LM393 Datasheet

LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V
SLCS005AF – OCTOBER 1979 – REVISED AUGUST 2023
LM393B, LM2903B, LM193, LM293, LM393 and LM2903 Dual Comparators
1 Features 3 Description
• NEW LM393B and LM2903B The LM393B and LM2903B devices are the
• Improved specifications of B-version next generation versions of the industry-standard
– Maximum rating: up to 38 V LM393 and LM2903 comparator family. These next
– ESD rating (HBM): 2k V generation B-version comparators feature lower offset
– Low input offset: 0.37 mV voltage, higher supply voltage capability, lower supply
– Low input bias current: 3.5 nA current, lower input bias current, lower propagation
– Low supply-current: 200 µA per comparator delay, and improved 2 kV ESD performance and
– Faster response time of 1 µsec input ruggedness through dedicated ESD clamps.
– Extended temperature range for LM393B The LM393B and LM2903B can drop-in replace the
– Available in tiny 2 x 2mm WSON package LM293, LM393 and LM2903, for both "A" and "V"
• B-version is drop-in replacement for LM293, grades.
LM393 and LM2903, A and V versions All devices consist of two independent voltage
• Common-mode input voltage range includes comparators that are designed to operate from a
ground single power supply over a wide range of voltages.
• Differential input voltage range equal to maximum- Quiescent current is independent of the supply
rated supply voltage: ±38 V voltage.
• Low output saturation voltage
• Output compatible with TTL, MOS, and CMOS Device Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
2 Applications
LM393B, LM2903B,
• Vacuum robot LM193, LM293, LM293A,
SOIC (8) 4.90 mm x 3.91 mm
• Single phase UPS LM393, LM393A, LM2903,
LM2903V, LM2903AV
• Server PSU
LM393B, LM2903B,
• Cordless power tool
LM293, LM293A, LM393, VSSOP (8) 3.00 mm x 3.00 mm
• Wireless infrastructure LM393A, LM2903
• Applicances LM293, LM393, LM393A,
• Building automation PDIP (8) 9.81 mm × 6.35 mm
LM2903
• Factory automation & control LM393, LM393A, LM2903 SO (8) 6.20 mm x 5.30 mm
• Motor drives
LM393B, LM2903B,
• Infotainment & cluster LM393, LM393A, LM2903, TSSOP (8) 3.00 mm x 4.40 mm
LM2903V, LM2903AV
LM393B, LM2903B SOT-23 (8) 2.90 mm x 1.60 mm
LM393B, LM2903B WSON (8) 2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at

the end of the data sheet.
Family Comparison Table
LM393 LM2903V LM293
Specification LM393B LM2903B LM2903 LM193 Units
LM393A LM2903AV LM293A
Supply Voltage 2 to 36 2 to 36 2 to 30 2 to 30 2 to 32 2 to 30 2 to 30 V
Total Supply Current
0.6 to 0.8 0.6 to 0.8 1 to 2.5 1 to 2.5 1 to 2.5 1 to 2.5 1 to 2.5 mA
(5V to 36V max)
Temperature Range −40 to 85 −40 to 125 0 to 70 −40 to 125 −40 to 125 −55 to 125 −25 to 85 °C
ESD (HBM) 2000 2000 1000 1000 1000 1000 1000 V
Offset Voltage ±9 ± 15 ±9
±4 ±4 ± 15 ±9 mV
(Max over temp) ±4 ±4 ±4
Input Bias Current (typ / max) 3.5 / 25 3.5 / 25 25 / 250 25 / 250 25 / 250 25 / 100 25 / 250 nA
Response Time (typ) 1 1 1.3 1.3 1.3 1.3 1.3 µsec
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SLCS005AF – OCTOBER 1979 – REVISED AUGUST 2023 www.ti.com
Table of Contents
1 Features............................................................................1 6.13 Switching Characteristics: LM193, LM239,
2 Applications..................................................................... 1 LM393, LM2903, all 'A' and 'V' versions...................... 11
3 Description.......................................................................1 6.14 Typical Characteristics, LMx93, LM2903 (all 'V'
4 Revision History.............................................................. 2 and 'A' suffixes)........................................................... 12
5 Pin Configuration and Functions...................................4 6.15 Typical Characteristics, LM393B and LM2903B..... 13
6 Specifications.................................................................. 5 7 Detailed Description......................................................19
6.1 Absolute Maximum Ratings........................................ 5 7.1 Overview................................................................... 19
6.2 Recommended Operating Conditions.........................5 7.2 Functional Block Diagram......................................... 19
6.3 Thermal Information: LM193.......................................6 7.3 Feature Description...................................................19
6.4 Thermal Information: LM293, LM393, LM2903 7.4 Device Functional Modes..........................................19
(all 'V' and 'A' suffixes)...................................................6 8 Application and Implementation.................................. 20
6.5 Thermal Information: LM393B and LM2903B............. 6 8.1 Application Information............................................. 20
6.6 ESD Ratings............................................................... 6 8.2 Typical Application.................................................... 20
6.7 Electrical Characteristics LM393B ............................. 7 9 Device and Documentation Support............................23
6.8 Electrical Characteristics LM2903B ........................... 8 9.1 Receiving Notification of Documentation Updates....23
6.9 Switching Characteristics LM393B and LM2903B...... 8 9.2 Support Resources................................................... 23
6.10 Electrical Characteristics for LM193, LM293, 9.3 Trademarks............................................................... 23
and LM393 (without A suffix).........................................9 9.4 Electrostatic Discharge Caution................................23
6.11 Electrical Characteristics for LM293A and 9.5 Glossary....................................................................23
LM393A....................................................................... 10 10 Mechanical, Packaging, and Orderable
6.12 Electrical Characteristics for LM2903, Information.................................................................... 23
LM2903V, and LM2903AV........................................... 11
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision AE (November 2020) to Revision AF (August 2023) Page

• Added reference to Application Note................................................................................................................ 20
Changes from Revision AD (October 2020) to Revision AE (November 2020) Page

• Corrected Family Comparison Table Offset Voltage units to mV........................................................................1
• LM393B and LM2903B recommended minimum supply votlage changed to 2V throughout.............................1
• Added separate offset voltage row for LM393B and LM2903B DGK package...................................................1
• Changed "B" devices recommended minimum supply votlage to 2V................................................................. 5
• Updated "B" device Supply Current vs Supply Voltage Graph for 2V...............................................................13
Changes from Revision AC (February 2020) to Revision AD (October 2020) Page

• Updated the numbering format for tables, figures and cross-references throughout the document.................. 1
Changes from Revision AB (December 2019) to Revision AC (February 2020) Page

• Changed front page Features, Applications and Description text to highlight B version.................................... 1
• Added WSON and SOT-23-8 packages............................................................................................................. 1
• Added Links to Family Table ..............................................................................................................................1
• Added DDF and DSG pkgs to Thermal Table.....................................................................................................6
Changes from Revision AA (September 2019) to Revision AB (December 2019) Page

