A team of iNEMI (InterNational Electronics Manufacturing Initiative) companies collaborated to de... more A team of iNEMI (InterNational Electronics Manufacturing Initiative) companies collaborated to develop Tin-lead and Lead-free rework processes for double-sided printed circuit boards in three thicknesses (0.062”, 0.093 ” and 0.135”) with electrolytic NiAu and Immersion Ag surface finishes. As a prelude to the rework development of the iNEMI Payette designed test board in Phase 2 an initial rework development phase was conducted (Phase 1). The initial phase was performed on a HP “Yunque ” test board with similar board characteristics to the Payette board. One of the components for rework development in Phase 1 was a 5-segment Mictor connector. This paper will present the Tin-lead and Lead-free rework development processes developed on the Phase 1 boards for the Mictor connector component as well as highlighting and analyzing certain areas of concern caused by reflow issues for adjacent CBGA parts during Micro-BGA rework, and reduced hole-fill during mini-pot rework activities on PDIP...
Our mission is to lead in developing transportation data and information of high quality and to a... more Our mission is to lead in developing transportation data and information of high quality and to advance their effective use in both public and private transportation decisionmaking. Our vision for the future: Data and information of high quality will support every significant transportation policy decision, thus advancing the quality of life and economic well-being of all Americans. To obtain copies of this and other Commodity Flow Survey products: Copies of this preliminary highlights report, Freight Shipments in America, may be obtained by contacting BTS at 1-800-853-1351 or by emailing
A team of iNEMI (InterNational Electronics Manufacturing Initiative) companies collaborated to de... more A team of iNEMI (InterNational Electronics Manufacturing Initiative) companies collaborated to develop Tin-lead and Lead-free rework processes for double-sided printed circuit boards in three thicknesses (0.062”, 0.093 ” and 0.135”) with electrolytic NiAu and Immersion Ag surface finishes. As a prelude to the rework development of the iNEMI Payette designed test board in Phase 2 an initial rework development phase was conducted (Phase 1). The initial phase was performed on a HP “Yunque ” test board with similar board characteristics to the Payette board. One of the components for rework development in Phase 1 was a 5-segment Mictor connector. This paper will present the Tin-lead and Lead-free rework development processes developed on the Phase 1 boards for the Mictor connector component as well as highlighting and analyzing certain areas of concern caused by reflow issues for adjacent CBGA parts during Micro-BGA rework, and reduced hole-fill during mini-pot rework activities on PDIP...
Our mission is to lead in developing transportation data and information of high quality and to a... more Our mission is to lead in developing transportation data and information of high quality and to advance their effective use in both public and private transportation decisionmaking. Our vision for the future: Data and information of high quality will support every significant transportation policy decision, thus advancing the quality of life and economic well-being of all Americans. To obtain copies of this and other Commodity Flow Survey products: Copies of this preliminary highlights report, Freight Shipments in America, may be obtained by contacting BTS at 1-800-853-1351 or by emailing
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Papers by Charlie Han