TC58NVG0S3AFT05

TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS

1 GBIT (128M × 8 BITS) CMOS NAND EEPROM

DESCRIPTION
The TC58NVG0S3A is a single 3.3-V 1G-bit (1,107,296,256 bits) NAND Electrically Erasable and Programmable
Read-Only Memory (NAND EEPROM) organized as (2048 + 64) bytes × 64 pages × 1024 blocks. The device has a
2112-byte static registers which allow program and read data to be transferred between the register and the
memory cell array in 2112-byte increments. The Erase operation is implemented in a single block unit (128 Kbytes
+ 4 Kbytes: 2112 bytes × 64 pages).
The TC58NVG0S3A is a serial-type memory device which utilizes the I/O pins for both address and data
input/output as well as for command inputs. The Erase and Program operations are automatically executed
making the device most suitable for applications such as solid-state file storage, voice recording, image file
memory for still cameras and other systems which require high-density non-volatile memory data storage.

FEATURES
• Organization • Powersupply VCC = 2.7 V to 3.6 V
Memory cell array 2112 × 64K × 8 • Program/Erase Cycles 1E5 Cycles (With ECC)
Register 2112 × 8 • Access time
Page size 2112 bytes Cell array to register 25 µs max
Block size (128K + 4K) bytes Serial Read Cycle 50 ns min
• Modes • Operating current
Read, Reset, Auto Page Program Read (50 ns cycle) 10 mA typ.
Auto Block Erase, Status Read Program (avg.) 10 mA typ.
• Mode control Erase (avg.) 10 mA typ.
Serial input/output Standby 50 µA max
Command control • Package
TSOPI48-P-1220-0.50 (Weight: 0.53 g typ.)

PIN ASSIGNMENT (TOP VIEW) PIN NAMES

NC 1 48 NC I/O1 to I/O8 I/O port
NC 2 47 NC
NC 3 46 NC
NC 4 45 NC CE Chip enable
NC 5 44 I/O8
GND 6 43 I/O7 WE Write enable
RY / BY 7 42 I/O6
RE 8 41 I/O5 RE Read enable
CE 9 40 NC
NC 10 39 NC CLE Command latch enable
NC 11 38 NC
VCC 12 37 VCC ALE Address latch enable
VSS 13 36 VSS
NC 14 35 NC
NC 15 34 NC WP Write protect
CLE 16 33 NC
ALE 17 32 I/O4 RY / BY Ready/Busy
WE 18 31 I/O3
WP 19 30 I/O2 GND Ground Input
NC 20 29 I/O1
NC 21 28 NC VCC Power supply
NC 22 27 NC
NC 23 26 NC VSS Ground
NC 24 25 NC

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 TC58NVG0S3AFT05
BLOCK DIAGRAM

VCC VSS
Status register

I/O1 Address register Column buffer

I/O
to Control Column decoder
circuit
I/O8 Command register Data register

Sense amp

CE

Row address decorder

Row address buffer
CLE

decoder
ALE Logic Control Memory
WE control circuit cell array

RE

WP

RY / BY
RY / BY HV generator

ABSOLUTE MAXIMUM RATINGS

SYMBOL RATING VALUE UNIT

VCC Power Supply Voltage −0.6 to 4.6 V

VIN Input Voltage −0.6 to 4.6 V

VI/O Input /Output Voltage −0.6 V to VCC + 0.3 V (≤ 4.6 V) V

PD Power Dissipation 0.3 W

TSOLDER Soldering Temperature (10 s) 260 °C

TSTG Storage Temperature −55 to 150 °C

TOPR Operating Temperature 0 to 70 °C

CAPACITANCE *(Ta = 25°C, f = 1 MHz)

SYMB0L PARAMETER CONDITION MIN MAX UNIT

CIN Input VIN = 0 V  10 pF

COUT Output VOUT = 0 V  10 pF

* This parameter is periodically sampled and is not tested for every device.

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 TC58NVG0S3AFT05
VALID BLOCKS (1)

SYMBOL PARAMETER MIN TYP. MAX UNIT

NVB Number of Valid Blocks 1004  1024 Blocks

(1) The TC58NVG0S3A occasionally contains unusable blocks. Refer to Application Note (13) toward the end of this document.
(2) The first block (block address #00) is guaranteed to be a valid block at the time of shipment.

