electronics

Review
A Comparative Reliability Study of Three
Fundamental Multilevel Inverters Using Two
Different Approaches
Omid Alavi *, Abbas Hooshmand Viki and Sadegh Shamlou
Department of Electrical Engineering, K.N. Toosi University of Technology, P.O. Box 16315-1355 Tehran, Iran;
[email protected] (A.H.V.); [email protected] (S.S.)
* Correspondence: [email protected]; Tel.: +98-930-167-7913

Academic Editor: Mostafa Bassiouni

Received: 9 December 2015; Accepted: 11 April 2016; Published: 15 April 2016

Abstract: The reliability of power electronic devices and components is very important to
manufacturers. In recent years, many researchers have conducted reliability assessments of power
electronic devices, yet the reliability of numerous circuits used widely has not been evaluated.
This paper presents a comprehensive reliability evaluation of fundamental multilevel inverters.
The reliability of the multilevel inverters is analyzed by calculating the mean time to failure for each
component. The calculation was performed by two methods (approximate and exact) to achieve better
comparisons. The approximate method is similar to the parts count method used in MIL-HDBK-217
reliability standard, and the exact method exhibits the parts stress method. In the exact method, due
to the direct relationship between component failure and temperature, we used Matlab Simulink to
determine power losses in diodes and switches taking into account the temperature factor. The results
determined by the approximate method showed that the three-level cascade H-bridge was the most
reliable of the inverters considered. Although the exact method validates those results, and shows
that cascade H-bridge (CHB) had a longer lifespan, but the calculated values are different. Therefore,
using different approaches for evaluating reliability results in different outcomes.

Keywords: power electronics; reliability; multilevel inverters; failure rate; mean time to
failure; redundancy

1. Introduction
In the recent years, reduction of fossil fuel resources has drawn much attention to the importance
of renewable energies. The use of renewable sources such as solar panels and wind turbines requires
extensive use of power electronic devices and the popularity of renewable energies, particularly wind
and solar energy is growing by the day. Photovoltaic systems are considered one of the best renewable
energy sources both on small and large scales [1]. The first solar cells were made in 1883 [2] and, today,
photovoltaic sources are used in different sectors, such as battery chargers, water pumps, household
electricity generation, satellites, etc. [3]. One of the main challenges facing the use of renewable energies
is the ever changing level of generated power. Of course, the power quality is also one of the main
concerns in this regard, which becomes more important with the significant increase in the number of
electronic devices [4].
Solar panels generate a DC voltage, so using solar energy requires an inverter to convert the
DC voltage to AC. Today, industry needs equipment with higher power, so direct connection of AC
voltage generated by renewable source to the grid with medium voltage level is essential. Therefore,
multilevel inverters have been introduced to work with higher voltages and also to improve the output
voltage [5].

Electronics 2016, 5, 18; doi:10.3390/electronics5020018 www.mdpi.com/journal/electronics

Electronics 2016, 5, 18 2 of 18
Electronics 2016, 5, 18 2 of 18

multilevel inverters have been introduced to work with higher voltages and also to improve the
output voltage
There [5].
are different topologies and control methods for multilevel inverters. In general, multilevel
inverters can be different
There are topologies
divided into and control
two categories: methods
fundamental andfor multilevel
modern. Thereinverters. In general,
are three fundamental
multilevel
topologies inverters can be
for multilevel divided[5–9]:
inverters into two categories: fundamental and modern. There are three
fundamental topologies for multilevel inverters [5–9]:
‚ diode-clamped or neutral-clamped (NPC)
• diode-clamped or neutral-clamped (NPC)
‚ capacitor-clamped or flying capacitor (FC)
• capacitor-clamped or flying capacitor (FC)
cascade H-bridge
•‚ cascade H-bridge (CHB)
(CHB)

The NPC
The NPC inverter
inverter was
was introduced
introduced in in the
the 1990s,
1990s, and
and itit has
has been
been widely
widely used
used in in FACTS
FACTS (flexible
(flexible
alternating current transmission system) and industrial drives. The FC inverter
alternating current transmission system) and industrial drives. The FC inverter with a three-phase with a three-phase
topology was
topology was presented
presented forfor the
the first
first time
time in in the
the early
early 1980s.
1980s. The The clamping
clamping capacitors
capacitors provide
provide the
the
smooth switching frequency ripple voltage, but their capacity is small. However,
smooth switching frequency ripple voltage, but their capacity is small. However, increasing the increasing the
number of
number of voltage
voltage levels
levels leads
leads to to some
some problematic
problematic issues:
issues: namely,
namely, thermal,
thermal, low-inductance,
low-inductance, and and
insulation designing.
insulation designing. CHB
CHB multilevel
multilevel inverters
inverters havehave been
been used
used in in various
various practical
practical applications
applications such
such
as broadcasting
as broadcasting amplifiers,
amplifiers, industrial
industrial drives,
drives, and and STATCOMs
STATCOMs (static (static synchronous
synchronous compensators).
compensators).
The primary
The primary disadvantage
disadvantage of of this
this inverter
inverter is is the
the presence
presence of of an
an individual
individual power
power supply
supply for
for each
each
H-bridge cell [10]. In this paper, we used these three mentioned inverters though
H-bridge cell [10]. In this paper, we used these three mentioned inverters though the three-level the three-level
scheme, and
scheme, and the
the circuit
circuit diagram
diagram of of one
one leg
leg ofof these
these inverters
inverters is is shown
shown in in Figure
Figure 1.
1.

Figure
Figure 1.
1. Circuit
Circuit diagrams
diagrams of three-level/phase:
three-level/phase:(a)
(a)neutral
neutralpoint
pointclamped
clamped(NPC);
(NPC);(b)
(b)flying
flying capacitor
capacitor
(FC);
(FC); and
and (c) cascade H-bridge (CHB).

