LM 324

LM124, LM124A, LM224, LM224A, LM224K, LM224KA
LM324, LM324A, LM324B, LM324BA, LM324K, LM324KA

LM2902, LM2902B, LM2902BA, LM2902K, LM2902KV, LM2902KAV
SLOS066AD – SEPTEMBER 1975 – REVISED OCTOBER 2024
LMx24, LMx24x, LMx24xx, LM2902, LM2902x, LM2902xx, LM2902xxx Quadruple

Operational Amplifiers
1 Features with features including low offset (600µV, typical),
common-mode input range to ground, and high
• Next-generation LM324B and LM2902B
differential input voltage capability.
• B versions are drop-in replacements for all
versions of LM224, LM324, and LM2902 The LM324B and LM2902B are unity-gain stable
• Improved specifications of B version and achieve a low offset voltage maximum of 3mV
– Supply range: 3V to 36V (B, BA versions) (2mV maximum for LM324BA and LM2902BA) and
– Low input offset voltage: ±2mV (BA version) / quiescent current of 240µA per amplifier (typical).
3mV (B version) High ESD (2kV HBM and 1.5kV CDM) and integrated
– ESD rating: 2kV (HBM), 1.5kV (CDM) EMI and RF filters enable the LM324B and
– EMI rejection: integrated RF and EMI filter LM2902B devices to be used in the most rugged,
– Low input bias current: 50nA maximum (across environmentally challenging applications.
–40°C to 125°C)
The LM324B and LM2902B can drop-in replace all
• Common-mode input voltage range includes V–
versions of the LM224, LM324, and LM2902 devices.
• Input voltage differential can be driven up to supply
voltage Package Information
• For dual B versions, see LM358B and LM2904B PART NUMBER(1) PACKAGE PACKAGE SIZE(2)
LM324B, LM324BA, LM2902B,
2 Applications LM2902BA, LM324xx, LM224xx,
LM124, LM2902xxx
D (SOIC, 14) 8.65mm × 6mm
• Merchant network and server power supply units LM324B, LM324BA, LM2902B,
LM2902BA, LM324xx, LM124, PW (TSSOP, 14) 5mm × 6.4mm
• Multi-function printers LM2902xxx
• Power supplies and mobile chargers LM324xx, LM224xx, LM2902xxx N (PDIP, 14) 19.3mm × 9.4mm
• Desktop PC and motherboard LM324, LM324A, LM324K,

NS (SOP, 14) 10.3mm × 7.8mm
LM324KA, LM2902, LM2902K
• Indoor and outdoor air conditioners
LM324A, LM2902K DB (SSOP, 14) 6.2mm × 7.8mm
• Washers, dryers, and refrigerators J (CDIP, 14) 19.56mm × 6.67mm
• AC inverters, string inverters, central inverters, and LM124A W (CFP, 14) 9.21mm × 6.3mm
voltage frequency drives FK (LCCC, 20) 8.89mm × 8.89mm
• Uninterruptible power supplies LM324B, LM2902B RTE (WQFN, 16(3)) 3mm × 3mm
3 Description (1) For more information, see Section 11.

(2) The package size (length × width) is a nominal value and
The LM324B and LM2902B devices are the includes pins, where applicable.
next-generation versions of the industry-standard (3) This package is preview only.
operational amplifiers (op amps) LM324 and LM2902,
which include four high-voltage (36V) op amps. These
devices provide outstanding value for cost-sensitive
applications,
Family Comparison
LM2902K
LM324B LM2902B LM324 LM324K LM224 LM224K LM124
SPECIFICATION LM2902 LM2902KV Units
LM324BA LM2902BA LM324A LM324KA LM224A LM224KA LM124A
LM2902KAV
3 to 26 (K)
Supply voltage 3 to 36 3 to 36 3 to 30 3 to 30 3 to 26 3 to 30 (KV, 3 to 30 3 to 30 3 to 30 V
KAV)
±3 ±3 ±7 ±7 ± 7 (K, KV) ±5 ±5 ±5
Offset voltage (max, 25°C) ±7 mV
±2 ±2 ±3 ±3 ± 2 (KAV) ±3 ±3 ±2
Input bias current at 25 °C 20 / 250 20 / 250 20 / 150 20 / 150 20 / 150
10 / 35 10 / 35 20 / 250 20 / 250 nA
(typ / max) 15 / 100 15 / 100 15 / 80 15 / 80 – / 50
ESD (HBM) 2000 2000 500 2000 500 2000 500 2000 500 V
Operating ambient
−40 to 85 −40 to 125 0 to 70 0 to 70 −40 to 125 −40 to 125 −25 to 85 −25 to 85 −55 to 125 °C
temperature
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SLOS066AD – SEPTEMBER 1975 – REVISED OCTOBER 2024 www.ti.com
Table of Contents
1 Features............................................................................1 6 Parameter Measurement Information.......................... 21
2 Applications..................................................................... 1 7 Detailed Description......................................................21
3 Description.......................................................................1 7.1 Overview................................................................... 21
4 Pin Configuration and Functions...................................3 7.2 Functional Block Diagram......................................... 22
5 Specifications.................................................................. 5 7.3 Feature Description...................................................23
5.1 Absolute Maximum Ratings........................................ 5 7.4 Device Functional Modes..........................................23
5.2 ESD Ratings............................................................... 5 8 Application and Implementation.................................. 24
5.3 Recommended Operating Conditions.........................5 8.1 Application Information............................................. 24
5.4 Thermal Information....................................................6 8.2 Typical Application.................................................... 24
5.5 Electrical Characteristics - LM324B and LM324BA.... 7 8.3 Power Supply Recommendations.............................25
5.6 Electrical Characteristics - LM2902B and 8.4 Layout....................................................................... 25
LM2902BA.....................................................................9 9 Device and Documentation Support............................27
5.7 Electrical Characteristics for LM324, LM324K, 9.1 Receiving Notification of Documentation Updates....27
LM224, LM224K, and LM124...................................... 11 9.2 Support Resources................................................... 27
5.8 Electrical Characteristics for LM2902, LM2902K, 9.3 Trademarks............................................................... 27
LM2902KV and LM2902KAV.......................................12 9.4 Electrostatic Discharge Caution................................27
5.9 Electrical Characteristics for LM324A, 9.5 Glossary....................................................................27
LM324KA, LM224A, LM224KA, and LM124A............. 13 10 Revision History.......................................................... 27
5.10 Operating Conditions.............................................. 13 11 Mechanical, Packaging, and Orderable
5.11 Typical Characteristics............................................ 14 Information.................................................................... 28
5.12 Typical Characteristics: All Devices Except B 11.1 Package Option Addendum.................................... 29
and BA Versions..........................................................20 11.2 Tape and Reel Information...................................... 30
2 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: LM124 LM124A LM224 LM224A LM224K LM224KA LM324 LM324A LM324B LM324BA LM324K LM324KA LM2902
LM2902B LM2902BA LM2902K LM2902KV LM2902KAV
www.ti.com SLOS066AD – SEPTEMBER 1975 – REVISED OCTOBER 2024
4 Pin Configuration and Functions
1OUT
4OUT
1IN±
4IN±
NC
1OUT 1 14 4OUT
20
19
1IN± 2 13 4IN±
1IN+ 4 18 4IN+
1IN+ 3 12 4IN+
NC 5 17 NC
VCC+ 4 11 VCC±
VCC+ 6 16 VCC±
2IN+ 5 10 3IN+
NC 7 15 NC
2IN± 6 9 3IN± 2IN+ 8 14 3IN+
10
11
12
13
2OUT 7 8 3OUT
9
Not to scale
2IN±
2OUT
NC
3OUT
3IN±
Not to scale
Figure 4-1. D, DB, J, N, NS, PW, and W Packages,

Figure 4-2. FK Package,
14-Pin SOIC, SSOP, CDIP, PDIP, SO, TSSOP, and
20-Pin LCCC
CFP
(Top View)
(Top View)
1OUT
4OUT
1IN-
4IN-
16
15
14
13
1IN+ 1 12 4IN+
VCC+ 2 11 VCC-
Thermal
NC 3 Pad 10 NC
2IN+ 4 9 3IN+
5
8
2IN–
2OUT
3OUT
3IN-
Not to scale
NOTE: RTE package is preview only
Figure 4-3. RTE Package,

16-Pin WQFN
(Top View)
Table 4-1. Pin Functions

PIN
SOIC, TSSOP,
PDIP, SSOP, TYPE(1) DESCRIPTION
NAME LCCC WQFN
SO, CDIP, and
CFP
1IN– 3 2 16 I Negative input
1IN+ 4 3 1 I Positive input
1OUT 2 1 15 O Output
Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3

Table 4-1. Pin Functions (continued)

