NY8B062E v1.1

DATA SHEET
NY8B062E
14 I/O + 12-ch ADC 8-bit EPROM-Based MCU
Version 1.1
Jul. 16, 2021
NYQUEST TECHNOLOGY CO. reserves the right to change this document without prior notice. Information provided by NYQUEST is believed to be accurate and reliable.
However, NYQUEST makes no warranty for any errors which may appear in this document. Contact NYQUEST to obtain the latest version of device specifications before
placing your orders. No responsibility is assumed by NYQUEST for any infringement of patent or other rights of third parties which may result from its use. In addition,
NYQUEST products are not authorized for use as critical components in life support devices/systems or aviation devices/systems, where a malfunction or failure of the product
may reasonably be expected to result in significant injury to the user, without the express written approval of NYQUEST.
NY8B062E
Revision History
Version Date Description Modified Page
1.0 2021/01/18 Formal release. -
10, 14, 15, 20, 32, 48,

1.1 2021/07/16 Added PWM4 description
49, 70, 106
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Table of Contents
1. 概述 ............................................................................................................................................. 8
1.1 功能 .................................................................................................................................................8
1.2 NY8B062E 與 NY8B062D 的主要差異 ......................................................................................... 10
1. General Description................................................................................................................. 11
1.1 Features ........................................................................................................................................ 11
1.2 Block Diagram ............................................................................................................................... 14
1.3 Pin Assignment .............................................................................................................................. 14
1.4 Pin Description ............................................................................................................................... 15
2. Memory Organization .............................................................................................................. 17

2.1 Program Memory ........................................................................................................................... 17
2.2 Data Memory ................................................................................................................................. 18
3. Function Description ............................................................................................................... 21

3.1 R-page Special Function Register .................................................................................................. 21
3.1.1 INDF (Indirect Addressing Register) .................................................................................................... 21
3.1.2 TMR0 (Timer0 Register) ...................................................................................................................... 21
3.1.3 PCL (Low Byte of PC[10:0]) ................................................................................................................ 21
3.1.4 STATUS (Status Register) ................................................................................................................... 22
3.1.5 FSR (Register File Selection Register) ............................................................................................... 22
3.1.6 PortA (PortA Data Register) ................................................................................................................ 23
3.1.7 PortB (PortB Data Register) ................................................................................................................ 23
3.1.8 PCON (Power Control Register) ......................................................................................................... 23
3.1.9 BWUCON (PortB Wake-up Control Register) ..................................................................................... 24
3.1.10 PCHBUF (High Byte of PC) ................................................................................................................. 24
3.1.11 ABPLCON (PortA/PortB Pull-Low Resistor Control Register) ............................................................. 24
3.1.12 BPHCON (PortB Pull-High Resistor Control Register) ........................................................................ 25
3.1.13 INTE (Interrupt Enable Register) ......................................................................................................... 25
3.1.14 INTF (Interrupt Flag Register) ............................................................................................................. 26
3.1.15 ADMD (ADC mode Register) .............................................................................................................. 27
3.1.16 ADR (ADC clock, ADC interrupt flag and ADC LSB output Register) ................................................. 27
3.1.17 ADD (ADC output data Register)......................................................................................................... 28
3.1.18 ADVREFH (ADC high reference voltage Register) ............................................................................. 28
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3.1.19 ADCR (Sampling pulse and ADC bit Register) ................................................................................... 28
3.1.20 AWUCON (PortA Wake-up Control Register) ..................................................................................... 29
3.1.21 PACON (ADC analog pin Register) ..................................................................................................... 29
3.1.22 ADJMD (ADC adjustment mode) ........................................................................................................ 29
3.1.23 INTEDG (Interrupt Edge Register) ...................................................................................................... 30
3.1.24 TMRH (Timer High Byte Register) ...................................................................................................... 30
3.1.25 ANAEN (Analog Circuit Enable Register)............................................................................................ 31
3.1.26 RFC (RFC Register) ............................................................................................................................ 31
3.1.27 TM3RH (Timer3 High Byte Register) .................................................................................................. 32
3.1.28 INTE2 (Interrupt Enable and Flag 2nd. Register) ................................................................................ 32
3.2 T0MD Register ............................................................................................................................... 32
3.3 F-page Special Function Register .................................................................................................. 34
3.3.1 IOSTA (PortA I/O Control Register) ..................................................................................................... 34
3.3.2 IOSTB (PortB I/O Control Register) .................................................................................................... 34
3.3.3 APHCON (PortA Pull-High Resistor Control Register) ........................................................................ 34
3.3.4 PS0CV (Prescaler0 Counter Value Register) ...................................................................................... 35
3.3.5 BODCON (PortB Open-Drain Control Register).................................................................................. 35
3.3.6 CMPCR (Comparator voltage select Control Register) ....................................................................... 35
3.3.7 PCON1 (Power Control Register1) ..................................................................................................... 36
3.4 S-page Special Function Register .................................................................................................. 37
3.4.2 T1CR1 (Timer1 Control Register1) ..................................................................................................... 37
3.4.4 PWM1DUTY (PWM1 Duty Register) ................................................................................................... 39
3.4.6 BZ1CR (Buzzer1 Control Register) ..................................................................................................... 39
3.4.7 IRCR (IR Control Register) .................................................................................................................. 40
3.4.8 TBHP (Table Access High Byte Address Pointer Register) ................................................................. 41
3.4.9 TBHD (Table Access High Byte Data Register) .................................................................................. 41
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3.4.16 OSCCR (Oscillation Control Register) ................................................................................................ 44
3.4.23 P4CR1 (PWM4 Control Register1) ...................................................................................................... 48
3.5 I/O Port .......................................................................................................................................... 49
3.5.1 Block Diagram of IO Pins .................................................................................................................... 51
3.6 Timer0............................................................................................................................................ 61
3.7 Timer1 / PWM1 / Buzzer1 .............................................................................................................. 62
3.8 Timer2 / PWM2 / Buzzer2 .............................................................................................................. 65

3.9 Timer3 / PWM3 / Buzzer3 / PWM4 ................................................................................................. 67
3.10 RFC Mode ..................................................................................................................................... 71
3.11 IR Carrier ....................................................................................................................................... 71

3.12 Low Voltage Detector (LVD) ........................................................................................................... 72
3.13 Voltage Comparator ....................................................................................................................... 73
3.14 Analog-to-Digital Convertor (ADC) ................................................................................................. 75

3.14.1 ADC reference voltage ........................................................................................................................ 76
3.14.2 ADC analog input channel ................................................................................................................... 77
3.14.3 ADC clock (ADCLK), sampling clock (SHCLK) and bit number .......................................................... 78
3.14.4 ADC operation ..................................................................................................................................... 79
3.15 Watch-Dog Timer (WDT) ................................................................................................................ 79
3.16 Interrupt ......................................................................................................................................... 79
3.16.1 Timer0 Overflow Interrupt .................................................................................................................... 80
3.16.2 Timer1 Underflow Interrupt .................................................................................................................. 81
3.16.5 WDT Timeout Interrupt ........................................................................................................................ 81
3.16.6 PA/PB Input Change Interrupt ............................................................................................................. 81
3.16.7 External 0 Interrupt .............................................................................................................................. 81
3.16.8 External 1 Interrupt .............................................................................................................................. 81
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3.16.9 LVD Interrupt ....................................................................................................................................... 81
3.16.10 Comparator Output Status Change Interrupt....................................................................................... 82
3.16.11 ADC end of conversion Interrupt ......................................................................................................... 82
3.17 Oscillation Configuration ................................................................................................................ 82
3.18 Operating Mode ............................................................................................................................. 84
3.18.1 Normal Mode ....................................................................................................................................... 86
3.18.2 Slow Mode ........................................................................................................................................... 86
3.18.3 Standby Mode ...................................................................................................................................... 86
3.18.4 Halt Mode ............................................................................................................................................ 87
3.18.5 Wake-up Stable Time .......................................................................................................................... 87
3.18.6 Summary of Operating Mode .............................................................................................................. 88
3.19 Reset Process ............................................................................................................................... 88
4. Instruction Set ......................................................................................................................... 90
5. Configuration Words ............................................................................................................. 106
6. Electrical Characteristics ...................................................................................................... 107

6.1 Absolute Maximum Rating ........................................................................................................... 107
6.2 DC Characteristics ....................................................................................................................... 107

6.3 OSC Characteristics .................................................................................................................... 109
6.4 Comparator / LVD Characteristics ................................................................................................ 109
6.5 ADC Characteristics ..................................................................................................................... 109

6.6 Characteristic Graph .................................................................................................................... 110
6.6.1 Frequency vs. VDD of I_HRC, I_LRC .................................................................................................. 110
6.6.2 Frequency vs. Temperature of I_HRC ................................................................................................ 110
6.6.3 Frequency vs. Temperature of I_LRC ................................................................................................ 111
6.6.4 Low Dropout Regulator vs. Temperature ............................................................................................ 111
6.6.5 Pull High Resistor vs. VDD ................................................................................................................. 112
6.6.6 VIH/VIL vs. VDD ................................................................................................................................. 112
6.7 Recommended Operating Voltage ............................................................................................... 113
6.8 LVR vs. Temperature.................................................................................................................... 114
6.9 LVD vs. Temperature.................................................................................................................... 114
6.10 LDO vs. Temperature ................................................................................................................... 115
7. Die Pad Diagram .................................................................................................................... 115
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8. Package Dimension ............................................................................................................... 116
8.1 8-Pin Plastic SOP (150 mil) .......................................................................................................... 116
8.2 14-Pin Plastic SOP (150 mil) ........................................................................................................ 116

8.3 16-Pin Plastic SOP (150 mil) ........................................................................................................ 117
9. Ordering Information ............................................................................................................. 117
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1. 概述
NY8B062E 是以EPROM作為記憶體的 8 位元微控制器，專為家電或量測等等的I/O應用設計。採用CMOS製程並同
時提供客戶低成本、高性能、及高性價比等顯著優勢。NY8B062E 核心建立在RISC精簡指令集架構可以很容易地做
編輯和控制，共有 55 條指令。除了少數指令需要 2 個時序，大多數指令都是 1 個時序即能完成，可以讓使用者輕鬆
地以程式控制完成不同的應用。因此非常適合各種中低記憶容量但又複雜的應用。
NY8B062E內建高精度十一加一通道十二位元類比數位轉換器，與高精度電壓比較器，足以應付各種類比介面的偵測
與量測。
在I/O的資源方面，NY8B062E 有 14 根彈性的雙向I/O腳，每個I/O腳都有單獨的暫存器控制為輸入或輸出腳。而且每
一個I/O腳位都有附加的程式控制功能如上拉或下拉電阻或開漏極(Open-Drain) 輸出。此外針對紅外線搖控的產品方
面，NY8B062E內建了可選擇頻率的紅外載波發射口。
NY8B062E 有四組計時器，可用系統頻率當作一般的計時的應用或者從外部訊號觸發來計數。另外NY8B062E 提供
4 組 10 位元解析度的PWM輸出，3 組蜂鳴器輸出可用來驅動馬達、LED、或蜂鳴器等等。
NY8B062E 採用雙時鐘機制，高速振盪或者低速振盪都可以分別選擇內部RC振盪或外部Crystal輸入。在雙時鐘機制
下，NY8B062E 可選擇多種工作模式如正常模式(Normal)、慢速模式(Slow mode)、待機模式(Standby mode) 與睡
眠模式(Halt mode)可節省電力消耗延長電池壽命。並且微控制器在使用內部RC高速振盪時，低速振盪可以同時使用
外部精準的Crystal計時。可以維持高速處理同時又能精準計算真實時間。
在省電的模式下如待機模式(Standby mode) 與睡眠模式(Halt mode)中，有多種事件可以觸發中斷喚醒NY8B062E

進入正常操作模式(Normal) 或慢速模式(Slow mode) 來處理突發事件。
1.1 功能
 寬廣的工作電壓：
 2.0V ~ 5.5V @系統頻率 ≦8MHz。
 2.2V ~ 5.5V @系統頻率 > 8MHz。
 寬廣的工作温度：-40°C ~ 85°C。
 2Kx14 bits EPROM。
 128 bytes SRAM。
 14 根可分別單獨控制輸入輸出方向的I/O腳(GPIO)、PA[7:0]、PB[5:0]。
 PA[5, 3:0] 及 PB[3:0] 可選擇輸入時使用內建下拉電阻。
 PA[7:0] 及 PB[5:0] 可選擇輸入時使用上拉電阻。
 PB[5:0] 可選擇開漏極輸出(Open-Drain)。
 PA[5] 可選擇當作輸入或開漏極輸出(Open-Drain)。
 所有I/O腳輸出可選擇一般灌電流(Normal Sink Current)或大灌電流(Large Sink Current)，除PA5 外。
 8 層程式堆棧(Stack)。
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 存取資料有直接或間接定址模式。
 一組 8 位元上數計時器(Timer0)包含可程式化的頻率預除線路。
 三組 10 位元下數計時器(Timer1, 2, 3)可選重複載入或連續下數計時。
 四個 10 位元脈衝寬度調變(PWM1, 2, 3, 4)。
 三個蜂鳴器輸出(BZ1, 2, 3)。
 38/57KHz紅外線載波頻率可供選擇，同時載波之極性也可以根據數據作選擇。
 內建準確的低電壓偵測電路(LVD)。
 內建十一加一通道 12 位元類比數位轉換器(Analog to Digital Converter)。
 內建準確的電壓比較器(Voltage Comparator)。
 內建上電復位電路(POR)。
 內建低壓復位功能(LVR)。
 內建看門狗計時(WDT)，可由程式韌體控制開關。
 內建電阻頻率轉換器(RFC)功能.
 雙時鐘機制，系統可以隨時切換高速振盪或者低速振盪。
 高速振盪：E_HXT (超過 6MHz外部高速石英振盪)
E_XT (455K~6MHz外部石英振盪)
I_HRC (1~20MHz內部高速RC振盪)
 低速振盪：E_LXT (32KHz外部低速石英振盪)
I_LRC (內部 32KHz低速RC振盪)
 四種工作模式可隨系統需求調整電流消耗：正常模式(Normal)、慢速模式(Slow mode)、待機模式(Standby
mode) 與睡眠模式(Halt mode)。
 十一種硬體中斷：
 Timer0 溢位中斷。
 Timer1 借位中斷。
 WDT 中斷。
 PA/PB 輸入狀態改變中斷。
 兩組外部中斷輸入。
 低電壓偵測中斷。
 比較器輸出轉態中斷。
 類比數位轉換完成中斷°
 NY8B062E在待機模式(Standby mode)下的十一種喚醒中斷：
 Timer0 溢位中斷。
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 WDT 中斷。
 低電壓偵測中斷。
 比較器輸出轉態中斷。
 類比數位轉換完成中斷º
 NY8B062E在睡眠模式(Halt mode)下的四種喚醒中斷：
 WDT 中斷。
1.2 NY8B062E 與 NY8B062D 的主要差異
Item Function NY8B062E NY8B062D
ADC offset Calibration *

