SST3904

NPN General Purpose Transistor Datasheet

l Outline
　 SOT-23 　
Parameter Value
　 　

VCEO 40V 　
IC 200mA
　
SST3 　

l Features l Inner circuit

1)BVCEO＞40V(IC=1mA)
2)Complements the SST3906

l Application
AUDIO FREQUENCY SMALL SIGNAL AMPLIFIER

l Packaging specifications 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　

Basic
Part No. Package Package Taping Reel size Tape width ordering Marking
size code (mm) (mm)
unit.(pcs)
SOT-23
SST3904 2924 T116 180 8 3000 R1A
(SST3)

l Absolute maximum ratings (Ta = 25°C)

Parameter Symbol Values Unit
Collector-base voltage VCBO 60 V
Collector-emitter voltage VCEO 40 V
Emitter-base voltage VEBO 6 V
Collector current IC 200 mA
PD*1 200 mW
Power dissipation
PD*2 350 mW
Junction temperature Tj 150 ℃
Range of storage temperature Tstg -55 to +150 ℃
　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　
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© 2016 ROHM Co., Ltd. All rights reserved. 1/4 20160610 - Rev.002
SST3904 　　　　　　　　 Datasheet

l Electrical characteristics (Ta = 25°C)

Values
Parameter Symbol Conditions Unit
Min. Typ. Max.
Collector-base breakdown voltage BVCBO IC = 10μA 60 - - V
Collector-emitter breakdown BVCEO IC = 1mA 40 - - V
voltage
Emitter-base breakdown voltage BVEBO IE = 10μA 6 - - V
Collector cut-off current ICES VCE = 30V - - 50 nA
Emitter cut-off current IEBO VEB = 3V - - 50 nA
VCE(sat)1 IC = 10mA, IB = 1mA - - 200 mV
Collector-emitter saturation voltage
VCE(sat)2 IC = 50mA, IB = 5mA - - 300 mV
VBE(sat)1 IC = 10mA, IB = 1mA 650 - 850 mV
Base-emitter saturation voltage
VBE(sat)2 IC = 50mA, IB = 5mA - - 950 mV
hFE1 VCE = 1V, IC = 100μA 40 - - -
hFE2 VCE = 1V, IC = 1mA 70 - - -

DC current gain hFE3 VCE = 1V, IC = 10mA 100 - 300 -

hFE4 VCE = 1V, IC = 50mA 60 - - -
hFE5 VCE = 1V, IC = 100mA 30 - - -
VCB = 10V, IE = 0A
Output capacitance Cob - - 4.0 pF
f = 100kHz
VBE = 0.5V, IC = 0A
Input capacitance Cib - - 8.0 pF
f = 100kHz
VCE = 20V, IE = -10mA
Transition frequency fT 300 - - MHz
f = 100MHz

Delay time td VCC ⋍ 3V, IC = 10mA - - 35 ns

IB1 = 1mA, RL = 300Ω
VBE(off) = -500mV
Rise time tr See test circuit - - 35 ns

Storage time tstg VCC ⋍ 3V - - 200 ns

IC = 10mA
IB1 = 1mA
IB2 = -1mA, RL = 300Ω
Fall time tf - - 50 ns
See test circuit

*1 Each terminal mounted on a reference land.

*2 Mounted on a ceramic board(7.0×5.0×0.6mm).
　 　 　 　 　 　 　
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© 2016 ROHM Co., Ltd. All rights reserved. 2/4 20160610 - Rev.002
SST3904 　　　 Datasheet

SWITCHING TIME TEST CIRCUIT

　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　
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© 2016 ROHM Co., Ltd. All rights reserved. 3/4 20160610 - Rev.002
SST3904 　　　 Datasheet

l Dimensions

　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　
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© 2016 ROHM Co., Ltd. All rights reserved. 4/4 20160610 - Rev.002
 Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport
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accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ

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a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

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product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.

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A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

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Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.