EE213 Topic00 Intro

EE213
Digital Integrated Circuits II
Topic 0: Introduction
Prof. Pingqiang Zhou

Associate Professor
ShanghaiTech University
School of Information Science and Technology
EE213 Topic0-Intro.1 ShanghaiTech University

Outline of Topic 0
 Course logistics
 Introduction to IC
• The history of IC
• The current trends in IC
• The future of IC
 The status of IC in China

Course Logistics
 Time: Mon./Wed., 1PM – 2:40PM
 Venue: SIST Rm 1D-107
 Instructor: Pingqiang Zhou (周平强)
[email protected]
Office Hour: TBD
 TAs: Wanzheng Weng (翁万正, wengwzh2022@)
Zi’ang Ge (葛梓昂, geza2022@)
Xin Xiong (熊欣, xiongxin2022@)
Office Hours: TBD
 We use Blackboard (互动教学平台)

Grading Information
 Homework/lab assignments 25%
 Midterm exam (week 8) 20%
• Closed-book, closed-notes
 Final exam (week 17?) 10%
• Open book/notes
 Project (4 weeks, 1 credit) 25%

 Literature review (week 9 -) 15%
- Review report (w/ >= 6 pages, double column)
- Presentation video
 Class participation 5%

Project Sample: A Simple CPU with SRAM

Project Sample: A Simple CPU with SRAM

Sample Topics for Literature Review
 AI for IC design
 AI chips
 Design for testability
 Design for manufacturing
 Emerging memories
 Emerging technologies, such as
• Quantum computing
• Superconducting computer
• Optical computing
• Neuromorphic computing
 2.5D/3D Integration

Academic Integrity

Course Spectrum: From Device to System
SYSTEM
MODULE
+
GATE
CIRCUIT
Vin Vout
DEVICE
G
S D
n+ n+

Example of IC Systems: An MIPS Processor

Course Topics (Tentative)
 Basic module (device to circuit), ~7 weeks
• Transistor and wires
• Inverter (delay, power, …)
• CMOS logic (combinational, sequential)
 Advanced module (system), ~5 weeks

• Data path (adder, multiplier, …)
• Memory (SRAM, DRAM, peripheral circuitry)
• Timing, clock/power distribution
 Selective module (the state-of-art), ~2 weeks

• From architecture to layout
• Low power design
• Technology variability (source, model, impact, …)

Class Materials
 UC Berkeley
• EE141: Digital Integrated Circuits
• EE241: Advanced Digital Integrated Circuits
 J. M. Rabaey, A. Chandrakasan, B. Nikolić, Digital
Integrated Circuits - A Design Perspective, 2nd ed., 2003.
 N. H. E. Weste and D. Harris, CMOS VLSI Design, 4th
ed., Addison Wesley, Reading, MA, 2011.
 J. Rabaey, Low Power Design Essentials, Springer 2009.

Class Materials - Other References
 VLSI Conferences
• International Solid-State Circuits Conference (ISSCC)
• Symposium on VLSI Circuits (VLSI)
• Custom Integrated Circuits Conference (CICC)
• Design Automation Conference (DAC)
 VLSI Journals
• IEEE Journal of Solid-State Circuits (JSSC)
• IEEE Trans. on VLSI Systems (TVLSI)
• IEEE Transactions on Circuits and Systems I/II

Tools, PDK and Models
 Tools
• HSPICE
• Schematic/layout tools (from Cadence/Synopsys)
 PDK
• NanGate open cell library http://www.nangate.com/?page_id=22
 Models
• Predictive sub-100nm models http://ptm.asu.edu/
• BSIM models http://bsim.berkeley.edu/models/

Course Goals
 This course aims to convey a knowledge of advanced
concepts of digital circuit and system design in state-of-art
MOS technologies
 Course goals
• Ability to design and implement CMOS digital circuits and optimize
them with respect to different constraints on PPA: performance
(speed), power and area (cost)
• Study the most significant challenges facing digital circuit designers in
the coming years and promising solutions
 Course prerequisites (optional)

• EE 113. Digital Integrated Circuits (CMOS devices and manufacturing
technology, logic gates and layout, delay, power, combinational circuit
design)
• EE 123. Microelectronic Devices (basic knowledge on CMOS device
operation)

EE113 vs. EE213
 EE113 (undergraduate level)
• Basic transistor and circuit models
• Basic circuit design styles
• First experiences with design – creating a solution given a set of
specifications
– At 90nm CMOS or even older
• Well defined design project
 EE213 (graduate level)

• Transistor model of varying accuracy
• Design under constraints: power, robust, reliability, …
• Learning more advanced techniques
– 45nm, 15nm, …
• Study the challenges facing designers in the coming years

Challenge Example – Low Power

Challenge Example – Variation
Layout 0.25µ 0.18µ
0.13µ 90-nm

Outline of Topic 0
 Course introduction
• What is IC?

