Rework

A team of iNEMI (InterNational Electronics Manufacturing Initiative) companies collaborated to develop Tin-lead and Lead-free rework processes for double-sided printed circuit boards in three thicknesses (0.062”, 0.093 ” and 0.135”) with electrolytic NiAu and Immersion Ag surface finishes. As a prelude to the rework development of the iNEMI Payette designed test board in Phase 2 an initial rework development phase was conducted (Phase 1). The initial phase was performed on a HP “Yunque ” test board with similar board characteristics to the Payette board. One of the components for rework development in Phase 1 was a 5-segment Mictor connector. This paper will present the Tin-lead and Lead-free rework development processes developed on the Phase 1 boards for the Mictor connector component as well as highlighting and analyzing certain areas of concern caused by reflow issues for adjacent CBGA parts during Micro-BGA rework, and reduced hole-fill during mini-pot rework activities on PDIP...

Version: C Total number of pages: 30 This deliverable defines the quality and evaluation strategy and criteria to be used subsequently in the project for assessing the Design Support Environment (DSE) and the Internet services under consideration. The deliverable describes the quality approach of the Consortium, with emphasis in the aspects related to software development. It also describes our evaluation strategy, including the evaluation plan, and the guidelines and recommendations to be included.