datasheet

19-1298; Rev 10; 1/06
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,

Up to 1Mbps, True RS-232 Transceivers
General Description Next-Generation Device Features
MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/ ♦ For Space-Constrained Applications
MAX3246E +3.0V-powered EIA/TIA-232 and V.28/V.24 MAX3228E/MAX3229E: ±15kV ESD-Protected,
communications interface devices feature low power con- +2.5V to +5.5V, RS-232 Transceivers in UCSP
sumption, high data-rate capabilities, and enhanced
electrostatic-discharge (ESD) protection. The enhanced ♦ For Low-Voltage or Data Cable Applications
ESD structure protects all transmitter outputs and MAX3380E/MAX3381E: +2.35V to +5.5V, 1µA,
receiver inputs to ±15kV using IEC 1000-4-2 Air-Gap 2Tx/2Rx, RS-232 Transceivers with ±15kV
Discharge, ±8kV using IEC 1000-4-2 Contact Discharge ESD-Protected I/O and Logic Pins
(±9kV for MAX3246E), and ±15kV using the Human Body
Model. The logic and receiver I/O pins of the MAX3237E
are protected to the above standards, while the transmit-
ter output pins are protected to ±15kV using the Human _______________Ordering Information
Body Model.
A proprietary low-dropout transmitter output stage delivers PIN- PKG
PART TEMP RANGE PACKAGE
true RS-232 performance from a +3.0V to +5.5V power CODE
supply, using an internal dual charge pump. The charge 20 Thin QFN-
pump requires only four small 0.1µF capacitors for opera- MAX3222ECTP 0°C to +70°C EP** (5mm x T2055-5
tion from a +3.3V supply. Each device guarantees opera- 5mm)
tion at data rates of 250kbps while maintaining RS-232
MAX3222ECUP 0°C to +70°C 20 TSSOP —
output levels. The MAX3237E guarantees operation at
250kbps in the normal operating mode and 1Mbps in the MAX3222ECAP 0°C to +70°C 20 SSOP —
MegaBaud™ operating mode, while maintaining RS-232- MAX3222ECWN 0°C to +70°C 18 Wide SO —
compliant output levels.
MAX3222ECPN 0°C to +70°C 18 Plastic DIP —
The MAX3222E/MAX3232E have two receivers and two
MAX3222EC/D 0°C to +70°C Dice* —
transmitters. The MAX3222E features a 1µA shutdown
mode that reduces power consumption in battery-pow- 20 Thin QFN-
ered portable systems. The MAX3222E receivers remain MAX3222EETP -40°C to +85°C EP** (5mm x T2055-5
active in shutdown mode, allowing monitoring of external 5mm)
devices while consuming only 1µA of supply current. The MAX3222EEUP -40°C to +85°C 20 TSSOP —
MAX3222E and MAX3232E are pin, package, and func-
tionally compatible with the industry-standard MAX242 MAX3222EEAP -40°C to +85°C 20 SSOP —
and MAX232, respectively. MAX3222EEWN -40°C to +85°C 18 Wide SO —
The MAX3241E/MAX3246E are complete serial ports MAX3222EEPN -40°C to +85°C 18 Plastic DIP —
(three drivers/five receivers) designed for notebook and MAX3232ECAE 0°C to +70°C 16 SSOP —
subnotebook computers. The MAX3237E (five drivers/
three receivers) is ideal for peripheral applications that MAX3232ECWE 0°C to +70°C 16 Wide SO —
require fast data transfer. These devices feature a shut- MAX3232ECPE 0°C to +70°C 16 Plastic DIP —
down mode in which all receivers remain active, while *Dice are tested at TA = +25°C, DC parameters only.
consuming only 1µA (MAX3241E/MAX3246E) or 10nA
(MAX3237E). **EP = Exposed paddle.
The MAX3222E, MAX3232E, and MAX3241E are avail-
able in space-saving SO, SSOP, TQFN and TSSOP pack-
ages. The MAX3237E is offered in an SSOP package. Ordering Information continued at end of data sheet.
The MAX3246E is offered in the ultra-small 6 x 6 UCSP™
package.
Pin Configurations, Selector Guide, and Typical Operating
Circuits appear at end of data sheet.
Applications
Battery-Powered Equipment Printers MegaBaud and UCSP are trademarks of Maxim Integrated
Products, Inc.
Cell Phones Smart Phones
† Covered by U.S. Patent numbers 4,636,930; 4,679,134;
Cell-Phone Data Cables xDSL Modems
4,777,577; 4,797,899; 4,809,152; 4,897,774; 4,999,761; and
Notebook, Subnotebook, other patents pending.
and Palmtop Computers
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
ABSOLUTE MAXIMUM RATINGS
VCC to GND ..............................................................-0.3V to +6V 18-Pin PDIP (derate 11.11mW/°C above +70°C)..........889mW
V+ to GND (Note 1) ..................................................-0.3V to +7V 20-Pin TQFN (derate 21.3mW/°C above +70°C) ........1702mW
V- to GND (Note 1) ...................................................+0.3V to -7V 20-Pin TSSOP (derate 10.9mW/°C above +70°C) ........879mW
V+ + |V-| (Note 1).................................................................+13V 20-Pin SSOP (derate 8.00mW/°C above +70°C) ..........640mW
Input Voltages 28-Pin SSOP (derate 9.52mW/°C above +70°C) ..........762mW
T_IN, EN, SHDN, MBAUD to GND ........................-0.3V to +6V 28-Pin Wide SO (derate 12.50mW/°C above +70°C) .............1W
R_IN to GND .....................................................................±25V 28-Pin TSSOP (derate 12.8mW/°C above +70°C) ......1026mW
Output Voltages 32-Lead Thin QFN (derate 33.3mW/°C above +70°C)..2666mW
T_OUT to GND...............................................................±13.2V 6 x 6 UCSP (derate 12.6mW/°C above +70°C) .............1010mW
R_OUT, R_OUTB (MAX3241E)................-0.3V to (VCC + 0.3V) Operating Temperature Ranges
Short-Circuit Duration, T_OUT to GND.......................Continuous MAX32_ _EC_ _ ...................................................0°C to +70°C
Continuous Power Dissipation (TA = +70°C) MAX32_ _EE_ _.................................................-40°C to +85°C
16-Pin SSOP (derate 7.14mW/°C above +70°C) ..........571mW Storage Temperature Range .............................-65°C to +150°C
16-Pin TSSOP (derate 9.4mW/°C above +70°C) .......754.7mW Lead Temperature (soldering, 10s) .................................+300°C
16-Pin TQFN (derate 20.8mW/°C above +70°C) .....1666.7mW Bump Reflow Temperature (Note 2)
16-Pin Wide SO (derate 9.52mW/°C above +70°C) .....762mW Infrared, 15s..................................................................+200°C
18-Pin Wide SO (derate 9.52mW/°C above +70°C) .....762mW Vapor Phase, 20s..........................................................+215°C
Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +3V to +5.5V, C1–C4 = 0.1µF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 3, 4)
PARAMETER CONDITIONS MIN TYP MAX UNITS

