T3035H, T3050H

Datasheet

30 A - 600 V H-series Snubberless Triac

A2 Features
• High current Triac
G
• High immunity level
A1
• Low thermal resistance with clip bonding
A2
• Very high 3 quadrant commutations at 150 °C capabilities
• Packages are RoHS (2002/95/EC) compliant
G
• UL certified (ref. file E81734)
G
A2 A2
A1 A1

TO-220AB TO-220AB Ins. Application

A2

Thanks to its high electrical noise immunity level and its strong current robustness,
the T3035H, T3050H series is designed for the control of AC actuators in appliances
A2
G
and industrial systems.
A1
D²PAK

Description
Specifically designed to operate at 150 °C, the 30 A triacs T3050H provide very high
dynamic and enhanced performance in terms of power loss and thermal dissipation.
This allows the heatsink size optimization, leading to space and cost effectiveness
Product status link when compared to electro-mechanical solutions.
Based on ST Snubberless technology, they offer a specified minimal commutation
T3035H, T3050H
and high noise immunity levels valid up to the Tj max.
These devices safely optimize the control of universal motors and inductive loads
Product summary found in power tools and major appliances.
By using an internal ceramic pad, they provide voltage insulation (rated at 2500
IT(RMS) 30 A
VRMS).
VDRM/VRRM 600 V

IGT 35 or 50 mA

DS6689 - Rev 8 - April 2022 www.st.com

For further information contact your local STMicroelectronics sales office.
 T3035H, T3050H
Characteristics

1 Characteristics

Table 1. Absolute maximum ratings (limiting values)

Symbol Parameter Value Unit

D2PAK, Tc = 121 °C
IT(RMS) RMS on-state current (full sine wave) TO-220AB 30 A
TO-220AB Ins. Tc = 92 °C

Non repetitive surge peak on-state current f = 50 Hz t = 20 ms 270

ITSM A
(full cycle, Tj initial = 25 °C) f = 60 Hz t = 16.7 ms 284

I2t I2t value for fusing tp = 10 ms 487 A2s

Critical rate of rise of on-state current,
dl/dt f = 120 Hz Tj =150 °C 50 A/µs
IG = 2 x IGT, tr ≤ 100 ns, f = 100 Hz

VDSM/ VDRM/VRRM
Non Repetitive peak off-state voltage tp = 10 ms Tj = 25 °C V
VRSM +100

IGM Peak gate current tp = 20 µs Tj = 150 °C 4 A

PG(AV) Average gate power dissipation Tj = 150 °C 1 W

Tstg Storage temperature range -40 to +150 °C

Tj Operating junction temperature range -40 to +150 °C

Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified)

Value
Symbol Test conditions Quadrants Unit
T3035H T3050H

IGT(1) Max. 35 50 mA
VD = 12 V, RL = 33 Ω I - II - III
VGT Max. 1.0 V

VGD VD = VDRM, RL = 3.3 kΩ I - II - III Max. 0.15 V

I - III Max. 75 90
IL IG = 1.2 x IGT mA
II Max. 90 110

IH (2) IT = 500 mA, gate open Max. 60 75 mA

dV/dt (2) VD = 2/3 x VDRM, gate open Tj = 150 °C Min. 1000 1500 V/µs

(dl/dt)c (2) Without snubber Tj = 150 °C Min. 33 44 A/ms

1. Minimum IGT is guaranteed at 20% of IGT max.

2. For both polarities of A2 referenced to A1.

DS6689 - Rev 8 page 2/13

 T3035H, T3050H
Characteristics

Table 3. Static characteristics

Symbol Test conditions Value Unit

VT (1) IT = 42 A, tp = 380 µs Tj = 25 °C Max. 1.55 V

VTO (1) Threshold voltage Tj = 150 °C Max. 0.80 V

RD(1) Dynamic resistance Tj = 150 °C Max. 15 mΩ

Tj = 25 °C 10 µA
VDRM = VRRM Max.
IDRM/ Tj = 150°C 8.5 mA
IRRM (2)
VD = VR = 400 V, peak voltage Tj = 150 °C Max. 7
mA
VD = VR = 200 V, peak voltage Tj = 150 °C Max. 5.5

1. For both polarities of A2 referenced to A1.

2. tp = 380 μs

Table 4. Thermal resistance

Symbol Parameter Value Unit

D2PAK,
0.8
Rth(j-c) Junction to case (AC) TO-220AB °C/W
TO-220AB Ins. 1.6

D2PAK,
Junction to ambient (Scu = 2 cm2) 45
Rth(j-a) TO-220AB °C/W
Junction to ambient TO-220AB Ins. 60

