BGA

The cyanobacteria are an ancient group of prokaryotic organisms that are found all over the world in environments as diverse as Antarctic soils and volcanic hot springs, and often where no other vegetation can exist. Being prokaryotes they share with others of their type the lack of a nucleus and a laminated extracellular wall. Unlike photosynthetic bacteria however, cyanobacteria possess chlorophyll-a in common with photosynthetic eukaryotes, and they liberate oxygen during photosynthesis. Cyanobacteria are ubiquitous in waters of a great range of salinity and temperature, and they occur in and on the soil as well as on rocks and in their fissures. As well, they form symbiotic and commensal relationships with a number of other organisms. In general, they are most abundant from waters with a neutral or slightly alkaline pH and can exhibit diurnal variation in abundance in waters with low buffering capacity. The name "blue-green algae" derives from the fact that the first species to be recognised and named were blue-green in colour, and although most species are in fact blue-green many are not.

Increasing demand for asphalt in the country results in 650,000 tons of imported asphalt per year. The early damage of asphalt pavement is due to increasing axle loads and high temperature climates. On the other side, natural asphalt in Buton island of Sulawesi Tenggara, which is the biggest natural asphalt deposit district in world containing about 677 million tons of asphalt, has not been optimally exploited. This research designs HRS-WC mixture by utilizing Buton Granular Asphalt ( BGA), one of Buton asphalt form, as additive in the binder. The objective of this research is to identify mixture characteristics by referring to Marshall characteristic. Mixture is designed under the Marshall Standard procedure and 24 hours Marshall Immersion at optimum binder content according to Indonesian specification (Bina Marga, 2005) for Hot Rolled Sheet-Wearing Course ( HRS-WC). Mixture design applies the additive BGA (Buton Granular Asphalt) variations of 0%, 2%, 4%, 6%, 8% and 10% to the total mixture. The results of the research showed the optimum asphalt content of specimen Buton Granular Asphalt (BGA) variations of 0%, 2%, 4%, 6%, 8%, and 10% were 8.3%, 7.7%, 7.2%, 6.7%, 6.4%, and 6.3%, respectively. The misture reached the Stability values at 1373.8 kgs, 1554.9 kgs, 1493.1 kgs, 1419.3 kgs, 1230.0 kgs, and 1429.3 kgs, respectively. Index of retained strength obtained were 98.1%, 75.4%, 87.9%, 93.0%, 98.6%, and 80.5%, respectively. Composition suitable for addition Buton Granular Asphalt (BGA) at HRS-WC mixture were 2% and 4% BGA, with the mixture density values of 2.266 gr/cm 3 and 2.218 gr/cm 3 , mixture VMA values of 19.9% and 18.9%, mixture VFWA values of 74.7% and 71.4%, mixture VITM values of 5.0% and 5.4%, mixture Stability values of 1554,9 kgs and 1493,1 kgs, mixture flow value of both of 3,0 mm, mixture MQ values of 524.1 kg/mm and 493.1 kg/mm, mixture Index of retained strength of 75.4% and 87.9%.

BGA (Blue Green Algae) are reported to ubiquitous in distribution and are reported in all the latitudes and longitude from the Antarctic and Arctic regions to the tropical dry deserts perhaps showing their beginning pioneering habitation of the ancient earth. They are also unique in their potentiality to simultaneously complete oxygenic photosynthesis and oxygen helpful in nitrogen fixation. By these processes such organisms particularly in the deeper habitat make significant contributions to the nitrogen bio – geochemical and Carbon cycle. The ability to fix nitrogen of these organisms either independently or in association with other organisms not only helpful to maintain natural ecosystems but also used in many countries particularly for production of rice cultivation. Their capability to grow in highly polluted habitat is also used to treat sewage and polluted effluents of various industries. From the foregoing this is evident that although BGA are prokaryotic and microscopic organisms and they are also ubiquitous in their distribution and play roles in the maintenance of various ecosystems. Their important contributions to the maintenance of global bio-geochemical and carbon cycle are quite significant. Some of them mostly use cyanobacteria for biofertilizer. This is therefore very important and too useful.