RECOMMENDED DC OPERATING CONDITIONS

SYMBOL PARAMETER MIN TYP. MAX UNIT

VCC Power Supply Voltage 2.7 3.3 3.6 V

VIH High Level input Voltage 2.0  VCC + 0.3 V

VIL Low Level Input Voltage −0.3*  0.8 V

* −2 V (pulse width lower than 20 ns)

DC CHARACTERISTICS (Ta = 0 to 70°C, VCC = 2.7 V~3.3 V)

SYMBOL PARAMETER CONDITION MIN TYP. MAX UNIT

IIL Input Leakage Current VIN = 0 V to VCC   ±10 µA

ILO Output Leakage Current VOUT = 0 V to VCC   ±10 µA

ICCO1 Reading CE = VIL, IOUT = 0 mA, tcycle = 50 ns  10 30 mA

ICCO2 Programming Current   10 30 mA

ICCO3 Erasing Current   10 30 mA

ICCS1 Standby Current CE = VIH, WP = 0 V/VCC   1 mA

ICCS2 Standby Current CE = VCC − 0.2 V, WP = 0 V/VCC   50 µA

VOH High Level Output Voltage VCC, IOH = −400 µA 2.4   V

VOL Low Level Output Voltage VCC, IOL = 2.1 mA   0.4 V

IOL ( RY / BY ) Output current of RY / BY pin VOL = 0.4 V  8  mA

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 TC58NVG0S3AFT05
AC CHARACTERISTICS AND RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70°C, VCC = 2.7 V~3.6 V)

SYMBOL PARAMETER MIN MAX UNIT NOTES

tCLS CLE Setup Time 0  ns

tCLH CLE Hold Time 10  ns

tCS CE Setup Time 0  ns

tCH CE Hold Time 10  ns

tWP Write Pulse Width 25  ns

tALS ALE Setup Time 0  ns

tALH ALE Hold Time 10  ns

tDS Data Setup Time 20  ns

tDH Data Hold Time 10  ns

tWC Write Cycle Time 50  ns

tWH WE High Hold Time 15  ns

tWW WP High to WE Low 100  ns

tRR Ready to RE Falling Edge 20  ns

tRW Ready to WE Falling Edge 20  ns

tRP Read Pulse Width 35  ns

tRC Read Cycle Time 50  ns

tREA RE Access Time (Serial Data Access)  35 ns

tCEA CE Access Time  45 ns

tCLEA CLE Access Time  45 ns

tALEA ALE Access Time  45 ns

tREAID RE Access Time (ID Read)  35 ns

tOH Data Output Hold Time 10  ns

tRHZ RE High to Output High Impedance  30 ns

tCHZ CE High to Output High Impedance  20 ns

tREH RE High Hold Time 15  ns

tIR Output-High-impedance-to- RE Falling Edge 0  ns

tRSTO RE Access Time (Status Read)  35 ns

tCSTO CE Access Time (Status Read)  45 ns

tCLSTO CLE Access Time (Status Read)  45 ns

tRHW RE High to WE Low 30  ns

tWHC WE High to CE Low 30  ns

tWHR WE High to RE Low 30  ns

tCR CE Low to RE Low (ID Read) 100  ns

tR Memory Cell Array to Starting Address  25 µs

tWB WE High to Busy  200 ns

tRST Device Reset Time (Read/Program/Erase)  6/10/500 µs

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 TC58NVG0S3AFT05
AC TEST CONDITIONS

PARAMETER CONDITION

Input level 2.4 V, 0.4 V

Input pulse rise and fall time 3 ns

Input comparison level 1.5 V, 1.5 V

Output data comparison level 1.5 V, 1.5 V

Output load CL (100 pF) + 1 TTL

PROGRAMMING AND ERASING CHARACTERISTICS

(Ta = 0 to 70°C, VCC = 2.7 V~3.6 V)

SYMBOL PARAMETER MIN TYP. MAX UNIT NOTES

tPROG Average Programming Time  200 700 µs

Number of Programming Cycles on Same Page

N   2 (1)
(per 512 + 16 bytes)

tBERASE Block Erasing Time  2 4 ms

(1) Refer to Application Note (12) toward the end of this document.