DC CHARACTERISTICS (VCC = +3.3V or +5V, TA = +25°C)
MAX3222E, MAX3232E,
0.3 1
Supply Current SHDN = VCC, no load MAX3241E, MAX3246E mA
MAX3237E 0.5 2.0
SHDN = GND 1 10 µA
Shutdown Supply Current
SHDN = R_IN = GND, T_IN = GND or VCC (MAX3237E) 10 300 nA
LOGIC INPUTS
Input Logic Low T_IN, EN, SHDN, MBAUD 0.8 V
VCC = +3.3V 2.0
Input Logic High T_IN, EN, SHDN, MBAUD V
VCC = +5.0V 2.4
Transmitter Input Hysteresis 0.5 V
MAX3222E, MAX3232E,
T_IN, EN, SHDN ±0.01 ±1
Input Leakage Current MAX3241E, MAX3246E µA
T_IN, SHDN, MBAUD MAX3237E (Note 5) 9 18
RECEIVER OUTPUTS
R_OUT (MAX3222E/MAX3237E/MAX3241E/
Output Leakage Current ±0.05 ±10 µA
MAX3246E), EN = VCC, receivers disabled
IOUT = 1.6mA (MAX3222E/MAX3232E/MAX3241E/
Output-Voltage Low 0.4 V
MAX3246E), IOUT = 1.0mA (MAX3237E)
2 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)

VCC - VCC -
Output-Voltage High IOUT = -1.0mA V
0.6 0.1
RECEIVER INPUTS
Input Voltage Range -25 +25 V
VCC = +3.3V 0.6 1.1
Input Threshold Low TA = +25°C V
VCC = +5.0V 0.8 1.5
VCC = +3.3V 1.5 2.4
Input Threshold High TA = +25°C V
VCC = +5.0V 2.0 2.4
Input Hysteresis 0.5 V
Input Resistance TA = +25°C 3 5 7 kΩ
TRANSMITTER OUTPUTS
All transmitter outputs loaded with 3kΩ to ground
Output Voltage Swing ±5 ±5.4 V
(Note 6)
Output Resistance VCC = 0, transmitter output = ±2V 300 50k Ω
Output Short-Circuit Current ±60 mA
VCC = 0 or +3.0V to +5.5V, VOUT = ±12V, transmitters
Output Leakage Current ±25 µA
disabled (MAX3222E/MAX3232E/MAX3241E/MAX3246E)
MOUSE DRIVABILITY (MAX3241E)
T1IN = T2IN = GND, T3IN = VCC, T3OUT loaded with
Transmitter Output Voltage 3kΩ to GND, T1OUT and T2OUT loaded with 2.5mA ±5 V
each
ESD PROTECTION
Human Body Model ±15
IEC 1000-4-2 Air-Gap Discharge (except MAX3237E) ±15
R_IN, T_OUT kV
IEC 1000-4-2 Contact Discharge (except MAX3237E) ±8
IEC 1000-4-2 Contact Discharge (MAX3246E only) ±9
Human Body Model ±15
T_IN, R_IN, R_OUT, EN, SHDN,
MAX3237E IEC1000-4-2 Air-Gap Discharge ±15 kV
MBAUD
IEC1000-4-2 Contact Discharge ±8
_______________________________________________________________________________________ 3
TIMING CHARACTERISTICS—MAX3222E/MAX3232E/MAX3241E/MAX3246E
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RL = 3kΩ, TA = TMIN to TMAX
CL = 1000pF, (MAX3222E/MAX3232E/ 250
Maximum Data Rate MAX3241E) (Note 6) kbps
one transmitter
switching TA = +25°C (MAX3246E) 250
tPHL Receiver input to receiver output, 0.15
Receiver Propagation Delay µs
tPLH CL = 150pF 0.15
Receiver Output Enable Time Normal operation (except MAX3232E) 200 ns
Receiver Output Disable Time Normal operation (except MAX3232E) 200 ns
Transmitter Skew |tPHL - tPLH| (Note 7) 100 ns
Receiver Skew |tPHL - tPLH| 50 ns
VCC = +3.3V, TA = +25°C,
RL = 3kΩ to 7kΩ, measured CL = 150pF
Transition-Region Slew Rate 6 30 V/µs
from +3.0V to -3.0V or -3.0V to to 1000pF
+3.0V, one transmitter switching
TIMING CHARACTERISTICS—MAX3237E
(VCC = +3V to +5.5V, C1–C4 = 0.1µF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3)
RL = 3kΩ, CL = 1000pF, one transmitter switching,
250
MBAUD = GND
VCC = +3.0V to +4.5V, RL = 3kΩ, CL = 250pF,
Maximum Data Rate 1000 kbps
one transmitter switching, MBAUD = VCC
VCC = +4.5V to +5.5V, RL = 3kΩ, CL = 1000pF,
1000
one transmitter switching, MBAUD = VCC
tPHL 0.15
Receiver Propagation Delay R_IN to R_OUT, CL = 150pF µs
tPLH 0.15
Receiver Output Enable Time Normal operation 2.6 µs
Receiver Output Disable Time Normal operation 2.4 µs
| tPHL - tPLH |, MBAUD = GND
Transmitter Skew (Note 7) 100 ns
| tPHL - tPLH |, MBAUD = VCC
Receiver Skew | tPHL - tPLH | 50 ns
VCC = +3.3V, CL = 150pF MBAUD = GND 6 30

RL = 3kΩ to 7kΩ, to 1000pF
Transition-Region Slew Rate +3.0V to -3.0V or MBAUD = VCC 24 150 V/µs
-3.0V to +3.0V, CL = 150pF to 2500pF,
TA = +25°C 4 30
MBAUD = GND
Note 3: MAX3222E/MAX3232E/MAX3241E: C1–C4 = 0.1µF tested at +3.3V ±10%; C1 = 0.047µF, C2, C3, C4 = 0.33µF tested at +5.0V
±10%. MAX3237E: C1–C4 = 0.1µF tested at +3.3V ±5%, C1–C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.047µF, C2, C3, C4 =
0.33µF tested at +5.0V ±10%. MAX3246E; C1-C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.22µF, C2, C3, C4 = 0.54µF tested at
5.0V ±10%.
Note 4: MAX3246E devices are production tested at +25°C. All limits are guaranteed by design over the operating temperature range.
Note 5: The MAX3237E logic inputs have an active positive feedback resistor. The input current goes to zero when the inputs are at
the supply rails.
Note 6: MAX3241EEUI is specified at TA = +25°C.
Note 7: Transmitter skew is measured at the transmitter zero crosspoints.
4 _______________________________________________________________________________________
__________________________________________Typical Operating Characteristics
(VCC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3kΩ and CL, TA = +25°C, unless otherwise noted.)
MAX3222E/MAX3232E MAX3222E/MAX3232E
TRANSMITTER OUTPUT VOLTAGE MAX3222E/MAX3232E OPERATING SUPPLY CURRENT
vs. LOAD CAPACITANCE SLEW RATE vs. LOAD CAPACITANCE vs. LOAD CAPACITANCE
6 16 45
MAX3237E toc02
MAX3237E toc03
MAX3237E toc01
T1 TRANSMITTING AT 250kbps
5 VOUT+ 40
14
TRANSMITTER OUTPUT VOLTAGE (V)
T2 TRANSMITTING AT 15.6kbps
4
12 -SLEW 35
3
SUPPLY CURRENT (mA)

T1 TRANSMITTING AT 250kbps 250kbps
SLEW RATE (V/µs)
2 30
T2 TRANSMITTING AT 15.6kbps 10 120kbps
1 25
8 +SLEW
0
20
-1
6 20kbps
-2 15
-3 4
10
-4
VOUT- 2 5
-5 FOR DATA RATES UP TO 250kbps
-6 0 0
0 1000 2000 3000 4000 5000 0 1000 2000 3000 4000 5000 0 1000 2000 3000 4000 5000
LOAD CAPACITANCE (pF) LOAD CAPACITANCE (pF) LOAD CAPACITANCE (pF)
MAX3241E MAX3241E
TRANSMITTER OUTPUT VOLTAGE MAX3241E OPERATING SUPPLY CURRENT
6 14 60
MAX3237E to04
MAX3237E toc05
MAX3237E toc06
5 1 TRANSMITTER AT 250kbps
VOUT+
12 2 TRANSMITTERS AT 15.6kbps
4 50
3 250kbps
SUPPLY CURRENT (mA)
1 TRANSMITTER AT 250kbps 10
SLEW RATE (V/µs)
2 40
2 TRANSMITTERS AT 15.6kbps 120kbps
1 8
0 30
-1 6 20kbps
-2 20
4
-3
-4 2 10
VOUT-
-5
-6 0 0
0 1000 2000 3000 4000 5000 0 1000 2000 3000 4000 5000 0 1000 2000 3000 4000 5000
MAX3237E MAX3237E MAX3237E