• Changed LM393B and LM2903B from Preview to Active status........................................................................1
• Added Family Comparison Table........................................................................................................................1
2 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated
Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V
www.ti.com SLCS005AF – OCTOBER 1979 – REVISED AUGUST 2023
Changes from Revision Z (October 2017) to Revision AA (September 2019) Page

• Added "B" devices with various text changes throughout datasheet..................................................................1
• Deleted from Device Information old LM193 CDIP and LCCC package references and drawings. These are
on the LM139-MIL data sheet.............................................................................................................................1
• Added "B" devices Thermal Information table.................................................................................................... 6
• Added "B" device electrical tables...................................................................................................................... 6
• Added "B" device graphs ................................................................................................................................. 13
Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 3
5 Pin Configuration and Functions
1OUT 1 8 VCC
1IN− 2 7 2OUT
1IN+ 3 6 2IN−
GND 4 5 2IN+
Figure 5-1. D, DGK, JG, P, PS, DDF or PW Package 8-Pin SOIC, VSSOP, PDIP, SO, or TSSOP Top View
1OUT 1 8 V+
Exposed
Thermal
1IN± 2 Die Pad 7 2OUT
on
1IN+ 3 Underside 6 2IN±
GND 4 5 2IN+
Connect thermal pad directly to GND pin.
Figure 5-2. DSG Package 8-Pin WSON With Exposed Pad Top View
Table 5-1. Pin Functions

PIN
SOIC, VSSOP, I/O DESCRIPTION
NAME PDIP, SO, DDF and DSG
TSSOP
1OUT 1 1 Output Output pin of comparator 1
1IN– 2 2 Input Negative input pin of comparator 1
1IN+ 3 3 Input Positive input pin of comparator 1
GND 4 4 — Ground
2IN+ 5 5 Input Positive input pin of comparator 2
2IN- 6 6 Input Negative input pin of comparator 2
2OUT 7 7 Output Output pin of comparator 2
VCC 8 8 — Positive Supply
Thermal
— PAD — Connect directly to GND pin
Pad
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Non-B Versions 36
VCC Supply voltage(2) –0.3 V
B Versions Only 38
Non-B Versions -36 36
VID Differential input voltage(3) V
B Versions Only -38 38
Non-B Versions 36
VI Input voltage (either input) –0.3 V
B Versions Only 38
IIK Input current(5) -50 mA
Non-B Versions 36
VO Output voltage –0.3 V
B Versions Only 38
Non-B Versions 20
IO Output current mA
B Versions Only 25
ISC Duration of output short circuit to ground(4) Unlimited
TJ Operating virtual-junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Production Processing Does Not Necessarily Include Testing of All Parameters.
(2) All voltage values, except differential voltages, are with respect to network ground.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Input current flows thorough parasitic diode to ground and turns on parasitic transistors that increases ICC and may cause output to be
incorrect. Normal operation resumes when input current is removed.
6.2 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
non-V devices 2 30
Supply voltage, VS = (V+) – (V–) V devices 2 32 V
"B" version devices 2 36
non-B devices 0
Input voltage range, VIVR (V+) – 2.0 V
"B" version devices –0.1
LM193 –55 125
LM2903, LM2903V, LM2903AV, LM2903B –40 125
Ambient temperature, TA LM393B –40 85 °C
LM293, LM293A –25 85
LM393, LM393A 0 70
6.3 Thermal Information: LM193

LM193
D
THERMAL METRIC(1) UNIT
(SOIC)
8 pin
RθJA Junction-to-ambient thermal resistance 126.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 70 °C/W
RθJB Junction-to-board thermal resistance 64.9 °C/W
ψJT Junction-to-top characterization parameter 20.3 °C/W
ψJB Junction-to-board characterization parameter 64.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.
6.4 Thermal Information: LM293, LM393, LM2903 (all 'V' and 'A' suffixes)
LM293, LM393, LM2903
D DGK P PS PW
(SOIC) (VSSOP) (PDIP) (SO) (TSSOP)
8 pin 8 pin 8 pin 8 pin 8 pin
RθJA Junction-to-ambient thermal resistance 131.8 199.4 73.7 139 194.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 78.4 90.2 62.6 98.9 77.0 °C/W
RθJB Junction-to-board thermal resistance 72.2 120.8 50.8 83.7 123.0 °C/W
ψJT Junction-to-top characterization parameter 26.5 21.5 39.2 47.4 13.1 °C/W
ψJB Junction-to-board characterization parameter 71.1 119.1 50.7 83 121.3 °C/W
6.5 Thermal Information: LM393B and LM2903B

LM393B, LM2903B
D PW DGK DDF DSG
(SOIC) (TSSOP) (VSSOP) (SOT-23) (WSON)
8 pin 8 pin 8 pin 8 pin 8 pins
RθJA Junction-to-ambient thermal resistance 148.5 200.6 193.7 197.9 96.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 90.2 89.6 82.9 119.2 119.0 °C/W
RθJB Junction-to-board thermal resistance 91.8 131.3 115.5 115.4 63.1 °C/W
ψJT Junction-to-top characterization parameter 38.5 22.1 20.8 19.4 12.4 °C/W
ψJB Junction-to-board characterization parameter 91.1 129.6 113.9 113.7 63.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance - - - - 37.8 °C/W
6.6 ESD Ratings

VALUE UNIT
LM393B and LM2903B Only
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
All Other Versions
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.7 Electrical Characteristics LM393B

VS = 5 V, VCM = (V–) ; TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VS = 5 to 36V –2.5 ±0.37 2.5
Input offset voltage
VS = 5 to 36V, TA = –40°C to +85°C -4 4
VIO mV
Input offset voltage, DGK VS = 5 to 36V –3.5 ±0.37 3.5
package only VS = 5 to 36V, TA = –40°C to +85°C –5 5
–3.5 –25 nA
IB Input bias current
TA = –40°C to +85°C –50 nA
–10 ±0.5 10 nA
IOS Input offset current
TA = –40°C to +85°C –25 25 nA
VS = 3 to 36V (V–) (V+) – 1.5 V
VCM Common mode range (1)
VS = 3 to 36V, TA = –40°C to +85°C (V–) (V+) – 2.0 V
Large signal differential VS = 15V, VO = 1.4V to 11.4V;
AVD 50 200 V/mV
voltage amplification RL ≥ 15k to (V+)
ISINK ≤ 4mA, VID = -1V 110 400 mV
Low level output Voltage
VOL ISINK ≤ 4mA, VID = -1V
{swing from (V–)} 550 mV
TA = –40°C to +85°C
High-level output leakage (V+) = VO = 5 V; VID = 1V 0.1 20 nA

IOH-LKG
current (V+) = VO = 36V; VID = 1V 0.3 50 nA
IOL Low level output current VOL = 1.5V; VID = -1V; VS = 5V 6 21 mA
Quiescent current (all VS = 5 V, no load 400 600 µA

IQ
comparators) VS = 36 V, no load, TA = –40°C to +85°C 550 800 µA
(1) The voltage at either input should not be allowed to go negative by more than 0.3 V otherwise output may be incorrect and excessive
input current can flow. The upper end of the common-mode voltage range is limited by VCC – 2V. However only one input needs to be
in the valid common mode range, the other input can go up the maximum VCC level and the comparator provides a proper output state.
Either or both inputs can go to maximum VCC level without damage.
6.8 Electrical Characteristics LM2903B

