MCP7940N
MCP7940N
MCP7940N
Operating Ranges
• Two-Wire Serial Interface, I2C Compatible Note 1: Available in I-temp only.
- I2C clock rate up to 400 kHz
• Temperature Range:
- Industrial (I): -40°C to +85°C
- Extended (E): -40°C to +125°C
• Automotive AEC-Q100 Qualified
Packages
• 8-Lead MSOP, 8-Lead PDIP, 8-Lead SOIC,
8-Lead 2x3 TDFN and 8-Lead TSSOP
8
VCC
1 CX1
X1
32.768 KHZ
6
SCL
PIC® MCU MCP7940N
5 2 CX2
SDA X2
7 3
MFP VBAT
VBAT
VSS
4
VCC
Power Control Power-Fail
VSS
and Switchover Time-Stamp
VBAT
X2 Day of Week
Digital Trimming
Date
Year
Param.
Symbol Characteristic Minimum Typical Maximum Units Conditions
No.
— — 100 kHz 1.8V VCC < 2.5V
1 FCLK Clock Frequency
— — 400 kHz 2.5V VCC 5.5V
4000 — — ns 1.8V VCC < 2.5V
2 THIGH Clock High Time
600 — — ns 2.5V VCC 5.5V
4700 — — ns 1.8V VCC < 2.5V
3 TLOW Clock Low Time
1300 — — ns 2.5V VCC 5.5V
1.8V VCC < 2.5V
— — 1000 ns
(Note 1)
4 TR SDA and SCL Rise Time
2.5V VCC 5.5V
— — 300 ns
(Note 1)
1.8V VCC < 2.5V
— — 1000 ns
(Note 1)
5 TF SDA and SCL Fall Time
2.5V VCC 5.5V
— — 300 ns
(Note 1)
4000 — — ns 1.8V VCC < 2.5V
6 THD:STA Start Condition Hold Time
600 — — ns 2.5V VCC 5.5V
4700 — — ns 1.8V VCC < 2.5V
7 TSU:STA Start Condition Setup Time
600 — — ns 2.5V VCC 5.5V
8 THD:DAT Data Input Hold Time 0 — — ns Note 2
250 — — ns 1.8V VCC < 2.5V
9 TSU:DAT Data Input Setup Time
100 — — ns 2.5V VCC 5.5V
4000 — — ns 1.8V VCC < 2.5V
10 TSU:STO Stop Condition Setup Time
600 — — ns 2.5V VCC 5.5V
— — 3500 ns 1.8V VCC < 2.5V
11 TAA Output Valid From Clock
— — 900 ns 2.5V VCC 5.5V
Bus free time: Time the bus 4700 — — ns 1.8V VCC < 2.5V
12 TBUF must be free before a new
transmission can start 1300 — — ns 2.5V VCC 5.5V
SCL
7
3 8 9 10
SDA
6
In
13
11 12
SDA
Out
VCC
VTRIP(MAX)
VTRIP(MIN)
14 15
5.5
5.0
Ͳ40 TA = -40°C
4.5 25
TA = 25°C
85
IBATT Current (μA)
4.0 TA = 85°C
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.30 1.90 2.50 3.10 3.70 4.30 4.90 5.50
VBAT Voltage (V)
SDA
Acknowledge
Bit
SCL 1 2 3 4 5 6 7 8 9 1 2 3
Transmitter must release the SDA line at this point Receiver must release the SDA line at this point
allowing the Receiver to pull the SDA line low to so the Transmitter can continue sending data.
acknowledge the previous eight bits of data.
