Advance Information: 128 X 64 Dot Matrix OLED/PLED Segment/Common Driver With Controller

SOLOMON SYSTECH
SEMICONDUCTOR TECHNICAL DATA
SSD1308
Advance Information
128 x 64 Dot Matrix

OLED/PLED Segment/Common Driver with Controller
This document contains information on a new product. Specifications and information herein are subject to change
without notice.
http://www.solomon-systech.com
SSD1308 Rev 1.0 P 1/56 Oct 2008 Copyright © 2008 Solomon Systech Limited
Appendix: IC Revision history of SSD1308 Specification
Version Change Items Effective Date

0.10 1st Release 30-May-08
1.0 1. Changed to Advance Information 27-Oct-08

2. Update die thickness tolerance from ±25um to ±15um
3. Round IREF to 19uA from 18.75uA
4. Update Table 11-1 and Table 12-1
Solomon Systech Oct 2008 P 2/56 Rev 1.0 SSD1308

CONTENTS
1 GENERAL DESCRIPTION .......................................................................................................7
2 FEATURES...................................................................................................................................7
3 ORDERING INFORMATION ...................................................................................................7
4 BLOCK DIAGRAM ....................................................................................................................8
5 DIE PAD FLOOR PLAN ............................................................................................................ 9
6 PIN DESCRIPTION ..................................................................................................................12
7 FUNCTIONAL BLOCK DESCRIPTIONS.............................................................................14

7.1 MCU INTERFACE SELECTION.............................................................................................................................. 14
7.1.1 MCU Parallel 6800-series Interface.......................................................................................................... 14
7.1.2 MCU Parallel 8080-series Interface.......................................................................................................... 15
7.1.3 MCU Serial Interface (4-wire SPI) ............................................................................................................ 16
7.1.4 MCU Serial Interface (3-wire SPI) ............................................................................................................ 17
7.1.5 MCU I2C Interface..................................................................................................................................... 18
7.2 COMMAND DECODER ......................................................................................................................................... 21
7.3 OSCILLATOR CIRCUIT AND DISPLAY TIME GENERATOR ..................................................................................... 21
7.4 FR SYNCHRONIZATION ....................................................................................................................................... 22
7.5 RESET CIRCUIT ................................................................................................................................................... 22
7.6 SEGMENT DRIVERS / COMMON DRIVERS ............................................................................................................ 23
7.7 GRAPHIC DISPLAY DATA RAM (GDDRAM)..................................................................................................... 24
7.8 SEG/COM DRIVING BLOCK ............................................................................................................................... 25
7.9 POWER ON AND OFF SEQUENCE ........................................................................................................................ 26
8 COMMAND TABLE ................................................................................................................. 27
8.1 DATA READ / WRITE .......................................................................................................................................... 32
9 COMMAND DESCRIPTIONS................................................................................................. 33
9.1 FUNDAMENTAL COMMAND ................................................................................................................................ 33
9.1.1 Set Lower Column Start Address for Page Addressing Mode (00h~0Fh) ................................................. 33
9.1.2 Set Higher Column Start Address for Page Addressing Mode (10h~1Fh) ................................................ 33
9.1.3 Set Memory Addressing Mode (20h).......................................................................................................... 33
9.1.4 Set Column Address (21h) ......................................................................................................................... 34
9.1.5 Set Page Address (22h).............................................................................................................................. 35
9.1.6 Set Display Start Line (40h~7Fh) .............................................................................................................. 35
9.1.7 Set Contrast Control for BANK0 (81h)...................................................................................................... 35
9.1.8 Set Segment Re-map (A0h/A1h) ................................................................................................................. 35
9.1.9 Entire Display ON (A4h/A5h) .................................................................................................................. 36
9.1.10 Set Normal/Inverse Display (A6h/A7h)...................................................................................................... 36
9.1.11 Set Multiplex Ratio (A8h)........................................................................................................................... 36
9.1.12 External or internal IREF Selection (ADh) .................................................................................................. 36
9.1.13 Set Display ON/OFF (AEh/AFh) ............................................................................................................... 36
9.1.14 Set Page Start Address for Page Addressing Mode (B0h~B7h)................................................................. 36
9.1.15 Set COM Output Scan Direction (C0h/C8h).............................................................................................. 36
9.1.16 Set Display Offset (D3h) ............................................................................................................................ 36
9.1.17 Set Display Clock Divide Ratio/ Oscillator Frequency (D5h) ................................................................... 39
9.1.18 Set Pre-charge Period (D9h) ..................................................................................................................... 39
9.1.19 Set COM Pins Hardware Configuration (DAh)......................................................................................... 39
9.1.20 Set VCOMH Deselect Level (DBh) ............................................................................................................... 42
9.1.21 NOP (E3h) ................................................................................................................................................. 42
9.1.22 Status register Read ................................................................................................................................... 42
SSD1308 Rev 1.0 P 3/56 Oct 2008 Solomon Systech

9.2 GRAPHIC ACCELERATION COMMAND ................................................................................................................. 43
9.2.1 Horizontal Scroll Setup (26h/27h) ............................................................................................................. 43
9.2.2 Continuous Vertical and Horizontal Scroll Setup (29h/2Ah)..................................................................... 44
9.2.3 Deactivate Scroll (2Eh).............................................................................................................................. 44
9.2.4 Activate Scroll (2Fh).................................................................................................................................. 44
9.2.5 Set Vertical Scroll Area(A3h) .................................................................................................................... 44
10 MAXIMUM RATINGS..........................................................................................................45
11 DC CHARACTERISTICS.....................................................................................................46
12 AC CHARACTERISTICS.....................................................................................................47
13 APPLICATION EXAMPLE..................................................................................................53
14 PACKAGE INFORMATION................................................................................................55
14.1 SSD1308Z DIE TRAY INFORMATION .................................................................................................................. 55

TABLES
TABLE 5-1 : SSD1308Z BUMP DIE PAD COORDINATES ...................................................................................................... 11
TABLE 6-1 : MCU BUS INTERFACE PIN SELECTION ............................................................................................................ 13
TABLE 7-1 : MCU INTERFACE ASSIGNMENT UNDER DIFFERENT BUS INTERFACE MODE ...................................................... 14
TABLE 7-2 : CONTROL PINS OF 6800 INTERFACE................................................................................................................. 14
TABLE 7-3 : CONTROL PINS OF 8080 INTERFACE................................................................................................................. 16
TABLE 7-4 : CONTROL PINS OF 4-WIRE SERIAL INTERFACE ................................................................................................. 16
TABLE 7-5 : CONTROL PINS OF 3-WIRE SERIAL INTERFACE ................................................................................................. 17
TABLE 8-1: COMMAND TABLE ........................................................................................................................................... 27
TABLE 8-2 : READ COMMAND TABLE ................................................................................................................................. 32
TABLE 8-3 : ADDRESS INCREMENT TABLE (AUTOMATIC) ................................................................................................... 32
TABLE 9-1 : EXAMPLE OF SET DISPLAY OFFSET AND DISPLAY START LINE WITH NO REMAP ............................................ 37
TABLE 9-2 :EXAMPLE OF SET DISPLAY OFFSET AND DISPLAY START LINE WITH REMAP .................................................. 38
TABLE 9-3 : COM PINS HARDWARE CONFIGURATION ....................................................................................................... 39
TABLE 10-1 : MAXIMUM RATINGS (VOLTAGE REFERENCED TO VSS)................................................................................ 45
TABLE 11-1 : DC CHARACTERISTICS .................................................................................................................................. 46
TABLE 12-1 : AC CHARACTERISTICS .................................................................................................................................. 47
TABLE 12-2 : 6800-SERIES MCU PARALLEL INTERFACE TIMING CHARACTERISTICS......................................................... 48
TABLE 12-3 : 8080-SERIES MCU PARALLEL INTERFACE TIMING CHARACTERISTICS......................................................... 49
TABLE 12-4 : 4-WIRE SERIAL INTERFACE TIMING CHARACTERISTICS ................................................................................ 50
TABLE 12-5 : 3-WIRE SERIAL INTERFACE TIMING CHARACTERISTICS ................................................................................ 51
TABLE 12-6 :I2C INTERFACE TIMING CHARACTERISTICS .................................................................................................... 52

FIGURES
FIGURE 4-1 SSD1308 BLOCK DIAGRAM .............................................................................................................................. 8
FIGURE 5-1 : SSD1308Z DIE DRAWING ............................................................................................................................... 9
FIGURE 5-2 : SSD1308Z ALIGNMENT MARK DIMENSIONS .................................................................................................. 10
FIGURE 6-1 PIN DESCRIPTION ............................................................................................................................................. 12
FIGURE 7-1 : DATA READ BACK PROCEDURE - INSERTION OF DUMMY READ ....................................................................... 15
FIGURE 7-2 : EXAMPLE OF WRITE PROCEDURE IN 8080 PARALLEL INTERFACE MODE......................................................... 15
FIGURE 7-3 : EXAMPLE OF READ PROCEDURE IN 8080 PARALLEL INTERFACE MODE .......................................................... 15
FIGURE 7-4 : DISPLAY DATA READ BACK PROCEDURE - INSERTION OF DUMMY READ ......................................................... 16
FIGURE 7-5 : WRITE PROCEDURE IN 4-WIRE SERIAL INTERFACE MODE ............................................................................... 17
FIGURE 7-6 : WRITE PROCEDURE IN 3-WIRE SERIAL INTERFACE MODE ............................................................................... 17
FIGURE 7-7 : I2C-BUS DATA FORMAT .................................................................................................................................. 19
FIGURE 7-8 : DEFINITION OF THE START AND STOP CONDITION ......................................................................................... 20
FIGURE 7-9 : DEFINITION OF THE ACKNOWLEDGEMENT CONDITION ................................................................................... 20
FIGURE 7-10 : DEFINITION OF THE DATA TRANSFER CONDITION ......................................................................................... 20
FIGURE 7-11 : OSCILLATOR CIRCUIT AND DISPLAY TIME GENERATOR .............................................................................. 21
FIGURE 7-12 : SEGMENT OUTPUT WAVEFORM IN THREE PHASES ....................................................................................... 23
FIGURE 7-13 : GDDRAM PAGES STRUCTURE OF SSD1308................................................................................................ 24
FIGURE 7-14 : ENLARGEMENT OF GDDRAM (NO ROW RE-MAPPING AND COLUMN-REMAPPING)...................................... 24
FIGURE 7-15 : IREF CURRENT SETTING BY RESISTOR VALUE ............................................................................................. 25
FIGURE 7-16 : THE POWER ON SEQUENCE.......................................................................................................................... 26
FIGURE 7-17 : THE POWER OFF SEQUENCE ........................................................................................................................ 26
FIGURE 9-1 : ADDRESS POINTER MOVEMENT OF PAGE ADDRESSING MODE ....................................................................... 33
FIGURE 9-2 : EXAMPLE OF GDDRAM ACCESS POINTER SETTING IN PAGE ADDRESSING MODE (NO ROW AND COLUMN-
REMAPPING) ............................................................................................................................................................... 33
FIGURE 9-3 : ADDRESS POINTER MOVEMENT OF HORIZONTAL ADDRESSING MODE ........................................................... 34
FIGURE 9-4 : ADDRESS POINTER MOVEMENT OF VERTICAL ADDRESSING MODE ................................................................ 34
FIGURE 9-5 : EXAMPLE OF COLUMN AND ROW ADDRESS POINTER MOVEMENT ................................................................ 35
FIGURE 9-6 :TRANSITION BETWEEN DIFFERENT MODES ...................................................................................................... 36
FIGURE 9-7 : HORIZONTAL SCROLL EXAMPLE: SCROLL RIGHT BY 1 COLUMN ................................................................... 43
FIGURE 9-8 : HORIZONTAL SCROLL EXAMPLE: SCROLL LEFT BY 1 COLUMN ..................................................................... 43
FIGURE 9-9 : HORIZONTAL SCROLLING SETUP EXAMPLE .................................................................................................... 43
FIGURE 9-10 : CONTINUOUS VERTICAL AND HORIZONTAL SCROLLING SETUP EXAMPLE .................................................... 44
FIGURE 12-1 : 6800-SERIES MCU PARALLEL INTERFACE CHARACTERISTICS ...................................................................... 48
FIGURE 12-2 : 8080-SERIES PARALLEL INTERFACE CHARACTERISTICS................................................................................ 49
FIGURE 12-3 : 4-WIRE SERIAL INTERFACE CHARACTERISTICS ............................................................................................. 50
FIGURE 12-4 : 3-WIRE SERIAL INTERFACE CHARACTERISTICS ............................................................................................. 51
FIGURE 12-5 : I2C INTERFACE TIMING CHARACTERISTICS .................................................................................................. 52
FIGURE 13-1 : APPLICATION EXAMPLE OF SSD1308Z WITH EXTERNAL IREF...................................................................... 53
FIGURE 13-2 : APPLICATION EXAMPLE OF SSD1308Z WITH INTERNAL IREF ....................................................................... 54
FIGURE 14-1 : SSD1308Z DIE TRAY INFORMATION ............................................................................................................ 55