註
1 Yes ---
2 ADC power consumption 500uA @5V 3mA @5V
3 Internal LDO ±0.5% ±1.0%
4 Input Schmitt Trigger Enable/Disable ---
5 PWM channel PWM1, 2, 3, 4 PWM1, 2, 3
*註: 需要增加 ADC 零點校準初始化程式 (可參考 NYIDE 範例程式)
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1. General Description
NY8B062E is an EPROM based 8-bit MCU tailored for ADC based applications like home appliances or meter
equipment. NY8B062E adopts advanced CMOS technology to provide customers remarkable solution with low cost,
high performance. RISC architecture is applied to NY8B062E and it provides 55 instructions. All instructions are
executed in single instruction cycle except program branch and skip instructions which will take two instruction
cycles. Therefore, NY8B062E is very suitable for those applications that are sophisticated but compact program size
is required.
NY8B062E provides 11+1 channel high-precision 12-bit analog-to-digital converter (ADC), and high-precision Low
Dropout Regulator and analog voltage comparator. They are suitable for any analog interface detection and
measurement applications.
As NY8B062E address I/O type applications, it can provide 14 I/O pins for applications which require abundant input
and output functionality. Moreover, each I/O pin may have additional features, like Pull-High/Pull-Low resistor and
open-drain output type through programming. Moreover, NY8B062E has built-in infrared (IR) carrier generator with
selectable IR carrier frequency and polarity for applications which demand remote control feature.
NY8B062E also provides 4 sets of timers which can be used as regular timer based on system oscillation or event
counter with external trigger clock. Moreover, NY8B062E provides 4 sets of 10-bit resolution Pulse Width Modulation
(PWM) output and 3 sets of buzzer output in order to drive motor/LED and buzzer.
NY8B062E employs dual-clock oscillation mechanism, either high oscillation or low oscillation can be derived from
internal resistor/capacitor oscillator or external crystal oscillator. Moreover, based on dual-clock mechanism,
NY8B062E provides kinds of operation mode like Normal mode, Slow mode, Standby mode and Halt mode in order
to save power consumption and lengthen battery operation life. Moreover, it is possible to use internal
high-frequency oscillator as CPU operating clock source and external 32KHz crystal oscillator as timer clock input,
so as to accurate count real time and maintain CPU working power.
While NY8B062E operates in Standby mode and Halt mode, kinds of event will issue interrupt requests and can
wake-up NY8B062E to enter Normal mode and Slow mode in order to process urgent events.
1.1 Features
 Wide operating voltage range:
 2.0V ~ 5.5V @system clock ≦8MHz.
 2.2V ~ 5.5V @system clock > 8MHz.
 Wide operating temperature: -40°C ~ 85°C.
 2K x 14 bits EPROM.
 128 bytes SRAM.
 14 general purpose I/O pins (GPIO), PA[7:0], PB[5:0], with independent direction control.
 PA[5, 3:0] and PB[3:0] have features of Pull-Low resistor for input pin.
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 PA[7:0] and PB[5:0] have features of Pull-High resistor.
 PB[5:0] have features of Open-Drain output.
 PA[5] have feature of input or open-drain output.
 I/O ports output current mode can be normal sink or large sink (exclude PA5).
 8-level hardware Stack.
 Direct and indirect addressing modes for data access.
 One 8-bit up-count timer (Timer0) with programmable prescaler.
 Three 10-bit reload or continuous down-count timers (Timer1, 2, 3).
 Four 10-bit resolution PWM (PWM1, 2, 3, 4) output.
 Three buzzer (BZ1, 2, 3) output.
 Selectable 38/57KHz IR carrier frequency and high/low polarity according to data value.
 Built-in high-precision Low-Voltage Detector (LVD).
 Built-in 11+1 channel high-precision 12-bit ADC.
 Built-in high-precision Voltage Comparator.
 Built-in Power-On Reset (POR).
 Built-in Low-Voltage Reset (LVR).
 Built-in Watch-Dog Timer (WDT) enabled/disabled by firmware control.
 Built-in Resistance to Frequency Converter (RFC) function.
 Dual-clock oscillation: System clock can switch between high oscillation and low oscillation.
 High oscillation: E_HXT (External High Crystal Oscillator, above 6MHz)
E_XT (External Crystal Oscillator, 455K~6MHz)
I_HRC (Internal High Resistor/Capacitor Oscillator ranging from 1M~20MHz)
 Low oscillation: E_LXT (External Low Crystal Oscillator, about 32KHz)
I_LRC (Internal 32KHz oscillator)
 Four kinds of operation mode to reduce system power consumption:

 Normal mode, Slow mode, Standby mode and Halt mode.
 Eleven hardware interrupt events:

 Timer0 overflow interrupt.
 Timer1 underflow interrupt.
 WDT timeout interrupt.
 PA/PB input change interrupt.
 2 set External interrupt.
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 LVD interrupt.
 Comparator output status change interrupt.
 ADC end-of-convert interrupt.
 Eleven interrupt events to wake-up NY8B062E from Standby mode:

 Timer0 overflow interrupt.
 LVD interrupt.
 Comparator output status change interrupt.
 ADC end-of-convert interrupt.
 Four interrupt events to wake-up NY8B062E from Halt mode:

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1.2 Block Diagram
1.3 Pin Assignment
NY8B062E provides three kinds of package type which are SOP16, SOP14 and SOP8.
Figure 1 Package pin assignment
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1.4 Pin Description
Pin Name I/O Description
PA0 PA0 is bidirectional I/O pin, and can be comparator analog input pins.
AIN0 I/O PA0 can be ADC analog input pin, AN0.
VREFH PA0 can be ADC external high reference voltage source.
PA1 PA1 is bidirectional I/O pin, and can be comparator analog input pins.
AIN1 I/O PA1 can be ADC analog input pin, AN1.
EX_CKI1 PA1 can be Timer2/3 clock source EX_CKI1.
PA2 PA2 is a bidirectional I/O pin, and can be comparator analog input pin.
AIN2 PA2 can be ADC analog input pin, AN2.
I/O
PWM3/BZ3 PA2 can be the output of PWM3 or Buzzer3.
SDI PA2 can be programming pad SDI.
PA3 PA3 is a bidirectional I/O pin, and can be comparator analog input pin.
I/O
PWM4 PA3 can be the output of PWM4
SDO PA3 also can be programming pad SDO.
PA4 PA4 is a bidirectional I/O pin.

PWM2 I/O PA4 can be the output of PWM2
EX_CKI0 PA4 can be the Timer0/1 clock source EX_CKI0.
SCK PA4 can be programming pad SCK.
PA5 PA5 is an input pin or open-drain output pin.

RSTb I/O PA5 can be the reset pin RSTb.
Vpp If Vpp is more than 7.75V, it also makes IC enter EPROM programming mode.

I/O
Xin PA6 can be the input pin of crystal oscillator Xin.

PWM4 PA7 can be the output of PWM4
I/O
Xout PA7 can be the output pin of crystal oscillator Xout.
PA7 also can be output of instruction clock.
PB0 PB0 is a bidirectional I/O pin.

AIN5 I/O PB0 can be ADC analog input pin, AN5.
INT0 PB0 can be the input pin of external interrupt INT0.

AIN6 PB1 can be ADC analog input pin, AN6.
I/O
IR If IR mode is enabled, this pin is IR carrier output.
INT1 PB1 can be the input pin of external interrupt INT1.

AIN7 I/O PB2 can be ADC analog input pin, AN7.
PWM2/BZ2 PB2 can be the output of PWM2 or Buzzer2.
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Pin Name I/O Description

PWM1/BZ1 I/O PB3 can be the output of PWM1 or Buzzer1
CMPO PB3 can be the output of comparator.
SDO PB3 can be programming pad SDO.

I/O

I/O
VDD - Positive power supply.
VSS - Ground.
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2. Memory Organization
NY8B062E memory is divided into two categories: one is program memory and the other is data memory.
2.1 Program Memory

The program memory space of NY8B062E is 2K words. Therefore, the Program Counter (PC) is 11-bit wide in
order to address any location of program memory.
Some locations of program memory are reserved as interrupt entrance. Power-On Reset vector is located at
0x000. Software interrupt vector is located at 0x001. Internal and external hardware interrupt vector is located at
0x008.
NY8B062E provides instruction GOTOA, CALLA to address 256 location of program space. NY8B062E also
provides instructions LCALL and LGOTO to address any location of program space.
When a call or interrupt is happening, next ROM address is written to top of the stack, when RET, RETIA or
RETIE instruction is executed, the top of stack data is read and load to PC.
NY8B062E program ROM address 0x7FE~0x7FF are reserved space, if user tries to write code in these
addresses will get unexpected false functions.
NY8B062E program ROM address 0x00E~0x00F are preset rolling code can be released and used as normal
program space.
Figure 2 Program Memory Address Mapping
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2.2 Data Memory
According to instructions used to access data memory, the data memory can be divided into three kinds of
categories: one is R-page Special-function register (SFR) + General Purpose Register (GPR), another is F-page
SFR and the other is S-page SFR. GPR are made of SRAM and user can use them to store variables or
intermediate results.
R-page data memory is divided into 4 banks and can be accessed directly or indirectly through a SFR register
which is File Select Register (FSR). STATUS [7:6] are used as Bank register BK[1:0] to select one bank out of
the 4 banks.
R-page register can be divided into addressing mode: direct addressing mode and indirect addressing mode.
The indirect addressing mode of data memory access is described in the following graph. This indirect
addressing mode is implied by accessing register INDF. The bank selection is determined by STATUS[7:6] and
the location selection is from FSR[6:0].
Figure 3 Indirect Addressing Mode of Data Memory Access
The direct addressing mode of data memory access is described below. The bank selection is determined by
STATUS [7:6] and the location selection is from instruction op-code[6:0] immediately.
Figure 4 Direct Addressing Mode of Data Memory Access
R-page SFR can be accessed by general instructions like arithmetic instructions and data movement
instructions. The R-page SFR occupies address from 0x0 to 0x1F of Bank 0. However, the same address
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range of Bank 1, Bank 2 and Bank 3 are mapped back to Bank 0. In other words, R-page SFR physically
existed at Bank 0. The GPR physically occupy address from 0x20 to 0x7F of Bank 0 and 0x20 to 0x3F of Bank
1. Other bank in address from 0x20 to 0x7F are mapped back as the Table 1 shows.
The NY8B062E register name and address mapping of R-page SFR are described in the following table.
Status [7:6] 00 01 10 11
Address (Bank 0) (Bank 1) (Bank 2) (Bank 3)
0x0 INDF
0x1 TMR0
0x2 PCL
0x3 STATUS
0x4 FSR
0x5 PORTA
0x6 PORTB
0x7 -
0x8 PCON
0x9 BWUCON
0xA PCHBUF
0xB ABPLCON
0xC BPHCON
0xD - The same mapping as Bank 0
0xE INTE
0xF INTF
0x10 ADMD
0x11 ADR
0x12 ADD
0x13 ADVREFH
0x14 ADCR
0x15 AWUCON
0x16 PACON
0x17 ADJMD
0x18 INTEDG
0x19 TMRH
0x1A ANAEN
0x1B RFC
The same mapping as Bank 0
0x1C TM3RH
0x1D ~0x1E - -
0x1F INTE2 The same mapping as Bank 0
General Purpose General Purpose Mapped to Mapped to
0x20 ~ 0x3F
Register Register bank0 Bank1
General Purpose Mapped to Mapped to Mapped to
0x40 ~ 0x7F
Register bank0 bank0 bank0
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Table 1 R-page SFR Address Mapping
F-page SFR can be accessed only by instructions IOST and IOSTR. S-page SFR can be accessed only by
instructions SFUN and SFUNR. STATUS[7:6] bank select bits are ignored while F-page and S-page register is
accessed. The register name and address mapping of F-page and S-page are depicted in the following table.
SFR Category
F-page SFR S-page SFR
Address
0x0 - TMR1
0x1 - T1CR1
0x2 - T1CR2
0x3 - PWM1DUTY
0x4 - PS1CV
0x5 IOSTA BZ1CR
0x6 IOSTB IRCR
0x7 - TBHP
0x8 - TBHD
0x9 APHCON TMR2
0xA PS0CV T2CR1
0xB - T2CR2
0xC BODCON PWM2DUTY
0xD - PS2CV
0xE CMPCR BZ2CR
0xF PCON1 OSCCR
0X10 - TMR3
0X11 - T3CR1
0X12 - T3CR2
0X13 - PWM3DUTY
0X14 - PS3CV
0X15 - BZ3CR
0X16 - P4CR1
0X17 - -
0X18 - PWM4DUTY
Table 2 F-page and S-page SFR Address Mapping
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3. Function Description
This chapter will describe the detailed operations of NY8B062E.
3.1 R-page Special Function Register
3.1.1 INDF (Indirect Addressing Register)

Name SFR Type Addr. Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
INDF R 0x0 INDF[7:0]
R/W Property R/W
Initial Value xxxxxxxx
The register INDF is not physically existed and it is used as indirect addressing mode. Any instruction
accessing INDF actually accesses the register pointed by register FSR
3.1.2 TMR0 (Timer0 Register)

TMR0 R 0x1 TMR0[7:0]
R/W Property R/W
Initial Value xxxxxxxx
When read the register TMR0, it actually read the current running value of Timer0.
Write the register TMR0 will change the current value of Timer0.
Timer0 clock source can be from instruction clock FINST, or from external pin EX_CKI0, or from Low Oscillator
Frequency according to T0MD and configuration word setting.
3.1.3 PCL (Low Byte of PC[10:0])

PCL R 0x2 PCL[7:0]
R/W Property R/W
Initial Value 0x00
The register PCL is the least significant byte (LSB) of 11-bit PC. PCL will be increased by one after one
instruction is executed except some instructions which will change PC directly. The high byte of PC, i.e.
PC[10:8], is not directly accessible. Update of PC[10:8] must be done through register PCHBUF.
For LGOTO instruction, PC[10:0] is from instruction word.
For LCALL instruction, PC[10:0] is from instruction word. Moreover the next PC address, i.e. PC+1, will push
onto top of Stack.
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3.1.4 STATUS (Status Register)
STATUS R 0x3 BK[1] BK[0] GP5 /TO /PD Z DC C
R/W Property R/W R/W R/W R/W(*2) R/W(*1) R/W R/W R/W
Initial Value 0 0 0 1 1 X X X
The register STATUS contains result of arithmetic instructions and reasons to cause reset.
C: Carry/Borrow bit
C=1, carry is occurred for addition instruction or borrow is not occurred for subtraction instruction.
C=0, carry is not occurred for addition instruction or borrow is occurred for subtraction instruction.
DC: Half Carry/half Borrow bit
DC=1, carry from the 4th LSB is occurred for addition instruction or borrow from the 4th LSB is not
occurred for subtraction instruction.
DC=0, carry from the 4th LSB is not occurred for addition instruction or borrow from the 4th LSB is
occurred for subtraction instruction.
Z: Zero bit
Z=1, result of logical operation is zero.

Z=0, result of logical operation is not zero.
/PD: Power down flag bit

/PD=1, after power-up or after instruction CLRWDT is executed.
/PD=0, after instruction SLEEP is executed.
/TO: Time overflow flag bit
/TO=1, after power-up or after instruction CLRWDT or SLEEP is executed.

/TO=0, WDT timeout is occurred.
GP5: General purpose read/write register bit.
BK[1:0]: Bank register is used to select one specific bank of data memory. BK[1:0]=00b, Bank 0 is selected.
BK[1:0]=01b, Bank 1 is selected. BK[1:0]=10b, Bank 2 is selected. BK[1:0]=11b, Bank 3 is selected.
(*1) can be cleared by sleep instruction.

(*2) can be set by clrwdt instruction.
3.1.5 FSR (Register File Selection Register)

FSR R 0x4 GP7 FSR[6:0]
R/W Property R/W
Initial Value 0 X X X X X X X
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FSR[6:0]: Select one register out of 128 registers of specific Bank.
GP7: general register.
3.1.6 PortA (PortA Data Register)

PortA R 0x5 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0
R/W Property R/W
Initial Value Data latch value is xxxxxxxx, read value is xxxxxxxx port value(PA7~PA0)
While reading PortA, it will get the status of the specific pin if that pin is configured as input pin. However, if
that pin is configured as output pin, whether it will get the status of the pin or the value of the corresponding
output data latch is depend on the configuration option RD_OPT. While writing to PortA, data is written to
PA’s output data latch.
3.1.7 PortB (PortB Data Register)

PortB R 0x6 GP7 GP6 PB5 PB4 PB3 PB2 PB1 PB0
R/W Property R/W
Initial Value Data latch value is xxxxxxxx, read value is xxxxxxxx port value(PB5~PB0)
While reading PortB, it will get the status of the specific pin if that pin is configured as input pin. However, if
that pin is configured as output pin, whether it will get the status of the pin or the value of the corresponding
output data latch is depend on the configuration option RD_OPT. While writing to PortB, data is written to
PB’s output data latch.
GP7~6 : general purpose register bits.
3.1.8 PCON (Power Control Register)

PCON R 0x8 WDTEN GP6 LVDEN /PHPA5 LVREN GP2 GP1 GP0
R/W Property R/W
Initial Value 1 0 0 1 1 0 0 0
GP6, GP4, GP2, GP1, GP0: General read/write register bits.

