DRV 10964
DRV 10964
DRV 10964
DRV10964
SLDS227 – MARCH 2016
100k
VCC
FG 1 FG PWM 10 PWMIN
4 W U 7
2.2 µF
5 GND V 6
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV10964
SLDS227 – MARCH 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................... 7
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 14
3 Description ............................................................. 1 8 Application and Implementation ........................ 17
4 Revision History..................................................... 2 8.1 Application Information............................................ 17
8.2 Typical Application .................................................. 17
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 20
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 20
6.2 ESD Ratings.............................................................. 4 10.1 Layout Guidelines ................................................. 20
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 20
6.4 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 21
6.5 Electrical Characteristics........................................... 5 11.1 Community Resources.......................................... 21
6.6 Typical Characteristics .............................................. 6 11.2 Trademarks ........................................................... 21
7 Detailed Description .............................................. 7 11.3 Electrostatic Discharge Caution ............................ 21
7.1 Overview ................................................................... 7 11.4 Glossary ................................................................ 21
7.2 Functional Block Diagram ......................................... 7 12 Mechanical, Packaging, and Orderable
Information ........................................................... 21
4 Revision History
DATE REVISION NOTES
February 2016 * Initial release.
DSN Package
10-Pin USON
Top View
FG 1 10 PWM
FGS 2 9 CONFIG
VCC 3 8 FR
W 4 7 U
GND 5 6 V
Pin Functions
PIN
I/O DESCRIPTION
NO. NAME
1 FG Output Motor speed indicator output (open drain).
Motor speed indicator selector. The state of this pin is latched on power up and can not be changed
2 FGS Input
dynamically.
3 VCC Power Input voltage for motor and chip supply.
4 W IO Motor Phase W
5 GND Ground Ground
6 V IO Motor Phase V
7 U IO Motor Phase U
8 FR Input Motor direction selector. This pin can be dynamically changed after power up.
Resistor setting for configuring the handoff threshold. The state of this pin is latched on power up and can
9 CONFIG Input
not be changed dynamically.
10 PWM Input Motor speed control input.
— Thermal Pad — Connect to Ground for maximum thermal efficiency. Thermal pad is on the bottom of the package.
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC pin supply voltage –0.3 6 V
Motor phase pins (U, V, W) –1 7.7 V
Direction, speed indicator input, and speed input (FR, FGS, PWM, CONFIG) –0.3 6 V
Speed output (FG) –0.3 7.7 V
TJ Junction temperature –40 150 °C
TSDR Maximum lead soldering temperature, 10 seconds 260 °C
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
1.6
1.4
Rdson
1.2
1.0
0.8
0.6
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Power Supply at 25ƒC C001
7 Detailed Description
7.1 Overview
The DRV10964 device is a three phase sensorless motor driver with integrated power MOSFETs. It is
specifically designed for high efficiency, low noise and low external component count motor drive applications.
The proprietary sensorless windowless 180° sinusoidal control scheme provides ultra-quiet motor operation by
keeping electrically induced torque ripple small.
Upon start-up, the DRV10964 device will spin the motor in the direction indicated by the FR input pin. The
DRV10964 device will operate a three phase BLDC motor using a sinusoidal control scheme. The magnitude of
the applied sinusoidal phase voltages is determined by the duty cycle of the PWM pin. As the motor spins, the
DRV10964 device provides the speed information at the FG pin.
The DRV10964 device contains an intelligent lock detect function. In the case where the motor is stalled by an
external force, the system will detect the lock condition and will take steps to protect itself as well as the motor.
The operation of the lock detect circuit is described in detail in Lock Detection .
The DRV10964 device also contains several internal protection circuits such as overcurrent protection,
overvoltage protection, undervoltage protection, and overtemperature protection.