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 TC58NVG0S3AFT05
TIMING DIAGRAMS
Latch Timing Diagram for Command/Address/Data

CLE
ALE
CE
RE Setup Time Hold Time

WE

tDS tDH

I/O1
to I/O8

: VIH or VIL

Command Input Cycle Timing Diagram

CLE
tCLS tCLH
tCS tCH

CE

tWP

WE

tALS tALH

ALE

tDS tDH

I/O1
to I/O8

: VIH or VIL

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 TC58NVG0S3AFT05
Address Input Cycle Timing Diagram

tCLS

CLE

tCS tWC tWC tWC

CE

tWP tWH tWP tWH tWP tWH tWP

WE

tALS tALH

ALE

tDS tDH tDS tDH tDS tDH tDS tDH

I/O1 CA0 to 7 CA8 to 11 PA0 to 7 PA8 to 15

to I/O8

: VIH or VIL

Data Input Cycle Timing Diagram

tCLH

CLE

tCH

CE

tALS tWC

ALE

tWP tWH tWP tWP

WE

tDS tDH tDS tDH tDS tDH

I/O1 DIN0 DIN1 DIN2111

to I/O8

: VIH or VIL

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 TC58NVG0S3AFT05
Serial Read Cycle Timing Diagram

tRC tCEA

CE

tRP tREH tRP tRP tCHZ

RE
tOH tOH tOH
tREA tRHZ tREA tRHZ tREA tRHZ

I/O1
to I/O8
tRR

RY / BY

Status Read Cycle Timing Diagram

tCLSTO

CLE
tCLS tCLH

tCS

CE

tWP tCH

WE
tWHC tCSTO tCHZ
tWHR

RE
tOH
tDS tDH tIR
tRSTO
tRHZ
I/O1 Status
70h*
to I/O8 output

RY / BY

* 70h represents the hexadecimal number : VIH or VIL

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 TC58NVG0S3AFT05
Read Cycle Timing Diagram

tCLEA

CLE
tCLS tCLH tCLS tCLH

tCS tCH tCS tCH tCEA

CE
tWC

WE
tALH tALS tALH tALS

ALE
tR tRC

RE tWB

tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tREA
tRR
I/O1 DOUT DOUT
00h CA0 to 7 CA8 to 11 PA0 to 7 PA8 to 15 30h
to I/O8 N N+1
Data out from
Col. Add. N Col. Add. N

RY/BY

Read Cycle Timing Diagram: When Interrupted by CE

tCLEA

CLE
tCLS tCLH tCLS tCLH

tCS tCH tCS tCH tCEA

CE
tWC

WE
tALH tALS tALH tALS tCHZ

ALE
tR tRC tRHZ

RE tWB

tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tREA tOH
tRR
I/O1 DOUT DOUT
00h CA0 to 7 CA8 to 11 PA0 to 7 PA8 to 15 30h
to I/O8 N N+1

Col. Add. N
Col. Add. N
RY/BY

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 TC58NVG0S3AFT05
Column Address Change in Read Cycle Timing Diagram (1/2)

tCLEA

CLE
tCLS tCLH tCLS tCLH

tCS tCH tCS tCH

CE
tWC tCEA

WE
tALH tALS tALH tALS

ALE
tR tRC

RE tWB

tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tRR
tREA

I/O1 DOUT DOUT DOUT

00h CA0 to 7 CA8 to 11 PA0 to 7 PA8 to 15 30h
to I/O8 A A+1 A+N
Column address Page address Page address
A P P
RY/BY

Column address
A

Continues to 1 of next page

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 TC58NVG0S3AFT05
Column Address Change in Read Cycle Timing Diagram (2/2)

tCLEA

CLE
tCLS tCLH tCLS tCLH

tCS tCH tCS tCH

CE
tWC
tCEA

WE
tRHW tALH tALS tALH tALS

ALE
tRC

RE
tDS tDH tDS tDH tDS tDH tDS tDH tREA
tIR
I/O1 DOUT DOUT DOUT DOUT
05h CA0 to 7 CA8 to 11 E0h
to I/O8 A+N B B+1 B + N’
Column address Page address
B P
RY/BY

Column address
B

Continued from 1 of last page

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 TC58NVG0S3AFT05
Auto-Program Operation Timing Diagram

tCLS

CLE
tCLS tCLH
tCS
tCS

CE

tCH

WE
tALH tALH
tALS tProg

tALS tWB
ALE

RE
tDS tDS
tDS tDH tDS tDH tDH tDH

I/O1 Status
80h CA0 to 7 CA8 to 11 PA0 to 7 PA8 to 15 10h 70h
to I/O8 output

DIN0 DIN1 DIN2111

RY / BY

: VIH or VIL : Do not input data while data is being output.

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 TC58NVG0S3AFT05
Auto Block Erase Timing Diagram

CLE
tCLS
tCS tCLH
tCLS
CE

WE

tALS tALH tWB tBERASE

ALE

RE

tDS tDH

I/O1 Status
60h PA0 to 7 PA8 to 15 D0h 70h
to I/O8 output

Busy
RY / BY Auto Block Erase Start Status Read
Erase Setup command command
command
: VIH or VIL : Do not input data while data is being output.