Although
Although the fundamental
fundamentalinverters
invertershavehave found
found a great
a great application
application in different
in different industries,
industries, there
there are many
are many things
things still still unknown
unknown about
about these
these topologies,
topologies, becauseimprovements
because improvementsofofother
other types of
of
converters
converters remain
remain unresolved.
unresolved.InInthe therecent
recentdecades,
decades, some
somenewnewtopologies
topologieshave been
have proposed
been proposed to
improve
to improvethethe
performance,
performance, increase
increasereliability and
reliability andreduce
reducethethenumber
numberof of circuit
circuit elements.
elements. Using
Using
Electronics 2016, 5, 18 3 of 18

mixed-level hybrid multilevel cells by replacing H-bridge with diode-clamped and capacitor-clamped
gives much better results, and can generate the appropriate number of levels by reducing the
number of independent DC sources [5]. Soft-switched inverters are another type of modern inverter.
The purpose of the soft-switched inverters is to reduce switching losses and increase converter
efficiency. Implementing the soft switching system in the cascade inverter is not different from
the conventional two-level inverter structure because each inverter cell is a two-level circuit [5].
However, implementing soft switching circuit for diode-clamped and capacitor-clamped structures
will be different [11–13].
Many of the proposed topologies have been introduced to merely reduce the number of
independent voltage sources and switches. In Reference [14], instead of using two 6-switch inverters for
feeding two engines, a 5-leg 10-switch inverter is used for simultaneous feeding of two engines, which
means that two switches have been removed from the design. Kominami and Fujimoto introduced
a novel 3-leg 9-switch inverter for simultaneous and independent feeding of two three-phase loads,
which means using one switch lesser than the previous topology [15]. Generally, reducing the
number of switches and elements in power electronic circuits increases the reliability of the inverter.
As previously mentioned, the solar cells are also used for providing electrical power for satellites.
In Reference [2], 6 Photovoltaic (PV) modules installed on an orbital satellite were studied to estimate
the most efficient way of receiving power. In a satellite feed system, lifetime of the inverter and PV
module is one of the most important issues. Higher inverter reliability means higher operational
lifespan. Of course, most PV module manufacturers guarantee 25 years lifespan ending up with around
25% initial efficiency [16]. Therefore, it is necessary to pay more attention to the issue of inverter reliability
(especially for multilevel inverters which are considered as the new generation of inverters).
This paper presents a comprehensive review on the principle of reliability and assessment of
multilevel inverter in terms of reliability. Two approximate and exact method are used to determine
reliability of multilevel inverters. The approximate method is based on the parts count method and
summing the reference failure rates for each component. The exact method exhibits a parts stress
method used to evaluate the reliability of inverters. In this paper, for the first time, reliability of
fundamental multilevel inverters is determined using an exact method and considering all conditions.
The remainder of this paper is organized as follows: Section 2 introduces the fundamental
principle of reliability and different approaches. Section 3 proposes the approximate and exact method
to assess the reliability, and in Section 4, a comprehensive reliability evaluation is presented using
two approaches for three multilevel inverters of CHB, FC, and NPC. Moreover, the effect of series
redundancy is shown in this section. Finally, Section 5 presents the conclusions.

2. Fundamental Principle of Reliability

Extracting the highest possible efficiency from each device has always been the goal of
manufacturers. In power converters, this optimal utilization includes high output quality, longer
lifespan, less energy consumption, etc. In fact, having a converter with longer lifespan means having a
converter with more reliability. Reliability shows the probability of system failure at a given time [17].
The reliability of a system depends on different factors; therefore, to assess that system, it must be
divided into smaller parts and reliability of each part then must be investigated. The reliability is
usually assessed from various aspects. To determine the reliability of a system, researchers often
use indices such as failure rate, mean time to failure (MTTF) and mean time to repair (MTTR) and
Availability [18]. Therefore to determine the reliability of a system, first it is necessary to define the
basic concepts.

2.1. Reliability
Reliability is defined as "the ability of an item to perform the requested function under the
stated conditions over a specified time period" and is often measured as failure probability or failure
frequency [19]. Most systems include three categories of reliability. These three categories include [20]:
Electronics 2016, 5, 18 4 of 18

‚ Software reliability
‚ Electronics 2016,
Hardware 5, 18
reliability 4 of 18

‚ Human
• reliability
Software reliability
• Hardware reliability
In studies covering the concept of reliability, the reliability of a system is usually considered
• Human reliability
independent from time, which for industrial products should be in the warranty period [18]. Failure
over timeIn studies
can covering
be shown the concept
in three of reliability,
different the reliability
time periods. The first of a system
period is learning
is the usually considered
phase, where
independent from time, which for industrial products should be in the warranty period [18]. Failure
work failure decreases with the passage of time. Length of this period can vary from several minutes to
over time can be shown in three different time periods. The first period is the learning phase, where
several hours. The second period is the failure consolidation phase which shows that after the learning
work failure decreases with the passage of time. Length of this period can vary from several minutes
phase,tofailure
severaldoes notThe
hours. change by period
second the passage
is the of time;consolidation
failure length of thisphase
period is random.
which The after
shows that thirdthe
period,
is thelearning
fatigue phase,
phase,failure
where does not change by the passage of time; length of this period is random. Thethese
the failure rate increases with the increase of time. By combining
three third
periods overisa the
period, single timephase,
fatigue period, combined
where failure
the failure rategraph can be
increases obtained
with [20]. of time. By
the increase
This combined
combining thesegraph can be shown
three periods in thetime
over a single formperiod,
of hazard function,
combined in graph
failure whichcancasebeitobtained
is called the
[20].curve graph (Figure 2). Similar to combined graph, this graph consists of three parts [21]:
bathtub
This combined graph can be shown in the form of hazard function, in which case it is called the
1. bathtub
The curve
early graph
failure or (Figure
burn-in2).period,
Similarwhere
to combined graph,function
the hazard this graph consists ofwith
decreases threetime.
parts [21]:
2. The
1. random
The earlyfailure
failure or useful life
or burn-in period,
period, where
where the hazard
the hazard function
function is constant.
decreases with time.
3. The
2. wear-out
The random period,
failurewhere thelife
or useful hazard function
period, increases.
where the hazard function is constant.
3. The wear-out period, where the hazard function increases.

Figure2.2.The
Figure Theclassical
classical bathtub
bathtubcurve.
curve.