LVREN: Enable/disable LVR.
LVREN=1, enable LVR.
LVREN=0, disable LVR.
/PHPA5: Disable/enable PA5 Pull-High resistor.

/PHPA5=1, disable PA5 Pull-High resistor.
/PHPA5=0, enable PA5 Pull-High resistor.
LVDEN: Enable/disable LVD.
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LVDEN=1, enable LVD.
LVDEN=0, disable LVD.
WDTEN: Enable/disable WDT.
WDTEN=1, enable WDT.
WDTEN=0, disable WDT.
3.1.9 BWUCON (PortB Wake-up Control Register)
BWUCON R 0x9 - - WUPB5 WUPB4 WUPB3 WUPB2 WUPB1 WUPB0

R/W Property - - R/W R/W R/W R/W R/W R/W
Initial Value X X 1 1 1 1 1 1
WUPBx: Enable/disable PBx wake-up function, 0 ≤ x ≤ 5.

WUPBx=1, enable PBx wake-up function.
WUPBx=0, disable PBx wake-up function.
3.1.10 PCHBUF (High Byte of PC)

PCHBUF R 0xA - XSPD_STP - PCHBUF[2:0]
R/W Property - W - W
Initial Value X 0 X 000
PCHBUF[2:0]: Buffer of the 10th ~ 8th bit of PC.
XSPD_STP: Write 1 to stop crystal 32.768K speed-up function, write-only.
3.1.11 ABPLCON (PortA/PortB Pull-Low Resistor Control Register)

SFR
Name Addr. Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Type
ABPLCON R 0xB /PLPB3 /PLPB2 /PLPB1 /PLPB0 /PLPA3 /PLPA2 /PLPA1 /PLPA0
R/W Property R/W
/PLPAx: Disable/enable PAx Pull-Low resistor, 0 ≤ x ≤ 3.

/PLPAx=1, disable PAx Pull-Low resistor.
/PLPAx=0, enable PAx Pull-Low resistor.
/PLPBx: Disable/enable PBx Pull-Low resistor, 0 ≤ x ≤ 3.

/PLPBx=1, disable PBx Pull-Low resistor.
/PLPBx=0, enable PBx Pull-Low resistor.
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3.1.12 BPHCON (PortB Pull-High Resistor Control Register)
BPHCON R 0xC - - /PHPB5 /PHPB4 /PHPB3 /PHPB2 /PHPB1 /PHPB0
/PHPBx: Disable/enable PBx Pull-High resistor, 0 ≤ x ≤ 5.

/PHPBx=1, disable PBx Pull-High resistor.
/PHPBx=0, enable PBx Pull-High resistor.
3.1.13 INTE (Interrupt Enable Register)

SFR
Type
INTE R 0xE INT1IE WDTIE T2IE LVDIE T1IE INT0IE PABIE T0IE
R/W Property R/W R/W R/W R/W R/W R/W R/W R/W
T0IE: Timer0 overflow interrupt enable bit.

T0IE=1, enable Timer0 overflow interrupt.
T0IE=0, disable Timer0 overflow interrupt.
PABIE: PortA/PortB input change interrupt enable bit.

PABIE=1, enable PortA/PortB input change interrupt.
PABIE=0, disable PortA/PortB input change interrupt.
INT0IE: External interrupt 0 enable bit.

INT0IE=1, enable external interrupt 0.
INT0IE=0, disable external interrupt 0.
T1IE: Timer1 underflow interrupt enable bit.

T1IE=1, enable Timer1 underflow interrupt.
T1IE=0, disable Timer1 underflow interrupt.
LVDIE: Low-voltage detector interrupt enable bit.

LVDIE=1, enable low-voltage detector interrupt.
LVDIE=0, disable low-voltage detector interrupt.

WDTIE: WDT timeout interrupt enable bit.

WDTIE=1, enable WDT timeout interrupt.
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WDTIE=0, disable WDT timeout interrupt.
INT1IE: External interrupt 1 enable bit.

INT1IE=1, enable external interrupt 1.
INT1IE=0, disable external interrupt 1.
3.1.14 INTF (Interrupt Flag Register)

SFR
Type
INTF R 0xF INT1IF WDTIF T2IF LVDIF T1IF INT0IF PABIF T0IF
Initial Value(note*) 0 0 0 0 0 0 0 0
T0IF: Timer0 overflow interrupt flag bit.

T0IF=1, Timer0 overflow interrupt is occurred.
T0IF must be clear by firmware.
PABIF: PortA/PortB input change interrupt flag bit.
PABIF=1, PortA/PortB input change interrupt is occurred.
PABIF must be clear by firmware.
INT0IF: External interrupt 0 flag bit.

INT0IF=1, external interrupt 0 is occurred.
INT0IF must be clear by firmware.
T1IF: Timer1 underflow interrupt flag bit.

T1IF=1, Timer1 underflow interrupt is occurred.
LVDIF: Low-voltage detector interrupt flag bit.

LVDIF=1, Low-voltage detector interrupt is occurred.
LVDIF must be clear by firmware.

WDTIF: WDT timeout interrupt flag bit.

WDTIF=1, WDT timeout interrupt is occurred.
WDTIF must be clear by firmware.
INT1IF: External interrupt 1 flag bit.

INT1IF=1, external interrupt 1 is occurred.
INT1IF must be clear by firmware.
Note: When corresponding INTE bit is not enabled, the read interrupt flag is 0.
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3.1.15 ADMD (ADC mode Register)
SFR
Type
ADMD R 0x10 ADEN START EOC GCHS CHS3 CHS2 CHS1 CHS0
R/W Property R/W W R R/W R/W R/W R/W R/W
ADEN: ADC enable bit.

ADEN=1, ADC is enabled.
START: Start an ADC conversion session.
When write 1 to this bit, start to execute ADC converting. This bit is write-only. Read this bit will get 0.
EOC: ADC status bit, read-only.

EOC=1 : ADC is end-of-convert, the ADC data present in ADR and ADD is available.
EOC=0 : ADC is in procession.
GCHS: ADC global channel select bit.

GCHS=0 : disable all ADC input channel.
GCHS=1 : enable ADC input channel.
CHS3~0: ADC input channel select bits.

0000=select PA0 pad as ADC input,
0101=select PB0 pad as ADC input,
0111=select PB2pad as ADC input,
1011=select 1/4 VDD as ADC input.
1100=select GND as ADC input.
3.1.16 ADR (ADC clock, ADC interrupt flag and ADC LSB output Register)
ADR R 0x11 ADIF ADIE ADCK1 ADCK0 AD3 AD2 AD1 AD0
R/W Property R/W R/W R/W R/W R R R R
Initial Value 0 0 0 0 X X X X
ADIF: ADC interrupt flag bit.
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ADIF=1, ADC end-of-convert interrupt is occurred.
ADIF must be clear by firmware.
ADIE: ADC end-of-convert interrupt enable bit.

ADIE=1 : enable ADC interrupt.
ADIE=0 : disable ADC interrupt.
ADCK1~0: ADC clock select.

00: ADC clock=FINST/16, 01: ADC clock=FINST/8, 10: ADC clock=FINST/1, 11: ADC clock=FINST/2.
AD3~0: 12-bit low-nibble ADC data buffer.
3.1.17 ADD (ADC output data Register)

ADD R 0x12 AD11 AD10 AD9 AD8 AD7 AD6 AD5 AD4
R/W Property R R R R R R R R
AD11~4: High-byte ADC data buffer.
3.1.18 ADVREFH (ADC high reference voltage Register)

SFR
Type
ADVREFH R 0x13 EVHENB - - - - - VHS1 VHS0
R/W Property R/W - - - - - R/W R/W
Initial Value 0 X X X X X 1 1
EVHENB: ADC reference high voltage (VREFH) select control bit.

EVHENB=0: ADC reference high voltage is internal generated, the voltage selected depends on
VHS1~0.
EVHENB=1: ADC reference high voltage is supplied by external pin PA0.
VHS1~0: ADC internal reference high voltage select bits.
11: VREFH=VDD, 10: VREFH=4V, 01: VREFH=3V, 00: VREFH=2V.
3.1.19 ADCR (Sampling pulse and ADC bit Register)

SFR
Name Addr Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Type
ADCR R 0x14 - PBCON5 PBCON4 PBCON3 SHCK1 SHCK0 ADCR1 ADCR0
R/W Property - R/W R/W R/W R/W R/W R/W R/W
Initial Value X 0 0 0 1 0 1 0
SHCK1~0: Sampling pulse width select.
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00: 1 ADC clock, 01: 2 ADC clock, 10: 4 ADC clock, 11: 8 ADC clock.
ADCR1~0: ADC conversion bit no. select.
00: 8-bit ADC, 01: 10-bit ADC, 1x: 12-bit ADC.
PBCONx: PB analog pin select, 3 ≤ x ≤ 5.

0=PBx can be analog ADC input or digital I/O pin.
1=PBx is pure analog ADC input pin for power-saving.
3.1.20 AWUCON (PortA Wake-up Control Register)

SFR
Type
AWUCON R 0x15 WUPA7 WUPA6 WUPA5 WUPA4 WUPA3 WUPA2 WUPA1 WUPA0
WUPAx: Enable/disable PAx wake-up function, 0 ≤ x ≤ 7.

WUPAx=1, enable PAx wake-up function.
WUPAx=0, disable PAx wake-up function.
3.1.21 PACON (ADC analog pin Register)

SFR
Type
PACON R 0x16 PBCON2 PBCON1 PBCON0 PACON4 PACON3 PACON2 PACON1 PACON0
PACONx: PA analog pin select, 0 ≤ x ≤ 4.

0=PAx can be analog ADC input or digital I/O pin.
1=PAx is pure analog ADC input pin for power-saving.
PBCONx: PB analog pin select, 0 ≤ x ≤ 2.

0=PBx can be analog ADC input or digital I/O pin.
1=PBx is pure analog ADC input pin for power-saving.
3.1.22 ADJMD (ADC adjustment mode)

SFR
Type
ADJMD R 0x17 - - ADJ_SIGN ADJ[4] ADJ[3] ADJ[2] ADJ[1] ADJ[0]

ADJ[x]: adjustment bit select, 0 ≤ x ≤ 4.
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00000=offset 0mV
11111=offset 12.5mV.
ADJ_SIGN: adjustment sign bit

0= adc data decrease
1=adc data increase
Note: For application, please refer to NYIDE example code “ADC_Interrupt _AutoK”.
3.1.23 INTEDG (Interrupt Edge Register)
INTEDG R 0x18 - - EIS1 EIS0 INT1G1 INT1G0 INT0G1 INT0G0

EIS1: External interrupt 1 select bit

EIS1=1, PB1 is external interrupt 1.
EIS1=0, PB1 is GPIO.
EIS0: External interrupt 0 select bit

EIS0=1, PB0 is external interrupt 0.
EIS0=0, PB0 is GPIO.
INT1G1~0: INT1 edge trigger select bit.

00: reserved, 01: rising edge, 10: falling edge, 11: rising/falling edge.
INT0G1~0: INT0 edge trigger select bit.

00: reserved, 01: rising edge, 10: falling edge, 11: rising/falling edge.
3.1.24 TMRH (Timer High Byte Register)

SFR
Type
PWM2 PWM2 PWM1 PWM1
TMRH R 0x19 TMR29 TMR28 TMR19 TMR18
DUTY9 DUTY8 DUTY9 DUTY8
Initial Value X X X X X X X X
TMR29~8: Timer2 MSB 2 bits. Write these 2 bits will overwrite the 10-bit Timer2 load value of bit 9
and 8. Read these 2 bits will get the Timer2 bit9-8 current value.
TMR19~8: Timer1 MSB 2 bits. Write these 2 bits will overwrite the 10-bit Timer1 load value of bit 9
and 8. Read these 2 bits will get the Timer1 bit9-8 current value.
PWM2DUTY9~8: PWM2 duty data MSB 2 bits.
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3.1.25 ANAEN (Analog Circuit Enable Register)

SFR
Type
ANAEN R 0x1A CMPEN - - - - - - -
R/W Property R/W - - - - - - -
Initial Value 0 X X X X X X X
CMPEN: Enable/disable voltage comparator.

CMPEN=1, enable voltage comparator.
CMPEN=0, disable voltage comparator.
3.1.26 RFC (RFC Register)
RFC R 0x1B RFCEN - - - PSEL[3:0]

R/W Property R/W - - - R/W
Initial Value 0 X X X 0
RFCEN: Enable/disable RFC function.

RFCEN=1, enable RFC function.
RFCEN=0, disable RFC function.
PSEL[3:0]: Select RFC pad.
PSEL[3:0] RFC PAD

0000 PA0
0001 PA1
0010 PA2
0011 PA3
0100 PA4
0101 PA5
0110 PA6
0111 PA7
1000 PB0
1001 PB1
1010 PB2
1011 PB3
1100 PB4
1101 PB5
Table 3 RFC pad select
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3.1.27 TM3RH (Timer3 High Byte Register)
SFR
Name Addr Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Type
TM3RH R 0x1C - - TMR39 TMR38 PWM4D9 PWM4D8 PWM3D9 PWM3D8
Initial Value - - X X X X X X
TMR39~8: Timer3 MSB 2 bits. Write these 2 bits will overwrite the 10-bit Timer3 load value of bit 9 and
8.Read these 2 bits will get the Timer3 bit9-8 current value.
3.1.28 INTE2 (Interrupt Enable and Flag 2nd. Register)
INTE2 R 0x1F - - - T3IF - - - T3IE

R/W Property - - - R/W - - - R/W
Initial Value - - - 0 - - - 0


3.2 T0MD Register

T0MD is a readable/writeable register which is only accessed by instruction T0MD / T0MDR.
T0MD - - LCKTM0 GP6 T0CS T0CE PS0WDT PS0SEL[2:0]
R/W Property R/W
Initial Value(note*) 0 0 1 1 1 111
PS0SEL[2:0]: Prescaler0 dividing rate selection. The rate depends on Prescaler0 is assigned to Timer0 or
WDT. When Prescaler0 is assigned to WDT, the dividing rate is dependent on which timeout
mechanism is selected.
Dividing Rate
PS0SEL[2:0] PS0WDT=0 PS0WDT=1 PS0WDT=1
(Timer0) (WDT Reset) (WDT Interrupt)
000 1:2 1:1 1:2
001 1:4 1:2 1:4
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Dividing Rate
PS0SEL[2:0] PS0WDT=0 PS0WDT=1 PS0WDT=1
(Timer0) (WDT Reset) (WDT Interrupt)
010 1:8 1:4 1:8
011 1:16 1:8 1:16
100 1:32 1:16 1:32
101 1:64 1:32 1:64
110 1:128 1:64 1:128
111 1:256 1:128 1:256
Table 4 Prescaler0 Dividing Rate
PS0WDT: Prescaler0 assignment.

PS0WDT=1, Prescaler0 is assigned to WDT.
PS0WDT=0, Prescaler0 is assigned to Timer0.
Note: Always set PS0WDT and PS0SEL[2:0] before enabling watchdog or timer interrupt, or reset or
interrupt may be falsely triggered.
T0CE: Timer0 external clock edge selection.

T0CE=1, Timer0 will increase one while high-to-low transition occurs on pin EX_CKI0.
T0CE=0, Timer0 will increase one while low-to-high transition occurs on pin EX_CKI0.
Note: T0CE is also applied to Low Oscillator Frequency as Timer0 clock source condition.
T0CS: Timer0 clock source selection.