DS6689 - Rev 8 page 3/13

 T3035H, T3050H
Characteristics (curves)

1.1 Characteristics (curves)

Figure 1. Maximum power dissipation versus on-state

Figure 2. On-state RMS current versus case temperature
RMS current
IT(RMS) (A)
P(W)
35
40
TO-220AB, D²PAK
35 30

30 25
TO-220AB- ins
25 20

20
15
15
10
10
5
5
Tc(°C)
IT(RMS)(A) 0
0 0 25 50 75 100 125 150
0 5 10 15 20 25 30

Figure 3. On-state RMS current versus ambient Figure 4. Variation of thermal impedance versus pulse
temperature (free air convection) duration

IT(RMS)(A) K=[Zth /Rth]

1.0E+00
3.5
Zth(j-c)
Zth(j-a)
3.0

2.5 1.0E-01

2.0

1.5
1.0E-02
1.0

0.5
Ta (°C) tP(s)
0.0 1.0E-03
0 25 50 75 100 125 150
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03

Figure 6. Relative variation of holding current and

Figure 5. Relative variation of gate trigger current and
latching current versus junction temperature (typical
gate trigger voltage versus junction temperature
value)

IH, IL [Tj] / IH, IL [Tj = 25 °C]

2.0

1.5

1.0
IL

IH
0.5

Tj(°C)
0.0
-50 -25 0 25 50 75 100 125 150

DS6689 - Rev 8 page 4/13

 T3035H, T3050H
Characteristics (curves)

Figure 7. Surge peak on-state current versus number of Figure 8. Non-repetitive surge peak on-state current for a
cycles sinusoidal pulse with width tP < 10 ms

ITSM(A) I TSM (A)

10000
Tj initial = 25°C
250

t = 20 ms
200
Non repetitive One cy cle 1000
Tj initial = 25 °C
150

100
100

Repetitive
50
TC = 121 °C

Number of cycles t P (ms)

0 10
1 01 100 1000
0.01 0.10 1.00 10.00

Figure 10. Relative variation of critical rate of decrease of

Figure 9. On-state characteristics (maximum values)
main current versus junction temperature
ITM(A)
(dI/dt)c[T j ]/(dI/dt)c [T j = 150 °C]
1000
11
10
9

100 8
7
V 6
5
10 4
3
2
1
Tj (°C)
1 0
25 50 75 100 125 150
0 1 2 3 4 5

Figure 12. Relative variation of leakage current versus

Figure 11. Relative variation of static dV/dt immunity
junction temperature for different values of blocking
versus junction temperature
voltage
dV/dt[Tj ]/dV/dt[Tj = 150 °C] IDRM [T j;V DRM /VRRM
RRM DRM RRM
11 1.0E+00
10 VD = V R= 400 V [Tj = 150 °C; 600 V]
9
8 1.0E-01 VDRM = V RRM = 600 V
7
6 VDRM = V RRM = 400 V
5 1.0E-02
4 VDRM = V RRM = 200 V
3
2 1.0E-03
1
Tj(°C)
0
25 50 75 100 125 150 T j (°C)
1.0E-04

25 50 75 100 125 150

DS6689 - Rev 8 page 5/13

 T3035H, T3050H
Characteristics (curves)

Figure 14. Acceptable junction to ambient thermal

Figure 13. Thermal resistance junction to ambient versus
resistance versus repetitive peak off-state voltage and
copper surface under tab
ambient temperature
Rth(j-a) (°C/W)
80
D²PAK
70
Epoxy printed board FR4, copper thickness = 35 µm

60

50

40

30

20

10
SCu (cm²)
0
0 5 10 15 20 25 30 35 40

DS6689 - Rev 8 page 6/13

 T3035H, T3050H
Package information

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

2.1 D²PAK package information

Figure 15. D²PAK package outline

E A E1
c2 E2
L2

D1
D
H

1 2 3

D2
L3

b2

e
b Max resin gate protrusion: 0.5 mm (1)
G

A1
A2

A3

R
L

Gauge Plane

c
V2
(1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical.

DS6689 - Rev 8 page 7/13

 T3035H, T3050H
D²PAK package information

Table 5. D²PAK package mechanical data

Dimensions

Ref. Millimeters Inches(1)

Min. Typ. Max. Min. Typ. Max.

