MCP7940N

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MCP7940N

Battery-Backed I2C Real-Time Clock/Calendar with SRAM

Timekeeping Features General Description


• Real-Time Clock/Calendar (RTCC): The MCP7940N Real-Time Clock/Calendar (RTCC)
- Hours, Minutes, Seconds, Day of Week, Day, tracks time using internal counters for hours, minutes,
Month, Year seconds, days, months, years, and day of week.
- Leap year compensated to 2399 Alarms can be configured on all counters up to and
- 12/24 hour modes including months. For usage and configuration, the
MCP7940N supports I2C communications up to
• Oscillator for 32.768 kHz Crystals:
400 kHz.
- Optimized for 6-9 pF crystals
The open-drain, multi-functional output can be
• On-Chip Digital Trimming/Calibration:
configured to assert on an alarm match, to output a
- ±1 PPM resolution selectable frequency square wave, or as a general
- ±129 PPM range purpose output.
• Dual Programmable Alarms The MCP7940N is designed to operate using a
• Versatile Output Pin: 32.768 kHz tuning fork crystal with external crystal
- Clock output with selectable frequency load capacitors. On-chip digital trimming can be used
- Alarm output to adjust for frequency variance caused by crystal
tolerance and temperature.
- General purpose output
• Power-Fail Time-Stamp: SRAM and timekeeping circuitry are powered from the
back-up supply when main power is lost, allowing the
- Time logged on switchover to and from
device to maintain accurate time and the SRAM
Battery mode
contents. The times when the device switches over to
Low-Power Features the back-up supply and when primary power returns
• Wide Voltage Range: are both logged by the power-fail time-stamp.
- Operating voltage range of 1.8V to 5.5V Package Types
- Backup voltage range of 1.3V to 5.5V
• Low Typical Timekeeping Current: MSOP, PDIP (1) , SOIC, TSSOP (1)
(1)
TDFN
- Operating from VCC: 1.2 µA at 3.3V
X1 1 8 VCC
- Operating from battery backup: 925 nA at X1 1 8 VCC
3.0V X2 2 7 MFP X2 2 7 MFP
• Automatic Switchover to Battery Backup VBAT 3 6 SCL VBAT 3 6 SCL
VSS 4 5 SDA
User Memory VSS 4 5 SDA

• 64-byte Battery-Backed SRAM

Operating Ranges
• Two-Wire Serial Interface, I2C Compatible Note 1: Available in I-temp only.
- I2C clock rate up to 400 kHz
• Temperature Range:
- Industrial (I): -40°C to +85°C
- Extended (E): -40°C to +125°C
• Automotive AEC-Q100 Qualified

Packages
• 8-Lead MSOP, 8-Lead PDIP, 8-Lead SOIC,
8-Lead 2x3 TDFN and 8-Lead TSSOP

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MCP7940N
FIGURE 1-1: TYPICAL APPLICATION SCHEMATIC

VCC VCC VCC

8
VCC
1 CX1
X1

32.768 KHZ
6
SCL
PIC® MCU MCP7940N
5 2 CX2
SDA X2

7 3
MFP VBAT
VBAT
VSS
4

FIGURE 1-2: BLOCK DIAGRAM

VCC
Power Control Power-Fail
VSS
and Switchover Time-Stamp
VBAT

SCL Control Logic Configuration


I2C Interface
and Addressing
SDA
Seconds
SRAM
Minutes
X1
32.768 kHz Hours
Oscillator Clock Divider

X2 Day of Week

Digital Trimming
Date

Square Wave Month


Output Alarms

Year

MFP Output Logic

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MCP7940N
1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings (†)


VCC.............................................................................................................................................................................6.5V
All inputs and outputs (except SDA and SCL) w.r.t. VSS .....................................................................-0.6V to VCC +1.0V
SDA and SCL w.r.t. VSS ............................................................................................................................... -0.6V to 6.5V
Storage temperature ............................................................................................................................... -65°C to +150°C
Ambient temperature with power applied................................................................................................ -40°C to +125°C
ESD protection on all pins  4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.

TABLE 1-1: DC CHARACTERISTICS


Industrial (I): VCC = +1.8V to 5.5V TA = -40°C to +85°C
DC CHARACTERISTICS
Extended (E): VCC = +1.8V to 5.5V TA = -40°C to +125°C
Param.
Symbol Characteristic Minimum Typical(1) Maximum Units Conditions
No.
D1 VIH High-Level Input Voltage 0.7 VCC — — V
— — 0.3 VCC V VCC  2.5V
D2 VIL Low-Level Input Voltage
— — 0.2 VCC V VCC < 2.5V
Hysteresis of Schmitt
D3 VHYS Trigger Inputs 0.05 VCC — — V Note 2
(SDA, SCL pins)
IOL = 3.0 mA @
Low-Level Output Voltage VCC = 4.5V
D4 VOL — — 0.40 V
(MFP, SDA pins) IOL = 2.1 mA @
VCC = 2.5V
D5 ILI Input Leakage Current — — ±1 µA VIN = VSS or VCC
D6 ILO Output Leakage Current — — ±1 µA VOUT = VSS or VCC
CIN, Pin Capacitance VCC = 5.0V (Note 2)
D7 — — 10 pF
COUT (SDA, SCL, MFP pins) TA = +25°C, f = 1 MHz
Oscillator Pin
D8 COSC — 3 — pF Note 2
Capacitance (X1, X2 pins)
VCC = 5.5V,
ICCREAD — — 300 µA
SRAM/RTCC Register SCL = 400 kHz
D9
Operating Current VCC = 5.5V,
ICCWRITE — — 400 µA
SCL = 400 kHz
SCL, SDA, VCC = 5.5V
— — 1 µA
VCC Data-Retention (I-Temp)
D10 ICCDAT
Current (oscillator off) SCL, SDA, VCC = 5.5V
— — 5 µA
(E-temp)
D11 ICCT Timekeeping Current — 1.2 — µA VCC = 3.3V (Note 2)
Power-fail Switchover
D12 VTRIP 1.3 1.5 1.7 V
Voltage
Backup Supply Voltage
D13 VBAT 1.3 — 5.5 V Note 2
Range
Note 1: Typical measurements taken at room temperature.
2: This parameter is not tested but ensured by characterization.

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MCP7940N
Industrial (I): VCC = +1.8V to 5.5V TA = -40°C to +85°C
DC CHARACTERISTICS (Continued)
Extended (E): VCC = +1.8V to 5.5V TA = -40°C to +125°C
Param.
Symbol Characteristic Minimum Typical(1) Maximum Units Conditions
No.
VBAT = 1.3V, VCC = VSS
— — 850 nA
(Note 2)
Timekeeping Backup VBAT = 3.0V, VCC = VSS
D14 IBATT — 925 1200 nA
Current (Note 2)
VBAT = 5.5V, VCC = VSS
— 9000 nA
(Note 2)
VBAT Data Retention
D15 IBATDAT — — 750 nA VBAT = 3.6V, VCC = VSS
Current (oscillator off)
Note 1: Typical measurements taken at room temperature.
2: This parameter is not tested but ensured by characterization.

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MCP7940N
TABLE 1-2: AC CHARACTERISTICS
Industrial (I): VCC = +1.8V to 5.5V TA = -40°C to +85°C
AC CHARACTERISTICS
Extended (E): VCC = +1.8V to 5.5V TA = -40°C to +125°C

Param.
Symbol Characteristic Minimum Typical Maximum Units Conditions
No.
— — 100 kHz 1.8V  VCC < 2.5V
1 FCLK Clock Frequency
— — 400 kHz 2.5V  VCC  5.5V
4000 — — ns 1.8V  VCC < 2.5V
2 THIGH Clock High Time
600 — — ns 2.5V  VCC  5.5V
4700 — — ns 1.8V  VCC < 2.5V
3 TLOW Clock Low Time
1300 — — ns 2.5V  VCC  5.5V
1.8V  VCC < 2.5V
— — 1000 ns
(Note 1)
4 TR SDA and SCL Rise Time
2.5V  VCC  5.5V
— — 300 ns
(Note 1)
1.8V  VCC < 2.5V
— — 1000 ns
(Note 1)
5 TF SDA and SCL Fall Time
2.5V  VCC  5.5V
— — 300 ns
(Note 1)
4000 — — ns 1.8V  VCC < 2.5V
6 THD:STA Start Condition Hold Time
600 — — ns 2.5V  VCC  5.5V
4700 — — ns 1.8V  VCC < 2.5V
7 TSU:STA Start Condition Setup Time
600 — — ns 2.5V  VCC  5.5V
8 THD:DAT Data Input Hold Time 0 — — ns Note 2
250 — — ns 1.8V  VCC < 2.5V
9 TSU:DAT Data Input Setup Time
100 — — ns 2.5V  VCC  5.5V
4000 — — ns 1.8V  VCC < 2.5V
10 TSU:STO Stop Condition Setup Time
600 — — ns 2.5V  VCC  5.5V
— — 3500 ns 1.8V  VCC < 2.5V
11 TAA Output Valid From Clock
— — 900 ns 2.5V  VCC  5.5V
Bus free time: Time the bus 4700 — — ns 1.8V  VCC < 2.5V
12 TBUF must be free before a new
transmission can start 1300 — — ns 2.5V  VCC  5.5V

Input Filter Spike Suppression


13 TSP — — 50 ns Note 1
(SDA and SCL pins)
14 TFVCC VCC fall time 300 — — s Note 1
15 TRVCC VCC rise time 0 — — s Note 1
16 FOSC Oscillator frequency — 32.768 — kHz
17 TOSF Oscillator timeout period 1 — — ms Note 1
Note 1: Not 100% tested.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

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MCP7940N
FIGURE 1-3: I2C BUS TIMING DATA
5 4
2 D3

SCL
7
3 8 9 10
SDA
6
In
13

11 12
SDA
Out

FIGURE 1-4: POWER SUPPLY TRANSITION TIMING

VCC

VTRIP(MAX)
VTRIP(MIN)

14 15

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MCP7940N
2.0 TYPICAL PERFORMANCE CURVE
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data represented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.

FIGURE 2-1: TIMEKEEPING BACKUP


CURRENT VS. BACKUP
SUPPLY VOLTAGE

5.5
5.0
Ͳ40 TA = -40°C
4.5 25
TA = 25°C
85
IBATT Current (μA)

4.0 TA = 85°C
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.30 1.90 2.50 3.10 3.70 4.30 4.90 5.50
VBAT Voltage (V)

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MCP7940N
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE


Name MSOP PDIP SOIC TDFN TSSOP Function
X1 1 1 1 1 1 Quartz Crystal Input, External Oscillator Input
X2 2 2 2 2 2 Quartz Crystal Output
VBAT 3 3 3 3 3 Battery Backup Supply Input
Vss 4 4 4 4 4 Ground
SDA 5 5 5 5 5 Bidirectional Serial Data (I2C)
SCL 6 6 6 6 6 Serial Clock (I2C)
MFP 7 7 7 7 7 Multifunction Pin
Vcc 8 8 8 8 8 Primary Power Supply
Note: Exposed pad on TFDN can be connected to Vss or left floating.