VS = 5 V, VCM = (V–) ; TA = 25°C (unless otherwise noted).
VS = 5 to 36V –2.5 ±0.37 2.5
Input offset voltage
VS = 5 to 36V, TA = –40°C to +125°C –4 4
VIO mV
Input offset voltage, DGK VS = 5 to 36V -3.5 ±0.37 3.5
package only VS = 5 to 36V, TA = –40°C to +125°C -5 5
–3.5 –25 nA
IB Input bias current
TA = –40°C to +125°C –50 nA
–10 ±0.5 10 nA
IOS Input offset current
TA = –40°C to +125°C –25 25 nA
VS = 3 to 36V (V–) (V+) – 1.5 V
VCM Common mode range (1)
VS = 3 to 36V, TA = –40°C to +125°C (V–) (V+) – 2.0 V
Large signal differential VS = 15V, VO = 1.4V to 11.4V;
AVD 50 200 V/mV
voltage amplification RL ≥ 15k to (V+)
ISINK ≤ 4mA, VID = -1V 110 400 mV
Low level output Voltage
VOL ISINK ≤ 4mA, VID = -1V
{swing from (V–)} 550 mV
TA = –40°C to +125°C
High-level output leakage (V+) = VO = 5 V; VID = 1V 0.1 20 nA

IOH-LKG
current (V+) = VO = 36V; VID = 1V 0.3 50 nA
IOL Low level output current VOL = 1.5V; VID = -1V; VS = 5V 6 21 mA
Quiescent current (all VS = 5 V, no load 400 600 µA

IQ
comparators) VS = 36 V, no load, TA = –40°C to +125°C 550 800 µA
6.9 Switching Characteristics LM393B and LM2903B

VS = 5V, VO_PULLUP = 5V, VCM = VS/2, CL = 15pF, RL = 5.1k Ohm, TA = 25°C (unless otherwise noted).
Propagation delay time, high-to-low;
tresponse TTL input with Vref = 1.4V 300 ns
TTL input signal (1)
Propagation delay time, high-to-low;
tresponse Input overdrive = 5mV, Input step = 100mV 1000 ns
Small scale input signal (1)
(1) High-to-low and low-to-high refers to the transition at the input.
6.10 Electrical Characteristics for LM193, LM293, and LM393 (without A suffix)
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM293
LM193
PARAMETER TEST CONDITIONS TA (1) LM393 UNIT
MIN TYP MAX MIN TYP MAX
VCC = 5 V to 30 V, 25°C 2 5 2 5
VIO Input offset voltage VIC = VICR min, mV
VO = 1.4 V Full range 9 9
25°C 3 25 5 50
IIO Input offset current VO = 1.4 V nA
Full range 100 250
25°C –25 –100 –25 –250
IIB Input bias current VO = 1.4 V nA
Full range –300 –400
0 to 0 to
25°C
Common-mode input-voltage VCC – 1.5 VCC – 1.5
VICR V
range(2) 0 to 0 to
Full range
VCC – 2 VCC – 2
VCC = 15 V,
Large-signal differential-voltage
AVD VO = 1.4 V to 11.4 V, 25°C 50 200 50 200 V/mV
amplification
RL ≥ 15 kΩ to VCC
VOH = 5 V VID = 1 V 25°C 0.1 0.1 50 nA
IOH High-level output current
VOH = 30 V VID = 1 V Full range 1 1 µA
25°C 150 400 130 400
VOL Low-level output voltage IOL = 4 mA, VID = –1 V mV
Full range 700 700
IOL Low-level output current VOL = 1.5 V, VID = –1 V 25°C 6 6 mA
VCC = 5 V 25°C 0.8 1 0.45 1
ICC Supply current RL = ∞ mA
VCC = 30 V Full range 2.5 0.55 2.5
(1) Full range (minimum or maximum) for LM193 is –55°C to 125°C, for LM293 is –25°C to 85°C, and for LM393 is 0°C to 70°C. All
characteristics are measured with zero common-mode input voltage, unless otherwise specified.
6.11 Electrical Characteristics for LM293A and LM393A

LM293A
PARAMETER TEST CONDITIONS TA (1) LM393A UNIT
MIN TYP MAX
VCC = 5 V to 30 V, VO = 1.4 V 25°C 1 2

VIO Input offset voltage mV
VIC = VICR(min) Full range 4
25°C 5 50
Full range 150
25°C –25 –250
Full range –400
0 to
25°C
VCC – 1.5
VICR Common-mode input-voltage range(2) V
0 to
Full range
VCC – 2
Large-signal differential-voltage VCC = 15 V, VO = 1.4 V to 11.4 V,
AVD 25°C 50 200 V/mV
amplification RL ≥ 15 kΩ to VCC
VOH = 5 V, VID = 1 V 25°C 0.1 50 nA
VOH = 30 V, VID = 1 V Full range 1 µA
25°C 110 400
VOL Low-level output voltage IOL = 4 mA, VID = –1 V mV
Full range 700
IOL Low-level output current VOL = 1.5 V, VID = –1 V, 25°C 6 mA
VCC = 5 V 25°C 0.60 1
VCC = 30 V Full range 0.72 2.5
(1) Full range (minimum or maximum) for LM293A is –25°C to 85°C, and for LM393A is 0°C to 70°C. All characteristics are measured with
zero common-mode input voltage, unless otherwise specified.
6.12 Electrical Characteristics for LM2903, LM2903V, and LM2903AV

LM2903, LM2903V LM2903AV
PARAMETER TEST CONDITIONS TA (1) UNIT
MIN TYP MAX MIN TYP MAX
VCC = 5 V to MAX(2) , 25°C 2 7 1 2
VIO Input offset voltage VO = 1.4 V, mV
VIC = VICR(min), Full range 15 4
25°C 5 50 5 50
Full range 200 200
25°C –25 –250 –25 –250
Full range –500 –500
0 to 0 to
25°C
Common-mode input- VCC – 1.5 VCC – 1.5
VICR V
voltage range(3) 0 to 0 to
Full range
VCC – 2 VCC – 2
Large-signal differential- VCC = 15 V, VO = 1.4 V to 11.4 V,
AVD 25°C 25 100 25 100 V/mV
voltage amplification RL ≥ 15 kΩ to VCC
VOH = 5 V, VID = 1 V 25°C 0.1 50 0.1 50 nA
VOH = VCC MAX(2), VID = 1 V Full range 1 1 µA
25°C 150 400 150 400
VOL Low-level output voltage IOL = 4 mA, VID = –1 V, mV
Full range 700 700
IOL Low-level output current VOL = 1.5 V, VID = –1 V 25°C 6 6 mA
VCC = 5 V 25°C 0.8 1 0.8 1
VCC = MAX Full range 2.5 2.5
(1) Full range (minimum or maximum) for LM2903 is –40°C to 125°C. All characteristics are measured with zero common-mode input
voltage, unless otherwise specified.
(2) VCC MAX = 30 V for non-V devices and 32 V for V-suffix devices.
6.13 Switching Characteristics: LM193, LM239, LM393, LM2903, all 'A' and 'V' versions
VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
RL connected to 5 V through 5.1 kΩ, 100-mV input step with 5-mV overdrive 1.3
Response time µs
CL = 15 pF(1) (2) TTL-level input step 0.3
(1) CL includes probe and jig capacitance.