1 GENERAL DESCRIPTION
SSD1308 is a single-chip CMOS OLED/PLED driver with controller for organic / polymer light emitting
diode dot-matrix graphic display system. It consists of 128 segments and 64commons. This IC is
designed for Common Cathode type OLED panel.
The SSD1308 embeds with contrast control, display RAM and oscillator, which reduces the number of
external components and power consumption. It has 256-step brightness control. Data/Commands are
sent from general MCU through the hardware selectable 6800/8080 series compatible Parallel Interface,
I2C interface or Serial Peripheral Interface. It is suitable for many compact portable applications, such as
mobile phone sub-display, MP3 player and calculator, etc.
2 FEATURES
• Resolution: 128 x 64 dot matrix panel
• Power supply
o VDD = 1.65V to 3.3V for IC logic
o VCC = 7V to 15V for Panel driving
• For matrix display
o OLED driving output voltage, 15V maximum
o Segment maximum source current: 150uA
o Common maximum sink current: 20mA
• 256 step contrast brightness current control
• Internal / External IREF Selection
• Embedded 128 x 64 bit SRAM display buffer
• Pin selectable MCU Interfaces:
o 8-bit 6800/8080-series parallel interface
o 3 /4 wire Serial Peripheral Interface
o I2C Interface
• Screen saving continuous scrolling function in both horizontal and vertical direction
• RAM write synchronization signal
• Programmable Frame Rate and Multiplexing Ratio
• Row Re-mapping and Column Re-mapping
• On-Chip Oscillator
• Chip layout for COG & COF
• Wide range of operating temperature: -40°C to 85°C
3 ORDERING INFORMATION
Table 3-1: Ordering Information
Ordering Part Number SEG COM Package Form Reference Remark

o Min SEG pad pitch : 47um
SSD1308Z 128 64 COG 9, 55 o Min COM pad pitch : 40um
o Die thickness: 300 +/- 15um

4 BLOCK DIAGRAM
Figure 4-1 SSD1308 Block Diagram
RES#
CS#
D/C#
E (RD#)
R/W#(WR#)
Graphic Display Data
RAM (GDDRAM)
BS2
Display Controller
COM62
Common
BS1
Driver
COM60
Interface
BS0
MCU
|
|
COM2
D7 COM0
D6
D5
D4
D3 SEG0
D2
Segment
SEG1
D1
Driver
|
D0 |
SEG126
SEG127
VDD
VCC
COM1
VSS
Common
COM3
VLSS
Driver
|
|
Voltage Control
Current Control
COM61
Command
COM63
Decoder
Oscillator
VCOMH
FR
CLS
IREF
CL

5 DIE PAD FLOOR PLAN
Figure 5-1 : SSD1308Z Die Drawing
Pad 1 Die size 6.76mm x 0.86mm

Die thickness 300 +/- 15um
Min I/O pad pitch 60um
Min SEG pad pitch 47um
Min COM pad pitch 40um
Bump height Nominal 15um
Bump size
Pad 1, 106, 124, 256 80um x 50um
Pad 2-18, 89-105, 107-123, 257-273 25um x 80um
Pad 19-88 40um x 89um
Pad 125-255 31um x 59um
Pad 274-281 (TR pads) 30um x 50um
SSD1308Z
Alignment
Position Size
mark
+ shape (-2973, 0) 75um x 75um
+ shape (2973, 0) 75um x 75um
Circle (2466.665, 7.575) R37.5um, inner 18um
SSL Logo (-2862.35, 144.82) -
(For details dimension please see p.10 )
Note
(1)
Diagram showing the Gold bumps face up.
(2)
Coordinates are referenced to center of the chip.
(3)
Coordinate units and size of all alignment marks are in um.
(4)
All alignment keys do not contain gold

Figure 5-2 : SSD1308Z alignment mark dimensions
T shape
+ shape
Circle
*All units are in um

Table 5-1 : SSD1308Z Bump Die Pad Coordinates
Pad no. Pad Name X-pos Y-pos Pad no. Pad Name X-pos Y-pos Pad no. Pad Name X-pos Y-pos Pad no. Pad Name X-pos Y-pos
1 NC -3315 -377.5 81 VCOMH 1875.585 -352.83 161 SEG35 1364.5 356 241 SEG114 -2398.5 356
2 VSS -3084.77 -362.5 82 VCC 1967.185 -352.83 162 SEG36 1317.5 356 242 SEG115 -2445.5 356
3 COM49 -3044.77 -362.5 83 VCC 2027.185 -352.83 163 SEG37 1270.5 356 243 SEG116 -2492.5 356
4 COM50 -3004.77 -362.5 84 VLSS 2109.185 -352.83 164 SEG38 1223.5 356 244 SEG117 -2539.5 356
5 COM51 -2964.77 -362.5 85 VLSS 2169.185 -352.83 165 SEG39 1176.5 356 245 SEG118 -2586.5 356
6 COM52 -2924.77 -362.5 86 VLSS 2254.185 -352.83 166 SEG40 1129.5 356 246 SEG119 -2633.5 356
7 COM53 -2884.77 -362.5 87 NC 2314.185 -352.83 167 SEG41 1082.5 356 247 SEG120 -2680.5 356
8 COM54 -2844.77 -362.5 88 NC 2374.185 -352.83 168 SEG42 1035.5 356 248 SEG121 -2727.5 356
9 COM55 -2804.77 -362.5 89 VSS 2444.77 -362.5 169 SEG43 988.5 356 249 SEG122 -2774.5 356
10 COM56 -2764.77 -362.5 90 COM31 2484.77 -362.5 170 SEG44 941.5 356 250 SEG123 -2821.5 356
11 COM57 -2724.77 -362.5 91 COM30 2524.77 -362.5 171 SEG45 894.5 356 251 SEG124 -2868.5 356
12 COM58 -2684.77 -362.5 92 COM29 2564.77 -362.5 172 SEG46 847.5 356 252 SEG125 -2915.5 356
13 COM59 -2644.77 -362.5 93 COM28 2604.77 -362.5 173 SEG47 800.5 356 253 SEG126 -2962.5 356
14 COM60 -2604.77 -362.5 94 COM27 2644.77 -362.5 174 SEG48 753.5 356 254 SEG127 -3009.5 356
15 COM61 -2564.77 -362.5 95 COM26 2684.77 -362.5 175 SEG49 706.5 356 255 NC -3056.5 356
16 COM62 -2524.77 -362.5 96 COM25 2724.77 -362.5 176 SEG50 659.5 356 256 NC -3315 367.5
17 COM63 -2484.77 -362.5 97 COM24 2764.77 -362.5 177 SEG51 612.5 356 257 COM32 -3315 315
18 VCOMH -2444.77 -362.5 98 COM23 2804.77 -362.5 178 SEG52 565.5 356 258 COM33 -3315 275
19 NC -2334.965 -352.83 99 COM22 2844.77 -362.5 179 SEG53 518.5 356 259 COM34 -3315 235
20 TR7 -2278.265 -352.83 100 COM21 2884.77 -362.5 180 SEG54 471.5 356 260 COM35 -3315 195
21 TR7 -2218.265 -352.83 101 COM20 2924.77 -362.5 181 SEG55 424.5 356 261 COM36 -3315 155
22 TR8 -2136.715 -352.83 102 COM19 2964.77 -362.5 182 SEG56 377.5 356 262 COM37 -3315 115
23 TR8 -2055.465 -352.83 103 COM18 3004.77 -362.5 183 SEG57 330.5 356 263 COM38 -3315 75
24 TR9 -1995.465 -352.83 104 COM17 3044.77 -362.5 184 SEG58 283.5 356 264 COM39 -3315 35
25 TR9 -1904.115 -352.83 105 VSS 3084.77 -362.5 185 SEG59 236.5 356 265 COM40 -3315 -5
26 TR10 -1844.115 -352.83 106 NC 3315 -377.5 186 SEG60 189.5 356 266 COM41 -3315 -45
27 TR10 -1762.865 -352.83 107 COM16 3315 -325 187 SEG61 142.5 356 267 COM42 -3315 -85
28 VDD1 -1679.31 -352.83 108 COM15 3315 -285 188 SEG62 95.5 356 268 COM43 -3315 -125
29 VDD1 -1619.31 -352.83 109 COM14 3315 -245 189 SEG63 48.5 356 269 COM44 -3315 -165
30 TR11 -1537.51 -352.83 110 COM13 3315 -205 190 SEG64 1.5 356 270 COM45 -3315 -205
31 BGGND -1477.51 -352.83 111 COM12 3315 -165 191 SEG65 -45.5 356 271 COM46 -3315 -245
32 VCC -1416.01 -352.83 112 COM11 3315 -125 192 SEG66 -92.5 356 272 COM47 -3315 -285
33 VCC -1356.01 -352.83 113 COM10 3315 -85 193 SEG67 -139.5 356 273 COM48 -3315 -325
34 VCOMH -1266.955 -352.83 114 COM9 3315 -45 194 SEG68 -186.5 356
35 VCOMH -1206.955 -352.83 115 COM8 3315 -5 195 SEG69 -233.5 356 Pad no. Pad Name X-pos Y-pos
36 VLSS -1125.155 -352.83 116 COM7 3315 35 196 SEG70 -280.5 356 Pin# Pin name X-dir Y-dir
37 VLSS -1043.355 -352.83 117 COM6 3315 75 197 SEG71 -327.5 356 274 TR0 2757.05 114.8
38 VLSS -983.355 -352.83 118 COM5 3315 115 198 SEG72 -374.5 356 275 TR1 2697.05 114.8
39 VSS -920 -352.83 119 COM4 3315 155 199 SEG73 -421.5 356 276 TR2 2637.05 114.8
40 VSS -856 -352.83 120 COM3 3315 195 200 SEG74 -468.5 356 277 TR3 2577.05 114.8
41 VSS -796 -352.83 121 COM2 3315 235 201 SEG75 -515.5 356 278 VSS 2517.05 114.8
42 VDD -732.645 -352.83 122 COM1 3315 275 202 SEG76 -562.5 356 279 TR4 2457.05 114.8
43 VDD -672.645 -352.83 123 COM0 3315 315 203 SEG77 -609.5 356 280 TR5 2397.05 114.8
44 BS0 -595.655 -352.83 124 NC 3315 367.5 204 SEG78 -656.5 356 281 TR6 2337.05 114.8
45 VSS -531.955 -352.83 125 NC 3055.5 356 205 SEG79 -703.5 356
46 BS1 -467.655 -352.83 126 SEG0 3009.5 356 206 SEG80 -750.5 356
47 VDD -403.155 -352.83 127 SEG1 2962.5 356 207 SEG81 -797.5 356
48 VDD -342.555 -352.83 128 SEG2 2915.5 356 208 SEG82 -844.5 356
49 BS2 -279.705 -352.83 129 SEG3 2868.5 356 209 SEG83 -891.5 356
50 VSS -215.705 -352.83 130 SEG4 2821.5 356 210 NC -940 356
51 FR -151.955 -352.83 131 SEG5 2774.5 356 211 SEG84 -988.5 356
52 CL -89.815 -352.83 132 SEG6 2727.5 356 212 SEG85 -1035.5 356
53 VSS -25.665 -352.83 133 SEG7 2680.5 356 213 SEG86 -1082.5 356
54 CS# 38.635 -352.83 134 SEG8 2633.5 356 214 SEG87 -1129.5 356
55 RES# 109.835 -352.83 135 SEG9 2586.5 356 215 SEG88 -1176.5 356
56 D/C# 182.425 -352.83 136 SEG10 2539.5 356 216 SEG89 -1223.5 356
57 VSS 246.125 -352.83 137 SEG11 2492.5 356 217 SEG90 -1270.5 356
58 R/W# 310.425 -352.83 138 SEG12 2445.5 356 218 SEG91 -1317.5 356
59 E 373.125 -352.83 139 SEG13 2398.5 356 219 SEG92 -1364.5 356
60 VDD 457.175 -352.83 140 SEG14 2351.5 356 220 SEG93 -1411.5 356
61 VDD 517.175 -352.83 141 SEG15 2304.5 356 221 SEG94 -1458.5 356
62 D0 609.275 -352.83 142 SEG16 2257.5 356 222 SEG95 -1505.5 356
63 D1 692.475 -352.83 143 SEG17 2210.5 356 223 SEG96 -1552.5 356
64 D2 765.675 -352.83 144 SEG18 2163.5 356 224 SEG97 -1599.5 356
65 D3 828.875 -352.83 145 SEG19 2116.5 356 225 SEG98 -1646.5 356
66 VSS 890.325 -352.83 146 SEG20 2069.5 356 226 SEG99 -1693.5 356
67 D4 951.275 -352.83 147 SEG21 2022.5 356 227 SEG100 -1740.5 356
68 D5 1013.315 -352.83 148 SEG22 1975.5 356 228 SEG101 -1787.5 356
69 D6 1075.355 -352.83 149 SEG23 1928.5 356 229 SEG102 -1834.5 356
70 D7 1137.395 -352.83 150 SEG24 1881.5 356 230 SEG103 -1881.5 356
71 VSS 1220.735 -352.83 151 SEG25 1834.5 356 231 SEG104 -1928.5 356
72 VSS 1280.735 -352.83 152 SEG26 1787.5 356 232 SEG105 -1975.5 356
73 CLS 1362.585 -352.83 153 SEG27 1740.5 356 233 SEG106 -2022.5 356
74 VDD 1425.285 -352.83 154 SEG28 1693.5 356 234 SEG107 -2069.5 356
75 VDD 1485.885 -352.83 155 SEG29 1646.5 356 235 SEG108 -2116.5 356
76 VDD 1553.185 -352.83 156 SEG30 1599.5 356 236 SEG109 -2163.5 356
77 VDD 1613.185 -352.83 157 SEG31 1552.5 356 237 SEG110 -2210.5 356
78 IREF 1684.585 -352.83 158 SEG32 1505.5 356 238 SEG111 -2257.5 356
79 IREF 1744.585 -352.83 159 SEG33 1458.5 356 239 SEG112 -2304.5 356
80 VCOMH 1815.585 -352.83 160 SEG34 1411.5 356 240 SEG113 -2351.5 356