3.1 Serial Data (SDA) 3.5 Backup Supply (VBAT)


This is a bidirectional pin used to transfer addresses This is the input for a backup supply to maintain the
and data into and out of the device. It is an open-drain RTCC and SRAM registers during the time when VCC
terminal. Therefore, the SDA bus requires a pull-up is unavailable.
resistor to VCC (typically 10 k for 100 kHz, 2 k for If the battery backup feature is not being used, the
400 kHz). For normal data transfer, SDA is allowed to VBAT pin should be connected to VSS.
change only during SCL low. Changes during SCL high
are reserved for indicating the Start and Stop
conditions.

3.2 Serial Clock (SCL)


This input is used to synchronize the data transfer to
and from the device.

3.3 Oscillator Input/Output (X1, X2)


These pins are used as the connections for an external
32.768 kHz quartz crystal and load capacitors. X1 is
the crystal oscillator input and X2 is the output. The
MCP7940N is designed to allow for the use of external
load capacitors in order to provide additional flexibility
when choosing external crystals. The MCP7940N is
optimized for crystals with a specified load capacitance
of 6-9 pF.
X1 also serves as the external clock input when the
MCP7940N is configured to use an external oscillator.

3.4 Multifunction Pin (MFP)


This is an output pin used for the alarm and square
wave output functions. It can also serve as a general
purpose output pin by controlling the OUT bit in the
CONTROL register.
The MFP is an open-drain output and requires a pull-up
resistor to Vcc (typically 10 k). This pin may be left
floating if not used.

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MCP7940N
4.0 I2C BUS CHARACTERISTICS 4.1.1.3 Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock


4.1 I2C Interface (SCL) is high determines a Stop condition. All
operations must end with a Stop condition.
The MCP7940N supports a bidirectional two-wire bus
and data transmission protocol. A device that sends 4.1.1.4 Data Valid (D)
data onto the bus is defined as transmitter, and a
device receiving data as receiver. The bus has to be The state of the data line represents valid data when,
controlled by a host device which generates the Start after a Start condition, the data line is stable for the
and Stop conditions, while the MCP7940N works as cli- duration of the high period of the clock signal.
ent. Both host and client can operate as transmitter or The data on the line must be changed during the low
receiver but the host device determines which mode is period of the clock signal. There is one bit of data per
activated. clock pulse.
4.1.1 BUS CHARACTERISTICS Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
The following bus protocol has been defined: data bytes transferred between the Start and Stop
• Data transfer may be initiated only when the bus conditions is determined by the host device.
is not busy.
4.1.1.5 Acknowledge
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in Each receiving device, when addressed, is obliged to
the data line while the clock line is high will be generate an Acknowledge signal after the reception of
interpreted as a Start or Stop condition. each byte. The host device must generate an extra
Accordingly, the following bus conditions have been clock pulse which is associated with this Acknowledge
defined (Figure 4-1). bit.
Note: The I2C interface is disabled while operat-
4.1.1.1 Bus Not Busy (A)
ing from the backup power supply.
Both data and clock lines remain high.
A device that acknowledges must pull down the SDA
4.1.1.2 Start Data Transfer (B) line during the Acknowledge clock pulse in such a way
that the SDA line is stable-low during the high period of
A high-to-low transition of the SDA line while the clock the Acknowledge-related clock pulse. Of course, setup
(SCL) is high determines a Start condition. All and hold times must be taken into account. During
commands must be preceded by a Start condition. reads, a host must signal an end of data to the client by
NOT generating an Acknowledge bit on the last byte
that has been clocked out of the client. In this case, the
client (MCP7940N) will leave the data line high to
enable the host to generate the Stop condition.

FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS

(A) (B) (D) (D) (C) (A)


SCL

SDA

Start Address or Data Stop


Condition Acknowledge Allowed Condition
Valid to Change

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MCP7940N
FIGURE 4-2: ACKNOWLEDGE TIMING

Acknowledge
Bit

SCL 1 2 3 4 5 6 7 8 9 1 2 3

SDA Data from transmitter Data from transmitter

Transmitter must release the SDA line at this point Receiver must release the SDA line at this point
allowing the Receiver to pull the SDA line low to so the Transmitter can continue sending data.
acknowledge the previous eight bits of data.

4.1.2 DEVICE ADDRESSING FIGURE 4-3: CONTROL BYTE FORMAT


The control byte is the first byte received following the Acknowledge Bit
Start condition from the host device (Figure 4-3). The
control byte begins with a 4-bit control code. For the Read/Write Bit
MCP7940N, this is set ‘1101’ for register read and Start Bit
write operations. The next three bits are non-config- Chip Select
urable Chip Select bits that must always be set to ‘1’. Control Code Bits
The last bit of the control byte defines the operation to
be performed. When set to a ‘1’ a read operation is S 1 1 0 1 1 1 1 R/W ACK
selected, and when set to a ‘0’ a write operation is
selected. RTCC Register/SRAM Control Byte
The combination of the 4-bit control code and the three
Chip Select bits is called the client address. Upon
receiving a valid client address, the client device out-
puts an acknowledge signal on the SDA line. Depend-
ing on the state of the R/W bit, the MCP7940N will
select a read or a write operation.

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MCP7940N
5.0 FUNCTIONAL DESCRIPTION 5.1 Memory Organization
The MCP7940N is a highly-integrated Real-Time The MCP7940N features two different blocks of mem-
Clock/Calendar (RTCC). Using an on-board, ory: the RTCC registers and general purpose SRAM
low-power oscillator, the current time is maintained in (Figure 5-1). They share the same address space,
seconds, minutes, hours, day of week, date, month, accessed through the ‘1101111X’ control byte.
and year. The MCP7940N also features 64 bytes of Unused locations are not accessible. The MCP7940N
general purpose SRAM. Two alarm modules allow will not acknowledge if the address is out of range, as
interrupts to be generated at specific times with flexible shown in the shaded region of the memory map in
comparison options. Digital trimming can be used to Figure 5-1.
compensate for inaccuracies inherent with crystals. The RTCC registers are contained in addresses
Using the backup supply input and an integrated power 0x00-0x1F. Table 5-1 shows the detailed RTCC regis-
switch, the MCP7940N will automatically switch to ter map. There are 64 bytes of user-accessible SRAM,
backup power when primary power is unavailable, located in the address range 0x20-0x5F. The SRAM is
allowing the current time and the SRAM contents to be a separate block from the RTCC registers. All RTCC
maintained. The time-stamp module captures the time registers and SRAM locations are maintained while
when primary power is lost and when it is restored. operating from backup power.
The RTCC configuration and Status registers are used
to access all of the modules featured on the
MCP7940N.

FIGURE 5-1: MEMORY MAP


RTCC Registers/SRAM
0x00
Time and Date
0x06
0x07
Configuration and Trimming
0x09
0x0A
Alarm 0
0x10
0x11
Alarm 1
0x17
0x18
Power-Fail/Power-Up Time-Stamps
0x1F
0x20

SRAM (64 Bytes)

0x5F
0x60

Unimplemented; device does not ACK

0xFF

I2C Address: 1101111x

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MCP7940N

TABLE 5-1: DETAILED RTCC REGISTER MAP


Addr. Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Section 5.3 “Timekeeping”
00h RTCSEC ST SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0
01h RTCMIN — MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0
02h RTCHOUR — 12/24 AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0
HRTEN1
03h RTCWKDAY — — OSCRUN PWRFAIL VBATEN WKDAY2 WKDAY1 WKDAY0
04h RTCDATE — — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0
05h RTCMTH — — LPYR MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0
06h RTCYEAR YRTEN3 YRTEN2 YRTEN1 YRTEN0 YRONE3 YRONE2 YRONE1 YRONE0
07h CONTROL OUT SQWEN ALM1EN ALM0EN EXTOSC CRSTRIM SQWFS1 SQWFS0
08h OSCTRIM SIGN TRIMVAL6 TRIMVAL5 TRIMVAL4 TRIMVAL3 TRIMVAL2 TRIMVAL1 TRIMVAL0
09h Reserved Reserved – Do not use
Section 5.4 “Alarms”
0Ah ALM0SEC — SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0
0Bh ALM0MIN — MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0
0Ch ALM0HOUR — 12/24(2) AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0
HRTEN1
0Dh ALM0WKDAY ALMPOL ALM0MSK2 ALM0MSK1 ALM0MSK0 ALM0IF WKDAY2 WKDAY1 WKDAY0
0Eh ALM0DATE — — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0
0Fh ALM0MTH — — — MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0
10h Reserved Reserved – Do not use
Section 5.4 “Alarms”
11h ALM1SEC — SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0
12h ALM1MIN — MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0
13h ALM1HOUR — 12/24(2) AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0
HRTEN1
14h ALM1WKDAY ALMPOL(3) ALM1MSK2 ALM1MSK1 ALM1MSK0 ALM1IF WKDAY2 WKDAY1 WKDAY0
15h ALM1DATE — — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0
16h ALM1MTH — — — MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0
17h Reserved Reserved – Do not use
Section 5.7.1 “Power-Fail Time-Stamp”
18h PWRDNMIN — MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0
19h PWRDNHOUR — 12/24 AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0
HRTEN1
1Ah PWRDNDATE — — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0
1Bh PWRDNMTH WKDAY2 WKDAY1 WKDAY0 MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0
Section 5.7.1 “Power-Fail Time-Stamp”
1Ch PWRUPMIN — MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0
1Dh PWRUPHOUR — 12/24 AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0
HRTEN1
1Eh PWRUPDATE — — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0
1Fh PWRUPMTH WKDAY2 WKDAY1 WKDAY0 MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0
Note 1: Grey areas are unimplemented.
2: The 12/24 bits in the ALMxHOUR registers are read-only and reflect the value of the 12/24 bit in the
RTCHOUR register.
3: The ALMPOL bit in the ALM1WKDAY register is read-only and reflects the value of the ALMPOL bit in the
ALM0WKDAY register.

