PLQ1 Datasheet STM

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PLQ 08

PLQ 1

FAST RECOVERY RECTIFIER DIODES

VERY FAST FORWARD AND REVERSE


RECOVERY DIODES

SUITABLE APPLICATION
SWTCHING POWER TRANSISTORS DRIVER
CI R CU I T S ( SERI E S DI O D ES IN
ANTISATURATION CLAMP SPEED UP DIODE
IN DISCRETE DARLINGTON...) F 126
(Plastic)
THYRISTORS GATE DRIVER CIRCUITS
HIGH FREQUENCY RECTIFICATION

ABSOLUTE RATINGS (limiting values)


Symbol Parameter Value Unit
IFRM Repetive Peak Forward Current tp ≤ 20µs 20 A

IF (AV) Average Forward Current* Ta = 25°C 1 A


δ = 0.5
IFSM Surge non Repetitive Forward Current tp = 10ms 20 A
Sinusoidal
Ptot Power Dissipation* Ta = 25°C 1.7 W

Tstg Storage and Junction Temperature Range - 40 to 125 °C


Tj

TL Maximum Lead Temperature for Soldering during 10s at 4mm 230 °C


from Case

Symbol Parameter PLQ 08 PLQ 1 Unit


VRRM Repetitive Peak Reverse Voltage 80 100 V
VRSM Non Repetitive Peak Reverse Voltage 80 100 V

THERMAL RESISTANCE
Symbol Parameter Value Unit
Rth (j - a) Junction-ambient* 60 °C/W

* On infinite heatsink with 10mm lead length.

November 1994 1/5


PLQ 08/PLQ 1

ELECTRICAL CHARACTERISTICS
STATIC CHARACTERISTICS
Synbol Test Conditions Min. Typ. Max. Unit
IR Tj = 25°C VR = VRRM 10 µA

Tj = 100°C 0.5 mA

VF Tj = 25°C IF = 1A 1.1 V

RECOVERY CHARACTERISTICS
Symbol Test Conditions Min. Typ. Max. Unit
trr Tj = 25°C IF = 1A diF/dt = - 50A/µs 50 ns
VR = 30V See figure 12
tfr Tj = 25°C IF = 1A tr = 20ns 50 ns
Measured at 1.1 x VF

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PLQ 08/PLQ 1

Figure 1. Power losses versus average Figure 2. Allowable DC current versus


current. ambient temperature.

Figure 3. Non repetitive surge peak current Figure 4. Transient thermal impedance
versus number of cycles. junction-ambient. Printed circuit versus pulse
duration (L = 10 mm).

Figure 5. Voltage drop versus forward current. Figure 6. Voltage drop versus forward current.

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PLQ 08/PLQ 1

Figure 7. Capacitance versus reverse voltage F ig u re 8. T hermal resis tan ce


applied. junction-ambient versus lead length.

Figure 9. Recovery time versus diF/dt. Figure 10. Peak reverse current versus diF/dt.

Figure 11. Dynamic parameters versus Figure 12. Measurement of trr (fig. 8) and IRM
junction temperature. (fig. 10).

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PLQ 08/PLQ 1

PACKAGE MECHANICAL DATA


F 126 (Plastic)

B A B /C
O

note 1 E E note 1

/D
O /D
O
note 2

DIMENSIONS
REF. Millimeters Inches NOTES
Min. Max. Min. Max.
A 6.05 6.35 0.238 0.250
1 - The lead diameter ∅ D is not controlled over zone E
B 26 1.024
2 - The minimum axial lengh within which the device may be
∅C 2.95 3.05 0.116 0.120
placed with its leads bent at right angles is 0.59"(15 mm)
∅D 0.76 0.86 0.029 0.034
E 1.27 0.050

Cooling method: by convection (method A)


Marking: type number
Weight: 0.4g

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.

© 1994 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.


SGS-THOMSON Microelectronics GROUP OF COMPANIES
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