Optical microscopy was used to discern the different grain orientations and grain boundaries on the polished cross-sections of neareutectic lead-free board-level SnAgCu (SAC) solder interconnects. Strain distributions with submicron accuracy of the deformations on the cross-sections of the solder interconnects were measured when the package was subjected to thermal loading from room temperature to 100°C. The results were correlated with the locations of different grains, grain boundaries and larger primary intermetallics. It revealed anisotropic nature of deformations in different grains of the SAC solder, which is similar to the thermomechanical behavior of pure Sn. The strain distribution in a solder interconnect varied significantly in different grain orientations. The primary intermetallics (Ag 3 Sn plates) also behaved very differently from the surrounding Sn matrix under the thermal loading. The demonstrated strain localization along the grain boundaries and bigger primary intermetallics provides a clue for the path of fatigue crack growth that leads to a failure because of anisotropic thermomechanical response of SAC solder during thermal cycling.

ریبال یعنی تعویض تمام توپ های قلع بر روی چیپ BGA. دلایل بسیاری وجود دارد که چرا ما چیپ را ریبال می کنیم. در این قسمت از مجموعه آموزش های تعمیرات تعمیرکارسلام؛ به شما کمک خواهیم کرد تا اطلاعاتی درباره ریبال کردن چیپ کسب کنید.

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Several unique solder paste systems have been developed and tested for 63Sn/37Pb solder bumping for wafer, CSP, and BGA with the low cost print-detach-reflow process. The results indicate that the bump height achieved is very adequate and consistent for all three area array package systems. Microstructure of solder bumps appears normal. The yield is also very high for both before reflow and after reflow condition, and is dictated by printing performance. With the unique high slump resistance exhibited by those newly developed pastes, the paste transfer efficiency at printing stage becomes the most critical performance for this process. The transfer efficiency increases with increasing area ratio, increasing taper angle, decreasing pitch, decreasing stencil thickness, decreasing challenge, with adoption of square aperture design, and is not sensitive to aspect ratio of aperture to solder particle size. The paste systems appear to have more potential for depositing a larger amount of paste per unit pitch, as evidenced by the linear relation between expected paste volume and the deposited paste volume. Increasing metal content helps improving bumping performance. The bottleneck of increasing bumping performance for wafer applications appears to be developing a stencil manufacturing technology capable of providing an aperture pattern with spacing considerably smaller than the stencil thickness. Slow print speed is also essential for adequate printing. A non-shiny non-smooth stencil surface is considered beneficial for aiding paste rolling. The flux residue of those pastes is cleanable with solvents.

Allergic asthma is driven by relative overexpression of Th2 cell-derived cytokines in response to aeroallergens. In independent studies, both allergen-specific rush immunotherapy (RIT) and CpG oligodeoxynucleotides (ODN) showed promise in blunting eosinophilic inflammation in a model of feline allergic asthma. We hypothesized that RIT using allergen and CpG ODN would work synergistically to dampen the asthmatic phenotype in experimentally asthmatic cats. Twelve cats with asthma induced using Bermuda grass allergen (BGA) were studied. Of these, six were administered adjuvanted BGA RIT using CpG ODN #2142; six were administered placebo (saline) RIT and later crossed over to adjuvanted RIT. Over 2 days, subcutaneous CpG ODN (0.5 ng/kg) with BGA (increasing doses every 2 h from 20 to 200 mg) was administered. Adverse events were recorded and compared with historical controls. Percentage of eosinophils in bronchoalveolar lavage fluid (BALF), % peripheral CD4 + CD25+ T regulatory cells (Tregs), lymphocyte proliferation in response to ConA, and cytokine concentrations in BALF were measured over 2 months. Group mean BALF % eosinophils for the adjuvanted RIT cats were significantly lower at week 1 and month 1 (p = 0.03 for both), and marginally significantly lower at month 2 (p = 0.09) compared with placebo RIT cats. By the end of the study, 8/12 treated cats had BALF % eosinophils within the reference range for healthy cats. Adjuvanted RIT, but not placebo RIT, cats had significant decreases in the ConA stimulation index over time (p = 0.05). BALF IL-4 concentrations were significantly higher at week 1 in adjuvanted RIT cats compared with baseline and month 2, and also with placebo RIT cats at week 1. No significant differences were detected between treatments or over time for IL-10 or IFN-g concentrations in BALF or for %Tregs cells in peripheral blood. Adjuvanted RIT using CpG ODN in experimental feline asthma dampens eosinophilic airway inflammation. Adverse effects associated with adjuvanted RIT were less severe compared with a historical, non-adjuvanted RIT protocol. The exact mechanism(s) by which adjuvanted RIT alters the aberrant allergic immune response were not elucidated in this study.

