature range -40 to +150 °C

Tj Operating junction temperature range -40 to +125 °C

VGRM Maximum peak reverse gate voltage 5 V

Vins Insulation RMS voltage, 1 minute 2500 V

Table 2. Electrical characteristics (Tj = 25°C, unless otherwise specified)

Symbol Test conditions Tj Value Unit

Min. 8
IGT mA
VD = 12 V, RL = 33 Ω Max 80
VGT Max 1.3 V

VGD VD = VDRM, RL = 3.3 kΩ 125 °C Min. 0.2 V

IH IT = 500 mA, gate open Max. 150 mA

IL IG = 1.2 x IGT Max. 200 mA

dV/dt VD = 67 %, VDRM gate open 125 °C Min. 1000 V/µs

VTM ITM = 100 A, tp = 380 μs Max. 1.9 V

VTO Threshold on-state voltage 125 °C Max. 1.0 V

RD On-state dynamic resistance 125 °C Max. 8.5 mΩ

25 °C 10 µA
IDRM/IRRM VD = VDRM, VR = VRRM Max.
125 °C 5 mA

Table 3. Thermal resistance

Symbol Parameters Value Unit

Rth(j-c) Junction to case (D.C) 0.9


°C/W
Rth(j-a) Junction to ambiant (D.C) 50

DS13093 - Rev 2 page 2/9


BTW69-800
Characteristics (curves)

1.1 Characteristics (curves)

Figure 1. Maximum average power dissipation versus Figure 2. Average on-state current versus case
average on-state current temperature

IT(AV)(A)
P(W) 60
55
DC
50 α = 180 °
50
45
40
40
35 α = 180 °
30
30
25
20
20
15 360° 360°
10
5 10
IT(AV)(A)
0 Tc (°C)
0 10 20 30 40 0
0 25 50 75 100 125

Figure 3. Relative variation of thermal impedance versus


pulse duration Figure 4. Relative variation of gate trigger current, holding
current and latching current versus junction temperature

K = [Zth / Rth]
IGT,IH,IL[Tj] / IGT,IH,IL[Tj = 25 °C]
1.E+00 2.5

2.0
Zth (j-c) IGT

Zth (j-a) 1.5


1.E-01

1.0 IH and IL

0.5
tp(s) Tj (°C)
1.E-02
0.0
1.E-03 1.E-01 1.E+01 1.E+03
-40 10 60 110

Figure 6. Non repetitive surge peak on-state current for a


Figure 5. Surge peak on-state current versus number of
sinusoidal pulse with width tp< 10 ms, and corresponding
cycles (VR = 0 V)
value of I²t (VR = 0 V)
ITSM(A) 2
ITSM(A) ,I t (A s)
2

600 10000
Tj initial=25°C

500
t=10ms
Non repetitive
Tj initial = 25 °C One cy cle dI/dt limitation:
400 50A/µs ITSM

300 Repetitive
Tc = 75 °C 1000

200

100
Number of cycles
0
t p (ms)
1 10 100 1000 100
0.01 0.10 1.00 10.00

DS13093 - Rev 2 page 3/9


BTW69-800
Characteristics (curves)

Figure 7. On-state characteristics (maximum values)


ITM(A)
1000

100
TJ = 125 °C

10

1
TJ = 25 °C TJ max:
Vt0 = 1 V
VTM(V) Rd = 8.5 mΩ
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

DS13093 - Rev 2 page 4/9


BTW69-800
Package information

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

2.1 TOP3 Ins. package information


• ECOPACK (lead-free plating and halogen free package compliance)
• Lead-free package leads finishing
• Halogen-free molding compound resin meets UL94 standard level V0
• Recommended torque: 1.05 N·m (max. torque: 1.2 N·m)

Figure 8. Package outline

DS13093 - Rev 2 page 5/9


BTW69-800
TOP3 Ins. package information

Table 4. Mechanical data

Dimensions

Ref. mm Inches(1)

Min. Typ. Max. Min. Typ. Max.

A 4.40 4.60 0.1732 0.1811


B 1.45 1.55 0.0571 0.0610
C 14.35 15.60 0.5650 0.6142
D 0.50 0.70 0.0197 0.0276
E 2.70 2.90 0.1063 0.1142
F 15.80 16.50 0.6220 0.6496
G 20.40 21.10 0.8031 0.8307
H 15.10 15.50 0.5945 0.6102
J 5.40 5.65 0.2126 0.2224
K 3.40 3.65 0.1339 0.1437
L 4.08 4.17 0.1606 0.1642
P 1.10 1.30 0.0430 0.0510
R 4.60 0.1811

1. Inches given for reference only

DS13093 - Rev 2 page 6/9


BTW69-800
Ordering information

3 Ordering information

Figure 9. Ordering information scheme

BTW 69 - 800 RG

Standard SCR series

Type
69 = 50 A

Voltage
800 = 800 V

Packing mode
RG = Tube

Table 5. Ordering information

Order code Marking Package Weight Base qty. Delivery mode

BTW69-800RG BTW69800 TOP3 Ins. 4.5 g 30 Tube

DS13093 - Rev 2 page 7/9


BTW69-800

Revision history
Table 6. Document revision history

Date Revision Changes

09-Sep-2019 1 Initial release.


27-Jul-2023 2 Updated Table 4. Mechanical data.

DS13093 - Rev 2 page 8/9


BTW69-800

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© 2023 STMicroelectronics – All rights reserved

DS13093 - Rev 2 page 9/9

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