Receiver
Receiver
Receiver
DATA SHEET
Philips Semiconductors
Product specication
AM receiver circuit
GENERAL DESCRIPTION
TDA1072A
The TDA1072A integrated AM receiver circuit performs the active and part of the filtering functions of an AM radio receiver. It is intended for use in mains-fed home receivers and car radios. The circuit can be used for oscillator frequencies up to 50 MHz and can handle r.f. signals up to 500 mV. R.F. radiation and sensitivity to interference are minimized by an almost symmetrical design. The voltage-controlled oscillator provides signals with extremely low distortion and high spectral purity over the whole frequency range even when tuning with variable capacitance diodes. If required, band switching diodes can easily be applied. Selectivity is obtained using a block filter before the i.f. amplifier. Features Inputs protected against damage by static discharge Gain-controlled r.f. stage Double balanced mixer Separately buffered, voltage-controlled and temperature-compensated oscillator, designed for simple coils Gain-controlled i.f. stage with wide a.g.c. range Full-wave, balanced envelope detector Internal generation of a.g.c. voltage with possibility of second-order filtering Buffered field strength indicator driver with short-circuit protection A.F. preamplifier with possibilities for simple a.f. filtering Electronic standby switch. QUICK REFERENCE DATA Supply voltage range Supply current range R.F. input voltage for S + N/N = 6 dB at m = 30% R.F. input voltage for 3% total harmonic distortion (THD) at m = 80% A.F. output voltage with Vi = 2 mV; fi = 1 MHz; m = 30% and fm = 400 Hz A.G.C. range: change of Vi for 1 dB change of Vo(af) Field strength indicator voltage at Vi = 500 mV; RL(9) = 2,7 k PACKAGE OUTLINE 16-lead DIL; plastic (SOT38); SOT38-1; 1996 August 09. VIND typ. 2,8 V Vo(af) typ. typ. 310 mV 86 dB Vi typ. 500 mV VP IP Vi typ. 7,5 to 18 V 15 to 30 mA 1,5 V
May 1984
Philips Semiconductors
Product specication
AM receiver circuit
TDA1072A
(1) Coil data: TOKO sample no. 7XNS-A7523DY; L1 : N1/N2 = 12/32; Qo = 65; QB = 57. Filter data: ZF = 700 at R3-4 = 3 k; ZI = 4,8 k.
Fig.1 Block diagram and test circuit (connections shown in broken lines are not part of the test circuit).
May 1984
Philips Semiconductors
Product specication
AM receiver circuit
FUNCTIONAL DESCRIPTION Gain-controlled r.f. stage and mixer
TDA1072A
The differential amplifier in the r.f. stage employs an a.g.c. negative feedback network to provide a wide dynamic range. Very good cross-modulation behaviour is achieved by a.g.c. delays at the various signal stages. Large signals are handled with low distortion and the S/N ratio of small signals is improved. Low noise working is achieved in the differential amplifier by using transistors with low base resistance. A double balanced mixer provides the i.f. output signal to pin 1. Oscillator The differential amplifier oscillator is temperature compensated and is suitable for simple coil connection. The oscillator is voltage-controlled and has little distortion or spurious radiation. It is specially suitable for electronic tuning using variable capacitance diodes. Band switching diodes can easily be applied using the stabilized voltage V11-16. An extra buffered oscillator output (pin 10) is available for driving a synthesizer. If this is not needed, resistor RL(10) can be omitted. Gain-controlled i.f. amplier This amplifier comprises two cascaded, variable-gain differential amplifier stages coupled by a band-pass filter. Both stages are gain-controlled by the a.g.c. negative feedback network. Detector The full-wave, balanced envelope detector has very low distortion over a wide dynamic range. Residual i.f. carrier is blocked from the signal path by an internal low-pass filter. A.F. preamplier This stage preamplifies the audio frequency output signal. The amplifier output has an emitter follower with a series resistor which, together with an external capacitor, yields the required low-pass for a.f. filtering. A.G.C. amplier The a.g.c. amplifier provides a control voltage which is proportional to the carrier amplitude. Second-order filtering of the a.g.c. voltage achieves signals with very little distortion, even at low audio frequencies. This method of filtering also gives fast a.g.c. settling time which is advantageous for electronic search tuning. The a.g.c. settling time can be further reduced by using capacitors of smaller value in the external filter (C16 and C17). The a.g.c. voltage is fed to the r.f. and i.f. stages via suitable a.g.c. delays. The capacitor at pin 7 can be omitted for low-cost applications. Field strength indicator output A buffered voltage source provides a high-level field strength output signal which has good linearity for logarithmic input signals over the whole dynamic range. If the field strength information is not needed, RL(9) can be omitted. Standby switch This switch is primarily intended for AM/FM band switching. During standby mode the oscillator, mixer and a.f. preamplifier are switched off. Short-circuit protection All pins have short-circuit protection to ground.