0x5F
0x60
0xFF
Bottom Layer
Copper Pour
(tied to ground)
X1
X1
CX1
CX1
X2 Oscillator GND
Crystal
CX2
GND
CX2
` X2
DEVICE PINS
DEVICE PINS
MCP7940N
Clock from X1
Ext. Source
X1
OSCRUN Bit
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Set Set
ALM0IF ALM1IF
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
MCP7940N
SQWFS<1:0>
Oscillator
X1 32.768 kHz
11
8.192 kHz
10
MUX
4.096 kHz
Postscaler
EXTOSC 01
X2 Digital 1 Hz
Trim 00 0
ST
64 Hz
1
CRSTRIM
ALM1EN,ALM0EN
ALMPOL
11 1 MFP
ALM1IF 1
10
MUX
0
0
01
OUT 00 SQWEN
ALM0IF 1
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
VCC
VTRIP
Power-Down Power-Up
Time-Stamp Time-Stamp
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is clear x = Bit is unknown
S
Bus Activity T S
Control Address
Host A T
R Byte Byte Data O
T P
SDA Line S11 01111 0 0 P
A A A
Bus Activity C C C
K K K
S
T S
Bus Activity A Control Address T
Host R Byte Byte Data Byte 0 Data Byte N O
T P
SDA Line S110 11110 0 P
A A A A
Bus Activity C C C C
K K K K
Random read operations allow the host to access any Because the RTCC registers and SRAM are separate
memory location in a random manner. To perform this blocks, reading past the end of each block will cause
type of read operation, first the address must be set. the Address Pointer to roll over to the beginning of the
This is done by sending the address to the MCP7940N same block. Specifically, the Address Pointer will roll
as part of a write operation (R/W bit set to ‘0’). After the over from 0x1F to 0x00, and from 0x5F to 0x20.
SDA Line P
A A A A N
C C C C O
Bus Activity K K K K A
C
K
XXXXXT 7940NI
YWWNNN 20113F
XXXXXXXX MCP7940N
T/XXXNNN I/P e313F
YYWW 2201
XXXXXXXT 7940NI
XXXXYYWW SN e3 2201
NNN 13F
XXX AAV
YWW 201
NN 13
XXXX 940N
TYWW I201
NNN 13F
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
8-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X 0.20 H
D
D
2
A
D
N
E
2
E1
2
E1 E
2X
0.20 H
2X 4 TIPS
NOTE 1 1 2 0.25 C
e
B
TOP VIEW
A
8X
0.10 C
A A2
SEATING
PLANE
C
A1 8X b A
0.25 C A-B D
SIDE VIEW
H
SEE DETAIL B
VIEW A–A
8-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
4X ș1
R1
H
R
c
SEATING
PLANE
C L ș
(L1)
4X ș1
DETAIL B
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Terminals N 8
Pitch e 0.65 BSC
Overall Height A – – 1.10
Standoff A1 0.00 – 0.15
Molded Package Thickness A2 0.75 0.85 0.95
Overall Length D 3.00 BSC
Overall Width E 4.90 BSC
Molded Package Width E1 3.00 BSC
Terminal Width b 0.22 – 0.40
Terminal Thickness c 0.08 – 0.23
Terminal Length L 0.40 0.60 0.80
Footprint L1 0.95 REF
Lead Bend Radius R 0.07 – –
Lead Bend Radius R1 0.07 – –
Foot Angle ș 0° – 8°
Mold Draft Angle ș1 5° – 15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
8-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
GX
SILK SCREEN
C G1
X
E
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D A
N B
E1
NOTE 1
1 2
TOP VIEW
C A A2
PLANE
L c
A1
e eB
8X b1
8X b
.010 C
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DATUM A DATUM A
b b
e e
2 2
e e
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e .100 BSC
Top to Seating Plane A - - .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015 - -
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness c .008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width b .014 .018 .022
Overall Row Spacing § eB - - .430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