In recent decades, many definitions have been proposed for the reliability concept. For instance,
In recent decades, many definitions have been proposed for the reliability concept. For instance,
The Oxford dictionary defines reliability as “the quality of being reliable, that may be relied upon; in
The Oxford dictionary defines reliability as “the quality of being reliable, that may be relied upon; in
which reliance or confidence may be put; trustworthy, safe, sure” [22]. In 1987, Hammersley
whichpresented
reliance or confidence
another may of
definition be reliability:
put; trustworthy, safe,issure”
“Reliability [22]. In 1987,
the agreement Hammersley
between two effortspresented
to
another definition
measure of reliability:
the same trait through“Reliability
maximallyissimilar
the agreement
methods”between two
[23]. There is efforts
a lack oftocomprehensive
measure the same
trait through
study inmaximally
the literature similar
on themethods”
reliability[23]. There electronic
of power is a lack ofconverters.
comprehensive study in[18,24],
In References the literature
an
on theoverall
reliability of power
assessment on electronic converters.
power electronic system In reliability
References [18,24],
has an overall In
been conducted. assessment
Reference on power
[25],
authors
electronic have reliability
system used condition monitoring
has been in orderIntoReference
conducted. estimate reliability.
[25], authorsIn Reference
have used [26], the
condition
evaluation
monitoring of reliability
in order to estimate for reliability.
a DC-DC In Boost converter
Reference [26],has
thebeen conducted
evaluation with a reliability
of reliability for a DC-DC
improvement approach. The reliability evaluation of modular multilevel converters
Boost converter has been conducted with a reliability improvement approach. The reliability evaluation (MMCs) as a
very important topology must be noted. Rashidi-Rad et al. presented a reliability evaluation of
of modular multilevel converters (MMCs) as a very important topology must be noted. Rashidi-Rad et al.
modular multilevel inverters with half and full-bridge cells based on two different methods [27].
presented a reliability evaluation of modular multilevel inverters with half and full-bridge cells based on
Their research showed that the modular inverters which utilized half-bridge cells performed better
two different
in terms methods [27].inTheir
of reliability, research
comparison showed
to the that the
full-bridge modular
modular inverters which utilized half-bridge
inverters.
cells performed
Nevertheless, reliability evaluations and finding ways to improve themmodular
better in terms of reliability, in comparison to the full-bridge inverters.
are important. For this
Nevertheless,
reason, there are reliability evaluations and
different experimental andpractical
finding examples
ways to improve them are
on the reliability important.
of power For this
electronic
reason, there are different
applications. Anurag etexperimental
al. analyzed the andeffect
practical examples
of reactive poweron injections
the reliability of power
by inverters electronic
used in
photovoltaic
applications. applications
Anurag et al. on their thermal
analyzed operation
the effect and component
of reactive reliability by
power injections [28].inverters
The authorsused in
suggestedapplications
photovoltaic that regulations should
on their be made
thermal by settingand
operation a limit on reactive
component power injections
reliability [28]. The by authors
PV
inverters. Isidori et al. investigated the reliability of a three-level back-to-back
suggested that regulations should be made by setting a limit on reactive power injections by PV converter for a 10 MW
wind turbine based on the semiconductors thermal behavior [29]. It was concluded that 60°
inverters. Isidori et al. investigated the reliability of a three-level back-to-back converter for a
10 MW wind turbine based on the semiconductors thermal behavior [29]. It was concluded that 60˝
Electronics 2016, 5, 18 5 of 18

discontinuous pulse width modulation shows more appropriate thermal performance. Additionally,
some experimental researches have been conducted for the reliability of components extensively used
in power electronic devices. For instance, a detailed study of the reliability of DC-link capacitors is
presented in Reference [30].
Considering the wide use of semiconductor devices in power electronics, assessing their reliability
is essential and imperative [31,32]. For example, the reliability of IGBTs has been assessed and soldering
condition has been identified as an important factor in the reliability of the IGBT module.

2.2. Failure
Failure occurs when the system stops to perform the requested function, for any reason. So,
failure-free operation time is generally a random variable, which can be long or short. Failure can be
divided into two categories: sudden and gradual. The sudden failure is considered as cataleptic failure
and gradual failure is considered as degradation failure [33].

2.3. Failure rate

Failure rate has an important role in determination of system reliability. The failure rate function
can determine the probability of failure over a specified time period. It can be defined as the failure
probability per time unit in the period of [t, t+∆t], when there has been no failure before t. Failure rate
can be obtained as follows [34]:
P pt ď T ď t ` ∆t |T ą tq P pt ď T ď t ` ∆tq
Failure rate “ “ (1)
∆t ∆t.PpT ą tq
where P(t ď T ď t + ∆t) is the failure probability of T in the time period of [t,t+∆t]. This probability can
be linked with CDF(f(t)) and PDF(f(t)) of the failure density function [34]:

P pt ď T ď t ` ∆tq “ f ptq ∆t “ F pt ` ∆tq ´ F ptq (2)

If we show the failure probability by failure distribution, the probability of failure non-occurrence
over a specified time period is obtained by the reliability probability distribution which is the difference
between the sum of all probabilities (equal to 1) and the failure probability. Therefore, we can obtain
the reliability function of the constant hazard section by the following equation [35]:

R ptq “ 1 ´ F ptq (3)

In fact, this function is the P(T > t) function. Thus, the system reliability can be obtained directly
from the failure density function. The evaluation of reliability is only possible by knowing the reliability
of components. Reliability of components is generally obtained by two failure distribution functions:
Exponential and Weibull [34,35].
∆t value is usually very small and close to zero. Thus, by assigning a small value to ∆t in the
previous failure rate equation, we obtain the failure rate function equation [36]:
F pt ` ∆tq ´ F ptq
z ptq “ lim “ f ptq {R ptq (4)
∆tÑ0 ∆t.R ptq
Failure rate is also shown by λ. Using the Exponential distribution, the probability distribution
function is obtained as a combination of failure rates:

f pt, λq “ λe´λt (5)

The reliability function is as follows [35]:

R pt, λq “ e´λt (6)

It should be noted that Equation (6) is true for the hazard fixed period. The failure rate estimated
by the average number of failures per unit time is expressed in the form of failure in time (FIT) [18]:
Electronics 2016, 5, 18 6 of 18

1 FIT “ 10´9 failure{hour (7)

Generally, using bathtub graph for modeling the failure rate function is a great tool for assessing
the reliability of the system. In recent years, there have been many studies covering subject of failure
rate function. In Reference [37], 17 different functions have been introduced to present the bathtub
shape which has made this article a good reference for failure rate function models. Carrascoa et al. [38],
have proposed a modified four-parameter Weibull distribution function for modeling the bathtub
graph. The advantage of this distribution function is its ability to perform monotone modeling as well
as non-monotone modeling. In Reference [39], the generalized two-parameter Weibull distribution
function has been presented, and the authors have stated that proper results can be achieved by
selecting the appropriate parameter values for the proposed distribution function. In Reference [40],
also similar to other mentioned articles, a generalized three-parameter distribution function has
been used to obtain the failure rate function; the results of that article showed that the introduced
distribution function is more flexible than some other proposed functions.