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MCP7940N
5.2 Oscillator Configuration EQUATION 5-1: LOAD CAPACITANCE
CALCULATION
The MCP7940N can be operated in two different oscil-
lator configurations: using an external crystal or using
an external clock input. C X1  C X2
C L = -------------------------
- + C STRAY
C X1 + C X2
5.2.1 EXTERNAL CRYSTAL
The crystal oscillator circuit on the MCP7940N is Where:
designed to operate with a standard 32.768 kHz tuning C L = Effective load capacitance
fork crystal and matching external load capacitors. By
C X1 = Capacitor value on X1 + C OSC
using external load capacitors, the MCP7940N allows
C X2 = Capacitor value on X2 + C OSC
for a wide selection of crystals. Suitable crystals have a
C STRAY = PCB stray capacitance
load capacitance (CL) of 6-9 pF. Crystals with a load
capacitance of 12.5 pF are not recommended.
Figure 5-2 shows the pin connections when using an
5.2.1.2 Layout Considerations
external crystal.
The oscillator circuit should be placed on the same
FIGURE 5-2: CRYSTAL OPERATION side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins. The load
MCP7940N capacitors should be placed next to the oscillator
itself, on the same side of the board.
X1 Use a grounded copper pour around the oscillator
CX1
circuit to isolate it from surrounding circuits. The
To Internal
Logic grounded copper pour should be routed directly to VSS.
Quartz
Do not run any signal traces or power traces inside the
ST ground pour. Also, if using a two-sided board, avoid any
Crystal
traces on the other side of the board where the crystal
is placed.
CX 2 X2
Layout suggestions are shown in Figure 5-3. In-line
packages may be handled with a single-sided layout
that completely encompasses the oscillator pins. With
fine-pitch packages, it is not always possible to com-
Note 1: The ST bit must be set to enable the
pletely surround the pins and components. A suitable
crystal oscillator circuit.
solution is to tie the broken guard sections to a mirrored
2: Always verify oscillator performance over ground layer. In all cases, the guard trace(s) must be
the voltage and temperature range that is returned to ground.
expected for the application.
For additional information and design guidance on
oscillator circuits, refer to these Microchip Application
5.2.1.1 Choosing Load Capacitors
Notes, available at the corporate website
CL is the effective load capacitance as seen by the (www.microchip.com):
crystal, and includes the physical load capacitors, pin
• AN1365, “Recommended Usage of Microchip
capacitance, and stray board capacitance. Equation 5-1
Serial RTCC Devices”
can be used to calculate CL.
• AN1519, “Recommended Crystals for Microchip
CX1 and CX2 are the external load capacitors. They Stand-Alone Real-Time Clock Calendar Devices”
must be chosen to match the selected crystal’s
specified load capacitance.
Note: If the load capacitance is not correctly
matched to the chosen crystal’s specified
value, the crystal may give a frequency
outside of the crystal manufacturer’s
specifications.

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MCP7940N
FIGURE 5-3: SUGGESTED PLACEMENT OF THE OSCILLATOR CIRCUIT
Single-Sided and In-line Layouts: Fine-Pitch (Dual-Sided) Layouts:
Copper Pour Oscillator Top Layer Copper Pour
(tied to ground) Crystal (tied to ground)

Bottom Layer
Copper Pour
(tied to ground)

X1
X1

CX1
CX1
X2 Oscillator GND
Crystal

CX2
GND
CX2
` X2

DEVICE PINS

DEVICE PINS

5.2.2 EXTERNAL CLOCK INPUT 5.2.3 OSCILLATOR FAILURE STATUS


A 32.768 kHz external clock source can be connected The MCP7940N features an oscillator failure flag,
to the X1 pin (Figure 5-4). When using this OSCRUN, that indicates whether or not the oscillator is
configuration, the X2 pin should be left floating. running. The OSCRUN bit is automatically set after 32
oscillator cycles are detected. If no oscillator cycles are
Note: The EXTOSC bit must be set to enable an
detected for more than TOSF, then the OSCRUN bit is
external clock source.
automatically cleared (Figure 5-5). This can occur if the
oscillator is stopped by clearing the ST bit or due to
FIGURE 5-4: EXTERNAL CLOCK INPUT oscillator failure.
OPERATION

MCP7940N

Clock from X1
Ext. Source

FIGURE 5-5: OSCILLATOR FAILURE STATUS TIMING DIAGRAM

X1

32 Clock Cycles < TOSF TOSF

OSCRUN Bit

TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH OSCILLATOR CONFIGURATION


Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
on Page

RTCSEC ST SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0 16


RTCWKDAY — — OSCRUN PWRFAIL VBATEN WKDAY2 WKDAY1 WKDAY0 18
CONTROL OUT SQWEN ALM1EN ALM0EN EXTOSC CRSTRIM SQWFS1 SQWFS0 26
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by oscillator configuration.

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MCP7940N
5.3 Timekeeping 5.3.1 DIGIT CARRY RULES
The MCP7940N maintains the current time and date The following list explains which timer values cause a
using an external 32.768 kHz crystal or clock source. digit carry when there is a rollover:
Separate registers are used for tracking seconds, min- • Time of day: from 11:59:59 PM to 12:00:00 AM
utes, hours, day of week, date, month, and year. The (12-hour mode) or 23:59:59 to 00:00:00 (24-hour
MCP7940N automatically adjusts for months with less mode), with a carry to the Date and Weekday
than 31 days and compensates for leap years from fields
2001 to 2399. The year is stored as a two-digit value. • Date: carries to the Month field according to Table
Both 12-hour and 24-hour time formats are supported 5-3
and are selected using the 12/24 bit. • Weekday: from 7 to 1 with no carry
The day of week value counts from 1 to 7, increments • Month: from 12/31 to 01/01 with a carry to the
at midnight, and the representation is user-defined (i.e., Year field
the MCP7940N does not require 1 to equal Sunday, • Year: from 99 to 00 with no carry
etc.).
All time and date values are stored in the registers as TABLE 5-3: DAY TO MONTH ROLLOVER
binary-coded decimal (BCD) values. The MCP7940N SCHEDULE
will continue to maintain the time and date while oper- Month Name Maximum Date
ating off the backup supply.
01 January 31
When reading from the timekeeping registers, the reg-
02 February 28 or 29(1)
isters are buffered to prevent errors due to rollover of
counters. The following events cause the buffers to be 03 March 31
updated: 04 April 30
• When a read is initiated from the RTCC registers 05 May 31
(addresses 0x00 to 0x1F) 06 June 30
• During an RTCC register read operation, when 07 July 31
the register address rolls over from 0x1F to 0x00
08 August 31
The timekeeping registers should be read in a single
09 September 30
operation to utilize the on-board buffers and avoid
rollover issues. 10 October 31
11 November 30
Note 1: Loading invalid values into the time and
date registers will result in undefined 12 December 31
operation. Note 1: 29 during leap years, otherwise 28.
2: To avoid rollover issues when loading
new time and date values, the oscilla-
tor/clock input should be disabled by
clearing the ST bit for External Crystal
mode and the EXTOSC bit for External
Clock Input mode. After waiting for the
OSCRUN bit to clear, the new values can
be loaded and the ST or EXTOSC bit can
then be re-enabled.

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MCP7940N

REGISTER 5-1: RTCSEC: TIMEKEEPING SECONDS VALUE REGISTER (ADDRESS 0x00)


R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ST SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7 ST: Start Oscillator bit


1 = Oscillator enabled
0 = Oscillator disabled
bit 6-4 SECTEN<2:0>: Binary-Coded Decimal Value of Second’s Tens Digit
Contains a value from 0 to 5
bit 3-0 SECONE<3:0>: Binary-Coded Decimal Value of Second’s Ones Digit
Contains a value from 0 to 9

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MCP7940N
REGISTER 5-2: RTCMIN: TIMEKEEPING MINUTES VALUE REGISTER (ADDRESS 0x01)
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7 Unimplemented: Read as ‘0’


bit 6-4 MINTEN<2:0>: Binary-Coded Decimal Value of Minute’s Tens Digit
Contains a value from 0 to 5
bit 3-0 MINONE<3:0>: Binary-Coded Decimal Value of Minute’s Ones Digit
Contains a value from 0 to 9
REGISTER 5-3: RTCHOUR: TIMEKEEPING HOURS VALUE REGISTER (ADDRESS 0x02)
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— 12/24 AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0
HRTEN1
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

If 12/24 = 1 (12-hour format):


bit 7 Unimplemented: Read as ‘0’
bit 6 12/24: 12 or 24 Hour Time Format bit
1 = 12-hour format
0 = 24-hour format
bit 5 AM/PM: AM/PM Indicator bit
1 = PM
0 = AM
bit 4 HRTEN0: Binary-Coded Decimal Value of Hour’s Tens Digit
Contains a value from 0 to 1
bit 3-0 HRONE<3:0>: Binary-Coded Decimal Value of Hour’s Ones Digit
Contains a value from 0 to 9
If 12/24 = 0 (24-hour format):
bit 7 Unimplemented: Read as ‘0’
bit 6 12/24: 12 or 24 Hour Time Format bit
1 = 12-hour format
0 = 24-hour format
bit 5-4 HRTEN<1:0>: Binary-Coded Decimal Value of Hour’s Tens Digit
Contains a value from 0 to 2.
bit 3-0 HRONE<3:0>: Binary-Coded Decimal Value of Hour’s Ones Digit
Contains a value from 0 to 9

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MCP7940N

REGISTER 5-4: RTCWKDAY: TIMEKEEPING WEEKDAY VALUE REGISTER (ADDRESS 0x03)


U-0 U-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1
— — OSCRUN PWRFAIL VBATEN WKDAY2 WKDAY1 WKDAY0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7-6 Unimplemented: Read as ‘0’


bit 5 OSCRUN: Oscillator Status bit
1 = Oscillator is enabled and running
0 = Oscillator has stopped or has been disabled
bit 4 PWRFAIL: Power Failure Status bit(1,2)
1 = Primary power was lost and the power-fail time-stamp registers have been loaded (must be
cleared in software). Clearing this bit resets the power-fail time-stamp registers to ‘0’.
0 = Primary power has not been lost
bit 3 VBATEN: External Battery Backup Supply (VBAT) Enable bit
1 = VBAT input is enabled
0 = VBAT input is disabled
bit 2-0 WKDAY<2:0>: Binary-Coded Decimal Value of Day of Week
Contains a value from 1 to 7. The representation is user-defined.
Note 1: The PWRFAIL bit must be cleared to log new time-stamp data. This is to ensure previous time-stamp data
is not lost.
2: The PWRFAIL bit cannot be written to a ‘1’ in software. Writing to the RTCWKDAY register will always
clear the PWRFAIL bit.
REGISTER 5-5: RTCDATE: TIMEKEEPING DATE VALUE REGISTER (ADDRESS 0x04)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1
— — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7-6 Unimplemented: Read as ‘0’


bit 5-4 DATETEN<1:0>: Binary-Coded Decimal Value of Date’s Tens Digit
Contains a value from 0 to 3
bit 3-0 DATEONE<3:0>: Binary-Coded Decimal Value of Date’s Ones Digit
Contains a value from 0 to 9

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MCP7940N

REGISTER 5-6: RTCMTH: TIMEKEEPING MONTH VALUE REGISTER (ADDRESS 0x05)


U-0 U-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1
— — LPYR MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7-6 Unimplemented: Read as ‘0’


bit 5 LPYR: Leap Year bit
1 = Year is a leap year
0 = Year is not a leap year
bit 4 MTHTEN0: Binary-Coded Decimal Value of Month’s Tens Digit
Contains a value of 0 or 1
bit 3-0 MTHONE<3:0>: Binary-Coded Decimal Value of Month’s Ones Digit
Contains a value from 0 to 9
REGISTER 5-7: RTCYEAR: TIMEKEEPING YEAR VALUE REGISTER (ADDRESS 0x06)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1
YRTEN3 YRTEN2 YRTEN1 YRTEN0 YRONE3 YRONE2 YRONE1 YRONE0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7-4 YRTEN<3:0>: Binary-Coded Decimal Value of Year’s Tens Digit


Contains a value from 0 to 9
bit 3-0 YRONE<3:0>: Binary-Coded Decimal Value of Year’s Ones Digit
Contains a value from 0 to 9

TABLE 5-4: SUMMARY OF REGISTERS ASSOCIATED WITH TIMEKEEPING


Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
on Page
RTCSEC ST SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0 16
RTCMIN — MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0 17
RTCHOUR — 12/24 AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0 17
HRTEN1
RTCWKDAY — — OSCRUN PWRFAIL VBATEN WKDAY2 WKDAY1 WKDAY0 18
RTCDATE — — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0 18
RTCMTH — — LPYR MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0 19
RTCYEAR YRTEN3 YRTEN2 YRTEN1 YRTEN0 YRONE3 YRONE2 YRONE1 YRONE0 19
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used in timekeeping.