T0CS=1, External clock on pin EX_CKI0 or Low Oscillator Frequency (I_LRC or E_LXT) is selected.
T0CS=0, Instruction clock FINST is selected.
GP6: General register.
LCKTM0: When T0CS=1, timer 0 clock source can be optionally selected to be low-frequency
oscillator.
T0CS=0, Instruction clock FINST is selected as Timer0 clock source.
T0CS=1, LCKTM0=0, external clock on pin EX_CKI0 is selected as Timer0 clock source.
T0CS=1, LCKTM0=1, Low Oscillator Frequency (I_LRC or E_LXT, depends on configuration word
Low Oscillator Frequency) output replaces pin EX_CKI0 as Timer0 clock source.
Note: For more detail descriptions of Timer0 clock source select, please see Timer0 section.
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3.3 F-page Special Function Register
3.3.1 IOSTA (PortA I/O Control Register)

IOSTA F 0x5 IOPA7 IOPA6 IOPA5 IOPA4 IOPA3 IOPA2 IOPA1 IOPA0
IOPAx: PAx I/O mode selection, 0 ≤ x ≤ 7.

IOPAx=1, PAx is input mode.
IOPAx=0, PAx is output mode.
3.3.2 IOSTB (PortB I/O Control Register)

IOSTB F 0x6 - - IOPB5 IOPB4 IOPB3 IOPB2 IOPB1 IOPB0
IOPBx: PBx I/O mode selection, 0 ≤ x ≤ 5.

IOPBx=1, PBx is input mode.
IOPBx=0, PBx is output mode.
3.3.3 APHCON (PortA Pull-High Resistor Control Register)

APHCON F 0x9 /PHPA7 /PHPA6 /PLPA5 /PHPA4 /PHPA3 /PHPA2 /PHPA1 /PHPA0
R/W Property R/W
/PHPAx: Enable/disable Pull-High resistor of PAx, x=0~4, 6~7.

/PHPAx=1, disable Pull-High resistor of PAx.
/PHPAx=0, enable Pull-High resistor of PAx.
/PLPA5: Enable/disable Pull-Low resistor of PA5.

/PLPA5=1, disable Pull-Low resistor of PA5.
/PLPA5=0, enable Pull-Low resistor of PA5.
Note: When PA6 and PA7 are used as crystal oscillator pads, the Pull-High resistor should not
enable. Or the oscillation may fail.
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3.3.4 PS0CV (Prescaler0 Counter Value Register)
PS0CV F 0xA PS0CV[7:0]
R/W Property R
While reading PS0CV, it will get current value of Prescaler0 counter.
3.3.5 BODCON (PortB Open-Drain Control Register)

BODCON F 0xC - - ODPB5 ODPB4 ODPB3 ODPB2 ODPB1 ODPB0
ODPBx: Enable/disable open-drain of PBx, 0 ≤ x ≤ 5.

ODPBx=1, enable open-drain of PBx.
ODPBx=0, disable open-drain of PBx.
3.3.6 CMPCR (Comparator voltage select Control Register)

CMPCR F 0xE PS3 PS2 PS1 PS0 VS3 VS2 VS1 VS0
R/W Property R/W
VS[3:0], PS[3:0]: When VS[3:0]=0, the comparator is in P2P mode, else it is in P2V mode.
When the comparator is in P2V mode, VS[3:0] select one of 15 reference voltages as the inverting input of
the comparator. And PS[3:0] determine one of 11 pads as the non-inverting input of the comparator.
When the comparator is in P2P mode, VS[3:0] is fixed 0, and PS[3:0] select 2 pads out of 4 combinations to
be the inverting and non-inverting input of the comparator. For detail P2P mode please see function
description comparator section.
VS[3:0] V- of Comparator PS[3:0] Selected pad

0000 P2P mode 0000 PA0
0001 1 / 16 VDD 0001 PA1
0010 2 / 16 VDD 0010 PA2
0011 3 / 16 VDD 0011 PA3
0100 4 / 16 VDD 0100 -
0101 5 / 16 VDD 0101 -
0110 6 / 16 VDD 0110 -
0111 7 / 16 VDD 0111 -
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VS[3:0] V- of Comparator PS[3:0] Selected pad
1000 8 / 16 VDD 1000 -
1001 9 / 16 VDD 1001 -
1010 10 / 16 VDD 1010 -
1011 11 / 16 VDD 1011 -
1100 12 / 16 VDD 1100 -
1101 13 / 16 VDD 1101 -
1110 14 / 16 VDD 1110 -
1111 15 / 16 VDD 1111 -
Table 5 P2V Mode
PS[3:0] Non-inverting input Inverting input

0000 PA0 PA1
0001 PA1 PA0
0010 PA2 PA3
0011 PA3 PA2
Table 6 P2P Mode (VS[3:0] = 4’b0000)
3.3.7 PCON1 (Power Control Register1)

PCON1 F 0xF GIE LVDOUT GP5 LVDS2 LVDS1 LVDS0 GP1 T0EN
R/W Property R/W(1*) R R/W R/W R/W R/W R/W R/W
Initial Value 0 X 0 1 1 1 0 1
T0EN: Enable/disable Timer0.

T0EN=1, enable Timer0.
T0EN=0, disable Timer0.
LVDS2~0: Select one of the 8 LVD voltage.

LVDS[2:0] Voltage
000 2.0V
001 2.2V
010 2.4V
011 2.7V
100 3.0V
101 3.3V
110 3.6V
111 4.3V
Table 7 LVD voltage select
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LVDOUT: Low voltage detector output, read-only.
GIE: Global interrupt enable bit.

GIE=1, enable all unmasked interrupts.
GIE=0, disable all interrupts.
GP5, GP1: General purpose read/write register.
(1*) : set by instruction ENI, clear by instruction DISI, read by instruction IOSTR.
3.4 S-page Special Function Register

TMR1 S 0x0 TMR1[7:0]
R/W Property R/W
Initial Value XXXXXXXX
When reading register TMR1, it will obtain current value of 10-bit down-count Timer1 at TMR1[9:0]. When
writing register TMR1, it will write data from TMRH[5:4] and Timer1 reload register to TMR1[9:0] current
content.
3.4.2 T1CR1 (Timer1 Control Register1)

SFR
Type
T1CR1 S 0x1 PWM1OEN PWM1OAL - - - T1OS T1RL T1EN
R/W Property R/W R/W - - - R/W R/W R/W
Initial Value 0 0 X X X 0 0 0
This register is used to configure Timer1 functionality.

T1RL: Configure Timer1 down-count mechanism while Non-Stop mode is selected (T1OS=0).
T1RL=1, initial value is reloaded from reload register TMR1[9:0].
T1RL=0, continuous down-count from 0x3FF when underflow is occurred.
T1OS: Configure Timer1 operating mode while underflow is reached.

T1OS=1, One-Shot mode. Timer1 will count once from the initial value to 0x00.
T1OS=0, Non-Stop mode. Timer1 will keep down-count after underflow.
T1OS T1RL Timer1 Down-Count Functionality
Timer1 will count from reload value down to 0x00.
0 0
When underflow is reached, 0x3FF is reloaded and continues down-count.
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0 1
When underflow is reached, reload value is reloaded and continues to down-count.
Timer1 will count from initial value down to 0x00.
1 x
When underflow is reached, Timer1 will stop down-count.
Table 8 Timer1 Functionality
PWM1OAL: Define PWM1 output active state.

PWM1OAL=1, PWM1 output is active low.
PWM1OAL=0, PWM1 output is active high.
PWM1OEN: Enable/disable PWM1 output.

PWM1OEN=1, PWM1 output will be present on PB3.
PWM1OEN=0, PB3 is GPIO.

T1CR2 S 0x2 - - T1CS T1CE /PS1EN PS1SEL[2:0]
PS1SEL[2:0]: Prescaler1 dividing rate selection.
PS1SEL[2:0] Dividing Rate

000 1:2
001 1:4
010 1:8
011 1:16
100 1:32
101 1:64
110 1:128
111 1:256
Note: Always set PS1SEL[2:0] at /PS1EN=1, or interrupt may be falsely triggered.
/PS1EN: Disable/enable Prescaler1.

/PS1EN=1, disable Prescaler1.
/PS1EN=0, enable Prescaler1.

T1CE=1, Timer1 will decrease one while high-to-low transition occurs on pin EX_CKI0.
T1CE=0, Timer1 will decrease one while low-to-high transition occurs on pin EX_CKI0.
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T1CS=1, External clock on pin EX_CKI0 is selected.
T1CS=0, Instruction clock is selected.
3.4.4 PWM1DUTY (PWM1 Duty Register)

PWM1DUTY S 0x3 PWM1DUTY[7:0]
R/W Property W
The reload value of 10-bit Timer1 stored on registers TMRH[5:4] and TMR1[7:0] is used to define the PWM1
frame rate, and registers TMRH[1:0] and PWM1DUTY[7:0] is used to define the duty cycle of PWM1.

PS1CV S 0x4 PS1CV[7:0]
R/W Property R
3.4.6 BZ1CR (Buzzer1 Control Register)

BZ1CR S 0x5 BZ1EN - - - BZ1FSEL[3:0]
R/W Property W - - - W
Initial Value 0 X X X 1 1 1 1
BZ1FSEL[3:0]: Frequency selection of BZ1 output.

BZ1 Frequency Selection
BZ1FSEL[3:0]
Clock Source Dividing Rate
0000 1:2
0001 1:4
0010 1:8
0011 1:16
Prescaler1 output
0100 1:32
0101 1:64
0110 1:128
0111 1:256
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BZ1FSEL[3:0]
1000 Timer1 bit 0

1001 Timer1 bit 1
1010 Timer1 bit 2
1011 Timer1 bit 3
Timer1 output
1100 Timer1 bit 4
1101 Timer1 bit 5
1110 Timer1 bit 6
1111 Timer1 bit 7
Table 10 Buzzer1 Output Frequency Selection
BZ1EN: Enable/Disable BZ1 output.

BZ1EN=1, enable Buzzer1.
BZ1EN=0, disable Buzzer1.
3.4.7 IRCR (IR Control Register)

IRCR S 0x6 IROSC358M - - - - IRCSEL IRF57K IREN
R/W Property W - - - - W W W
Initial Value 0 X X X X 0 0 0
IREN: Enable/Disable IR carrier output.

IREN=1, enable IR carrier output.
IREN=0, disable IR carrier output.
IRF57K: Selection of IR carrier frequency.

IRF57K=1, IR carrier frequency is 57KHz.
IRF57K=0, IR carrier frequency is 38KHz.
IRCSEL: Polarity selection of IR carrier.

IRCSEL=0, IR carrier will be generated when I/O pin data is 1.
IRCSEL=1, IR carrier will be generated when I/O pin data is 0.
IROSC358M: When external crystal is used, this bit is determined according to what kind of crystal is used.
This bit is ignored if internal high frequency oscillation is used.
IROSC358M=1, crystal frequency is 3.58MHz.
IROSC358M=0, crystal frequency is 455KHz.
Note:
1. Only high oscillation (FHOSC) (See section 3.17) can be used as IR clock source.
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2. Division ratio for different oscillation type.
OSC. Type 57KHz 38KHz Conditions
HIRC mode (the input to IR module is set to 4MHz no matter

High IRC(4MHz) 64 96
what system clock is)
Xtal 3.58MHz 64 96 Xtal mode & IROSC358M=1
Xtal 455KHz 8 12 Xtal mode & IROSC358M=0
Table 11 Division ratio for different oscillation type
3.4.8 TBHP (Table Access High Byte Address Pointer Register)

TBHP S 0x7 - - - - - TBHP2 TBHP1 TBHP0
R/W Property - - - - - R/W R/W R/W
When instruction CALLA, GOTOA or TABLEA is executed, the target address is constituted by TBHP[2:0]
and ACC. ACC is the Low Byte of PC[10:0] and TBHP[2:0] is the high byte of PC[10:0].
3.4.9 TBHD (Table Access High Byte Data Register)

TBHD S 0x8 - - TBHD5 TBHD4 TBHD3 TBHD2 TBHD1 TBHD0
R/W Property - - R R R R R R
When instruction TABLEA is executed, high byte of content of addressed ROM is loaded into TBHD[5:0]
register. The Low Byte of content of addressed ROM is loaded to ACC.

TMR2 S 0x9 TMR2[7:0]
R/W Property R/W
writing register TMR2, it will write data from TMRH[7:6] and Timer2 reload register to Timer2[9:0] current
content.
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T2CR1 S 0xA PWM2OEN PWM2OAL - - - T2OS T2RL T2EN

T2RL=1, initial value is reloaded from reload register TMR2.


0 0

0 1

1 x


PWM2OEN=1, PWM2 output will be present on PB2.
PWM2OEN=0, PB2 is GPIO.

T2CR2 S 0xB - - T2CS T2CE /PS2EN PS2SEL[2:0]
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000 1:2
001 1:4
010 1:8
011 1:16
100 1:32
101 1:64
110 1:128
111 1:256




PWM2DUTY S 0xC PWM2DUTY[7:0]
R/W Property W
The reload value of 10-bit Timer2 stored on registers TMRH[7:6] and TMR2[7:0] is used to define the PWM2
frame rate, and registers TMRH[3:2] and PWM2DUTY[7:0] is used to define the duty cycle of PWM2.

PS2CV S 0xD PS2CV[7:0]
R/W Property R
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BZ2CR S 0xE BZ2EN - - - BZ2FSEL[3:0]

BZ2FSEL[3:0]
0000 1:2
0001 1:4
0010 1:8
0011 1:16
Prescaler2 output
0100 1:32
0101 1:64
0110 1:128
0111 1:256
1000 Timer2 bit 0
1001 Timer2 bit 1
1010 Timer2 bit 2
1011 Timer2 bit 3
Timer2 output
1100 Timer2 bit 4
1101 Timer2 bit 5
1110 Timer2 bit 6
1111 Timer2 bit 7

3.4.16 OSCCR (Oscillation Control Register)

SFR
Type
OSCCR S 0xF CMPOUT CMPOE CMPIF CMPIE OPMD[1:0] STPHOSC SELHOSC
R/W Property R R/W R/W R/W R/W R/W R/W
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Initial Value X 0 0 0 00 0 1
SELHOSC: Selection of system oscillation (FOSC).

SELHOSC=1, FOSC is high-frequency oscillation (FHOSC).
SELHOSC=0, FOSC is low-frequency oscillation (FLOSC).
STPHOSC: Disable/enable high-frequency oscillation (FHOSC).

STPHOSC=1, FHOSC will stop oscillation and be disabled.
STPHOSC=0, FHOSC keep oscillation.
OPMD[1:0]: Selection of operating mode.

OPMD[1:0] Operating Mode
00 Normal mode
01 Halt mode
10 Standby mode
11 reserved
Table 15 Selection of Operating Mode by OPMD[1:0]
CMPIE: Enable/Disable of comparator interrupt.

CMPIE=1, Enable of comparator interrupt.
CMPIE=0, Disable of comparator interrupt.
CMPIF: Comparator output change state interrupt is occurred.

CMPIF=1, comparator interrupt is occurred.
CMPIF must be clear by firmware.
CMPOE: Disable/enable comparator output to pad PB3.

CMPOE=1, enable comparator output to pad PB3.
CMPOE=0, disable comparator output to pad PB3.
Note: Comparator output to pad PB3 has higher priority than pwm1/buzzer1 output to pad PB3.
CMPOUT: Comparator output status, read-only.
Note: STPHOSC cannot be changed with SELHOSC or OPMD at the same time. STPHOSC cannot be
changed with OPMD at the same time during SELHOSC1.

TMR3 S 0x10 TMR3[7:0]
R/W Property R/W
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writing register TMR3, it will write data from TM3RH[5:4] and Timer3 reload register to Timer3[9:0] current
content.

