lm139

LM139, LM239, LM339, LM339B, LM139A, LM239A
LM339A, LM2901B, LM2901, LM2901AV, LM2901V

SLCS006X – OCTOBER 1979 – REVISED OCTOBER 2023
LM339B, LM2901B, LM339, LM239, LM139, LM2901 Quad Differential Comparators
1 Features 3 Description
• NEW LM339B and LM2901B The LM339B and LM2901B devices are the
• Improved specifications of B-version next generation versions of the industry-standard
– Maximum rating: up to 38 V LM339 and LM2901 comparator family. These next
– ESD rating (HBM): 2k V generation B-version comparators feature lower offset
– Low input offset: 0.37 mV voltage, higher supply voltage capability, lower supply
– Low input bias current: 3.5 nA current, lower input bias current, lower propagation
– Low supply-current: 200 µA per comparator delay, and improved 2 kV ESD performance and
– Faster response time of 1 µsec input ruggedness through dedicated ESD clamps.
– Extended temperature range for LM339B The LM339B and LM2901B can drop-in replace the
• B-version is drop-in replacement for LM239, LM239, LM339 and LM2901, for both "A" and "V"
LM339 and LM2901, A and V versions grades.
• Common-mode input voltage range includes All devices consist of four independent voltage
ground comparators that are designed to operate from a
• Differential input voltage range equal to maximum- single power supply over a wide range of voltages.
rated supply voltage: ±38 V
• Low output saturation voltage Device Information
• Output compatible with TTL, MOS, and CMOS PART NUMBER PACKAGE (1) BODY SIZE (NOM)
• For single version, see the TL331B LM139x CDIP (14) 21.30 mm × 7.60 mm
• For dual version, see the LM393B or LM2903B LM139x, LM239x, LM339x,
LM2901x, LM339B, SOIC (14) 8.70 mm × 3.90 mm
2 Applications LM2901B
• Vacuum robot LM239, LM339x, LM2901 PDIP (14) 19.30 mm × 6.40 mm
• Single phase UPS LM239, LM2901, LM339B,
TSSOP (14) 5.00 mm × 4.40 mm
• Server PSU LM2901B
• Cordless power tool LM339x, LM2901, LM339B,
SO (14) 10.20 mm × 5.30 mm
• Wireless infrastructure LM2901B
• Applicances LM339x, LM339B SSOP (14) 6.50 mm × 5.30 mm
• Building automation LM2901B SOT-23 (14) 4.20 mm x 2.00 mm
• Factory automation & control
LM339B, LM2901B WQFN (16) 3.00 mm x 3.00 mm
• Motor drives
• Infotainment & cluster (1) For all available packages, see the orderable addendum at
the end of the data sheet.
Family Comparison Table
LM339 LM2901 LM2901V LM139 LM239
Specification LM339B LM2901B Units
LM339A LM2901A LM2901AV LM139A LM239A
Supply Voltage 2 to 36 2 to 36 2 to 30 2 to 30 2 to 32 2 to 30 2 to 30 V
Total Supply Current
0.8 to 1 0.8 to 1 1 to 2.5 1 to 2.5 1 to 2.5 1 to 2.5 1 to 2.5 mA
(5V to 36V max)
Temperature Range −40 to 85 −40 to 125 0 to 70 −40 to 125 −40 to 125 −55 to 125 −25 to 85 °C
ESD (HBM) 2000 2000 1000 1000 1000 1000 1000 V
Offset Voltage ±9 ± 15 ± 15 ±9 ±9
± 5.5 ± 5.5 mV
(Max over temp) ±4 ±4 ±4 ±4 ±4
Input Bias Current (typ / max) 3.5 / 25 3.5 / 25 25 / 250 25 / 250 25 / 250 25 / 100 25 / 250 nA
Response Time (typ) 1 1 1.3 1.3 1.3 1.3 1.3 µsec
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
SLCS006X – OCTOBER 1979 – REVISED OCTOBER 2023 www.ti.com
Table of Contents
1 Features............................................................................1 7.15 Switching Characteristics for LM339B and
2 Applications..................................................................... 1 LM2901B..................................................................... 14
3 Description.......................................................................1 7.16 Switching Characteristics for LMx39 and LMx39A..14
4 Revision History.............................................................. 3 7.17 Switching Characteristics for LM2901.....................14
5 Other Versions................................................................. 4 7.18 Typical Characteristics for LM339B and
6 Pin Configuration and Functions...................................5 LM2901B Only.............................................................15
7 Specifications.................................................................. 6 7.19 Typical Characteristics, Non-B Versions................. 21
7.1 Absolute Maximum Ratings for LM339B and 8 Detailed Description......................................................23
LM2901B....................................................................... 6 8.1 Overview................................................................... 23
7.2 Absolute Maximum Ratings for Non-B Versions......... 6 8.2 Functional Block Diagram......................................... 23
7.3 ESD Ratings for LM339B and LM2901B.................... 7 8.3 Feature Description...................................................23
7.4 ESD Ratings, Non-B Versions.................................... 7 8.4 Device Functional Modes..........................................23
7.5 Recommended Operating Conditions for 9 Application and Implementation.................................. 24
LM339B and LM2901B..................................................7 9.1 Application Information............................................. 24
7.6 Recommended Operating Conditions, Non-B 9.2 Typical Application.................................................... 24
Versions.........................................................................7 9.3 Power Supply Recommendations.............................26
7.7 Thermal Information for LM339B and LM2901B.........8 9.4 Layout....................................................................... 26
7.8 Thermal Information for Non-B Versions.....................8 10 Device and Documentation Support..........................27
7.9 Electrical Characteristics for LM339B......................... 9 10.1 Related Links.......................................................... 27
7.10 Electrical Characteristics for LM2901B................... 10 10.2 Receiving Notification of Documentation Updates..27
7.11 Electrical Characteristics for LM139 and LM139A...11 10.3 Support Resources................................................. 27
7.12 Electrical Characteristics for LMx39 and LMx39A.. 12 10.4 Trademarks............................................................. 27
7.13 Electrical Characteristics for LM2901, 10.5 Electrostatic Discharge Caution..............................27
LM2901V and LM2901AV........................................... 13 10.6 Glossary..................................................................27
7.14 Switching Characteristics for LM139 and 11 Mechanical, Packaging, and Orderable
LM139A....................................................................... 14 Information.................................................................... 28
2 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated
Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V
www.ti.com SLCS006X – OCTOBER 1979 – REVISED OCTOBER 2023
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision W (October 2023) to Revision X (October 2023) Page

• Added LM339B and LM2901B to Device Information Table for SOT-23/QFN....................................................1
Changes from Revision V (December 2022) to Revision W (October 2023) Page

• Updated thermal tables for new package releases.............................................................................................6
• Changed Apps Input Voltage Range text to reference appnote....................................................................... 24
Changes from Revision U (November 2018) to Revision V (December 2022) Page

• Updated the numbering format for tables, figures, and cross-references throughout the document. ............... 1
• Added "B" version throughout. Added Device Family Table. .............................................................................1
Changes from Revision T (June 2015) to Revision U (November 2018) Page