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 TC58NVG0S3AFT05
ID Read Operation Timing Diagram

tCLS

CLE
tCLS
tCS tCS tCH tCEA

CE

tCH

WE
tALS tALH
tALH tALEA

ALE

RE
tDH
tDH
tREAID tREAID tREAID tREAID tREAID

I/O 90h 00h 98h F1h Note 1 Note 2 Note 3

ID Read Address Maker code Device code

command 00
: VIH or VIL
Note 1: 80h or 00h
Note 2: 95h or 15h
Note 3: 40h or C0h

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 TC58NVG0S3AFT05
PIN FUNCTIONS
The device is a serial access memory which utilizes time-sharing input of address information. The device
pin-outs are configured as shown in Figure 1.
NC 1 48 NC
NC 2 47 NC
Command Latch Enable: CLE NC 3 46 NC
NC 4 45 NC
The CLE input signal is used to control loading of the NC 5 44 I/O8
operation mode command into the internal command register. GND 6 43 I/O7
RY/BY 7 42 I/O6
The command is latched into the command register from the RE 8 41 I/O5
I/O port on the rising edge of the WE signal while CLE is CE 9 40 NC
NC 10 39 NC
High. NC 11 38 NC
VCC 12 37 VCC
VSS 13 36 VSS
Address Latch Enable: ALE NC 14 35 NC
NC 15 34 NC
The ALE signal is used to control loading of either address CLE 16 33 NC
ALE 17 32 I/O4
information or input data into the internal address/data WE 18 31 I/O3
register. WP 19 30 I/O2
NC 20 29 I/O1
Address information is latched on the rising edge of WE if NC 21 28 NC
ALE is High. NC 22 27 NC
NC 23 26 NC
Input data is latched if ALE is Low. NC 24 25 NC

Chip Enable: CE Figure 1. Pinout

The device goes into a low-power Standby mode when CE goes High during the device is in Ready state.
The CE signal is ignored when device is in Busy state ( RY / BY = L), such as during a Program or Erase or
Read operation, and will not enter Standby mode even if the CE input goes High.

Write Enable: WE
The WE signal is used to control the acquisition of data from the I/O port.

Read Enable: RE
The RE signal controls serial data output. Data is available tREA after the falling edge of RE .
The internal column address counter is also incremented (Address = Address + 1) on this falling edge.

I/O Port: I/O1 to 8

The I/O1 to 8 pins are used as a port for transferring address, command and input/output data to and from
the device.

Write Protect: WP
The WP signal is used to protect the device from accidental programming or erasing. The internal voltage
regulator is reset when WP is Low. This signal is usually used for protecting the data during the power-on/off
sequence when input signals are invalid.

Ready/Busy: RY / BY
The RY / BY output signal is used to indicate the operating condition of the device. The RY / BY signal is
in Busy state ( RY / BY = L) during the Program, Erase and Read operations and will return to Ready state
( RY / BY = H) after completion of the operation. The output buffer for this signal is an open drain and has to
be pulled-up to Vccq with appropriate resister.

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 TC58NVG0S3AFT05
Schematic Cell Layout and Address Assignment
The Program operation works on page units while the Erase operation works on block units.

I/O1 A page consists of 2112 bytes in which 2048 bytes are used
2048 64 I/O8 for main memory storage and 64 bytes are for redundancy
or for other uses.
1 page = 2112 bytes
1 block = 2112 bytes × 64 pages = (128K + 4K) bytes
64 Pages
= 1 block
Capacity = 2112 bytes × 64 pages × 1024 blocks
65536
pages An address is read in via the I/O port over four consecutive
1024 blocks clock cycles, as shown in Table 1.

8I/O

2112
Figure 2. Schematic Cell Layout

Table 1. Addressing

I/O8 I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 CA0 to CA11: Column address
PA0 to PA15 : Page address
First cycle CA7 CA6 CA5 CA4 CA3 CA2 CA1 CA0

Second cycle L L L L CA11 CA10 CA9 CA8 PA6 to PA15 : Block address
PA0 to PA5 : NAND address in block
Third cycle PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0

Fourth cycle PA15 PA14 PA13 PA12 PA11 PA10 PA9 PA8

Operation Mode: Logic and Command Tables

The operation modes such as Program, Erase, Read and Reset are controlled by the eleven different
command operations shown in Table 3. Address input, command input and data input/output are controlled by
the CLE, ALE, CE , WE , RE and WP signals, as shown in Table 2.