PIN
SOIC, TSSOP,
PDIP, SSOP, TYPE(1) DESCRIPTION
NAME LCCC WQFN
SO, CDIP, and
CFP
VCC- 16 11 11 — Negative (lowest) supply or ground (for single-supply operation)
1, 5, 7, 11, 15,
NC — 3, 10 — Do not connect
17
VCC+ 6 4 2 — Positive (highest) supply
(1) I = input, O = output
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
LM324B, LM324BA, LM324xx, LM224xx,
LM2902
LM2902B, LM2902BA LM2902xxx, LM124x UNIT
MIN MAX MIN MAX MIN MAX
Supply voltage, VCC (2) 40 26 32 V
Differential input voltage, VID (3) ±40 ±26 ±32 V
Input voltage, VI (either input) –0.3 40 –0.3 26 –0.3 32 V
Duration of output short circuit (one amplifier) to ground
Unlimited Unlimited Unlimited
at (or below) TA = 25°C, VCC ≤ 15 V(4)
Operating virtual junction temperature, TJ 150 150 150 °C
Case temperature for 60 seconds FK package 260 °C
Lead temperature 1.6 mm (1/16
J or W package 300 300 °C
inch) from case for 60 seconds
Storage temperature, Tstg –65 150 –65 150 –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
(3) Differential voltages are at IN+, with respect to IN−.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
5.2 ESD Ratings

VALUE UNIT
LM324B, LM324BA, LM2902B, LM2902BA, LM224K, LM224KA,
LM324K, LM324KA, LM2902K, LM2902KV, LM2902KAV
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101 ±1000
LM124, LM124A, LM224, LM224A, LM324, LM324A, LM2902
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101 ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
LM324B, LM324BA, LM324xx, LM224xx,
LM2902
LM2902B, LM2902BA LM2902xxx, LM124x UNIT
MIN MAX MIN MAX MIN MAX
VCC Supply voltage 3 36 3 26 3 30 V
VCM Common-mode voltage 0 VCC – 2 0 VCC – 2 0 VCC – 2 V
LM124x –55 125
LM2902xxx,
-40 125 –40 125
LM2902Bx
TA Operating free air
°C
temperature LM324Bx -40 85
LM224xx –25 85
LM324xx 0 70

5.4 Thermal Information

LMx24, LM2902 LMx24
D DB N NS PW RTE FK J W
THERMAL METRIC(1) (SOIC) (SSOP) (PDIP) (SO) (TSSOP) (WQFN) (LCCC) (CDIP) (CFP) UNIT
(5)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 16 PINS 20 PINS 14 PINS 14 PINS

RθJA (2) (3) Junction-to-
ambient thermal 99.3 106.5 83.5 90.4 124.7 64.9 74.5 84.7 153.4 °C/W
resistance
RθJC(top) (4) Junction-to-case
(top) thermal 60.4 55.5 62.0 48.0 57.9 68.8 49.9 37.5 72.7 °C/W
resistance
RθJB 57.5 56.8 57.7 49.2 80.7 40.2 49.0 72.2 146.5
ψJT 19.8 18.2 40.5 14.4 8.4 4.9 42.9 31.0 48.3
ψJB 57.0 55.8 57.1 48.8 79.8 40.0 48.9 67.3 129.2
RθJC(bot) Junction-to-case
(bottom) thermal — — — — — 23.6 7.3 18.8 10.1 °C/W
resistance
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
note.
(2) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(3) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) Maximum power dissipation is a function of TJ(max), RθJA, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) – TC)/RθJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
(5) This package is preview only.
5.5 Electrical Characteristics - LM324B and LM324BA

For VS = (V+) – (V–) = 5 V to 36 V (±2.5 V to ±18 V), at TA = 25°C, VCM = VOUT = VS / 2, and RL = 10 kΩ connected to VS / 2
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
±0.6 ±3.0
LM324B
TA = –40°C to 85°C ±4.0
VOS Input offset voltage mV
±0.3 ±2
LM324BA
TA = –40°C to 85°C 2.5
dVOS/dT Input offset voltage drift RS = 0 Ω TA = –40°C to 85°C ±7 μV/°C
Input offset voltage versus
PSRR 65 100 dB
power supply
Channel separation f = 1 kHz to 20 kHz 120 dB
INPUT VOLTAGE RANGE
Common-mode voltage VS = 3 V to 36 V V– (V+) – 1.5

VCM V
range VS = 5 V to 36 V TA = –40°C to 85°C V– (V+) – 2
Common-mode rejection (V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V 70 80

CMRR dB
ratio (V–) ≤ VCM ≤ (V+) – 2 V VS = 5 V to 36 V TA = –40°C to 85°C 65 80
INPUT BIAS CURRENT
-10 -35
IB Input bias current nA
TA = –40°C to 85°C -60
dIOS/dT Input offset current drift TA = –40°C to 85°C 10 pA/°C
±0.5 ±4
IOS Input offset current nA
TA = –40°C to 85°C ±5
NOISE
EN Input voltage noise f = 0.1 to 10 Hz 3 μVPP
eN Input voltage noise density RS = 100 Ω, VI = 0 V, f = 1 kHz (see Figure 7-2 for test circuit) 35 nV/√Hz
INPUT CAPACITANCE
ZID Differential 10 || 0.1 MΩ || pF
ZICM Common-mode 4 || 1.5 GΩ || pF
OPEN-LOOP GAIN
VS = 15 V, VO = 1 V to 11 V, RL ≥ 10 kΩ, connected to 50 100

AOL Open-loop voltage gain V/mV
(V-) TA = –40°C to 85°C 25
FREQUENCY RESPONSE
GBW Gain-bandwidth product RL = 1 MΩ, CL = 20 pF (see Figure 7-1 for test circuit) 1.2 MHz
SR Slew rate RL = 1 MΩ, CL = 30 pF, VI = ±10 V (see Figure 7-1 for test circuit) 0.5 V/μs
Θm Phase margin G = + 1, RL = 10kΩ, CL = 20 pF 56 °
tS Settling time To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF 4 μs
Overload recovery time VIN × gain > VS 10 μs
Total harmonic distortion + G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36 V, RL = 100 kΩ, IOUT ≤ 50 µA, BW = 80
THD+N 0.001%
noise kHz
OUTPUT
VO IOUT = -50 µA 1.35 1.5 V
VO Positive Rail (V+) IOUT = -1 mA 1.4 1.6 V
VO IOUT = -5 mA 1.5 1.75 V
Voltage output swing from
VO rail IOUT = 50 µA 100 150 mV
VO IOUT = 1 mA 0.75 1 V
Negative Rail (V-)
VS = 5 V, RL ≤ 10 kΩ
VO TA = –40°C to 85°C 5 20 mV
connected to (V–)
-20(1) -30 mA
VS = 15 V; VO = V-; VID = 1 V Source
TA = –40°C to 85°C -10(1) mA
IO Output current VS = 15 V; VO = V+; VID = -1 10(1) 20 mA
Sink
V TA = –40°C to 85°C 5(1) mA
VID = -1 V; VO = (V-) + 200 mV 50 85 μA
ISC Short-circuit current VS = 20 V, (V+) = 10 V, (V-) = -10 V, VO = 0 V ±40 ±60 mA
CLOAD Capacitive load drive 100 pF

5.5 Electrical Characteristics - LM324B and LM324BA (continued)

Open-loop output
RO f = 1 MHz, IO = 0 A 300 Ω
impedance
POWER SUPPLY
Quiescent current per VS = 5 V; IO = 0 A TA = –40°C to 85°C 240 300 μA

IQ
amplifier VS = 36 V; IO = 0 A TA = –40°C to 85°C 350 750 μA
(1) Specified by design and characterization only.
5.6 Electrical Characteristics - LM2902B and LM2902BA

OFFSET VOLTAGE
±0.6 ±3.0
LM2902B
TA = –40°C to 125°C ±4.0
VOS Input offset voltage mV
±0.3 ±2
LM2902BA
TA = –40°C to 125°C 2.5
dVOS/dT Input offset voltage drift RS = 0 Ω TA = –40°C to 125°C ±7 μV/°C
Input offset voltage versus
PSRR 65 100 dB
power supply
Channel separation f = 1 kHz to 20 kHz 120 dB
INPUT VOLTAGE RANGE
Common-mode voltage VS = 3 V to 36 V V– (V+) – 1.5

VCM V
range VS = 5 V to 36 V TA = –40°C to 125°C V– (V+) – 2
Common-mode rejection (V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V 70 80

CMRR dB
ratio (V–) ≤ VCM ≤ (V+) – 2 V VS = 5 V to 36 V TA = –40°C to 125°C 65 80
INPUT BIAS CURRENT
-10 -35
IB Input bias current nA
TA = –40°C to 125°C -60
±0.5 ±4
IOS Input offset current nA
TA = –40°C to 125°C ±5
NOISE
EN Input voltage noise f = 0.1 to 10 Hz 3 μVPP
eN Input voltage noise density RS = 100 Ω, VI = 0 V, f = 1 kHz (see Figure 7-2 for test circuit) 35 nV/√Hz
INPUT CAPACITANCE
ZID Differential 10 || 0.1 MΩ || pF
ZICM Common-mode 4 || 1.5 GΩ || pF
OPEN-LOOP GAIN
VS = 15 V, VO = 1 V to 11 V, RL ≥ 10 kΩ, connected to 50 100