• Changed LM239x temperature range from 125°C to 85°C in Description section............................................. 1
• Changed data sheet title ....................................................................................................................................1
• Changed LM293AD to LM239AD in Device Comparison Table ........................................................................ 4
• Added Input Current and related footnote in Absolute Maximum Ratings .........................................................6
• Changed layout of Recommended Operating Conditions temperatures to separate rows.................................7
• Changed values in the Thermal Information table to align with JEDEC standards............................................ 8
• Added LM2901V and LMV2901AV to LM2901 Elect Char Table title to make more clear which devices are
covered............................................................................................................................................................. 13
• Changed "Dual" to "Quad" and removed "Absolute Maximum" wording and mention of Q100 in Overview
section text........................................................................................................................................................23
• Changed and corrected text in Feature Description section.............................................................................23
• Changed Example Values in Typical Application Design Parameters table .................................................... 24
• Added Receiving Notification of Documentation Updates section....................................................................27
Changes from Revision S (August 2012) to Revision T (June 2015) Page

• Deleted Ordering Information table. .................................................................................................................. 1
• Added Military Disclaimer to Features list.......................................................................................................... 1
• Added Applications, Device Information table, Pin Configuration and Functions section, ESD Ratings table,
Thermal Information table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section. No
specification changes......................................................................................................................................... 1
Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 3

5 Other Versions
OTHER QUALIFIED VERSIONS OF LM139-SP, LM239A, LM2901, LM2901AV, LM2901V:
• Automotive Q100: LM239A-Q1, LM2901B-Q1, LM2901-Q1, LM2901AV-Q1, LM2901V-Q1
• Enhanced Product: LM239A-EP
• Space: LM139-SP
6 Pin Configuration and Functions
OUT1
OUT2
OUT3
OUT4
1OUT 1 14 3OUT
2OUT 2 13 4OUT
16
15
14
13
VCC 3 12 GND VCC 1 12 GND
2IN– IN1± 2 11 IN4+

4 11 4IN+ Thermal
NC 3 Pad 10 NC
2IN+ 5 10 4IN–
IN1+ 4 9 IN4±
1IN– 6 9 3IN+
8
1IN+ 7 8 3IN–
IN2±
IN2+
IN3±
IN3+
Figure 6-1. D, DB, N, NS, PW, DYY, J Packages Not to scale
14-Pin SOIC, SSOP, PDIP, SO, TSSOP, SOT-23, NOTE: Connect exposed thermal pad directly to GND pin.
CDIP Figure 6-2. RTE Package
Top View 16-Pad WQFN With Exposed Thermal Pad
Top View
Table 6-1. Pin Functions

PIN
D, DB, N, I/O DESCRIPTION
NAME(1) NS, PW, WQFN
DYY, J
OUT1 (1) 1 16 Output Output pin of the comparator 2
OUT2 (1) 2 15 Output Output pin of the comparator 1
VCC 3 1 — Positive supply
IN2– (1) 4 5 Input Negative input pin of the comparator 1
IN2+ (1) 5 6 Input Positive input pin of the comparator 1
IN1– (1) 6 2 Input Negative input pin of the comparator 2
IN1+ (1) 7 4 Input Positive input pin of the comparator 2
IN3– 8 7 Input Negative input pin of the comparator 3
IN3+ 9 8 Input Positive input pin of the comparator 3
IN4– 10 9 Input Negative input pin of the comparator 4
IN4+ 11 11 Input Positive input pin of the comparator 4
GND 12 12 — Negative supply
OUT4 13 13 Output Output pin of the comparator 4
OUT3 14 14 Output Output pin of the comparator 3
NC — 3 — No Internal Connection - Leave floating or GND
NC — 10 — No Internal Connection - Leave floating or GND
Thermal Pad — PAD — Connect directly to GND pin
(1) Some manufacturers transpose the names of channels 1 & 2. Electrically the pinouts are identical, just a difference in the channel
naming convention.

7 Specifications
7.1 Absolute Maximum Ratings for LM339B and LM2901B
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage: VS = (V+) – (V–) -0.3 38 V
Differential input voltage : VID (2) ±38 V
Input pins (IN+, IN–) -0.3 38 V
Current into input pins (IN+, IN–) -50 mA
Output pin (OUT) -0.3 38 V
Output sink current 25 mA
Output short-circuit duration(3) Unlimited s
Junction temperature, TJ TBD 150 °C
Storage temperature, Tstg -65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) Differential voltages are at IN+ with respect to IN-
(3) Short circuits from outputs to V+ can cause excessive heating and eventual destruction.
7.2 Absolute Maximum Ratings for Non-B Versions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage(2) 36 V
VID Differential input voltage(3) ±36 V
VI Input voltage range (either input) –0.3 36 V
IK Input current(5) –50 mA
VO Output voltage 36 V
IO Output current 20 mA
Duration of output short circuit to ground(4) Unlimited
TJ Operating virtual-junction temperature 150 °C
Case temperature for 60 s FK package 260 °C
Lead temperature 1.6 mm (1/16 in) from case for 60 s J package 300 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground.
(3) Differential voltages are at xIN+ with respect to xIN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Input current flows through parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output to
be incorrect. Normal operation resumes when input is removed.
7.3 ESD Ratings for LM339B and LM2901B

VALUE UNIT
Electrostatic Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000

V(ESD) V
discharge Human-body model (CDM), per ANSI/ESDA/JEDEC JS-002(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process
7.4 ESD Ratings, Non-B Versions

VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.5 Recommended Operating Conditions for LM339B and LM2901B

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage: VS = (V+) – (V–) 2 36 V
Ambient temperature, TA, LM339B –40 85 °C
Ambient temperature, TA, LM2901B –40 125 °C
Input Voltage Range, VIVR (V–) – 0.1 (V+) – 2.0 V
7.6 Recommended Operating Conditions, Non-B Versions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Non-V devices 2 30 V
VCC Supply voltage
V devices 2 32 V
LM139x –55 125
LM239x –25 85
TJ Junction temperature °C
LM339x –0 70
LM2901x –40 125

7.7 Thermal Information for LM339B and LM2901B

LM339B, LM2901B
D PW DDY RUC RTE
THERMAL METRIC(1) UNIT
(SOIC) (TSSOP) (SOT-23) (QFN) (QFN)
14 PINS 14 PINS 14 PINS 14 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 111.2 136.6 67.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66.9 66.6 72.3 °C/W
RθJB Junction-to-board thermal resistance 67.8 79.8 43.1 °C/W
ψJT Junction-to-top characterization parameter 28.0 17.8 6.3 °C/W
ψJB Junction-to-board characterization parameter 67.4 79.3 42.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance - - - 26.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semicondctor and IC Package Thermal Metrics report,
SPRA953.
7.8 Thermal Information for Non-B Versions

LMx39, LM2901x
THERMAL METRIC(1) D DB N NS PW J W UNIT
(SOIC) (SSOP) (PDIP) (SO) (TSSOP) (CDIP) (CFP)
RθJA Junction-to-ambient thermal resistance 98.8 111.8 79 96.2 120 89.5 156.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 64.3 63.6 73.4 56.1 59 46.1 86.7 °C/W
RθJB Junction-to-board thermal resistance 59.7 60.5 58.7 56.9 68.8 78.7 154.6 °C/W
ψJT Junction-to-top characterization parameter 25.7 26.2 48.3 24.8 9.9 3 56.5 °C/W
Junction-to-board characterization
ψJB 59.3 59.8 58.5 56.4 68.2 71.8 133.5 °C/W
parameter
RθJC(bot) Junction-to-case (bottom) thermal
— — — — — 24.2 14.3 °C/W
resistance
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.9 Electrical Characteristics for LM339B