Table 2. Logic Table

*1
CLE ALE CE WE RE WP

Command Input H L L H *

Data Input L L L H H

Address input L H L H *

Serial Data Output L L L H *

During Programming (Busy) * * * * * H

During Erasing (Busy) * * * * * H

During Reading (Busy) * * * * * *

Program, Erase Inhibit * * * * * L

Standby * * H * * 0 V/VCC

H: VIH, L: VIL, *: VIH or VIL

*1: Refer to Application Note (10) toward the end of this document regarding the WP signal when Program or Erase Inhibit

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 TC58NVG0S3AFT05

Table 3. Command table (HEX)

First Cycle Second Cycle Acceptable while Busy

Serial Data Input 80 

Auto Program 10 

Read Address Input 00 

Column Address Change in Serial Data Output 05 

Read Start 30

Read Column Change E0 

Auto Block Erase 60 D0

ID Read 90 

Status Read 70 ○

Reset FF ○

HEX data bit assignment

(Example)
Serial Data Input: 80h

1 0 0 0 0 0 0 0
I/O8 7 6 5 4 3 2 I/O1

Table 4. shows the operation states for Read mode.

Table 4. Read mode operation states

CLE ALE CE WE RE I/O1 to I/O8 Power

Output select L L L H L Data output Active

Output Deselect L L L H H High impedance Active

Standby L L H H * High impedance Standby

Read Busy * * * * * High Impedance Active

H: VIH, L: VIL, *: VIH or VIL

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 TC58NVG0S3AFT05
DEVICE OPERATION
Read Mode
Read mode is set when “00h” and “30h” commands are issued to the Command register. Between the
commands, start address for the Read mode need to be issued. Refer to Figure 3. below for sequence and the
block diagram (Refer to the detailed timing chart.).

CLE

CE

WE

ALE

RE

RY / BY Column Address M Page Address N Busy

I/O 00h 30h M M+1 M+2

Page Address N
Start-address input
A data transfer operation from the cell array to the register
M 2111
starts on the rising edge of WE in the 30h command input
cycle (after the address information has been latched). The
Select page
device will be in Busy state during this transfer period.
N Cell array
After the transfer period the device returns to Ready state.
Serial data can be output synchronously with the RE clock
Figure 3. Read mode (1) operation from the start address designated in the address input cycle.

Random Column Address Change in Read Cycle

CLE

CE

WE

ALE

RE

RY / BY Busy
Col. M
I/O 00h 30h M M+1 M+2 M+3 05h E0h M’ M’ + 1 M’ + 2 M’ + 3 M’ + 4

Col. M Page N Page N Col. M’ Page N

Start from Col. M Start from Col. M’
Start-address input
In the serial data out from the register, the column address
M M’
can be changed by inputting the column address with 05h and
E0h commands.
The data are read out in serial from the column address
Select page
which is input to the device by 05h and E0h commands with
N Cell array
RE clock.

Figure 4. Random Column Address Change in Serial Read

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 TC58NVG0S3AFT05
Auto Page Program Operation
The device carries out an Automatic Page Program operation when it receives a “10h” Program command
after the address and data have been input. The sequence of command, address and data input is shown below.
(Refer to the detailed timing chart.)

CLE

CE

WE

ALE

RE

RY/BY

I/O 80h Din Din Din Din 10h 70h

Col. M Page P Data Status Out

The data is transferred (programmed) from the register to the

Data input
selected page on the rising edge of WE following input of the “10h”
Program Reading & verification
command. After programming, the programmed data is transferred
Selected back to the register to be automatically verified by the device. If the
page programming does not succeed, the Program/Verify operation is
repeated by the device until success is achieved or until the
maximum loop number set in the device is reached.

Figure 7. Auto Page Program operation

Auto Block Erase

The Auto Block Erase operation starts on the rising edge of WE after the Erase Start command “D0h”
which follows the Erase Setup command “60h”. This two-cycle process for Erase operations acts as an extra
layer of protection from accidental erasure of data due to external noise. The device automatically executes the
Erase and Verify operations.