Underjill is a polymeric material used in flip-chip devices that $Us the gap between the IC chip and the organic board, and encapsulates the solder joints. It can dramatically enhance the reliability of the flip-chip devices by distributing the thermo-mechanical stresses caused by the Coeficient of Thermal Expansion (CTE) mismatch between the chip and the board evenly throughout the whole package. Current underfills are mainly epoxy-based materials that are not reworkable a$er curing, which places an obstacle in jlip-chip technology development. Not only is reworkable underfill a key material to address the non-reworkability of the #&chip packnges, it can also be used to enhance the reliability of Ball Grid Array (BGA) and Chip Scale Package (CSP) devices without sacrificing their good reworkability feature. The objective of this study is to evaluate process viability, material perj%omzance, and reliability of reworkable underfills for board level encapsulation of BGA, CSP and pip-chip packages. Both commercial and in-house developed reworkable undei$lls are included in this study. For comparison, three commercial non-reworkable underfills are also included as the baseline materials. It is found that certain reworkable undeMlls can provide similar thermal shock reliability to the flip chip test vehicle as to the baseline unde$lls. The eflect of the undei$lls to the board-level BGA and CSP reliability is largely dependent on the internal structure of the BGMCSP components, but in general reworkable underjills improve the reliability of these components. In this paper, details on reliability assessment and failure mode analysis will be presented and discussed.

An approach is proposed to solve multistage distribution network expansion planning problems considering future uncertainties, guiding the planner from production of expansion plans, evaluation of the plans under various future uncertain scenarios, to the selection of the best strategy. A new balanced genetic algorithm (BGA) is introduced that improves the intensification of the solution search procedure by trading-off diversification ability. This facilitates searching for the optimal solution, but also the efficient production of suboptimal solutions for the planner to take into consideration. The features of the BGA allow a multistage planning problem to be solved more efficiently; the BGA can consider a set of expansion plans in an early planning stage in a single run and produce planning strategies required to solve network problems in a later stage along the planning horizon. The overall performance of each plan under different uncertain scenarios is evaluated using a modified data envelopment analysis to assist decisions on which solution to adopt. The approach is applied to a multistage "greenfield" distribution network expansion problem considering scenarios for the location of future loads. The results clearly show the advantages of the approach over more conventional methods.

BGA (Blue Green Algae) are reported to ubiquitous in distribution and are reported in all the latitudes and longitude from the Antarctic and Arctic regions to the tropical dry deserts perhaps showing their beginning pioneering habitation of the ancient earth. They are also unique in their potentiality to simultaneously complete oxygenic photosynthesis and oxygen helpful in nitrogen fixation. By these processes such organisms particularly in the deeper habitat make significant contributions to the nitrogen bio – geochemical and Carbon cycle. The ability to fix nitrogen of these organisms either independently or in association with other organisms not only helpful to maintain natural ecosystems but also used in many countries particularly for production of rice cultivation. Their capability to grow in highly polluted habitat is also used to treat sewage and polluted effluents of various industries. From the foregoing this is evident that although BGA are prokaryotic and microscopic or...

Glucocorticoids (GCs) are palliative for allergic asthma, but allergen-specific immunotherapy (ASIT), which relies on identification of allergens, represents a potentially curative treatment. The purpose of this study was to determine if oral or inhaled GCs would interfere with identification of sensitizing allergens. The hypothesis was that oral but not inhaled GCs would interfere with accurate allergen-specific IgE identification determined by skin and serum testing in experimentally asthmatic cats. Asthma was induced in 18 cats using Bermuda grass allergen (BGA). Cats (n=6/group) were randomized to receive oral GCs (10mg prednisolone q 24 h), inhaled GCs (600 μg budesonide q 24 h) or placebo (q 24 h PO) for one month. Intradermal skin testing (IDST) and serum BGA-specific IgE were measured prior to, during and after treatment. A paired t test was used to compare groups pre- and post-treatment (P<0.05 significant). IDST reactivity was eliminated in 4/6, 3/6, and 1/6 cats receiving oral GCs, inhaled GCs, and placebo respectively. Two weeks after stopping treatment, IDST was again positive in all cats. Serum IgE reactivity to BGA was not significantly diminished by any treatment. In conclusion, a two-week withdrawal from GCs is adequate for IDST, but may not be necessary for serum IgE testing.