VS = 5 V, VCM = (V–) ; TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VS = 5 to 36V –3.5 ±0.37 3.5
VIO Input offset voltage mV
VS = 5 to 36V, TA = –40°C to +85°C –5.5 5.5
–3.5 –25 nA
IB Input bias current
TA = –40°C to +85°C –50 nA
–25 ±0.5 25 nA
IOS Input offset current
TA = –40°C to +85°C –50 50 nA
VS = 3 to 36V (V–) (V+) – 1.5 V
VCM Common mode range (1)
VS = 3 to 36V, TA = –40°C to +85°C (V–) (V+) – 2.0 V
Large signal differential VS = 15V, VO = 1.4V to 11.4V;
AVD 50 200 V/mV
voltage amplification (2) RL ≥ 15k to (V+)
ISINK ≤ 4mA, VID = -1V 110 400 mV
Low level output Voltage
VOL ISINK ≤ 4mA, VID = -1V
{swing from (V–)} 550 mV
TA = –40°C to +85°C
(V+) = VO = 5 V; VID = 1V 0.1 50 nA
IOH-LKG High-level output leakage current
(V+) = VO = 36V; VID = 1V 100 nA
IOL Low level output current VOL = 1.5V; VID = -1V; VS = 5V 6 21 mA
VS = 5 V, no load 0.8 1.2 mA
IQ Quiescent current (all comparators)
VS = 36 V, no load, TA = –40°C to +85°C 1 1.6 mA
(1) The voltage at either input should not be allowed to go negative by more than 0.3 V otherwise output may be incorrect and excessive
input current can flow. The upper end of the common-mode voltage range is limited by VCC – 2V. However only one input needs to be
in the valid common mode range, the other input can go up the maximum VCC level and the comparator provides a proper output state.
Either or both inputs can go to maximum VCC level without damage.
(2) This parameter is ensured by design and/or characterization and is not tested in production.

7.10 Electrical Characteristics for LM2901B

VS = 5 V, VCM = (V–) ; TA = 25°C (unless otherwise noted).
VS = 5 to 36V –3.5 ±0.37 3.5
VIO Input offset voltage mV
VS = 5 to 36V, TA = –40°C to +125°C –5.5 5.5
–3.5 –25 nA
IB Input bias current
TA = –40°C to +125°C –50 nA
–25 ±0.5 25 nA
IOS Input offset current
TA = –40°C to +125°C –50 50 nA
VS = 3 to 36V (V–) (V+) – 1.5 V
VCM Common mode range (1)
VS = 3 to 36V, TA = –40°C to +125°C (V–) (V+) – 2.0 V
Large signal differential VS = 15V, VO = 1.4V to 11.4V;
AVD 50 200 V/mV
voltage amplification (2) RL ≥ 15k to (V+)
ISINK ≤ 4mA, VID = -1V 110 400 mV
Low level output Voltage
VOL ISINK ≤ 4mA, VID = -1V
{swing from (V–)} 550 mV
TA = –40°C to +125°C
(V+) = VO = 5 V; VID = 1V 0.1 50 nA
IOH-LKG High-level output leakage current
(V+) = VO = 36V; VID = 1V 100 nA
IOL Low level output current VOL = 1.5V; VID = -1V; VS = 5V 6 21 mA
VS = 5 V, no load 0.8 1.2 mA
IQ Quiescent current (all comparators)
VS = 36 V, no load, TA = –40°C to +125°C 1 1.6 mA
(1) The voltage at either input should not be allowed to go negative by more than 0.3 V otherwise output may be incorrect and excessive
input current can flow. The upper end of the common-mode voltage range is limited by VCC – 2V. However only one input needs to be
in the valid common mode range, the other input can go up the maximum VCC level and the comparator provides a proper output state.
Either or both inputs can go to maximum VCC level without damage.
(2) This parameter is ensured by design and/or characterization and is not tested in production.
7.11 Electrical Characteristics for LM139 and LM139A

at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM139 LM139A
PARAMETER TEST CONDITIONS(1) TA (2) UNIT
MIN TYP MAX MIN TYP MAX
VCC = 5 V to 30 V, 25°C 2 5 1 2
VIO Input offset voltage VIC = VICR min, mV
VO = 1.4 V Full range 9 4
25°C 3 25 3 25
IIO Input offset current VO = 1.4 V nA
Full range 100 100
25°C –25 –100 –25 –100
IIB Input bias current VO = 1.4 V nA
Full range –300 –300
0 to 0 to
25°C
Common-mode input- VCC – 1.5 VCC – 1.5
VICR V
voltage range(3) 0 to 0 to
Full range
VCC – 2 VCC – 2
Large-signal differential- VCC+ = ±7.5 V,
AVD 25°C 200 50 200 V/mV
voltage amplification VO = –5 V to 5 V
VOH = 5 V 25°C 0.1 0.1 nA
IOH High-level output current VID = 1 V
VOH = 30 V Full range 1 1 μA
25°C 150 400 150 400
VOL Low-level output voltage VID = –1 V, IOL = 4 mA mV
Full range 700 700
IOL Low-level output current VID = –1 V, VOL = 1.5 V 25°C 6 16 6 16 mA
Supply current
ICC VO = 2.5 V, No load 25°C 0.8 2 0.8 2 mA
(four comparators)
(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
(2) Full range (MIN to MAX) for LM139 and LM139A is –55°C to +125°C. All characteristics are measured with zero common-mode input
voltage, unless otherwise specified.
(3) The voltage at either input or common-mode must not be allowed to go negative by more than 0.3 V. The upper end of the
common-mode voltage range is VCC+ – 1.5 V; however, one input can exceed VCC, and the comparator will provide a proper output
state as long as the other input remains in the common-mode range. Either or both inputs can go to 30 V without damage.

7.12 Electrical Characteristics for LMx39 and LMx39A

LM239 LM239A
PARAMETER TEST CONDITIONS(1) TA (2) LM339 LM339A UNIT
MIN TYP MAX MIN TYP MAX
VCC = 5 V to 30 V, 25°C 2 5 1 3
VIO Input offset voltage VIC = VICR min, mV
VO = 1.4 V Full range 9 4
25°C 5 50 5 50
Full range 150 150
25°C –25 –250 –25 –250
Full range –400 –400
0 to 0 to
25°C
Common-mode input- VCC – 1.5 VCC – 1.5
VICR V
voltage range(3) 0 to 0 to
Full range
VCC – 2 VCC – 2
VCC = 15 V,
Large-signal differential-
AVD VO = 1.4 V to 11.4 V, 25°C 50 200 50 200 V/mV
voltage amplification
RL ≥ 15 kΩ to VCC
VOH = 5 V 25°C 0.1 50 0.1 50 nA
VOH = 30 V Full range 1 1 μA
25°C 150 400 150 400
VOL Low-level output voltage VID = –1 V, IOL = 4 mA mV
Full range 700 700
IOL Low-level output current VID = –1 V, VOL = 1.5 V 25°C 6 16 6 16 mA
Supply current
ICC VO = 2.5 V, No load 25°C 0.8 2 0.8 2 mA
(four comparators)
(2) Full range (MIN to MAX) for LM239/LM239A is –25°C to +85°C, and for LM339/LM339A is 0°C to 70°C. All characteristics are
measured with zero common-mode input voltage, unless otherwise specified.
state as long as the other input remains in the common-mode range. Either or both inputs can go to 30 V without damage.
7.13 Electrical Characteristics for LM2901, LM2901V and LM2901AV