AOL Open-loop voltage gain V/mV
(V-) TA = –40°C to 125°C 25
FREQUENCY RESPONSE
GBW Gain-bandwidth product RL = 1 MΩ, CL = 20 pF (see Figure 7-1 for test circuit) 1.2 MHz
SR Slew rate RL = 1 MΩ, CL = 30 pF, VI = ±10 V (see Figure 7-1 for test circuit) 0.5 V/μs
Θm Phase margin G = + 1, RL = 10kΩ, CL = 20 pF 56 °
tS Settling time To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF 4 μs
Overload recovery time VIN × gain > VS 10 μs
Total harmonic distortion + G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36V, RL = 100 kΩ, IOUT ≤ 50 µA, BW = 80
THD+N 0.001%
noise kHz
OUTPUT
VO IOUT = -50 µA 1.35 1.5 V
VO Positive Rail (V+) IOUT = -1 mA 1.4 1.6 V
VO IOUT = -5 mA 1.5 1.75 V
Voltage output swing from
VO rail IOUT = 50 µA 100 150 mV
VO IOUT = 1 mA 0.75 1 V
Negative Rail (V-)
VS = 5 V, RL ≤ 10 kΩ
VO TA = –40°C to 125°C 5 20 mV
connected to (V–)
-20(1) -30 mA
VS = 15 V; VO = V-; VID = 1 V Source
TA = –40°C to 125°C -10(1) mA
IO Output current VS = 15 V; VO = V+; VID = -1 10(1) 20 mA
Sink
V TA = –40°C to 125°C 5(1) mA
VID = -1 V; VO = (V-) + 200 mV 50 85 μA
ISC Short-circuit current VS = 20 V, (V+) = 10 V, (V-) = -10 V, VO = 0 V ±40 ±60 mA
CLOAD Capacitive load drive 100 pF

5.6 Electrical Characteristics - LM2902B and LM2902BA (continued)

Open-loop output
RO f = 1 MHz, IO = 0 A 300 Ω
impedance
POWER SUPPLY
Quiescent current per VS = 5 V; IO = 0 A TA = –40°C to 125°C 240 300 μA

IQ
amplifier VS = 36 V; IO = 0 A TA = –40°C to 125°C 750 μA
(1) Specified by design and characterization only.
5.7 Electrical Characteristics for LM324, LM324K, LM224, LM224K, and LM124
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM124, LM224, LM224K LM324, LM324K
PARAMETER TEST CONDITIONS(1) TA (2) UNIT
MIN TYP(3) MAX MIN TYP(3) MAX
VCC = 5 V to MAX, VIC = VICRmin, 25°C 3 5 3 7

VIO Input offset voltage mV
VO = 1.4 V Full range 7 9
25°C 2 30 2 50
IIO Input offset current VO = 1.4 V nA
Full range 100 150
25°C –20 –150 –20 –250
IIB Input bias current VO = 1.4 V nA
Full range –300 –500
0 to 0 to
25°C
VCC – 1.5 VCC – 1.5
VICR Common-mode input voltage range VCC = 5 V to MAX V
0 to 0 to
Full range
VCC – 2 VCC – 2
RL = 2 kΩ 25°C VCC – 1.5 VCC – 1.5
VOH High-level output voltage RL = 2 kΩ Full range 26 26 V
VCC = MAX
RL ≥ 10 kΩ Full range 27 28 27 28
VOL Low-level output voltage RL ≤ 10 kΩ Full range 5 20 5 20 mV
Large-signal differential voltage VCC+ = 15 V, VO = 1 V to 11 V, 25°C 50 100 25 100

AVD V/mV
amplification RL ≥ 2 kΩ Full range 25 15
CMRR Common-mode rejection ratio VIC = VICRmin 25°C 70 80 65 80 dB
Supply-voltage rejection ratio
kSVR 25°C 65 100 65 100 dB
(ΔVCC /ΔVIO)
VO1/ VO2 Crosstalk attenuation f = 1 kHz to 20 kHz 25°C 120 120 dB
VCC = 15 V, 25°C –20 –30 –60 –20 –30 –60
VID = 1 V, Source
VO = 0 Full range –10 –10
mA
IO Output current VCC = 15 V, 25°C 10 20 10 20
VID = –1 V, Sink
VO = 15 V Full range 5 5
VID = –1 V, VO = 200 mV 25°C 12 30 12 30 μA

VCC at 5 V, VO = 0,
IOS Short-circuit output current 25°C ±40 ±60 ±40 ±60 mA
VCC- at –5 V
VO = 2.5 V, no load Full range 0.7 1.2 0.7 1.2
ICC Supply current (four amplifiers) VCC = MAX, VO = 0.5 VCC, mA
Full range 1.4 3 1.4 3
no load
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX
VCC for testing purposes is 26 V for LM2902 and 30 V for the others.
(2) Full range is –55°C to +125°C for LM124, –25°C to +85°C for LM224, and 0°C to 70°C for LM324.
(3) All typical values are at TA = 25°C.

5.8 Electrical Characteristics for LM2902, LM2902K, LM2902KV and LM2902KAV

LM2902, LM2902K LM2902KV, LM2902KAV
MIN TYP(3) MAX MIN TYP(3) MAX
Non-A-suffix 25°C 3 7 3 7
VCC = 5 V to MAX, devices Full range 10 10
VIO Input offset voltage VIC = VICRmin, mV
VO = 1.4 V A-suffix 25°C 1 2
devices Full range 4
ΔVIO/ΔT Input offset voltage temperature drift RS = 0 Ω Full range 7 μV/°C
25°C 2 50 2 50
IIO Input offset current VO = 1.4 V nA
Full range 300 150
ΔIIO/ΔT Input offset voltage temperature drift Full range 10 pA/°C
25°C –20 –250 –20 –250
IIB Input bias current VO = 1.4 V nA
Full range –500 –500
0 to 0 to
25°C
VCC – 1.5 VCC – 1.5
VICR Common-mode input voltage range VCC = 5 V to MAX V
0 to 0 to
Full range
VCC – 2 VCC – 2
RL = 10 kΩ 25°C VCC – 1.5 VCC – 1.5
VOH High-level output voltage RL = 2 kΩ Full range 22 26 V
VCC = MAX
RL ≥ 10 kΩ Full range 23 24 27
VOL Low-level output voltage RL ≤ 10 kΩ Full range 5 20 5 20 mV
VCC = 15 V, 25°C 25 100 25 100
Large-signal differential voltage
AVD VO = 1 V to 11 V, V/mV
amplification Full range 15 15
RL ≥ 2 kΩ
CMRR Common-mode rejection ratio VIC = VICRmin 25°C 50 80 60 80 dB
Supply-voltage rejection ratio
kSVR 25°C 50 100 60 100 dB
(ΔVCC /ΔVIO)
VO1/ VO2 Crosstalk attenuation f = 1 kHz to 20 kHz 25°C 120 120 dB
VCC = 15 V, 25°C –20 –30 –60 –20 –30 –60
VID = 1 V, Source
VO = 0 Full range –10 –10
mA
IO Output current VCC = 15 V, 25°C 10 20 10 20
VID = –1 V, Sink
VO = 15 V Full range 5 5
VID = –1 V, VO = 200 mV 25°C 30 12 40 μA

IOS Short-circuit output current VCC at 5 V, VO = 0, VCC- at –5 V 25°C ±40 ±60 ±40 ±60 mA
VO = 2.5 V, no load Full range 0.7 1.2 0.7 1.2
ICC Supply current (four amplifiers) VCC = MAX, VO = 0.5 VCC, mA
Full range 1.4 3 1.4 3
no load
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX
VCC for testing purposes is 26 V for LM2902 and 32 V for LM2902V.
(2) Full range is –40°C to +125°C for LM2902.
5.9 Electrical Characteristics for LM324A, LM324KA, LM224A, LM224KA, and LM124A
LM124A LM224A, LM224KA LM324A, LM324KA
MIN TYP(3) MAX MIN TYP(3) MAX MIN TYP(3) MAX
VCC = 5 V to 30 V, 25°C 2 2 3 2 3
Input offset
VIO VIC = VICRmin, mV
voltage Full range 4 4 5
VO = 1.4 V
Input offset 25°C 10 2 15 2 30

IIO VO = 1.4 V nA
current Full range 30 30 75
Input bias 25°C –50 –15 –80 –15 –100