6 PIN DESCRIPTION
Key:
I = Input NC = Not Connected
O =Output Pull LOW= connect to Ground
I/O = Bi-directional (input/output) Pull HIGH= connect to VDD
P = Power pin
Figure 6-1 Pin Description
Pin Name Type Description

VDD P Power supply pin for core logic operation.
VCC P Power supply for panel driving voltage. This is also the most positive power voltage
supply pin.
VSS P This is a ground pin.
VLSS P This is an analog ground pin. It should be connected to VSS externally.
VCOMH O The pin for COM signal deselected voltage level.

A capacitor should be connected between this pin and VSS.
VDD1 P Reserved pin. It should be kept NC.
BGGND P Reserved pin. It should be connected to ground.
BS[2:0] I MCU bus interface selection pins. Please refer to Table 6-1 for the details of setting.
IREF I This is segment output current reference pin.

When external IREF is used, a resistor should be connected between this pin and VSS to
maintain the IREF current at 19 uA. Please refer to Figure 7-15 for the details of resistor
value.
When internal IREF is used, this pin should be kept NC.
FR O This pin outputs RAM write synchronization signal. Proper timing between MCU data
writing and frame display timing can be achieved to prevent tearing effect.
It should be kept NC if it is not used. Please refer to Section 7.4 for details usage.
CL I This is external clock input pin.

When internal clock is enabled (i.e. HIGH in CLS pin), this pin is not used and should be
connected to VSS. When internal clock is disabled (i.e. LOW in CLS pin), this pin is the
external clock source input pin.
CLS I This is internal clock enable pin. When it is pulled HIGH (i.e. connect to VDD), internal
clock is enabled. When it is pulled LOW, the internal clock is disabled; an external clock
source must be connected to the CL pin for normal operation.
RES# I This pin is reset signal input. When the pin is pulled LOW, initialization of the chip is
executed. Keep this pin HIGH (i.e. connect to VDD) during normal operation.
CS# I This pin is the chip select input. (active LOW).

Pin Name Type Description
D/C# I This is Data/Command control pin. When it is pulled HIGH (i.e. connect to VDD), the data
at D[7:0] is treated as data. When it is pulled LOW, the data at D[7:0] will be transferred
to the command register.
In I2C mode, this pin acts as SA0 for slave address selection.
When 3-wire serial interface is selected, this pin must be connected to VSS.
For detail relationship to MCU interface signals, please refer to the Timing Characteristics
Diagrams: Figure 12-1 to Figure 12-5.
E (RD#) I When interfacing to a 6800-series microprocessor, this pin will be used as the Enable (E)
signal. Read/write operation is initiated when this pin is pulled HIGH (i.e. connect to VDD)
and the chip is selected.
When connecting to an 8080-series microprocessor, this pin receives the Read (RD#)
signal. Read operation is initiated when this pin is pulled LOW and the chip is selected.
When serial or I2C interface is selected, this pin must be connected to VSS.
R/W#(WR#) I This is read / write control input pin connecting to the MCU interface.
When interfacing to a 6800-series microprocessor, this pin will be used as Read/Write
(R/W#) selection input. Read mode will be carried out when this pin is pulled HIGH (i.e.
connect to VDD) and write mode when LOW.
When 8080 interface mode is selected, this pin will be the Write (WR#) input. Data write
operation is initiated when this pin is pulled LOW and the chip is selected.
When serial or I2C interface is selected, this pin must be connected to VSS.
D[7:0] IO These are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus.
When serial interface mode is selected, D0 will be the serial clock input: SCLK; D1 will
be the serial data input: SDIN and D2 should be kept NC.
When I2C mode is selected, D2, D1 should be tied together and serve as SDAout, SDAin in
application and D0 is the serial clock input, SCL.
TR0-TR11 - Testing reserved pins. It should be kept NC.
SEG0 ~ O These pins provide Segment switch signals to OLED panel. These pins are VSS state when
SEG127 display is OFF.
COM0 ~ O These pins provide Common switch signals to OLED panel. They are in high impedance
COM63 state when display is OFF.
NC - This is dummy pin. Do not group or short NC pins together.
Table 6-1 : MCU Bus Interface Pin Selection

2
I C Interface 6800-parallel 8080-parallel 4-wire Serial 3-wire Serial
SSD1308
interface interface interface interface
Pin Name
(8 bit) (8 bit)
BS0 0 0 0 0 1
BS1 1 0 1 0 0
BS2 0 1 1 0 0
Note
(1)
0 is connected to VSS
(2)
1 is connected to VDD

7 FUNCTIONAL BLOCK DESCRIPTIONS
7.1 MCU Interface selection

SSD1308 MCU interface consist of 8 data pins and 5 control pins. The pin assignment at different interface
mode is summarized in Table 7-1. Different MCU mode can be set by hardware selection on BS[2:0] pins
(please refer to Table 6-1 for BS[2:0] setting).
Table 7-1 : MCU interface assignment under different bus interface mode
Pin Name Data/Command Interface Control Signal
Bus
Interface D7 D6 D5 D4 D3 D2 D1 D0
E R/W# CS# D/C# RES#
8-bit 8080 D[7:0] RD# WR# CS# D/C# RES#
8-bit 6800 D[7:0] E R/W# CS# D/C# RES#
3-wire SPI Tie LOW NC SDIN SCLK Tie LOW CS# Tie LOW RES#
4-wire SPI Tie LOW NC SDIN SCLK Tie LOW CS# D/C# RES#
I2C Tie LOW SDAOUT SDAIN SCL Tie LOW SA0 RES#
7.1.1 MCU Parallel 6800-series Interface

The parallel interface consists of 8 bi-directional data pins (D[7:0]), R/W#, D/C#, E and CS#.
A LOW in R/W# indicates WRITE operation and HIGH in R/W# indicates READ operation.
A LOW in D/C# indicates COMMAND read/write and HIGH in D/C# indicates DATA read/write.
The E input serves as data latch signal while CS# is LOW. Data is latched at the falling edge of E signal.
Table 7-2 : Control pins of 6800 interface
Function E R/W# CS# D/C#

Write command ↓ L L L
Read status ↓ H L L
Write data ↓ L L H
Read data ↓ H L H
Note
(1)
↓ stands for falling edge of signal
H stands for HIGH in signal
L stands for LOW in signal
In order to match the operating frequency of display RAM with that of the microprocessor, some pipeline
processing is internally performed which requires the insertion of a dummy read before the first actual display
data read. This is shown in Figure 7-1.

Figure 7-1 : Data read back procedure - insertion of dummy read
R/W#
Databus N n n+1 n+2
Write column
Dummy read Read 1st data Read 2nd data Read 3rd data
address
7.1.2 MCU Parallel 8080-series Interface

The parallel interface consists of 8 bi-directional data pins (D[7:0]), RD#, WR#, D/C# and CS#.
A LOW in D/C# indicates COMMAND read/write and HIGH in D/C# indicates DATA read/write.
A rising edge of RD# input serves as a data READ latch signal while CS# is kept LOW.
A rising edge of WR# input serves as a data/command WRITE latch signal while CS# is kept LOW.
Figure 7-2 : Example of Write procedure in 8080 parallel interface mode

CS#
WR#
D[7:0]
D/C#
high
RD#
low
Figure 7-3 : Example of Read procedure in 8080 parallel interface mode

CS#
RD#
D[7:0]
D/C#
high
WR#
low

Table 7-3 : Control pins of 8080 interface
Function RD# WR# CS# D/C#
Write command H ↑ L L
Read status ↑ H L L
Write data H ↑ L H
Read data ↑ H L H
Note
(1)
↑ stands for rising edge of signal
(2)
(3)
In order to match the operating frequency of display RAM with that of the microprocessor, some pipeline
processing is internally performed which requires the insertion of a dummy read before the first actual display
data read. This is shown in Figure 7-4.
Figure 7-4 : Display data read back procedure - insertion of dummy read
WR#
RD#
Databus N n n+1 n+2
Write column
Dummy read Read 1st data Read 2nd data Read 3rd data
address
7.1.3 MCU Serial Interface (4-wire SPI)
The 4-wire serial interface consists of serial clock: SCLK, serial data: SDIN, D/C#, CS#. In 4-wire SPI mode,
D0 acts as SCLK, D1 acts as SDIN. For the unused data pins, D2 should be left open. The pins from D3 to
D7, E and R/W# (WR#)# can be connected to an external ground.
Table 7-4 : Control pins of 4-wire Serial interface
Function E(RD#) R/W#(WR#) CS# D/C# D0
Write command Tie LOW Tie LOW L L ↑
Write data Tie LOW Tie LOW L H ↑
Note
(1)
(2)
SDIN is shifted into an 8-bit shift register on every rising edge of SCLK in the order of D7, D6, ... D0. D/C#
is sampled on every eighth clock and the data byte in the shift register is written to the Graphic Display Data
RAM (GDDRAM) or command register in the same clock.
Under serial mode, only write operations are allowed.