2.4. Mean Time to Failure

Mean time to failure (MTTF) is the average time before the first failure of a component or device
after it starts to work. This failure is such that the device is no longer able to continue its normal
functions. MTTF is usually estimated in hours or thousand hours and is often listed among the parts
specifications. When MTTF of a device is reported as one hundred thousand hours, it means that the
first failure disrupting the device functioning is expected to occurs after this time period. Here, two
important points should be mentioned.
1. This time is only a guarantee. There is no guarantee that the device will not fail after a few
hours of work or that it will definitely fail after one hundred thousand hours and will not work much
longer than that.
2. This time is the actual time that device functions. For example, one hundred thousand hours
is equal to about 11 years and 5 months. However, if device is used 8 h a day, this period becomes
actually 3 times longer, about 34 years, because device has not been operating 24 h a day.
MTTF is expressed by reliability function, and is as below:
ż `8
MTTF “ R ptq dt (8)
0

where reliability function must be obtained by e´λt . Thus, the more simplified form of MTTF is as
follows [18,34–36]:
MTTF “ 1{λ (9)

As seen from Equation (8), the value of MTTF has a direct relationship with the reliability
function, so MTTF value changes with different assumptions for reliability function. For example, in
Reference [40], reliability function, which is expressed in terms of generalized Weibull function, is in a
different form. Several studies have been conducted on MTTF concept. Heidelberger et al. presented a
good numerical method to calculate the MTTF in a Markovian model [41].
MTTF is an incomplete statistical parameter, and it is one of the main limitations of MTTF, so that
it does not properly show the failure behavior, especially when failure mechanism has not a constant
failure rate [42]. In Reference [43], nTTF (the time to failure of n% of the population) have been studied.
nTTF reports on failure rate are more accurate than MTTF, but it is more difficult to use because it
requires the distribution of failure times [43].

2.5. Mean Time to Repair

MTTR is the average time spent to repair a failed device and its value is dependent on maintenance
conditions [17]. If we assume the time required to repair System x has a gamma distribution with
parameters µ and β, then MTTR can be obtained by [44]:
Electronics 2016, 5, 18 7 of 18

ż `8
β
MTTR “ xN pxq dx “ (10)
0 µ
where N(x) is the gamma distribution function. By assigning 1 to β, gamma distribution becomes
equivalent to exponential distribution, therefore summarized MTTR value can be shown by 1/µ. MTTR
is very difficult to calculate and it is usually determined empirically by studying the previous repairs [45].

2.6. Mean Time between Failures

Mean time between failures (MTBF) is one of the most important quantitative parameters that
can help us achieve preventive maintenance as well as reliability. MTBF is the average time between
two successive failures. In some cases, none of the MTBF definitions can properly describe the system
reliability; for example, when the distribution function is not exponential, it is practically impossible
for MTBF to predict the time to failure [46]; but in systems with random failures and emergencies
that may include a wide range of failures and components, MTBF can be a good measure to predict
emergency failures. In References [47,48], authors have acknowledged MTBF as a good measure have
stated that it provides an appropriate combination of MTTR and MTTF measures.
MTBF can be obtained from the following equation [49]:

MTBF “ MTTF ` MTTR (11)

In Reference [50], condition-based fault tree analysis (CBFTA) has been used to improve the
accuracy of MTBF measurement. In fact, CBFTA is a tool for updating the values of system reliability
and calculating these values accurately along with monitored system condition. The results show that
using CBFTA improves the level of system reliability.

2.7. Availability and Average Availability

Availability is one of the most important measures of reliability and shows the probability of
system being functional at a given time. Average Availability or Point Availability represents is the
probability of functionality of requested component under given conditions during time period of t.
Average Availability can be obtained from the following equation [18]:
MTTF
A avg “ (12)
MTTF ` MTTR
Thus, Availability improves by increasing MTTF and reducing MTTR. Expressing Aavg as
(MTBF-MTTR)/MTBF is usually avoided [33]. According to the authors of [51], increasing MTTF
does not necessarily increase the value of Availability and Average Availability; also, Availability and
Average Availability can be increased without changing MTTF.

3. Methodology
In recent decades, various procedures for estimating the reliability have been introduced by
different organizations. The first of reliability estimation titled TR-1100 was published in 1956 in
United States by Rome Air Development Center (RADC). This standard described the failure rate
for electronic and computer parts [52]. After the publication of this standard, MIL-HDBK-217 was
published as a handbook and became the most popular one in this field. After that different firms and
organizations developed and improve their own reliability handbooks and software. Some of these
procedures include:

‚ RAC’s PRISM [53]

‚ Telcordia SR-332 [54]
‚ SAE’s PREL [55]
‚ CNET's reliability prediction method [56]
Electronics 2016, 5, 18 8 of 18

‚ Siemens’ SN29500 standard [57]

‚ British Telecom’s HRD-4 [58]

In Reference [59], authors made a comparison between different methods available for estimating
the reliability. Today, MIL-HDBK-217 handbook is still used as a reference for reliability estimation.
It should be mentioned that MIL-HDBK-217 is a standard applied to military industry so it is very
conservative compared to other standards. Moreover, the suitability of this standard compared to other
ones has been proved because of its different and more factors which cover all aspects of reliability and
influential items [60]. This handbook uses two methods called parts count and parts stress to estimate
the reliability of system components at various stages of design [47,61].
Having the stress of electrical components and designed circuits, reliability can be predicted by
using parts stress method. The parts count method requires less data, generally including information
such as the number of parts, their quality level, and conditions of use. That is why parts stress methods
usually yields more accurate results regarding system reliability [47]. The main difference between the
parts stress and parts count methods is in how they calculate the system failure rate.