(2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
6.14 Typical Characteristics, LMx93, LM2903 (all 'V' and 'A' suffixes)
TA= 25°C, VS= 5V, RPULLUP=5.1k, CL = 15 pF, VCM=0V unless otherwise noted.
1.8 80
1.6 70
TA = –55°C
TA = –55°C
1.4
IIN – Input Bias Current – nA

TA = 25°C 60
ICC – Supply Current – mA
TA = 0°C
1.2 TA = 0°C
50
1 TA = 25°C
TA = 70°C
40
0.8 TA = 70°C
TA = 125°C
30
0.6 TA = 125°C
20
0.4
0.2 10
0 0
0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 35
VCC – Supply Voltage – V VCC – Supply Voltage – V
Figure 6-1. Supply Current vs Supply Voltage Figure 6-2. Input Bias Current vs Supply Voltage
10 6
5
Overdrive = 5 mV
VO – Saturation Voltage – V
VO – Output Voltage – V
TA = 125°C 4
Overdrive = 20 mV
TA = 25°C 3
0.1
Overdrive = 100 mV
TA = –55°C
2
0.01 1
0
0.001
0.01 0.1 1 10 100 -1
-0.3 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25
IO – Output Sink Current – mA
t – Time – µs
Figure 6-3. Output Saturation Voltage

Figure 6-4. Response Time for Various Overdrives Negative
Transition
Overdrive = 5 mV
VO – Output Voltage – V
Overdrive = 20 mV
3
Overdrive = 100 mV
2
-1
-0.3 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25
t – Time – µs
Figure 6-5. Response Time for Various Overdrives Positive Transition
6.15 Typical Characteristics, LM393B and LM2903B

TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
500
460
420
Total Supply Current (PA)

380
340
300
260
220 -40°C
0°C
180 25°C
140 85°C
VS=3V 125°C
100
-0.5 -0.25 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2
Input Voltage (V)
Figure 6-6. Total Supply Current vs. Supply Voltage Figure 6-7. Total Supply Current vs. Input Voltage at 3V
500 500
460 460
420 420
380 380
340 340
300 300
260 260
220 -40°C 220 -40°C
0°C 0°C
180 25°C 180 25°C
140 85°C 140 85°C
VS=3.3V 125°C VS=5V 125°C
100 100
-0.5 -0.25 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 -0.5 0 0.5 1 1.5 2 2.5 3 3.5 4
Input Voltage (V) Input Voltage (V)
Figure 6-8. Total Supply Current vs. Input Voltage at 3.3V Figure 6-9. Total Supply Current vs. Input Voltage at 5V
500 550
460 510
420 470
380 430
340 390
300 350
260 310
220 -40°C 270 -40°C
0°C 0°C
180 25°C 230 25°C
140 85°C 190 85°C
VS=12V 125°C VS=36V 125°C
100 150
-1 0 1 2 3 4 5 6 7 8 9 10 11 0 3 6 9 12 15 18 21 24 27 30 33 36
Figure 6-10. Total Supply Current vs. Input Voltage at 12V Figure 6-11. Total Supply Current vs. Input Voltage at 36V
6.15 Typical Characteristics, LM393B and LM2903B (continued)

noted.
2 2
1.5 1.5
Input Offset Voltage (mV)

1 1
0.5 0.5
0 0
-0.5 -0.5
-1 -1
-1.5 VS = 3V -1.5 VS = 5V
63 Channels 62 Channels
-2 -2
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)
Figure 6-12. Input Offset Voltage vs. Temperature at 3V Figure 6-13. Input Offset Voltage vs. Temperature at 5V
2 2
1.5 1.5
1 1
0.5 0.5
0 0
-0.5 -0.5
-1 -1
-1.5 VS = 12V -1.5 VS = 36V

-2 -2
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Figure 6-14. Input Offset Voltage vs. Temperature at 12V Figure 6-15. Input Offset Voltage vs. Temperature at 36
2 2
1.5 1.5
1 1
0.5 0.5
0 0
-0.5 -0.5
-1 -1
-1.5 TA = -40°C -1.5 TA = 25°C

-2 -2
3 6 9 12 15 18 21 24 27 30 33 36 3 6 9 12 15 18 21 24 27 30 33 36
Supply Voltage (V) Supply Voltage (V)
Figure 6-16. Input Offset Voltage vs. Supply Voltage at -40°C Figure 6-17. Input Offset Voltage vs. Supply Voltage at 25°C

noted.
2 2
1.5 1.5

1 1
0.5 0.5
0 0
-0.5 -0.5
-1 -1
-1.5 TA = 85°C -1.5 TA = 125qC

-2 -2
3 6 9 12 15 18 21 24 27 30 33 36 3 6 9 12 15 18 21 24 27 30 33 36
Supply Voltage (V) Supply Voltage (V)
Figure 6-18. Input Offset Voltage vs. Supply Voltage at 85°C Figure 6-19. Input Offset Voltage vs. Supply Voltage at 125°C
0 0
VCM=0V 125°C VS=5V
-0.5 85°C -0.5
-1 25°C -1
0°C
Input Bias Current (nA)
-1.5 -40°C -1.5

-2 -2
-2.5 -2.5
-3 -3
-3.5 -3.5 125°C
85°C
-4 -4 25°C
0°C
-4.5 -4.5
-40°C
-5 -5
3 6 9 12 15 18 21 24 27 30 33 36 -0.5 0 0.5 1 1.5 2 2.5 3 3.5
Supply Voltage (V) Input Voltage (V)
Figure 6-20. Input Bias Current vs. Supply Voltage Figure 6-21. Input Bias Current vs. Input Voltage at 5V
0 1
-0.5 VS=12V 0.5 VS=36V
0
-1
-0.5
-1.5
-1
-2 -1.5
-2.5 -2
-3 -2.5
-3.5 125°C -3
125°C
85°C -3.5 85°C
-4 25°C 25°C
-4
0°C 0°C
-4.5
-40°C -4.5 -40°C
-5 -5
-0.5 0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 10.5 0 4 8 12 16 20 24 28 32 36
Figure 6-22. Input Bias Current vs. Input Voltage at 12V Figure 6-23. Input Bias Current vs. Input Voltage at 36V

noted.
10 10
VS = 3V VS = 5V
Output Voltage to GND (V)