Pass
60 D0 70 I/O
Block Address Erase Start Status Read Fail
input: 2 cycles command command

RY / BY Busy

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 TC58NVG0S3AFT05
ID Read
The device contains ID code which identify the device type, the manufacturer, and some features of the
device. The ID codes can be read out under the following timing conditions:

CLE
tCEA
CE

WE
tALEA

ALE

RE
tREAID

I/O 90h 00h 98h F1h Note 1 Note 2 Note 3

ID Read Address Maker code Device code

command 00 Note 1: 80h or 00h
Note 2: 95h or 15h
For the specifications of the access times tREAID, tCR and tALEA refer to the AC Characteristics. Note 3: 40h or C0h

Figure 13. ID Read Timing

Table 6. Code table

Descripton I/O8 I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 Hex Data

1st Data Maker Code 1 0 0 1 1 0 0 0 98h

2nd Data Device Code 1 1 1 1 0 0 0 1 F1h

Chip Number, Cell Type,

3rd Data 0 or 1 0 0 0 0 0 0 0 80h or 00h
PGM Page

Page Size, Block Size,

4th Data 0 or 1 0 0 1 0 1 0 1 95h or 15h
Redundant Size, Organization

5th Data Plane Number, Plane Size 0 or 1 1 0 0 0 0 0 0 40h or C0h

3rd Data

Descripton I/O8 I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1

1 0 0

2 0 1
Internal Chip Number
4 1 0

8 1 1

2 level cell 0 0

4 level cell 0 1
Cell Type
8 level cell 1 0

16 level cell 1 1

1 0 0

Number of simultaneously 2 0 1
programmed pages 4 1 0

8 1 1

Reserved 1 0

Reserved 2 0 or 1

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 TC58NVG0S3AFT05
4th Data

Descripton I/O8 I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1

1 KB 0 0

Page Size 2 KB 0 1
(without redundant area)
4 KB 1 0

8 KB 1 1

64 KB 0 0

Block Size 128 KB 0 1

(without redundant area) 256 KB 1 0

512 KB 1 1

8 0 0

Redundant area size 16 0 1

(byte/512 byte) Reserved 1 0

Reserved 1 1

×8 0
Organization
×16 1

Reserved 0 or 1

5th Data

Descripton I/O8 I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1

1 0 0

2 0 1
Plane Number
4 1 0

8 1 1

64 Mbit 0 0 0

128 Mbit 0 0 1

256 Mbit 0 1 0

512 Mbit 0 1 1
Plane Size
1 Gbit 1 0 0

2 Gbit 1 0 1

4 Gbit 1 1 0

8 Gbit 1 1 1

Reserved 0 or 1 0 0

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 TC58NVG0S3AFT05
Status Read
The device automatically implements the execution and verification of the Program and Erase operations.
The Status Read function is used to monitor the Ready/Busy status of the device, determine the result (pass
/fail) of a Program or Erase operation, and determine whether the device is in Protect mode. The device status
is output via the I/O port on the RE clock after a “70h” command input.
The resulting information is outlined in Table 5.

Table 5. Status output table

STATUS OUTPUT

I/O1 Chip Status 1 Pass: 0 Fail: 1

I/O2 Not Used 0 or 1

I/O3 Not Used 0 The Pass/Fail status on I/O1 is only

valid when the device is in the Ready
I/O4 Not Used 0
state.
I/O5 Not Used 0

I/O6 Ready/Busy Ready: 1 Busy: 0

I/O7 Not Used 0 or 1

I/O8 Write Protect Protect: 0 Not Protected: 1

An application example with multiple devices is shown in Figure 6.

CE1 CE2 CE3 CEN CEN + 1

CLE
ALE Device Device Device Device Device
WE 1 2 3 N N+1
RE

I/O1
to I/O8
RY/BY

RY/BY Busy

CLE

ALE

WE

CE1

CEN

RE

I/O 70h 70h

Status on Device 1 Status on Device N

Figure 6. Status Read timing application example

System Design Note: If the RY / BY pin signals from multiple devices are wired together as shown in the
diagram, the Status Read function can be used to determine the status of each individual device.

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 TC58NVG0S3AFT05
Reset
The Reset mode stops all operations. For example, in the case of a Program or Erase operation the internally
generated voltage is discharged to 0 volts and the device enters Wait state.
The response to an “FFh” Reset command input during the various device operations is as follows:

When a Reset (FFh) command is input during programming

Figure 8.

80 10 FF 00

Internal VPP

RY/BY

tRST (max 10 µs)

When a Reset (FFh) command is input during erasing

Figure 9.

D0 FF 00

Internal erase
voltage

RY/BY
tRST (max 500 µs)

When a Reset (FFh) command is input during Read operation

Figure 10.

00 FF 00

RY/BY

tRST (max 6 µs)

When a Status Read command (70h) is input after a Reset

Figure 11.