TRANSMITTER OUTPUT VOLTAGE TRANSMITTER OUTPUT VOLTAGE TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE (MBAUD = GND) vs. LOAD CAPACITANCE vs. LOAD CAPACITANCE (MBAUD = VCC)
6 6 7.5
MAX3237E toc08
MAX3246E toc07A
MAX3237E toc07
5 5 1Mbps
VOUT+ VOUT+
4 4 5.0
FOR DATA RATES UP TO 250kbps 2Mbps
3 3 1.5Mbps
1 TRANSMITTER AT 250kbps
2 4 TRANSMITTERS AT 15.6kbps 2 2.5
FOR DATA RATES UP TO 250kbps 1 TRANSMITTER AT FULL DATA RATE
1 ALL TRANSMITTERS LOADED 1 1 TRANSMITTER 250kbps 4 TRANSMITTERS AT 1/16 DATA RATE
WITH 3kΩ + CL
0 0 4 TRANSMITTERS 15.6kbps 0 3kΩ + CL LOAD, EACH OUTPUT
-1 -1 ALL TRANSMITTERS LOADED
WITH 3kΩ + CL
-2 -2 -2.5
-3 -3 1.5Mbps
2Mbps
-4 -4 -5.0
VOUT- VOUT- 1Mbps
-5 -5
-6 -6 -7.5
0 500 1000 1500 2000 2500 3000 0 500 1000 1500 2000 2500 3000 0 500 1000 1500 2000
_______________________________________________________________________________________ 5
Typical Operating Characteristics (continued)
(VCC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3kΩ and CL, TA = +25°C, unless otherwise noted.)
SLEW RATE vs. LOAD CAPACITANCE SLEW RATE vs. LOAD CAPACITANCE SUPPLY CURRENT vs. LOAD CAPACITANCE
(MBAUD = GND) (MBAUD = VCC) WHEN TRANSMITTING DATA (MBAUD = GND)
12 70 50
MAX3237E toc09
MAX3237E toc10
MAX3237E toc11
250kbps
10 60
-SLEW, 1Mbps 40 120kbps
SR-
SUPPLY CURRENT (mA)

50 +SLEW, 1Mbps
SLEW RATE (V/µs)
8 SLEW RATE (V/µs)

-SLEW, 2Mbps 20kbps
SR+ +SLEW, 2Mbps 30
40
6
30
20
4
1 TRANSMITTER AT 250kbps 20 1 TRANSMITTER AT 20kbps, 120kbps, 250kbps
4 TRANSMITTERS AT 15.6kbps 1 TRANSMITTER AT FULL DATA RATE 4 TRANSMITTERS AT 15.6kbps
2 4 TRANSMITTERS AT 1/16 DATA RATE 10
ALL TRANSMITTERS LOADED 10 ALL TRANSMITTERS LOADED
WITH 3kΩ + CL 3kΩ + CL LOAD EACH OUTPUT WITH 3kΩ + CL
0 0 0
0 500 1000 1500 2000 2500 3000 0 500 1000 1500 2000 0 500 1000 1500 2000 2500 3000
MAX3237E MAX3237E
TRANSMITTER OUTPUT VOLTAGE MAX3237E SUPPLY CURRENT
TRANSMITTER SKEW vs. LOAD CAPACITANCE
vs. SUPPLY VOLTAGE (MBAUD = GND) vs. SUPPLY VOLTAGE (MBAUD = GND)
(MBAUD = VCC)
100 6 50
MAX3237E toc14
MAX3237E toc13
MAX3237E toc12
5 VOUT+
4 40
80
SUPPLY CURRENT (mA)
3
TRANSMITTER SKEW (ns)
2
1 TRANSMITTER AT 250kbps 30
60 1
4 TRANSMITTERS AT 15.6kbps
0
ALL TRANSMITTERS LOADED
40 -1 WITH 3kΩ +1000pF 20
-2 1 TRANSMITTER AT 250kbps
|tPLH - tPHL| -3 4 TRANSMITTERS AT 15.6kbps
20 1 TRANSMITTER AT 500kbps 10 ALL TRANSMITTERS LOADED
4 TRANSMITTERS AT 1/16 DATA RATE -4 VOUT-
WITH 3kΩ AND 1000pF
ALL TRANSMITTERS LOADED -5
WITH 3kΩ + CL 0
0 -6
0 500 1000 1500 2000 2.0 2.5 3.0 3.5 4.0 4.5 5.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0
LOAD CAPACITANCE (pF) SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V)
MAX3246E MAX3246E
TRANSMITTER OUTPUT VOLTAGE MAX3246E OPERATING SUPPLY CURRENT
7 16 60
MAX3237E toc17
MAX3237E toc16
MAX3237E toc15
6 55 1 TRANSMITTER AT 250kbps
VOUT+ 2 TRANSMITTERS AT 15.6kbps
5 14 50
4 45
SUPPLY CURRENT (mA)
1 TRANSMITTER AT 250kbps
SLEW RATE (V/µs)
3 12 40
2 TRANSMITTERS AT 15.6kbps 250kbps
2 35
1 SR- 120kbps
10 30
0 SR+ 25
-1
8 20
-2 20kbps
15
-3
-4 6 10
VOUT- 5
-5
-6 4 0
0 1000 2000 3000 4000 5000 0 1000 2000 3000 4000 5000 0 1000 2000 3000 4000 5000
6 _______________________________________________________________________________________
Pin Description
PIN
SO/DIP/ NAME FUNCTION
MAX3237E MAX3246E
SO/ TSSOP/ SSOP/ 20-PIN SSOP/
TQFN TQFN QFN
DIP SSOP 16-PIN TSSOP SO
TSSOP
Receiver Enable. Active

19 1 1 — — — 13* 23 22 B3 EN
low.
Positive Terminal of
1 2 2 16 1 2 28 28 28 F3 C1+ Voltage-Doubler Charge-
Pump Capacitor
20 3 3 15 2 3 27 27 27 F1 V+ +5.5V Generated by the

Charge Pump
Negative Terminal of
2 4 4 1 3 4 25 24 23 F4 C1- Voltage-Doubler Charge-
Pump Capacitor
Positive Terminal of
3 5 5 2 4 5 1 1 29 E1 C2+ Inverting Charge-Pump
Capacitor
Negative Terminal of
4 6 6 3 5 6 3 2 30 D1 C2- Inverting Charge-Pump
Capacitor
-5.5V Generated by the

