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    Cookson Electronics Assembly Materials Lead-Free Seminar Pad Finishes, Laminates and Component Finishes

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    Richie Reyes
    PCB Surface Finishes Need Flat Co-planar Surface Long Term Reliability - - Strong Solder Joint Electrical Performance EMI Shielding Wire Bondable Pb-Free - (SnPb HASL is out) ENTEK(r) OSPExisting high BGA reliability, low cost in use, and newly improved solderability products index PWB surface finishes index Component finishes are moving towards pure tin.

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    Cookson Electronics Assembly Materials Lead-Free Seminar Pad Finishes, Laminates and Component Finishes

    Uploaded by

    Richie Reyes
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    PCB Surface Finishes Need Flat Co-planar Surface Long Term Reliability - - Strong Solder Joint Electrical Performance EMI Shielding Wire Bondable Pb-Free - (SnPb HASL is out) ENTEK(r) OSPExisting high BGA reliability, low cost in use, and newly improved solderability products index PWB surface finishes index Component finishes are moving towards pure tin.

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    PCB Surface Finishes Need Flat Co-planar Surface Long Term Reliability - - Strong Solder Joint Electrical Performance EMI Shielding Wire Bondable Pb-Free - (SnPb HASL is out) ENTEK(r) OSPExisting high BGA reliability, low cost in use, and newly improved solderability products index PWB surface finishes index Component finishes are moving towards pure tin.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    52 views12 pages

    Cookson Electronics Assembly Materials Lead-Free Seminar Pad Finishes, Laminates and Component Finishes

    Uploaded by

    Richie Reyes
    PCB Surface Finishes Need Flat Co-planar Surface Long Term Reliability - - Strong Solder Joint Electrical Performance EMI Shielding Wire Bondable Pb-Free - (SnPb HASL is out) ENTEK(r) OSPExisting high BGA reliability, low cost in use, and newly improved solderability products index PWB surface finishes index Component finishes are moving towards pure tin.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 12

    Cookson Electronics Assembly Materials Lead-Free Seminar Pad Finishes, Laminates and Component Finishes

    index Fry's Metals, Inc., Alpha Fry Ltd 2004

    PCB Surface Finishes

    Need
    Flat Co-planar Surface Long Term Reliability
    Strong Solder Joint Electrical Performance EMI Shielding Key pad Contacts Press Fit Connectors

    Low Contact Resistance


    Wire Bondable Pb-Free - (SnPb HASL is out) Choice between


    Cu OSP Electroless Silver Electroless Tin Electroless Ni Au

    index

    Fry's Metals, Inc., Alpha Fry Ltd 2004

    PCB Surface Finishes


    Lead-Free Spread Testing

    Board Finish

    Cu OSP 106A HT 0.30um

    Immersion Ag

    Immersion Sn

    Tin/Lead (Sn/Pb)

    Spread is generally lower with High-Tin alloys


    Tin/Silver/Copper (SAC)

    Lead-Free Solder alloys have increased surface tension leading to reduced spread on many surface finishes

    index

    Fry's Metals, Inc., Alpha Fry Ltd 2004

    PWB Surface Finishes Summary

    ENTEK OSP- Existing high BGA reliability, low cost in use, and newly improved solderability products IAg- Excellent pb free solderability and reliability, availability, and mask compatibility ISn- more expensive than , shorter shelf life, poor mask compatibility, and whisker reliability ENIG- Most expensive, market capacity concerns, difficult mask compatibility, fear of black pad liability

    index

    Fry's Metals, Inc., Alpha Fry Ltd 2004

    Component Finishes
    During the Transition to Lead-Free, many Leaded Devices will still have Tin-Lead Finishes
    Components finishes are moving towards pure tin
    Connectors, bright & matte pure tin over a Ni barrier Lead-frame, matte pure tin with or without a Ni barrier layer Chip capacitors/resistors, etc, matte pure tin over a Ni barrier Solder bumps, pure tin, eutectic tin/silver

    Grid Array comps (BGA, CSP) almost exclusively Tin-Lead finishes


    SAC alloy spheres are becoming commonplace

    Many FP ICs have been using NiPd for some years (TI)