1 1
100m 100m
125°C 125°C
10m 85°C 10m 85°C
25°C 25°C
0°C 0°C
-40°C -40°C
1m 1m
10P 100P 1m 10m 100m 10P 100P 1m 10m 100m
Output Sinking Current (A) Output Sinking Current (A)
Figure 6-24. Output Low Voltage vs. Output Sinking Current at Figure 6-25. Output Low Voltage vs. Output Sinking Current at
3V 5V
10 10
VS = 12V VS = 36V
1 1
100m 100m
125°C 125°C
10m 85°C 10m 85°C
25°C 25°C
0°C 0°C
-40°C -40°C
1m 1m
10P 100P 1m 10m 100m 10P 100P 1m 10m 100m
Output Sinking Current (A) Output Sinking Current (A)
Figure 6-26. Output Low Voltage vs. Output Sinking Current at Figure 6-27. Output Low Voltage vs.Output Sinking Current at
12V 36V
100 100
50 Output set high 50 Output set high
Output High Leakage to GND (nA)
Output High Leakage to GND (nA)
VOUT = VS VOUT = VS
20 20
10 10
5 5
2 2
1 1
0.5 0.5
0.2 0.2
0.1 0.1
0.05 0.05
0.02 0.02
0.01 0.01
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Figure 6-28. Output High Leakage Current vs.Temperature at 5V Figure 6-29. Output High Leakage Current vs. Temperature at
36V

noted.
1000 1000
VS = 5V 125°C VS = 5V 125°C
900 900
Propagation Delay, High to Low (ns)
Propagation Delay, Low to High (ns)

VCM = 0V 85°C VCM = 0V 85°C
800 CL = 15pF 25°C 800 CL = 15pF 25°C
RP = 5.1k -40°C RP = 5.1k -40°C
700 700
600 600
500 500
400 400
300 300
200 200
100 100
0 0
5 10 100 1000 5 10 100 1000
Input Overdrive (mV) Input Overdrive (mV)
Figure 6-30. High to Low Propagation Delay vs. Input Overdrive Figure 6-31. Low to High Propagation Delay vs. Input Overdrive
Voltage, 5V Voltage, 5V
1000 1000
VS = 12V 125°C VS = 12V 125°C
900 900

VCM = 0V 85°C VCM = 0V 85°C
800 CL = 15pF 25°C 800 CL = 15pF 25°C
RP = 5.1k -40°C RP = 5.1k -40°C
700 700
600 600
500 500
400 400
300 300
200 200
100 100
0 0
5 10 100 1000 5 10 100 1000
1000 1000
VS = 36V 125°C VS = 36V 125°C
900 900
VCM = 0V 85°C VCM = 0V 85°C

800 CL = 15pF 25°C 800 CL = 15pF 25°C
RP = 5.1k -40°C RP = 5.1k -40°C
700 700
600 600
500 500
400 400
300 300
200 200
100 100
0 0
5 10 100 1000 5 10 100 1000

noted.
6 6
VREF = VCC/2 VREF = VCC/2
5 5
4 4
Output Voltage (V)
Output Voltage (V)

20mV Overdrive 20mV Overdrive
3 3
100mV
2 5mV 2 Overdrive
Overdrive 5mV Overdrive
1 100mV 1
Overdrive
0 0
-1 -1
-0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1
Time (Ps) Time (Ps)
Figure 6-36. Response Time for Various Overdrives, High-to- Figure 6-37. Response Time for Various Overdrives, Low-to-
Low Transition High Transition
7 Detailed Description
7.1 Overview
These dual comparators have the ability to operate up to absolute maximum of 36 V (38 V for the "B" version) on
the supply pin. This device has proven ubiquity and versatility across a wide range of applications. This is due to
very wide supply voltages range, low Iq and fast response of the devices.
The open-drain output allows the user to configure the output's logic high voltage (VOH) and can be used to
enable the comparator to be used in AND functionality.
7.2 Functional Block Diagram
VCC
80-µA
Current Regulator
10 µA 60 µA 10 µA 80 µA
COMPONENT COUNT
Epi-FET 1
Diodes 2
IN+ Resistors 2
OUT Transistors 30
IN−
GND
Figure 7-1. Schematic (Each Comparator)
7.3 Feature Description

The comparator consists of a PNP darlington pair input, allowing the device to operate with very high gain and
fast response with minimal input bias current. The input Darlington pair creates a limit on the input common
mode voltage capability, allowing the comparator to accurately function from ground to VCC– 1.5 V input. Allow
for VCC– 2 V at cold temperature.
The output consists of an open drain NPN (pull-down or low side) transistor. The output NPN sinks current when
the negative input voltage is higher than the positive input voltage and the offset voltage. The VOL is resistive
and scales with the output current. See Figure 6-3 for VOL values with respect to the output current.
7.4 Device Functional Modes
7.4.1 Voltage Comparison
The device operates solely as a voltage comparator, comparing the differential voltage between the positive and
negative pins and outputting a logic low or high impedance (logic high with pullup) based on the input differential
polarity.
8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information

The device is typically used to compare a single signal to a reference or two signals against each other. Many
users take advantage of the open drain output to drive the comparison logic output to a logic voltage level to an
MCU or logic device. The wide supply range and high voltage capability makes this comaprator optimal for level
shifting to a higher or lower voltage.
8.2 Typical Application
VLOGIC VLOGIC
VSUP VSUP Rpullup
Rpullup
Vin + Vin+ +
½ LM2903 ½ LM2903
Vref Vin-
CL CL
Figure 8-1. Single-Ended and Differential Comparator Configurations
8.2.1 Design Requirements

For this design example, use the parameters listed in Table 8-1 as the input parameters.
Table 8-1. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
Input Voltage Range 0 V to Vsup-2 V
Supply Voltage 4.5 V to VCC maximum
Logic Supply Voltage 0 V to VCC maximum
Output Current (RPULLUP) 1 µA to 4 mA
Input Overdrive Voltage 100 mV
Reference Voltage 2.5 V
Load Capacitance (CL) 15 pF
8.2.2 Detailed Design Procedure

When using the device in a general comparator application, determine the following:
• Input Voltage Range
• Minimum Overdrive Voltage
• Output and Drive Current
• Response Time
8.2.2.1 Input Voltage Range
When choosing the input voltage range, the input common mode voltage range (VICR) must be taken in to
account. If temperature operation is below 25°C the VICR can range from 0 V to VCC– 2.0 V. This limits the input
voltage range to as high as VCC– 2.0 V and as low as 0 V. Operation outside of this range can yield incorrect
comparisons.
The following is a list of input voltage situation and their outcomes:
1. When both IN- and IN+ are both within the common-mode range:
a. If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking
current
b. If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is
not conducting
2. When IN- is higher than common-mode and IN+ is within common-mode, the output is low and the output
transistor is sinking current
3. When IN+ is higher than common-mode and IN- is within common-mode, the output is high impedance and
the output transistor is not conducting
4. When IN- and IN+ are both higher than common-mode, see Section 2 of Application Design Guidelines for
LM339, LM393, TL331 Family Comparators Including the New B-versions.
8.2.2.2 Minimum Overdrive Voltage

Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the
comparator over the offset voltage (VIO). To make an accurate comparison the Overdrive Voltage (VOD) should
be higher than the input offset voltage (VIO). Overdrive voltage can also determine the response time of the
comparator, with the response time decreasing with increasing overdrive. Figure 8-2 and Figure 8-3 show
positive and negative response times with respect to overdrive voltage.
8.2.2.3 Output and Drive Current
Output current is determined by the load/pull-up resistance and logic/pullup voltage. The output current produces
a output low voltage (VOL) from the comparator. In which VOL is proportional to the output current. Use Section
6.14 to determine VOL based on the output current.
The output current can also effect the transient response. See Section 8.2.2.4 for more information.
8.2.2.4 Response Time
Response time is a function of input over drive. See Section 8.2.3 for typical response times. The rise and
falls times can be determined by the load capacitance (CL), load/pullup resistance (RPULLUP) and equivalent
collector-emitter resistance (RCE).
• The rise time (τR) is approximately τR ~ RPULLUP × CL
• The fall time (τF) is approximately τF ~ RCE × CL
– RCE can be determine by taking the slope of Section 6.14 in its linear region at the desired temperature, or
by dividing the VOL by Iout
8.2.3 Application Curves

The following curves were generated with 5 V on VCC and VLogic, RPULLUP = 5.1 kΩ, and 50 pF scope probe.
6 6
5 5
Output Voltage, Vo(V)
Output Voltage (Vo)

4 4
3 3
2 5mV OD 2
5mV OD
1 20mV OD 1
20mV OD
0 0
100mV OD 100mV OD
±1 ±1
-0.25 0.25 0.75 1.25 1.75 2.25 ±0.25 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Time (usec) C004 Time (usec) C006
Figure 8-2. Response Time for Various Overdrives Figure 8-3. Response Time for Various Overdrives
(Positive Transition) (Negative Transition)
8.2.4 Power Supply Recommendations

For fast response and comparison applications with noisy or AC inputs, TI recommends to use a bypass
capacitor on the supply pin to reject any variation on the supply voltage. This variation can eat into the input
common-mode range of the comparator and create an inaccurate comparison.
8.2.5 Layout
8.2.5.1 Layout Guidelines
For accurate comparator applications without hysteresis it is important maintain a stable power supply with
minimized noise and glitches. To achieve this, it is best to add a bypass capacitor between the supply voltage
and ground. This should be implemented on the positive power supply and negative supply (if available). If a
negative supply is not being used, do not put a capacitor between the IC's GND pin and system ground.
Minimize coupling between outputs and inverting inputs to prevent output oscillations. Do not run output and
inverting input traces in parallel unless there is a VCC or GND trace between output and inverting input traces to
reduce coupling. When series resistance is added to inputs, place resistor close to the device.
8.2.5.2 Layout Example
Better Ground
PF
1 1OUT VCC 8 VCC
Input Resistors
Close to device
2 1IN- 2OUT 7 OK
VCC or GND
3 1IN+ 2IN- 6
Ground 4 GND 2IN+ 5
Figure 8-4. LM2903 Layout Example
9 Device and Documentation Support

9.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
9.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
9.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
9.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
9.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 27-Jun-2024
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM193DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 LM193 Samples
LM193DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 LM193 Samples
LM2903AVQDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV Samples
LM2903AVQDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV Samples
LM2903AVQPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV Samples
LM2903AVQPWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV Samples
LM2903BIDDFR ACTIVE SOT-23-THIN DDF 8 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903B Samples
LM2903BIDGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 903B Samples
LM2903BIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2903B Samples
LM2903BIDSGR ACTIVE WSON DSG 8 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 903B Samples
LM2903BIPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2903B Samples
LM2903DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAUAG | SN Level-1-260C-UNLIM -40 to 125 (MAP, MAS, MAU) Samples
LM2903DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 LM2903 Samples
LM2903DRG3 ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM2903 Samples
LM2903P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 LM2903P Samples
LM2903PSR ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 Samples
LM2903PWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 L2903 Samples
LM2903PWRG3 ACTIVE TSSOP PW 8 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L2903 Samples
LM2903PWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 Samples
LM2903QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q Samples
Addendum-Page 1
(6)
LM2903VQDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V Samples
LM2903VQPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V Samples
LM293ADGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 (MDP, MDS, MDU) Samples
LM293ADGKRG4 ACTIVE VSSOP DGK 8 2500 TBD Call TI Call TI -25 to 85 Samples
LM293ADR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A Samples
LM293ADRG4 LIFEBUY SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 (MCP, MCS, MCU) Samples
LM293DGKRG4 ACTIVE VSSOP DGK 8 2500 TBD Call TI Call TI -25 to 85 Samples
LM293DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM293 Samples
LM293DRG3 ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -25 to 85 LM293 Samples
LM293P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type -25 to 85 LM293P Samples
LM293PE4 ACTIVE PDIP P 8 50 TBD Call TI Call TI -25 to 85 Samples
LM393ADGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M8P, M8S, M8U) Samples
LM393ADGKRG4 ACTIVE VSSOP DGK 8 2500 TBD Call TI Call TI 0 to 70 Samples
LM393ADR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM393A Samples
LM393AP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type 0 to 70 LM393AP Samples
LM393APE4 ACTIVE PDIP P 8 50 TBD Call TI Call TI 0 to 70 Samples
LM393APSR ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L393A Samples
LM393APWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L393A Samples
LM393BIDDFR ACTIVE SOT-23-THIN DDF 8 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 393B Samples
LM393BIDGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 393B Samples
Addendum-Page 2
(6)
LM393BIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM393B Samples
LM393BIDSGR ACTIVE WSON DSG 8 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 393B Samples
LM393BIPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM393B Samples
LM393DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 (M9P, M9S, M9U) Samples
LM393DGKRG4 ACTIVE VSSOP DGK 8 2500 TBD Call TI Call TI 0 to 70 Samples
LM393DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM393 Samples
LM393DRG3 ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM393 Samples
LM393P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type 0 to 70 LM393P Samples
LM393PE3 ACTIVE PDIP P 8 50 RoHS & SN N / A for Pkg Type 0 to 70 LM393P Samples
Non-Green
LM393PE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 LM393P Samples
LM393PS ACTIVE SO PS 8 80 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L393 Samples
LM393PSR ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L393 Samples
LM393PSRG4 ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L393 Samples
LM393PWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L393 Samples
LM393PWRG3 ACTIVE TSSOP PW 8 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 L393 Samples
LM393PWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L393 Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 3
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM2903, LM2903B, LM293 :
• Automotive : LM2903-Q1, LM2903B-Q1

• Enhanced Product : LM293-EP
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS TAPE DIMENSIONS

K0 P1
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2 Q1 Q2
Q3 Q4 Q3 Q4 User Direction of Feed
Pocket Quadrants
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM193DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903AVQDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903AVQDR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1
LM2903AVQDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903AVQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903AVQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903BIDDFR SOT-23- DDF 8 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
THIN
LM2903BIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2903BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903BIDSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2
LM2903BIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
Pack Materials-Page 1

(mm) W1 (mm)
LM2903DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903PSR SO PS 8 2000 330.0 16.4 8.35 6.6 2.4 12.0 16.0 Q1
LM2903PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903VQDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903VQDR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1
LM2903VQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903VQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM293ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393APSR SO PS 8 2000 330.0 16.4 8.35 6.6 2.4 12.0 16.0 Q1
LM393APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM393APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