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MCP7940N
5.4 Alarms TABLE 5-5: ALARM MASKS
The MCP7940N features two independent alarms. ALMxMSK<2:0> Alarm Asserts on Match of
Each alarm can be used to either generate an interrupt 000 Seconds
at a specific time in the future, or to generate a periodic
001 Minutes
interrupt every minute, hour, day, day of week, or
month. 010 Hours
There is a separate interrupt flag, ALMxIF, for each 011 Day of Week
alarm. The interrupt flags are set by hardware when the 100 Date
chosen alarm mask condition matches (Table 5-5). The 101 Reserved
interrupt flags must be cleared in software.
110 Reserved
If either alarm module is enabled by setting the corre-
111 Seconds, Minutes, Hours, Day of
sponding ALMxEN bit in the CONTROL register, and if
Week, Date, and Month
the square wave clock output is disabled (SQWEN =
0), then the MFP will operate in Alarm Interrupt Output
mode. Refer to Section 5.5 “Output Configurations”
Note 1: The alarm interrupt flags must be cleared
for details. The alarm interrupt output is available while
by the user. If a flag is cleared while the
operating from the backup power supply.
corresponding alarm condition still
Both Alarm0 and Alarm1 offer identical operation. All matches, the flag will be set again, gener-
time and date values are stored in the registers as ating another interrupt.
binary-coded decimal (BCD) values.
2: Loading invalid values into the alarm reg-
Note: Throughout this section, references to the isters will result in undefined operation.
register and bit names for the alarm mod-
ules are referred to generically by the use
of ‘x’ in place of the specific module num-
ber. Thus, “ALMxSEC” might refer to the
seconds register for Alarm0 or Alarm1.

FIGURE 5-6: ALARM BLOCK DIAGRAM

Alarm0 Timekeeping Alarm1


Registers Registers Registers

ALM0SEC RTCSEC ALM1SEC

ALM0MIN RTCMIN ALM1MIN

ALM0HOUR RTCHOUR ALM1HOUR

ALM0WKDAY RTCWKDAY ALM1WKDAY

ALM0DATE RTCDATE ALM1DATE

ALM0MTH RTCMTH ALM1MTH

Alarm0 Mask Comparator Comparator Alarm1 Mask

Set Set
ALM0IF ALM1IF

ALM0MSK<2:0> MFP Output Logic MFP ALM1MSK<2:0>

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MCP7940N
5.4.1 CONFIGURING THE ALARM
In order to configure the alarm modules, the following
steps need to be performed:
1. Load the timekeeping registers and enable the
oscillator
2. Configure the ALMxMSK<2:0> bits to select the
desired alarm mask
3. Set or clear the ALMPOL bit according to the
desired output polarity
4. Ensure the ALMxIF flag is cleared
5. Based on the selected alarm mask, load the
alarm match value into the appropriate regis-
ter(s)
6. Enable the alarm module by setting the
ALMxEN bit

REGISTER 5-8: ALMxSEC: ALARM0/1 SECONDS VALUE REGISTER (ADDRESSES 0x0A/0x11)


U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7 Unimplemented: Read as ‘0’


bit 6-4 SECTEN<2:0>: Binary-Coded Decimal Value of Second’s Tens Digit
Contains a value from 0 to 5
bit 3-0 SECONE<3:0>: Binary-Coded Decimal Value of Second’s Ones Digit
Contains a value from 0 to 9
REGISTER 5-9: ALMxMIN: ALARM0/1 MINUTES VALUE REGISTER (ADDRESSES 0x0B/0x12)
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7 Unimplemented: Read as ‘0’


bit 6-4 MINTEN<2:0>: Binary-Coded Decimal Value of Minute’s Tens Digit
Contains a value from 0 to 5
bit 3-0 MINONE<3:0>: Binary-Coded Decimal Value of Minute’s Ones Digit
Contains a value from 0 to 9

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MCP7940N
REGISTER 5-10: ALMxHOUR: ALARM0/1 HOURS VALUE REGISTER (ADDRESSES 0x0C/0x13)
U-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— 12/24 AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0
HRTEN1
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

If 12/24 = 1 (12-hour format):


bit 7 Unimplemented: Read as ‘0’
bit 6 12/24: 12 or 24 Hour Time Format bit(1)
1 = 12-hour format
0 = 24-hour format
bit 5 AM/PM: AM/PM Indicator bit
1 = PM
0 = AM
bit 4 HRTEN0: Binary-Coded Decimal Value of Hour’s Tens Digit
Contains a value from 0 to 1
bit 3-0 HRONE<3:0>: Binary-Coded Decimal Value of Hour’s Ones Digit
Contains a value from 0 to 9
If 12/24 = 0 (24-hour format):
bit 7 Unimplemented: Read as ‘0’
bit 6 12/24: 12 or 24 Hour Time Format bit(1)
1 = 12-hour format
0 = 24-hour format
bit 5-4 HRTEN<1:0>: Binary-Coded Decimal Value of Hour’s Tens Digit
Contains a value from 0 to 2.
bit 3-0 HRONE<3:0>: Binary-Coded Decimal Value of Hour’s Ones Digit
Contains a value from 0 to 9
Note 1: This bit is read-only and reflects the value of the 12/24 bit in the RTCHOUR register.

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MCP7940N

REGISTER 5-11: ALMxWKDAY: ALARM0/1 WEEKDAY VALUE REGISTER (ADDRESSES


0x0D/0x14)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1
ALMPOL ALMxMSK2 ALMxMSK1 ALMxMSK0 ALMxIF WKDAY2 WKDAY1 WKDAY0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7 ALMPOL: Alarm Interrupt Output Polarity bit


1 = Asserted output state of MFP is a logic high level
0 = Asserted output state of MFP is a logic low level
bit 6-4 ALMxMSK<2:0>: Alarm Mask bits
000 = Seconds match
001 = Minutes match
010 = Hours match (logic takes into account 12-/24-hour operation)
011 = Day of week match
100 = Date match
101 = Reserved; do not use
110 = Reserved; do not use
111 = Seconds, Minutes, Hour, Day of Week, Date and Month
bit 3 ALMxIF: Alarm Interrupt Flag bit(1,2)
1 = Alarm match occurred (must be cleared in software)
0 = Alarm match did not occur
bit 2-0 WKDAY<2:0>: Binary-Coded Decimal Value of Day bits
Contains a value from 1 to 7. The representation is user-defined.
Note 1: If a match condition still exists when this bit is cleared, it will be set again automatically.
2: The ALMxIF bit cannot be written to a 1 in software. Writing to the ALMxWKDAY register will always clear
the ALMxIF bit.

REGISTER 5-12: ALMxDATE: ALARM0/1 DATE VALUE REGISTER (ADDRESSES 0x0E/0x15)


U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1
— — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7-6 Unimplemented: Read as ‘0’


bit 5-4 DATETEN<1:0>: Binary-Coded Decimal Value of Date’s Tens Digit
Contains a value from 0 to 3
bit 3-0 DATEONE<3:0>: Binary-Coded Decimal Value of Date’s Ones Digit
Contains a value from 0 to 9

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MCP7940N

REGISTER 5-13: ALMxMTH: ALARM0/1 MONTH VALUE REGISTER (ADDRESSES 0x0F/0x16)


U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1
— — — MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7-5 Unimplemented: Read as ‘0’


bit 4 MTHTEN0: Binary-Coded Decimal Value of Month’s Tens Digit
Contains a value of 0 or 1
bit 3-0 MTHONE<3:0>: Binary-Coded Decimal Value of Month’s Ones Digit
Contains a value from 0 to 9

TABLE 5-6: SUMMARY OF REGISTERS ASSOCIATED WITH ALARMS


Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
on Page
ALM0SEC — SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0 21
ALM0MIN — MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0 21
ALM0HOUR — 12/24 AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0 22
HRTEN1
ALM0WKDAY ALMPOL ALM0MSK2 ALM0MSK1 ALM0MSK0 ALM0IF WKDAY2 WKDAY1 WKDAY0 23
ALM0DATE — — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0 23
ALM0MTH — — — MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0 24
ALM1SEC — SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0 21
ALM1MIN — MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0 21
ALM1HOUR — 12/24 AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0 22
HRTEN1
ALM1WKDAY ALMPOL ALM1MSK2 ALM1MSK1 ALM1MSK0 ALM1IF WKDAY2 WKDAY1 WKDAY0 23
ALM1DATE — — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0 23
ALM1MTH — — — MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0 24
CONTROL OUT SQWEN ALM1EN ALM0EN EXTOSC CRSTRIM SQWFS1 SQWFS0 26
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by alarms.

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MCP7940N
5.5 Output Configurations TABLE 5-7: MFP OUTPUT MODES
The MCP7940N features Square Wave Clock Output, SQWEN ALM0EN ALM1EN Mode
Alarm Interrupt Output, and General Purpose Output General Purpose
modes. All of the output functions are multiplexed onto 0 0 0
Output
MFP according to Table 5-7.
0 1 0
Only the alarm interrupt outputs are available while Alarm Interrupt
0 0 1
operating from the backup power supply. If none of the Output
output functions are being used, the MFP can safely be 0 1 1
left floating. Square Wave Clock
1 x x
Output
Note: The MFP is an open-drain output and
requires a pull-up resistor to VCC (typically
10 k).