T3CR1 S 0x11 PWM3OEN PWM3OAL - - - T3OS T3RL T3EN

T3RL=1, initial value is reloaded from reload register TMR3.


0 0
0 1
1 x


PWM3OEN=1, PWM3 output will be present on PA2.
PWM3OEN=0, PA2 is GPIO.

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T3CR2 S 0x12 - - T3CS T3CE /PS3EN PS3SEL[2:0]

000 1:2
001 1:4
010 1:8
011 1:16
100 1:32
101 1:64
110 1:128
111 1:256




R/W Property W
The reload value of 10-bit Timer3 stored on registers TM3RH[5:4] and TMR3[7:0] is used to define the
PWM3 frame rate, and registers TM3RH[1:0] and PWM3DUTY[7:0] is used to define the duty cycle of
PWM3.

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PS3CV S 0x14 PS3CV[7:0]
R/W Property R

BZ3CR S 0x15 BZ3EN - - - BZ3FSEL[3:0]

BZ3FSEL[3:0]
0000 1:2
0001 1:4
0010 1:8
0011 1:16
Prescaler3 output
0100 1:32
0101 1:64
0110 1:128
0111 1:256
1000 Timer3 bit 0
1001 Timer3 bit 1
1010 Timer3 bit 2
1011 Timer3 bit 3
Timer3 output
1100 Timer3 bit 4
1101 Timer3 bit 5
1110 Timer3 bit 6
1111 Timer3 bit 7

3.4.23 P4CR1 (PWM4 Control Register1)

P4CR1 S 0x16 PWM4OEN PWM4OAL - - - - - -
R/W Property R/W R/W - - - - - -
Initial Value 0 0 X X X X X X
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PWM4OEN=1, PWM4 output will be present on PA3 or PA7.
PWM2OEN=0, PA3 or PA7 is GPIO.
Note: PWM4 output pin is defined by NYIDE Config Block Setting.

R/W Property W
The reload value of 10-bit Timer3 stored on registers TM3RH[5:4] and TMR3[7:0] is used to define the
PWM4 frame rate, and registers TM3RH[3:2] and PWM4DUTY[7:0] is used to define the duty cycle of
PWM4.
3.5 I/O Port

NY8B062E provides 14 I/O pins which are PA[7:0] and PB[5:0]. User can read/write these I/O pins through
registers PORTA and PORTB respectively. Each I/O pin has a corresponding register bit to define it is input pin
or output pin. Register IOSTA[7:0] define the input/output direction of PA[7:0]. Register IOSTB[5:0] define the
input/output direction of PB[5:0].
When an I/O pin is configured as input pin, it may have Pull-High resistor or Pull-Low resistor which is enabled
or disabled through registers. Register APHCON[7:6, 4:0] are used to enable or disable Pull-High resistor of
PA[7:6, 4:0]. Register APHCON[5] and ABPLCON[3:0] are used to enable or disable Pull-Low resistor of PA[5,
3:0]. Register BPHCON[5:0] are used to enable or disable Pull-High resistor of PB[5:0]. Register ABPLCON[7:4]
are used to enable or disable Pull-Low resistor of PB[3:0]. PCON[4] is used to enable or disable Pull-High
resistor of PA[5].
When an PortB I/O pin is configured as output pin, there is a corresponding and individual register to select as
Open-Drain output pin. Register BODCON[5:0] determine PB[5:0] is Open-Drain or not.
The summary of Pad I/O feature is listed in the table below.

Feature PA[3:0] PA[7:6]&PA[4] PA[5] PB[3:0] PB[5:4]
Pull-High Resistor V V V V V
Input
Pull-Low Resistor V X V V X
Output Open-Drain X X always V V
Table 19 Summary of Pad I/O Feature
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The level change on each I/O pin of PA and PB may generate interrupt request. Register AWUCON[7:0] and
BWUCON[5:0] will select which I/O pin of PA and PB may generate this interrupt. As long as any pin of PA and
PB is selected by corresponding bit of AWUCON and BWUCON, the register bit PABIF (INTF[1]) will set to 1 if
there is a level change occurred on any selected pin. An interrupt request will occur and interrupt service routine
will be executed if register bit PABIE (INTE[1]) and GIE (PCON1[7]) are both set to 1.
There is two external interrupt provided by NY8B062E. When register bit EIS0 (INTEDG[4]) is set to 1, PB0 is
used as input pin for external interrupt 0. When register bit EIS1 (INTEDG[5]) is set to 1, PB1 is used as input
pin for external interrupt 1.
Note: When PB0 or PB1 is both set as level change operation and external interrupt, the external
interrupt will have higher priority, and the PB0 or PB1 level change operation will be disabled. But
PB5~PB2 level change function are not affected.
NY8B062E provides IR carrier generation output. When IREN=1, the IR carrier output will be present on PB1
pad. When IREN=0, the IR carrier will not be generated.
PA5 can be used as external reset input determined by a configuration word. When an active-low signal is
applied to PA5, it will cause NY8B062E to enter reset process.
When external crystal (E_HXT, E_XT or E_LXT) is adopted for high oscillation or low oscillation according to
setting of configuration words, PA6 will be used as crystal input pin (Xin) and PA7 will be used as crystal output
pin (Xout).
When I_HRC or I_LRC mode is selected as system oscillation and E_HXT, E_XT or E_LXT is not adopted,
instruction clock is observable on PA7 if a configuration word is enabled.
Moreover, PA4 can be timer 0 external clock source EX_CKI0 if T0MD T0CS=1 and LCK_TM0=0. PA4 can be
timer 1 external clock source EX_CKI0 if T1CS=1. PA1 can be Timer2/Timer3 external clock source EX_CKI1 if
T2CS/T3CS=1.
Moreover, PB3 can be comparator output if CMPOE=1. PB3 can be PWM1 output If T1CR1[7] PWM1OEN=1.
PB3 can be Buzzer1 output if BZ1CR[7] BZ1EN=1. The output priority of PB3 is comparator output > PWM1
output > Buzzer1 output.
PB2 can be PWM2 output If T2CR1[7] PWM2OEN=1. PB2 can be Buzzer2 output if BZ2CR[7] BZ2EN=1. The
output priority of PB2 is PWM2>Buzzer2.
When configured as output, the sink current of each pin can be normal (19mA for VDD =3V), large (28mA for VDD
=3V) according to configuration words. Check the following table for sink current mode setting:
Configuration Word Normal Sink Large Sink
PXcurrent 0 1
PXcsc 0 0
Table 20 Sink current mode setting (X=A, B)
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3.5.1 Block Diagram of IO Pins
IO_SEL: set pad attribute as input or output
WRITE_EN: write data to pad.
READ_EN: read pad.
PULLUP_ENB: enable Pull-High.

PULLDOWN_EN: enable Pull-Low.
VPEN: enable pad to comparator non-inverting input.
VNEN: enable pad to comparator inverting input.

CMPVP, CMPVN: comparator non-inverting and inverting input.
RD_TYPE: select read pin or read latch.
Figure 5 Block Diagram of PA[3:2]&PA0
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IO_SEL: set pad attribute as input or output.
READ_EN: read pad.

VPEN: enable pad to comparator non-inverting input.
VNEN: enable pad to comparator inverting input.
CMPVP, CMPVN: comparator non-inverting and inverting input.
EX_CKI1: external clock for Timer2, 3.
Figure 6 Block Diagram of PA1
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READ_EN: read pad.

EX_CKI0: external clock for Timer0, 1.
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RSTPAD_EN: enable PA5 as reset pin.
RSTB_IN: reset signal input.

READ_EN: read pad.
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XTL_EN: enable crystal oscillation mode.
READ_EN: read pad.

Figure 9 Block Diagram of PA6, PA7
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READ_EN: read pad.
OD_EN: enable open-Drain.

EIS0: external interrupt function enable.
INTEDG[1:0]: external interrupt edge select.
EX_INT0: external interrupt signal.
WUB: port B wake-up enable.
SET_PBIF: port B wake-up flag.
Figure 10 Block Diagram of PB0
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READ_EN: read pad.

EIS1: external interrupt function enable.
INTEDG[3:2]: external interrupt edge select.
EX_INT1: external interrupt signal.
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READ_EN: read pad.

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READ_EN: read pad.

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READ_EN: read pad.