被“卡脖子”的中国芯片

IPhone Generations (2007 - 2017)
EE213 Topic0-Intro.22 [Google Image] ShanghaiTech University

The Teardown of IPhone 3G (2008)

Making of a Chip
EE213 Topic0-Intro.24 [GlobalFoundaries] ShanghaiTech University

IC Products
 Processors
• CPU, DSP, Controllers
 Memory chips
• RAM, ROM, EEPROM
 System-on-chip (SoC)
 In smartphones
 Analog
• Mobile communication,
audio/video processing
 Embedded systems
• In cars, factories
• Network cards

IC vs. Semiconductor

Semiconductor
Osborne executive portable computer (1982) v.s iPhone (2007)
Weight 100x
Size 500x
Performance 1/100

A Snapshot of Future Computing Applications
 “Computing everywhere”
 Future systems
• Cloud computing Mobile Users
• Clients
• Embedded systems Sea of Sensors
• Ambient intelligence

Outline of Topic 0
• What is IC?

The Evolution of ICs
EE213 Topic0-Intro.30 [YouTube] ShanghaiTech University

Two Related Nobel Prizes (1956, 2000)
Early IC, 1958, TI
er/2000/kilby.html
http://www.nobel.se/physics/educational/post
Vacuum tube Modern IC
1947, bipolar
transistor, Bell

Function of a Transistor - Switch
EE213 Topic0-Intro.32 [Google Image] ShanghaiTech University

The Number of Transistors on IC Chips

Transistor Numbers in iPhone XS/Mate 20?
A12 Bionic
4-core GPU
6.9
Billions!
2 performance cores
8-core 4 performance cores

Neural Engine
A12 Bionic multicore chip

Moore’s Law – the Driving Force
Transistor count
Power
Frequency
EE213 Topic0-Intro.35 [Intel] ShanghaiTech University

Cost Incentive – What’s behind Moore’s Law
The compound annual reduction in processing cost of

one transistor is [14% - 22%] from 130nm to 14nm.
EE213 Topic0-Intro.36 [Intel, 2015] ShanghaiTech University
Outline of Topic 00
• What is IC?

IC Design Trends
speed/area speed
security
speed/power variation
speed/
area power
thermal
power low power ultra-low power variation
1970’s 1980’s 1990’s 2000’s 2010’s
[©Xie]
The International Technology Roadmap
for Semiconductors (ITRS)
Tech Num of Num Freq Vdd Power
Year Node Transistors Wire
Level (GHz) (V) (W)
(nm) (Billion)
2011 22 1.5 12 3.7 0.9 161

2013 18 3.1 13 4.0 0.85 149
2015 15 3.1 13 4.3 0.80 143
2017 13 6.2 14 4.7 0.75 130
2019 11 12.4 14 5.1 0.71 133
2021 9 12.4 15 5.7 0.66 130
2023 8 24.7 15 6.0 0.62 -

Tech. Node of Representative Foundries

#1: Thermal Issue
Sun’s
10000
Surface
…chips become too hot…
Rocket
1000
Power Density (W/cm2)
Nozzle
Nuclear
Reactor
100
8086 Hot Plate

10 4004 P6
8008 8085 386 Pentium®
286 486
1 8080
1970 1980 1990 2000 2010 Source: pconline

Year
EE213 Topic0-Intro.41 Source: Borkar, De Intel ShanghaiTech University

#2: Variations
Spatial variation
110
100
90
Temperature (C)
80
70
60
50
40
[©Xie]
On-Die temperature [©Mohanty]
Process variation
Temporal variation
Circuit aging effect

#3: 3D Integration
Detailed view Generalized view
Layer 5
Layer 4
Interlayer Via Layer 3

(TSVs)
Layer 2
Metal wires
of layer 1
[www.tourtx.cn]
Layer 1
Device on
layer 1 Bulk Substrate
3D chip
• Higher packing density, faster on-chip communication

 But higher power density -> hotter chip
Chiplets – 2.5D
Chiplet-based design
EE213 Topic0-Intro.44 https://en.wikichip.org/wiki/chiplet ShanghaiTech University