    Potential Issues with Components at Higher Temperatures


    Active Components
    Pop-corning Discoloration

    Passive Components
    Thermal shock cracking CTE mismatch Potential Metallurgical issues

    index

    Fry's Metals, Inc., Alpha Fry Ltd 2004

    Component Reflow Profile


    Typical Component Reflow profile specification

    index

    Fry's Metals, Inc., Alpha Fry Ltd 2004

    Tin Whiskers
    What Are Tin Whiskers?
    Extrusions from the tin layer It is accelerated by the compressive stress built-up in the tin layer Compressive stress sources
    Plating process Intermetallic compound formation at interface Mechanical deformation Thermal stress due to CTE mismatch (eg, Sn/Alloy 42) Ni barrier layer whenever pure tin is used Thermal bake at 150C for an hour Reflow Minimize thermal mismatch between finish and substrate Minimize mechanical deformation Maintain good plating process control
    Bath composition Plating parameters

    Whisker

    Tin

    Copper
    Growth of Cu6Sn5 Generates compressive stress

    Compressive stress relieved / reduced by


    index

    Fry's Metals, Inc., Alpha Fry Ltd 2004

    Tin Whiskers
    Why Do Tin Whiskers Cause So Much Concern?
    Whisker growth is real Whiskers grow over time in ambient temperatures and can cause short circuits. There are documented field failures in aerospace applications Whisker growth mechanisms are not well understood There is no industry standard to test whisker growth propensity Understanding whisker growth mechanisms is challenging Many accelerating factors Besides plating process, substrates, environmental conditions (e.g., isothermal vs. thermal cycling, mechanical deformation) also play very important roles Different combinations of these factors would yield different whisker growth propensity

    Inter-metallic Management
    There are two key inter-metallics, Cu6Sn5 and Cu3Sn shown here in a SAC solder joint Both form in the melt but Cu6Sn5 grows most rapidly at ambient temperatures, preferentially at Tin grain boundaries and causes compressive stress Cu3Sn forms nearest the Cu and can act as a diffusion barrier 1500C baking has been shown to reduce whiskers on tin finishes by forming Cu3Sn preferentially There is more research required to better understand the mechanisms, further Information is available from: http://www.metallurgy.nist.gov/solder/ . index http://www.nemi.org/
    Fry's Metals, Inc., Alpha Fry Ltd 2004

    Laminate Thermal Robustness


    Lead-Free Challenge
    Higher Process Temperatures

    Through Hole Reliability

    Problem

    Delamination Measles/ Blister Resistance

    Z-Axis Expansion Glass Transition Temperature (Tg)

    Mechanism

    Thermal Stability Degradation Temperature/Tg/ Time at Temperature Performance

    Key Base Material Properties

    index

    Fry's Metals, Inc., Alpha Fry Ltd 2004

    Laminates
    The Issue For Base Materials

    Peak assembly temperatures that can reach 260oC vs. 230235oC. Coupled with increasing PCB/PCA complexity:
    Additional thermal cycles Additional rework cycles

    Can result in:


    PTH barrel cracking or compromised long-term reliability. Blistering, delamination, or resin degradation during assembly.

    Two key issues:


    Surviving assembly without defects Insuring long term reliability after assembly

    index

    Fry's Metals, Inc., Alpha Fry Ltd 2004

    Laminate considerations for Lead-Free

    Specifying Tg may be necessary, but is insufficient. A higher Tg is not always better. CTE values must be considered as well. Time to delamination tests are increasingly relevant, but may correlate better to assembly related defects than long term reliability. Decomposition temperature is a critical property to understand when specifying materials for Pb-free assembly compatibility. Polyclad offers base materials with the properties required for Pb-free assembly:
    Epoxy FR-4: 370HR Enhanced Electrical: GETEK, LD-621 Halogen Free: HF-541, HF-571

    index

    Fry's Metals, Inc., Alpha Fry Ltd 2004

    Assembly Labelling
    Proposed Mark
    No Mark

    Categorization
    Not ROHS Compliant

    Material Type
    Contains lead e.g.: Sn3-4%Ag0.5-0.9%Cu e.g.:SnZnBi, SnBi e.g.: SnZn, SnZn-x, Pure-Sn, NiPd, NiPdAu, SnAu, SnSb etc.

    e1 e2 e3

    SnAgCu family Contains Bismuth Other lead free materials

    Reference Vivek Gupta Draft Specification IPC Lead-Free Conference 2003

    index

    Fry's Metals, Inc., Alpha Fry Ltd 2004

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