3.1. Approximate Method

As previously mentioned, there are two extensively used approaches for reliability assessments to
calculate failure rates. The first method is parts count which is a simple way to estimate the reliability
of a system. When there is no detailed system information, using this method is preferred. This method
uses typical operating conditions called reference conditions to predict the failure rate under these
conditions. However, it may be assumed that the device is not working under reference conditions,
and the actual operating conditions will affect failure rates calculated from the parts count method.
Therefore, this method can be considered as an approximate method. In this method, only the number
of components is important, and the construction is not involved. Therefore, this method is typically
based on quantitative analyses.
The approximate method used in this paper is similar to the method employed in Reference [62],
which the reliability of three-level NPC and CHB inverter based on FIT has been studied. In that article,
the voltage difference between circuit elements in properly compared. In this comparison, NPC has
used IGBT’s with medium voltage and CHB has used low voltage. In this comparison, the quantities
of components have been the center of focus. The results of that article have shown that in terms of
reliability, NPC inverter is 4.5 times better than CHB inverter.
It is obviously clear that one of the factors required for the analysis using this method is the
voltage level of investigated inverters. In fact, this method of comparison is the same as parts count
method, where failure rates are estimated based on voltage values. In addition, the comparison has
been made when inverters were connected to the drive. Therefore it is necessary to make a comparison
individually and without drive.
As mentioned above, we should find the voltage level of inverters in the first step. According to
the authors of [62,63], the NPC, FC, and CHB inverters can be placed in the category of high, high, and
low voltage IGBT switches. Based on this method, failure rate of diode has always been determined
as 100 FIT, and failure rates of high voltage and low voltage IGBT have been determined as 400 FIT
and 100 FIT, respectively. Additionally, failure rate of high voltage capacitor has been determined
as 300 FIT and this parameter for low voltage capacitor has been determined as 400 FIT. The whole
system failure rate can be determined by multiplying the diode, IGBT, and capacitors failure rate by
their quantity, and summing all obtained values.
In general, the failure rate for a device under reference conditions can be expressed by:
N
ÿ
λSYSTEM “ λre f piq ˆ k (13)
i “1

where k is the number of elements with the reference failure rate of λref (i) , and N is the number of parts.
Electronics 2016, 5, 18 9 of 18

3.2. Exact Method

Electronics 2016, 5, 18 9 of 18
The exact method presents a scheme of parts stress method. Unlike the parts count method, parts
stress3.2.
method requires knowledge of the specific part’s stress levels and different operating conditions.
Exact Method
In order to assess reliability of a system using this method, the various stresses on each part and
The exact method presents a scheme of parts stress method. Unlike the parts count method,
accurate environment conditions are needed. These conditions can be shown by different pi factors
parts stress method requires knowledge of the specific part’s stress levels and different operating
in theconditions.
failure rate equations. Number of various parameters in this method leads to a complexity
In order to assess reliability of a system using this method, the various stresses on each
in determining the failure
part and accurate rates, conditions
environment and although increases
are needed. These the accuracy.
conditions canThe total failure
be shown ratepiin the
by different
partsfactors
stress method
in the failure rate equations. Number of various parameters in this method leads tomethod.
can be calculated by summing all failure rates, similar to the parts count a
The following
complexitydiscussions willthe
in determining review the
failure related
rates, and relations
although of the exact
increases themethod.
accuracy. The total failure
In
rateMIL-HDBK-217
in the parts stresshandbook,
method canthebefailure rate by
calculated of circuit
summing components is calculated
all failure rates, similar tousing an index
the parts
calledcount method.
the base The rate.
failure following discussions
Equation of base will review
failure thecan
rate related relations
be shown asofbelow
the exact method.
[64]:
In MIL-HDBK-217 handbook, ˆ the failure rate of˙circuitˆcomponents is calculated ˙P using an index
NT failure rate can be
called the base failure rate. Equation of base 273 `T`
shown asp∆Tq
belowS [64]:
λb “ A.exp .exp (14)
273 ` T ` p∆Tq S TM
273 + + (Δ )
λ = . exp . exp (14)
where A is the scaling factor 273 +rate.
of failure + (ΔN)T , TM , and P are the shape parameters, T is the
temperature, ∆T is the difference between maximum allowable temperature with no junction current
where A is the scaling factor of failure rate. NT, TM, and P are the shape parameters, T is the
and the maximumΔT
temperature, allowable temperature
is the difference with full
between rated junction
maximum allowable current or power,
temperature S isnothe
with stress ratio
junction
that can be calculated
current by the ratio
and the maximum of actual
allowable stress towith
temperature ratedfullstress.
rated junction current or power, S is the
Handbook MIL-HDBK-217
stress ratio that can be calculatedoffers a combined
by the approach
ratio of actual to rated
stress to predict reliability so that the reliability
stress.
of each part of the MIL-HDBK-217
Handbook system is determinedoffers a individually
combined approachand as to a whole. Form of this
predict reliability model
so that the is as
reliability
follows [65]: of each part of the system is determined individually and as a whole. Form of this model is
as follows [65]: λ p “ λO πO ` λe πe ` λC πC ` λSj πSj ` λi (15)
λ =λ π +λ π +λ π +λ π +λ (15)
where λp is the predicted failure rate, λO is the failure rate from operational stresses, λe is the failure
where λby
rate caused p is environmental
the predicted failure rate, λλOCisisthe
stresses, thefailure rate
failure from
rate operational
caused stresses, λe is
by temperature the failure
cycling stresses,
rate caused by environmental stresses, λ C is the failure rate caused by temperature cycling stresses,
λSj is the failure rate caused by solder joints, λi is the failure rate caused by induced stresses, πO is
λSj is the failure
the operational rate π
factor, caused by solder joints, λi is the failure rate caused by induced stresses, πO is the
e is the environmental factor, πC is the cycling factor, and πSj is the solder
operational factor, πe is the environmental factor, πC is the cycling factor, and πSj is the solder joints
joints factor.
factor.
As the thickness of the solder increases, reliability also increases. Figure 3 shows the effect of
As the thickness of the solder increases, reliability also increases. Figure 3 shows the effect of
solder jointjoint
solder on the reliability
on the ofofananIGBT
reliability IGBTmodule;
module; as as can
canbe beseen,
seen,module
module lifetime
lifetime increases
increases with with
increasing thickness
increasing of solder
thickness [32]:
of solder [32]:

Figure
Figure 3. The
3. The effect
effect ofofsolder
solderthickness
thickness on
onthe
thelifetime ofof
lifetime anan
IGBT module.
IGBT module.