(mm) W1 (mm)
LM393BIDDFR SOT-23- DDF 8 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
THIN
LM393BIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM393BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393BIDSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2
LM393BIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393PSR SO PS 8 2000 330.0 16.4 8.35 6.6 2.4 12.0 16.0 Q1
LM393PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM393PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM393PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM193DR SOIC D 8 2500 350.0 350.0 43.0
LM2903AVQDR SOIC D 8 2500 340.5 338.1 20.6
LM2903AVQDR SOIC D 8 2500 340.5 338.1 20.6
LM2903AVQDRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2903AVQPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM2903AVQPWRG4 TSSOP PW 8 2000 356.0 356.0 35.0
LM2903BIDDFR SOT-23-THIN DDF 8 3000 210.0 185.0 35.0
LM2903BIDGKR VSSOP DGK 8 2500 366.0 364.0 50.0
LM2903BIDR SOIC D 8 2500 356.0 356.0 35.0
LM2903BIDR SOIC D 8 2500 340.5 338.1 20.6
LM2903BIDSGR WSON DSG 8 3000 210.0 185.0 35.0
LM2903BIPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM2903DGKR VSSOP DGK 8 2500 366.0 364.0 50.0
LM2903DR SOIC D 8 2500 340.5 338.1 20.6
LM2903DR SOIC D 8 2500 340.5 338.1 20.6
LM2903DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM2903DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2903DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2903PSR SO PS 8 2000 356.0 356.0 35.0
LM2903PWR TSSOP PW 8 2000 356.0 356.0 35.0
LM2903PWR TSSOP PW 8 2000 356.0 356.0 35.0
LM2903PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM2903PWRG4 TSSOP PW 8 2000 356.0 356.0 35.0
LM2903VQDR SOIC D 8 2500 340.5 338.1 20.6
LM2903VQDR SOIC D 8 2500 340.5 338.1 20.6
LM2903VQPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM2903VQPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM293ADGKR VSSOP DGK 8 2500 366.0 364.0 50.0
LM293ADR SOIC D 8 2500 340.5 338.1 20.6
LM293ADR SOIC D 8 2500 340.5 338.1 20.6
LM293ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM293ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM293ADRG4 SOIC D 8 2500 356.0 356.0 35.0
LM293ADRG4 SOIC D 8 2500 356.0 356.0 35.0
LM293DGKR VSSOP DGK 8 2500 370.0 355.0 55.0
LM293DGKR VSSOP DGK 8 2500 366.0 364.0 50.0
LM293DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
LM293DR SOIC D 8 2500 356.0 356.0 35.0
LM293DR SOIC D 8 2500 356.0 356.0 35.0
LM293DR SOIC D 8 2500 340.5 338.1 20.6
LM293DR SOIC D 8 2500 340.5 338.1 20.6
LM293DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM393ADR SOIC D 8 2500 340.5 338.1 20.6
LM393ADR SOIC D 8 2500 340.5 338.1 20.6
LM393ADR SOIC D 8 2500 356.0 356.0 35.0
LM393ADR SOIC D 8 2500 356.0 356.0 35.0
LM393ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393APSR SO PS 8 2000 356.0 356.0 35.0
LM393APWR TSSOP PW 8 2000 356.0 356.0 35.0
LM393APWR TSSOP PW 8 2000 356.0 356.0 35.0
LM393BIDDFR SOT-23-THIN DDF 8 3000 210.0 185.0 35.0
LM393BIDGKR VSSOP DGK 8 2500 366.0 364.0 50.0
LM393BIDR SOIC D 8 2500 356.0 356.0 35.0
LM393BIDR SOIC D 8 2500 340.5 338.1 20.6
LM393BIDSGR WSON DSG 8 3000 210.0 185.0 35.0
LM393BIPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM393DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
LM393DGKR VSSOP DGK 8 2500 366.0 364.0 50.0
LM393DGKR VSSOP DGK 8 2500 346.0 346.0 35.0
LM393DR SOIC D 8 2500 340.5 338.1 20.6
LM393DR SOIC D 8 2500 340.5 338.1 20.6
LM393DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM393DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393PSR SO PS 8 2000 356.0 356.0 35.0
LM393PWR TSSOP PW 8 2000 356.0 356.0 35.0
LM393PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM393PWRG4 TSSOP PW 8 2000 356.0 356.0 35.0
TUBE
T - Tube
height L - Tube length
W - Tube
width
B - Alignment groove width

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
LM2903P P PDIP 8 50 506 13.97 11230 4.32
LM2903P P PDIP 8 50 506 13.97 11230 4.32
LM2903QD D SOIC 8 75 505.46 6.76 3810 4
LM293P P PDIP 8 50 506 13.97 11230 4.32
LM293P P PDIP 8 50 506.1 9 600 5.4
LM393AP P PDIP 8 50 506.1 9 600 5.4
LM393AP P PDIP 8 50 506 13.97 11230 4.32
LM393P P PDIP 8 50 506 13.97 11230 4.32
LM393P P PDIP 8 50 506.1 9 600 5.4
LM393P P PDIP 8 50 506 13.97 11230 4.32
LM393PE3 P PDIP 8 50 506.1 9 600 5.4
LM393PE4 P PDIP 8 50 506 13.97 11230 4.32
LM393PS PS SOP 8 80 530 10.5 4000 4.1
PACKAGE OUTLINE
DDF0008A SCALE 4.000
SOT-23 - 1.1 mm max height
PLASTIC SMALL OUTLINE
C
2.95 SEATING PLANE
TYP
2.65
A PIN 1 ID 0.1 C
AREA
6X 0.65
8
1
2.95
2.85 2X
NOTE 3 1.95
4
5
0.38
8X
0.22
1.65 0.1 C A B
B 1.1 ALTERNATIVE PACKAGE
1.55
MAX SINGULATION VIEW
0.20
TYP
0.08
SEE DETAIL A
0.25
GAGE PLANE
0.1
0 -8 0.6 0.0
0.3
DETAIL A
TYPICAL
4222047/D 04/2024
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
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EXAMPLE BOARD LAYOUT
DDF0008A SOT-23 - 1.1 mm max height
8X (1.05)
SYMM
1
8
8X (0.45)
SYMM
6X (0.65)
5
4
(R0.05)
TYP (2.6)
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK METAL UNDER SOLDER MASK

METAL OPENING
OPENING SOLDER MASK
0.05 MAX EXPOSED EXPOSED

METAL 0.05 MIN
ALL AROUND ALL AROUND METAL
NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
SOLDER MASK DETAILS
4222047/D 04/2024
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DDF0008A SOT-23 - 1.1 mm max height
8X (1.05) SYMM
(R0.05) TYP
1
8
8X (0.45)
SYMM
6X (0.65)
5
4
(2.6)
SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4222047/D 04/2024
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
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D0008A SOIC - 1.75 mm max height
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]

EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK SOLDER MASK

METAL METAL UNDER
OPENING OPENING SOLDER MASK
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND

DEFINED DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)

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D0008A SOIC - 1.75 mm max height
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]

BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
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GENERIC PACKAGE VIEW
DSG 8 WSON - 0.8 mm max height
2 x 2, 0.5 mm pitch PLASTIC SMALL OUTLINE - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224783/A
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PACKAGE OUTLINE
DSG0008A SCALE 5.500
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2.1 B
A
1.9
0.32
PIN 1 INDEX AREA 0.18
2.1
1.9
0.4
0.2
ALTERNATIVE TERMINAL SHAPE

TYPICAL
0.8 C
0.7
SEATING PLANE
0.05 SIDE WALL
0.08 C
0.00 METAL THICKNESS
DIM A
OPTION 1 OPTION 2
0.1 0.2
EXPOSED
THERMAL PAD 0.9 0.1 (DIM A) TYP
4 5
6X 0.5
2X
9
1.5 1.6 0.1
8
1
PIN 1 ID 0.32
8X
(45 X 0.25) 0.4 0.18
8X
0.2 0.1 C A B
0.05 C
4218900/E 08/2022
NOTES:
per ASME Y14.5M.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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DSG0008A WSON - 0.8 mm max height
(0.9) ( 0.2) VIA

8X (0.5)
TYP
1
8
8X (0.25)
(0.55)
SYMM 9
(1.6)
6X (0.5)
5
4
(R0.05) TYP SYMM
(1.9)

SCALE:20X
0.07 MAX 0.07 MIN

SOLDER MASK METAL METAL UNDER SOLDER MASK

OPENING SOLDER MASK OPENING
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4218900/E 08/2022
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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DSG0008A WSON - 0.8 mm max height
8X (0.5) SYMM METAL

1
8
8X (0.25)
(0.45)
SYMM
9
6X (0.5) (0.7)
5
4
(R0.05) TYP (0.9)
(1.9)

EXPOSED PAD 9:
87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
4218900/E 08/2022
NOTES: (continued)
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PACKAGE OUTLINE
PW0008A SCALE 2.800
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
C
6.6 SEATING PLANE
TYP
6.2
A PIN 1 ID 0.1 C
AREA
6X 0.65
8
1
3.1 2X
2.9
NOTE 3 1.95
4
5
0.30
8X
0.19
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.75 0.15
0 -8 0.05
0.50
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
per ASME Y14.5M.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
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PW0008A TSSOP - 1.2 mm max height
8X (1.5)
8X (0.45) SYMM
(R0.05)
1 TYP
8
SYMM
6X (0.65)
5
4
(5.8)

SCALE:10X

METAL OPENING
OPENING SOLDER MASK
0.05 MAX 0.05 MIN


DEFINED DEFINED
SOLDER MASK DETAILS

NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)

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PW0008A TSSOP - 1.2 mm max height
8X (1.5)
SYMM (R0.05) TYP
8X (0.45)
1
8
SYMM
6X (0.65)
5
4
(5.8)

SCALE:10X
4221848/A 02/2015
NOTES: (continued)
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PACKAGE OUTLINE
DGK0008A SCALE 4.000
VSSOP - 1.1 mm max height
C
5.05
TYP
A 4.75
0.1 C
PIN 1 INDEX AREA
SEATING
PLANE
6X 0.65
8
1
2X
3.1
1.95
2.9
NOTE 3
4
5 0.38
8X
0.25
3.1 0.13 C A B
B
2.9
NOTE 4
0.23
0.13
SEE DETAIL A
0.25
GAGE PLANE
1.1 MAX
0.7 0.15
0 -8 0.4 0.05
DETAIL A
A 20
TYPICAL
4214862/A 04/2023
PowerPAD is a trademark of Texas Instruments.
NOTES:
per ASME Y14.5M.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-187.
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TM
DGK0008A VSSOP - 1.1 mm max height
SYMM
8X (1.4) (R0.05) TYP
8X (0.45) 1 8
SYMM
6X (0.65)
5
4
SEE DETAILS
(4.4)

EXPOSED METAL SHOWN
SCALE: 15X

METAL
OPENING SOLDER MASK OPENING
EXPOSED METAL EXPOSED METAL
0.05 MAX 0.05 MIN

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
15.000
4214862/A 04/2023
NOTES: (continued)

8. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
9. Size of metal pad may vary due to creepage requirement.
www.ti.com
TM
DGK0008A VSSOP - 1.1 mm max height
SYMM
8X (1.4) (R0.05) TYP
8X (0.45) 1 8
SYMM
6X (0.65)
5
4
(4.4)

SCALE: 15X
4214862/A 04/2023
NOTES: (continued)
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LM393 Datasheet

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LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V

SLCS005AF – OCTOBER 1979 – REVISED AUGUST 2023

LM393B, LM2903B, LM193, LM293, LM393 and LM2903 Dual Comparators

(1) For all available packages, see the orderable addendum at

Changes from Revision AE (November 2020) to Revision AF (August 2023) Page

Changes from Revision AD (October 2020) to Revision AE (November 2020) Page

Changes from Revision AC (February 2020) to Revision AD (October 2020) Page

Changes from Revision AB (December 2019) to Revision AC (February 2020) Page

Changes from Revision AA (September 2019) to Revision AB (December 2019) Page

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Changes from Revision Z (October 2017) to Revision AA (September 2019) Page

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5 Pin Configuration and Functions

Connect thermal pad directly to GND pin.

Table 5-1. Pin Functions

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6.2 Recommended Operating Conditions

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6.3 Thermal Information: LM193

6.5 Thermal Information: LM393B and LM2903B

6.6 ESD Ratings

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6.7 Electrical Characteristics LM393B

High-level output leakage (V+) = VO = 5 V; VID = 1V 0.1 20 nA

Quiescent current (all VS = 5 V, no load 400 600 µA

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6.8 Electrical Characteristics LM2903B

High-level output leakage (V+) = VO = 5 V; VID = 1V 0.1 20 nA

Quiescent current (all VS = 5 V, no load 400 600 µA

6.9 Switching Characteristics LM393B and LM2903B

(1) High-to-low and low-to-high refers to the transition at the input.

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6.11 Electrical Characteristics for LM293A and LM393A

VCC = 5 V to 30 V, VO = 1.4 V 25°C 1 2

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6.12 Electrical Characteristics for LM2903, LM2903V, and LM2903AV

(1) CL includes probe and jig capacitance.

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IIN – Input Bias Current – nA

Figure 6-3. Output Saturation Voltage

Figure 6-5. Response Time for Various Overdrives Positive Transition

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6.15 Typical Characteristics, LM393B and LM2903B

Total Supply Current (PA)

Total Supply Current (PA)

Total Supply Current (PA)

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6.15 Typical Characteristics, LM393B and LM2903B (continued)

Input Offset Voltage (mV)

Input Offset Voltage (mV)

-1.5 VS = 12V -1.5 VS = 36V

Input Offset Voltage (mV)

-1.5 TA = -40°C -1.5 TA = 25°C

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6.15 Typical Characteristics, LM393B and LM2903B (continued)

Input Offset Voltage (mV)

-1.5 TA = 85°C -1.5 TA = 125qC

-1.5 -40°C -1.5

Input Bias Current (nA)