May 1984
Philips Semiconductors
Product specication
AM receiver circuit
RATINGS Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) Supply voltage Total power dissipation Input voltage VP = V13-16 Ptot V14-15 V14-16, V15-16 V14-16, V15-16 Input current Operating ambient temperature range Storage temperature range Junction temperature THERMAL RESISTANCE From junction to ambient Rth j-a = I14, I15 Tamb Tstg Tj
TDA1072A
80
K/W
DEVICE CHARACTERISTICS VP = V13-16 = 8,5 V; Tamb = 25 C; fi = 1 MHz; fm = 400 Hz; m = 30%; fif = 460 kHz; measured in test circuit of Fig.1; unless otherwise specied PARAMETER Supplies Supply voltage Supply current R.F. stage and mixer Input voltage (d.c. value) R.F. input impedance at Vi < 300 V R.F. input impedance at Vi > 10 mV I.F. output impedance Conversion transconductance before start of a.g.c. Maximum i.f. output voltage, inductive coupling to pin 1 D.C. value of output current (pin 1) at Vi = 0 V A.G.C. range of input stage R.F. signal handling capability: input voltage for THD = 3% at m = 80% Vi(rms) 500 mV I1 1,2 30 mA dB V1-13(p-p) 5 V I1/Vi 6,5 mA/V V14-16, V15-16 R14-16, R15-16 C14-16, C15-16 R14-16, R15-16 C14-16, C15-16 R1-16 C1-16 500 VP/2 5,5 25 8 22 6 V k pF k pF k pF VP = V13-16 IP = I13 7,5 15 8,5 23 18 30 V mA SYMBOL MIN. TYP. MAX. UNIT
May 1984
Philips Semiconductors
Product specication
AM receiver circuit
TDA1072A
PARAMETER Oscillator Frequency range Oscillator amplitude (pins 11 to 12) External load impedance External load impedance for no oscillation Ripple rejection at VP(rms) = 100 mV; fP = 100 Hz (RR = 20 log [V13-16/V11-16]) Source voltage for switching diodes (6 VBE) D.C. output current (for switching diodes) Change of output voltage at I11 = 20 mA (switch to maximum load) Buffered oscillator output D.C. output voltage Output signal amplitude Output impedance Output current I.F., a.g.c. and a.f. stages D.C. input voltage I.F. input impedance I.F. input voltage for THD = 3% at m = 80% Voltage gain before start of a.g.c. A.G.C. range of i.f. stages: change of V3-4 for 1 dB change of Vo(af); V3-4(ref) = 75 mV A.F. output voltage at V3-4(if) = 50 V A.F. output voltage at V3-4(if) = 1 mV A.F. output impedance (pin 6) Indicator driver Output voltage at Vi = 0 mV; RL(9) = 2,7 k Output voltage at Vi = 500 mV; RL(9) = 2,7 k Load resistance V3-4 RR fosc
SYMBOL
MIN.
TYP. 130
MAX.