FF 70
I/O status : Pass/Fail → Pass
: Ready/Busy → Ready
RY/BY

FF 70
I/O status : Ready/Busy → Busy

RY/BY

When two or more Reset commands are input in succession

Figure 12.
(1) (2) (3)

FF FF FF

RY/BY

The second FF command is invalid, but the third FF command is valid.

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 TC58NVG0S3AFT05
APPLICATION NOTES AND COMMENTS

(1) Power-on/off sequence:

The timing sequence shown in Figure 15 is necessary for power-on/off sequence.

The device internal initialization start after the power supply reaches appropriate level in power on
sequence. During the initialization the device Ready/Busy signal outputs Busy state as shown in the Figure
15. In this time period, the acceptable commands are FFh or 70h.
The WP signal is useful for protecting against data corruption at power-on/off.

2.7 V
2.5 V
VCC
0V
Don’t Don’t
care care
CE , WE , RE
CLE, ALE
VIH

VIL VIL
WP 1 ms max
100 µs max Operation

Invalid Don’t
care
Ready/Busy

Figure 15. Power-on/off Sequence

(2) Status after power-on

The following sequence is necessary because some input signals may not be stable at power-on.

Power on FF

Reset

Figure 16.

(3) Prohibition of unspecified commands

The operation commands are listed in Table 3. Input of a command other than those specified in Table 3.
is prohibited. Stored data may be corrupted if an unknown command is entered during the command cycle.

(4) Restriction of command while Busy state

During Busy state, do not input any command except 70h, and FFh.

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 TC58NVG0S3AFT05

(5) Acceptable commands after Serial Input command “80h”

Once the Serial Input command “80h” has been input, do not input any command other than the Column
Address Change in Auto Program command “10h” or the Reset command “FFh”.

80 FF

WE

Address input
RY / BY

If a command other than “10h” or “FFh” is input, the Program operation is not performed and the device
operation is set to the mode which the input command specifies.

80 XX 10
Mode specified by the command. Programming cannot be executed.

Command other than

“10h” or “FFh”

(6) Addressing for program operation

Within a block, the pages must be programmed consecutively from the LSB (least significant bit) page of
the block to MSB (most significant bit) page of the block. Random page address programming is prohibited.

From the LSB page to MSB page Ex.) Random page program (Prohibition)
DATA IN: Data (1) Data (64) DATA IN: Data (1) Data (64)

Data register Data register

Page 0 (1) Page 0 (2)

Page 1 (2) Page 1 (32)
Page 2 (3) Page 2 (3)

Page 31 (32) Page 31 (1)

Page 63 (64) Page 63 (64)

Figure 17. page programming within a block

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 TC58NVG0S3AFT05

(7) Status Read during a Read operation

00

[A]
command 00 30 70

CE

WE

RY/BY

RE
Address N Status Read
command input Status output
Status Read
Figure 18.
The device status can be read out by inputting the Status Read command “70h” in Read mode.
Once the device has been set to Status Read mode by a “70h” command, the device will not return to
Read mode.
Therefore, a Status Read during a Read operation is prohibited.
However, when the Read command “00h” is input during [A], Status mode is reset and the device returns
to Read mode. In this case, data output starts automatically from address N and address input is
unnecessary

(8) Auto programming failure

Fail
80 10 70 I/O 80 10
Address Data Address Data
M input N input

80
10 If the programming result for page address M is Fail, do not try to program the
page to address N in another block without the data input sequence.
Because the previous input data has been lost, the same input sequence of 80h
M
command, address and data is necessary.

Figure 19.

(9) RY/ BY : termination for the Ready/Busy pin ( RY/ BY )

A pull-up resistor needs to be used for termination because the RY / BY buffer consists of an open drain
circuit. V CC
Ready
VCC VCC
R 3.0 V 3.0 V
Device 1.0 V Busy 1.0 V
RY/BY
CL
tf tr

VSS VCC = 3.3 V

1.5 µs Ta = 25°C 15 ns
tf CL = 100 pF
tr 1.0 µs 10 ns tf
tr
0.5 µs 5 ns
This data may vary from device to device.
We recommend that you use this data as a
reference when selecting a resistor value. 0 1 KΩ 2 KΩ 3 KΩ 4 KΩ
Figure 19. R

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 TC58NVG0S3AFT05

(10) Note regarding the WP signal

The Erase and Program operations are automatically reset when WP goes Low. The operations are
enabled and disabled as follows:

Enable Programming

WE

DIN 80 10

WP

RY/BY

tWW (100 ns min)

Disable Programming

WE

DIN 80 10

WP

RY/BY

tWW (100 ns min)

Enable Erasing

WE

DIN 60 D0

WP

RY/BY

tWW (100 ns min)

Disable Erasing

WE

DIN 60 D0

WP

RY/BY

tWW (100 ns min)

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 TC58NVG0S3AFT05

(11) When five address cycles are input

Although the device may read in a fifth address, it is ignored inside the chip.