LM2901
PARAMETER TEST CONDITIONS(1) TA (2) UNIT
MIN TYP MAX
25°C 2 7
Non-A devices
VIC = VICR min, Full range 15
VIO Input offset voltage VO = 1.4 V, mV
VCC = 5 V to MAX(3) 25°C 1 2
A-suffix devices
Full range 4
25°C 5 50
Full range 200
25°C –25 –250
Full range –500
0 to
25°C
Common-mode input- VCC – 1.5
VICR V
voltage range(4) 0 to
Full range
VCC – 2
Large-signal differential- VCC = 15 V, VO = 1.4 V to 11.4 V,
AVD 25°C 25 100 V/mV
voltage amplification RL ≥ 15 kΩ to VCC
VOH = 5 V 25°C 0.1 50 nA
VOH = VCC MAX(3) Full range 1 μA
Non-V devices 150 500
VID = –1 V, 25°C
VOL Low-level output voltage V-suffix devices 150 400 mV
IOL = 4 mA
All devices Full range 700
IOL Low-level output current VID = –1 V, VOL = 1.5 V 25°C 6 16 mA
Supply current VO = 2.5 V, VCC = 5 V 0.8 2

ICC 25°C mA
(four comparators) No load VCC = MAX(3) 1 2.5
(2) Full range (MIN to MAX) for LM2901 is –40°C to +125°C. All characteristics are measured with zero common-mode input voltage,
unless otherwise specified.
(3) VCC MAX = 30 V for non-V devices, and 32 V for V-suffix devices
state as long as the other input remains in the common-mode range. Either or both inputs can go to VCC MAX without damage.

7.14 Switching Characteristics for LM139 and LM139A

VCC = 5 V, TA = 25°C
LM139
PARAMETER TEST CONDITIONS LM139A UNIT
TYP
RL connected to 5 V through 5.1 kΩ, 100-mV input step with 5-mV overdrive 1.3
Response time μs
CL = 15 pF(1) (2) TTL-level input step 0.3
(1) CL includes probe and jig capacitance.

(2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
7.15 Switching Characteristics for LM339B and LM2901B

VS = 5V, VO_PULLUP = 5V, VCM = VS/2, CL = 15pF, RL = 5.1k Ohm, TA = 25°C (unless otherwise noted).
Propagation delay time, high-to-low;
tresponse Input overdrive = 5mV, Input step = 100mV 1000 ns
Small scale input signal (1)
Propagation delay time, high-to-low;
tresponse TTL input with Vref = 1.4V 300 ns
TTL input signal (1)
(1) High-to-low and low-to-high refers to the transition at the input.
7.16 Switching Characteristics for LMx39 and LMx39A

VCC = 5 V, TA = 25°C
LM239
LM239A
PARAMETER TEST CONDITIONS LM339 UNIT
LM339A
TYP
Response time μs

7.17 Switching Characteristics for LM2901

VCC = 5 V, TA = 25°C
LM2901
PARAMETER TEST CONDITIONS UNIT
TYP
Response time μs

7.18 Typical Characteristics for LM339B and LM2901B Only

TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
1100 1000
No Load, Output High
900
1000
800
Total Supply Current (uA)
Total Supply Current (A)

900
700
800 600
700 500
400
600 -40°C
-40°C 300 0°C
25°C 25°C
500 85°C 200 85°C
125°C VS=3V 125°C
400 100
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 -0.5 -0.25 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2
Supply Voltage (V) Input Voltage (V)
Figure 7-1. Total Supply Current vs. Supply Voltage Figure 7-2. Total Supply Current vs. Input Voltage at 3V
1000 1000
900 900
800 800
700 700
600 600
500 500
400 400
-40°C -40°C
300 0°C 300 0°C
25°C 25°C
200 85°C 200 85°C
VS=3.3V 125°C VVSS=12V
=5V
=3V 125°C
100 100
-0.5 -0.25 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 -0.5 -0.25 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2
Input Voltage (V) Input Voltage (V)
Figure 7-3. Total Supply Current vs. Input Voltage at 3.3V Figure 7-4. Total Supply Current vs. Input Voltage at 5V
1000 1100
900 1000
800 900
700 800
600 700
500 600
400 500
-40°C -40°C
300 0°C 400 0°C
25°C 25°C
200 85°C 300 85°C
VS=12V 125°C VS=36V 125°C
100 200
-1 0 1 2 3 4 5 6 7 8 9 10 11 0 3 6 9 12 15 18 21 24 27 30 33 36
Figure 7-5. Total Supply Current vs. Input Voltage at 12V Figure 7-6. Total Supply Current vs. Input Voltage at 36V

7.18 Typical Characteristics for LM339B and LM2901B Only (continued)

noted.
2 2
1.5 1.5
Input Offset Voltage (mV)

1 1
0.5 0.5
0 0
-0.5 -0.5
-1 -1
-1.5 VS = 3V -1.5 VS = 5V
63 Channels 62 Channels
-2 -2
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)
Figure 7-7. Input Offset Voltage vs. Temperature at 3V Figure 7-8. Input Offset Voltage vs. Temperature at 5V
2 2
1.5 1.5
1 1
0.5 0.5
0 0
-0.5 -0.5
-1 -1
-1.5 VS = 12V -1.5 VS = 36V

-2 -2
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Figure 7-9. Input Offset Voltage vs. Temperature at 12V Figure 7-10. Input Offset Voltage vs. Temperature at 36
2 2
1.5 1.5
1 1
0.5 0.5
0 0
-0.5 -0.5
-1 -1
-1.5 TA = -40°C -1.5 TA = 25°C

-2 -2
3 6 9 12 15 18 21 24 27 30 33 36 3 6 9 12 15 18 21 24 27 30 33 36
Supply Voltage (V) Supply Voltage (V)
Figure 7-11. Input Offset Voltage vs. Supply Voltage at -40°C Figure 7-12. Input Offset Voltage vs. Supply Voltage at 25°C

noted.
2 2
1.5 1.5

1 1
0.5 0.5
0 0
-0.5 -0.5
-1 -1
-1.5 TA = 85°C -1.5 TA = 125qC

-2 -2
3 6 9 12 15 18 21 24 27 30 33 36 3 6 9 12 15 18 21 24 27 30 33 36
Supply Voltage (V) Supply Voltage (V)
Figure 7-13. Input Offset Voltage vs. Supply Voltage at 85°C Figure 7-14. Input Offset Voltage vs. Supply Voltage at 125°C
0 0
VCM=0V 125°C VS=5V
-0.5 85°C -0.5
-1 25°C -1
0°C
Input Bias Current (nA)
-1.5 -40°C -1.5

-2 -2
-2.5 -2.5
-3 -3
-3.5 -3.5 125°C
85°C
-4 -4 25°C
0°C
-4.5 -4.5
-40°C
-5 -5
3 6 9 12 15 18 21 24 27 30 33 36 -0.5 0 0.5 1 1.5 2 2.5 3 3.5
Supply Voltage (V) Input Voltage (V)
Figure 7-15. Input Bias Current vs. Supply Voltage Figure 7-16. Input Bias Current vs. Input Voltage at 5V
0 1
-0.5 VS=12V 0.5 VS=36V
0
-1
-0.5
-1.5
-1
-2 -1.5
-2.5 -2
-3 -2.5
-3.5 125°C -3
125°C
85°C -3.5 85°C
-4 25°C 25°C
-4
0°C 0°C
-4.5
-40°C -4.5 -40°C
-5 -5
-0.5 0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 10.5 0 4 8 12 16 20 24 28 32 36
Figure 7-17. Input Bias Current vs. Input Voltage at 12V Figure 7-18. Input Bias Current vs. Input Voltage at 36V


noted.
10 10
VS = 3V VS = 5V
Output Voltage to GND (V)