Recent articles about the reliability of electronic components (switches, diodes, capacitors and
Recent articles about the reliability of electronic components (switches, diodes, capacitors and
inductors) have presented specific relationships and equations for failure rate in each of these
inductors) have presented specific relationships and equations for failure rate in each of these
components. Considering to the components usually used in power electronic circuits, in this paper
components. Considering
we express to for
the failure rate thethe
components usually [26,47,66,67]:
following elements used in power electronic circuits, in this paper
we express the failure rate for the following elements [26,47,66,67]:
λ ( )=λ π π π (16)
λ ( λ p pCapacitorq
− “ λb πCV
)=πQλ ππE π π (17) (16)

λ ( ´ Trans
λ p pInductor ) =f ormerq
λ π π π“πλb πC πQ πE (18) (17)
Electronics 2016, 5, 18 10 of 18

λ p pSwitchq “ λb πT π A πQ πE (18)

λ p pDiodeq “ λb πT πC πS πQ πE (19)

where λb is the base failure rate, which is 0.012 and 0.064 for switch and diode, respectively.
Equation (20) must be used to calculate λb for inductors [47,67]:
ˆ ˙15.6
THS ` 273
λb “ 0.00035 ˆ exp (20)
329

where THS is the heat sink temperature or the temperature of the inductor hot spot, which is calculated
as follows [26,47,67]:

THS “ TA ` 1.1 ˆ ∆T (21)

In Equation (21), TA is the device ambient operating temperature (in degrees Celsius); ∆T is also
average temperature rise above ambient. The following equation must be used to calculate λb for
capacitors [47]:
«ˆ ˙ ff ˜ ˙ ¸
S 3 TA ` 273 5
ˆ
λb “ 0.00254 ` 1 exp 5.09 ˆ (22)
0.5 378

where S is the ratio of operating voltage to nominal voltage. In switch and diode failure rates, πT is the
temperature factor and can be calculated as is shown below [26,47]:
˜ ˜ ¸¸
1 1
πTpSq “ exp ´1925 ˆ ´ (23)
Tj ` 273 298
˜ ˜ ¸¸
1 1
πTpDq “ exp ´1925 ˆ ´ (24)
Tj ` 273 293

In Equations (23) and (24), Tj is the junction temperature and must be obtained by the
following equation:

Tj “ TC ` θ jc ˆ Ploss (25)

where TC is the heat sink temperature, θjc is the thermal resistance of diode or switch (assumed 0.25
for switch and 1.6 for diode) and Ploss is the power loss of switch or diode; πS is the stress factor and is
calculated as follows [47]:

πS “ VS2.43 (26)

where VS is the ratio of operating voltage to nominal voltage.

In the capacitor failure rate, πCV is the capacitor factor which can be obtained by [47]:

πCV “ 0.34 ˆ C0.12 (27)

where C is the capacitance values (in microfarad).

In some articles, πQ (quality factor) and πE (environment factor) have been considered to be equal
to 1, and consequently have been ignored [26,66]. To increase the accuracy, the values of quality factor
for semiconductor, inductor and capacitor, can be considered 5.5, 10 and 20 respectively. The value
of 1 is considered as environment factor πE for all components. Application factor π A , and contact
construction factor π C can be obtained from Tables 1 and 2:
Electronics 2016, 5, 18 11 of 18

Table 1. Application factor for different rated powers [47,67].

Application (Pr Rated Output Power) πA

Linear Amplification (Pr < 2 W) 1.5
Small Signal Switching 0.7
Non-Linear, (Pr ě 2 W)
2 ď Pr < 5 W 2.0
5 ď Pr < 50 W 4.0
50 ď Pr < 250 W 8.0
Pr ě 250 W 10

Table 2. Two values of contact construction factor based on different conditions [47,67].

Contact Construction πC
Metallurgically Bonded 1.0
Non-Metallurgically Bonded and Spring Loaded Contacts 2.0

The temperature factor plays a prominent role in the reliability assessment of power electronic
devices, and is related to power losses for semiconductors components. Thus, the failure rate depends
on the calculation method of power losses in diodes and IGBTs. The used approach in this paper is
based upon the determination of conduction and switching losses for each semiconductor component.
For this purpose, we used a simulation software to find an accurate value for power losses. Detailed
and extensive explanations of the procedure for identifying and determining these power losses can
be found in [68].

4. Results and Discussion

With regard to the differences in the structure of power electronic circuits and also differences in
the voltage level, base failure rate for each element and for each topology must be calculated separately.
Main components of a multilevel inverter generally include the following:
‚ Diode rectifiers
‚ DC link capacitors
‚ IGBT switching devices
Using FIT is one of the standard methods of analysis. As previously mentioned, each FIT is
obtained by dividing the number of failures by one billion hours, and reversing the FIT gives us MTTF.
However, the more correct relationship for failure rate should be as follows:
1
MTBF “ (28)
λ
According to the approximate method mentioned in Section 3, and based on FIT values specified
for the circuit components, MTTF parameters for the three well-known three-level/phase inverters
(3L-3P) with almost identical operation can be calculated as shown in Table 3:

Table 3. The approximate MTTF for three considered inverters.

Component/Inverter Type NPC FC CHB

IGBTs 12 ˆ 400 12 ˆ 400 12 ˆ 100
Capacitors 2 ˆ 300 5 ˆ 300 3 ˆ 400
Diodes 18 ˆ 100 12 ˆ 100 12 ˆ 100
Total FITs 7200 7500 3600
Failure Rate (failure/106 hours) 7.2 7.5 3.6
MTTF 138,888 133,333 277,777
NPC: diode-clamped or neutral-clamped; FC: capacitor-clamped or flying capacitor; CHB: cascade H-bridge;
MTTF: mean time to failure; FIT: failures in time; IGBT: insulated-gate bipolar transistor.
Electronics 2016, 5, 18 12 of 18

By multiplying the number of components by their FITs and summing these findings, we can
calculate total FITs for each inverter (e.g., the number of IGBTs, capacitors and diodes used in NPC
inverter is 12, 2 and 15, respectively). Summing all failure rates to predict reliability means that a failure
in any element of the system, causes system failure. MTTF value of each inverter can be calculated
using Equation (9). Results by this method show that 3L-3P CHB inverter has better performance in
terms of reliability.
In the investigated inverters, failure of any part or element leads to total system failure.
Electronics 2016, 5, 18 12 of 18
The number of elements
Electronics 2016, 5, 18
used in power electronics circuit is another parameter affecting its reliability.
12 of 18
TheTherelationship
relationship between
betweeninverter
inverterlevels
levels and
and the
the number
number of of components
componentsininthe
thecircuit
circuitis isshown
shown in in
Figure
Figure
The 4: 4:
relationship between inverter levels and the number of components in the circuit is shown in
Figure 4:

Figure 4. Number of total used components of multilevel inverters for different levels.
Figure 4. Number of total used components of multilevel inverters for different levels.
Figure 4. Number of total used components of multilevel inverters for different levels.
Using the previous quantitative method and reliability estimation, it can be shown that
Using the previous quantitative method and reliability estimation, it can be shown that increased
increased
Usingnumber of levelsquantitative
the previous and thus increasedmethodnumber of power estimation,
and reliability electronics circuit
it cancomponents
be shown lead
that
number of levels
MTTF. of levels and thus increased number of power electronics circuit components lead to
to reducednumber
increased and thus increased number of power electronics circuit components lead
reduced MTTF.
According
to reduced MTTF. to Figure 5, it is evident that using quantitative method, increase in the voltage levels
According
in allAccording totoFigure
three inverters 5,5,ititissystem
cause
Figure isevident
evident that
that using
reliability quantitative
to quantitative
using method,
reduce sharply. Thus,
method, increase inin the
it is necessary
increase the voltage levels
to present
voltage levels
in in
all three
another
all inverters
method
three tocause
inverters system
determine
cause thereliability
system failure toin
rate
reliability reduce
order
to sharply.
ableThus,
to besharply.
reduce it is necessary
to obtain
Thus, aitbetter to present
analysis.
is necessary another
to present
method
another tomethod
determine the failurethe
to determine rate in order
failure rate to
in be able
order toto
beobtain
able toaobtain
betteraanalysis.
better analysis.

Figure 5. The approximate MTTF for different voltage levels.

Figure5.5.The
Figure Theapproximate
approximate MTTF
MTTF for
for different
differentvoltage
voltagelevels.
levels.
Adoption of the exact method includes using Equations (16)–(19), by initially calculating λP for
eachAdoption
component and then multiplying these failure rates by the numberby of initially
Adoption ofofthethe exact
exact method includes
method includes using Equations
using Equations (16)–(19),
(16)–(19), byeach component
initially to obtain
calculating
calculating λP for
λP for
total component
each failure rate. and
Failure
thenrate of whole system
multiplying then can
these failure ratesbe by
calculated usingofthe
the number following
each componentequation [47]:
to obtain
each component and then multiplying these failure rates by the number of each component to obtain
total failure rate. Failure rate of whole system then can be calculated using the following equation [47]:
total failure rate. Failure rate of whole system then can be calculated using the following equation [47]:
λ = λ (29)
N
λ = ÿ λ (29)
λSYSTEM “ λPi (29)
This approach presents the parts stress method. i “1 In this method, calculation of the most
influential factor, which
This approach is thethe
presents temperature factor
parts stress πT, is very
method. In thisimportant.
method,Matlab Simulink
calculation software
of the most
This approach presents the parts stress method. In this method, calculation of the most influential
has been used
influential to which
factor, accurately calculate
is the the power
temperature factorloss
πT, in diodes
is very and switches.
important. A Simulink
Matlab 1-ohm resistor has
software
factor, which is the temperature factor πT , is very important. Matlab Simulink software has been used
beenbeen
has usedused
to measure the current.
to accurately calculate the power loss in diodes and switches. A 1-ohm resistor has
been Equations (16)–(27)
used to measure the are used to calculate pi factors and failure rate for each of the circuit
current.
elements for fundamental
Equations (16)–(27) arethree-level three-phase
used to calculate inverters
pi factors andof failure
NPC, FCrateand
for CHB
each with
of theidentical
circuit
conditions,
elements forand their valuesthree-level
fundamental are shownthree-phase
in Tables 4–6. The basic
inverters characteristics
of NPC, FC and CHB of three
withconsidered
identical
inverters are
conditions, andsimilar, and are
their values the shown
input involtage,
Tables output
4–6. Thefrequency and switching
basic characteristics frequency
of three consideredare
respectively
inverters are200 V, 50 Hz
similar, andand the20input
kHz. The output
voltage, powerfrequency
output of NPC, FC andandswitching
CHB are 2075, 3750 and
frequency are
Electronics 2016, 5, 18 13 of 18

to accurately calculate the power loss in diodes and switches. A 1-ohm resistor has been used to
measure the current.
Equations (16)–(27) are used to calculate pi factors and failure rate for each of the circuit elements
for fundamental three-level three-phase inverters of NPC, FC and CHB with identical conditions, and
their values are shown in Tables 4–6. The basic characteristics of three considered inverters are similar,
and the input voltage, output frequency and switching frequency are respectively 200 V, 50 Hz and
20 kHz. The output power of NPC, FC and CHB are 2075, 3750 and 2150 W, respectively. The value of
capacitors used in the considered inverters are also shown in Table 6.

Table 4. The calculated base failure rates for switches.

Type PLoss (S) TC (˝ C) Tj (˝ C) πT πA πE πQ λP

NPC 95.27 W 45 68.817 2.288 10 1 5.5 1.511
FC 130.5 W 45 77.625 2.636 10 1 5.5 1.740
CHB 18.46 W 45 49.615 1.637 10 1 5.5 1.080

Table 5. The calculated base failure rates for diodes.

Type PLoss (D) TC (˝ C) Tj (˝ C) πT πC πS πE πQ λP

NPC 11.144 W 35 52.830 1.938 1 0.0518 1 5.5 0.0353
FC 0.088 W 35 35.140 1.381 1 0.0016 1 5.5 0.0007
CHB 1.118 W 35 36.789 1.427 1 0.0128 1 5.5 0.0064

Table 6. The calculated base failure rate of capacitors.

Type Capacitor TA (˝ C) λb πCV πE πQ λP

NPC 200 mF 22.7 0.045 1.471 1 10 0.6619
FC 2200 µF 22.7 0.065 0.856 1 10 0.5565
CHB 660 µF 22.7 0.102 0.733 1 10 0.7472

The failure rate of control circuit for all three inverters is considered 0.88, similar to that of
Reference [47]. According to Equation (28), failure rate of the whole system can be calculated by
multiplying the number of each unique component by its failure rate, and then summing all products.
The final results regarding this calculation are shown in Table 7:

Table 7. The calculated MTTF for different multilevel inverters using the exact method.