5 7 7 4 6 7 4 3 31 C1 V-
Charge Pump
9, 6,
8, 5, 5, 6, 7, F6, E6, RS-232 Transmitter
6, 15 8, 17 7, 14 8, 17 10, 7, T_OUT
15 12 10, 12 D6 Outputs
11 8
A4, A5,
9, 6,
7, 14 9, 16 8, 13 9, 16 8, 9, 11 4–8 1–5 A6, B6, R_IN RS-232 Receiver Inputs
14 11
C6
13,
C2, B1,
10, 7, 12, 18, 20, 14, TTL/CMOS Receiver
8, 13 10, 15 9, 12 15–19 A1, A2, R_OUT
13 10 15 21 15, Outputs
A3
17, 18
17*, 19*, 12, 10,
11, 13, E3, E2, TTL/CMOS Transmitter
10, 11 12, 13 8, 9 10, 11 22*, 23*, 13, 11, T_IN
12 14 D2 Inputs
24* 14 12
*These pins have an active positive feedback resistor internal to the MAX3237E, allowing unused inputs to be left unconnected.
_______________________________________________________________________________________ 7
Pin Description (continued)
PIN
SO/DIP/ NAME FUNCTION
MAX3237E SSOP/ MAX3246E
SO/ TSSOP/ SSOP/ 20-PIN
TQFN TQFN SO/ QFN
DIP SSOP 16-PIN TSSOP
TSSOP
TSSOP
16 16 18 13 15 18 2 25 24 F5 GND Ground
17 17 19 14 16 19 26 26 26 F2 VCC +3.0V to +5.5V Supply

Voltage
18 18 20 — — — 14* 22 21 B2 Shutdown Control. Active

SHDN
low.
No Connection. For
C3, D3, B4, MAX3246E, these
9, 16,
1, 10, C4, D4, E4,
9, 12 — 11, 14 — — — — 25, B5, C5, D5, N.C. locations are not
11, 20
32 populated with solder
E5
bumps.
MegaBaud Control Input.
Connect to GND for
— — — — — — 15* — — — MBAUD normal operation; connect
to VCC for 1Mbps
transmission rates.
Noninverting
20,
— — — — — — 16 19, 20 — R_OUTB Complementary Receiver
21
Outputs. Always active.
Exposed Paddle. Solder
the exposed paddle to
EP — — EP — — — — EP — GND
the ground alone or leave
unconnected.
8 _______________________________________________________________________________________
VCC VCC
0.1µF 0.1µF
C1+ VCC C1+ VCC

V+ V+
C1 C3 C1 C3
C1- MAX3222E C1- MAX3222E
MAX3232E MAX3232E
C2+ MAX3237E V- C2+ MAX3237E V-
C2 MAX3241E C4 C2 MAX3241E C4
C2- MAX3246E C2- MAX3246E
T_ IN T_ OUT T_ IN T_ OUT
R_ OUT R_ IN R_ OUT R_ IN
5kΩ 5kΩ
1000pF 7kΩ
3kΩ 150pF
GND (2500pF, MAX3237E only) GND
MINIMUM SLEW-RATE TEST CIRCUIT MAXIMUM SLEW-RATE TEST CIRCUIT
Figure 1. Slew-Rate Test Circuits
Detailed Description into a high-impedance state when the device is in shut-

down mode (SHDN = GND). The MAX3222E/
Dual Charge-Pump Voltage Converter MAX3232E/MAX3237E/MAX3241E/MAX3246E permit
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/ the outputs to be driven up to ±12V in shutdown.
MAX3246Es’ internal power supply consists of a regu- The MAX3222E/MAX3232E/MAX3241E/MAX3246E
lated dual charge pump that provides output voltages transmitter inputs do not have pullup resistors. Connect
of +5.5V (doubling charge pump) and -5.5V (inverting unused inputs to GND or VCC. The MAX3237E’s trans-
charge pump) over the +3.0V to +5.5V VCC range. The mitter inputs have a 400kΩ active positive-feedback
charge pump operates in discontinuous mode; if the resistor, allowing unused inputs to be left unconnected.
output voltages are less than 5.5V, the charge pump is
enabled, and if the output voltages exceed 5.5V, the MAX3237E MegaBaud Operation
charge pump is disabled. Each charge pump requires For higher-speed serial communications, the
a flying capacitor (C1, C2) and a reservoir capacitor MAX3237E features MegaBaud operation. In
(C3, C4) to generate the V+ and V- supplies (Figure 1). MegaBaud operating mode (MBAUD = V CC ), the
MAX3237E transmitters guarantee a 1Mbps data rate
RS-232 Transmitters with worst-case loads of 3kΩ in parallel with 250pF for
The transmitters are inverting level translators that con- +3.0V < VCC < +4.5V. For +5V ±10% operation, the
vert TTL/CMOS-logic levels to ±5V EIA/TIA-232-compli- MAX3237E transmitters guarantee a 1Mbps data rate
ant levels. into worst-case loads of 3kΩ in parallel with 1000pF.
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E transmitters guarantee a 250kbps data rate RS-232 Receivers
with worst-case loads of 3kΩ in parallel with 1000pF, The receivers convert RS-232 signals to CMOS-logic
providing compatibility with PC-to-PC communication output levels. The MAX3222E/MAX3237E/MAX3241E/
software (such as LapLink™). Transmitters can be par- MAX3246E receivers have inverting three-state outputs.
alleled to drive multiple receivers or mice. Drive EN high to place the receiver(s) into a high-
impedance state. Receivers can be either active or
The MAX3222E/MAX3237E/MAX3241E/MAX3246E
inactive in shutdown (Table 1).
transmitters are disabled and the outputs are forced
LapLink is a trademark of Traveling Software.
_______________________________________________________________________________________ 9
VCC
5V/div SHDN
0
T2OUT
PREVIOUS
VCC PROTECTION RS-232
DIODE 2V/div
Rx 0
5kΩ
UART
Tx VCC = 3.3V T1OUT
GND SHDN = GND C1–C4 = 0.1µF
40µs/div
a) OLDER RS-232: POWERED-DOWN UART DRAWS CURRENT FROM Figure 3. Transmitter Outputs Recovering from Shutdown or
A ACTIVE RECEIVER OUTPUT IN SHUTDOWN. Powering Up
VCC
TO LOGIC MAX3222E/MAX3237E/MAX3241E/
µP TRANSITION MAX3246E Shutdown Mode
DETECTOR
Supply current falls to less than 1µA in shutdown mode
(SHDN = low). The MAX3237E’s supply current falls
MAX3237E/MAX3241E to10nA (typ) when all receiver inputs are in the invalid
range (-0.3V < R_IN < +0.3). When shut down, the
R1OUTB
device’s charge pumps are shut off, V+ is pulled down
VCC PROTECTION to VCC, V- is pulled to ground, and the transmitter out-
DIODE puts are disabled (high impedance). The time required
Rx R1OUT R1IN
to recover from shutdown is typically 100µs, as shown
THREE-STATED
in Figure 3. Connect SHDN to VCC if shutdown mode is
EN = VCC 5kΩ not used. SHDN has no effect on R_OUT or R_OUTB
UART (MAX3237E/MAX3241E).
T1OUT
T1IN
Tx
GND SHDN = GND ±15kV ESD Protection
As with all Maxim devices, ESD-protection structures
are incorporated to protect against electrostatic dis-
charges encountered during handling and assembly.
b) NEW MAX3237E/MAX3241E: EN SHUTS DOWN RECEIVER OUTPUTS The driver outputs and receiver inputs of the
B (EXCEPT FOR B OUTPUTS), SO NO CURRENT FLOWS TO UART IN SHUTDOWN. MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E
B B OUTPUTS INDICATE RECEIVER ACTIVITY DURING SHUTDOWN WITH EN HIGH.
have extra protection against static electricity. Maxim’s
Figure 2. Detection of RS-232 Activity when the UART and engineers have developed state-of-the-art structures to
Interface are Shut Down; Comparison of MAX3237E/MAX3241E protect these pins against ESD of ±15kV without damage.
(b) with Previous Transceivers (a) The ESD structures withstand high ESD in all states:
normal operation, shutdown, and powered down. After
The complementary outputs on the MAX3237E/ an ESD event, Maxim’s E versions keep working without
MAX3241E (R_OUTB) are always active, regardless of the latchup, whereas competing RS-232 products can latch
state of EN or SHDN. This allows the device to be used and must be powered down to remove latchup.
for ring indicator applications without forward biasing Furthermore, the MAX3237E logic I/O pins also have
other devices connected to the receiver outputs. This is ±15kV ESD protection. Protecting the logic I/O pins to
ideal for systems where VCC drops to zero in shutdown ±15kV makes the MAX3237E ideal for data cable
to accommodate peripherals such as UARTs (Figure 2). applications.
10 ______________________________________________________________________________________
ESD protection can be tested in various ways; the
Table 1. MAX3222E/MAX3237E/MAX3241E/
transmitter outputs and receiver inputs for the
MAX3246E Shutdown and Enable Control MAX3222E/MAX3232E/MAX3241E/MAX3246E are
Truth Table characterized for protection to the following limits:
R_OUTB • ±15kV using the Human Body Model
SHDN EN T_OUT R_OUT (MAX3237E/ • ±8kV using the Contact Discharge method specified
MAX3241E) in IEC 1000-4-2
High • ±9kV (MAX3246E only) using the Contact Discharge
0 0 Active Active method specified in IEC 1000-4-2
impedance
High High • ±15kV using the Air-Gap Discharge method speci-
0 1 Active fied in IEC 1000-4-2
impedance impedance
1 0 Active Active Active
High
1 1 Active Active
impedance
RC RD
1MΩ 1500Ω IP 100% Ir PEAK-TO-PEAK RINGING
90% (NOT DRAWN TO SCALE)
CHARGE-CURRENT- DISCHARGE
LIMIT RESISTOR RESISTANCE
AMPERES
HIGH- DEVICE- 36.8%