FIGURE 5-7: MFP OUTPUT BLOCK DIAGRAM

MCP7940N

SQWFS<1:0>
Oscillator
X1 32.768 kHz
11
8.192 kHz
10

MUX
4.096 kHz

Postscaler
EXTOSC 01
X2 Digital 1 Hz
Trim 00 0
ST
64 Hz
1

CRSTRIM

ALM1EN,ALM0EN
ALMPOL
11 1 MFP
ALM1IF 1
10
MUX

0
0
01
OUT 00 SQWEN
ALM0IF 1

 2011-2022 Microchip Technology Inc. and its subsidiares DS20005010J-page 25


MCP7940N
REGISTER 5-14: CONTROL: RTCC CONTROL REGISTER (ADDRESS 0x07)
R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
OUT SQWEN ALM1EN ALM0EN EXTOSC CRSTRIM SQWFS1 SQWFS0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7 OUT: Logic Level for General Purpose Output bit


Square Wave Clock Output Mode (SQWEN = 1):
Unused.
Alarm Interrupt Output mode (ALM0EN = 1 or ALM1EN = 1):
Unused.
General Purpose Output mode (SQWEN = 0, ALM0EN = 0, and ALM1EN = 0):
1 = MFP signal level is logic high
0 = MFP signal level is logic low
bit 6 SQWEN: Square Wave Output Enable bit
1 = Enable Square Wave Clock Output mode
0 = Disable Square Wave Clock Output mode
bit 5 ALM1EN: Alarm 1 Module Enable bit
1 = Alarm 1 enabled
0 = Alarm 1 disabled
bit 4 ALM0EN: Alarm 0 Module Enable bit
1 = Alarm 0 enabled
0 = Alarm 0 disabled
bit 3 EXTOSC: External Oscillator Input bit
1 = Enable X1 pin to be driven by external 32.768 kHz source
0 = Disable external 32.768 kHz input
bit 2 CRSTRIM: Coarse Trim Mode Enable bit
Coarse Trim mode results in the MCP7940N applying digital trimming every 64 Hz clock cycle.
1 = Enable Coarse Trim mode. If SQWEN = 1, MFP will output trimmed 64 Hz(1) nominal clock signal.
0 = Disable Coarse Trim mode
See Section 5.6 “Digital Trimming” for details
bit 1-0 SQWFS<1:0>: Square Wave Clock Output Frequency Select bits
If SQWEN = 1 and CRSTRIM = 0:
Selects frequency of clock output on MFP
00 = 1 Hz(1)
01 = 4.096 kHz(1)
10 = 8.192 kHz(1)
11 = 32.768 kHz
If SQWEN = 0 or CRSTRIM = 1:
Unused.
Note 1: The 8.192 kHz, 4.096 kHz, 64 Hz, and 1 Hz square wave clock output frequencies are affected by digital
trimming.

DS20005010J-page 26  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N
5.5.1 SQUARE WAVE OUTPUT MODE 5.5.2.2 Dual Alarm Operation
The MCP7940N can be configured to generate a When both alarm modules are enabled, the MFP out-
square wave clock signal on MFP. The input clock put is determined by a combination of the ALM0IF,
frequency, FOSC, is divided according to the ALM1IF, and ALMPOL flags.
SQWFS<1:0> bits as shown in Table 5-8. If ALMPOL = 1, the ALM0IF and ALM1IF flags are
The square wave output is not available when operat- OR’d together and the result is output on MFP. If
ing from the backup power supply. ALMPOL = 0, the ALM0IF and ALM1IF flags are AND’d
together, and the result is inverted and output on MFP
Note: All of the clock output rates are affected by
(Table 5-10). This provides the user with flexible
digital trimming except for the 1:1
options for combining alarms.
postscaler value (SQWFS<1:0> = 11).
Note: If ALMPOL = 0 and both alarms are
TABLE 5-8: CLOCK OUTPUT RATES enabled, the MFP will only assert when
both ALM0IF and ALM1IF are set.
Nominal
SQWFS<1:0> Postscaler
Frequency
TABLE 5-10: DUAL ALARM OUTPUT
00 1:32,768 1 Hz TRUTH TABLE
01 1:8 4.096 kHz ALMPOL ALM0IF ALM1IF MFP
10 1:4 8.192 kHz
0 0 0 1
11 1:1 32.768 kHz
0 0 1 1
Note 1: Nominal frequency assumes FOSC is
0 1 0 1
32.768 kHz.
0 1 1 0
5.5.2 ALARM INTERRUPT OUTPUT 1 0 0 0
MODE 1 0 1 1
The MFP will provide an interrupt output when enabled 1 1 0 1
alarms match and the square wave clock output is dis-
1 1 1 1
abled. This prevents the user from having to poll the
alarm interrupt flag to check for a match.
5.5.3 GENERAL PURPOSE OUTPUT
The alarm interrupt output is available when operating MODE
from the backup power supply.
If the square wave clock output and both alarm mod-
The ALMxIF flags control when the MFP is asserted, as ules are disabled, the MFP acts as a general purpose
described in the following sections. output. The output logic level is controlled by the OUT
bit.
5.5.2.1 Single Alarm Operation
The general purpose output is not available when
When only one alarm module is enabled, the MFP output operating from the backup power supply.
is based on the corresponding ALMxIF flag and the
ALMPOL flag. If ALMPOL = 1, the MFP output reflects
the value of the ALMxIF flag. If ALMPOL = 0, the MFP
output reflects the inverse of the ALMxIF flag (Table 5-9).

TABLE 5-9: SINGLE ALARM OUTPUT


TRUTH TABLE
ALMPOL ALMxIF(1) MFP
0 0 1
0 1 0
1 0 0
1 1 1
Note 1: ALMxIF refers to the interrupt flag corre-
sponding to the alarm module that is
enabled.

 2011-2022 Microchip Technology Inc. and its subsidiares DS20005010J-page 27


MCP7940N
TABLE 5-11: SUMMARY OF REGISTERS ASSOCIATED WITH OUTPUT CONFIGURATION
Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
on Page
ALM0WKDAY ALMPOL ALM0MSK2 ALM0MSK1 ALM0MSK0 ALM0IF WKDAY2 WKDAY1 WKDAY0 23
ALM1WKDAY ALMPOL ALM1MSK2 ALM1MSK1 ALM1MSK0 ALM1IF WKDAY2 WKDAY1 WKDAY0 23
CONTROL OUT SQWEN ALM1EN ALM0EN EXTOSC CRSTRIM SQWFS1 SQWFS0 26
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used in output configuration.

DS20005010J-page 28  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N
5.6 Digital Trimming occurs once per minute when CRSTRIM = 0. The SIGN
bit specifies whether to add cycles or to subtract them.
The MCP7940N features digital trimming to correct for The TRIMVAL<6:0> bits are used to specify by how
inaccuracies of the external crystal or clock source, up many clock cycles to adjust. Each step in the
to roughly ±129 PPM when CRSTRIM = 0. In addition TRIMVAL<6:0> value equates to adding or subtracting
to compensating for intrinsic inaccuracies in the clock, two clock pulses to or from the 32.768 kHz clock signal.
this feature can also be used to correct for error due to This results in a correction of roughly 1.017 PPM per
temperature variation. This can enable the user to step when CRSTRIM = 0. Setting TRIMVAL<6:0> to
achieve high levels of accuracy across a wide tempera- 0x00 disables digital trimming.
ture operating range.
Digital trimming also occurs while operating off the
Digital trimming consists of the MCP7940N periodically backup supply.
adding or subtracting clock cycles, resulting in small
adjustments in the internal timing. The adjustment
REGISTER 5-15: OSCTRIM: OSCILLATOR DIGITAL TRIM REGISTER (ADDRESS 0x08)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SIGN TRIMVAL6 TRIMVAL5 TRIMVAL4 TRIMVAL3 TRIMVAL2 TRIMVAL1 TRIMVAL0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7 SIGN: Trim Sign bit


1 = Add clocks to correct for slow time
0 = Subtract clocks to correct for fast time
bit 6-0 TRIMVAL<6:0>: Oscillator Trim Value bits
When CRSTRIM = 0:
1111111 = Add or subtract 254 clock cycles every minute
1111110 = Add or subtract 252 clock cycles every minute



0000010 = Add or subtract 4 clock cycles every minute
0000001 = Add or subtract 2 clock cycles every minute
0000000 = Disable digital trimming
When CRSTRIM = 1:
1111111 = Add or subtract 254 clock cycles 128 times per second
1111110 = Add or subtract 252 clock cycles 128 times per second



0000010 = Add or subtract 4 clock cycles 128 times per second
0000001 = Add or subtract 2 clock cycles 128 times per second
0000000 = Disable digital trimming

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MCP7940N
5.6.1 CALIBRATION 5.6.1.2 Calibration by Observing Time
In order to perform calibration, the number of error Deviation
clock pulses per minute must be found and the corre- To calibrate the MCP7940N by observing the deviation
sponding trim value must be loaded into over time, perform the following steps:
TRIMVAL<6:0>.
1. Ensure TRIMVAL<6:0> is reset to 0x00.
There are two methods for determining the trim value. 2. Load the timekeeping registers to synchronize
The first method involves measuring an output fre- the MCP7940N with a known-accurate refer-
quency directly and calculating the deviation from ideal. ence time.
The second method involves observing the number of
3. Enable the crystal oscillator or external clock
seconds gained or lost over a period of time.
input by setting the ST bit or EXTOSC bit,
Once the OSCTRIM register has been loaded, digital respectively.
trimming will automatically occur every minute. 4. Observe how many seconds are gained or lost
over a period of time (larger time periods offer
5.6.1.1 Calibration by Measuring Frequency more accuracy).
To calibrate the MCP7940N by measuring the output 5. Calculate the PPM deviation (see Equation 5-3).
frequency, perform the following steps:
1. Enable the crystal oscillator or external clock EQUATION 5-3: CALCULATING ERROR
input by setting the ST bit or EXTOSC bit, PPM
respectively.
SecDeviation
2. Ensure TRIMVAL<6:0> is reset to 0x00. PPM = -----------------------------------  1000000
ExpectedSec
3. Select an output frequency by setting
SQWFS<1:0>.
Where:
4. Set SQWEN to enable the square wave output.
ExpectedSec = Number of seconds in chosen period
5. Measure the resulting output frequency using a
calibrated measurement tool, such as a SecDeviation = Number of seconds gained or lost
frequency counter.
6. Calculate the number of error clocks per minute • If the MCP7940N has gained time relative to
(see Equation 5-2). the reference clock, then the oscillator is
faster than ideal and the SIGN bit must be
EQUATION 5-2: CALCULATING TRIM cleared.
VALUE FROM MEASURED • If the MCP7940N has lost time relative to the
FREQUENCY reference clock, then the oscillator is slower
than ideal and the SIGN bit must be set.
32768 6. Calculate the trim value (see Equation 5-4).
 F IDEAL – F MEAS   -------------------  60
F IDEAL
TRIMVAL<6:0> = --------------------------------------------------------------------------------
-
2 EQUATION 5-4: CALCULATING TRIM
VALUE FROM ERROR
Where: PPM
F IDEAL = Ideal frequency based on SQWFS<1:0>
TRIMVAL<6:0> = PPM  32768  60-
F MEAS = Measured frequency ------------------------------------------
1000000  2

• If the number of error clocks per minute is


7. Load the correct value into TRIMVAL<6:0>.
negative, then the oscillator is faster than
ideal and the SIGN bit must be cleared.
• If the number of error clocks per minute is Note 1: Choosing a longer time period for observ-
positive, then the oscillator is slower than ing deviation will improve accuracy.
ideal and the SIGN bit must be set. 2: Large temperature variations during the
7. Load the correct value into TRIMVAL<6:0>. observation period can skew results.