Parameter/Type NPC FC CHB

Failure Rate (Failure/106 hours) 19.9853 23.6709 15.2784
MTTF (hour) 50,036 42,245 65,451

The results show that CHB inverter has a better reliability. The calculated results from the
approximate method are very different in comparison of the exact method. It can be considered that
the approximate method is not suitable for assessing reliability, and the calculated MTTFs are bigger
than the exact method outcomes. However, in this case, the suitability of the inverters in terms of
reliability is similar for the approximate and exact methods. Of course other factors such as cost and
performance should also be considered for the selection of an inverter. Several methods have been
proposed to improve the reliability of power electronic circuits, and this discussion is not within the
scope of the present article. However, the effect of one of the most useful methods in this regard,
should be mentioned.
Electronics 2016, 5, 18 14 of 18

Series Redundancy
In this method, adding series components will improve the reliability. Thus, the failure of one
component will not result in the failure of other components and eventually the whole system. Cost is
the only factor limiting the number of series components. In a system with n series components, the
reliability function will be as follows [66]:
n
R ptq “ 1 ´ p1 ´ e´λt q (30)

According to Equation (29), greater number of series components results in reliability function
values closer to 1. Figures 6–8 show the effect of series redundancy on three multilevel inverters of
NPC, FC, and
Electronics 2016,CHB:
5, 18 14 of 18
Electronics 2016, 5, 18 14 of 18
Electronics 2016, 5, 18 14 of 18

Figure
6. 6. Theeffect
effect of seriesredundancy
redundancy on reliability
reliability of
ofNPC.
Figure
Figure 6.The
The effectofofseries
series redundancy on
on reliability of NPC.
NPC.
Figure 6. The effect of series redundancy on reliability of NPC.

Figure 7. The effect of series redundancy on reliability of FC.

Figure 7.The
The effectofofseries
series redundancy on
on reliability
reliability of FC.
Figure 7.7.
Figure Theeffect
effect of seriesredundancy
redundancy on reliability ofFC.
of FC.

Figure 8. The effect of series redundancy on reliability of CHB.

Figure 8. The effect of series redundancy on reliability of CHB.
Figure 8.8.The
Figure Theeffect
effectofofseries
seriesredundancy
redundancy on
on reliability
reliabilityof
ofCHB.
CHB.
There are different researches in the field of power electronics reliability. In References [66,69],
There are different researches in the field of power electronics reliability. In References [66,69],
numerous redundancy
There are structures in
different researches andthemethods for improving
field of power thereliability.
electronics reliabilityInofReferences
power electronic
[66,69],
numerous redundancy structures and methods for improving the reliability of power electronic
circuits have
numerous been assessed.
redundancy It canand
structures be said that, in
methods forrecent years,the
improving there has beenofmuch
reliability powerattention to
electronic
circuits have been assessed. It can be said that, in recent years, there has been much attention to
redundancy structures in different circuits. For instance, different redundancy structures
circuits have been assessed. It can be said that, in recent years, there has been much attention to have been
redundancy structures in different circuits. For instance, different redundancy structures have been
proposed forstructures
redundancy different converters:
in different Inverters [70,71],
circuits. For the matrix
instance, converter
different [72], multilevel
redundancy structures converters
have been
proposed for different converters: Inverters [70,71], the matrix converter [72], multilevel converters
[73], DC-DC
proposed forconverter [74], and power
different converters: factor[70,71],
Inverters correction rectifiers
the matrix [75].
converter [72], multilevel converters
Electronics 2016, 5, 18 15 of 18

There are different researches in the field of power electronics reliability. In References [66,69],
numerous redundancy structures and methods for improving the reliability of power electronic circuits
have been assessed. It can be said that, in recent years, there has been much attention to redundancy
structures in different circuits. For instance, different redundancy structures have been proposed for
different converters: Inverters [70,71], the matrix converter [72], multilevel converters [73], DC-DC
converter [74], and power factor correction rectifiers [75].
However, an accurate and thematic assessment of numerous widely used circuits including
multilevel inverters is yet to be done.
In this paper, for the first time, we used approximate and exact methods to assess the reliability of
three conventional multilevel inverters of NPC, FC and CHB, to highlight the importance of reliability
concept in power electronic circuits. But, reliability of many modern multilevel inverters including
Hybrid Multilevel Cells is yet to be evaluated.

5. Conclusions
In the present study, the reliability evaluation of fundamental multilevel inverters was analyzed.
In recent years, the reliability of multilevel inverters is one the most important researches field, but a
comprehensive and accurate reliability assessment have not been done yet. In this paper, for the first
time, a reliability assessment of multilevel inverters was introduced using two different methods (exact
and approximate). The approximate method was based on summing all reference failure rates to predict
reliability means that a failure in any element of the system, cause system failure. The results from this
method showed that CHB inverter performs better in terms of reliability. In the exact method, some
parameters such as base failure rate, temperature factor, stress factor, capacitor factor, environment
factor, application factor and contact construction factor, should be determined. An accurate value
for environment factor is very important, and this factor has a direct relationship with semiconductor
power losses. Therefore, Matlab Simulink has been used to determine switch and diode power
losses. The results from exact method are similar to the approximate method, and the exact values
are 50,036, 42,245 and 65,451 h for NPC, FC and CHB, respectively. The benefit of the exact method is
an increase the accuracy by considering all conditions for each inverter. According to the proposed
method, it can be concluded that CHB inverter is the best choice in term of reliability. The results
confirmed that predicted failure rates are absolutely dependent on the method used. In addition,
series redundancy principle of fundamental multilevel inverters was described. The results showed
that series redundancy increases the reliability. With adding one redundancy part at a 50,000 h
period, the reliability function value increased about 23.26%, 21.24%, and 24.88% for NPC, FC, and
CHB, respectively.

Acknowledgments: Reviews of an earlier version of the manuscript by anonymous reviewers from

Electronics are gratefully appreciated, and authors gratefully acknowledge two anonymous reviewers for their
valuable comments.
Author Contributions: The authors contributed equally to this work. Abbas Hooshmand Viki carried out initial
research on the principle of reliability and its using in power electronics. Sadegh Shamlou provided suitable
resources for a more extensive study on this topic, and recommended the approximate method. The exact method
was discussed by Omid Alavi, and the simulations also performed by him. All authors contributed in calculating
the parameters obtained from the simulations, the writing and revising of the manuscript.
Conflicts of Interest: The authors declare no conflict of interest.

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