1 1
100m 100m
125°C 125°C
10m 85°C 10m 85°C
25°C 25°C
0°C 0°C
-40°C -40°C
1m 1m
10P 100P 1m 10m 100m 10P 100P 1m 10m 100m
Output Sinking Current (A) Output Sinking Current (A)
Figure 7-19. Output Low Voltage vs. Output Sinking Current at Figure 7-20. Output Low Voltage vs. Output Sinking Current at
3V 5V
10 10
VS = 12V VS = 36V
1 1
100m 100m
125°C 125°C
10m 85°C 10m 85°C
25°C 25°C
0°C 0°C
-40°C -40°C
1m 1m
10P 100P 1m 10m 100m 10P 100P 1m 10m 100m
Output Sinking Current (A) Output Sinking Current (A)
Figure 7-21. Output Low Voltage vs. Output Sinking Current at Figure 7-22. Output Low Voltage vs.Output Sinking Current at
12V 36V
100 100
50 Output set high 50 Output set high
Output High Leakage to GND (nA)
Output High Leakage to GND (nA)
VOUT = VS VOUT = VS
20 20
10 10
5 5
2 2
1 1
0.5 0.5
0.2 0.2
0.1 0.1
0.05 0.05
0.02 0.02
0.01 0.01
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Figure 7-23. Output High Leakage Current vs.Temperature at 5V Figure 7-24. Output High Leakage Current vs. Temperature at
36V

noted.
1000 1000
VS = 5V 125°C VS = 5V 125°C
900 900
Propagation Delay, High to Low (ns)
Propagation Delay, Low to High (ns)

VCM = 0V 85°C VCM = 0V 85°C
800 CL = 15pF 25°C 800 CL = 15pF 25°C
RP = 5.1k -40°C RP = 5.1k -40°C
700 700
600 600
500 500
400 400
300 300
200 200
100 100
0 0
5 10 100 1000 5 10 100 1000
Input Overdrive (mV) Input Overdrive (mV)
Figure 7-25. High to Low Propagation Delay vs. Input Overdrive Figure 7-26. Low to High Propagation Delay vs. Input Overdrive
Voltage, 5V Voltage, 5V
1000 1000
VS = 12V 125°C VS = 12V 125°C
900 900
VCM = 0V 85°C VCM = 0V 85°C

800 CL = 15pF 25°C 800 CL = 15pF 25°C
RP = 5.1k -40°C RP = 5.1k -40°C
700 700
600 600
500 500
400 400
300 300
200 200
100 100
0 0
5 10 100 1000 5 10 100 1000
1000 1000
VS = 36V 125°C VS = 36V 125°C
900 900
VCM = 0V 85°C VCM = 0V 85°C

800 CL = 15pF 25°C 800 CL = 15pF 25°C
RP = 5.1k -40°C RP = 5.1k -40°C
700 700
600 600
500 500
400 400
300 300
200 200
100 100
0 0
5 10 100 1000 5 10 100 1000


noted.
6 6
VREF = VCC/2 VREF = VCC/2
5 5
4 4
Output Voltage (V)
Output Voltage (V)

20mV Overdrive 20mV Overdrive
3 3
100mV
2 5mV 2 Overdrive
Overdrive 5mV Overdrive
1 100mV 1
Overdrive
0 0
-1 -1
-0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1
Time (Ps) Time (Ps)
Figure 7-31. Response Time for Various Overdrives, High-to- Figure 7-32. Response Time for Various Overdrives, Low-to-
Low Transition High Transition
7.19 Typical Characteristics, Non-B Versions
1.8 80
1.6 70
TA = –55°C
TA = –55°C
1.4
IIN – Input Bias Current – nA

TA = 25°C 60
ICC – Supply Current – mA
TA = 0°C
1.2 TA = 0°C
50
1 TA = 25°C
TA = 70°C
40
0.8 TA = 70°C
TA = 125°C
30
0.6 TA = 125°C
20
0.4
0.2 10
0 0
0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 35
VCC – Supply Voltage – V VCC – Supply Voltage – V
Figure 7-33. Supply Current vs Supply Voltage Figure 7-34. Input Bias Current vs Supply Voltage
10 6
5
Overdrive = 5 mV
VO – Saturation Voltage – V
1
VO – Output Voltage – V
4
TA = 125°C
Overdrive = 20 mV
TA = 25°C 3
0.1 Overdrive = 100 mV
TA = –55°C 2
1
0.01
0.001 -1
0.01 0.1 1 10 100 -0.3 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25
IO – Output Sink Current – mA t – Time – µs
Figure 7-35. Output Saturation Voltage Figure 7-36. Response Time for Various Overdrives
Negative Transition

Overdrive = 5 mV
VO – Output Voltage – V
4
Overdrive = 20 mV
3
Overdrive = 100 mV
2
-1
-0.3 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25
t – Time – µs
Figure 7-37. Response Time for Various Overdrives Positive Transition
8 Detailed Description
8.1 Overview
The LMx39 and LM2901x are quad comparators with the ability to operate up to an absolute maximum of 36 V
on the supply pin. This standard device has proven ubiquity and versatility across a wide range of applications.
This is due to very wide supply voltages range (2 V up to 32 V), low Iq, and fast response of the device.
The open-drain output allows the user to configure the output logic low voltage (VOL) and allows the comparator
to be used in AND functionality.
8.2 Functional Block Diagram
VCC
80-µA
Current Regulator
10 µA 60 µA 10 µA 80 µA
COMPONENT COUNT
Epi-FET 1
Diodes 2
IN+ Resistors 2
OUT Transistors 30
IN−
GND
Figure 8-1. Schematic (Each Comparator)
8.3 Feature Description

The comparator consists of a PNP Darlington pair input, allowing the device to operate with very high gain
and fast response with minimal input bias current. The input Darlington pair creates a limit on the input common-
mode voltage capability, allowing the comparator to accurately function from ground to (VCC – 1.5 V) differential
input. Allow for (VCC – 2 V) at cold temperature.
The output consists of an open-collector NPN (pulldown or low-side) transistor. The output NPN sinks current
when the negative input voltage is higher than the positive input voltage and the offset voltage. The VOL is
resistive and scales with the output current. See the Section 7 section for VOL values with respect to the output
current.
8.4 Device Functional Modes
8.4.1 Voltage Comparison
The comparator operates solely as a voltage comparator, comparing the differential voltage between the positive
and negative pins and outputting a logic low or high impedance (logic high with pullup) based on the input
differential polarity.

9 Application and Implementation

Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information

Typically, a comparator compares either a single signal to a reference, or to two differnt signals. Many users
take advantage of the open-drain output to drive the comparison logic output to a logic voltage level to an MCU
or logic device. The wide supply range and high voltage capability makes LMx39 or LM2901x optimal for level
shifting to a higher or lower voltage.
9.2 Typical Application
VLOGIC VLOGIC
VSUP VSUP Rpullup
Rpullup
Vin + Vin+ +
LM2901 LM2901
Vref Vin-
CL CL
Figure 9-1. Single-ended and Differential Comparator Configurations
9.2.1 Design Requirements

For this design example, use the parameters listed in Table 9-1 as the input parameters.
Table 9-1. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
Input Voltage Range 0 V to Vsup-1.5 V
Supply Voltage 4.5 V to VCC maximum
Logic Supply Voltage 0 V to VCC maximum
Output Current (RPULLUP) 1 µA to 4 mA
Input Overdrive Voltage 100 mV
Reference Voltage 2.5 V
Load Capacitance (CL) 15 pF
9.2.2 Detailed Design Procedure