Figure 7-5 : Write procedure in 4-wire Serial interface mode
CS#
D/C#
SDIN/
DB1 DB2 DBn
SCLK
SCLK
(D0)
SDIN(D1) D7 D6 D5 D4 D3 D2 D1 D0
7.1.4 MCU Serial Interface (3-wire SPI)

The 3-wire serial interface consists of serial clock SCLK, serial data SDIN and CS#.
In 3-wire SPI mode, D0 acts as SCLK, D1 acts as SDIN. For the unused data pins, D2 should be left open.
The pins from D3 to D7, R/W# (WR#)#, E and D/C# can be connected to an external ground.
The operation is similar to 4-wire serial interface while D/C# pin is not used. There are altogether 9-bits will
be shifted into the shift register on every ninth clock in sequence: D/C# bit, D7 to D0 bit. The D/C# bit (first
bit of the sequential data) will determine the following data byte in the shift register is written to the Display
Data RAM (D/C# bit = 1) or the command register (D/C# bit = 0). Under serial mode, only write operations
are allowed.
Table 7-5 : Control pins of 3-wire Serial interface
Function E(RD#) R/W#(WR#) CS# D/C# D0
Write command Tie LOW Tie LOW L Tie LOW ↑ Note
(1)
Write data Tie LOW Tie LOW L Tie LOW ↑ L stands for LOW in signal
Figure 7-6 : Write procedure in 3-wire Serial interface mode
CS#
SDIN/
DB1 DB2 DBn
SCLK
SCLK
(D0)
SDIN(D1) D/C# D7 D6 D5 D4 D3 D2 D1 D0

7.1.5 MCU I2C Interface
The I2C communication interface consists of slave address bit SA0, I2C-bus data signal SDA (SDAOUT/D2 for
output and SDAIN/D1 for input) and I2C-bus clock signal SCL (D0). Both the data and clock signals must be
connected to pull-up resistors. RES# is used for the initialization of device.
a) Slave address bit (SA0)

SSD1308 has to recognize the slave address before transmitting or receiving any information by the
I2C-bus. The device will respond to the slave address following by the slave address bit (“SA0” bit)
and the read/write select bit (“R/W#” bit) with the following byte format,
b7 b6 b5 b4 b3 b2 b1 b0
0 1 1 1 1 0 SA0 R/W#
“SA0” bit provides an extension bit for the slave address. Either “0111100” or “0111101”, can be
selected as the slave address of SSD1308. D/C# pin acts as SA0 for slave address selection.
“R/W#” bit is used to determine the operation mode of the I2C-bus interface. R/W#=1, it is in read
mode. R/W#=0, it is in write mode.
b) I2C-bus data signal (SDA)
SDA acts as a communication channel between the transmitter and the receiver. The data and the
acknowledgement are sent through the SDA.
It should be noticed that the ITO track resistance and the pulled-up resistance at “SDA” pin becomes
a voltage potential divider. As a result, the acknowledgement would not be possible to attain a valid
logic 0 level in “SDA”.
“SDAIN” and “SDAOUT” are tied together and serve as SDA. The “SDAIN” pin must be connected to
act as SDA. The “SDAOUT” pin may be disconnected. When “SDAOUT” pin is disconnected, the
acknowledgement signal will be ignored in the I2C-bus.
c) I2C-bus clock signal (SCL)
The transmission of information in the I2C-bus is following a clock signal, SCL. Each transmission of
data bit is taken place during a single clock period of SCL.

7.1.5.1 I2C-bus Write data
The I2C-bus interface gives access to write data and command into the device. Please refer to Figure 7-7 for
the write mode of I2C-bus in chronological order.
Figure 7-7 : I2C-bus data format
Note: Co – Continuation bit

D/C# – Data / Command Selection bit
ACK – Acknowledgement
SA0 – Slave address bit
R/W# – Read / Write Selection bit
Write mode S – Start Condition / P – Stop Condition
R/W#
ACK
Co
D/C#
ACK
ACK
Co
D/C#
ACK
ACK
P
Control byte Data byte Control byte
S
00 11 111 11 01 Data byte
Slave Address m ≥ 0 words 1 byte n ≥ 0 bytes

MSB ……………….LSB
SA0
R/W#
011110
SSD1308
Slave Address
Co
D/C
ACK
0 0 0 0 0 0
Control byte
7.1.5.2 Write mode for I2C

1) The master device initiates the data communication by a start condition. The definition of the start
condition is shown in Figure 7-8. The start condition is established by pulling the SDA from HIGH to
LOW while the SCL stays HIGH.
2) The slave address is following the start condition for recognition use. For the SSD1308, the slave
address is either “b0111100” or “b0111101” by changing the SA0 to LOW or HIGH (D/C pin acts as
SA0).
3) The write mode is established by setting the R/W# bit to logic “0”.
4) An acknowledgement signal will be generated after receiving one byte of data, including the slave
address and the R/W# bit. Please refer to the Figure 7-9 for the graphical representation of the
acknowledge signal. The acknowledge bit is defined as the SDA line is pulled down during the HIGH
period of the acknowledgement related clock pulse.
5) After the transmission of the slave address, either the control byte or the data byte may be sent across
the SDA. A control byte mainly consists of Co and D/C# bits following by six “0” ‘s.
a. If the Co bit is set as logic “0”, the transmission of the following information will contain
data bytes only.
b. The D/C# bit determines the next data byte is acted as a command or a data. If the D/C# bit is
set to logic “0”, it defines the following data byte as a command. If the D/C# bit is set to
logic “1”, it defines the following data byte as a data which will be stored at the GDDRAM.
The GDDRAM column address pointer will be increased by one automatically after each
data write.
6) Acknowledge bit will be generated after receiving each control byte or data byte.
7) The write mode will be finished when a stop condition is applied. The stop condition is also defined
in Figure 7-8. The stop condition is established by pulling the “SDA in” from LOW to HIGH while
the “SCL” stays HIGH.

Figure 7-8 : Definition of the Start and Stop Condition
tHSTART tSSTOP
SDA SDA
SCL S
SCL
P
START condition STOP condition
Figure 7-9 : Definition of the acknowledgement condition
DATA OUTPUT
BY TRANSMITTER
Non-acknowledge
DATA OUTPUT
BY RECEIVER
Acknowledge
SCL FROM
MASTER 1 2 8 9
S
START Clock pulse for acknowledgement

Condition
Please be noted that the transmission of the data bit has some limitations.
1. The data bit, which is transmitted during each SCL pulse, must keep at a stable state within the “HIGH”
period of the clock pulse. Please refer to the Figure 7-10 for graphical representations. Except in start or
stop conditions, the data line can be switched only when the SCL is LOW.
2. Both the data line (SDA) and the clock line (SCL) should be pulled up by external resistors.
Figure 7-10 : Definition of the data transfer condition
SDA
SCL
Data line is Change

stable of data

7.2 Command Decoder
This module determines whether the input data is interpreted as data or command. Data is interpreted based
upon the input of the D/C# pin.
If D/C# pin is HIGH, D[7:0] is interpreted as display data written to Graphic Display Data RAM (GDDRAM).
If it is LOW, the input at D[7:0] is interpreted as a command. Then data input will be decoded and written to
the corresponding command register.
7.3 Oscillator Circuit and Display Time Generator

Figure 7-11 : Oscillator Circuit and Display Time Generator
Internal
Oscillator
Fosc
M CLK DCLK
Divider
U
CL X Display
Clock
CLS
This module is an on-chip LOW power RC oscillator circuitry. The operation clock (CLK) can be generated
either from internal oscillator or external source CL pin. This selection is done by CLS pin. If CLS pin is
pulled HIGH, internal oscillator is chosen and CL should be left open. Pulling CLS pin LOW disables
internal oscillator and external clock must be connected to CL pins for proper operation. When the internal
oscillator is selected, its output frequency Fosc can be changed by command D5h A[7:4].
The display clock (DCLK) for the Display Timing Generator is derived from CLK. The division factor “D”
can be programmed from 1 to 16 by command D5h
DCLK = FOSC / D
The frame frequency of display is determined by the following formula.

Fosc
FFRM =
D × K × No. of Mux
where
• D stands for clock divide ratio. It is set by command D5h A[3:0]. The divide ratio has the range from 1 to
16.
• K is the number of display clocks per row. The value is derived by
K = Phase 1 period + Phase 2 period + BANK0 pulse width
= 2 + 2 + 50 = 54 at power on reset
(Please refer to Section 7.6 “Segment Drivers / Common Drivers” for the details of the “Phase”)
• Number of multiplex ratio is set by command A8h. The power on reset value is 63 (i.e. 64MUX).
• FOSC is the oscillator frequency. It can be changed by command D5h A[7:4]. The higher the register
setting results in higher frequency.

7.4 FR synchronization
FR synchronization signal can be used to prevent tearing effect.
One frame
FR
100%
Memory
Access
Process
0%
Time
Fast write MCU

Slow write MCU
SSD1308 displaying memory updates to OLED screen
The starting time to write a new image to OLED driver is depended on the MCU writing speed. If MCU can
finish writing a frame image within one frame period, it is classified as fast write MCU. For MCU needs
longer writing time to complete (more than one frame but within two frames), it is a slow write one.
For fast write MCU: MCU should start to write new frame of ram data just after rising edge of FR pulse and
should be finished well before the rising edge of the next FR pulse.
For slow write MCU: MCU should start to write new frame ram data after the falling edge of the 1st FR
pulse and must be finished before the rising edge of the 3rd FR pulse.
7.5 Reset Circuit

When RES# input is LOW, the chip is initialized with the following status:
1. Display is OFF
2. 128 x 64 Display Mode
3. Normal segment and display data column address and row address mapping (SEG0 mapped to
address 00h and COM0 mapped to address 00h)
4. Shift register data clear in serial interface
5. Display start line is set at display RAM address 0
6. Column address counter is set at 0
7. Normal scan direction of the COM outputs
8. Contrast control register is set at 7Fh
9. Normal display mode (Equivalent to A4h command)

7.6 Segment Drivers / Common Drivers
Segment drivers deliver 128 current sources to drive the OLED panel. The driving current can be adjusted
from 0 to 150uA with 256 steps. Common drivers generate voltage-scanning pulses.
The segment driving waveform is divided into three phases:

1. In phase 1, the OLED pixel charges of previous image are discharged in order to prepare for next
image content display.
2. In phase 2, the OLED pixel is driven to the targeted voltage. The pixel is driven to attain the
corresponding voltage level from VSS. The period of phase 2 can be programmed in length from 1 to
15 DCLKs. If the capacitance value of the pixel of OLED panel is larger, a longer period is required
to charge up the capacitor to reach the desired voltage.
3. In phase 3, the OLED driver switches to use current source to drive the OLED pixels and this is the
current drive stage.
Figure 7-12 : Segment Output Waveform in three phases
Segment
VSS
Time
Phase: 1 2 3
After finishing phase 3, the driver IC will go back to phase 1 to display the next row image data. This three-
step cycle is run continuously to refresh image display on OLED panel.
In phase 3, if the length of current drive pulse width is set to 50, after finishing 50 DCLKs in current drive
phase, the driver IC will go back to phase 1 for next row display.

7.7 Graphic Display Data RAM (GDDRAM)
The GDDRAM is a bit mapped static RAM holding the bit pattern to be displayed. The size of the RAM is
128 x 64 bits and the RAM is divided into eight pages, from PAGE0 to PAGE7, which are used for
monochrome 128x64 dot matrix display, as shown in Figure 7-13.
Figure 7-13 : GDDRAM pages structure of SSD1308
Row re-mapping
PAGE0 (COM0-COM7) PAGE0 (COM 63-COM56)
Page 0
Page 1
PAGE2 (COM16-COM23) PAGE2 (COM47-COM40)
Page 2
Page 3
Page 4
Page 5
PAGE6 (COM48–COM55) PAGE6 (COM15-COM8)
Page 6
Page 7
SEG0 ---------------------------------------------SEG127
Column re-mapping SEG127 ---------------------------------------------SEG0
When one data byte is written into GDDRAM, all the rows image data of the same page of the current
column are filled (i.e. the whole column (8 bits) pointed by the column address pointer is filled.). Data bit D0
is written into the top row, while data bit D7 is written into bottom row as shown in Figure 7-14.
Figure 7-14 : Enlargement of GDDRAM (No row re-mapping and column-remapping)

SEG123
SEG134
SEG125
SEG126
SEG127
....................
SEG0
SEG1
SEG2
SEG3
SEG4
LSB D0 COM16
COM17
:
PAGE2 .................... :
:
:
:
MSB D7 COM23
Each box represents one bit of image data
For mechanical flexibility, re-mapping on both Segment and Common outputs can be selected by software as
shown in Figure 7-13.
For vertical shifting of the display, an internal register storing the display start line can be set to control the
portion of the RAM data to be mapped to the display (command D3h).