UNIT
0,6 0,5
60 150 200 60
MHz mV k
0 2,4
55 4,2 0,5
20 3 3,9
dB V mA V
V11-16 I11 V11-16 V10-16 V10-16(p-p) R10 I10(peak) V3-16, V4-16 R3-4 C3-4
V mV mA
2,0 3 7 90 68
V k pF mV dB
V3-4/V6-16
dB mV mV k
2,5 1,5
20 2,8
150 3,1
mV V k
May 1984
Philips Semiconductors
Product specication
AM receiver circuit
TDA1072A
PARAMETER Standby switch Switching threshold at VP = 7,5 to 18 V; Tamb = 40 to + 80 C on-voltage off-voltage on-current at V2-16 = 0 V off-current at V2-16 = 20 V
SYMBOL
MIN.
TYP.
MAX.
UNIT
V2-16 V2-16 I2 I2
0 3,5
2,0 20 200 10
V V A A
OPERATING CHARACTERISTICS VP = 8,5 V; fi = 1 MHz; m = 30%; fm = 400 Hz; Tamb = 25 C; measured in Fig.1; unless otherwise specied PARAMETER R.F. sensitivity R.F. input required for S + N/N = 6 dB R.F. input required for S + N/N = 26 dB R.F. input required for S + N/N = 46 dB R.F. input at start of a.g.c. R.F. large signal handling R.F. input at THD = 3%; m = 80% R.F. input at THD = 3%; m = 30% R.F. input at THD = 10%; m = 30% A.G.C. range Change of Vi for 1 dB change of Vo(af); Vi(ref) = 500 mV Change of Vi for 6 dB change of Vo(af); Vi(ref) = 500 mV Output signal A.F. output voltage at Vi = 4 V; m = 80% A.F. output voltage at Vi = 1 mV THD at Vi = 1 mV; m = 80% THD at Vi = 500 mV; m = 30% Signal-to-noise ratio at Vi = 100 mV Ripple rejection at Vi = 2 mV; VP(rms) = 100 mV; fP = 100 Hz (RR = 20 log [VP/Vo(af)]) RR 38 dB Vo(af) Vo(af) dtot dtot (S + N)/N 240 130 310 0,5 1 58 390 mV mV % % dB Vi 91 dB Vi 86 dB Vi Vi Vi 500 700 900 mV mV mV Vi Vi Vi Vi 1,5 15 150 30 V V V V SYMBOL MIN. TYP. MAX. UNIT
May 1984
Philips Semiconductors
Product specication
AM receiver circuit
TDA1072A
PARAMETER Unwanted signals Suppression of i.f. whistles at Vi = 15 V; m = 0% related to a.f. signal of m = 30% at fi 2 fif at fi 3 fif I.F. suppression at r.f. input for symmetrical input for asymmetrical input Residual oscillator signal at mixer output at fosc at 2 fosc APPLICATION INFORMATION if if 2if 3if
SYMBOL
MIN.
TYP.
MAX.
UNIT
37 44 40 40 1 1,1
dB dB dB dB A A
I1(osc) I1(2osc)
(1) Capacitor values depend on crystal type. (2) Coil data: 9 windings of 0,1 mm dia laminated Cu wire on TOKO coil set 7K 199CN; Qo = 80.
May 1984
Philips Semiconductors
Product specication
AM receiver circuit
TDA1072A
Fig.4 Fig.3 A.F. output as a function of r.f. input in the circuit of Fig.1; fi = 1 MHz; fm = 400 Hz; m = 30%.
Total harmonic distortion and (S + N)/N as functions of r.f. input in the circuit of Fig.1; m = 30% for (S + N)/N curve and m = 80% for THD curve.
Fig.5
Total harmonic distortion as a function of modulation frequency at Vi = 5 mV; m = 80%; measured in the circuit of Fig.1 with C7-16(ext) = 0 F and 2,2 F.