The JPL-led CSP Consortium of enterprises representing government agencies and private companies has jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. Since last year, more than 150 test vehicles, singleand double-sided, have been assembled and are presently being subjected to various environmental tests. As an active participant in the consortium, Celestica has been heavily involved in test vehicles design review and test vehicle assembly. Its Customer Oriented Rapid Engineering Lab (CORE Lab) was used for assembly and inspection of the CSP test vehicles. Key objective was to integrate CSPs into main stream surface mount technology (SMT) assembly. In this paper, the assembly process flow, solder paste for different stencil design, manufacturing defects, X-ray inspection results, and ultrasonic characterizations are reported. Optimize process techniques which were learned during the six month assembly of test vehicles are also presented. Also, manufacturing robustness of CSPs were investigated by increasing the placement offset during assembly. Limiting offsets for different CSPs were reported and finally, future activities on assembly process optimization and characterizations were reviewed.

Product level assessment of drop and shock reliability relies heavily on experimental test methods. Prediction of drop and shock survivability is largely beyond the state-of-art. However, the use of experimental approach to test out every possible design variation, and identify the one that gives the maximum design margin is often not feasible because of product development cycle time and cost constraints. Presently, one of the primary methodologies for evaluating shock and vibration survivability of electronic packaging is the JEDEC drop test method, JESD22-B111 which tests board-level reliability of packaging. However, packages in electronic products may be subjected to a wide-array of boundary conditions beyond those targeted in the test method.

Product level assessment of drop and shock reliability relies heavily on experimental test methods. Prediction of drop and shock survivability is largely beyond the state-of-art. However, the use of experimental approach to test out every possible design variation, and identify the one that gives the maximum design margin is often not feasible because of product development cycle time and cost constraints. Presently, one of the primary methodologies for evaluating shock and vibration survivability of electronic packaging is the JEDEC drop test method, JESD22-B111 which tests board-level reliability of packaging. However, packages in electronic products may be subjected to a wide-array of boundary conditions beyond those targeted in the test method. In this paper, a failure-envelope approach based on wavelet transforms and damage proxies has been developed to model drop and shock survivability of electronic packaging. Data on damage progression under transient-shock and vibration in both 95.5Sn4.0Ag0.5Cu and 63Sn37Pb ball-grid arrays has been presented. Component types examined include flex-substrate and rigid substrate ball-grid arrays. Dynamic measurements like acceleration, strain and resistance are measured and analyzed using highspeed data acquisition system capable of capturing in-situ strain, continuity and acceleration data in excess of 5 million samples per second. Ultra high-speed video at 150,000 fps per second has been used to capture the deformation kinematics. The concept of relative damage index has been used to both evaluate and predict damage progression during transient shock. The failure-envelope provides a fundamental basis for development of component integration guidelines to ensure survivability in shock and vibration environments at a user-specified confidence level. The approach is scalable to application at system-level. Explicit finite-element models have been developed for prediction of shock survivability based on the failure envelope. Mo- - del predictions have been correlated with experimental data for both leaded and leadfree ball-grid arrays

Bordetella pertussis-specific antibodies protect against whooping cough by facilitating host defense mechanisms such as phagocytosis. However, the mechanism involved in the phagocytosis of the bacteria under non-opsonic conditions is still poorly characterized. We report here that B. pertussis binding and internalization is cholesterol dependent. Furthermore, we found cholesterol to be implicated in B. pertussis survival upon interaction with human neutrophils. Pre-treatment of PMN with cholesterol sequestering drugs like nystatin or methyl-b-cyclodextrin (MbCD) resulted in a drastic decrease of uptake of non-opsonized B. pertussis. Conversely, phagocytosis of opsonized bacteria was not affected by these drugs, showing that cholesterol depletion affects neither the viability of PMN nor the route of entry of opsonized B. pertussis. Additionally, intracellular survival rate of non-opsonized bacteria was significantly decreased in cholesterol-depleted PMN. Accordingly, confocal laser microscopy studies showed that non-opsonized B. pertussis co-localized with lysosomal markers only in cholesterol-depleted PMN but not in normal PMN. Our results indicate that B. pertussis docks to molecules that eventually prevent cellular bactericidal activity. r