Note: Using a lower output frequency and/or


averaging the measured frequency over a
number of clock pulses will reduce the
effects of jitter and improve accuracy.

DS20005010J-page 30  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N
5.6.2 COARSE TRIM MODE By monitoring the MFP output frequency while in this
mode, the user can easily observe the TRIMVAL<6:0>
When CRSTRIM = 1, Coarse Trim mode is enabled.
value affecting the clock timing.
While in this mode, the MCP7940N will apply trimming
at a rate of 128 Hz. If SQWEN is set, the MFP will out- Note 1: The 64 Hz Coarse Trim mode square
put a trimmed 64 Hz nominal clock signal. wave output is not available while operat-
Because trimming is applied at a rate of 128 Hz rather ing from the backup power supply.
than once every minute, each step of the 2: With Coarse Trim mode enabled, the
TRIMVAL<6:0> value has a significantly larger effect TRIMVAL<6:0> value has a drastic effect
on the resulting time deviation and output clock on timing. Leaving the mode enabled
frequency. during normal operation will likely result
in inaccurate time.

TABLE 5-12: SUMMARY OF REGISTERS ASSOCIATED WITH DIGITAL TRIMMING


Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
on Page
CONTROL OUT SQWEN ALM1EN ALM0EN EXTOSC CRSTRIM SQWFS1 SQWFS0 26
OSCTRIM SIGN TRIMVAL6 TRIMVAL5 TRIMVAL4 TRIMVAL3 TRIMVAL2 TRIMVAL1 TRIMVAL0 29
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by digital trimming.

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MCP7940N
5.7 Battery Backup 5.7.1 POWER-FAIL TIME-STAMP
The MCP7940N features a backup power supply input The MCP7940N includes a power-fail time-stamp mod-
(VBAT) that can be used to provide power to the time- ule that stores the minutes, hours, date, and month
keeping circuitry, RTCC registers, and SRAM while pri- when primary power is lost and when it is restored
mary power is unavailable. The MCP7940N will (Figure 5-8). The PWRFAIL bit is also set to indicate
automatically switch to backup power when VCC falls that a power failure occurred.
below VTRIP, and back to VCC when it is above VTRIP. Note: Throughout this section, references to the
The VBATEN bit must be set to enable the VBAT input. register and bit names for the Power-Fail
Time-Stamp module are referred to gener-
The following functionality is maintained while operat-
ically by the use of ‘x’ in place of the spe-
ing on backup power:
cific module name. Thus, “PWRxxMIN”
• Timekeeping might refer to the minutes register for
• Alarms Power-Down or Power-Up.
• Alarm Output To utilize the power-fail time-stamp feature, a backup
• Digital Trimming power supply must be available with the VBAT input
• RTCC Register and SRAM Contents enabled, and the oscillator should also be running to
The following features are not available while operating ensure accurate functionality.
on backup power: Note 1: The PWRFAIL bit must be cleared to log
• I2C Communication new time-stamp data. This is to ensure
• Square Wave Clock Output previous time-stamp data is not lost.
• General Purpose Output 2: Clearing the PWRFAIL bit will clear all
time-stamp registers.

FIGURE 5-8: POWER-FAIL TIME-STAMP TIMING

VCC

VTRIP

Power-Down Power-Up
Time-Stamp Time-Stamp

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MCP7940N
REGISTER 5-16: PWRxxMIN: POWER-DOWN/POWER-UP TIME-STAMP MINUTES VALUE
REGISTER (ADDRESSES 0x18/0x1C)
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7 Unimplemented: Read as ‘0’


bit 6-4 MINTEN<2:0>: Binary-Coded Decimal Value of Minute’s Tens Digit
Contains a value from 0 to 5
bit 3-0 MINONE<3:0>: Binary-Coded Decimal Value of Minute’s Ones Digit
Contains a value from 0 to 9
REGISTER 5-17: PWRxxHOUR: POWER-DOWN/POWER-UP TIME-STAMP HOURS VALUE
REGISTER (ADDRESSES 0x19/0x1D)
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— 12/24 AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0
HRTEN1
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

If 12/24 = 1 (12-hour format):


bit 7 Unimplemented: Read as ‘0’
bit 6 12/24: 12 or 24 Hour Time Format bit
1 = 12-hour format
0 = 24-hour format
bit 5 AM/PM: AM/PM Indicator bit
1 = PM
0 = AM
bit 4 HRTEN0: Binary-Coded Decimal Value of Hour’s Tens Digit
Contains a value from 0 to 1
bit 3-0 HRONE<3:0>: Binary-Coded Decimal Value of Hour’s Ones Digit
Contains a value from 0 to 9
If 12/24 = 0 (24-hour format):
bit 7 Unimplemented: Read as ‘0’
bit 6 12/24: 12 or 24 Hour Time Format bit
1 = 12-hour format
0 = 24-hour format
bit 5-4 HRTEN<1:0>: Binary-Coded Decimal Value of Hour’s Tens Digit
Contains a value from 0 to 2.
bit 3-0 HRONE<3:0>: Binary-Coded Decimal Value of Hour’s Ones Digit
Contains a value from 0 to 9

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MCP7940N
REGISTER 5-18: PWRxxDATE: POWER-DOWN/POWER-UP TIME-STAMP DATE VALUE
REGISTER (ADDRESSES 0x1A/0x1E)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7-6 Unimplemented: Read as ‘0’


bit 5-4 DATETEN<1:0>: Binary-Coded Decimal Value of Date’s Tens Digit
Contains a value from 0 to 3
bit 3-0 DATEONE<3:0>: Binary-Coded Decimal Value of Date’s Ones Digit
Contains a value from 0 to 9
REGISTER 5-19: PWRxxMTH: POWER-DOWN/POWER-UP TIME-STAMP MONTH VALUE
REGISTER (ADDRESSES 0x1B/0x1F)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WKDAY2 WKDAY1 WKDAY0 MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0
bit 7 bit 0

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown

bit 7-5 WKDAY<2:0>: Binary-Coded Decimal Value of Day bits


Contains a value from 1 to 7. The representation is user-defined.
bit 4 MTHTEN0: Binary-Coded Decimal Value of Month’s Ones Digit
Contains a value of 0 or 1
bit 3-0 MTHONE<3:0>: Binary-Coded Decimal Value of Month’s Ones Digit
Contains a value from 0 to 9

TABLE 5-13: SUMMARY OF REGISTERS ASSOCIATED WITH BATTERY BACKUP


Register
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
on Page
RTCWKDAY — — OSCRUN PWRFAIL VBATEN WKDAY2 WKDAY1 WKDAY0 18
PWRDNMIN — MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0 33
PWRDNHOUR — 12/24 AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0 33
HRTEN1
PWRDNDATE — — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0 34
PWRDNMTH WKDAY2 WKDAY1 WKDAY0 MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0 34
PWRUPMIN — MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0 33
PWRUPHOUR — 12/24 AM/PM HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0 33
HRTEN1
PWRUPDATE — — DATETEN1 DATETEN0 DATEONE3 DATEONE2 DATEONE1 DATEONE0 34
PWRUPMTH WKDAY2 WKDAY1 WKDAY0 MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0 34
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used with battery backup.

DS20005010J-page 34  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N
6.0 ON-BOARD MEMORY device transmits the data byte to be written into the
addressed memory location. The MCP7940N stores
The MCP7940N has 64 bytes of SRAM for general pur- the data byte into memory and acknowledges again,
pose usage. It is retained when the primary power and the host generates a Stop condition (Figure 6-1).
supply is removed if a backup supply is present and
If an attempt is made to write to an address past 0x5F,
enabled.
the MCP7940N will not acknowledge the address or
Although the SRAM is a separate block from the RTCC data bytes, and no data will be written. After a byte
registers, they are accessed using the same control Write command, the internal Address Pointer will point
byte, ‘1101111X’. to the address location following the one that was just
written.
6.1 SRAM/RTCC Registers
6.1.2 SRAM/RTCC REGISTER
The RTCC registers are located at addresses 0x00 to
SEQUENTIAL WRITE
0x1F, and the SRAM is located at addresses 0x20 to
0x5F. The SRAM can be accessed while the RTCC reg- The write control byte, address, and the first data byte
isters are being internally updated. The SRAM is not are transmitted to the MCP7940N in the same way as
initialized by a Power-On Reset (POR). in a byte write. But instead of generating a Stop condi-
tion, the host transmits additional data bytes. Upon
Neither the RTCC registers nor the SRAM can be
receipt of each byte, the MCP7940N responds with an
accessed when the device is operating off the backup
Acknowledge, during which the data is latched into
power supply.
memory and the Address Pointer is internally incre-
mented by one. As with the byte write operation, the
6.1.1 SRAM/RTCC REGISTER BYTE
host ends the command by generating a Stop condition
WRITE
(Figure 6-2).
Following the Start condition from the host, the control
There is no limit to the number of bytes that can be writ-
code and the R/W bit (which is a logic low) are clocked
ten in a single command. However, because the RTCC
onto the bus by the host transmitter. This indicates to
registers and SRAM are separate blocks, writing past
the addressed client receiver that the address byte will
the end of each block will cause the Address Pointer to
follow after it has generated an Acknowledge bit during
roll over to the beginning of the same block. Specifi-
the ninth clock cycle. Therefore, the next byte transmit-
cally, the Address Pointer will roll over from 0x1F to
ted by the host is the address and will be written into the
0x00, and from 0x5F to 0x20.
Address Pointer of the MCP7940N. After receiving
another Acknowledge bit from the MCP7940N, the host

FIGURE 6-1: SRAM/RTCC BYTE WRITE

S
Bus Activity T S
Control Address
Host A T
R Byte Byte Data O
T P
SDA Line S11 01111 0 0 P

A A A
Bus Activity C C C
K K K

FIGURE 6-2: SRAM/RTCC SEQUENTIAL WRITE

S
T S
Bus Activity A Control Address T
Host R Byte Byte Data Byte 0 Data Byte N O
T P
SDA Line S110 11110 0 P
A A A A
Bus Activity C C C C
K K K K