IIB VO = 1.4 V nA
current Full range –100 –100 –200
0 to 0 to 0 to
Common-mode 25°C
VCC − 1.5 VCC – 1.5 VCC – 1.5
VICR input voltage VCC = 30 V V
range 0 to 0 to 0 to
Full range
VCC − 2 VCC – 2 VCC – 2
RL = 2 kΩ 25°C VCC − 1.5 VCC – 1.5 VCC – 1.5
High-level output
VOH RL= 2 kΩ Full range 26 26 26 V
voltage VCC = 30 V
RL≥ 10 kΩ Full range 27 27 28 27 28
Low-level output
VOL RL ≤ 10 kΩ Full range 20 5 20 5 20 mV
voltage
Large-signal 25°C 50 100 50 100 25 100
VCC = 15 V,
differential
AVD VO = 1 V to 11 V, V/mV
voltage Full range 25 25 15
RL ≥ 2 kΩ
amplification
Common-mode
CMRR VIC = VICRmin 25°C 70 70 80 65 80 dB
rejection ratio
Supply-voltage
kSVR rejection ratio 25°C 65 65 100 65 100 dB
(ΔVCC /ΔVIO)
Crosstalk
VO1/ VO2 f = 1 kHz to 20 kHz 25°C 120 120 120 dB
attenuation
VCC = 15 V, 25°C –20 –20 –30 –60 –20 –30 –60
VID = 1 V, Source
VO = 0 Full range –10 –10 –10
mA
IO Output current VCC = 15 V, 25°C 10 10 20 1 20
VID = –1 V, Sink
VO = 15 V Full range 5 5 5
VID = −1 V, VO = 200 mV 25°C 12 12 30 12 30 μA

Short-circuit VCC at 5 V, VCC- at –5 V,
IOS 25°C ±40 ±60 ±40 ±60 ±40 ±60 mA
output current VO = 0
VO = 2.5 V, no load Full range 0.7 1.2 0.7 1.2 0.7 1.2
Supply current
ICC VCC = 30 V, VO = 15 V, mA
(four amplifiers) Full range 1.4 3. 1.4 3 1.4 3
no load
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
(2) Full range is –55°C to +125°C for LM124A, –25°C to +85°C for LM224A, and 0°C to 70°C for LM324A.
5.10 Operating Conditions
VCC = ±15 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
SR Slew rate at unity gain RL = 1 MΩ, CL = 30 pF, VI = ±10 V (see Figure 6-1) 0.5 V/μs
B1 Unity-gain bandwidth RL = 1 MΩ, CL = 20 pF (see Figure 6-1) 1.2 MHz
Vn Equivalent input noise voltage RS = 100 Ω, VI = 0 V, f = 1 kHz (see Figure 6-2) 35 nV/√Hz

5.11 Typical Characteristics

This typical characteristics section is applicable for LM324B and LM2902B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
20
17.5
15
Amplifiers (%)
12.5
10
7.5
2.5
0
-3000 -1800 -600 600 1800 3000
Offset Voltage (µV)
Figure 5-1. Offset Voltage Production Distribution
Figure 5-2. Offset Voltage Drift Distribution
3000
2400
1800
1200
600
VOS (µV)
0
-600
-1200
-1800
-2400
-3000
-18 -14 -10 -6 -2 2 6 10 14
VCM (V)
Figure 5-3. Offset Voltage vs Temperature Figure 5-4. Offset Voltage vs Common-Mode Voltage
100 150
90 135
80 120
70 105
60 90
Phase (degree)
50 75
Gain (dB)
40 60
30 45
20 30
10 Gain, VS = 36 V 15
0 Phase, VS = 36 V 0
Gain, VS = 5 V
-10 Phase, VS = 5 V -15
-20 -30
100 1k 10k 100k 1M
Frequency (Hz)
Figure 5-5. Open-Loop Gain and Phase vs Frequency
Figure 5-6. Closed-Loop Gain vs Frequency
5.11 Typical Characteristics (continued)

Figure 5-7. Output Voltage Swing vs Output Current (Sourcing) Figure 5-8. CMRR vs Frequency
100
90
80
70
PSRR (dB)
60
50
40
30 PSRR+ (dB)
PSRR− (dB)
20
100 1k 10k 100k 1M 10M
Frequency (Hz)
Figure 5-9. PSRR vs Frequency Figure 5-10. Common-Mode Rejection Ratio vs
Temperature
20
Power-Supply Rejection Ratio (µV/V)
16
Amplitude (500 nV/div)
12
0
-40 -20 0 20 40 60 80 100 120 Time (1 s/div)
Te mperature (°C)
.
VS = 5 V to 36 V
Figure 5-12. 0.1-Hz to 10-Hz Noise
Figure 5-11. Power Supply Rejection Ratio vs Temperature


-40
RL = 2 k
-50 RL = 10 k
-60
THD+N (dB)
-70
-80
-90
-100
-110
100 1k 10k
Frequency (Hz)
. G = 1, f = 1 kHz, BW = 80 kHz,
. VOUT = 10 VPP, RL connected to V–
Figure 5-13. Input Voltage Noise Spectral Density vs Frequency Figure 5-14. THD+N Ratio vs Frequency, G = 1
G = –1, f = 1 kHz, BW = 80 kHz, G = 1, f = 1 kHz, BW = 80 kHz,

VOUT = 10 VPP, RL connected to V– RL connected to V–
See Section 6 .
Figure 5-15. THD+N Ratio vs Frequency, G = –1 Figure 5-16. THD+N vs Output Amplitude, G = 1
600
-40°C
25°C
500 125°C
400
IQ (µA)
300
200
100
3 6 9 12 15 18 21 24 27 30 33 36
Supply Voltage (V)
G = –1, f = 1 kHz, BW = 80 kHz, .

RL connected to V– .
See Section 6 .
Figure 5-17. THD+N vs Output Amplitude, G = –1 Figure 5-18. Quiescent Current vs Supply Voltage

650 1000
VS = 5 V 700 IOUT = 0 mA
600 VS = 36 V IOUT = 5 mA
Open-Loop Output Impedance ()

500
550
300
500
200
450
IQ (µA)
400 100
70
350
50
300
30
250
20
200
150 10
-40 -20 0 20 40 60 80 100 120 1k 10k 100k 1M 10M
Te mperature (°C) Frequency (Hz)
Figure 5-19. Quiescent Current vs Temperature Figure 5-20. Open-Loop Output Impedance vs Frequency
30 10
RISO = 0 , overshoot (+)
9 RISO = 0 , overshoot (−)
25
8
7
20
Overshoot (%)
Overshoot (%)
6
15 5
4
10
3
2
5
RISO = 0 , overshoot (+) 1
RISO = 0 , overshoot (−)
0 0
0 50 100 150 200 250 300 350 0 40 80 120 160 200
Capacitive Load (pF) Capacitive Load (pF)
G = 1, 100-mV output step, RL = open G = –1, 100-mV output step, RL = open
Figure 5-21. Small-Signal Overshoot vs Capacitive Load Figure 5-22. Small-Signal Overshoot vs Capacitive Load
Amplitude (1 V/div)
Input
Output
Time (1 s/div)
G = +1, RL = 10 kΩ, CL = 20 pF G = –10
Figure 5-23. Phase Margin vs Capacitive Load Figure 5-24. Overload Recovery (Positive Rail)


Input
Output
Amplitude (2 mV/div)
Amplitude (1 V/div)
Input
Output
Time (20 µs/div)

Time (1 s/div)
G = 1, RL = open
G = –10
Figure 5-26. Small-Signal Step Response, G = 1
Figure 5-25. Overload Recovery (Negative Rail)
15
10
Input
Output 0
-5
-10
-15
Time (20 µs/div) Time (1 s/div)
G = –1, RL = open, RFB = 10K G = 1, RL = open
See Section 6 Figure 5-28. Large-Signal Step Response (Falling)
Figure 5-27. Small-Signal Step Response, G = –1
Amplitude (1 V/div)
Input
Output
Time (20 µs/div)

G = 1, RL = open G = –1, RL = open
Figure 5-29. Large-Signal Step Response, G = 1 Figure 5-30. Large-Signal Step Response, G = –1

15
14
13
Maximum Output Voltage (V)

12
11
10
9
8
7
6
5
4
3
2
1
0
100 1k 10k 100k 1M
Frequency (Hz)
.
VS = 15 V
Figure 5-31. Short-Circuit Current vs Temperature
Figure 5-32. Maximum Output Voltage vs Frequency
-70 90
-80
80
-90
70
Crosstalk (dB)
EMIRR (dB)
-100
60
-110
50
-120
-130 40
-140 30
1k 10k 100k 1M 10M
1M 10M 100M 1G
Frequency (Hz)
Frequency (Hz)
Figure 5-33. Channel Separation vs Frequency Figure 5-34. EMIRR (Electromagnetic Interference Rejection
Ratio) vs Frequency

5.12 Typical Characteristics: All Devices Except B and BA Versions

10 8
VCC = 15 V
Output Voltage Referenced to +Vcc (V)

5
3 7
2
6
Output Voltage (V)
1
0.5 5
0.3
0.2
4
0.1
0.05 3
0.03 VCC = 15 V
0.02 VCC = 5 V 2
VCC = 30 V
0.01
0.001 0.01 0.1 0.2 0.5 1 2 3 5 710 20 50 100 1
Output Sink Current (mA) 0.001 0.01 0.1 0.2 0.5 1 2 3 5 710 20 50 100
D001
Output Source Current (mA) D002
Figure 5-35. Output Sinking Characteristics
Figure 5-36. Output Sourcing Characteristics
0.09 3.25
3
0.08
2.75
0.07
2.5
Output Voltage (V)

