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    Alsic-Based Hybrid Composite Tool Kit

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    gramuiitm
    This document summarizes an presentation given by Richard Adams and Mark Occhionero of Ceramics Process Systems on AlSiC-based composite materials. It describes how AlSiC can be engineered to provide controlled thermal expansion, high thermal conductivity, and lightweight properties. It also outlines how Ceramics Process Systems manufactures AlSiC through a casting process that results in net shape parts with tight tolerances. The presentation introduces how additional materials like carbon fibers, diamond, and metal alloys can be integrated during the casting process to create multifunctional composites for applications like electronics cooling and optics.

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    Alsic-Based Hybrid Composite Tool Kit

    Uploaded by

    gramuiitm
    15 views18 pages
    This document summarizes an presentation given by Richard Adams and Mark Occhionero of Ceramics Process Systems on AlSiC-based composite materials. It describes how AlSiC can be engineered to provide controlled thermal expansion, high thermal conductivity, and lightweight properties. It also outlines how Ceramics Process Systems manufactures AlSiC through a casting process that results in net shape parts with tight tolerances. The presentation introduces how additional materials like carbon fibers, diamond, and metal alloys can be integrated during the casting process to create multifunctional composites for applications like electronics cooling and optics.

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    NE IMAPS Symposium Adams 050604-1

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    This document summarizes an presentation given by Richard Adams and Mark Occhionero of Ceramics Process Systems on AlSiC-based composite materials. It describes how AlSiC can be engineered to provide controlled thermal expansion, high thermal conductivity, and lightweight properties. It also outlines how Ceramics Process Systems manufactures AlSiC through a casting process that results in net shape parts with tight tolerances. The presentation introduces how additional materials like carbon fibers, diamond, and metal alloys can be integrated during the casting process to create multifunctional composites for applications like electronics cooling and optics.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPT, PDF, TXT or read online from Scribd
    Download as ppt, pdf, or txt
    15 views18 pages

    Alsic-Based Hybrid Composite Tool Kit

    Uploaded by

    gramuiitm
    This document summarizes an presentation given by Richard Adams and Mark Occhionero of Ceramics Process Systems on AlSiC-based composite materials. It describes how AlSiC can be engineered to provide controlled thermal expansion, high thermal conductivity, and lightweight properties. It also outlines how Ceramics Process Systems manufactures AlSiC through a casting process that results in net shape parts with tight tolerances. The presentation introduces how additional materials like carbon fibers, diamond, and metal alloys can be integrated during the casting process to create multifunctional composites for applications like electronics cooling and optics.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPT, PDF, TXT or read online from Scribd
    Download as ppt, pdf, or txt
    of 18

    "AlSiC-Based Hybrid

    Composite Tool Kit"


    By Richard W. Adams
    and Mark A. Occhionero

    Ceramics Process Systems


    111 South Worcester St
    Chartley MA 02712-0338
    www.alsic.com

    New England IMAPS 31 Annual Symposium


    Thursday May 6, 2004
    "AlSiC-Based Hybrid Composite Tool Kit"

    • Abstract: AlSiC and multi-component structures provide unique


    thermal management electronic packaging solutions for
    microwave, microelectronics, power electronics, and
    optoelectronics that result in improved product reliability. This
    paper reviews volume AlSiC manufacturing applications today,
    and then describes examples of a wide range of possibilities for
    multi-component, multi-functional thermal management
    structures.
    AlSiC Packaging for Electronics Thermal Management
    - Basic Parameters
    • Controlled Thermal Expansion
    – Engineered CTE values - for component and assembly compatibility =
    reliability
    – Engineered solutions can create typical CTE values 7-12 ppm/°C

    • Thermal Dissipation
    – High isotropic thermal conductivity, typical = 200 W/mK

    • Lightweight
    – 3 g/cm3

    • Cost Effective Manufacturing Capability - net shape cast


    CPS AlSiC Fabrication - Defines Properties and Design
    • SiC to Al-metal ratio defines thermal expansion
    – 1st - SiC preform with controlled and variable volume content
    – 2nd - Infiltrate with Al-metal to form the AlSiC composite

    • Thermal conductivity determined by components


    – Electronic Grade SiC 230 - 260 W/mK
    – A356.2 Casting Alloy 160 W/mK
    – Little influence of ratio of 2 components

    • net shape forming


    – preform is ~ smaller than final part
    – infiltration tool = final dimensions
    – eliminates costly machining

    SiC preform AlSiC product


    injection molded infiltration casting
    AlSiC - Metal Matrix Composite Material

    ~37 vol% SiC

    ~55 vol% SiC

    SiC ~63 vol% SiC

    SiC particles uniformly distributed


    in continuous Al-matrix

    See www.alsic.com
    AlSiC Tools
    • Marry Properties to Product Design
    • Design Functionality
    – Basic AlSiC
    • lids
    • baseplates
    • package system structures

