SIC654
SIC654
SIC654
www.vishay.com
Vishay Siliconix
50 A VRPower® Integrated Power Stage
(Datasheet in Brief)
DESCRIPTION FEATURES
The SiC654 and SiC654A are high frequency integrated • Highly efficient
power stage optimized for synchronous buck applications - Thermally enhanced PowerPAK® MLP55-31L package
to offer high current, high efficiency, and high power density - Vishay’s latest TrenchFET technology and low side
performance with very low shutdown current. Packaged in MOSFET with integrated Schottky diode
Vishay’s 5 mm x 5 mm MLP package, SiC654 and SiC654A - Integrated, low impedance, bootstrap switch
enable voltage regulator designs to deliver up to 50 A - Power MOSFETs optimized for 19 V input stage
continuous current per phase. - Supports PS4 mode light load requirement with low
shutdown supply current (5 V, 3 μA)
The internal power MOSFETs utilize Vishay’s latest - Zero current detection for improved light load efficiency
TrenchFET® technology that delivers industry benchmark • Highly versatile
performance to significantly reduce switching and - 5 V and 3.3 V PWM logic with tri-state and hold-off timer
conduction losses. - 5 V DSBL#, ZCD_EN# logic with PS4 state support
- High frequency operation up to 2 MHz
The SiC654 and SiC654A incorporates an advanced • Robust and reliable
MOSFET gate driver IC that features high current driving - Delivers in excess of 50 A continuous current,
capability, adaptive dead-time control, an integrated 70 A, peak (10 ms) and 100 A, peak (10 μs)
bootstrap switch, and user selectable zero current detection - Over current protection
to improve light load efficiency. The driver is also compatible - Over temperature flag
with a wide range of PWM controllers, supports tri-state - Over temperature protection
PWM, and 5 V / 3.3 V PWM logic. - Under-voltage lockout protection
- High side MOSFET short detection
The device also supports PS4 mode to reduce power • Effective monitoring and reporting
consumption when the system is in standby state. - Accurate temperature reporting
- Warnings and faults reporting flag
The SiC654 and SiC654A offer operating temperature • Material categorization: for definitions of compliance
monitoring, protection features, and warning flags that please see www.vishay.com/doc?99912
improve system monitoring and reliability.
APPLICATIONS
• Multi-phase VRDs for computing, graphics card and
memory
• Intel core processor power delivery
- VCORE, VGRAPHICS, VSYSTEM AGENT
- VCCGI
• Up to 24 V rail input DC/DC VR modules
TYPICAL APPLICATION DIAGRAM
5V VIN
VIN_S
VCC
V IN
BOOT
PHASE
ZCD_EN#
VSWH
DSBL# Gate VOUT
PWM
controller driver
PWM
TMON/FAULT
C GND
PGND
GL
PRODUCT SUMMARY
Part number SiC654 SiC654A
50 A Power stage plus, 2.5 V to 24 Vin, 5 V PWM with 50 A Power stage plus, 2.5 V to 24 Vin, 3.3 V PWM
Description
ZCD mode with ZCD mode
Input voltage min. (V) 2.5 2.5
Input voltage max. (V) 24 24
Current rating (A) 50i 50
Switch frequency max. (kHz) 2000 2000
Enable (yes / no) Yes Yes
Monitoring features TMON/FAULT Monitor TMON/FAULT Monitor
Protection OCP, OTP, UVLO OCP, OTP, UVLO
Light load mode ZCD ZCD
Pulse-width modulation (V) 5 3.3
Package type PowerPAK® MLP55-31L PowerPAK® MLP55-31L
Package size (W, L, H) (mm) 5 x 5 x 0.75 5 x 5 x 0.75
Status code 1 1
Product type VRPower (DrMOS) VRPower (DrMOS)
• Multi-phase VRDs for computing, graphics • Multi-phase VRDs for computing, graphics card
card and memory and memory
Applications
• Intel core processor power delivery • Intel core processor power delivery
• Up to 24 V rail input DC/DC VR modules • Up to 24 V rail input DC/DC VR modules
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and
F2
2x D2-4
F1
A2
K8
0.10 C B 24 31
E2-4
K11
23 1
K5 E2- 1
F3
0.10 M C A B
K6
K3
K10
MLP55-31L
0.05 M C
(5 mm x 5 mm) e1/3x
E
E2- 3
E2- 2
e/25x
3
b 16 8
B 31x
L
b1
31x 15 9
K2
C D2- 3 D2- 2
K9
e2 e3
MILLIMETERS INCHES
DIM.
MIN. NOM. MAX. MIN. NOM. MAX.
A 0.70 0.75 0.80 0.027 0.029 0.031
A1 0.00 - 0.05 0.000 - 0.002
A2 0.20 ref. 0.008 ref.
b 0.20 0.25 0.30 0.078 0.098 0.011
b1 0.15 0.20 0.25 0.006 0.008 0.010
D 4.90 5.00 5.10 0.193 0.196 0.200
e 0.50 BSC 0.019 BSC
e1 3.50 BSC 0.138 BSC
e2 1.50 BSC 0.060 BSC
e3 1.00 BSC 0.040 BSC
E 4.90 5.00 5.10 0.193 0.196 0.200
L 0.35 0.40 0.45 0.013 0.015 0.017
D2-1 0.98 1.03 1.08 0.039 0.041 0.043
D2-2 0.98 1.03 1.08 0.039 0.041 0.043
D2-3 1.87 1.92 1.97 0.074 0.076 0.078
D2-4 0.30 BSC 0.012 BSC
D2-5 1.05 1.10 1.15 0.041 0.043 0.045
E2-1 1.27 1.32 1.37 0.050 0.052 0.054
E2-2 1.93 1.98 2.03 0.076 0.078 0.080
E2-3 3.75 3.80 3.85 0.148 0.150 0.152
E2-4 0.45 BSC 0.018 BSC
F1 0.15 0.20 0.25 0.006 0.008 0.010
F2 0.20 ref. 0.008 ref.
F3 0.15 ref. 0.006 ref.
Notes
1. Use millimeters as the primary measurement
2. Dimensioning and tolerances conform to ASME Y14.5M. - 1994
3. Dimension b applies to plated terminal and is measured between 0.20 mm and 0.25 mm from terminal tip
4. The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other feature of package body
5. Exact shape and size of this feature is optional
6. Package warpage max. 0.08 mm
7. Applied only for terminals
0.75
1.35 0.57
0.3
0.33
3.4
(D2-1) (D2-5) 31 0.5 1 24
31 1.03 1.05 24
0.75
1 (D3) 0.3
23 1.13
1 23
1.6
0.45
(E3)
0.85
0.3
0.5 (e)
0.35
(E2-2)
1.15
1.42
1.32
0.15
0.33
(K2) 0.22 2.02
1.75 0.3
(E2-1)
0.4
4.2
(K1) 0.67
3.5
5
3.05
0.07
0.25
2.15
(E2-3)
(b)
2.08
1.98
0.5
8 16 8 0.35 0.18 16
0.58
0.65
(L) 9 15 (L) 0.3
0.4 (D2-2) (D2-3) 0.4 9 15
0.35
0.3
1.03 1.92 0.35 0.5 0.75
0.5 0.65
31 24
1 23
33
Component for MLP55-31L
32
8 16
9 15
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