7.8 SEG/COM Driving block
This block is used to derive the incoming power sources into the different levels of internal use voltage and
current.
• VCC is the most positive voltage supply.
• VCOMH is the Common deselected level. It is internally regulated.
• VLSS is the ground path of the analog and panel current.
• IREF is a reference current source for segment current drivers ISEG. The relationship between reference
current and segment current of a color is:
ISEG = Contrast / 256 x IREF x scale factor
in which
the contrast (0~255) is set by Set Contrast command 81h; and
the scale factor is 8 by default.
Bit A[4] of command ADh is used to select external or internal IREF :

A[4] = ‘0’ Select external IREF [Reset]
A[4] = ‘1’ Enable internal IREF during display ON
When external IREF is used, the magnitude of IREF is controlled by the value of resistor, which is connected
between IREF pin and VSS as shown in Figure 7-15. It is recommended to set IREF to 19 ± 2uA so as to achieve
ISEG = 150uA at maximum contrast 255.
Figure 7-15 : IREF Current Setting by Resistor Value
SSD1308
IREF ~ 19uA IREF (voltage at

this pin =
VCC – 2.5)
R1
VSS
Since the voltage at IREF pin is VCC – 2.5V, the value of resistor R1 can be found as below:
For IREF = 19uA, VCC =12V:
R1 = (Voltage at IREF – VSS) / IREF

= (12 – 2.5) / 19uA
= 500KΩ
When internal IREF is used, the IREF pin should be kept NC and the ISEG is set as 150uA .

7.9 Power ON and OFF sequence
The following figures illustrate the recommended power ON and power OFF sequence of SSD1308
Power ON sequence:
1. Power ON VDD
2. After VDD become stable, set RES# pin LOW (logic low) for at least 3us (t1) (4) and then HIGH (logic
high).
3. After set RES# pin LOW (logic low), wait for at least 3us (t2). Then Power ON VCC.(1)
4. After VCC become stable, send command AFh for display ON. SEG/COM will be ON after 100ms
(tAF).
Figure 7-16 : The Power ON sequence
ON VDD RES# ON VCC Send AFh command for Display ON
VDD
OFF
t1
RES#
GND
t2
VCC
OFF
tAF
ON
SEG/COM
OFF
Power OFF sequence:

1. Send command AEh for display OFF.
2. Power OFF VCC.(1), (2), (3)
3. Power OFF VDD after tOFF. (5) (Typical tOFF=100ms)
Figure 7-17 : The Power OFF sequence
Send command AEh for display OFF OFF VCC OFF VDD
VCC
OFF
tOFF
VDD
OFF
Note:
(1)
Since an ESD protection circuit is connected between VDD and VCC, VCC becomes lower than VDD whenever VDD is
ON and VCC is OFF as shown in the dotted line of VCC in Figure 7-16 and Figure 7-17.
(2)
VCC should be kept float (i.e. disable) when it is OFF.
(3)
Power Pins (VDD , VCC) can never be pulled to ground under any circumstance.
(4)
The register values are reset after t1.
(5)
VDD should not be Power OFF before VCC Power OFF.

8 COMMAND TABLE
Table 8-1: Command Table
(D/C#=0, R/W#(WR#) = 0, E(RD#=1) unless specific setting is stated)
Fundamental Command Table

D/C# Hex D7 D6 D5 D4 D3 D2 D1 D0 Command Description
0 00~0F 0 0 0 0 X3 X2 X1 X0 Set Lower Column Set the lower nibble of the column start
Start Address for address register for Page Addressing Mode
Page Addressing using X[3:0] as data bits. The initial display
Mode line register is reset to 0000b after RESET.
Note
(1)
This command is only for page addressing mode
0 10~1F 0 0 0 1 X3 X2 X1 X0 Set Higher Column Set the higher nibble of the column start
Start Address for address register for Page Addressing Mode
Page Addressing using X[3:0] as data bits. The initial display
Mode line register is reset to 0000b after RESET.
Note
(1)
0 20 0 0 1 0 0 0 0 0 Set Memory A[1:0] = 00b, Horizontal Addressing Mode

0 A[1:0] * * * * * * A1 A0 Addressing Mode A[1:0] = 01b, Vertical Addressing Mode
A[1:0] = 10b, Page Addressing Mode
(RESET)
A[1:0] = 11b, Invalid
0 21 0 0 1 0 0 0 0 1 Set Column Address Setup column start and end address

0 A[6:0] * A6 A5 A4 A3 A2 A1 A0 A[6:0] : Column start address, range : 0-127d,
0 B[6:0] * B6 B5 B4 B3 B2 B1 B0 (RESET=0d)
B[6:0]: Column end address, range : 0-127d,

(RESET =127d)
Note
(1)
This command is only for horizontal or vertical
addressing mode.
0 22 0 0 1 0 0 0 1 0 Set Page Address Setup page start and end address

0 A[2:0] * * * * * A2 A1 A0 A[2:0] : Page start Address, range : 0-7d,
0 B[2:0] * * * * * B2 B1 B0 (RESET = 0d)
B[2:0] : Page end Address, range : 0-7d,
(RESET = 7d)
Note
(1)
This command is only for horizontal or vertical
addressing mode.
0 40~7F 0 1 X5 X4 X3 X2 X1 X0 Set Display Start Set display RAM display start line register
Line from 0-63 using X5X3X2X1X0.
Display start line register is reset to 000000b
during RESET.
0 81 1 0 0 0 0 0 0 1 Set Contrast Control Double byte command to select 1 out of 256

0 A[7:0] A7 A6 A5 A4 A3 A2 A1 A0 contrast steps. Contrast increases as the value
increases.
(RESET = 7Fh )

0 A0/A1 1 0 1 0 0 0 0 X0 Set Segment Re-map A0h, X[0]=0b: column address 0 is mapped to
SEG0 (RESET)
A1h, X[0]=1b: column address 127 is mapped
to SEG0
0 A4/A5 1 0 1 0 0 1 0 X0 Entire Display ON A4h, X0=0b: Resume to RAM content display
(RESET)
Output follows RAM content
A5h, X0=1b: Entire display ON
Output ignores RAM content
0 A6/A7 1 0 1 0 0 1 1 X0 Set Normal/Inverse A6h, X[0]=0b: Normal display (RESET)
Display 0 in RAM: OFF in display panel
1 in RAM: ON in display panel
A7h, X[0]=1b: Inverse display
0 in RAM: ON in display panel
1 in RAM: OFF in display panel
0 A8 1 0 1 0 1 0 0 0 Set Multiplex Ratio Set MUX ratio to N+1 MUX
0 A[5:0] * * A5 A4 A3 A2 A1 A0 N=A[5:0] : from 16MUX to 64MUX, RESET=
111111b (i.e. 63d, 64MUX)
A[5:0] from 0 to 14 are invalid entry.
0 AD 1 0 1 0 1 1 0 1 External or internal Select external or internal IREF :

0 A[4] 0 0 0 A4 0 0 0 0 IREF Selection A[4] = ‘0’ Select external IREF (RESET)
A[4] = ‘1’ Enable internal IREF during display
ON
Note
(1)
Refer to section 7.8 for details.
0 AE 1 0 1 0 1 1 1 X0 Set Display ON/OFF AEh, X[0]=0b:Display OFF (sleep mode) (RESET)
AF AFh X[0]=1b:Display ON in normal mode
0 B0~B7 1 0 1 1 0 X2 X1 X0 Set Page Start Set GDDRAM Page Start Address

Address for Page (PAGE0~PAGE7) for Page Addressing Mode
Addressing Mode using X[2:0].
Note
(1)
0 C0/C8 1 1 0 0 X3 0 0 0 Set COM Output C0h, X[3]=0b: normal mode (RESET) Scan
Scan Direction from COM0 to COM[N –1]
C8h, X[3]=1b: remapped mode. Scan from
COM[N-1] to COM0
Where N is the Multiplex ratio.
0 D3 1 1 0 1 0 0 1 1 Set Display Offset Set vertical shift by COM from 0d~63d

0 A[5:0] * * A5 A4 A3 A2 A1 A0 The value is reset to 00h after RESET.
0 D5 1 1 0 1 0 1 0 1 Set Display Clock A[3:0] : Define the divide ratio (D) of the
0 A[7:0] A7 A6 A5 A4 A3 A2 A1 A0 Divide display clocks (DCLK):
Ratio/Oscillator Divide ratio= A[3:0] + 1, RESET is
Frequency 0000b (divide ratio = 1)
A[7:4] : Set the Oscillator Frequency, FOSC.

Oscillator Frequency increases with
the value of A[7:4] and vice versa.
RESET is 1000b
Range:0000b~1111b
Frequency increases as setting value
increases.

0 D9 1 1 0 1 1 0 0 1 Set Pre-charge A[3:0] : Phase 1 period of up to 15 DCLK
0 A[7:0] A7 A6 A5 A4 A3 A2 A1 A0 Period clocks 0 is invalid entry
(RESET=2h)
A[7:4] : Phase 2 period of up to 15 DCLK

clocks 0 is invalid entry
(RESET=2h )
0 DA 1 1 0 1 1 0 1 0 Set COM Pins A[4]=0b, Sequential COM pin configuration

0 A[5:4] 0 0 A5 A4 0 0 1 0 Hardware A[4]=1b(RESET), Alternative COM pin
Configuration configuration
A[5]=0b(RESET), Disable COM Left/Right

remap
A[5]=1b, Enable COM Left/Right remap
0 DB 1 1 0 1 1 0 1 1 Set VCOMH Deselect A[6:4] Hex V COMH deselect level

0 A[6:4] 0 A6 A5 A4 0 0 0 0 Level code
000b 00h ~ 0.65 x VCC
010b 20h ~ 0.77 x VCC (RESET)
011b 30h ~ 0.83 x VCC
0 E3 1 1 1 0 0 0 1 1 NOP Command for no operation
2. Scrolling Command Table

0 26/27 0 0 1 0 0 1 1 X0 Continuous 26h, X[0]=0, Right Horizontal Scroll
0 A[7:0] 0 0 0 0 0 0 0 0 Horizontal 27h, X[0]=1, Left Horizontal Scroll
0 B[2:0] * * * * * B2 B1 B0 Scroll Setup (Horizontal scroll by 1 column)
0 C[2:0] * * * * * C2 C1 C0 A[7:0] : Dummy byte (Set as 00h)
0 D[2:0] * * * * * D2 D1 D0 B[2:0] : Define start page address
0 E[7:0] 0 0 0 0 0 0 0 0 000b – PAGE0 011b – PAGE3 110b – PAGE6
0 F[7:0] 1 1 1 1 1 1 1 1 001b – PAGE1 100b – PAGE4 111b – PAGE7
010b – PAGE2 101b – PAGE5
C[2:0] : Set time interval between each scroll step in
terms of frame frequency
000b – 5 frames 100b – 3 frames
010b – 128 frames 110b – 25 frame
011b – 256 frames 111b – 2 frame
D[2:0] : Define end page address
000b – PAGE0 011b – PAGE3 110b – PAGE6
The value of D[2:0] must be larger or equal to
B[2:0]
E[7:0] : Dummy byte (Set as 00h)
F[7:0] : Dummy byte (Set as FFh)

0 29/2A 0 0 1 0 1 0 X1 X0 Continuous 29h, X1X0=01b : Vertical and Right Horizontal Scroll
0 A[2:0] 0 0 0 0 0 0 0 0 Vertical and 2Ah, X1X0=10b : Vertical and Left Horizontal Scroll
0 B[2:0] * * * * * B2 B1 B0 Horizontal (Horizontal scroll by 1 column)
0 C[2:0] * * * * * C2 C1 C0 Scroll Setup A[7:0] : Dummy byte
0 D[2:0] * * * * * D2 D1 D0
0 E[5:0] * * E5 E4 E3 E2 E1 E0 B[2:0] : Define start page address
C[2:0] : Set time interval between each scroll step in

terms of frame frequency
010b – 128 frames 110b – 25 frame
011b – 256 frames 111b – 2 frame
D[2:0] : Define end page address

The value of D[2:0] must be larger or equal
to B[2:0]
E[5:0] : Vertical scrolling offset

e.g. E[5:0]= 01h refer to offset =1 row
E[5:0] =3Fh refer to offset =63 rows
Note
(1)
No continuous vertical scrolling is available.
0 2E 0 0 1 0 1 1 1 0 Deactivate Stop scrolling that is configured by command

scroll 26h/27h/29h/2Ah.
Note
(1)
After sending 2Eh command to deactivate the scrolling
action, the ram data needs to be rewritten.
0 2F 0 0 1 0 1 1 1 1 Activate Start scrolling that is configured by the scrolling setup

scroll commands :26h/27h/29h/2Ah with the following valid
sequences:
Valid command sequence 1: 26h ;2Fh.