3D Carbon Nanotube Chips?
$61million !!!
The Electronics Max Shulaker Subhasish Mitra Philip Wong

MIT Stanford
Resurgence Initiative
EE213 Topic0-Intro.45 http://www.eri-summit.com/ ShanghaiTech University
#4: Security
Trojans
U
U D
D F
U
T
D: Design, F: Fabrication
T: Test, U: User

#5: AI Chips
AlphaGo vs. Lee Sedol
Source: googleblog.com

AI Chip – Google TPU
“Google一直坚信伟大的软件将在伟大的硬件的帮助下更加大放异彩，所以
Google便在想，我们可不可以做出一款专用机机器学习算法的专用芯片，TPU
便诞生了。”
[New York Times]

Google TPU

Big AI Placers

#6: Open Source RISC-V

Outline of Topic 0
• What is IC?
• The current trends of IC

CMOS Device Scaling Continues (ITRS)
But facing challenges and limiting!
90nm Node
2003 65nm Node
2005
45nm Node
2007
32nm Node
2009
22nm Node
50nm Length 2011
(IEDM2002) 16 nm node
30nm 25 nm
Prototype 2013
15nm
(IEDM2000) 20nm Prototype 11nm node
(VLSI2001) 2015
15nm Prototype 8 nm node
(IEDM2001) 2017
10nm Prototype 7nm
(DRC 2003)
5nm
3nm

FinFET and GAA
Watch Prof. Chenming Hu’s Recorded Talk at SWEDCS’2016

Gate Fin
Why FinFET and What Next?
http://swedcs2016.shanghaitech.edu.cn/register.html
EE213 Topic0-Intro.56 https://www.eet-china.com/news/40a11532.html ShanghaiTech University

Technology Strategy/Roadmap
T. C. Chen, Where Si-CMOS is going: Trendy Hype vs. Real Technology, ISSCC’06

Outline of Topic 0
• What is IC?

IC Design/Fabrication/Test/Assembly Flow
EE213 Topic0-Intro.59 [Ozgur, NYU] ShanghaiTech University

Example of Globalized IC Value Chain
 Design – Europe, India and China
 Fabrication – Taiwan/South Korea
 Test, package – Taiwan/China Mainland
 Assembly – China Mainland
EE213 Topic0-Intro.60 [Digitimes and the Economist] ShanghaiTech University

Global/China’s IC Industry
EE213 Topic0-Intro.61
[Shaojun Wei, DAC 2017] ShanghaiTech University
Values of ICs Consumed in China
 Largest consumer in the world

Electronic Device Production in China
Large portions are “Made in China”
EE213 Topic0-Intro.63 [Shaojun Wei, DAC 2017] ShanghaiTech University

Few IC Products from Indigenous Suppliers

2021: $432.6 Billion!
 Since 2013, China’s import of ICs > $200 billion.

Top Semiconductor Players

Future IC in China
《中国制造 2025》提出：2020年中国芯片自给率要达到40%，
2025年要达到70%，但目前国内的自给率仍为10%左右，
因此接下来几年中国半导体将迎来跨越式大发展。
Investment Funds in China

“中国IC设计现在不缺市场、不缺资本、最缺的是人才”

“中美之争，其实是人才之争”
 我国芯片自给率目前不到30%，尤其是高端芯片方面，对外依赖严重，
而“缺芯”的一个重要原因，就是缺乏芯片的设计和制造人才。
 《中国集成电路产业人才白皮书（2019—2020年版）》指出，我国集
成电路人才在供给总量上仍显不足，到2022年，芯片专业人才缺口仍
将近25万。
 2020年，华为创始人任正非造访东南大学、南京大学等高校时表示：“
点燃未来灯塔的责任无疑是要落在高校上，而高校就是为社会输出人才
的地方，中国芯片的崛起必然需要人才的努力。”
 2020年7月30日，国务院学位委员会会议投票通过提案：集成电路专业
成为一级学科，从电子科学与技术一级学科中独立出来，将为我国培养
更多的芯片人才。
 目前在芯片相关人才学历方面，本科生占比73.76%，硕士及以上学历
仅占6.53%。
Major Institutions Conducting IC Research in China