    – AlSiC + Concurrent IntegrationTM


    • Cooling Tubes - active fluid
    • HOPG / Diamond - passive transfer
    • Dielectric Ceramic Inserts - Ω isolation
    Basic AlSiC Design
    See www.alsic.com
    • Pick compatible AlSiC CTE
    – Seal rings
    – Substrates
    – Devices

    • Design rules for AlSiC casting


    – Draft Angles
    – Thicknesses
    – Radii
    – Al-Rich Areas for conventional
    machining
    Basic AlSiC - lids
    • Simple to Complex Geometries
    •Applications:
    •Microprocessor Lids
    •DSP
    •Flip Chip Lids
    •Optical Lids

    •Volumes
    •100 pcs - 40K/week

    •Price (Volume/Complexity)
    • $ 2 - $ 5 in volumes of
    ~100K/yr
    Basic AlSiC - lids
    • Complex Geometries
    •Product is net-shape fabricated -
    no machining
    •multiple pedestals
    •angled features
    •radial alignment features
    •septums and walls
    •lower cost than machined
    Aluminum alternative
    Basic AlSiC - Baseplates

    • Compatible CTE = unlimited


    Thomas Schuetze, Herman Berg, Oliver
    thermal cycling of package Schilling “The new 6.5kV IGBT module: a
    reliable device for medium voltage
    applications”, PCIM September 2001
    – AlN soldered to AlSiC

    • Design
    – Dome Shape - Side 1
    • Compressing a dome shape
    against flat cold plate
    maximizes heat transfer

    – Flat - Side 2
    • Attachment of “flat” substrates flat dielectric substrate surface

    convex bow cooler plate surface


    Concurrent IntegrationTM -High Density Interconnect (HDI) for
    GaAs Microwave Transmit/Receive Packages

    • Dielectric Feedthrus
    First, dense dielectric ceramic
    ferrules are inserted into the
    QuickCastTM infiltration tooling along
    with the SiC preform.

    Then, the Al-metal, that infiltrates


    the SiC preform to form the AlSiC
    composite, hermetically bonds and
    fills the ferrules to form coaxial
    feedthrus. This process is termed
    Concurrent IntegrationTM.
    Concurrent IntegrationTM - AlSiC LED Submount
    • Alloy Metal Inserts
    •Product Features:
    •multiple pedestals
    •angled features
    •partially machined to expose Alloy
    49 pads for assembly
    •Alloy 49 bonded direct to Al phase
    of AlSiC

    Alloy 49 pad
    Concurrent IntegrationTM - Optoelectronic AlSiC TE
    Cooler Substrate with HOPG

    • High Thermal Conductivity Insert


    Heat source surface
    • Product Features:
    – Pyrolytic Graphite (PG) compressively
    encapsulated within AlSiC
    – Thermal conductivity 1300 W/mK 1350 W/mK
    – PG located near heat source/TE
    cooler position.
    • Selective use of costly material AlSiC

    HOPG 1300 W/mK


    AlSiC

    1350 W/mK
    AlSiC laser diode TEC substrate system showing TEC
    mount area (top) and the cross section showing the
    HOPG insert in the AlSiC composite (bottom).
    Concurrent IntegrationTM - Liquid Flow Thru Cooling
    • Cooling Tube or Heat Exchanger

    Product Features:
    • Tube intimate within AlSiC casting
    – SiC overmolded onto tube
    – Direct bond AlSiC to tube
    – Maximize heat transfer AlSiC to tube
    • Low cost one step assembly
    • CPS Patented process
    Metallurgical Bonding AlSiC to AlSiC
    • Friction Stir Welding
    •Bonding of Engineered Al-Rich TOP
    Areas within AlSiC casting

    •Al Solder Bonding Processes BASE


    •Various commercially available
    •Desired Al Skin Present on
    AlSiC

    Heat sink and housing are joined by


    Friction Stir Welding.
    QuickCastTM High Pressure Precision Aluminum Casting
    • Aluminum-only precision casting
    – Tolerances in the +/-0.003” Range

    – Low cost tooling

    – Rapid product introduction and moderate


    production rate

    • Option for Concurrent IntegrationTM


    – Diamond, PG, etc inserts

    High Output LED light housing


    • RV, Boats, Theater, Safety Lighting
    Summary "AlSiC-Based Hybrid Composite Tool Kit"

    • Basic AlSiC Properties coupled with Concurrent Integration TM


    – AlSiC = Engineered CTE, Thermal Conductivity, Lightweight

    – CPS AlSiC =
    • Shape Complexity and Tight Tolerance - net shape

    • Attractive Value Proposition for many (growing number) of Applications

    • Concurrent IntegrationTM Presents Thermal Package Design Options - limited only


    to your imagination
    – AlN, ZTA, Al2O3, Si3N4 Substrates/Ferrules, etc.

    – Stainless steel, alloy 49, Titanium inserts

    – Tubes, Heat exchangers, welded pin fin coolers

    – High Thermal Conductivity Diamond, PG


    Visit the CPS Booth

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