May 1984
Philips Semiconductors
Product specication
AM receiver circuit
TDA1072A
Fig.7
Fig.6
Typical frequency response curves from Fig.1 showing the effect of filtering as follows: with i.f. filter; - - - with a.f. filter; with i.f. and a.f. filters.
May 1984
10
Philips Semiconductors
Product specication
AM receiver circuit
TDA1072A
Fig.9 A.F. output as a function of r.f. input using the circuit of Fig.8 with that of Fig.1.
Fig.10 Suppression of cross-modulation as a function of input signal, measured in the circuit of Fig.8 with the input circuit as shown in Fig.11. Curve is for Wanted Vo(af)/Unwanted Vo(af) = 20 dB; Vrfw, Vrfu are signals at the aerial input, V'aew, V'aeu are signals at the unloaded output of the aerial. Wanted signal (V'aew, Vrfw): fi = 1 MHz; fm = 400 Hz; m = 30%. Unwanted signal (V'aeu, Vrfu): fi = 900 kHz; fm = 400 Hz; m = 30%. Effective selectivity of input tuned circuit = 21 dB.
May 1984
11
Philips Semiconductors
Product specication
AM receiver circuit
TDA1072A
Fig.12 Oscillator amplitude as a function of pin 11, 12 impedance in the circuit of Fig.8.
May 1984
12
Philips Semiconductors
Product specication
AM receiver circuit
TDA1072A
Fig.13 Total harmonic distortion and (S + N)/N as functions of r.f. input using the circuit of Fig.8 with that of Fig.1.
Fig.14 Forward transfer impedance as a function of intermediate frequency for filters 1 to 4 shown in Fig.15; centre frequency = 455 kHz.
May 1984
13
Philips Semiconductors
Product specication
AM receiver circuit
TDA1072A
Fig.15 I.F. filter variants applied to the circuit of Fig.1. For filter data, refer to Table 1.
May 1984
14
Data for I.F. lters shown in Fig.15. Criterium for adjustment is ZF = maximum (optimum selectivity curve at centre frequency f0 = 455 kHz). See also Fig.14. 3 L1 3900 29 : 29 0,08 60 75 0,09 mm 13 : 31 4700 3900 pF L2 L1 4 UNIT
May 1984
FILTER NO.
Coil data
L1
Value of C
3900
Philips Semiconductors
N1: N2 0,08 50
12 : 32
Diameter of Cu
AM receiver circuit
laminated wire
0,09
Qo
65 (typ.)
12
7XNS-A7523DY
7XNS-A7519DY
Murata type
SFZ455A
D (typical value)
RG, RL
Bandwidth (3 dB)
4,2
S9kHz
24
ZI
4,8
QB
57
ZF
0,70
Bandwidth (3 dB)
3,6
S9kHz
35
S18kHz
52
S27kHz
63
Product specication
TDA1072A
* The beginning of an arrow indicates the beginning of a winding; N1 is always the inner winding, N2 the outer winding.
Philips Semiconductors
Product specication
AM receiver circuit
TDA1072A
Fig.16 Printed-circuit board component side, showing component layout. For circuit diagram see Fig.1.
May 1984
16
Philips Semiconductors
Product specication
AM receiver circuit
TDA1072A
May 1984
17
May 1984
Philips Semiconductors
AM receiver circuit
18 Product specication
(1) Values of capacitors depend on the selected group of capacitive diodes BB112. (2) For i.f. filter and coil data refer to Fig.1.
TDA1072A
Fig.18 Car radio application with capacitive diode tuning and electronic MW/LW switching. The circuit includes pre-stage a.g.c. optimized for good large-signal handling.
Philips Semiconductors
Product specication
AM receiver circuit
PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TDA1072A
SOT38-1
D seating plane
ME
A2
A1
c Z e b1 b 16 9 MH w M (e 1)
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
May 1984
19
Philips Semiconductors
Product specication
AM receiver circuit
SOLDERING Introduction
TDA1072A
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our IC Package Databook (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
May 1984
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