0.06 2.25
2
Iout (A)
0.05
1.75
0.04 1.5
0.03 1.25
1
0.02 Input
0.75 Output
0.01 0.5
0 0.25
-55 -40 -25 -10 5 20 35 50 65 80 95 110 125 0 5 10 15 20 25 30 35 40 45 50
Temperature (qC) Time (PS) D004
D003
Figure 5-37. Source Current Limiting Figure 5-38. Voltage Follower Large Signal Response (50 pF)
90 20
Common-Mode Rejection Ratio (dB)
80 17.5
70 15
Output Swing (Vpp)
60
12.5
50
10
40
7.5
30
5
20
2.5
10
0
0
1000 2000 5000 10000 100000 1000000
100 200 500 1000 10000 100000 1000000 Frequency (Hz)
Frequency (Hz) D007
D006
Figure 5-40. Maximum Output Swing vs. Frequency
Figure 5-39. Common-Mode Rejection Ratio
(VCC = 15 V)
6 Parameter Measurement Information

900 Ω
VCC+
VCC+
− 100 Ω
VO −
+ VI = 0 V
VI VO
RS
CL +
VCC− RL
VCC−
Figure 6-2. Noise-Test Circuit
Figure 6-1. Unity-Gain Amplifier
7 Detailed Description
7.1 Overview
These devices consist of four independent high-gain frequency-compensated operational amplifiers that are
designed specifically to operate from a single supply over a wide range of voltages. Operation from split supplies
is also possible if the difference between the two supplies is 3 V to 36 V (B and BA versions), 3 V to 26 V (for
LM2902 devices), or 3 V to 30 V (for all other devices), and VCC is at least 1.5 V more positive than the input
common-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage.
Applications include transducer amplifiers, DC amplification blocks, and all the conventional operational-amplifier
circuits that can be more easily implemented in single-supply-voltage systems. For example, the LM324B and
LM2902B devices can be operated directly from the standard 5-V supply that is used in digital systems and
provides the required interface electronics, without requiring additional ±15-V supplies.

7.2 Functional Block Diagram
ESD protection cells - available on B, BA, and K versions only
7.3 Feature Description

7.3.1 Unity-Gain Bandwidth
Gain bandwidth product is found by multiplying the measured bandwidth of an amplifier by the gain at which that
bandwidth was measured. These devices have a high gain bandwidth of 1.2 MHz.
7.3.2 Slew Rate
The slew rate is the rate at which an operational amplifier can change the output when there is a change on the
input. These devices have a 0.5-V/μs slew rate.
7.3.3 Input Common Mode Range
The valid common mode range is from device ground to VCC – 1.5 V (VCC – 2 V across temperature). Inputs
may exceed VCC up to the maximum VCC without device damage. At least one input must be in the valid input
common mode range for output to be correct phase. If both inputs exceed valid range, then output phase is
undefined. If either input is less than –0.3 V, then input current should be limited to 1 mA and output phase is
undefined.
7.4 Device Functional Modes
These devices are powered on when the supply is connected. This device can be operated as a single supply
operational amplifier or dual supply amplifier depending on the application.

8 Application and Implementation

Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information

The LMx24 and LM2902 operational amplifiers are useful in a wide range of signal conditioning applications.
Inputs can be powered before VCC for flexibility in multiple supply circuits.
8.2 Typical Application
A typical application for an operational amplifier in an inverting amplifier. This amplifier takes a positive voltage
on the input, and makes it a negative voltage of the same magnitude. In the same manner, it also makes
negative voltages positive.
RF
RI Vsup+
VOUT
+
VIN
Vsup-
Figure 8-1. Application Schematic
8.2.1 Design Requirements

The supply voltage must be chosen such that it is larger than the input voltage range and output range. For
instance, this application will scale a signal of ±0.5 V to ±1.8 V. Setting the supply at ±12 V is sufficient to
accommodate this application.
8.2.2 Detailed Design Procedure
Determine the gain required by the inverting amplifier using Equation 1 and Equation 2:
AV = VOUT
VIN (1)
1.8
AV = −0.5 = − 3.6 (2)
Once the desired gain is determined, choose a value for RI or RF. Choosing a value in the kΩ range is desirable
because the amplifier circuit uses currents in the mA range. This choice makes sure that the part does not draw
too much current. This example chooses 10 kΩ for RI, which means 36 kΩ is used for RF. This was determined
by Equation 3.
AV = RF
RI (3)
8.2.3 Application Curve

2
VIN
1.5
VOUT
1
0.5
Volts
0
-0.5
-1
-1.5
-2
0 0.5 1 1.5 2
Time (ms)
Figure 8-2. Input and Output Voltages of the Inverting Amplifier
8.3 Power Supply Recommendations
CAUTION
Supply voltages larger than 32 V for a single supply, or outside the range of ±16 V for a dual supply
can permanently damage the device (see the Section 5.1).
Place 0.1-μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high
impedance power supplies. For more detailed information on bypass capacitor placement, refer to the Section
8.4.
8.4 Layout
8.4.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices, including:
• Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the
operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance
power sources local to the analog circuitry.
– Connect low-ESR, 0.1-μF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single
supply applications.
• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds, paying attention to the flow of the ground current.
• To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If it
is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed
to in parallel with the noisy trace.
• Place the external components as close to the device as possible. Keeping RF and RG close to the inverting
input minimizes parasitic capacitance, as shown in Section 8.4.2.
• Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.

8.4.2 Layout Examples

Place components close to
device and to each other to
reduce parasitic errors
Run the input traces as far
away from the supply lines RF
as possible
NC NC VS+
Use low-ESR, ceramic
RG bypass capacitor
GND IN1í VCC+
VIN IN1+ OUT

RIN
VCCí NC GND
Only needed for
dual-supply
operation
GND VS-
(or GND for single supply) VOUT Ground (GND) plane on another layer
Figure 8-3. Operational Amplifier Board Layout for Noninverting Configuration
RIN
VIN +
VOUT
RG
RF
Figure 8-4. Operational Amplifier Schematic for Noninverting Configuration
9 Device and Documentation Support

9.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Notifications to register and receive a weekly digest of any product information that has changed. For change
details, review the revision history included in any revised document.
9.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
9.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
9.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
9.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
10 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision AC (March 2024) to Revision AD (October 2024) Page

• Removed the D (SOIC, 14) package preview note from the B and BA devices.................................................1
Changes from Revision AB (November 2023) to Revision AC (March 2024) Page

• Added preview note to the WQFN-16 package pinout....................................................................................... 3
• Added LM324BIRTER and LM2902BIRTER preview information to the Mechanical, Packaging, and
Orderable Information section.......................................................................................................................... 28
Changes from Revision AA (September 2023) to Revision AB (November 2023) Page

• Changed the status of LM324BA and LM2902BA from: preview to: active........................................................1
Changes from Revision Z (April 2023) to Revision AA (September 2023) Page

• Removed preview note from TSSOP-14 BA devices in Device Information table..............................................1
• Changed the format of the Package Information table to include package lead size.........................................1

Changes from Revision Y (October 2022) to Revision Z (April 2023) Page

• Added WQFN-16 package in the Package Information table.............................................................................1
• Added WQFN-16 package details to Pin Configuration and Functions section................................................. 3
• Added additional graphs for LM324Bx and LM2902Bx to Typical Characteristics .......................................... 14
Changes from Revision X (May 2022) to Revision Y (October 2022) Page

• Removed preview note from TSSOP-14 B devices in Device Information table................................................ 1
• Updated Description information........................................................................................................................ 1
• Updated LM324B and LM324BA Electrical Characteristics table for RTM revision........................................... 7
• Updated LM2902B and LM2902BA Electrical Characteristics table for RTM revision....................................... 9
• Added graphs for LM324Bx and LM2902Bx to Typical Characteristics ...........................................................14
Changes from Revision W (March 2015) to Revision X (May 2022) Page

• Updated Features to include the B and BA versions..........................................................................................1
• Added application links to Applications section.................................................................................................. 1
• Corrected available packages in the Device Information table...........................................................................1
• Added B and BA versions to Device Information table.......................................................................................1
• Updated package images in the Pin Configuration and Functions section to new format - no
specification changes......................................................................................................................................... 3
• Renamed GND and Vcc to Vcc- and Vcc+, respectively, in the Pin Functions table ........................................ 3
• Added B and BA versions to Absolute Maximum Ratings table ........................................................................5
• Added the B and BA versions to the ESD Ratings table ................................................................................... 5
• Added B and BA versions to Recommended Operating Conditions table .........................................................5
• Added the Electrical Characteristics - LM324B and LM324BA table .................................................................7
• Added the Electrical Characteristics - LM2902B and LM2902BA table..............................................................9
• Removed Documentation Support and Related Links in the Device and Documentation Support section......27
Changes from Revision V (January 2014) to Revision W (March 2014) Page