Valid command sequence 4: 2Ah ;2Fh.
For example, if “26h; 2Ah; 2Fh.” commands are

issued, the setting in the last scrolling setup command,
i.e. 2Ah in this case, will be executed. In other words,
setting in the last scrolling setup command overwrites
the setting in the previous scrolling setup commands.

0 A3 1 0 1 0 0 0 1 1 Set Vertical A[5:0] : Set No. of rows in top fixed area. The No. of
0 A[5:0] * * A5 A4 A3 A2 A1 A0 Scroll Area rows in top fixed area is referenced to the top
0 B[6:0] * B6 B5 B4 B3 B2 B1 B0 of the GDDRAM (i.e. row 0).[RESET = 0]
B[6:0] : Set No. of rows in scroll area. This is the

number of rows to be used for vertical
scrolling. The scroll area starts in the first
row below the top fixed area. [RESET = 64]
Note
(1)
A[5:0]+B[6:0] <= MUX ratio
(2)
B[6:0] <= MUX ratio
(3a)
Vertical scrolling offset (E[5:0] in 29h/2Ah) <
B[6:0]
(3b)
Set Display Start Line (X5X4X3X2X1X0 of
40h~7Fh) < B[6:0]
(4)
The last row of the scroll area shifts to the first row
of the scroll area.
(5)
For 64d MUX display
A[5:0] = 0, B[6:0]=64 : whole area scrolls
A[5:0]= 0, B[6:0] < 64 : top area scrolls
A[5:0] + B[6:0] < 64 : central area scrolls
A[5:0] + B[6:0] = 64 : bottom area scrolls
Note
(1) “*” stands for “Don’t care”.

Table 8-2 : Read Command Table
Bit Pattern Command Description
D7D6D5D4D3D2D1D0 Status Register Read D[7] : Reserved
D[6] : “1” for display OFF / “0” for display ON
D[5] : Reserved
D[4] : Reserved
D[3] : Reserved
D[2] : Reserved
D[1] : Reserved
D[0] : Reserved
Note
(1)
Patterns other than those given in the Command Table are prohibited to enter the chip as a command; as unexpected
results can occur.
8.1 Data Read / Write

To read data from the GDDRAM, select HIGH for both the R/W# (WR#) pin and the D/C# pin for 6800-
series parallel mode and select LOW for the E (RD#) pin and HIGH for the D/C# pin for 8080-series parallel
mode. No data read is provided in serial mode operation.
In normal data read mode the GDDRAM column address pointer will be increased automatically by one after
each data read.
Also, a dummy read is required before the first data read.
To write data to the GDDRAM, select LOW for the R/W# (WR#) pin and HIGH for the D/C# pin for both
6800-series parallel mode and 8080-series parallel mode. The serial interface mode is always in write mode.
The GDDRAM column address pointer will be increased automatically by one after each data write.
Table 8-3 : Address increment table (Automatic)

D/C# R/W# (WR#) Comment Address Increment
0 0 Write Command No
0 1 Read Status No
1 0 Write Data Yes
1 1 Read Data Yes

9 COMMAND DESCRIPTIONS
9.1 Fundamental Command
9.1.1 Set Lower Column Start Address for Page Addressing Mode (00h~0Fh)
This command specifies the lower nibble of the 8-bit column start address for the display data RAM under
Page Addressing Mode. The column address will be incremented by each data access. Please refer to Section
Table 8-1 and Section 9.1.3 for details.
9.1.2 Set Higher Column Start Address for Page Addressing Mode (10h~1Fh)
This command specifies the higher nibble of the 8-bit column start address for the display data RAM under
Page Addressing Mode. The column address will be incremented by each data access. Please refer to Section
Table 8-1 and Section 9.1.3 for details.
9.1.3 Set Memory Addressing Mode (20h)

There are 3 different memory addressing mode in SSD1308: page addressing mode, horizontal addressing
mode and vertical addressing mode. This command sets the way of memory addressing into one of the above
three modes. In there, “COL” means the graphic display data RAM column.
Page addressing mode (A[1:0]=10xb)

In page addressing mode, after the display RAM is read/written, the column address pointer is increased
automatically by 1. If the column address pointer reaches column end address, the column address pointer is
reset to column start address and page address pointer is not changed. Users have to set the new page and
column addresses in order to access the next page RAM content. The sequence of movement of the PAGE
and column address point for page addressing mode is shown in Figure 9-1.
Figure 9-1 : Address Pointer Movement of Page addressing mode
COL0 COL 1 ….. COL 126 COL 127
PAGE0
PAGE1
: : : : : :
PAGE6
PAGE7
In normal display data RAM read or write and page addressing mode, the following steps are required to
define the starting RAM access pointer location:
• Set the page start address of the target display location by command B0h to B7h.
• Set the lower start column address of pointer by command 00h~0Fh.
• Set the upper start column address of pointer by command 10h~1Fh.
For example, if the page address is set to B2h, lower column address is 03h and upper column address is 10h,
then that means the starting column is SEG3 of PAGE2. The RAM access pointer is located as shown in
Figure 9-2. The input data byte will be written into RAM position of column 3.
Figure 9-2 : Example of GDDRAM access pointer setting in Page Addressing Mode (No row and column-
remapping)
SEG0 SEG3 (Starting column) SEG127
RAM access pointer
LSB D0 COM16
Each lattice represents COM17
one bit of image data :
PAGE2
(Starting page)
.................... :
:
:
:
MSB D7 COM23

Horizontal addressing mode (A[1:0]=00b)
In horizontal addressing mode, after the display RAM is read/written, the column address pointer is increased
automatically by 1. If the column address pointer reaches column end address, the column address pointer is
reset to column start address and page address pointer is increased by 1. The sequence of movement of the
page and column address point for horizontal addressing mode is shown in Figure 9-3. When both column
and page address pointers reach the end address, the pointers are reset to column start address and page start
address (Dotted line in Figure 9-3.)
Figure 9-3 : Address Pointer Movement of Horizontal addressing mode

PAGE0
PAGE1
: : : : : :
PAGE6
PAGE7
Vertical addressing mode: (A[1:0]=01b)

In vertical addressing mode, after the display RAM is read/written, the page address pointer is increased
automatically by 1. If the page address pointer reaches the page end address, the page address pointer is reset
to page start address and column address pointer is increased by 1. The sequence of movement of the page
and column address point for vertical addressing mode is shown in Figure 9-4. When both column and page
address pointers reach the end address, the pointers are reset to column start address and page start address
(Dotted line in Figure 9-4.)
Figure 9-4 : Address Pointer Movement of Vertical addressing mode

PAGE0 …..
PAGE1 …..
: :
PAGE6 …..
PAGE7 …..
In normal display data RAM read or write and horizontal / vertical addressing mode, the following steps are
required to define the RAM access pointer location:
• Set the column start and end address of the target display location by command 21h.
• Set the page start and end address of the target display location by command 22h.
Example is shown in Figure 9-5.
9.1.4 Set Column Address (21h)

This triple byte command specifies column start address and end address of the display data RAM. This
command also sets the column address pointer to column start address. This pointer is used to define the
current read/write column address in graphic display data RAM. If horizontal address increment mode is
enabled by command 20h, after finishing read/write one column data, it is incremented automatically to the
next column address. Whenever the column address pointer finishes accessing the end column address, it is
reset back to start column address and the row address is incremented to the next row.

9.1.5 Set Page Address (22h)
This triple byte command specifies page start address and end address of the display data RAM. This
command also sets the page address pointer to page start address. This pointer is used to define the current
read/write page address in graphic display data RAM. If vertical address increment mode is enabled by
command 20h, after finishing read/write one page data, it is incremented automatically to the next page
address. Whenever the page address pointer finishes accessing the end page address, it is reset back to start
page address.
The figure below shows the way of column and page address pointer movement through the example: column
start address is set to 2 and column end address is set to 125, page start address is set to 1 and page end
address is set to 6; Horizontal address increment mode is enabled by command 20h. In this case, the graphic
display data RAM column accessible range is from column 2 to column 125 and from page 1 to page 6 only.
In addition, the column address pointer is set to 2 and page address pointer is set to 1. After finishing
read/write one pixel of data, the column address is increased automatically by 1 to access the next RAM
location for next read/write operation (solid line in Figure 9-5). Whenever the column address pointer
finishes accessing the end column 125, it is reset back to column 2 and page address is automatically
increased by 1 (solid line in Figure 9-5). While the end page 6 and end column 125 RAM location is
accessed, the page address is reset back to 1 and the column address is reset back to 2 (dotted line in Figure
9-5). .
Figure 9-5 : Example of Column and Row Address Pointer Movement
Col 0 Col 1 Col 2 ….. ……. Col 125 Col 126 Col 127
PAGE0
PAGE1
: :
PAGE6
PAGE7 :
9.1.6 Set Display Start Line (40h~7Fh)

This command sets the Display Start Line register to determine starting address of display RAM, by selecting
a value from 0 to 63. With value equal to 0, RAM row 0 is mapped to COM0. With value equal to 1, RAM
row 1 is mapped to COM0 and so on.
Refer to Table 9-1 for more illustrations.
9.1.7 Set Contrast Control for BANK0 (81h)

This command sets the Contrast Setting of the display. The chip has 256 contrast steps from 00h to FFh. The
segment output current increases as the contrast step value increases.
9.1.8 Set Segment Re-map (A0h/A1h)

This command changes the mapping between the display data column address and the segment driver. It
allows flexibility in OLED module design. Please refer to Table 8-1.
This command only affects subsequent data input. Data already stored in GDDRAM will have no changes.

9.1.9 Entire Display ON (A4h/A5h)
A4h command enable display outputs according to the GDDRAM contents.
If A5h command is issued, then by using A4h command, the display will resume to the GDDRAM contents.
In other words, A4h command resumes the display from entire display “ON” stage.
A5h command forces the entire display to be “ON”, regardless of the contents of the display data RAM.
9.1.10 Set Normal/Inverse Display (A6h/A7h)

This command sets the display to be either normal or inverse. In normal display a RAM data of 1 indicates an
“ON” pixel while in inverse display a RAM data of 0 indicates an “ON” pixel.
9.1.11 Set Multiplex Ratio (A8h)

This command switches the default 63 multiplex mode to any multiplex ratio, ranging from 16 to 63. The
output pads COM0~COM63 will be switched to the corresponding COM signal.
9.1.12 External or internal IREF Selection (ADh)

This command selects the external IREF or internal IREF. Refer to Section 7.8 for details.
9.1.13 Set Display ON/OFF (AEh/AFh)

These single byte commands are used to turn the OLED panel display ON or OFF.
When the display is ON, the selected circuits by Set Master Configuration command will be turned ON.
When the display is OFF, those circuits will be turned OFF and the segment and common output are in VSS
state and high impedance state, respectively. These commands set the display to one of the two states:
o AEh : Display OFF
o AFh : Display ON
Figure 9-6 :Transition between different modes

AFh
Normal mode Sleep mode
AEh
9.1.14 Set Page Start Address for Page Addressing Mode (B0h~B7h)
This command positions the page start address from 0 to 7 in GDDRAM under Page Addressing Mode.
Please refer to Table 8-1 and Section 9.1.3 for details.
9.1.15 Set COM Output Scan Direction (C0h/C8h)

This command sets the scan direction of the COM output, allowing layout flexibility in the OLED module
design. Additionally, the display will show once this command is issued. For example, if this command is
sent during normal display then the graphic display will be vertically flipped immediately. Please refer to
Table 9-3 for details.
9.1.16 Set Display Offset (D3h)

This is a double byte command. The second command specifies the mapping of the display start line to one of
COM0~COM63 (assuming that COM0 is the display start line then the display start line register is equal to 0).