U
CONFIG Decode
V
ADC V/I Sensor
W
VCC GND
DRV10964
VCC
PWM and
PWM WakeUp
FR
FGS Logic
Core
Lock
U
Over Current
V
Thermal
W
UVLO
DRV10964 GND
U-V U
V-W V
W-U W
Sinusoidal Voltage from Phase to Phase Sinusoidal Voltage from Phase to GND
With Third Order Harmonics
PWM Output
Average Value
The output amplitude is determined by the supply voltage (VCC) and the commanded PWM duty cycle (PWM) as
described in Equation 1 and illustrated in Figure 3. The maximum amplitude is applied when the commanded
PWM duty cycle is 100%.
Vphpk = PWMdc × VCC (1)
Vphpk
VCC*PWMdc
The motor speed is controlled indirectly by using the PWM command to control the amplitude of the phase
voltages which are applied to the motor.
VCC/2
255
255
No AVS or Software
(511 is the Maximum) 50%
50% Current Limit Occurs
Output at Peak
The transfer function between the PWM commanded duty cycle and the output peak amplitude is adjustable in
the DRV10964 device. The output peak amplitude is described by Equation 1 when PWMdc > minimum operation
duty cycle. The minimum operation duty cycle is 10%. When the PWM commanded duty cycle is lower than
minimum operation duty cycle and higher than 0.38%, the output will be controlled at the minimum operation duty
cycle. When the input duty cycle is lower than 0.38%, the DRV10964 device will not drive the output, and enters
the standby mode. This is illustrated in Figure 6.
Output Duty
10%
Closed Loop
FG = defined by FGS
Operation
Command PWM = 0%
Speed < 10 Hz
No motor
Speed abnormal
Figure 8. Lock Detect
The behavior of each lock detect scheme is described in the following sections.
4 x Kt
Ktc
Kt
0.5 x Kt
Lock detect
U M BEMF = kt * speed
If speed > U / kt
Lock is triggered.
The DRV10964 includes an anti-voltage-surge (AVS) feature which prevents energy from being transferred from
the motor to the power supply. This feature helps to protect the DRV10964 as well as any other components that
are connected to the power supply (VCC).
I
U = BEMF + I * Rm M BEMF = kt * speed
The lower two pictures in Figure 13 illustrate how the AVS circuit in the DRV10964 device prevents this energy
from being returned to the supply. When the AVS condition is detected the DRV10964 device will act to turn on
the low side device designated as S6. This allows the current flowing in the motor inductance to be returned to
ground instead of being directed to the VCC supply voltage.
Power On
Calibration 40 ms
Resistance
Align
Measurement
Open Loop
Accelerate
Kt
Wait TOFF_LOCK Coasting
Measurement
60 degrees
±
V
+
U
+
W ±
The motor speed is determined by measuring the time between two rising edges of either of the comparators.
If neither of the comparator outputs toggle for a given amount of time (80 ms), the condition is defined as
stationary and the Align state will begin. If the comparators are toggling at a speed that is greater than this
threshold then the DRV10964 will wait for the motor to slow down until the toggling is less than the threshold and
it can be treated as stationary.
7.4.1.4 Align
To align the rotor to the commutation logic the DRV10964 applies a 50% duty cycle on phases V and W while
holding phase U at GND. This condition is maintained for 0.64 seconds. In order to avoid a sudden change in
current that could result in undesirable acoustics the 50% duty cycle is applied gradually to the motor over 0.3
seconds.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
100k
VCC
FG 1 FG PWM 10 PWMIN
4 W U 7
2.2 µF
5 GND V 6
Figure 19. Reference PCB Open Loop and Close Loop Figure 20. Reference PCB Closed Loop
10 Layout
2.2 uF
GND
100k
VCC
FG 1 10 PWM
100k
FGS 2 9 CONFIG
GND
VCC 3 (PPAD) 8 FR
W 4 7 U
GND 5 6 V
11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
DRV10964FFDSNR ACTIVE SON DSN 10 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 964FF1
DRV10964FFDSNT ACTIVE SON DSN 10 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 964FF1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
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