• Added Applications ............................................................................................................................................1
• Added Device Information table......................................................................................................................... 1
• Added Mechanical, Packaging, and Orderable Information section................................................................. 28
Changes from Revision U (August 2010) to Revision V (January 2014) Page

• Updated document to new TI data sheet format - no specification changes......................................................1
• Updated Features ..............................................................................................................................................1
• Updated Features ..............................................................................................................................................1
• Removed Ordering Information table................................................................................................................. 3
• Added Pin Functions table .................................................................................................................................3
11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
11.1 Package Option Addendum
Packaging Information
Orderable Package Lead/Ball MSL Peak Device
Status(1) Package Type Pins Package Qty Eco Plan(2) Op Temp (°C)
Device Drawing Finish(6) Temp(3) Marking(4) (5)
LM324BIRTER PREVIEW WQFN RTE 16 5000 RoHS & Green NIPDAU Level-1-260C- -40 to 125 LM324B
UNLIM
LM2902BIRTER PREVIEW WQFN RTE 16 5000 RoHS & Green NIPDAU Level-1-260C- -40 to 125 L2902B
UNLIM
(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on
information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming
materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Product Folder Links: LM124 LM124A LM224 LM224A LM224K LM224KA LM324 LM324A LM324B LM324BA LM324K LM324KA LM2902 LM2902B LM2902BA LM2902K LM2902KV
LM2902KAV
11.2 Tape and Reel Information

REEL DIMENSIONS TAPE DIMENSIONS
K0 P1
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2 Q1 Q2
Q3 Q4 Q3 Q4 User Direction of Feed
Pocket Quadrants
Reel Reel
Package Package A0 B0 K0 P1 W Pin1
Device Pins SPQ Diameter Width W1
Type Drawing (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) (mm)
LM324BIRTER WQFN RTE 16 5000 330 12.4 3.3 3.3 1.1 8 12 Q2
LM2902BIRTER WQFN RTE 16 5000 330 12.4 3.3 3.3 1.1 8 12 Q2
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM324BIRTER WQFN RTE 16 5000 367.0 367.0 35.0
LM2902BIRTER WQFN RTE 16 5000 367.0 367.0 35.0

PACKAGE OUTLINE
RTE0016C SCALE 3.600
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
3.1 B
A
2.9
PIN 1 INDEX AREA

3.1
2.9
SIDE WALL
METAL THICKNESS
DIM A
OPTION 1 OPTION 2
0.1 0.2
C
0.8 MAX
SEATING PLANE
0.05
0.00 0.08
1.68 0.07 (DIM A) TYP

5 8
EXPOSED
THERMAL PAD
12X 0.5
4
9
4X SYMM
17
1.5
1
12
0.30
16X
0.18
PIN 1 ID 16 13 0.1 C A B
(OPTIONAL) SYMM
0.05
0.5
16X
0.3
4219117/B 04/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT

RTE0016C WQFN - 0.8 mm max height
( 1.68)
SYMM
16 13
16X (0.6)
1
12
16X (0.24)
17 SYMM
(2.8)
(0.58)
TYP
12X (0.5)
9
4
( 0.2) TYP
VIA
5 8
(R0.05) (0.58) TYP
ALL PAD CORNERS
(2.8)
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:20X
0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND
SOLDER MASK
METAL
OPENING
EXPOSED EXPOSED
SOLDER MASK METAL METAL UNDER
METAL
OPENING SOLDER MASK
NON SOLDER MASK

SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS

4219117/B 04/2022
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com

EXAMPLE STENCIL DESIGN

RTE0016C WQFN - 0.8 mm max height
( 1.55)
16 13
16X (0.6)
1
12
16X (0.24)
17 SYMM
(2.8)
12X (0.5)
9
4
METAL
ALL AROUND
5 8
SYMM
(R0.05) TYP
(2.8)
SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 17:

85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
4219117/B 04/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com 22-Nov-2024
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
5962-7704301VCA ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 5962-7704301VC Samples
& Green A
LM124JQMLV
5962-9950403V9B ACTIVE XCEPT KGD 0 100 RoHS & Green Call TI N / A for Pkg Type -55 to 125 Samples
5962-9950403VCA ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 5962-9950403VC Samples
& Green A
LM124AJQMLV
77043012A ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 77043012A Samples
& Green LM124FKB
7704301CA ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 7704301CA Samples
& Green LM124JB
7704301DA ACTIVE CFP W 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 7704301DA Samples
& Green LM124WB
77043022A ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 77043022A Samples
& Green LM124AFKB
7704302CA ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 7704302CA Samples
& Green LM124AJB
7704302DA ACTIVE CFP W 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 7704302DA Samples
& Green LM124AWB
JM38510/11005BCA ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 JM38510 Samples
& Green /11005BCA
LM124AFKB ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 77043022A Samples
& Green LM124AFKB
LM124AJ ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 LM124AJ Samples
& Green
LM124AJB ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 7704302CA Samples
& Green LM124AJB
LM124AWB ACTIVE CFP W 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 7704302DA Samples
& Green LM124AWB
LM124D OBSOLETE SOIC D 14 TBD Call TI Call TI -55 to 125 LM124
LM124DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 LM124 Samples
LM124DRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 LM124 Samples
Addendum-Page 1
(6)
LM124FKB ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 77043012A Samples
& Green LM124FKB
LM124J ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 LM124J Samples
& Green
LM124JB ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 7704301CA Samples
& Green LM124JB
LM124W ACTIVE CFP W 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 LM124W Samples
& Green
LM124WB ACTIVE CFP W 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 7704301DA Samples
& Green LM124WB
LM224AD OBSOLETE SOIC D 14 TBD Call TI Call TI -25 to 85 LM224A
LM224ADR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM224A Samples
LM224ADRE4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM224A Samples
LM224ADRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM224A Samples
LM224AN ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -25 to 85 LM224AN Samples

LM224DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM224 Samples
LM224DRG3 OBSOLETE SOIC D 14 TBD Call TI Call TI -25 to 85 LM224

LM224KAD OBSOLETE SOIC D 14 TBD Call TI Call TI -25 to 85 LM224KA

LM224KADR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM224KA Samples
LM224KADRG4 ACTIVE SOIC D 14 2500 TBD Call TI Call TI -25 to 85 Samples
LM224KAN ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -25 to 85 LM224KAN Samples
LM224KDR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM224K Samples
LM224KN ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -25 to 85 LM224KN Samples
LM224N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -25 to 85 LM224N Samples
Addendum-Page 2
(6)
LM224NE4 ACTIVE PDIP N 14 25 TBD Call TI Call TI -25 to 85 Samples
LM2902BAIDR ACTIVE SOIC D 14 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902BA Samples
LM2902BAIPWR ACTIVE TSSOP PW 14 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2902BA Samples
LM2902BIDR ACTIVE SOIC D 14 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902B Samples
LM2902BIPWR ACTIVE TSSOP PW 14 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902B Samples

LM2902DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 LM2902 Samples
LM2902DRE4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902 Samples
LM2902DRG3 OBSOLETE SOIC D 14 TBD Call TI Call TI -40 to 125 LM2902

LM2902KAVQDR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KA Samples
LM2902KAVQDRG4 OBSOLETE SOIC D 14 TBD Call TI Call TI -40 to 125 L2902KA

LM2902KAVQPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KA Samples
LM2902KAVQPWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KA Samples
LM2902KD OBSOLETE SOIC D 14 TBD Call TI Call TI -40 to 125 LM2902K

LM2902KDB ACTIVE SSOP DB 14 80 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2902K Samples
LM2902KDR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902K Samples
LM2902KN ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 LM2902KN Samples
LM2902KNSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902K Samples
LM2902KNSRG4 ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902K Samples
LM2902KPW OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 125 L2902K

LM2902KPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2902K Samples
LM2902KVQDR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KV Samples
Addendum-Page 3
(6)
LM2902KVQDRG4 OBSOLETE SOIC D 14 TBD Call TI Call TI -40 to 125 L2902KV

LM2902KVQPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KV Samples
LM2902KVQPWRG4 OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 125 L2902KV

LM2902N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU | SN N / A for Pkg Type -40 to 125 LM2902N Samples
LM2902NE4 OBSOLETE PDIP N 14 TBD Call TI Call TI -40 to 125 LM2902N

LM2902NSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902 Samples
LM2902PW OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 125 L2902

LM2902PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 L2902 Samples
LM2902PWRE4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2902 Samples
LM2902PWRG3 OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 125 L2902

LM2902PWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2902 Samples
LM324AD OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70 LM324A

LM324ADBR ACTIVE SSOP DB 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM324A Samples
LM324ADR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM324A Samples
LM324ADRG4 OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70 LM324A

LM324AN ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 LM324AN Samples
LM324ANSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM324A Samples
LM324ANSRG4 ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM324A Samples
LM324APW OBSOLETE TSSOP PW 14 TBD Call TI Call TI 0 to 70 L324A