When using the LMx39 in a general comparator application, determine the following:
• Input voltage range
• Minimum overdrive voltage
• Output and drive current
• Response time
9.2.2.1 Input Voltage Range
When choosing the input voltage range, the input common-mode voltage range (VICR) must be taken in to
account. If temperature operation is above or below 25°C the VICR can range from 0 V to VCC– 2 V. This limits
the input voltage range to as high as VCC– 2 V and as low as 0 V. Operation outside of this range can yield
incorrect comparisons.
The following list describes the outcomes of some input voltage situations.
• When both IN– and IN+ are both within the common-mode range:
– If IN– is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current
– If IN– is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is
not conducting
• When IN– is higher than common mode and IN+ is within common mode, the output is low and the output
transistor is sinking current
• When IN+ is higher than common mode and IN– is within common mode, the output is high impedance and
the output transistor is not conducting
• When IN– and IN+ are both higher than common mode, see Section 2 of Application Design Guidelines for
LM339, LM393, TL331 Family Comparators Including the New B-versions
9.2.2.2 Minimum Overdrive Voltage
Overdrive voltage is the differential voltage produced between the positive and negative inputs of the comparator
over the offset voltage (VIO). To make an accurate comparison, the overdrive voltage (VOD) must be higher than
the input offset voltage (VIO). Overdrive voltage can also determine the response time of the comparator, with
the response time decreasing with increasing overdrive. Figure 9-2 and Figure 9-3 show positive and negative
response times with respect to overdrive voltage.
9.2.2.3 Output and Drive Current
Output current is determined by the load and pullup resistance and logic and pullup voltage. The output current
produces a low-level output voltage (VOL) from the comparator, where VOL is proportional to the output current.
The output current can also effect the transient response.
9.2.2.4 Response Time
Response time is a function of input over-drive. See the Section 7.19 graphs for typical response times. The rise
and fall times can be determined by the load capacitance (CL), load/pull-up resistance (RPULLUP) and equivalent
collector-emitter resistance (RCE).
• The rise time (τR) is approximately τR~ RPULLUP × CL
• The fall time (τF) is approximately τF ~ RCE × CL
– RCE can be determined by taking the slope of Figure 7-35 in its linear region at the desired temperature, or
by dividing the VOL by IOUT

9.2.3 Application Curves

Figure 9-2 and Figure 9-3 were generated with scope probe parasitic capacitance of 50 pF.
6 6
5 5
Output Voltage, Vo(V)
Output Voltage (Vo)

4 4
3 3
2 5mV OD 2
5mV OD
1 20mV OD 1
20mV OD
0 0
100mV OD 100mV OD
±1 ±1
-0.25 0.25 0.75 1.25 1.75 2.25 ±0.25 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Time (usec) C004 Time (usec) C006
VCC = 5 V VLogic = 5 V RPULLUP = 5.1 kΩ VCC = 5 V VLogic = 5 V RPULLUP = 5.1 kΩ
Figure 9-2. Response Time vs Output Voltage Figure 9-3. Response Time vs Output Voltage
(Positive Transition) (Negative Transition)
9.3 Power Supply Recommendations

For fast response and comparison applications with noisy or AC inputs, use a bypass capacitor on the supply
pin to reject any variation on the supply voltage. This variation can affect the common-mode range of the
comparator input and create an inaccurate comparison.
9.4 Layout
9.4.1 Layout Guidelines
To create an accurate comparator application without hysteresis, maintain a stable power supply with minimized
noise and glitches, which can affect the high level input common-mode voltage range. To achieve this accuracy,
add a bypass capacitor between the supply voltage and ground. Place a bypass capacitor on the positive power
supply and negative supply (if available).
Note
If a negative supply is not being used, do not place a capacitor between the GND pin of the device
and system ground.
9.4.2 Layout Example

Ground
Bypass 1 14 3OUT
Capacitor
1OUT
0.1 μF 2OUT 2 13 4OUT
Positive Supply VCC 3 12 GND Negative Supply or Ground
2IN– 4 11 4IN+ Only needed

for dual power
2IN+ 5 10 4IN– 0.1 μF supplies
1IN– 6 9 3IN+ Ground
1IN+ 7 8 3IN–
Figure 9-4. LMx39 Layout Example
10 Device and Documentation Support

10.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 10-1. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY
DOCUMENTS SOFTWARE COMMUNITY
LM139 Click here Click here Click here Click here Click here
LM139A Click here Click here Click here Click here Click here
LM2901AV Click here Click here Click here Click here Click here
LM2901V Click here Click here Click here Click here Click here
10.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
10.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
10.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
10.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Oct-2024
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM139AD OBSOLETE SOIC D 14 TBD Call TI Call TI -55 to 125 LM139A

LM139ADG4 OBSOLETE SOIC D 14 TBD Call TI Call TI -55 to 125 LM139A
LM139ADR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 LM139A Samples
LM139ADRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 LM139A Samples
LM139D OBSOLETE SOIC D 14 TBD Call TI Call TI -55 to 125 LM139

LM139DG4 OBSOLETE SOIC D 14 TBD Call TI Call TI -55 to 125 LM139
LM139DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 LM139 Samples
LM139DRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 LM139 Samples
LM239AD OBSOLETE SOIC D 14 TBD Call TI Call TI -25 to 85 LM239A

LM239ADR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM239A Samples
LM239ADRE4 ACTIVE SOIC D 14 2500 TBD Call TI Call TI -25 to 85 Samples
LM239ADRG4 ACTIVE SOIC D 14 2500 TBD Call TI Call TI -25 to 85 Samples

LM239DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM239 Samples
LM239N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU | SN N / A for Pkg Type -25 to 85 LM239N Samples
LM239NE4 ACTIVE PDIP N 14 25 TBD Call TI Call TI -25 to 85 Samples
LM239PW OBSOLETE TSSOP PW 14 TBD Call TI Call TI -25 to 85 L239

LM239PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 L239 Samples
LM239PWRG4 OBSOLETE TSSOP PW 14 TBD Call TI Call TI -25 to 85 L239

LM2901AVQDR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2901AV Samples
LM2901AVQDRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2901AV Samples
LM2901AVQPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2901AV Samples
Addendum-Page 1
(6)
LM2901AVQPWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2901AV Samples
LM2901BIDR ACTIVE SOIC D 14 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2901B Samples
LM2901BIPWR ACTIVE TSSOP PW 14 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2901B Samples
LM2901BIRTER ACTIVE WQFN RTE 16 5000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 M2901B Samples

LM2901DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 LM2901 Samples
LM2901DRE4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2901 Samples
LM2901DRG3 ACTIVE SOIC D 14 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM2901 Samples
LM2901DRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2901 Samples
LM2901N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 LM2901N Samples
LM2901NSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2901 Samples
LM2901PW OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 125 L2901

LM2901PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 L2901 Samples
LM2901PWRG3 ACTIVE TSSOP PW 14 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L2901 Samples
LM2901PWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2901 Samples
LM2901VQDR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2901V Samples
LM2901VQPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2901V Samples
LM2901VQPWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2901V Samples
LM339AD OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70 LM339A

LM339ADBR ACTIVE SSOP DB 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L339A Samples
LM339ADR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM339A Samples
LM339ADRG4 OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70 LM339A
Addendum-Page 2
(6)
LM339AN ACTIVE PDIP N 14 25 RoHS & Green NIPDAU | SN N / A for Pkg Type 0 to 70 LM339AN Samples
LM339ANE4 ACTIVE PDIP N 14 25 TBD Call TI Call TI 0 to 70 Samples
LM339ANSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM339A Samples
LM339APW OBSOLETE TSSOP PW 14 TBD Call TI Call TI 0 to 70 L339A