For example, to move the COM16 towards the COM0 direction by 16 lines the 6-bit data in the second byte
should be given as 010000b. To move in the opposite direction by 16 lines the 6-bit data should be given by
64 – 16, so the second byte would be 100000b. The following two tables (Table 9-1, Table 9-2) show the
example of setting the command C0h/C8h and D3h.
Table 9-1 : Example of Set Display Offset and Display Start Line with no Remap
Output
64 64 64 56 56 56 Set MUX ratio(A8h)
Normal Normal Normal Normal Normal Normal COM Normal / Remapped (C0h / C8h)
Hardware 0 8 0 0 8 0 Display offset (D3h)
pin name 0 0 8 0 0 8 Display start line (40h - 7Fh)
COM0 Row0 RAM0 Row8 RAM8 Row0 RAM8 Row0 RAM0 Row8 RAM8 Row0 RAM8
COM48 Row48 RAM48 Row56 RAM56 Row48 RAM56 Row48 RAM48 - - Row48 RAM56
COM56 Row56 RAM56 Row0 RAM0 Row56 RAM0 - - Row0 RAM0 - -
Display
(a) (b) (c) (d) (e) (f)
examples
(a) (b) (c) (d)
(e) (f) (RAM)

Table 9-2 :Example of Set Display Offset and Display Start Line with Remap
Output
64 64 64 48 48 48 48 Set MUX ratio(A8h)
Remap Remap Remap Remap Remap Remap Remap COM Normal / Remapped (C0h / C8h)
Hardware 0 8 0 0 8 0 8 Display offset (D3h)
pin name 0 0 8 0 0 8 16 Display start line (40h - 7Fh)
COM0 Row63 RAM63 Row7 RAM7 Row63 RAM7 Row47 RAM47 - - Row47 RAM55 - -
COM8 Row55 RAM55 Row63 RAM63 Row55 RAM63 Row39 RAM39 Row47 RAM47 Row39 RAM47 Row47 RAM63
COM48 Row15 RAM15 Row23 RAM23 Row15 RAM23 - - Row7 RAM7 - - Row7 RAM23
COM56 Row7 RAM7 Row15 RAM15 Row7 RAM15 - - - - - - - -
Display
(a) (b) (c) (d) (e) (f) (g)
examples
(a) (b) (c) (d)
(e) (f) (g) (RAM)

9.1.17 Set Display Clock Divide Ratio/ Oscillator Frequency (D5h)
This command consists of two functions:
• Display Clock Divide Ratio (D)(A[3:0])

Set the divide ratio to generate DCLK (Display Clock) from CLK. The divide ratio is from 1 to 16,
with reset value = 1. Please refer to section 7.3 for the details relationship of DCLK and CLK.
• Oscillator Frequency (A[7:4])

Program the oscillator frequency Fosc that is the source of CLK if CLS pin is pulled high. The 4-bit
value results in 16 different frequency settings available as shown below. The default setting is
1000b.
9.1.18 Set Pre-charge Period (D9h)

This command is used to set the duration of the pre-charge period. The interval is counted in number of
DCLK, where RESET equals 2 DCLKs.
9.1.19 Set COM Pins Hardware Configuration (DAh)

This command sets the COM signals pin configuration to match the OLED panel hardware layout. The table
below shows the COM pin configuration under different conditions (for MUX ratio =64):
Table 9-3 : COM Pins Hardware Configuration
Conditions COM pins Configurations
1 Sequential COM pin configuration (DAh A[4] =0) ROW63
COM output Scan direction: from COM0 to COM63 (C0h)
Disable COM Left/Right remap (DAh A[5] =0) ROW32 ROW31
128x 64
ROW0
COM32 COM0
SSD1308Z
COM63 COM31
Pad 1,2,3,…->126
Gold Bumps face up
Enable COM Left/Right remap (DAh A[5] =1)
ROW31 ROW32
128 x 64
ROW0
COM32 COM0
SSD1308Z
COM63
Pad 1,2,3,…->126
Gold Bumps face up

Disable COM Left/Right remap (DAh A[5] =0) ROW31 ROW32
128 x 64
ROW63
COM32 COM0
SSD1308Z
COM63 COM31
Pad 1,2,3,…->126
Gold Bumps face up
ROW32 ROW31
128 x 64
ROW63
COM32 COM0
SSD1308Z
COM63 COM31
Pad 1,2,3,…->126
Gold Bumps face up
5 Alternative COM pin configuration (DAh A[4] =1) ROW63 ROW62
Disable COM Left/Right remap (DAh A[5] =0) ROW61
128 x 64
ROW1 ROW2
ROW0
COM32 COM0
SSD1308Z COM1
COM62
COM63 COM31
Pad 1,2,3,…->126
Gold Bumps face up

ROW61
128 x 64
ROW2
ROW1
ROW0
COM32 COM0
COM33
SSD1308Z
COM30
COM63
COM31
Pad 1,2,3,…->126
Gold Bumps face up
7 Alternative COM pin configuration (DAh A[4] =1) ROW0
ROW1
COM output Scan direction: from COM63 to COM0(C8h)
Disable COM Left/Right remap (DAh A[5] =0) ROW2
128 x 64
ROW62 ROW61
ROW63
COM32 COM0
SSD1308Z COM1
COM62
COM63 COM31
Pad 1,2,3,…->126
Gold Bumps face up
COM output Scan direction: from COM63 to COM0(C8h) ROW2
128 x 64
ROW61
ROW62
ROW63
COM32 COM0
COM33
SSD1308Z
COM30
COM63
COM31
Pad 1,2,3,…->126
Gold Bumps face up

9.1.20 Set VCOMH Deselect Level (DBh)
This command adjusts the VCOMH regulator output.
9.1.21 NOP (E3h)

No Operation Command
9.1.22 Status register Read

This command is issued by setting D/C# ON LOW during a data read (See Figure 12-1 to Figure 12-2 for
parallel interface waveform). It allows the MCU to monitor the internal status of the chip. No status read is
provided for serial mode.

9.2 Graphic Acceleration Command
9.2.1 Horizontal Scroll Setup (26h/27h)
This command consists of consecutive bytes to set up the horizontal scroll parameters and determines the
scrolling start page, end page and scrolling speed.
Before issuing this command the horizontal scroll must be deactivated (2Eh). Otherwise, RAM content may
be corrupted.
The SSD1308 horizontal scroll is designed for 128 columns scrolling. The following two figures (Figure 9-7,
Figure 9-8, Figure 9-9) show the examples of using the horizontal scroll:
Figure 9-7 : Horizontal scroll example: Scroll RIGHT by 1 column

SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG122
SEG123
SEG124
SEG125
SEG126
SEG127
Original Setting
SEG127
SEG121
SEG122
SEG123
SEG124
SEG125
SEG126
After one scroll
SEG0
SEG1
SEG2
SEG3
SEG4
step
…
Figure 9-8 : Horizontal scroll example: Scroll LEFT by 1 column

SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG122
SEG123
SEG124
SEG125
SEG126
SEG127
Original
Setting
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG123
SEG124
SEG125
SEG126
SEG127
SEG0
After one
scroll step
Figure 9-9 : Horizontal scrolling setup example

9.2.2 Continuous Vertical and Horizontal Scroll Setup (29h/2Ah)
This command consists of 6 consecutive bytes to set up the continuous vertical scroll parameters and
determines the scrolling start page, end page, scrolling speed and vertical scrolling offset.
The bytes B[2:0], C[2:0] and D[2:0] of command 29h/2Ah are for the setting of the continuous horizontal
scrolling. The byte E[5:0] is for the setting of the continuous vertical scrolling offset. All these bytes together
are for the setting of continuous diagonal (horizontal + vertical) scrolling. If the vertical scrolling offset byte
E[5:0] is set to zero, then only horizontal scrolling is performed (like command 26/27h).
Before issuing this command the scroll must be deactivated (2Eh). Otherwise, RAM content may be
corrupted. The following figure (Figure 9-10 ) show the example of using the continuous vertical and
horizontal scroll:
Figure 9-10 : Continuous Vertical and Horizontal scrolling setup example
9.2.3 Deactivate Scroll (2Eh)

This command stops the motion of scrolling. After sending 2Eh command to deactivate the scrolling action,
the ram data needs to be rewritten.
9.2.4 Activate Scroll (2Fh)

This command starts the motion of scrolling and should only be issued after the scroll setup parameters have
been defined by the scrolling setup commands :26h/27h/29h/2Ah . The setting in the last scrolling setup
command overwrites the setting in the previous scrolling setup commands.
The following actions are prohibited after the scrolling is activated

1. RAM access (Data write or read)
2. Changing the horizontal scroll setup parameters
9.2.5 Set Vertical Scroll Area(A3h)

This command consists of 3 consecutive bytes to set up the vertical scroll area. For the continuous vertical
scroll function (command 29/2Ah), the number of rows that in vertical scrolling can be set smaller or equal to
the MUX ratio.

10 MAXIMUM RATINGS
Table 10-1 : Maximum Ratings (Voltage Referenced to VSS)
Symbol Parameter Value Unit
VDD -0.3 to +4 V
Supply Voltage
VCC 0 to 16 V
VSEG SEG output voltage 0 to VCC V
VCOM COM output voltage 0 to 0.9*VCC V
Vin Input voltage VSS-0.3 to VDD+0.3 V
TA Operating Temperature -40 to +85 ºC
Tstg Storage Temperature Range -65 to +150 ºC
Maximum ratings are those values beyond which damages to the device may occur. Functional operation should be restricted to the
limits in the Electrical Characteristics tables or Pin Description section
This device may be light sensitive. Caution should be taken to avoid exposure of this device to any light source during normal
operation. This device is not radiation protected.

11 DC CHARACTERISTICS
Condition (Unless otherwise specified):

Voltage referenced to VSS
VDD = 1.65 to 3.3V
TA = 25°C
Table 11-1 : DC Characteristics

Symbol Parameter Test Condition Min Typ Max Unit
VCC Operating Voltage - 7 - 15 V
V
VDD Logic Supply Voltage - 1.65 - 3.3
VOH High Logic Output Level IOUT = 100uA, 3.3MHz 0.9 x VDD - - V
VOL Low Logic Output Level IOUT = 100uA, 3.3MHz - - 0.1 x VDD V
VIH High Logic Input Level - 0.8 x VDD - - V
VIL Low Logic Input Level - - - 0.2 x VDD V
ICC, SLEEP ICC, Sleep mode Current VDD = 1.65V~3.3V, VCC = 7V~15V
- - 10 uA
Display OFF, No panel attached
IDD, SLEEP IDD, Sleep mode Current VDD = 1.65V~3.3V, VCC = 7V~15V
- - 10 uA
Display OFF, No panel attached
VCC Supply Current
VDD = 2.8V, VCC = 12V,
ICC IREF = 19uA - 600 950 uA
No loading, Display ON, All
ON Contrast = FFh
VDD Supply Current
VDD = 2.8V, VCC = 12V,
IDD
IREF = 19uA - 50 150 uA
No loading, Display ON, All
ON
Segment Output Current Contrast=FFh - 150 -
ISEG Contrast=AFh - 102 - uA
VDD=2.8V, VCC=12V,
IREF =19uA, Display ON. Contrast=3Fh - 36 -
Dev = (ISEG – IMID)/IMID
Segment output current IMID = (IMAX + IMIN)/2
Dev -3 - +3 %
uniformity ISEG[0:131] = Segment current at
contrast = FFh
Adjacent pin output current Adj Dev = (I[n]-I[n+1]) /
Adj. Dev -2 - +2 %
uniformity (contrast = FF) (I[n]+I[n+1])