LM324APWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L324A Samples
LM324APWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L324A Samples
LM324BAIDR ACTIVE SOIC D 14 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM324BA Samples
LM324BAIPWR ACTIVE TSSOP PW 14 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 L324BA Samples
Addendum-Page 4
(6)
LM324BIDR ACTIVE SOIC D 14 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM324B Samples
LM324BIPWR ACTIVE TSSOP PW 14 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM324B Samples
LM324D OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70 LM324

LM324DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM324 Samples
LM324DRE4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 Samples
LM324DRG3 OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70 LM324

LM324DRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 Samples
LM324KAD OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70 LM324KA

LM324KADR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM324KA Samples
LM324KADRG4 ACTIVE SOIC D 14 2500 TBD Call TI Call TI 0 to 70 Samples
LM324KAN ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 LM324KAN Samples
LM324KANSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM324KA Samples
LM324KAPW OBSOLETE TSSOP PW 14 TBD Call TI Call TI 0 to 70 L324KA

LM324KAPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L324KA Samples
LM324KDR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM324K Samples
LM324KN ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 LM324KN Samples
LM324KNSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM324K Samples
LM324KPW OBSOLETE TSSOP PW 14 TBD Call TI Call TI 0 to 70 L324K

LM324KPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L324K Samples
LM324N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU | SN N / A for Pkg Type 0 to 70 LM324N Samples
LM324NE3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70 LM324N

LM324NE4 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70 LM324N
LM324NSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 Samples
Addendum-Page 5
(6)
LM324NSRE4 ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 Samples
LM324NSRG4 ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 Samples
LM324PW OBSOLETE TSSOP PW 14 TBD Call TI Call TI 0 to 70 L324

LM324PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L324 Samples
LM324PWRE4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L324 Samples
LM324PWRG3 OBSOLETE TSSOP PW 14 TBD Call TI Call TI 0 to 70 L324

LM324PWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L324 Samples
M38510/11005BCA ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 JM38510 Samples
& Green /11005BCA
PLM2902BIDR ACTIVE SOIC D 14 3000 TBD Call TI Call TI -40 to 125 Samples
PLM324BIDR ACTIVE SOIC D 14 3000 TBD Call TI Call TI -40 to 85 Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 6
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM124, LM124-SP, LM124M, LM2902, LM2902B, LM2902BA :
• Catalog : LM124, LM124

• Automotive : LM2902-Q1, LM2902B-Q1, LM2902BA-Q1
• Enhanced Product : LM2902-EP
• Military : LM124M, LM124M
• Space : LM124-SP, LM124-SP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 7
PACKAGE MATERIALS INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS TAPE DIMENSIONS

K0 P1
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2 Q1 Q2
Q3 Q4 Q3 Q4 User Direction of Feed
Pocket Quadrants
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM124DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM224ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM224ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM224ADRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM224ADRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM224DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM224DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM224KADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM224KDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM2902BAIDR SOIC D 14 3000 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2902BAIPWR TSSOP PW 14 3000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2902BIDR SOIC D 14 3000 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2902DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM2902DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM2902KAVQPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2902KAVQPWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
Pack Materials-Page 1
Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1

Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2902KDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM2902KNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
LM2902KPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2902KVQPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2902NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
LM2902PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM2902PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM324ADBR SSOP DB 14 2000 330.0 16.4 8.35 6.6 2.4 12.0 16.0 Q1
LM324ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM324ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
LM324APWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM324APWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM324BAIDR SOIC D 14 3000 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM324BAIPWR TSSOP PW 14 3000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM324BIDR SOIC D 14 3000 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM324BIPWR TSSOP PW 14 3000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM324DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM324DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM324DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM324DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM324KADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM324KANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
LM324KAPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM324KDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM324KNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
LM324KPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM324NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
LM324PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LM324PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W

LM124DR SOIC D 14 2500 350.0 350.0 43.0
LM224ADR SOIC D 14 2500 340.5 336.1 32.0
LM224ADR SOIC D 14 2500 356.0 356.0 35.0
LM224ADRG4 SOIC D 14 2500 340.5 336.1 32.0
LM224ADRG4 SOIC D 14 2500 356.0 356.0 35.0
LM224DR SOIC D 14 2500 356.0 356.0 35.0
LM224DRG4 SOIC D 14 2500 356.0 356.0 35.0
LM224KADR SOIC D 14 2500 356.0 356.0 35.0
LM224KDR SOIC D 14 2500 356.0 356.0 35.0
LM2902BAIDR SOIC D 14 3000 353.0 353.0 32.0
LM2902BAIPWR TSSOP PW 14 3000 356.0 356.0 35.0
LM2902BIDR SOIC D 14 3000 340.5 336.1 25.0
LM2902DR SOIC D 14 2500 353.0 353.0 32.0
LM2902DRG4 SOIC D 14 2500 353.0 353.0 32.0
LM2902KAVQPWR TSSOP PW 14 2000 356.0 356.0 35.0
LM2902KAVQPWRG4 TSSOP PW 14 2000 367.0 367.0 35.0
LM2902KDR SOIC D 14 2500 356.0 356.0 35.0
LM2902KNSR SO NS 14 2000 356.0 356.0 35.0
LM2902KPWR TSSOP PW 14 2000 356.0 356.0 35.0
LM2902KVQPWR TSSOP PW 14 2000 356.0 356.0 35.0
LM2902NSR SO NS 14 2000 356.0 356.0 35.0
LM2902PWR TSSOP PW 14 2000 356.0 356.0 35.0
LM2902PWRG4 TSSOP PW 14 2000 356.0 356.0 35.0
LM324ADBR SSOP DB 14 2000 356.0 356.0 35.0
LM324ADR SOIC D 14 2500 356.0 356.0 35.0
LM324ANSR SO NS 14 2000 356.0 356.0 35.0
LM324APWR TSSOP PW 14 2000 356.0 356.0 35.0
LM324APWRG4 TSSOP PW 14 2000 356.0 356.0 35.0
LM324BAIDR SOIC D 14 3000 340.5 336.1 25.0
LM324BAIPWR TSSOP PW 14 3000 356.0 356.0 35.0
LM324BIDR SOIC D 14 3000 340.5 336.1 25.0
LM324BIPWR TSSOP PW 14 3000 356.0 356.0 35.0
LM324DR SOIC D 14 2500 353.0 353.0 32.0
LM324DR SOIC D 14 2500 356.0 356.0 35.0
LM324DRG4 SOIC D 14 2500 353.0 353.0 32.0
LM324DRG4 SOIC D 14 2500 356.0 356.0 35.0
LM324KADR SOIC D 14 2500 356.0 356.0 35.0
LM324KANSR SO NS 14 2000 356.0 356.0 35.0
LM324KAPWR TSSOP PW 14 2000 356.0 356.0 35.0
LM324KDR SOIC D 14 2500 356.0 356.0 35.0
LM324KNSR SO NS 14 2000 356.0 356.0 35.0
LM324KPWR TSSOP PW 14 2000 356.0 356.0 35.0
LM324NSR SO NS 14 2000 356.0 356.0 35.0
LM324PWR TSSOP PW 14 2000 356.0 356.0 35.0
LM324PWRG4 TSSOP PW 14 2000 356.0 356.0 35.0
TUBE
T - Tube
height L - Tube length
W - Tube
width
B - Alignment groove width

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
5962-9950403VCA J CDIP 14 25 506.98 15.24 13440 NA
77043012A FK LCCC 20 55 506.98 12.06 2030 NA
7704301DA W CFP 14 25 506.98 26.16 6220 NA
77043022A FK LCCC 20 55 506.98 12.06 2030 NA
7704302DA W CFP 14 25 506.98 26.16 6220 NA
LM124AFKB FK LCCC 20 55 506.98 12.06 2030 NA
LM124AWB W CFP 14 25 506.98 26.16 6220 NA
LM124FKB FK LCCC 20 55 506.98 12.06 2030 NA
LM124W W CFP 14 25 506.98 26.16 6220 NA
LM124WB W CFP 14 25 506.98 26.16 6220 NA
LM224AN N PDIP 14 25 506 13.97 11230 4.32
LM224KAN N PDIP 14 25 506 13.97 11230 4.32
LM224KN N PDIP 14 25 506 13.97 11230 4.32
LM224N N PDIP 14 25 506 13.97 11230 4.32
LM2902KDB DB SSOP 14 80 530 10.5 4000 4.1
LM2902KN N PDIP 14 25 506 13.97 11230 4.32
LM2902N N PDIP 14 25 506 13.97 11230 4.32
LM2902N N PDIP 14 25 506.1 9 600 5.4
LM324AN N PDIP 14 25 506 13.97 11230 4.32
LM324AN N PDIP 14 25 506 13.97 11230 4.32
LM324KAN N PDIP 14 25 506 13.97 11230 4.32
LM324KAN N PDIP 14 25 506 13.97 11230 4.32
LM324KN N PDIP 14 25 506 13.97 11230 4.32
LM324KN N PDIP 14 25 506 13.97 11230 4.32
LM324N N PDIP 14 25 506 13.97 11230 4.32
LM324N N PDIP 14 25 506 13.97 11230 4.32
LM324N N PDIP 14 25 506 13.97 11230 4.32
LM324N N PDIP 14 25 506.1 9 600 5.4
PACKAGE OUTLINE
D0014A SCALE 1.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
C
6.2
TYP SEATING PLANE
5.8
A PIN 1 ID 0.1 C
AREA
12X 1.27
14
1
8.75 2X
8.55 7.62
NOTE 3
7
8
0.51
14X
4.0 0.31
B 1.75 MAX
3.8 0.25 C A B
NOTE 4
0.25
TYP
0.13
SEE DETAIL A
0.25
GAGE PLANE
0.25
0 -8 1.27 0.10
0.40
DETAIL A
TYPICAL
4220718/A 09/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side.
5. Reference JEDEC registration MS-012, variation AB.
www.ti.com
D0014A SOIC - 1.75 mm max height
14X (1.55) SYMM