VOLTAGE Cs STORAGE UNDER-
DC 100pF CAPACITOR TEST 10%
SOURCE 0
0 TIME
tRL
tDL
CURRENT WAVEFORM
Figure 4a. Human Body ESD Test Model Figure 4b. Human Body Model Current Waveform
I
100%
RC RD
90%
50MΩ to 100MΩ 330Ω
CHARGE-CURRENT- DISCHARGE
I PEAK
LIMIT RESISTOR RESISTANCE
HIGH- DEVICE-
VOLTAGE Cs STORAGE UNDER-
DC 150pF CAPACITOR TEST
SOURCE
10%
t r = 0.7ns to 1ns t
30ns
60ns
Figure 5a. IEC 1000-4-2 ESD Test Model Figure 5b. IEC 1000-4-2 ESD Generator Current Waveform
______________________________________________________________________________________ 11
Table 2. Required Minimum Capacitor
6
Values
MAX3222E-fig06a
5

VCC C1 C2, C3, C4 4 VOUT+
VCC = 3.0V
(V) (µF) (µF) 3
2
MAX3222E/MAX3232E/MAX3241E
1 VOUT+
3.0 to 3.6 0.1 0.1
0
4.5 to 5.5 0.047 0.33 -1
3.0 to 5.5 0.1 0.47 -2
VCC VOUT-
MAX3237E/MAX3246E -3
-4 VOUT-
3.0 to 3.6 0.22 0.22
-5
3.15 to 3.6 0.1 0.1 -6
4.5 to 5.5 0.047 0.33 0 1 2 3 4 5 6 7 8 9 10
LOAD CURRENT PER TRANSMITTER (mA)
3.0 to 5.5 0.22 1.0
Figure 6a. MAX3241E Transmitter Output Voltage vs. Load

Table 3. Logic-Family Compatibility with Current Per Transmitter
Various Supply Voltages
SYSTEM IEC 1000-4-2
VCC SUPPLY The IEC 1000-4-2 standard covers ESD testing and
POWER-SUPPLY
VOLTAGE COMPATIBILITY performance of finished equipment; it does not specifi-
VOLTAGE
(V) cally refer to integrated circuits. The MAX3222E/
(V)
MAX3232E/MAX3237E/MAX3241E/MAX3246E help you
3.3 3.3
Compatible with all design equipment that meets level 4 (the highest level)
CMOS families of IEC 1000-4-2, without the need for additional ESD-
protection components.
Compatible with all
5 5 TTL and CMOS The major difference between tests done using the
families Human Body Model and IEC 1000-4-2 is higher peak
current in IEC 1000-4-2, because series resistance is
Compatible with ACT lower in the IEC 1000-4-2 model. Hence, the ESD with-
and HCT CMOS, and stand voltage measured to IEC 1000-4-2 is generally
5 3.3
with AC, HC, or lower than that measured using the Human Body
CD4000 CMOS Model. Figure 5a shows the IEC 1000-4-2 model, and
Figure 5b shows the current waveform for the ±8kV IEC
For the MAX3237E, all logic and RS-232 I/O pins are 1000-4-2 level 4 ESD Contact Discharge test. The Air-
characterized for protection to ±15kV per the Human Gap Discharge test involves approaching the device
Body Model. with a charged probe. The Contact Discharge method
connects the probe to the device before the probe is
ESD Test Conditions energized.
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents Machine Model
test setup, test methodology, and test results. The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resis-
Human Body Model tance. Its objective is to emulate the stress caused by
Figure 4a shows the Human Body Model, and Figure contact that occurs with handling and assembly during
4b shows the current waveform it generates when dis- manufacturing. All pins require this protection during
charged into a low impedance. This model consists of manufacturing, not just RS-232 inputs and outputs.
a 100pF capacitor charged to the ESD voltage of interest, Therefore, after PC board assembly, the Machine
which is then discharged into the test device through a Model is less relevant to I/O ports.
1.5kΩ resistor.
12 ______________________________________________________________________________________
VCC = +3.0V TO +5.5V
CBYPASS
26
28 VCC 27
C1+ V+
C1 24 C3
C1- COMPUTER SERIAL PORT
1 3
C2+ MAX3241E V-
C2 C4
2
C2-
14 T1IN T1OUT 9
+V
13 T2IN T2OUT 10
+V
12 T3IN T3OUT 11
VCC
R1OUTB -V
21
GND
20 R2OUTB
19 R1IN 4 Tx
R1OUT
18 R2OUT 5kΩ R2IN 5

MOUSE
5kΩ
15 R5OUT R5IN 8
23 5kΩ
EN 22
SHDN VCC
GND
25
Figure 6b. Mouse Driver Test Circuit
Applications Information excessively with temperature. If in doubt, use capaci-

tors with a larger nominal value. The capacitor’s equiv-
Capacitor Selection alent series resistance (ESR), which usually rises at low
The capacitor type used for C1–C4 is not critical for temperatures, influences the amount of ripple on V+
proper operation; polarized or nonpolarized capacitors and V-.
can be used. The charge pump requires 0.1µF capaci-
tors for 3.3V operation. For other supply voltages, see Power-Supply Decoupling
Table 2 for required capacitor values. Do not use val- In most circumstances, a 0.1µF VCC bypass capacitor
ues smaller than those listed in Table 2. Increasing the is adequate. In applications sensitive to power-supply
capacitor values (e.g., by a factor of 2) reduces ripple noise, use a capacitor of the same value as charge-
on the transmitter outputs and slightly reduces power pump capacitor C1. Connect bypass capacitors as
consumption. C2, C3, and C4 can be increased without close to the IC as possible.
changing C1’s value. However, do not increase C1
Operation Down to 2.7V
without also increasing the values of C2, C3, C4,
Transmitter outputs meet EIA/TIA-562 levels of ±3.7V
and CBYPASS to maintain the proper ratios (C1 to
with supply voltages as low as 2.7V.
the other capacitors).
When using the minimum required capacitor values,
make sure the capacitor value does not degrade
______________________________________________________________________________________ 13
Transmitter Outputs Recovering the transmitters are enabled only when the magnitude
from Shutdown of V- exceeds approximately -3.0V.