National Lab/IC Industry around ShanghaiTech
张江集成电上海超级张江人工
路产业区计算中心智能岛
上海中医药大学复旦张江校区张江药谷
上海同
步交大张江校区新药研发张江中区
辐射光国家蛋白质平台文创空间
中科院微小卫星
源科学中心· 张江中区
创新研究院众创空间
上海中科路站
中国科学院
上海高等研究院上海市三大先导产业
（张江实验室）
人工智能
集成电路
生物医药

IC Industry around ShanghaiTech
 上海集成电路从业人员占全国40%，人才缺口超过10万。
华为
 上海电子/集成电路一级博士点不足10个，人才供应严重不足。海思
集成电路设计产业园（紫光集团、
阿里巴巴、威尔股份、兆易创新等
复旦）
微电子上海韦
凯世通中芯国尔上海微电
际子装备
技创兆芯
紫光
集成电路企业
博通 600余家
展锐
科华大
新大疆华虹宏力
日月光
从业人数 20万人
产值 1450亿上海
合性国家中
高通盛美、华力
人工智能岛
海科美光（上海平头哥）
综学超威
张江
江中
上海科技大学
AMD
上实验室张江实验室心
张心
15公里
1. 集成电路产业最集中
2. 综合技术水平最高
3. 产业链最完整
华力二期

Clean Room@ShanghaiTech
1500m2 下一代量子器件加工平台
梯队完备的科研工程团队

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EE213

Digital Integrated Circuits II

Prof. Pingqiang Zhou

EE213 Topic0-Intro.1 ShanghaiTech University

 The status of IC in China

EE213 Topic0-Intro.2 ShanghaiTech University

 We use Blackboard (互动教学平台)

EE213 Topic0-Intro.3 ShanghaiTech University

 Project (4 weeks, 1 credit) 25%

EE213 Topic0-Intro.4 ShanghaiTech University

EE213 Topic0-Intro.5 ShanghaiTech University

EE213 Topic0-Intro.6 ShanghaiTech University

EE213 Topic0-Intro.7 ShanghaiTech University

EE213 Topic0-Intro.9 ShanghaiTech University

EE213 Topic0-Intro.10 ShanghaiTech University

EE213 Topic0-Intro.11 ShanghaiTech University

 Advanced module (system), ~5 weeks

 Selective module (the state-of-art), ~2 weeks

EE213 Topic0-Intro.12 ShanghaiTech University

EE213 Topic0-Intro.13 ShanghaiTech University

EE213 Topic0-Intro.14 ShanghaiTech University

EE213 Topic0-Intro.15 ShanghaiTech University

 Course prerequisites (optional)

EE213 Topic0-Intro.16 ShanghaiTech University

 EE213 (graduate level)

EE213 Topic0-Intro.17 ShanghaiTech University

EE213 Topic0-Intro.18 ShanghaiTech University

Layout 0.25µ 0.18µ

EE213 Topic0-Intro.19 ShanghaiTech University

 The status of IC in China

EE213 Topic0-Intro.20 ShanghaiTech University

EE213 Topic0-Intro.21 ShanghaiTech University

EE213 Topic0-Intro.22 [Google Image] ShanghaiTech University

EE213 Topic0-Intro.23 ShanghaiTech University

EE213 Topic0-Intro.24 [GlobalFoundaries] ShanghaiTech University

EE213 Topic0-Intro.25 ShanghaiTech University

EE213 Topic0-Intro.26 ShanghaiTech University

Osborne executive portable computer (1982) v.s iPhone (2007)

EE213 Topic0-Intro.27 ShanghaiTech University

EE213 Topic0-Intro.28 ShanghaiTech University

 The status of IC in China

EE213 Topic0-Intro.29 ShanghaiTech University

EE213 Topic0-Intro.30 [YouTube] ShanghaiTech University

Early IC, 1958, TI

EE213 Topic0-Intro.31 ShanghaiTech University

EE213 Topic0-Intro.32 [Google Image] ShanghaiTech University

EE213 Topic0-Intro.33 ShanghaiTech University

8-core 4 performance cores

A12 Bionic multicore chip

EE213 Topic0-Intro.35 [Intel] ShanghaiTech University

The compound annual reduction in processing cost of

 The status of IC in China

EE213 Topic0-Intro.37 ShanghaiTech University

1970’s 1980’s 1990’s 2000’s 2010’s

2011 22 1.5 12 3.7 0.9 161

EE213 Topic0-Intro.39 ShanghaiTech University

EE213 Topic0-Intro.40 ShanghaiTech University

8086 Hot Plate

1970 1980 1990 2000 2010 Source: pconline