Read operation

CLE

CE

WE

ALE

I/O 00h 30h

Ignored
Address input
RY / BY

Figure 22.

Program operation

CLE

CE

WE

ALE

I/O 80h

Ignored
Address input Data input

Figure 23.

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 TC58NVG0S3AFT05

(12) Several programming cycles on the same page (Partial Page Program)

A page can be divided into up to 8 segments as follows:-

Data area (column address 0 to 2047): 512 bytes × 4 segments

1st segment: column address 0 to 511
2nd segment: column address 512 to 1023
3rd segment: column address 1024 to 1535
4th segment: column address 1536 to 2047

Redundant area (column address 2048 to 2111): 16 bytes × 4 segments

1st segment: column address 2048 to 2063
2nd segment: column address 2064 to 2079
3rd segment: column address 2080 to 2095
4th segment: column address 2096 to 2111

Each segment can be programmed individually as follows:

1st programming Data Pattern 1 All 1 s

2nd programming All 1 s Data Pattern 2 All 1 s

8th programming All 1 s Data Pattern 8

Result Data Pattern 1 Data Pattern 2 Data Pattern 8

Figure 24.

Note: The input data for unprogrammed or previously programmed page segments must be “1”
(i.e. the inputs for all page bytes outside the segment which is to be programmed should be set to all “1”).

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 TC58NVG0S3AFT05

(13) Invalid blocks (bad blocks)

The device occasionally contains unusable blocks. Therefore, the following issues must be recognized:

At the time of shipment, all data bytes in a valid block are FFh. For
bad blocks, all bytes are not in the FFh state. Please don’t perform erase
operation to bad blocks.
Bad Block
Check if the device has any bad blocks after installation into the
system. Figure 27. shows the test flow for bad block detection. Bad blocks
which are detected by the test flow must be managed as unusable blocks
by the system.
A bad block does not affect the performance of good blocks because it is
Bad Block isolated from the bit line by the select gate

The number of valid blocks at the time of shipment is as follows:

Figure 26.
MIN TYP. MAX UNIT

Valid (Good) Block Number 1004  1024 Block

Bad Block Test Flow

Read Check: Read the 1st page or the 2nd

Start
page of each block. If the column
address 0 or 2048 of the 1st
page or the 2nd page is not FF
(Hex), define the block as a bad
Block No = 1
block.

Fail
Read Check

Pass
Block No. = Block No. + 1 Bad Block *1

No
Block No. = 1024

Yes

End

*1: No erase operation is allowed to detected bad blocks

Figure 27.

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 TC58NVG0S3AFT05

(14) Failure phenomena for Program and Erase operations

The device may fail during a Program or Erase operation.

The following possible failure modes should be considered when implementing a highly reliable system.

FAILURE MODE DETECTION AND COUNTERMEASURE SEQUENIE

Block Erase Failure Status Read after Erase → Block Replacement

Page Programming Failure Status Read after Program → Block Replacement

Programming Failure (1) Block Verify after Program → Retry

Single Bit
“1 to 0” (2) ECC

• ECC: Error Correction Code.

• Block Replacement

Program

Error occurs When an error happens in Block A, try to

Buffer reprogram the data into another Block (Block
memory Block A B) by loading from an external buffer. Then,
prevent further system accesses to Block A (by
creating a bad block table or by using another
appropriate scheme).

Block B

Figure 28.

Erase

When an error occurs in an Erase operation, prevent future accesses to this bad block
(again by creating a table within the system or by using another appropriate scheme).

(15) Do not turn off the power before write/erase operation is complete. Avoid using the device when the battery
is low. Power shortage and/or power failure before write/erase operation is complete will cause loss of data
and/or damage to data.

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 TC58NVG0S3AFT05
Package Dimensions

Weight: 0.53 g (typ.)

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 TC58NVG0S3AFT05

RESTRICTIONS ON PRODUCT USE 030619EBA

• The information contained herein is subject to change without notice.

• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..

• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.

• The products described in this document are subject to the foreign exchange and foreign trade laws.

• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.

2003-08-20A 33/33
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