LM339APWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L339A Samples
LM339APWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L339A Samples
LM339BIDR ACTIVE SOIC D 14 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM339B Samples
LM339BIPWR ACTIVE TSSOP PW 14 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM339B Samples
LM339BIRTER ACTIVE WQFN RTE 16 5000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM339B Samples
LM339D OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70 LM339

LM339DBR ACTIVE SSOP DB 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM339 Samples
LM339DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM339 Samples
LM339DRE4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM339 Samples
LM339DRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM339 Samples
LM339N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU | SN N / A for Pkg Type 0 to 70 LM339N Samples
LM339NE3 ACTIVE PDIP N 14 25 RoHS & SN N / A for Pkg Type 0 to 70 LM339N Samples
Non-Green
LM339NE4 ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 LM339N Samples
LM339NSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM339 Samples
LM339PW OBSOLETE TSSOP PW 14 TBD Call TI Call TI 0 to 70 L339

LM339PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L339 Samples
LM339PWRE4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L339 Samples
LM339PWRG3 ACTIVE TSSOP PW 14 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 L339 Samples
Addendum-Page 3
(6)
LM339PWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L339 Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM139, LM239A, LM2901, LM2901AV, LM2901B, LM2901V :
• Automotive : LM239A-Q1, LM2901-Q1, LM2901AV-Q1, LM2901B-Q1, LM2901V-Q1
Addendum-Page 4
• Enhanced Product : LM239A-EP

• Space : LM139-SP
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS TAPE DIMENSIONS

K0 P1
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2 Q1 Q2
Q3 Q4 Q3 Q4 User Direction of Feed
Pocket Quadrants
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM139ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM139ADRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM139DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM139DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM239ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM239ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM239DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM239PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2901AVQPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2901AVQPWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2901BIDR SOIC D 14 3000 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM2901BIPWR TSSOP PW 14 3000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2901BIRTER WQFN RTE 16 5000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
LM2901DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM2901DRG3 SOIC D 14 2500 330.0 16.8 6.5 9.5 2.1 8.0 16.0 Q1
LM2901DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
Pack Materials-Page 1
Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1

Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2901DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM2901NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
LM2901PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2901PWRG3 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2901PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2901VQPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2901VQPWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM339ADBR SSOP DB 14 2000 330.0 16.4 8.35 6.6 2.4 12.0 16.0 Q1
LM339ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM339ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
LM339APWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM339APWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM339BIDR SOIC D 14 3000 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM339BIPWR TSSOP PW 14 3000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM339BIRTER WQFN RTE 16 5000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
LM339DBR SSOP DB 14 2000 330.0 16.4 8.35 6.6 2.4 12.0 16.0 Q1
LM339DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM339DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM339DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM339NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
LM339PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM339PWRG3 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM339PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM139ADR SOIC D 14 2500 350.0 350.0 43.0
LM139ADRG4 SOIC D 14 2500 350.0 350.0 43.0
LM139DR SOIC D 14 2500 350.0 350.0 43.0
LM139DRG4 SOIC D 14 2500 350.0 350.0 43.0
LM239ADR SOIC D 14 2500 353.0 353.0 32.0
LM239ADR SOIC D 14 2500 356.0 356.0 35.0
LM239DR SOIC D 14 2500 353.0 353.0 32.0
LM239PWR TSSOP PW 14 2000 356.0 356.0 35.0
LM2901AVQPWR TSSOP PW 14 2000 356.0 356.0 35.0
LM2901AVQPWRG4 TSSOP PW 14 2000 356.0 356.0 35.0
LM2901BIDR SOIC D 14 3000 356.0 356.0 35.0
LM2901BIPWR TSSOP PW 14 3000 356.0 356.0 35.0
LM2901BIRTER WQFN RTE 16 5000 367.0 367.0 35.0
LM2901DR SOIC D 14 2500 353.0 353.0 32.0
LM2901DRG3 SOIC D 14 2500 364.0 364.0 27.0
LM2901DRG4 SOIC D 14 2500 356.0 356.0 35.0
LM2901DRG4 SOIC D 14 2500 353.0 353.0 32.0
LM2901NSR SO NS 14 2000 356.0 356.0 35.0
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2901PWR TSSOP PW 14 2000 356.0 356.0 35.0
LM2901PWRG3 TSSOP PW 14 2000 364.0 364.0 27.0
LM2901PWRG4 TSSOP PW 14 2000 356.0 356.0 35.0
LM2901VQPWR TSSOP PW 14 2000 356.0 356.0 35.0
LM2901VQPWRG4 TSSOP PW 14 2000 356.0 356.0 35.0
LM339ADBR SSOP DB 14 2000 356.0 356.0 35.0
LM339ADR SOIC D 14 2500 353.0 353.0 32.0
LM339ANSR SO NS 14 2000 356.0 356.0 35.0
LM339APWR TSSOP PW 14 2000 356.0 356.0 35.0
LM339APWRG4 TSSOP PW 14 2000 356.0 356.0 35.0
LM339BIDR SOIC D 14 3000 356.0 356.0 35.0
LM339BIPWR TSSOP PW 14 3000 356.0 356.0 35.0
LM339BIRTER WQFN RTE 16 5000 367.0 367.0 35.0
LM339DBR SSOP DB 14 2000 356.0 356.0 35.0
LM339DR SOIC D 14 2500 353.0 353.0 32.0
LM339DRG4 SOIC D 14 2500 356.0 356.0 35.0
LM339DRG4 SOIC D 14 2500 353.0 353.0 32.0
LM339NSR SO NS 14 2000 356.0 356.0 35.0
LM339PWR TSSOP PW 14 2000 356.0 356.0 35.0
LM339PWRG3 TSSOP PW 14 2000 364.0 364.0 27.0
LM339PWRG4 TSSOP PW 14 2000 356.0 356.0 35.0
TUBE
T - Tube
height L - Tube length
W - Tube
width
B - Alignment groove width

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
LM239N N PDIP 14 25 506 13.97 11230 4.32
LM239N N PDIP 14 25 506.1 9 600 5.4
LM2901N N PDIP 14 25 506 13.97 11230 4.32
LM339AN N PDIP 14 25 506 13.97 11230 4.32
LM339AN N PDIP 14 25 506 13.97 11230 4.32
LM339AN N PDIP 14 25 506.1 9 600 5.4
LM339AN N PDIP 14 25 506 13.97 11230 4.32
LM339N N PDIP 14 25 506 13.97 11230 4.32
LM339N N PDIP 14 25 506 13.97 11230 4.32
LM339N N PDIP 14 25 506.1 9 600 5.4
LM339N N PDIP 14 25 506 13.97 11230 4.32
LM339NE3 N PDIP 14 25 506.1 9 600 5.4
LM339NE4 N PDIP 14 25 506 13.97 11230 4.32
LM339NE4 N PDIP 14 25 506 13.97 11230 4.32
LM339NE4 N PDIP 14 25 506 13.97 11230 4.32
GENERIC PACKAGE VIEW
RTE 16 WQFN - 0.8 mm max height
3 x 3, 0.5 mm pitch PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225944/A
www.ti.com
PACKAGE OUTLINE
RTE0016C SCALE 3.600
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
3.1 B
A
2.9
PIN 1 INDEX AREA

3.1
2.9
SIDE WALL
METAL THICKNESS
DIM A
OPTION 1 OPTION 2
0.1 0.2
C
0.8 MAX
SEATING PLANE
0.05
0.00 0.08
1.68 0.07 (DIM A) TYP