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MCP7940N
6.1.3 SRAM/RTCC REGISTER CURRENT address is sent, the host generates a Start condition
ADDRESS READ following the Acknowledge. This terminates the write
operation, but not before the internal Address Pointer is
The MCP7940N contains an address counter that
set. Then, the host issues the control byte again but
maintains the address of the last byte accessed, inter-
with the R/W bit set to a ‘1’. The MCP7940N will then
nally incremented by one. Therefore, if the previous
issue an Acknowledge and transmit the 8-bit data word.
read access was to address n (n is any legal address),
The host will not acknowledge the transfer but it does
the next current address read operation would access
generate a Stop condition which causes the
data from address n + 1.
MCP7940N to discontinue transmission (Figure 6-4).
Upon receipt of the control byte with R/W bit set to ‘1’, After a random Read command, the internal address
the MCP7940N issues an Acknowledge and transmits counter will point to the address location following the
the 8-bit data word. The host will not acknowledge the one that was just read.
transfer but does generate a Stop condition and the
MCP7940N discontinues transmission (Figure 6-3). 6.1.5 SRAM/RTCC REGISTER
SEQUENTIAL READ
FIGURE 6-3: SRAM/RTCC CURRENT Sequential reads are initiated in the same way as a
ADDRESS READ random read except that after the MCP7940N trans-
S mits the first data byte, the host issues an Acknowledge
T S
Bus Activity A Control Data T as opposed to the Stop condition used in a random
Host R Byte Byte O read. This Acknowledge directs the MCP7940N to
T P
transmit the next sequentially addressed 8-bit word
SDA Line S 1 1 0 1 1 1 1 1 P (Figure 6-5). Following the final byte transmitted to the
A N host, the host will NOT generate an Acknowledge but
Bus Activity C O
K
will generate a Stop condition. To provide sequential
A reads, the MCP7940N contains an internal Address
C
K Pointer which is incremented by one at the completion
of each operation. This Address Pointer allows the
6.1.4 SRAM/RTCC REGISTER RANDOM entire memory block to be serially read during one
READ operation.

Random read operations allow the host to access any Because the RTCC registers and SRAM are separate
memory location in a random manner. To perform this blocks, reading past the end of each block will cause
type of read operation, first the address must be set. the Address Pointer to roll over to the beginning of the
This is done by sending the address to the MCP7940N same block. Specifically, the Address Pointer will roll
as part of a write operation (R/W bit set to ‘0’). After the over from 0x1F to 0x00, and from 0x5F to 0x20.

FIGURE 6-4: SRAM/RTCC RANDOM READ


S S
Bus Activity T T S
Host A Control Address A Control Data T
R Byte Byte R Byte Byte O
T T P
SDA Line S1 1 0 1 1 1 1 0 S 1 1 0 1 1 1 1 1 P
A A A N
Bus Activity C C C O
K K K A
C
K

FIGURE 6-5: SRAM/RTCC SEQUENTIAL READ


CONTROL S
Bus Activity T
BYTE DATA n DATA n + 1 DATA n + 2 DATA n + X
Host O
P

SDA Line P
A A A A N
C C C C O
Bus Activity K K K K A
C
K

DS20005010J-page 36  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
8-Lead MSOP Example

XXXXXT 7940NI
YWWNNN 20113F

8-Lead PDIP (300 mil) Example

XXXXXXXX MCP7940N
T/XXXNNN I/P e313F
YYWW 2201

8-Lead SOIC (3.90 mm) Example

XXXXXXXT 7940NI
XXXXYYWW SN e3 2201
NNN 13F

8-Lead 2x3 TDFN Example

XXX AAV
YWW 201
NN 13

8-Lead TSSOP Example

XXXX 940N
TYWW I201
NNN 13F

 2011-2022 Microchip Technology Inc. and its subsidiares DS20005010J-page 37


MCP7940N

1st Line Marking Codes


Part Number
MSOP PDIP SOIC TDFN TSSOP
MCP7940N 7940NT MCP7940N 7940NT AAV 940N
Note 1: T = Temperature grade

Legend: XX...X Customer-specific information


Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
e3 JEDEC® designator for Matte Tin (Sn)
* This package is RoHs compliant. The JEDEC designator ( e3 )
can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

DS20005010J-page 38  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N

8-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

2X 0.20 H
D
D
2

A
D
N

E
2
E1
2

E1 E

2X
0.20 H

2X 4 TIPS
NOTE 1 1 2 0.25 C
e
B

TOP VIEW
A
8X
0.10 C
A A2
SEATING
PLANE
C
A1 8X b A
0.25 C A-B D

SIDE VIEW

H
SEE DETAIL B

VIEW A–A

Microchip Technology Drawing C04-111-MS Rev D Sheet 1 of 2

 2011-2022 Microchip Technology Inc. and its subsidiares DS20005010J-page 39


MCP7940N

8-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

4X ș1

R1
H

R
c

SEATING
PLANE
C L ș
(L1)
4X ș1

DETAIL B

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Terminals N 8
Pitch e 0.65 BSC
Overall Height A – – 1.10
Standoff A1 0.00 – 0.15
Molded Package Thickness A2 0.75 0.85 0.95
Overall Length D 3.00 BSC
Overall Width E 4.90 BSC
Molded Package Width E1 3.00 BSC
Terminal Width b 0.22 – 0.40
Terminal Thickness c 0.08 – 0.23
Terminal Length L 0.40 0.60 0.80
Footprint L1 0.95 REF
Lead Bend Radius R 0.07 – –
Lead Bend Radius R1 0.07 – –
Foot Angle ș 0° – 8°
Mold Draft Angle ș1 5° – 15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-111-MS Rev D Sheet 2 of 2

DS20005010J-page 40  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N

8-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

GX

SILK SCREEN

C G1

X
E

RECOMMENDED LAND PATTERN


Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 0.65 BSC
Contact Pad Spacing C 4.40
Contact Pad Width (X8) X 0.45
Contact Pad Length (X8) Y 1.45
Contact Pad to Contact Pad (X4) G1 2.95
Contact Pad to Contact Pad (X6) GX 0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-2111-MS Rev D

 2011-2022 Microchip Technology Inc. and its subsidiares DS20005010J-page 41


MCP7940N

8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D A
N B

E1

NOTE 1
1 2
TOP VIEW

C A A2

PLANE
L c
A1

e eB
8X b1
8X b
.010 C

SIDE VIEW END VIEW

Microchip Technology Drawing No. C04-018-P Rev E Sheet 1 of 2

DS20005010J-page 42  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N

8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

ALTERNATE LEAD DESIGN


(NOTE 5)

DATUM A DATUM A

b b
e e
2 2

e e

Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e .100 BSC
Top to Seating Plane A - - .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015 - -
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness c .008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width b .014 .018 .022
Overall Row Spacing § eB - - .430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
5. Lead design above seating plane may vary, based on assembly vendor.

Microchip Technology Drawing No. C04-018-P Rev E Sheet 2 of 2

 2011-2022 Microchip Technology Inc. and its subsidiares DS20005010J-page 43


MCP7940N

8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

2X
0.10 C A–B
D
A D
NOTE 5
N

E
2
E1
2

E1 E

2X
0.10 C A–B
2X
0.10 C A–B
NOTE 1 1 2

e NX b
B 0.25 C A–B D
NOTE 5
TOP VIEW
0.10 C

C A A2
SEATING
PLANE 8X
0.10 C
A1 SIDE VIEW

h
R0.13
h
R0.13
H 0.23

L
SEE VIEW C
(L1)
VIEW A–A

VIEW C
Microchip Technology Drawing No. C04-057-SN Rev F Sheet 1 of 2

DS20005010J-page 44  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N

8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 1.27 BSC
Overall Height A - - 1.75
Molded Package Thickness A2 1.25 - -
Standoff § A1 0.10 - 0.25
Overall Width E 6.00 BSC
Molded Package Width E1 3.90 BSC
Overall Length D 4.90 BSC
Chamfer (Optional) h 0.25 - 0.50
Foot Length L 0.40 - 1.27
Footprint L1 1.04 REF
Foot Angle 0° - 8°
Lead Thickness c 0.17 - 0.25
Lead Width b 0.31 - 0.51
Mold Draft Angle Top 5° - 15°
Mold Draft Angle Bottom 5° - 15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.

Microchip Technology Drawing No. C04-057-SN Rev F Sheet 2 of 2

 2011-2022 Microchip Technology Inc. and its subsidiares DS20005010J-page 45


MCP7940N

8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

SILK SCREEN

Y1

X1
E

RECOMMENDED LAND PATTERN

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 1.27 BSC
Contact Pad Spacing C 5.40
Contact Pad Width (X8) X1 0.60
Contact Pad Length (X8) Y1 1.55

Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-2057-SN Rev F

DS20005010J-page 46  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N

8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]
With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D A B
N

(DATUM A)
(DATUM B)
E
NOTE 1

2X
0.15 C
1 2
2X
0.15 C
TOP VIEW
0.10 C
(A3)
C A
SEATING
PLANE 8X
A1 0.08 C
SIDE VIEW
0.10 C A B
L D2
1 2

0.10 C A B

NOTE 1
E2

N
8X b
e 0.10 C A B
0.05 C
BOTTOM VIEW

 2011-2022 Microchip Technology Inc. and its subsidiares DS20005010J-page 47


MCP7940N

8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]
With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 0.50 BSC
Overall Height A 0.70 0.75 0.80
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Length D 2.00 BSC
Overall Width E 3.00 BSC
Exposed Pad Length D2 1.35 1.40 1.45
Exposed Pad Width E2 1.25 1.30 1.35
Contact Width b 0.20 0.25 0.30
Contact Length L 0.25 0.30 0.45
Contact-to-Exposed Pad K 0.20 - -
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing No. C04-129-MN Rev E Sheet 2 of 2

DS20005010J-page 48  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N

8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]
With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

X2
EV
8

ØV

C Y2 EV

Y1

1 2
SILK SCREEN
X1
E

RECOMMENDED LAND PATTERN

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 0.50 BSC
Optional Center Pad Width X2 1.60
Optional Center Pad Length Y2 1.50
Contact Pad Spacing C 2.90
Contact Pad Width (X8) X1 0.25
Contact Pad Length (X8) Y1 0.85
Thermal Via Diameter V 0.30
Thermal Via Pitch EV 1.00

Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process

Microchip Technology Drawing No. C04-129-MN Rev. B

 2011-2022 Microchip Technology Inc. and its subsidiares DS20005010J-page 49


MCP7940N

/HDG3ODVWLF7KLQ6KULQN6PDOO2XWOLQH 67 PP%RG\>76623@

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DS20005010J-page 50  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N

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1XPEHURI3LQV 1 
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0LFURFKLS7HFKQRORJ\'UDZLQJ&5HY&6KHHWRI