Figure 3 shows two transmitter outputs recovering from
shutdown mode. As they become active, the two trans- Mouse Drivability
mitter outputs are shown going to opposite RS-232 levels The MAX3241E is designed to power serial mice while
(one transmitter input is high; the other is low). Each operating from low-voltage power supplies. It has
transmitter is loaded with 3kΩ in parallel with 2500pF. been tested with leading mouse brands from manu-
The transmitter outputs display no ringing or undesir- facturers such as Microsoft and Logitech. The
able transients as they come out of shutdown. Note that MAX3241E successfully drove all serial mice tested
and met their current and voltage requirements.
VCC
0.1µF
T1IN 5V/div
VCC
C1+ V+
C1 C3
C1- 5V/div
T1OUT
MAX3222E
C2+ MAX3232E V-
C2 MAX3237E C4
C2- MAX3241E 5V/div
MAX3246E R1OUT
T_ OUT
VCC = 3.3V, C1–C4 = 0.1µF
T_ IN
2µs/div
R_ OUT R_ IN
Figure 9. MAX3241E Loopback Test Result at 250kbps
5kΩ 1000pF
GND
+5V
T_IN
0
Figure 7. Loopback Test Circuit
+5V
0 T_OUT
5kΩ + 250pF
-5V
VCC = 3.3V
+5V C1–C4 = 0.1µF
T1IN 5V/div R_OUT
0
400ns/div
5V/div
T1OUT Figure 10. MAX3237E Loopback Test Result at 1000kbps
(MBAUD = VCC)
5V/div
R1OUT VCC = 3.3V
C1–C4 = 0.1µF
2µs/div
Figure 8. MAX3241E Loopback Test Result at 120kbps
14 ______________________________________________________________________________________
Figure 6a shows the transmitter output voltages under UCSP Reliability
increasing load current at +3.0V. Figure 6b shows a The UCSP represents a unique packaging form factor
typical mouse connection using the MAX3241E. that may not perform equally to a packaged product
through traditional mechanical reliability tests. UCSP
High Data Rates reliability is integrally linked to the user’s assembly
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/ methods, circuit board material, and usage environ-
MAX3246E maintain the RS-232 ±5V minimum transmit- ment. The user should closely review these areas when
ter output voltage even at high data rates. Figure 7 considering use of a UCSP package. Performance
shows a transmitter loopback test circuit. Figure 8 through Operating Life Test and Moisture Resistance
shows a loopback test result at 120kbps, and Figure 9 remains uncompromised as the wafer-fabrication
shows the same test at 250kbps. For Figure 8, all trans- process primarily determines it.
mitters were driven simultaneously at 120kbps into RS-
232 loads in parallel with 1000pF. For Figure 9, a single Mechanical stress performance is a greater considera-
transmitter was driven at 250kbps, and all transmitters tion for a UCSP package. UCSPs are attached through
were loaded with an RS-232 receiver in parallel with direct solder contact to the user’s PC board, foregoing
1000pF. the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
The MAX3237E maintains the RS-232 ±5.0V minimum ered. Table 4 shows the testing done to characterize
transmitter output voltage at data rates up to 1Mbps. the UCSP reliability performance. In conclusion, the
Figure 10 shows a loopback test result at 1Mbps with UCSP is capable of performing reliably through envi-
MBAUD = VCC. For Figure 10, all transmitters were ronmental stresses as indicated by the results in the
loaded with an RS-232 receiver in parallel with 250pF. table. Additional usage data and recommendations are
Interconnection with 3V and 5V Logic detailed in the UCSP application note, which can be
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/ found on Maxim’s website at www.maxim-ic.com.
MAX3246E can directly interface with various 5V logic
families, including ACT and HCT CMOS. See Table 3
for more information on possible combinations of inter-
connections.
Table 4. Reliability Test Data

FAILURES PER
TEST CONDITIONS DURATION
SAMPLE SIZE
TA = -35°C to +85°C, 150 cycles, 0/10,
Temperature Cycle
TA = -40°C to +100°C 900 cycles 0/200
Operating Life TA = +70°C 240 hours 0/10
Moisture Resistance TA = +20°C to +60°C, 90% RH 240 hours 0/10
Low-Temperature Storage TA = -20°C 240 hours 0/10
Low-Temperature Operational TA = -10°C 24 hours 0/10
Solderability 8-hour steam age — 0/15
ESD ±15kV, Human Body Model — 0/5
High-Temperature Operating
TJ = +150°C 168 hours 0/45
Life
______________________________________________________________________________________ 15
__________________________________________________________Pin Configurations
TOP VIEW
EN 1 18 SHDN EN 1 20 SHDN N.C. 1 20 N.C. C1+ 1 16 VCC

C1+ 2 17 VCC C1+ 2 19 VCC C1+ 2 19 VCC V+ 2 15 GND
V+ 3 16 GND V+ 3 18 GND V+ 3 18 GND C1- 3 14 T1OUT
C1- 4 15 T1OUT C1- 4 17 T1OUT C1- 4 17 T1OUT C2+ 4 MAX3232E 13 R1IN
C2+ 5 MAX3222E 14 R1IN C2+ 5 MAX3222E 16 R1IN C2+ 5 MAX3232E 16 R1IN C2- 5 12 R1OUT
C2- 6 13 R1OUT C2- 6 15 R1OUT C2- 6 15 R1OUT V- 6 11 T1IN
V- 7 12 T1IN V- 7 14 N.C. V- 7 14 T1IN T2OUT 7 10 T2IN
T2OUT 8 11 T2IN T2OUT 8 13 T1IN T2OUT 8 13 T2IN R2IN 8 9 R2OUT
R2IN 9 10 R2OUT R2IN 9 12 T2IN R2IN 9 12 R2OUT

SO/DIP/SSOP/TSSOP
R2OUT 10 11 N.C. N.C. 10 11 N.C.
SO/DIP
TSSOP/SSOP TSSOP
TOP VIEW
N.C.
N.C.
C2+
C1+
VCC
C2-
C2+ 1 28 C1+ C2+ 1 28 C1+
V+
V-
GND 2 27 V+ C2- 2 27 V+
25
32
31
30
29
28
27
26
C2- 3 26 VCC V- 3 26 VCC
V- 4 25 C1- R1IN 4 25 GND R1IN 1 24 GND
T1OUT 5 24 T1IN R2IN 5 24 C1- R2IN 2 23 C1-

MAX3237E MAX3241E
T2OUT 6 23 T2IN R3IN 6 23 EN R3IN 3 22 EN
T3OUT 7 22 T3IN R4IN 7 22 SHDN R4IN 4 21 SHDN

MAX3241E
R1IN 8 21 R1OUT R5IN 8 21 R1OUTB R5IN 5 20 R1OUTB
R2IN 9 20 R2OUT T1OUT 9 20 R2OUTB T1OUT 6 19 R2OUTB
T4OUT 10 19 T4IN T2OUT 10 19 R1OUT T2OUT 7 18 R1OUT
R3IN 11 18 R3OUT T3OUT 11 18 R2OUT T3OUT 8 17 R2OUT
T5OUT 12 17 T5IN T3IN 12 17 R3OUT