5. Lead design above seating plane may vary, based on assembly vendor.
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A D
NOTE 5
N
E
2
E1
2
E1 E
2X
0.10 C A–B
2X
0.10 C A–B
NOTE 1 1 2
e NX b
B 0.25 C A–B D
NOTE 5
TOP VIEW
0.10 C
C A A2
SEATING
PLANE 8X
0.10 C
A1 SIDE VIEW
h
R0.13
h
R0.13
H 0.23
L
SEE VIEW C
(L1)
VIEW A–A
VIEW C
Microchip Technology Drawing No. C04-057-SN Rev F Sheet 1 of 2
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 1.27 BSC
Overall Height A - - 1.75
Molded Package Thickness A2 1.25 - -
Standoff § A1 0.10 - 0.25
Overall Width E 6.00 BSC
Molded Package Width E1 3.90 BSC
Overall Length D 4.90 BSC
Chamfer (Optional) h 0.25 - 0.50
Foot Length L 0.40 - 1.27
Footprint L1 1.04 REF
Foot Angle 0° - 8°
Lead Thickness c 0.17 - 0.25
Lead Width b 0.31 - 0.51
Mold Draft Angle Top 5° - 15°
Mold Draft Angle Bottom 5° - 15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
SILK SCREEN
Y1
X1
E
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 1.27 BSC
Contact Pad Spacing C 5.40
Contact Pad Width (X8) X1 0.60
Contact Pad Length (X8) Y1 1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]
With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D A B
N
(DATUM A)
(DATUM B)
E
NOTE 1
2X
0.15 C
1 2
2X
0.15 C
TOP VIEW
0.10 C
(A3)
C A
SEATING
PLANE 8X
A1 0.08 C
SIDE VIEW
0.10 C A B
L D2
1 2
0.10 C A B
NOTE 1
E2
N
8X b
e 0.10 C A B
0.05 C
BOTTOM VIEW
8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]
With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 0.50 BSC
Overall Height A 0.70 0.75 0.80
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Length D 2.00 BSC
Overall Width E 3.00 BSC
Exposed Pad Length D2 1.35 1.40 1.45
Exposed Pad Width E2 1.25 1.30 1.35
Contact Width b 0.20 0.25 0.30
Contact Length L 0.25 0.30 0.45
Contact-to-Exposed Pad K 0.20 - -
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]
With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
EV
8
ØV
C Y2 EV
Y1
1 2
SILK SCREEN
X1
E
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 0.50 BSC
Optional Center Pad Width X2 1.60
Optional Center Pad Length Y2 1.50
Contact Pad Spacing C 2.90
Contact Pad Width (X8) X1 0.25
Contact Pad Length (X8) Y1 0.85
Thermal Via Diameter V 0.30
Thermal Via Pitch EV 1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
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Temperature I = -40°C to +85°C (AEC-Q100 Grade 3) Note 1: Tape and Reel identifier only appears
Range: E = -40°C to +125°C (AEC-Q100 Grade 1) in the catalog part number description.
This identifier is used for ordering
Package: MNY = 8-Lead Plastic Dual Flat, No Lead (I-temp purposes and is not printed on the
only) device package. Check with our
MS = 8-Lead Plastic Micro Small Outline Microchip Sales Office for package
SN = 8-Lead Plastic Small Outline (3.90 mm body) availability with the Tape and Reel
ST = 8-Lead Plastic Thin Shrink Small Outline option.
(4.4 mm body, I-temp only) 2: The VAO/VXX automotive variants
have been designed, manufactured,
tested and qualified in accordance with
Variant( 2, 3): VAO = Standard Automotive AEC-Q100 requirements for
automotive applications.
3: For customers requesting a PPAP, a
customer-specific part will be
generated and provided. A PPAP is not
provided for VAO part numbers.
• Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
• Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
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This publication and the information herein may be used only Trademarks
with Microchip products, including to design, test, and integrate The Microchip name and logo, the Microchip logo, Adaptec,
Microchip products with your application. Use of this informa- AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
tion in any other manner violates these terms. Information CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
regarding device applications is provided only for your conve-
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
nience and may be superseded by updates. It is your responsi- MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
bility to ensure that your application meets with your PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
specifications. Contact your local Microchip sales office for SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
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services.
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MICROCHIP MAKES NO REPRESENTATIONS OR WAR- Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
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LIMITED TO ANY IMPLIED WARRANTIES OF NON- U.S.A.
INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
ITS CONDITION, QUALITY, OR PERFORMANCE. Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI- CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
RECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSE- EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
QUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
KIND WHATSOEVER RELATED TO THE INFORMATION OR Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
ARE FORESEEABLE. TO THE FULLEST EXTENT PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
FOR THE INFORMATION. of Microchip Technology Incorporated in the U.S.A. and other
countries.
Use of Microchip devices in life support and/or safety applica-
tions is entirely at the buyer's risk, and the buyer agrees to SQTP is a service mark of Microchip Technology Incorporated in
defend, indemnify and hold harmless Microchip from any and the U.S.A.
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
any Microchip intellectual property rights unless otherwise trademarks of Microchip Technology Inc. in other countries.
stated.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.