Figure 14 Block Diagram of PB4,5
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3.6 Timer0
Timer0 is an 8-bit up-count timer and its operation is enabled by register bit T0EN (PCON1[0]). Writing to Timer0
will set its initial value. Reading from Timer0 will show its current count value.
The clock source to Timer0 can be from instruction clock, external pin EX_CKI0 or low speed clock Low
Oscillator Frequency according to register bit T0CS and LCK_TM0 (T0MD[5] and T0MD[7]). When T0CS is 0,
instruction clock is selected as Timer0 clock source. When T0CS is 1 and LCK_TM0 is 0, EX_CKI0 is selected
as Timer0 clock source. When T0CS is 1 and LCK_TM0 is 1 (and Timer0 source must set to 1), Low Oscillator
Frequency (I_LRC or E_LXT, depends on configuration word) output is selected. Summarized table is shown
below. (Also check Figure 15)
Timer0 clock source T0CS LCKTM0 Timer0 source Low Oscillator Frequency
Instruction clock 0 X X X
0 X
EX_CKI0 1 X
X 0
E_LXT 1 1 1 1
I_LRC 1 1 1 0
Table 21 Summary of Timer0 clock source control
Moreover the active edge of EX_CKI0 or Low Oscillator Frequency to increase Timer0 can be selected by
register bit T0CE (T0MD[4]). When T0CE is 1, high-to-low transition on EX_CKI0 or Low Oscillator Frequency
will increase Timer0. When T0CE is 0, low-to-high transition on EX_CKI0 or Low Oscillator Frequency will
increase Timer0. When using Low Oscillator Frequency as Timer0 clock source, it is suggested to use
prescaler0 (see below descriptions) and the ratio set to more than 4, or missing count may happen.
Before Timer0 clock source is supplied to Timer0, it can be divided by Prescaler0 if register bit PS0WDT
(T0MD[3]) is clear to 0. When writing 0 to PS0WDT by instruction, Prescaler0 is assigned to Timer0 and
Prescaler0 will be clear after this instruction is executed. The dividing rate of Prescaler0 is determined by
register bits PS0SEL[2:0] which is from 1:2 to 1:256.
When Timer0 is overflow, the register bit T0IF (INTF[0]) will be set to 1 to indicate Timer0 overflow event is
occurred. If register bit T0IE (INTE[0]) and GIE are both set to 1, interrupt request will occur and interrupt service
routine will be executed. T0IF will not be clear until firmware writes 0 to T0IF.
The block diagram of Timer0 and WDT is shown in the figure below.
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Figure 15 Block Diagram of Timer0 and WDT
3.7 Timer1 / PWM1 / Buzzer1
Timer1 is a 10-bit down-count timer with Prescaler1 whose dividing rate is programmable. The output of Timer1
can be used to generate PWM1 output and Buzzer1 output. Timer1 builds in auto-reload function and Timer1
reload register stores reload data with double buffers. When user write Timer1 reload register, write Timer1 MSB
2 bits(TMRH[5:4]) first and write TMR1 second, Timer1 reload register will be updated to Timer1 counter after
Timer1 overflow occurs when T1EN=1. If T1EN=0, Timer1 reload register will be updated to Timer1 counter after
write TMR1 immediately. A read to the Timer1 will show the content of the Timer1 current count value.
The block diagram of Timer1 is shown in the figure below.
Figure 16 Block Diagram of Timer1
The operation of Timer1 can be enabled or disabled by register bit T1EN (T1CR1[0]). After Timer1 is enabled, its
clock source can be instruction clock or pin EX_CKI0 which is determined by register bit T1CS (T1CR2[5]).
When T1CS is 1, EX_CKI0 is selected as clock source. When T1CS is 0, instruction clock is selected as clock
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source. When EX_CKI0 is selected, the active edge to decrease Timer1 is determined by register bit T1CE
(T1CR2[4]). When T1CE is 1, high-to-low transition on EX_CKI0 will decrease Timer1. When T1CE is 0,
low-to-high transition on EX_CKI0 will decrease Timer1. The selected clock source can be divided further by
Prescaler1 before it is applied to Timer1. Prescaler1 is enabled by writing 0 to register bit /PS1EN (T1CR2[3])
and the dividing rate is from 1:2 to 1:256 determined by register bits PS1SEL[2:0] (T1CR2[2:0]). Current value of
Prescaler1 can be obtained by reading register PS1CV.
Timer1 provides two kinds of operating mode: one is One-Shot mode and the other is Non-Stop mode. When
register bit T1OS (T1CR1[2]) is 1, One-Shot mode is selected. Timer1 will count down once from initial value
stored on register TMR1[9:0] to 0x00, i.e. underflow is occurred. When register bit T1OS (T1CR1[2]) is 0,
Non-Stop mode is selected. When underflow is occurred, there are two selections to start next down-count
which is determined by register bit T1RL (T1CR1[1]). When T1RL is 1, the initial value stored on register
TMR1[9:0] will be restored and start next down-count from this initial value. When T1RL is 0, Timer1 will start
next down-count from 0x3FF.
When Timer1 is underflow, the register bit T1IF (INTF[3]) will be set to 1 to indicate Timer1 underflow event is
The timing chart of Timer1 is shown in the following figure.
Figure 17 Timer1 Timing Chart
The PWM1 output can be available on I/O pin PB3 when register bit PWM1OEN (T1CR1[7]) is set to 1.
Moreover, PB3 will become output pin automatically. The active state of PWM1 output is determined by register
bit PWM1OAL (T1CR1[6]). When PWM1OAL is 1, PWM1 output is active low. When PWM1OAL is 0, PWM1
output is active high. Moreover, the duty cycle and frame rate of PWM1 are both programmable. The duty cycle
is determined by registers TMRH[1:0] and PWM1DUTY[7:0]. When PWM1DUTY is 0, PWM1 output will be
never active. When PWM1DUTY is 0x3FF, PWM1 output will be active for 1023 Timer1 input clocks. The frame
rate is determined by TMRH[5:4] + TMR1[7:0] initial value. Therefore, PWM1DUTY value must be less than or
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equal to TMRH[5:4] + TMR1[7:0]. When user write PWM1DUTY, write PWM1DUTY[9:8] MSB 2 bits(TMRH[1:0])
first and write PWM1DUTY[7:0] second, PWM1 duty register will be updated after Timer1 overflow occurs. The
block diagram of PWM1 is illustrated in the following figure.
Figure 18 PWM1 Block Diagram
The Buzzer1 output (BZ1) can be available on I/O pin PB3 when register bit BZ1EN (BZ1CR1[7]) is set to 1.
Moreover, PB3 will become output pin automatically. The frequency of BZ1 can be derived from Timer1 output
or Prescaler1 output and dividing rate is determined by register bits BZ1FSEL[3:0] (BZ1CR[3:0]). When
BZ1FSEL[3] is 0, Prescaler1 output is selected to generate BZ1 output. When BZ1FSEL[3] is 1, Timer1 output is
selected to generate BZ1 output. The dividing rate can be from 1:2 to 1:256 in order to generate all kinds of
frequency. The block diagram of Buzzer1 is illustrated in the following figure.
Figure 19 Buzzer1 Block Diagram
Note: When PWM1 and Buzzer1 are both enabled, PWM1 will have the higher priority for PB3 output.
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3.8 Timer2 / PWM2 / Buzzer2
can be used to generate PWM2 output and Buzzer2 output. Timer2 builds in auto-reload function and Timer2
reload register stores reload data with double buffers. When user write Timer2 reload register, write Timer2 MSB
2 bits(TMRH[7:6]) first and write TMR2 second, Timer2 reload register will be updated to Timer2 counter after
Timer2 overflow occurs when T2EN=1. If T2EN=0, Timer2 reload register will be updated to Timer2 counter after
write TMR2 immediately. A read to the Timer2 will show the content of the Timer2 current count value.
low-to-high transition on EX_CKI1 will decrease Timer2.
The selected clock source can be divided further by Prescaler2 before it is applied to Timer2. Prescaler2 is
enabled by writing 0 to register bit /PS2EN (T2CR2[3]) and the dividing rate is from 1:2 to 1:256 determined by
register bits PS2SEL[2:0] (T2CR2[2:0]). Current value of Prescaler2 can be obtained by reading register
PS2CV.
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When Timer2 is underflow, the register bit T2IF (INTF[5]) will be set to 1 to indicate Timer2 underflow event is
The PWM2 output can be available on I/O pin PB2 when register bit PWM2OEN (T2CR1[7]) is set to 1.
Moreover, PB2 will become output pin automatically. The active state of PWM2 output is determined by register
is determined by register TMRH[3:2],PWM2DUTY[7:0]. When PWM2DUTY is 0, PWM2 output will be never
active. When PWM2DUTY is 0x3FF, PWM2 output will be active for 1023 Timer2 input clocks. The frame rate is
determined by TMRH[7:6],TMR2[7:0] initial value. Therefore, PWM2DUTY value must be less than or equal to
TMR2[9:0]. When user write PWM2DUTY, write PWM2DUTY[9:8] MSB 2 bits(TMRH[3:2]) first and write
PWM2DUTY[7:0] second, PWM2 duty register will be updated after Timer2 overflow occurs. The block diagram
of PWM2 is illustrated in the following figure.
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The Buzzer2 output (BZ2) can be available on I/O pin PB2 when register bit BZ2EN (BZ2CR1[7]) is set to 1.
Moreover, PB2 will become output pin automatically. The frequency of BZ2 can be derived from Timer2 output
or Prescaler2 output and dividing rate is determined by register bits BZ2FSEL[3:0] (BZ2CR[3:0]). When
3.9 Timer3 / PWM3 / Buzzer3 / PWM4
can be used to generate PWM3 output. Timer3 builds in auto-reload function and Timer3 reload register stores
reload data with double buffers. When users write Timer3 reload register, write Timer3 MSB 2 bits(TM3RH[5:4])
first and write TMR3 second, Timer3 reload register will be updated to Timer3 counter after Timer3 overflow
occurs when T3EN=1. If T3EN=0, Timer3 reload register will be updated to Timer3 counter after write TMR3
immediately. A read to the Timer3 will show the content of the Timer3 current count value.
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low-to-high transition on EX_CKI1 will decrease Timer3.
The selected clock source can be divided further by Prescaler3 before it is applied to Timer3. Prescaler3 is
enabled by writing 0 to register bit /PS3EN (T3CR2[3]) and the dividing rate is from 1:2 to 1:256 determined by
register bits PS3SEL[2:0] (T3CR2[2:0]). Current value of Prescaler3 can be obtained by reading register
PS3CV.
When Timer3 is underflow, the register bit T3IF (INTE2[4]) will be set to 1 to indicate Timer3 underflow event is
occurred. If register bit T3IE (INTE2[0]) and GIE are both set to 1, interrupt request will occur and interrupt
service routine will be executed. T3IF will not be clear until firmware writes 0 to T3IF.
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The PWM3 output can be available on I/O pin PA2 when register bit PWM3OEN (T3CR1[7]) is set to 1.
Moreover, PA2 will become output pin automatically. The active state of PWM3 output is determined by register
is determined by register TM3RH[1:0],PWM3DUTY[7:0]. When PWM3DUTY is 0, PWM3 output will be never
active. When PWM3DUTY is 0x3FF, PWM3 output will be active for 1023 Timer3 input clocks. The frame rate is
determined by TM3RH[5:4],TMR3[7:0] initial value. Therefore, PWM3DUTY value must be less than or equal to
TMR3[9:0]. When user write PWM3DUTY, write PWM3DUTY[9:8] MSB 2 bits(TM3RH[1:0]) first and write
PWM3DUTY[7:0] second, PWM3 duty register will be updated after Timer3 overflow occurs. The block diagram
of PWM3 is illustrated in the following figure.
The Buzzer3 output (BZ3) can be available on I/O pin PA2 when register bit BZ3EN (BZ3CR1[7]) is set to 1.
Moreover, PA2 will become output pin automatically. The frequency of BZ3 can be derived from Timer3 output or
Prescaler3 output and dividing rate is determined by register bits BZ3FSEL[3:0] (BZ3CR[3:0]). When
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The PWM4 output can be available on I/O pin PA3 or PA7 when register bit PWM4OEN (P4CR1[7]) is set to 1.
Moreover, PA3 or PA7 will become output pin automatically. The active state of PWM4 output is determined by
register bit PWM4OAL (P4CR1[6]). When PWM4OAL is 1, PWM4 output is active low. When PWM4OAL is 0,
PWM4 output is active high. Moreover, the duty cycle and frame rate of PWM4 are both programmable. The
duty cycle is determined by register TM3RH[3:2],PWM4DUTY[7:0]. When PWM4DUTY is 0, PWM4 output will
be never active. When PWM4DUTY is 0x3FF, PWM4 output will be active for 1023 Timer3 input clocks. The
frame rate is determined by TM3RH[5:4],TMR3[7:0] initial value. Therefore, PWM4DUTY value must be less
than or equal to TMR3[9:0]. When user write PWM4DUTY, write PWM4DUTY[9:8] MSB 2 bits(TM3RH[3:2]) first
and write PWM4DUTY[7:0] second, PWM4 duty register will be updated after Timer3 overflow occurs. The block
diagram of PWM4 is illustrated in the following figure.
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3.10 RFC Mode
NY8B062E has built-in RFC mode. Once RFC mode is enabled, the selected input pad state will take control of
the Timer1 counting. When the selected input pad is recognized as 0 state (The input pad voltage is smaller
than VIL), Timer1 keeps counting. When this selected pad is recognized as 1 (The input pad voltage is larger
than VIH), Timer1 stops counting. The following figure shows how RFC mode operates: PSEL3~0 is used to
select one RFC input pad out of 14 NY8B062E pads. RFCEN is used to switch the Timer1 enable signal
between the normal enable signal T1EN and RFC selected input state.
One application of RFC mode is to measure the capacitor-resistor charging time, As the figure shows, when
PSEL3~0=0x01, PA1 is selected as RFC input pad. At first the PA1 is set as output low (the voltage of PA1 is
discharged to 0). Next step, clear Timer1 content, set PA1 as input and enable RFC mode. Then Timer1 will
start counting, and the RC circuit will start charging PA1. As PA1 is charged to the VIH voltage, the Timer1
counting is stopped because PA1 input is high. The Timer1 content will show the RC circuit charging time.
(Note: Timer1 is down-count.)
Figure 28 RFC Block Diagram
3.11 IR Carrier
The IR carrier will be generated after register bit IREN (IRCR[0]) is set to 1. Moreover, PB1 will become output
pin automatically. When IREN is clear to 0, PB1 will become general I/O pin as it was configured.
The IR carrier frequency is selectable by register bit IRF57K (IRCR[1]). When IRF57K is 1, IR carrier frequency
is 57KHz. When IRF57K is 0, IR carrier frequency is 38KHz. Because IR carrier frequency is derived from high
frequency system oscillation FHOSC, it is necessary to specify what frequency is used as system oscillation when
external crystal is used. Register bit IROSC358M (IRCR[7]) is used to provide NY8B062E this information.
When IROSC358M is 1, frequency of external crystal is 3.58MHz and when IROSC358M is 0, frequency of
external crystal is 455KHz. When internal high frequency oscillation is adopted, this register will be ignored, and
it will provide 4MHz clock to IR module.
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The active state (polarity) of IR carrier is selectable according to PB1 output data. When register bit IRCSEL
(IRCR[2]) is 1, IR carrier will be present on pin PB1 when its output data is 0. When register bit IRCSEL
(IRCR[2]) is 0, IR carrier will be present on pin PB1 when its output data is 1. The polarity of IR carrier is shown
in the following figure.
Figure 29 Polarity of IR Carrier vs. Output Data
3.12 Low Voltage Detector (LVD)

NY8B062E low voltage detector (LVD) built-in precise band-gap reference for accurately detecting VDD level. If
LVDEN(register PCON[5])=1 and VDD voltage value falls below LVD voltage which is selected by LVDS[2:0] as
table shown below, the LVD output will become low. If the LVD interrupt is enabled, the LVD interrupt flag will be
high and if GIE=1 it will force the program to execute interrupt service routine. Moreover, LVD real-state output
can be polled by register PCON1[6]. The following is LVD block diagram:
Figure 30 LVD block diagram
The following table is LVD voltage select table.

LVDS[2:0] Voltage
000 2.0V
001 2.2V
010 2.4V
011 2.7V
100 3.0V
101 3.3V
110 3.6V
111 4.3V
Table 22 LVD voltage select
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3.13 Voltage Comparator

NY8B062E provides 1 set of voltage comparator and internal reference voltage with various analog comparing
mode. The comparator non-inverting and inverting input can share with GPIO. The internal reference voltage
can only routed to inverting input of comparator.
CMPEN (register ANAEN[7]) is used to enable and disable comparator. When CMPEN=0(default), comparator
is disabled. When CMPEN=1, the comparator is enabled. In halt mode the comparator is disabled automatically.
NY8B062E comparator has two operating mode, which is P2V mode and P2P mode. These two modes are
determined by VS[3:0] (register CMPCR[3:0]). When VS[3:0]=0, the comparator is in P2P mode. When
VS[3:0]=1~15, it is in P2V mode. The pads used in the comparator are set as analog pads in the configuration
words “Comparator Input” Pin Select.
P2V mode has the function of comparing voltage between a designated analog pad and a designated reference.
The structure of P2V mode is shown in the following figure:
Figure 31 Comparator P2V mode block diagram
In P2V mode, the inverting input of the comparator is determined by VS[3:0]. VS[3:0] is used to select one out of
15 reference voltages, which is 1/16 VDD to 15/16 VDD as the table shown below.
VS[3:0] Reference voltage
0000 P2P mode

0001 1/16 VDD
0010 2/16 VDD
0011 3/16 VDD
0100 4/16 VDD
0101 5/16 VDD
0110 6/16 VDD
0111 7/16 VDD
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1000 8/16 VDD
VS[3:0] Reference voltage
1001 9/16 VDD
1010 10/16 VDD
1011 11/16 VDD
1100 12/16 VDD
1101 13/16 VDD
1110 14/16 VDD
1111 15/16 VDD
Table 23 P2V mode reference voltage select
In P2V mode, the non-inverting input of the comparator is determined by PS[3:0] (register CMPCR[7:4]). PS[3:0]
select one out of 4 pads PA0~3 as the non-inverting input of the comparator. The table is shown below.
PS[3:0] Selected Pad
0000 PA0
0001 PA1
0010 PA2
0011 PA3
0100 ~1111 -
Table 24 P2V mode pad select
The P2P mode has the function of comparing voltage between two analog pads. In this mode VS[3:0]=0, PS[3:0]
select 2 out of 4 analog pads to be the non-inverting and inverting input of the comparator. The selection table is
as the below.
Figure 32 Comparator P2P mode block diagram
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PS[3:0] Non-inverting input Inverting input
0000 PA0 PA1

0001 PA1 PA0
0010 PA2 PA3
0011 PA3 PA2
0100~1111 - -
Table 25 P2P mode pads select
There are 3 ways to get the comparator output result: One is through interrupt mechanism, one is through
register polling, another is through probing output pad.
To use comparator interrupt function, set CMPEN=1 and CMPIE=1, then read register OSCCR which will end the
mismatch condition of comparator output and registered comparator output, then clear interrupt flag CMPIF.
When comparator output change state, the CMPIF will be set to 1, thus entering interrupt service routine.
Comparator output can be polled by CMPOUT (register OSCCR[7] ).
To probe comparator output at output pad, set CMPOE (register OSCCR[6]) to 1, then PB3 will be the real-time
state of the comparator output. It is noted that when CMPOE=1, the PWM1 function will be disabled if it is
enabled.
3.14 Analog-to-Digital Convertor (ADC)

NY8B062E provide 11+1 channel 12-bit SAR ADC to transfer analog signal into 12-bits digital data. The ADC
high reference voltage is selectable. They can be external voltage from PA0, or internal generated voltage VDD,
4V, 3V or 2V. The Analog input is selected from analog signal input pin PA0~PA4, PB0~PB5 or from internal
generated 1 / 4 *VDD. The ADC clock ADCLK can be selected to be FINST/1, FINST/2, FINST/8 or FINST/16. The
Sampling pulse width can be selected to be ADCLK*1, ADCLK*2, ADCLK*4 or ADCLK*8. Set ADEN=1 before
ADC take into operation. Then set START=1, the ADC will start to convert analog signal to digital. EOC=0
means ADC is in processing. EOC=1 indicate ADC is at end of conversion. If ADIE=1 and global interrupt is
enabled, the ADC interrupt will issue after EOC low go high. The block diagram is as following figure.
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Figure 33 ADC block diagram
3.14.1 ADC reference voltage

ADC is built-in five high reference voltage source controlled by ADVREFH register. These high reference
voltage source are one external voltage source (PA0) and four internal voltage source (VDD, 4V, 3V, 2V).
When EVHENB bit is “1”, ADC reference voltage is external voltage source from PA0. In this mode PA0 must
input a voltage between VDD and 2V. If EVHENB bit is 0, ADC reference voltage is from internal voltage
source selected by VHS[1:0]. If VHS[1:0] is “11”, ADC reference voltage is VDD. If VHS[1:0] is “10”, ADC
reference voltage is 4V. If VHS[1:0] is “01”, ADC reference voltage is 3V. If VHS[1:0] is “00”, ADC reference
voltage is 2V. The limitation of internal reference voltage application is VDD can't below each of internal
voltage level, or the level is equal to VDD. ADC sampling voltage range is limited by high/low reference
voltage. The ADC low reference voltage is VSS and not changeable. The ADC high reference voltage
includes internal VDD/4V/3V/2V and external reference voltage source from PA0 pin. The ADC reference
voltage range limitation is (ADC high reference voltage – low reference voltage) ≥ 2V. ADC low reference
voltage is VSS=0V. So ADC high reference voltage range is 2V ~ VDD.
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ADC analog input signal voltage must be from ADC low reference voltage to ADC high reference voltage. If
the ADC analog input signal voltage is over this range, The ADC converting result is unexpected (full scale or
zero).
EVHENB VHS[1:0] Reference voltage

1 xx PA0
0 11 VDD
0 10 4V
0 01 3V
0 00 2V
Table 26 ADC reference voltage select
3.14.2 ADC analog input channel

ADC use CHS[3:0] and GCHS to select analog input source. GCHS is global channel select. Namely, GCHS
must be 1 before any analog input source can be selected and converted.
GCHS CHS[3:0] ADC analog input source
0 xxxx x
1 0000 PA0
1 0001 PA1
1 0010 PA2
1 0011 PA3
1 0100 PA4
1 0101 PB0
1 0110 PB1
1 0111 PB2
1 1000 PB3
1 1001 PB4
1 1010 PB5
1 1011 1 / 4 * VDD
1 11xx N.C.
Table 27 ADC analog input source select
ADC input pins are shared with digital I/O pins. Connect an analog signal to these pin may cause extra
current leakage in I/O pins. In the power down mode, the above leakage current will be a big problem.
PACON[0:4] are PA[0:4] configuration register, PACON[5:7] are PB[0:2] configuration register and ADCR[4:6]
are PB[3:5] configuration register to solve above problem. Write “1” to PACON and ADCR[4:6] will configure
related PA /PB pin as pure analog input pin to avoid current leakage, and it can't be use as normal I/O.
Except setting the PACON and ADCR[4:6] register, the selected analog input pin must be set as input mode
and the internal pull-high / pull-down must be disabled, otherwise the analog input level may be affected.
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3.14.3 ADC clock (ADCLK), sampling clock (SHCLK) and bit number
Conversion speed and conversion accuracy are affected by the selection of the ADC clock (ADCLK),
sampling pulse width (SHCLK) and conversion bit number. ADCLK is the base clock of ADC. During the
operation of SAR ADC, bit operation is synchronized with ADCLK. SHCLK is the duration of analog signal
sampling time, larger SHCLK will restore original analog signal level more closely but it will slow down the
ADC conversion speed. Vise versa. The ADC can select different conversion bit number which is depended
on ADCR[1:0] register bits. There are 2 bit number to select, which is 12-bit, 10-bit and 8-bit. Less conversion
bit number will speed up the ADC conversion rate but the effective ADC bit is less. More conversion bit
number will slow down the conversion rate but the accuracy is more.
The ADC clock is derived from FINST and is selectable from ADCK[1:0].
ADCK[1:0] ADC clock
00 FINST/16
01 FINST/8
10 FINST/1
11 FINST/2
Table 28 ADC clock select
The Sampling clock width is derived from ADCLK and is selectable from SHCK[1:0].
SHCK[1:0] Sampling clock
00 1 ADCLK
01 2 ADCLK
10 4 ADCLK
11 8 ADCLK
Table 29 ADC sampling clock select
ADC bit number select is from ADCR[1:0].