1
14
14X (0.6)
12X (1.27)
SYMM
7 8
(R0.05)
TYP
(5.4)

SCALE:8X
SOLDER MASK METAL UNDER SOLDER MASK

METAL OPENING
OPENING SOLDER MASK
0.07 MAX 0.07 MIN

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
SOLDER MASK DETAILS
4220718/A 09/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
D0014A SOIC - 1.75 mm max height
14X (1.55) SYMM
1
14
14X (0.6)
12X (1.27)
SYMM
7 8
(5.4)

SCALE:8X
4220718/A 09/2016
NOTES: (continued)
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DB0014A SCALE 2.000
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
C
8.2
TYP
A 7.4
0.1 C
PIN 1 INDEX AREA SEATING
PLANE
12X 0.65
14
1
2X
6.5
3.9
5.9
NOTE 3
7
8 0.38
14X
0.22
0.15 C A B
5.6
B
5.0
NOTE 4
0.25
0.09
SEE DETAIL A
2 MAX
0.25
GAGE PLANE
0.95 0.05 MIN

0 -8 0.55
DETAIL A
A 15
TYPICAL
4220762/A 05/2024
NOTES:
per ASME Y14.5M.
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-150.
www.ti.com
DB0014A SSOP - 2 mm max height
14X (1.85) SYMM
1 (R0.05) TYP
14X (0.45) 14
SYMM
12X (0.65)
7 8
(7)

EXPOSED METAL SHOWN
SCALE: 10X

METAL
OPENING SOLDER MASK OPENING
EXPOSED METAL EXPOSED METAL
0.05 MAX 0.05 MIN

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
15.000
4220762/A 05/2024
NOTES: (continued)

www.ti.com
DB0014A SSOP - 2 mm max height
14X (1.85) SYMM

(R0.05) TYP
1
14X (0.45) 14
SYMM
12X (0.65)
7 8
(7)

SCALE: 10X
4220762/A 05/2024
NOTES: (continued)
www.ti.com
PACKAGE OUTLINE
PW0014A SCALE 2.500
TSSOP - 1.2 mm max height
SEATING
PLANE
6.6 C
TYP
A 6.2
0.1 C
PIN 1 INDEX AREA
12X 0.65
14
1
2X
5.1 3.9
4.9
NOTE 3
4X (0 -12 )
7
8
0.30
14X
0.17
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
0 -8
DETAIL A
A 20
TYPICAL
4220202/B 12/2023
NOTES:
per ASME Y14.5M.
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
PW0014A TSSOP - 1.2 mm max height
14X (1.5) SYMM

(R0.05) TYP
1
14X (0.45) 14
SYMM
12X (0.65)
7 8
(5.8)

EXPOSED METAL SHOWN
SCALE: 10X

METAL SOLDER MASK OPENING
OPENING
EXPOSED METAL EXPOSED METAL
0.05 MAX 0.05 MIN

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED) SOLDER MASK DETAILS
15.000
4220202/B 12/2023
NOTES: (continued)

www.ti.com
PW0014A TSSOP - 1.2 mm max height
14X (1.5) SYMM

(R0.05) TYP
1
14X (0.45) 14
SYMM
12X (0.65)
7 8
(5.8)

SCALE: 10X
4220202/B 12/2023
NOTES: (continued)
www.ti.com
GENERIC PACKAGE VIEW
RTE 16 WQFN - 0.8 mm max height
3 x 3, 0.5 mm pitch PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225944/A
www.ti.com
GENERIC PACKAGE VIEW
FK 20 LCCC - 2.03 mm max height
8.89 x 8.89, 1.27 mm pitch LEADLESS CERAMIC CHIP CARRIER
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4229370\/A\
www.ti.com
PACKAGE OUTLINE
J0014A SCALE 0.900
CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE
PIN 1 ID A 4X .005 MIN

(OPTIONAL) [0.13] .015-.060 TYP
[0.38-1.52]
1
14
12X .100
[2.54] 14X .014-.026
14X .045-.065 [0.36-0.66]
[1.15-1.65]
.010 [0.25] C A B
.754-.785
[19.15-19.94]
7 8
B .245-.283 .2 MAX TYP .13 MIN TYP

[6.22-7.19] [5.08] [3.3]
C SEATING PLANE
.308-.314
[7.83-7.97]
AT GAGE PLANE
.015 GAGE PLANE

[0.38]
0 -15 14X .008-.014

TYP [0.2-0.36]
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
www.ti.com
J0014A CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE
(.300 ) TYP
[7.62] SEE DETAIL B
SEE DETAIL A
1 14
12X (.100 )
[2.54]
SYMM
14X ( .039)
[1]
7 8
SYMM

NON-SOLDER MASK DEFINED
SCALE: 5X
.002 MAX (.063)

[0.05] [1.6]
ALL AROUND METAL
( .063)
SOLDER MASK [1.6]
OPENING
METAL
SOLDER MASK .002 MAX

(R.002 ) TYP [0.05]
OPENING
[0.05] ALL AROUND
DETAIL A DETAIL B
SCALE: 15X 13X, SCALE: 15X
4214771/A 05/2017
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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Copyright © 2024, Texas Instruments Incorporated

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LM124, LM124A, LM224, LM224A, LM224K, LM224KA

LM324, LM324A, LM324B, LM324BA, LM324K, LM324KA

LMx24, LMx24x, LMx24xx, LM2902, LM2902x, LM2902xx, LM2902xxx Quadruple

• Desktop PC and motherboard LM324, LM324A, LM324K,

3 Description (1) For more information, see Section 11.

2 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

4 Pin Configuration and Functions

2IN± 6 9 3IN± 2IN+ 8 14 3IN+

Figure 4-1. D, DB, J, N, NS, PW, and W Packages,

NOTE: RTE package is preview only

Figure 4-3. RTE Package,

Table 4-1. Pin Functions

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3

Table 4-1. Pin Functions (continued)

(1) I = input, O = output

4 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

5.2 ESD Ratings

5.3 Recommended Operating Conditions

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5

5.4 Thermal Information

14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 16 PINS 20 PINS 14 PINS 14 PINS

6 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

5.5 Electrical Characteristics - LM324B and LM324BA

Common-mode voltage VS = 3 V to 36 V V– (V+) – 1.5

Common-mode rejection (V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V 70 80

VS = 15 V, VO = 1 V to 11 V, RL ≥ 10 kΩ, connected to 50 100

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 7

5.5 Electrical Characteristics - LM324B and LM324BA (continued)

Quiescent current per VS = 5 V; IO = 0 A TA = –40°C to 85°C 240 300 μA

(1) Specified by design and characterization only.

8 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

5.6 Electrical Characteristics - LM2902B and LM2902BA

Common-mode voltage VS = 3 V to 36 V V– (V+) – 1.5

Common-mode rejection (V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V 70 80

VS = 15 V, VO = 1 V to 11 V, RL ≥ 10 kΩ, connected to 50 100

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 9

5.6 Electrical Characteristics - LM2902B and LM2902BA (continued)

Quiescent current per VS = 5 V; IO = 0 A TA = –40°C to 125°C 240 300 μA

(1) Specified by design and characterization only.

10 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

VCC = 5 V to MAX, VIC = VICRmin, 25°C 3 5 3 7

Large-signal differential voltage VCC+ = 15 V, VO = 1 V to 11 V, 25°C 50 100 25 100

VID = –1 V, VO = 200 mV 25°C 12 30 12 30 μA

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 11

5.8 Electrical Characteristics for LM2902, LM2902K, LM2902KV and LM2902KAV

VID = –1 V, VO = 200 mV 25°C 30 12 40 μA

12 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Input offset 25°C 10 2 15 2 30

Input bias 25°C –50 –15 –80 –15 –100

VID = −1 V, VO = 200 mV 25°C 12 12 30 12 30 μA

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 13

5.11 Typical Characteristics

Figure 5-6. Closed-Loop Gain vs Frequency

14 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

5.11 Typical Characteristics (continued)

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 15

5.11 Typical Characteristics (continued)

G = –1, f = 1 kHz, BW = 80 kHz, G = 1, f = 1 kHz, BW = 80 kHz,

G = –1, f = 1 kHz, BW = 80 kHz, .