5 8
EXPOSED
THERMAL PAD
12X 0.5
4
9
4X 17 SYMM
1.5
1
12
0.30
16X
0.18
PIN 1 ID 16 13 0.1 C A B
(OPTIONAL) SYMM
0.05
0.5
16X
0.3
4219117/B 04/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RTE0016C WQFN - 0.8 mm max height
( 1.68)
SYMM
16 13
16X (0.6)
1
12
16X (0.24)
17 SYMM
(2.8)
(0.58)
TYP
12X (0.5)
9
4
( 0.2) TYP
VIA
5 8
(R0.05) (0.58) TYP
ALL PAD CORNERS
(2.8)
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:20X
0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND
SOLDER MASK
METAL OPENING
EXPOSED EXPOSED
SOLDER MASK METAL METAL UNDER
METAL
OPENING SOLDER MASK
NON SOLDER MASK

SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS

4219117/B 04/2022
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RTE0016C WQFN - 0.8 mm max height
( 1.55)
16 13
16X (0.6)
1
12
16X (0.24)
17 SYMM
(2.8)
12X (0.5)
9
4
METAL
ALL AROUND
5 8
SYMM
(R0.05) TYP
(2.8)
SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 17:

85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
4219117/B 04/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
D0014A SCALE 1.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
C
6.2
TYP SEATING PLANE
5.8
A PIN 1 ID 0.1 C
AREA
12X 1.27
14
1
8.75 2X
8.55 7.62
NOTE 3
7
8
0.51
14X
4.0 0.31
B 1.75 MAX
3.8 0.25 C A B
NOTE 4
0.25
TYP
0.13
SEE DETAIL A
0.25
GAGE PLANE
0.25
0 -8 1.27 0.10
0.40
DETAIL A
TYPICAL
4220718/A 09/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side.
5. Reference JEDEC registration MS-012, variation AB.
www.ti.com
D0014A SOIC - 1.75 mm max height
14X (1.55) SYMM

1
14
14X (0.6)
12X (1.27)
SYMM
7 8
(R0.05)
TYP
(5.4)

SCALE:8X
SOLDER MASK METAL UNDER SOLDER MASK

METAL OPENING
OPENING SOLDER MASK
0.07 MAX 0.07 MIN

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
SOLDER MASK DETAILS
4220718/A 09/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
D0014A SOIC - 1.75 mm max height
14X (1.55) SYMM
1
14
14X (0.6)
12X (1.27)
SYMM
7 8
(5.4)

SCALE:8X
4220718/A 09/2016
NOTES: (continued)
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DB0014A SCALE 2.000
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
C
8.2
TYP
A 7.4
0.1 C
PIN 1 INDEX AREA SEATING
PLANE
12X 0.65
14
1
2X
6.5
3.9
5.9
NOTE 3
7
8 0.38
14X
0.22
0.15 C A B
5.6
B
5.0
NOTE 4
0.25
0.09
SEE DETAIL A
2 MAX
0.25
GAGE PLANE
0.95 0.05 MIN

0 -8 0.55
DETAIL A
A 15
TYPICAL
4220762/A 05/2024
NOTES:
per ASME Y14.5M.
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-150.
www.ti.com
DB0014A SSOP - 2 mm max height
14X (1.85) SYMM
1 (R0.05) TYP
14X (0.45) 14
SYMM
12X (0.65)
7 8
(7)

EXPOSED METAL SHOWN
SCALE: 10X

METAL
OPENING SOLDER MASK OPENING
EXPOSED METAL EXPOSED METAL
0.05 MAX 0.05 MIN

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
15.000
4220762/A 05/2024
NOTES: (continued)

www.ti.com
DB0014A SSOP - 2 mm max height
14X (1.85) SYMM

(R0.05) TYP
1
14X (0.45) 14
SYMM
12X (0.65)
7 8
(7)

SCALE: 10X
4220762/A 05/2024
NOTES: (continued)
www.ti.com
PACKAGE OUTLINE
PW0014A SCALE 2.500
TSSOP - 1.2 mm max height
SEATING
PLANE
6.6 C
TYP
A 6.2
0.1 C
PIN 1 INDEX AREA
12X 0.65
14
1
2X
5.1 3.9
4.9
NOTE 3
4X (0 -12 )
7
8
0.30
14X
0.17
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
0 -8
DETAIL A
A 20
TYPICAL
4220202/B 12/2023
NOTES:
per ASME Y14.5M.
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
PW0014A TSSOP - 1.2 mm max height
14X (1.5) SYMM

(R0.05) TYP
1
14X (0.45) 14
SYMM
12X (0.65)
7 8
(5.8)

EXPOSED METAL SHOWN
SCALE: 10X

METAL SOLDER MASK OPENING
OPENING
EXPOSED METAL EXPOSED METAL
0.05 MAX 0.05 MIN

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED) SOLDER MASK DETAILS
15.000
4220202/B 12/2023
NOTES: (continued)

www.ti.com
PW0014A TSSOP - 1.2 mm max height
14X (1.5) SYMM

(R0.05) TYP
1
14X (0.45) 14
SYMM
12X (0.65)
7 8
(5.8)

SCALE: 10X
4220202/B 12/2023
NOTES: (continued)
www.ti.com
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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
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is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
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LM139, LM239, LM339, LM339B, LM139A, LM239A

LM339A, LM2901B, LM2901, LM2901AV, LM2901V

LM339B, LM2901B, LM339, LM239, LM139, LM2901 Quad Differential Comparators

2 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated

Changes from Revision W (October 2023) to Revision X (October 2023) Page

Changes from Revision V (December 2022) to Revision W (October 2023) Page

Changes from Revision U (November 2018) to Revision V (December 2022) Page

Changes from Revision T (June 2015) to Revision U (November 2018) Page

Changes from Revision S (August 2012) to Revision T (June 2015) Page

Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 3

4 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated

6 Pin Configuration and Functions

2IN– IN1± 2 11 IN4+

Table 6-1. Pin Functions

Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 5

7.2 Absolute Maximum Ratings for Non-B Versions

6 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated

7.3 ESD Ratings for LM339B and LM2901B

Electrostatic Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000

7.4 ESD Ratings, Non-B Versions

7.5 Recommended Operating Conditions for LM339B and LM2901B

7.6 Recommended Operating Conditions, Non-B Versions

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7.7 Thermal Information for LM339B and LM2901B

7.8 Thermal Information for Non-B Versions

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7.9 Electrical Characteristics for LM339B

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7.10 Electrical Characteristics for LM2901B

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7.11 Electrical Characteristics for LM139 and LM139A

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7.12 Electrical Characteristics for LMx39 and LMx39A

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7.13 Electrical Characteristics for LM2901, LM2901V and LM2901AV

Supply current VO = 2.5 V, VCC = 5 V 0.8 2

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7.14 Switching Characteristics for LM139 and LM139A

(1) CL includes probe and jig capacitance.

7.15 Switching Characteristics for LM339B and LM2901B

(1) High-to-low and low-to-high refers to the transition at the input.

7.16 Switching Characteristics for LMx39 and LMx39A

(1) CL includes probe and jig capacitance.

7.17 Switching Characteristics for LM2901

(1) CL includes probe and jig capacitance.

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7.18 Typical Characteristics for LM339B and LM2901B Only

Total Supply Current (A)

Total Supply Current (A)

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7.18 Typical Characteristics for LM339B and LM2901B Only (continued)

Input Offset Voltage (mV)

Input Offset Voltage (mV)

-1.5 VS = 12V -1.5 VS = 36V

Input Offset Voltage (mV)

-1.5 TA = -40°C -1.5 TA = 25°C

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7.18 Typical Characteristics for LM339B and LM2901B Only (continued)

Input Offset Voltage (mV)

-1.5 TA = 85°C -1.5 TA = 125qC