ADCR[1:0] Conversion bit number
00 8-bit
01 10-bit
1x 12-bit
Table 30 conversion bit number select
The ADC converting time is from START(Start to ADC convert) to EOC=1 (End of ADC convert). The duration
is depending on ADC resolution and ADC clock rate and sampling clock width.
ADC conversion time ≈ sampling clock width + (ADC bit number + 2) * ADCLK width.
The following table is some example conversion time and conversion rate of ADC.
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Conversion FINST=2MHz FINST=250K
Bit No. ADC clock SHCLK Time
(ADCLK No.) Time Rate Time Rate
12 FINST/16 8 ADCLK 22 176us 5.68kHz 1408us 710Hz

12 FINST/1 1 ADCLK 15 7.5us 133.3kHz 60us 16.7kHz
Table 31 ADC Conversion time
3.14.4 ADC operation

Set ADC clock ( ADCLK), sampling clock width (SHCLK), conversion bit number (ADCR), ADC high reference
voltage (ADVREFH), select input channel and PACON related bit. Then set ADEN=1.
After setting ADEN=1, it must wait at least 256us (ADC internal bias stable time) before ADC can operate.
Write START to 1 to start an ADC conversion session. During ADC is in processing EOC=0. Polling EOC=1 or
wait for ADC interrupt at the end of ADC conversion.
3.15 Watch-Dog Timer (WDT)

There is an on-chip free-running oscillator in NY8B062E which is used by WDT. As this oscillator is independent
of other oscillation circuits, WDT may still keep working during Standby mode and Halt mode.
WDT can be enabled or disabled by a configuration word. When WDT is enabled by configuration word, its
operation still can be controlled by register bit WDTEN (PCON[7]) during program execution. Moreover, the
mechanism after WDT time-out can reset NY8B062E or issue an interrupt request which is determined by
another configuration word. At the same time, register bit /TO (STATUS[4]) will be clear to 0 after WDT time-out.
The baseline of WDT time-out period can be 3.5 ms, 15 ms, 60 ms or 250 ms which is determined by two
configuration words. The time-out period can be lengthened if Prescaler0 is assigned to WDT. Prescaler0 will be
assigned to WDT by writing 1 to register bit PS0WDT. The dividing rate of Prescaler0 for WDT is determined by
register bits PS0SEL[2:0] and depends on WDT time-out mechanism. The dividing rate is from 1:1 to 1:128 if
WDT time-out will reset NY8B062E and dividing rate is from 1:2 to 1:256 if WDT time-out will interrupt
NY8B062E.
When Prescaler0 is assigned to WDT, the execution of instruction CLRWDT will clear WDT, Prescaler0 and set
/TO flag to 1.
If user selects interrupt for WDT time-out mechanism, register bit WDTIF (INTF[6]) will set to 1 after WDT is
expired. It may generate an interrupt request if register bit WDTIE (INTE[6]) and GIE both set to 1. WDTIF will
not be clear until firmware writes 0 to WDTIF.
3.16 Interrupt
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NY8B062E provides two kinds of interrupt: one is software interrupt and the other is hardware interrupt.
Software interrupt is caused by execution of instruction INT. There are 11 hardware interrupts:
 Timer0 overflow interrupt.
 Timer1 underflow interrupt.
 WDT timeout interrupt.
 PA/PB input change interrupt.
 External 0 interrupt.
 External 1 interrupt
 LVD interrupt.
 Comparator output status change interrupt.
 ADC end-of-convert interrupt.
GIE is global interrupt enable flag. It has to be 1 to enable hardware interrupt functions. GIE can be set by ENI
instruction and clear to 0 by DISI instruction.
After instruction INT is executed, no matter GIE is set or clear, the next instruction will be fetched from address
0x001. At the same time, GIE will be clear to 0 by NY8B062E automatically. This will prevent nested interrupt
from happening. The last instruction of interrupt service routine of software interrupt has to be RETIE. Execution
of this instruction will set GIE to 1 and return to original execution sequence.
While any of hardware interrupts is occurred, the corresponding bit of interrupt flag will be set to 1. This bit will
not be clear until firmware writes 0 to this bit. Therefore user can obtain information of which event causes
hardware interrupt by polling the corresponding bit of interrupt flag. Note that only when the corresponding
interrupt enable bit is set to 1, will the corresponding interrupt flag be read. And if the corresponding interrupt
enable bit is set to 1 and GIE is also 1, hardware interrupt will occur and next instruction will be fetched from
0x008. At the same time, the register bit GIE will be clear by NY8B062E automatically. If user wants to
implement nested interrupt, instruction ENI can be used as the first instruction of interrupt service routine which
will set GIE to 1 again and allow other interrupt events to interrupt NY8B062E again. Instruction RETIE has to be
the last instruction of interrupt service routine which will set GIE to 1 and return to original execution sequence.
It should be noted that ENI instruction cannot be placed right before RETIE instruction because ENI instruction
in interrupt service routine will trigger nested interrupt, but RETIE will clear internal interrupt processing after
jump out of ISR, so it is possible for interrupt flag to be falsely cleared.
3.16.1 Timer0 Overflow Interrupt

Timer0 overflow (from 0x00 to 0xFF) will set register bit T0IF. This interrupt request will be serviced if T0IE
and GIE are set to 1.
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3.16.2 Timer1 Underflow Interrupt
Timer1 underflow (from 0x3FF to 0x00) will set register bit T1IF. This interrupt request will be serviced if T1IE


3.16.5 WDT Timeout Interrupt

When WDT is timeout and the configuration word selects WDT timeout will generate interrupt request, it will
set register bit WDTIF. This interrupt request will be serviced if WDTIE and GIE are set to 1.
3.16.6 PA/PB Input Change Interrupt

When PAx, 0 ≤ x ≤ 7, PBy, 0 ≤ y ≤ 5 is configured as input pin and corresponding register bit WUPAx, WUPBx
is set to 1, a level change on these selected I/O pin(s) will set register bit PABIF. This interrupt request will be
serviced if PABIE and GIE are set to 1. Note when PB0 or PB1 is both set as level change interrupt and
external interrupt, the external interrupt enable EIS0 or EIS1=1 will disable PB0 or PB1 level change
operation.
3.16.7 External 0 Interrupt

According to the configuration of EIS0=1 and INTEDG, the selected active edge on I/O pin PB0 will set
register bit INT0IF and this interrupt request will be served if INT0IE and GIE are set to 1.
3.16.8 External 1 Interrupt

According to the configuration of EIS1=1 and INTEDG, the selected active edge on I/O pin PB1 will set
register bit INT1IF and this interrupt request will be served if INT1IE and GIE are set to 1.
3.16.9 LVD Interrupt

When VDD level falls below LVD voltage, LVD flag will go from high to low, and set the register bit LVDIF=1.
This interrupt request will be serviced if LVDIE and GIE are set to 1.
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3.16.10 Comparator Output Status Change Interrupt
The comparator interrupt is triggered whenever a change occurs on the comparator output status. This
interrupt request will be serviced if CMPIE and GIE are set to 1. Note that before the comparator interrupt
could happen, reading register OSCCR is needed to clear the previous comparator output status difference.
3.16.11 ADC end of conversion Interrupt

The ADC interrupt is triggered whenever an ADC end-of-convert signal is issued. This interrupt request will
be serviced if ADIE and GIE are set to 1.
3.17 Oscillation Configuration

Because NY8B062E is a dual-clock IC, there are high oscillation (FHOSC) and low oscillation (FLOSC) that can be
selected as system oscillation (FOSC). The oscillators which could be used as FHOSC are internal high RC oscillator
(I_HRC), external high crystal oscillator (E_HXT) and external crystal oscillator (E_XT). The oscillators which could
be used as FLOSC are internal low RC oscillator (I_LRC) and external low crystal oscillator (E_LXT).
Figure 34 Oscillation Configuration of NY8B062E
There are two configuration words to determine which oscillator will be used as FHOSC. When I_HRC is selected
as FHOSC, I_HRC output frequency is determined by three configuration words and it can be 1M, 2M, 4M, 8M,
16M or 20MHz. Moreover, external crystal oscillator pads PA6 and PA7 can be used as I/O pins. On the other
hand, PA7 can be the output pin of instruction clock according to a configuration word’s setting. If FHOSC required
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external crystal whose frequency ranges from 8MHz to 20MHz, E_HXT is recommended. If FHOSC required
external crystal whose frequency ranges from 455KHz to 6MHz, E_XT is recommended. When E_HXT or E_XT
is adopted, PA6/PA7 cannot be used as I/O pins. They must be used as crystal output pin and input pin. PA7 is
crystal output pin (Xout) and PA6 is crystal input pin (Xin).
There is one configuration word to determine which oscillator will be used as FLOSC. When I_LRC is selected, its
frequency is centered on 32768Hz. If FLOSC required external crystal, E_LXT is selected and only 32768Hz
crystal is allowed. When E_LXT is adopted, PA6/PA7 cannot be used as I/O pins. They must be used as crystal
output pin and input pin. PA7 is crystal output pin (Xout) and PA6 is crystal input pin (Xin). The dual-clock
combinations of FHOSC and FLOSC are listed below.
No. FHOSC FLOSC
1 I_HRC I_LRC
2 E_HXT or E_XT I_LRC
3 I_HRC E_LXT
Table 32 Dual-clock combinations
When E_HXT, E_XT or E_LXT is used as one of oscillations, the crystal or resonator is connected to Xin and
Xout to provide oscillation. Moreover, a resistor and two capacitors are recommended to connect as following
figure in order to provide reliable oscillation, refer to the specification of crystal or resonator to adopt appropriate
C1 or C2 value. The recommended value of C1 and C2 are listed in the table below.
Oscillation Mode Crystal Frequency (Hz) C1, C2 (pF)
16M 5 ~ 10
E_HXT 10M 5 ~ 30
8M 5 ~ 20
4M 5 ~ 30
E_XT 1M 5 ~ 30
455K 10 ~ 100
E_LXT 32768 5 ~ 30
Table 33 Recommended C1 and C2 Value for Different Kinds of Crystal Oscillation
For 20MHZ resonator in 2 clock CPU cycle mode, an 18pF C2 capacitor is a must.
To get precise and stable 32.768k frequency, choosing the right C1 and C2 value is important. You need to
match the C1 / C2 capacitance to the specific crystal you chose. Every crystal datasheet lists something called
the Load Capacitance (CL), C1 and C2 value is chosen with the following formula:
C1=C2=2*CL-Cbt
Where Cbt is the NY8B062E crystal pad built-in capacitance, which is about 5pF. For example, for crystal
CL=12.5P, C1=C2=20pF is recommended.
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Figure 35 Connection for External Crystal Oscillation
Either FHOSC or FLOSC can be selected as system oscillation FOSC according to the value of register bit SELHOSC
(OSCCR[0]). When SELHOSC is 1, FHOSC is selected as FOSC. When SELHOSC is 0, FLOSC is selected as FOSC.
Once FOSC is determined, the instruction clock FINST can be FOSC/2 or FOSC/4 according to value of a
configuration word.
3.18 Operating Mode
NY8B062E provides four kinds of operating mode to tailor all kinds of application and save power consumptions.
These operating modes are Normal mode, Slow mode, Standby mode and Halt mode. Normal mode is
designated for high-speed operating mode. Slow mode is designated for low-speed mode in order to save
power consumption. At Standby mode, NY8B062E will stop almost all operations except Timer0/Timer1/Timer2/
Timer3/WDT in order to wake-up periodically. At Halt mode, NY8B062E will sleep until external event or WDT
trigger IC to wake-up. The block diagram of four operating modes is described in the following figure.
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Figure 36 Four Operating Modes
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3.18.1 Normal Mode
After any Reset Event is occurred and Reset Process is completed, NY8B062E will begin to execute
program under Normal mode or Slow mode. Which mode is selected after Reset Process is determined by
the Startup Clock configuration word. If Startup Clock=fast, NY8B062E will enter Normal mode, if Startup
Clock=Slow, NY8B062E will enter Slow mode. At Normal mode, FHOSC is selected as system oscillation in
order to provide highest performance and its power consumption will be the largest among four operating
modes. After power on or any reset trigger is released, NY8B062E will enter Normal mode after reset
process is completed.
 Instruction execution is based on FHOSC and all peripheral modules may be active according to
corresponding module enable bit.
 The FLOSC is still active and running.
 IC can switch to Slow mode by writing 0 to register bit SELHOSC (OSCCR[0]).
 IC can switch to Standby mode or Halt mode by programming register bits OPMD[1:0] (OSCCR[3:2]).
 For real time clock applications, the NY8B062E can run in normal mode, at the same time the
low-frequency clock Low Oscillator Frequency connects to Timer0 clock. This is made possible by setting
LCKTM0 to 1 and corresponding configuration word Timer0 source setting to 1.
3.18.2 Slow Mode

NY8B062E will enter Slow mode by writing 0 to register bit SELHOSC. At Slow mode, FLOSC is selected as
system oscillation in order to save power consumption but still keep IC running. However, FHOSC will not be
disabled automatically by NY8B062E. Therefore user can write 1 to register bit STPHOSC (OSCCR[1]) in slow
mode to reduce power consumption further. But it is noted that it is forbidden to enter slow mode and stop
FHOSC at the same time, one must enter slow mode first, then disable FHOSC, or the program may hang on.
 Instruction execution is based on FLOSC and all peripheral modules may be active according to
corresponding module enable bit.
 FHOSC can be disabled by writing 1 to register bit STPHOSC.
 IC can switch to Standby mode or Halt mode by programming register bits OPMD[1:0].
 IC can switch to Normal mode by writing 1 to SELHOSC.
3.18.3 Standby Mode

NY8B062E will enter Standby mode by writing 10b to register bits OPMD[1:0]. At Standby mode, however,
FHOSC will not be disabled automatically by NY8B062E and user has to enter slow mode and write 1 to
register bit STPHOSC in order to stop FHOSC oscillation. Most of NY8B062E peripheral modules are disabled
but Timer can be still active if register bit T0EN/T1EN/T2EN/T3EN is set to 1. Therefore NY8B062E can
wake-up after Timer0/Timer1/Timer2/Timer3 is expired. The expiration period is determined by the register
TMR0/TMR1[9:0]/TMR2[9:0]/TMR3[9:0], FINST and other configurations for Timer0/Timer1/Timer2/Timer3.
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 Instruction execution is stop and some peripheral modules may be active according to corresponding
module enable bit.
 FHOSC can be disabled by writing 1 to register bit STPHOSC.
 The FLOSC is still active and running.
 IC can wake-up from Standby mode if any of (a) Timer0/Timer1/Timer2/Timer3 (overflow/underflow)

interrupt, (b) WDT timeout interrupt, (c) PA/PB input change interrupt or (d) INT external interrupt is
happened.
 After wake-up from Standby mode, IC will return to Normal mode if SELHOSC=1, IC will return to Slow
mode if SELHOSC=0.
 It is not recommended to change oscillator mode (normal to slow / slow to normal) and enter standby
mode at the same time.
3.18.4 Halt Mode