10
11
12
13
14
15
16
9
EN 13 16 R1OUTB T2IN 13 16 R4OUT

N.C.
T3IN
T2IN
T1IN
R5OUT
R4OUT
R3OUT
N.C.
SHDN 14 15 MBAUD T1IN 14 15 R5OUT
SSOP SSOP/SO/TSSOP QFN
16 ______________________________________________________________________________________
Pin Configurations (continued)
R1OUT
R1OUT
T1OUT
T1OUT
TOP VIEW TOP VIEW
R1IN
R1IN
T1IN
T1IN
N.C.
15 14 13 12 11 12 11 10 9
GND 16 10 T2IN
GND 13 8 T2IN
VCC 17 9 N.C.
VCC 14 7 R2OUT
SHDN 18 8 R2OUT
MAX3222E MAX3232E
V+ 15 6 R2IN
EN 19 7 R2IN
EXPOSED EXPOSED
PADDLE C1+ 16 PADDLE 5 T2OUT
V+ 20 6 T2OUT
1 2 3 4 5 1 2 3 4
C1+
C1-
C2+
C2-
V-
C1-
C2+
C2-
V-
TQFN TQFN
TOP VIEW
(BUMPS ON BOTTOM)
B2: SHDN
C2: R1OUT
D2: T3IN R4OUT R5OUT R1IN R2IN
E2: T2IN
B3: EN R3OUT A1 A2 A3 A4 A5 A6 R3IN
E3: T1IN
BUMPS B4, B5, C3, C4, R2OUT B1 B2 B3 B6 R4IN
C5, D3, D4, D5, E4, AND
E5 NOT POPULATED
V- C1 C2 C6 R5IN
MAX3246E
C2- D1 D2 D6 T3OUT
C2+ E1 E2 E3 E6 T2OUT
V+ F1 F2 F3 F4 F5 F6 T1OUT
VCC C1+ C1- GND
UCSP
______________________________________________________________________________________ 17
__________________________________________________Typical Operating Circuits
+3.3V +3.3V
17 16
CBYPASS CBYPASS
VCC VCC
2 C1+ 3 1 C1+ 2
V+ C1 V+
C1 C3* C3*
0.1µF 4 0.1µF 0.1µF 3 0.1µF
C1- C1-
MAX3222E MAX3232E
5 7 4 6
C2+ V- C2+ V-
C2 C4 C2 C4
0.1µF 6 0.1µF 0.1µF 5 0.1µF
C2- C2-
12 T1IN T1OUT 15 11 T1IN T1OUT 14
TTL/CMOS RS-232 TTL/CMOS RS-232

INPUTS OUTPUTS INPUTS OUTPUTS
13 R1OUT R1IN 14 12 R1OUT R1IN 13
TTL/CMOS 5kΩ RS-232 TTL/CMOS 5kΩ RS-232

OUTPUTS INPUTS OUTPUTS INPUTS
10 R2OUT R2IN 9 9 R2OUT R2IN 8
1 EN 5kΩ 5kΩ
18
SHDN
GND GND
16
15
*C3 CAN BE RETURNED TO EITHER VCC OR GROUND.

NOTE: PIN NUMBERS REFER TO SO/DIP PACKAGES.
MAX3222E PINOUT REFERS TO SO/DIP PACKAGES.
MAX3232E PINOUT REFERS TO TSSOP/SSOP/SO/DIP/ PACKAGES
SEE TABLE 2 FOR CAPACITOR SELECTION.
18 ______________________________________________________________________________________
_____________________________________Typical Operating Circuits (continued)
+3.3V +3.3V
CBYPASS CBYPASS
26 26
VCC VCC
28 C1+ 27 28 C1+ 27
V+ C3* C1 V+
0.1µF
25 0.1µF 24 C3*
C1- 0.1µF C1- 0.1µF
MAX3237E MAX3241E
1 4 1 3
C2+ V- C2+ V-
C2
0.1µF 0.1µF C4
3 0.1µF 2
C2- C2- 0.1µF

T1
23 T2IN T2
T2OUT 6
TTL/CMOS 13 T2IN T2OUT 10 RS-232
INPUTS OUTPUTS
LOGIC 22 T3IN T3OUT 7 RS-232 12 T3IN T3OUT 11
T3 OUTPUTS
INPUTS
21 R1OUTB
19 T4IN T4OUT 10
T4
20 R2OUTB
17 T5IN T5OUT 12
T5
19 R1OUT R1IN 4
16 R1OUTB
5kΩ
18 R2OUT R2IN 5
21 R1OUT R1 R1IN 8
5kΩ
5kΩ TTL/CMOS
OUTPUTS
17 R3OUT R3IN 6 RS-232
20 R2OUT R2IN 9 RS-232 INPUTS
LOGIC R2 INPUTS 5kΩ
OUTPUTS
5kΩ
16 R4OUT R4IN 7
18 R3OUT R3 R3IN 11
5kΩ
5kΩ
15 R5OUT R5IN 8
MBAUD 15 5kΩ
13 EN
14 23 EN
SHDN SHDN 22
GND GND
2 25
______________________________________________________________________________________ 19
_____________________________________Typical Operating Circuits (continued)
+3.3V
CBYPASS
F2
VCC
F3 C1+ F1
C1 V+
0.1µF F4 C3*
C1- 0.1µF
MAX3246E
E1 C1
C2+ V-
C2
C4
0.1µF D1
C2- 0.1µF
E3 T1IN T1OUT F6
TTL/CMOS E2 T2IN T2OUT E6 RS-232

INPUTS OUTPUTS
D2 T3IN T3OUT D6
C2 R1OUT R1IN A4
5kΩ
B1 R2OUT R2IN A5
5kΩ
TTL/CMOS A1 R3OUT R3IN A6 RS-232

OUTPUTS INPUTS
5kΩ
A2 R4OUT R4IN B6
5kΩ
A3 R5OUT R5IN C6
5kΩ
B3 EN
SHDN B2
GND
F5
20 ______________________________________________________________________________________
Selector Guide Ordering Information (continued)
NO. OF GUARANTEED PIN- PKG
LOW-POWER PART TEMP RANGE PACKAGE
PART DRIVERS/ DATA RATE CODE
SHUTDOWN
RECEIVERS (bps)
16 Thin QFN-
MAX3222E 2/2 ✔ 250k MAX3232ECTE 0°C to +70°C EP** (5mm x T1655-2
MAX3232E 2/2 — 250k 5mm)
MAX3232ECUE 0°C to +70°C 16 TSSOP —
MAX3237E
5/3 ✔ 250k MAX3232ECUP 0°C to +70°C 20 TSSOP —
(Normal)
MAX3232EEAE -40°C to +85°C 16 SSOP —
MAX3237E
5/3 ✔ 1M MAX3232EEWE -40°C to +85°C 16 Wide SO —
(MegaBaud)
MAX3241E 3/5 ✔ 250k MAX3232EEPE -40°C to +85°C 16 Plastic DIP —
16 Thin QFN-
MAX3246E 3/5 ✔ 250k
MAX3232EETE -40°C to +85°C EP** (5mm x T1655-2
5mm)
MAX3232EEUE -40°C to +85°C 16 TSSOP —
___________________ Chip Information
MAX3232EEUP -40°C to +85°C 20 TSSOP —
TRANSISTOR COUNT:
MAX3237ECAI 0°C to +70°C 28 SSOP —
MAX3222E/MAX3232E: 1129
MAX3237EEAI -40°C to +85°C 28 SSOP —
MAX3237E: 2110
MAX3241ECAI 0°C to +70°C 28 SSOP —
MAX3241E: 1335 MAX3241ECWI 0°C to +70°C 28 Wide SO —
MAX3246E: 842 MAX3241ECUI 0°C to +70°C 28 TSSOP —
PROCESS: BICMOS MAX3241ECTJ 0°C to +70°C 32 Thin QFN —
MAX3241EEAI -40°C to +85°C 28 SSOP —
MAX3241EEWI -40°C to +85°C 28 Wide SO —
MAX3241EEUI -40°C to +85°C 28 TSSOP —
MAX3246ECBX-T 0°C to +70°C 6 x 6 UCSP† —
MAX3246EEBX-T -40°C to +85°C 6 x 6 UCSP† —
†Requires solder temperature profile described in the Absolute
Maximum Ratings section. UCSP Reliability is integrally linked
to the user’s assembly methods, circuit board material, and
environment. Refer to the UCSP Reliability Notice in the UCSP
Reliability section of this datasheet for more information.
**EP = Exposed paddle.
______________________________________________________________________________________ 21
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
24L QFN THIN.EPS