12 AC CHARACTERISTICS
Conditions:
Voltage referenced to VSS
VDD=1.65 to3.3V
TA = 25°C
Table 12-1 : AC Characteristics

Symbol Parameter Test Condition Min Typ Max Unit
FOSC (1) Oscillation Frequency of Display VDD = 2.8V 333 370 407 kHz
Timing Generator
FFRM Frame Frequency for 64 MUX 128x64 Graphic Display Mode, - FOSC x 1/(DxKx64) - Hz
(2)
Mode Display ON, Internal Oscillator
Enabled
RES# Reset low pulse width 3 - - us
Note
(1)
FOSC stands for the frequency value of the internal oscillator and the value is measured when command D5h A[7:4] is
in default value.
(2)
D: divide ratio (default value = 1)
K: number of display clocks (default value = 54)
Please refer to Table 8-1 (Set Display Clock Divide Ratio/Oscillator Frequency, D5h) for detailed description

Table 12-2 : 6800-Series MCU Parallel Interface Timing Characteristics
(VDD - VSS = 1.65V to 3.3V, TA = 25°C)
Symbol Parameter Min Typ Max Unit
tcycle Clock Cycle Time 300 - - ns
tAS Address Setup Time 0 - - ns
tAH Address Hold Time 0 - - ns
tDSW Write Data Setup Time 40 - - ns
tDHW Write Data Hold Time 7 - - ns

tDHR Read Data Hold Time 20 - - ns
tOH Output Disable Time - - 70 ns
tACC Access Time - - 140 ns

Chip Select Low Pulse Width (read) 120
PWCSL - - ns
Chip Select Low Pulse Width (write) 60
Chip Select High Pulse Width (read) 60
PWCSH - - ns
Chip Select High Pulse Width (write) 60
tR Rise Time - - 40 ns
tF Fall Time - - 40 ns
Figure 12-1 : 6800-series MCU parallel interface characteristics

Table 12-3 : 8080-Series MCU Parallel Interface Timing Characteristics
(VDD - VSS = 1.65V to 3.3V, TA = 25°C)
tDHR Read Data Hold Time 20 - - ns
tOH Output Disable Time - - 70 ns
tACC Access Time - - 140 ns
tPWLR Read Low Time 120 - - ns
tPWLW Write Low Time 60 - - ns
tPWHR Read High Time 60 - - ns
tPWHW Write High Time 60 - - ns
tCS Chip select setup time 0 - - ns
tCSH Chip select hold time to read signal 0 - - ns
tCSF Chip select hold time 20 - - ns
Figure 12-2 : 8080-series parallel interface characteristics
Write Cycle
CS#
tCS tCSF
D/C#
tAS tAH
tF tR
tcycle
WR# tPWLW tPWHW
tDSW tDHW
D[7:0]
Read cycle
CS# tCSH
tCS
D/C#
tAS tAH
tF tR
tcycle
RD# tPWLR tPWHR
tACC tDHR
D[7:0]
tOH

Table 12-4 : 4-wire Serial Interface Timing Characteristics
(VDD - VSS = 1.65V to 3.3V, TA = 25°C)

tCSS Chip Select Setup Time 20 - - ns
tCSH Chip Select Hold Time 10 - - ns
tCLKL Clock Low Time 20 - - ns
tCLKH Clock High Time 20 - - ns
Figure 12-3 : 4-wire Serial interface characteristics
D/C#
t AS t AH
t CSS t CSH
CS#
t cycle
tCLKL tCLKH
SCLK(D 0 )
tF tR
t DSW t DHW
SDIN(D 1 ) Valid Data
CS#
SCLK(D0 )
SDIN(D1) D7 D6 D5 D4 D3 D2 D1 D0

Table 12-5 : 3-wire Serial Interface Timing Characteristics
(VDD - VSS = 1.65V to 3.3V, TA = 25°C)

tCSS Chip Select Setup Time 20 - - ns
tCSH Chip Select Hold Time 10 - - ns
tCLKL Clock Low Time 20 - - ns
tCLKH Clock High Time 20 - - ns
Figure 12-4 : 3-wire Serial interface characteristics
t CSS t CSH
CS#
t CYCLE
tCLKH
t CLKL
SCLK
tF tR
t DSW tDHW
SDIN Valid Data
CS#
SCLK
SDIN
D/C# D7 D6 D5 D4 D3 D2 D1 D0

Conditions:
VDD - VSS = VDD - VSS = 1.65V to 3.3V
TA = 25°C
Table 12-6 :I2C Interface Timing Characteristics

tcycle Clock Cycle Time 2.5 - - us
tHSTART Start condition Hold Time 0.6 - - us
tHD Data Hold Time (for “SDAOUT” pin) 0 - - ns
Data Hold Time (for “SDAIN” pin) 300 - - ns
tSD Data Setup Time 100 - - ns
tSSTART Start condition Setup Time (Only relevant for a repeated 0.6 - - us
Start condition)
tSSTOP Stop condition Setup Time 0.6 - - us
tR Rise Time for data and clock pin - - 300 ns
tF Fall Time for data and clock pin - - 300 ns
tIDLE Idle Time before a new transmission can start 1.3 - - us
Figure 12-5 : I2C interface Timing characteristics
// //
SDA
tHD tF tIDLE
tHSTART tSSTART tSSTOP
tR tSD
SCL
tCYCLE

13 Application Example
Figure 13-1 : Application Example of SSD1308Z with External IREF
The configuration for 8080-parallel interface mode and External IREF is shown in the following diagram:
(VDD=2.8V, VCC =12V, IREF=19uA)
DISPLAY PANEL
128 x 64
SEG127
COM62
COM60
COM61
COM63
COM2
COM0
COM1
COM3
SEG0
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
SSD1308Z
VLSS /
VDD1 BGGND VCC VCOMH VSS BS0 BS1 BS2 FR CL CS# RES# D/C# R/W#(W/R#) E (RD#) D[7:0] CLS VDD IREF
R1
C2
C1
C3
VCC VSS CS# RES# D/C# R/W#(W/R#) E (RD#) D[7:0] VDD
Pin connected to MCU interface: D[7:0], E (RD#), R/W#(W/R#) , D/C#, CS#, RES#
VDD1 , TR0-TR11, FR should be left open.
C1: 1.0uF (1)

C2: 2.2uF (1)
C3: 2.2uF (1)
Voltage at IREF = VCC – 2.5V. For VCC = 12V, IREF = 19uA:

R1 = (Voltage at IREF - VSS) / IREF
= (12-2.5) / 19uA
= 500KΩ
Note
(1)
The capacitor value is recommended value. Select appropriate value against module application.

Figure 13-2 : Application Example of SSD1308Z with Internal IREF
The configuration for 8080-parallel interface mode and Internal IREF is shown in the following diagram:
(VDD=2.8V, VCC =12V, IREF is internally generated by setting command ADh. )
DISPLAY PANEL
128 x 64
SEG127
COM62
COM60
COM61
COM63
COM2
COM0
COM1
COM3
SEG0
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
SSD1308Z
VLSS /
VDD1 BGGND VCC VCOMH VSS BS0 BS1 BS2 FR CL CS# RES# D/C# R/W#(W/R#) E (RD#) D[7:0] CLS VDD IREF
C2
C1
C3
VCC VSS CS# RES# D/C# R/W#(W/R#) E (RD#) D[7:0] VDD
Pin connected to MCU interface: D[7:0], E (RD#), R/W#(W/R#) , D/C#, CS#, RES#
IREF, VDD1 , TR0-TR11, FR should be left open.
C1: 1.0uF (1)

C2: 2.2uF (1)
C3: 2.2uF (1)
Note
(1)
The capacitor value is recommended value. Select appropriate value against module application.

14 PACKAGE INFORMATION
14.1 SSD1308Z Die Tray Information

Figure 14-1 : SSD1308Z die tray information

Solomon Systech reserves the right to make changes without notice to any products herein. Solomon Systech makes no warranty,
representation or guarantee regarding the suitability of its products for any particular purpose, nor does Solomon Systech assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any, and all, liability, including without
limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating parameters,
including “Typical” must be validated for each customer application by the customer’s technical experts. Solomon Systech does not con-
vey any license under its patent rights nor the rights of others. Solomon Systech products are not designed, intended, or authorized for use
as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any
other application in which the failure of the Solomon Systech product could create a situation where personal injury or death may occur.
Should Buyer purchase or use Solomon Systech products for any such unintended or unauthorized application, Buyer shall indemnify and
hold Solomon Systech and its offices, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Solomon Systech was negligent regarding the design or manufacture of the
part.
All Solomon Systech Products complied with six (6) hazardous substances limitation requirement per European Union (EU) “Restriction of
Hazardous Substance (RoHS) Directive (2002/95/EC)” and China standard “电子信息产品污染控制标识要求 (SJ/T11364-2006)” with
control Marking Symbol . Hazardous Substances test report is available upon requested.
http://www.solomon-systech.com

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SOLOMON SYSTECH

SEMICONDUCTOR TECHNICAL DATA

128 x 64 Dot Matrix

Version Change Items Effective Date

1.0 1. Changed to Advance Information 27-Oct-08

Solomon Systech Oct 2008 P 2/56 Rev 1.0 SSD1308

1 GENERAL DESCRIPTION .......................................................................................................7

3 ORDERING INFORMATION ...................................................................................................7

4 BLOCK DIAGRAM ....................................................................................................................8

5 DIE PAD FLOOR PLAN ............................................................................................................ 9

6 PIN DESCRIPTION ..................................................................................................................12

7 FUNCTIONAL BLOCK DESCRIPTIONS.............................................................................14

SSD1308 Rev 1.0 P 3/56 Oct 2008 Solomon Systech

Solomon Systech Oct 2008 P 4/56 Rev 1.0 SSD1308

SSD1308 Rev 1.0 P 5/56 Oct 2008 Solomon Systech

Solomon Systech Oct 2008 P 6/56 Rev 1.0 SSD1308

Ordering Part Number SEG COM Package Form Reference Remark

SSD1308 Rev 1.0 P 7/56 Oct 2008 Solomon Systech

Figure 4-1 SSD1308 Block Diagram

Solomon Systech Oct 2008 P 8/56 Rev 1.0 SSD1308

Pad 1 Die size 6.76mm x 0.86mm

SSD1308 Rev 1.0 P 9/56 Oct 2008 Solomon Systech

*All units are in um

Solomon Systech Oct 2008 P 10/56 Rev 1.0 SSD1308

SSD1308 Rev 1.0 P 11/56 Oct 2008 Solomon Systech

Figure 6-1 Pin Description

Pin Name Type Description

VSS P This is a ground pin.

VLSS P This is an analog ground pin. It should be connected to VSS externally.

VCOMH O The pin for COM signal deselected voltage level.

VDD1 P Reserved pin. It should be kept NC.

BGGND P Reserved pin. It should be connected to ground.

IREF I This is segment output current reference pin.

When internal IREF is used, this pin should be kept NC.

CL I This is external clock input pin.

CS# I This pin is the chip select input. (active LOW).

Solomon Systech Oct 2008 P 12/56 Rev 1.0 SSD1308

TR0-TR11 - Testing reserved pins. It should be kept NC.

NC - This is dummy pin. Do not group or short NC pins together.

Table 6-1 : MCU Bus Interface Pin Selection

SSD1308 Rev 1.0 P 13/56 Oct 2008 Solomon Systech

7.1 MCU Interface selection

7.1.1 MCU Parallel 6800-series Interface

Table 7-2 : Control pins of 6800 interface

Function E R/W# CS# D/C#

Solomon Systech Oct 2008 P 14/56 Rev 1.0 SSD1308

Databus N n n+1 n+2

7.1.2 MCU Parallel 8080-series Interface

Figure 7-2 : Example of Write procedure in 8080 parallel interface mode

Figure 7-3 : Example of Read procedure in 8080 parallel interface mode

SSD1308 Rev 1.0 P 15/56 Oct 2008 Solomon Systech

Databus N n n+1 n+2

7.1.3 MCU Serial Interface (4-wire SPI)

Under serial mode, only write operations are allowed.

Solomon Systech Oct 2008 P 16/56 Rev 1.0 SSD1308

7.1.4 MCU Serial Interface (3-wire SPI)

Figure 7-6 : Write procedure in 3-wire Serial interface mode

SSD1308 Rev 1.0 P 17/56 Oct 2008 Solomon Systech

a) Slave address bit (SA0)