 2011-2022 Microchip Technology Inc. and its subsidiares DS20005010J-page 51


MCP7940N

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 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0
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 )RUEHVWVROGHULQJUHVXOWVWKHUPDOYLDVLIXVHGVKRXOGEHILOOHGRUWHQWHGWRDYRLGVROGHUORVVGXULQJ
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0LFURFKLS7HFKQRORJ\'UDZLQJ&5HY%

DS20005010J-page 52  2011-2022 Microchip Technology Inc. and its subsidiares


MCP7940N
APPENDIX A: REVISION HISTORY Old Bit Name New Bit Name
ALM1POL ALMPOL
Revision J (04/2022)
ALM0C<2:0> ALM0MSK<2:0>
Updated Data Sheet for MCP7940N I2C RTCC to
ALM1C<2:0> ALM1MSK<2:0>
include Automotive part numbers and other fixes;
Updated SOIC, TDFN and TSSOP package drawings;
Replaced terminology “Master” and “Slave” with “Host”
Revision E (01/2013)
and “Client” respectively. Revised Table 1-2: AC Characteristics; temperature
range
Revision H (10/2019)
Added notes regarding automotive grade availability;
Revision D (11/2012)
Corrected MSOP marking rotation; Updated package Added Extended Temp.
drawings SOIC and PDIP.
Revision C (12/2011)
Revision G (07/2018)
Added DC/AC Char. Charts.
Updated Section 5.5.1 “Square Wave Output Mode”.
Revision B (09/2011)
Revision F (03/2014)
• Added Figure 1-2
Updated overall content for improved clarity. Added • Added Parameter D15 to Table 1-1
detailed descriptions of registers. Updated block
• Added Section 3.3 “Oscillator Input/Output (X1,
diagram and application schematic.
X2)”, Section 3.4 “Multifunction Pin (MFP)”,
Defined names for all bits and registers, and renamed Section 3.5 “Backup Supply (VBAT)”
the bits shown in Table 7-1 for clarification. • Added Figure 5-1
Renamed the DC characteristics shown in Table 7-2 for • Updated Section 5.2.3 “Oscillator Failure Status”,
clarification. Section 5.2.4 “Crystal Specs”, Section 5.2.5
“Power-fail Time-stamp”.
TABLE 7-1: BIT NAME CHANGES
Old Bit Name New Bit Name Revision A (04/2011)
OSCON OSCRUN Original release of this document.
VBAT PWRFAIL
LP LPYR
SQWE SQWEN
ALM0 ALM0EN
ALM1 ALM1EN
RS0 SQWFS0
RS1 SQWFS1
RS2 CRSTRIM
CALIBRATION TRIMVAL<6:0>
ALM0POL ALMPOL

TABLE 7-2: DC CHARACTERISTIC NAME CHANGES


Old Name Old Symbol New Name New Symbol
Operating current SRAM ICC Read SRAM/RTCC register operating current ICCREAD
ICC Write ICCWRITE
Operating current IVCC Timekeeping current ICCT
IBAT Timekeeping backup current IBATT
Standby current ICCS VCC data retention current (oscillator off) ICCDAT

 2011-2022 Microchip Technology Inc. and its subsidiares DS20005010J-page 53


MCP7940N
THE MICROCHIP WEBSITE CUSTOMER SUPPORT
Microchip provides online support via our website at Users of Microchip products can receive assistance
www.microchip.com. This website is used as a means through several channels:
to make files and information easily available to • Distributor or Representative
customers. Accessible by using your favorite Internet
• Local Sales Office
browser, the website contains the following information:
• Field Application Engineer (FAE)
• Product Support – Data sheets and errata, appli-
• Technical Support
cation notes and sample programs, design
resources, user’s guides and hardware support Customers should contact their distributor, representa-
documents, latest software releases and archived tive or Field Application Engineer (FAE) for support.
software Local sales offices are also available to help custom-
• General Technical Support – Frequently Asked ers. A listing of sales offices and locations is included in
Questions (FAQ), technical support requests, the back of this document.
online discussion groups, Microchip consultant Technical support is available through the website
program member listing at: http://microchip.com/support
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of Micro-
chip sales offices, distributors and factory repre-
sentatives

CUSTOMER CHANGE NOTIFICATION


SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a spec-
ified product family or development tool of interest.
To register, access the Microchip website at
www.microchip.com. Under “Support”, click on “Cus-
tomer Change Notification” and follow the registra-
tion instructions.

DS20005010J-page 54  2011-2022 Microchip Technology Inc.and its subsidiaries


MCP7940N
PRODUCT IDENTIFICATION SYSTEM (NON-AUTOMOTIVE)
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Not every possible ordering
combination is listed below.
( 1)
[X] -X /XX
PART NO. Examples:
a) MCP7940N-E/MS: Extended Temperature,
Device Tape and Reel Temperature Package MSOP package.
Option Range
a) MCP7940NT-E/MS: Extended Temperature,
Device: MCP7940N = 1.8V - 5.5V I2C Serial RTCC MSOP package, Tape and Reel.
MCP7940NT= 1.8V - 5.5V I2C Serial RTCC b) MCP7940N-I/P: Industrial Temperature,
(Tape and Reel) PDIP package.
c) MCP7940N-I/SN: Industrial Temperature,
Tape and Reel Blank = Tube SOIC package.
Option( 1): T = Tape and Reel d) MCP7940NT-I/SN: Industrial Temperature,
SOIC package, Tape and Reel.
e) MCP7940NT-E/SN: Extended Temperature,
Temperature I = -40°C to +85°C (Industrial)
SOIC package, Tape and Reel.
Range: E = -40°C to +125°C (Extended)
f) MCP7940NT-E/SN: Extended Temperature,
SOIC package, Tape and Reel.
Package: MS = 8-Lead Plastic Micro Small Outline g) MCP7940NT-I/MNY: Industrial Temperature,
P = 8-Lead Plastic PDIP (300 mil body, I-temp TDFN package, Tape and Reel.
only)
h) MCP7940NT-I/ST: Industrial Temperature,
SN = 8-Lead Plastic Small Outline (3.90 mm body)
TSSOP package, Tape and Reel.
MNY(1) = 8-Lead Plastic Dual Flat, No Lead (I-temp
only)
Note 1: Tape and Reel identifier only appears in
ST = 8-Lead Plastic Thin Shrink Small Outline
the catalog part number description.
(4.4 mm body, I-temp only)
This identifier is used for ordering pur-
poses and is not printed on the device
package. Check with our Microchip
Sales Office for package availability with
the Tape and Reel option.
2: "Y" indicates a Nickel Palladium Gold
(NiPdAu) finish.

 2011-2022 Microchip Technology Inc. and its subsidiares DS20005010J-page 55


MCP7940N
PRODUCT IDENTIFICATION SYSTEM (AUTOMOTIVE)
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Not every possible ordering
combination is listed below.
( 1) ( 2, 3)
PART NO. [X] -X /XX XXX Examples:
a) MCP7940N-E/MSVAO: Automotive Grade,
Device
Tape and Reel Temperature Package Variant MSOP Package
Option Range b) MCP7940N-E/SNVAO: Automotive Grade,
Device: MCP7940N = 1.8V - 5.5V I2C Serial RTCC SOIC package
c) MCP7940NT-E/MSVAO: Automotive Grade,
MSOP Package, Tape and Reel
Tape and Reel Blank = Tube
Option( 1): T = Tape and Reel d) MCP7940NT-E/SNVAO: Automotive Grade,
SOIC package, Tape and Reel

Temperature I = -40°C to +85°C (AEC-Q100 Grade 3) Note 1: Tape and Reel identifier only appears
Range: E = -40°C to +125°C (AEC-Q100 Grade 1) in the catalog part number description.
This identifier is used for ordering
Package: MNY = 8-Lead Plastic Dual Flat, No Lead (I-temp purposes and is not printed on the
only) device package. Check with our
MS = 8-Lead Plastic Micro Small Outline Microchip Sales Office for package
SN = 8-Lead Plastic Small Outline (3.90 mm body) availability with the Tape and Reel
ST = 8-Lead Plastic Thin Shrink Small Outline option.
(4.4 mm body, I-temp only) 2: The VAO/VXX automotive variants
have been designed, manufactured,
tested and qualified in accordance with
Variant( 2, 3): VAO = Standard Automotive AEC-Q100 requirements for
automotive applications.
3: For customers requesting a PPAP, a
customer-specific part will be
generated and provided. A PPAP is not
provided for VAO part numbers.

DS20005010J-page 56  2011-2022 Microchip Technology Inc. and its subsidiares


Note the following details of the code protection feature on Microchip products:
• Microchip products meet the specifications contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.

• Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.

This publication and the information herein may be used only Trademarks
with Microchip products, including to design, test, and integrate The Microchip name and logo, the Microchip logo, Adaptec,
Microchip products with your application. Use of this informa- AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
tion in any other manner violates these terms. Information CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
regarding device applications is provided only for your conve-
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
nience and may be superseded by updates. It is your responsi- MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
bility to ensure that your application meets with your PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
specifications. Contact your local Microchip sales office for SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
additional support or, obtain additional support at https:// Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
www.microchip.com/en-us/support/design-help/client-support- Technology Incorporated in the U.S.A. and other countries.
services.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
MICROCHIP MAKES NO REPRESENTATIONS OR WAR- Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-
WRITTEN OR ORAL, STATUTORY OR OTHERWISE, Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
RELATED TO THE INFORMATION INCLUDING BUT NOT registered trademarks of Microchip Technology Incorporated in the
LIMITED TO ANY IMPLIED WARRANTIES OF NON- U.S.A.
INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
ITS CONDITION, QUALITY, OR PERFORMANCE. Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI- CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
RECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSE- EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
QUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
KIND WHATSOEVER RELATED TO THE INFORMATION OR Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
ARE FORESEEABLE. TO THE FULLEST EXTENT PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
FOR THE INFORMATION. of Microchip Technology Incorporated in the U.S.A. and other
countries.
Use of Microchip devices in life support and/or safety applica-
tions is entirely at the buyer's risk, and the buyer agrees to SQTP is a service mark of Microchip Technology Incorporated in
defend, indemnify and hold harmless Microchip from any and the U.S.A.
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
any Microchip intellectual property rights unless otherwise trademarks of Microchip Technology Inc. in other countries.
stated.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.

All other trademarks mentioned herein are property of their


respective companies.

© 2011-2022, Microchip Technology Incorporated and its subsidiar-


ies.

All Rights Reserved.


For information regarding Microchip’s Quality Management Systems,
ISBN: 978-1-5224-9834-6
please visit www.microchip.com/quality.

 2011-2022 Microchip Technology Inc. and its subsidiaries DS20005010J-page 57


Worldwide Sales and Service
AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
Corporate Office Australia - Sydney India - Bangalore Austria - Wels
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09/14/21

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