PACKAGE OUTLINE,
12, 16, 20, 24, 28L THIN QFN, 4x4x0.8mm
1
21-0139 E 2
PACKAGE OUTLINE,
12, 16, 20, 24, 28L THIN QFN, 4x4x0.8mm
2
21-0139 E 2
22 ______________________________________________________________________________________
Package Information (continued)
TSSOP4.40mm.EPS
PACKAGE OUTLINE, TSSOP 4.40mm BODY
1
21-0066 I 1
______________________________________________________________________________________ 23
36L,UCSP.EPS
PACKAGE OUTLINE, 6x6 UCSP
1
21-0082 K 1
24 ______________________________________________________________________________________
SOICW.EPS
INCHES MILLIMETERS
N DIM MIN MAX MIN MAX
A 0.093 0.104 2.35 2.65
A1 0.004 0.012 0.10 0.30
B 0.014 0.019 0.35 0.49
C 0.009 0.013 0.23 0.32
e 0.050 1.27
E H
E 0.291 0.299 7.40 7.60
H 0.394 0.419 10.00 10.65
L 0.016 0.050 0.40 1.27
VARIATIONS:
1
INCHES MILLIMETERS
TOP VIEW DIM MIN MAX MIN MAX N MS013
D 0.398 0.413 10.10 10.50 16 AA
D 0.447 0.463 11.35 11.75 18 AB
D 0.496 0.512 12.60 13.00 20 AC
D 0.598 0.614 15.20 15.60 24 AD
D D 0.697 0.713 17.70 18.10 28 AE
A C
e B A1 0∞-8∞
L
FRONT VIEW
SIDE VIEW
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, .300" SOIC

APPROVAL DOCUMENT CONTROL NO. REV.
1
21-0042 B 1
SSOP.EPS
2 1
INCHES MILLIMETERS
DIM MIN MAX MIN MAX INCHES MILLIMETERS
A 0.068 0.078 1.73 1.99 MIN MAX MIN MAX N
A1 0.002 0.008 0.05 0.21 D 0.239 0.249 6.07 6.33 14L
B 0.010 0.015 0.25 0.38 D 0.239 0.249 6.07 6.33 16L
C 0.004 0.008 0.09 0.20 D 0.278 0.289 7.07 7.33 20L
E H D SEE VARIATIONS D 0.317 0.328 8.07 8.33 24L
D 0.397 0.407 10.07 10.33 28L
E 0.205 0.212 5.20 5.38
e 0.0256 BSC 0.65 BSC
H 0.301 0.311 7.65 7.90
L 0.025 0.037 0.63 0.95
0∞ 8∞ 0∞ 8∞
C
B
e A1 L
NOTES:
1. D&E DO NOT INCLUDE MOLD FLASH.
2. MOLD FLASH OR PROTRUSIONS NOT TO EXCEED .15 MM (.006").
PROPRIETARY INFORMATION
3. CONTROLLING DIMENSION: MILLIMETERS. TITLE:
4. MEETS JEDEC MO150. PACKAGE OUTLINE, SSOP, 5.3 MM

5. LEADS TO BE COPLANAR WITHIN 0.10 MM. APPROVAL DOCUMENT CONTROL NO. REV.
1
21-0056 C 1
______________________________________________________________________________________ 25
PDIPN.EPS
Revision History
Pages changed at Rev 10: 1–4, 9, 11, 21, 22, 26
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
26 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2006 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.

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19-1298; Rev 10; 1/06

±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,

________________________________________________________________ Maxim Integrated Products 1

PARAMETER CONDITIONS MIN TYP MAX UNITS

PARAMETER CONDITIONS MIN TYP MAX UNITS

VCC = +3.3V, CL = 150pF MBAUD = GND 6 30

SUPPLY CURRENT (mA)

MAX3237E MAX3237E MAX3237E

SUPPLY CURRENT (mA)

8 SLEW RATE (V/µs)

Receiver Enable. Active

20 3 3 15 2 3 27 27 27 F1 V+ +5.5V Generated by the

-5.5V Generated by the

17 17 19 14 16 19 26 26 26 F2 VCC +3.0V to +5.5V Supply

18 18 20 — — — 14* 22 21 B2 Shutdown Control. Active

C1+ VCC C1+ VCC

MINIMUM SLEW-RATE TEST CIRCUIT MAXIMUM SLEW-RATE TEST CIRCUIT

Figure 1. Slew-Rate Test Circuits

Detailed Description into a high-impedance state when the device is in shut-

HIGH- DEVICE- 36.8%

LIMIT RESISTOR RESISTANCE

TRANSMITTER OUTPUT VOLTAGE (V)

Figure 6a. MAX3241E Transmitter Output Voltage vs. Load

18 R2OUT 5kΩ R2IN 5

17 R3OUT 5kΩ R3IN 6

16 R4OUT 5kΩ R4IN 7

Figure 6b. Mouse Driver Test Circuit

Applications Information excessively with temperature. If in doubt, use capaci-

from Shutdown of V- exceeds approximately -3.0V.

Figure 8. MAX3241E Loopback Test Result at 120kbps

Table 4. Reliability Test Data

EN 1 18 SHDN EN 1 20 SHDN N.C. 1 20 N.C. C1+ 1 16 VCC

T2OUT 8 11 T2IN T2OUT 8 13 T1IN T2OUT 8 13 T2IN R2IN 8 9 R2OUT

R2IN 9 10 R2OUT R2IN 9 12 T2IN R2IN 9 12 R2OUT

V- 4 25 C1- R1IN 4 25 GND R1IN 1 24 GND

T1OUT 5 24 T1IN R2IN 5 24 C1- R2IN 2 23 C1-

T3OUT 7 22 T3IN R4IN 7 22 SHDN R4IN 4 21 SHDN

R2IN 9 20 R2OUT T1OUT 9 20 R2OUTB T1OUT 6 19 R2OUTB

T4OUT 10 19 T4IN T2OUT 10 19 R1OUT T2OUT 7 18 R1OUT

R3IN 11 18 R3OUT T3OUT 11 18 R2OUT T3OUT 8 17 R2OUT

T5OUT 12 17 T5IN T3IN 12 17 R3OUT

EN 13 16 R1OUTB T2IN 13 16 R4OUT

SHDN 14 15 MBAUD T1IN 14 15 R5OUT

SSOP SSOP/SO/TSSOP QFN

VCC C1+ C1- GND

TTL/CMOS RS-232 TTL/CMOS RS-232

13 R1OUT R1IN 14 12 R1OUT R1IN 13

TTL/CMOS 5kΩ RS-232 TTL/CMOS 5kΩ RS-232

*C3 CAN BE RETURNED TO EITHER VCC OR GROUND.

24 T1IN T1OUT 5 14 T1IN T1OUT 9

*C3 CAN BE RETURNED TO EITHER VCC OR GROUND.

TTL/CMOS E2 T2IN T2OUT E6 RS-232

TTL/CMOS A1 R3OUT R3IN A6 RS-232

*C3 CAN BE RETURNED TO EITHER VCC OR GROUND.

24L QFN THIN.EPS

PACKAGE OUTLINE, .300" SOIC

4. MEETS JEDEC MO150. PACKAGE OUTLINE, SSOP, 5.3 MM

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