A 4.30 4.60 0.1693 0.1811

A1 2.49 2.69 0.0980 0.1059
A2 0.03 0.23 0.0012 0.0091
A3 0.25 0.0098
b 0.70 0.93 0.0276 0.0366
b2 1.25 1.7 0.0492 0.0669
c 0.45 0.60 0.0177 0.0236
c2 1.21 1.36 0.0476 0.0535
D 8.95 9.35 0.3524 0.3681
D1 7.50 8.00 0.2953 0.3150
D2 1.30 1.70 0.0512 0.0669
e 2.54 0.1
E 10.00 10.28 0.3937 0.4047
E1 8.30 8.70 0.3268 0.3425
E2 6.85 7.25 0.2697 0.2854
G 4.88 5.28 0.1921 0.2079
H 15 15.85 0.5906 0.6240
L 1.78 2.28 0.0701 0.0898
L2 1.27 1.40 0.0500 0.0551
L3 1.40 1.75 0.0551 0.0689
R 0.40 0.0157
V2 0° 8° 0° 8°

1. Dimensions in inches are given for reference only

Figure 16. D²PAK recommended footprint (dimensions are in mm)

16.90

10.30 5.08

1.30

3.70
8.90

DS6689 - Rev 8 page 8/13

 T3035H, T3050H
TO-220AB package information

2.2 TO-220AB package information

• Molding compound resin is halogen-free and meets flammability standard UL94 level 0
• Lead-free package leads finishing
• ECOPACK2 compliant
• Recommended torque: 0.4 to 0.6 N.m

Figure 17. TO-220AB package outline

B C

b2
Resin gate 0.5 mm I
max. protusion(1)
L
F

I4

l3

a1 c2

l2
a2

M
b1 Resin gate 0.5 mm c1
max. protusion(1)
e
(1)Resin gate position accepted in one of the two positions or in the symmetrical opposites.

DS6689 - Rev 8 page 9/13

 T3035H, T3050H
TO-220AB package information

Table 6. TO-220AB package mechanical data

Dimensions

Ref. Millimeters Inches(1)

Min. Typ. Max. Min. Typ. Max.

A 15.20 15.90 0.5984 0.6260

a1 3.75 0.1476
a2 13.00 14.00 0.5118 0.5512
B 10.00 10.40 0.3937 0.4094
b1 0.61 0.88 0.0240 0.0346
b2 1.23 1.32 0.0484 0.0520
C 4.40 4.60 0.1732 0.1811
c1 0.49 0.70 0.0193 0.0276
c2 2.40 2.72 0.0945 0.1071
e 2.40 2.70 0.0945 0.1063
F 6.20 6.60 0.2441 0.2598
I 3.73 3.88 0.1469 0.1528
L 2.65 2.95 0.1043 0.1161
I2 1.14 1.70 0.0449 0.0669
I3 1.14 1.70 0.0449 0.0669
I4 15.80 16.40 16.80 0.6220 0.6457 0.6614
M 2.6 0.1024

1. Inch dimensions are for reference only.

DS6689 - Rev 8 page 10/13

 T3035H, T3050H
Ordering information

3 Ordering information

Figure 18. Ordering information scheme

Table 7.

T 30 xx H - 6 y -TR

Triac series
Current
30 = 30 A
Sensitivity
35 = 35 mA
50 = 50 mA
High temperature
Voltage
6 = 600 V
Package
T = TO-220AB
I = TO-220AB insulated
G = D²PAK
Delivery mode
Blank = Tube (T0-220AB, TO-220AB ins.)
-TR = Tape and reel (D²PAK)

Ordering information

Order code Marking Package Weight Base qty. Delivery mode

T3035H-6G T3035H-6G 50 Tube

D²PAK 1.5 g
T3035H-6G-TR T3035H-6G 1000 Tape and reel 13"
T3035H-6I T3035H-6I TO-220AB Ins. 2.3 g 50 Tube
T3035H-6T T3035H-6T TO-220AB 2.3 g 50 Tube
T3050H-6G T3050H-6G 50 Tube
D²PAK 1.5 g
T3050H-6G-TR T3050H-6G 1000 Tape and reel 13"
T3050H-6T T3050H-6T TO-220AB 2.3 g 50 Tube

DS6689 - Rev 8 page 11/13

 T3035H, T3050H

Revision history
Table 8. Document revision history

Date Version Changes

28-Jan-2010 1 Initial release.

17-May-2010 2 Updated maximum Tj in Table 2.
14-Dec-2010 3 Updated IGT in Table 1.
20-Sep-2011 4 Updated: Features.
21-Jul-2015 5 Update Table 2 and reformatted to current standard.
20-Jan-2017 6 D²PAK package added.
Updated Description and Table 2.
17-Nov-2021 7
Minor text changes.
29-Apr-2022 8 Updated Table 2 and Table 7.

DS6689 - Rev 8 page 12/13

 T3035H, T3050H

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DS6689 - Rev 8 page 13/13