NY8B062E will enter Halt mode by executing instruction SLEEP or writing 01b to register bits OPMD[1:0].
After entering Halt mode, register bit /PD (STATUS[3]) will be clear to 0, register bit /TO (STATUS[4]) will be
set to 1 and WDT will be clear but keep running.
At Halt mode, all of peripheral modules are disabled, instruction execution is stop and NY8B062E can only
wake-up by some specific events. Therefore, Halt mode is the most power saving mode provided by
NY8B062E.
 Instruction execution is stop and all peripheral modules are disabled.
 FHOSC and FLOSC are both disabled automatically.
 IC can wake-up from Halt mode if any of (a) WDT timeout interrupt, (b) PA/PB input change interrupt or
(c) INT or external interrupt is happened.
 After wake-up from Halt mode, IC will return to Normal mode if SELHOSC=1, IC will return to Slow mode
if SELHOSC=0.
Note: Users can change STPHOSC and enter Halt mode in the same instruction.
 It is not recommended to change oscillator mode (normal to slow or slow to normal) and enter halt mode
at the same time.
3.18.5 Wake-up Stable Time

The wake-up stable time of Halt mode is determined by Configuration word: High Oscillator Frequency or
Low Oscillator Frequency. If one of E_HXT, E_XT and E_LXT is selected, the wake-up period would be
512*FOSC. And if no XT mode are selected, 16*Fosc would be set as wake up period. On the other hand,
there is no need of wake-up stable time for Standby mode because either FHOSC or FLOSC is still running at
Standby mode.
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Before NY8B062E enter Standby mode or Halt mode, user may execute instruction ENI. At this condition,
NY8B062E will branch to address 0x008 in order to execute interrupt service routine after wake-up. If
instruction DISI is executed before entering Standby mode or Halt mode, the next instruction will be executed
after wake-up.
3.18.6 Summary of Operating Mode

The summary of four operating modes is described in the following table.
Mode Normal Slow Standby Halt
FHOSC Enabled STPHOSC STPHOSC Disabled
FLOSC Enabled Enabled Enabled Disabled
Instruction Execution Executing Executing Stop Stop
Timer0/1/2/3 TxEN TxEN TxEN Disabled
Option and Option and
WDT Option and WDTEN Option and WDTEN
WDTEN WDTEN
Other Modules Module enable bit Module enable bit Module enable bit All disabled
- Timer0/1/2/3 overflow
- WDT timeout - WDT timeout
- PA/PB input change
- PA/PB input
Wake-up Source - - - INT0/1
change
- LVD interrupt
- Comparator interrupt - INT0/1
- ADC end-of-convert
Table 34 Summary of Operating Modes
3.19 Reset Process

NY8B062E will enter Reset State and start Reset Process when one of following Reset Event is occurred:
 Power-On Reset (POR) is occurred when VDD rising is detected.
 Low-Voltage Reset (LVR) is occurred when operating VDD is below pre-defined voltage.
 Pin RSTb is low state.
 WDT timeout reset.
Moreover, value of all registers will be initialized to their initial value or unchanged if its initial value is unknown.
The status bits /TO and /PD could be initialized according to which event causes reset. The /TO and /PD value
and its associated event is summarized in the table below.
Event /TO /PD
POR, LVR 1 1
RSTb reset from non-Halt mode unchanged unchanged
RSTb reset from Halt mode 1 1
WDT reset from non-Halt mode 0 1
WDT reset from Halt mode 0 0
SLEEP executed 1 0
CLRWDT executed 1 1
Table 35 Summary of /TO & /PD Value and its Associated Event
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After Reset Event is released, NY8B062E will start Reset Process. It will wait certain amount of period for
oscillation stable no matter what kind of oscillator is adopted. This period is called power-up reset time and is
determined by three-bit configuration words which can be 140us, 4.5ms, 18ms, 72ms or 288ms. After power-up
reset time, NY8B062E will wait for further oscillator start-up time (OST) before it starts to execute program.
OST=1 clock cycle of FOSC if the previous power-up time is 140us, OST=16 clock cycles of FOSC if the previous
power-up time is 4.5ms, 18ms, 72ms or 288ms.
Figure 37 Block diagram of on-chip reset circuit
For slow VDD power-up, it is recommended to use RSTb reset, as the following figure.
 It is recommended the R value should be not greater than 40KΩ.
 The R1 value=100Ω to 1KΩ will prevent high current, ESD or Electrical overstress flowing into reset pin.
 The diode helps discharge quickly when power down.
Figure 38 Block Diagram of Reset Application
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4. Instruction Set
NY8B062E provides 55 powerful instructions for all kinds of applications.
OP OP
Inst. Operation Cyc. Flag Inst. Operation Cyc. Flag
1 2 1 2
Arithmetic Instructions Arithmetic Instructions
ANDAR R d dest = ACC & R 1 Z ADDAR R d dest = R + ACC 1 Z, DC, C
IORAR R d dest = ACC | R 1 Z SUBAR R d dest = R + (~ACC) 1 Z, DC, C
XORAR R d dest = ACC ⊕ R 1 Z ADCAR R d dest = R + ACC + C 1 Z, DC, C
ANDIA i ACC = ACC & i 1 Z SBCAR R d dest = R + (~ACC) + C 1 Z, DC, C
IORIA i ACC = ACC | i 1 Z ADDIA i ACC = i + ACC 1 Z, DC, C
XORIA i ACC = ACC ⊕ i 1 Z SUBIA i ACC = i + (~ACC) 1 Z, DC, C
RRR R d Rotate right R 1 C ADCIA i ACC = i + ACC + C 1 Z, DC, C
RLR R d Rotate left R 1 C SBCIA i ACC = i + (~ACC) + C 1 Z, DC, C
BSR R bit Set bit in R 1 - DAA Decimal adjust for ACC 1 C
BCR R bit Clear bit in R 1 - CMPAR R Compare R with ACC 1 Z, C
INCR R d Increase R 1 Z CLRA Clear ACC 1 Z
DECR R d Decrease R 1 Z CLRR Clear R 1 Z
COMR R d dest = ~R 1 Z Other Instructions
Conditional Instructions NOP No operation 1 -
BTRSC R bit Test bit in R, skip if clear 1 or 2 - SLEEP Go into Halt mode 1 /TO, /PD
BTRSS R bit Test bit in R, skip if set 1 or 2 - CLRWDT Clear Watch-Dog Timer 1 /TO, /PD
INCRSZ R d Increase R, skip if 0 1 or 2 - ENI Enable interrupt 1 -
DECRS
R d Decrease R, skip if 0 1 or 2 - DISI Disable interrupt 1 -
Z
Data Transfer Instructions INT Software Interrupt 3 -
MOVAR R Move ACC to R 1 - RET Return from subroutine 2 -
MOVR R d Move R 1 Z Return from interrupt and

RETIE 2 -
MOVIA i Move immediate to ACC 1 - enable interrupt
SWAPR R d Swap halves R 1 - Return, place immediate in

RETIA i 2 -
IOST F Load ACC to F-page SFR 1 - ACC
IOSTR F Move F-page SFR to ACC 1 - CALLA Call subroutine by ACC 2 -
SFUN S Load ACC to S-page SFR 1 - GOTOA unconditional branch by ACC 2 -
SFUNR S Move S-page SFR to ACC 1 - LCALL adr Call subroutine 2 -
T0MD Load ACC to T0MD 1 - LGOTO adr unconditional branch 2 -
T0MDR Move T0MD to ACC 1 -
TABLEA Read ROM 2 -
Table 36 Instruction Set
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ACC: Accumulator.
adr: immediate address.
bit: bit address within an 8-bit register R.
C: Carry/Borrow bit
C=1, carry is occurred for addition instruction or borrow is NOT occurred for subtraction instruction.
C=0, carry is not occurred for addition instruction or borrow IS occurred for subtraction instruction.
d: Destination
If d is “0”, the result is stored in the ACC.
If d is “1”, the result is stored back in register R.
DC: Digital carry flag.
dest: Destination.
F: F-page SFR, F is 0x5 ~ 0xF.
i: 8-bit immediate data.
PC: Program Counter.
PCHBUF: High Byte Buffer of Program Counter.
/PD: Power down flag bit

/PD=1, after power-up or after instruction CLRWDT is executed.
/PD=0, after instruction SLEEP is executed.

Prescaler: Prescaler0 dividing rate.
R: R-page SFR, R is 0x0 ~0x7F.
S: S-page SFR, S is 0x0 ~ 0x15.
T0MD: T0MD register.
TBHP: The high-Byte at target address in ROM.
TBHD: Store the high-Byte data at target address in ROM.
/TO: Time overflow flag bit
/TO=1, after power-up or after instruction CLRWDT or SLEEP is executed.
/TO=0, WDT timeout is occurred.
WDT: Watchdog Timer Counter.
Z: Zero flag
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ADCAR Add ACC and R with Carry ADDAR Add ACC and R
Syntax: ADCAR R, d Syntax: ADDAR R, d
Operand: 0 ≤ R ≤ 127 Operand: 0 ≤ R ≤ 127
d = 0, 1. d = 0, 1.
Operation: R + ACC + C → dest Operation: ACC + R → dest
Status affected: Z, DC, C Status affected: Z, DC, C
Description: Add the contents of ACC and Description: Add the contents of ACC and R.
register R with Carry. If d is 0, the If d is 0, the result is stored in
result is stored in ACC. If d is 1, ACC. If d is 1, the result is stored
the result is stored back to R. back to R.
Cycle 1 Cycle: 1
Example: ADCAR R, d Example: ADDAR R, d
before executing instruction: before executing instruction:
ACC=0x12, R=0x34, C=1, d=1, ACC=0x12, R=0x34,C=1, d=1,
after executing instruction: after executing instruction:
R=0x47, ACC=0x12, C=0. R=0x46, ACC=0x12, C=0.
ADCIA Add ACC and Immediate with ADDIA Add ACC and Immediate
Carry
Syntax: ADCIA i Syntax: ADDIA i
Operand: 0 ≤ i ＜ 255 Operand: 0 ≤ i ＜ 255
Operation: ACC + i + C → ACC Operation: ACC + i → ACC
Description: Add the contents of ACC and the Description: Add the contents of ACC with the
8-bit immediate data i with Carry. 8-bit immediate data i. The result
The result is placed in ACC. is placed in ACC.
Cycle: 1 Cycle: 1
Example: ADCIA i Example: ADDIA i

before executing instruction: before executing instruction:
ACC=0x12, i=0x34, C=1, ACC=0x12, i=0x34, C=1,
ACC=0x47, C=0. ACC=0x46, C=0.
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ANDAR AND ACC and R BCR Clear Bit in R
Syntax: ANDAR R, d Syntax: BCR R, bit
d = 0, 1. 0 ≤ bit ≤ 7
Operation: ACC & R → dest Operation: 0 → R[bit]
Status affected: Z Status affected: --

Description: Clear the bitth position in R.
Description: The content of ACC is AND’ed with
R. If d is 0, the result is stored in Cycle: 1
ACC. If d is 1, the result is stored
back to R. Example: BCR R, B2
before executing instruction:
Cycle: 1 R=0x5A, B2=0x3,
Example: ANDAR R, d after executing instruction:
before executing instruction: R=0x52.
ACC=0x5A, R=0xAF, d=1.
after executing instruction:
R=0x0A, ACC=0x5A, Z=0.
ANDIA AND Immediate with ACC BSR Set Bit in R

Syntax: ANDIA i Syntax: BSR R, bit
Operand: 0 ≤ i ＜ 255 Operand: 0 ≤ R ≤ 127
0 ≤ bit ≤ 7
Operation: ACC & i → ACC
Operation: 1 → R[bit]
Status affected: Z
Status affected: --
Description: The content of ACC register is
Description: Set the bitth position in R.
AND’ed with the 8-bit immediate Cycle: 1
data i. The result is placed in ACC. Example: BSR R, B2
Cycle: 1 before executing instruction:
R=0x5A, B2=0x2,
Example: ANDIA i
R=0x5E.
ACC=0x5A, i=0xAF,
ACC=0x0A, Z=0.
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BTRSC Test Bit in R and Skip if Clear CALLA Call Subroutine
Syntax: BTRSC R, bit Syntax: CALLA
Operand: 0 ≤ R ≤ 127 Operand: --
0 ≤ bit ≤ 7 Operation: PC + 1 → Top of Stack
Operation: Skip next instruction, if R[bit] = 0. {TBHP, ACC} → PC
Status affected: --
Status affected: --
Description: The return address (PC + 1) is
Description: If R[bit] = 0, the next instruction pushed onto top of Stack. The
which is already fetched is contents of TBHP[2:0] is loaded
discarded and a NOP is executed into PC[10:8] and ACC is loaded
instead. Therefore it makes this into PC[7:0].
instruction a two-cycle instruction.
Cycle: 2
Cycle: 1 or 2(skip)
Example: CALLA
Example: BTRSC R, B2 before executing instruction:
Instruction1 TBHP=0x02, ACC=0x34.
Instruction2 PC=A0. Stack pointer=1.
before executing instruction: after executing instruction:
R=0x5A, B2=0x2, PC=0x234, Stack[1]=A0+1, Stack
after executing instruction: pointer=2
because R[B2]=0, instruction1
will not be executed, the program
will start execute instruction from
instruction2.
BTRSS Test Bit in R and Skip if Set CLRA Clear ACC

Syntax: BTRSS R, bit Syntax: CLRA
0 ≤ bit ≤ 7
Operation: 00h → ACC
Operation: Skip next instruction, if R[bit] = 1. 1→Z
Status affected: -- Status affected: Z
Description: If R[bit] = 1, the next instruction Description: ACC is clear and Z is set to 1.
which is already fetched is Cycle: 1
discarded and a NOP is executed
instead. Therefore, it makes this Example: CLRA
instruction a two-cycle instruction. before executing instruction:
ACC=0x55, Z=0.
Cycle: 1 or 2(skip) after executing instruction:
Example: BTRSS R, B2 ACC=0x00, Z=1.
Instruction2
Instruction3
R=0x5A, B2=0x3,
because R[B2]=1, instruction2
will not be executed, the program
will start execute instruction from
instruction3.
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CLRR Clear R COMR Complement R
Syntax: CLRR R Syntax: COMR R, d
d = 0, 1.
Operation: 00h → R
1→Z Operation: ~R → dest
Status affected: Z Status affected: Z
Description: The content of R is clear and Z is Description: The content of R is complemented.
set to 1. If d is 0, the result is stored in ACC.
If d is 1, the result is stored back to
Cycle: 1 R.
Example: CLRR R Cycle: 1
R=0x55, Z=0. Example: COMR, d
after executing instruction: before executing instruction:
R=0x00, Z=1. R=0xA6, d=1, Z=0.
R=0x59, Z=0.
CLRWDT Clear Watch-Dog Timer CMPAR Compare ACC and R

Syntax: CLRWDT Syntax: CMPAR R
Operand: -- Operand: 0 ≤ R ≤ 127
Operation: 00h → WDT, Operation: R - ACC → (No restore)
00h → WDT prescaler Status affected: Z, C
1 → /TO
1 → /PD Description: Compare ACC and R by
subtracting ACC from R with 2’s
Status affected: /TO, /PD complement representation. The
content of ACC and R is not
Description: Executing CLRWDT will reset changed.
WDT, Prescaler0 if it is assigned to
WDT. Moreover, status bits /TO Cycle: 1
and /PD will be set to 1.
Example: CMPAR R
Example: CLRWDT R=0x34, ACC=12, Z=0, C=0.
/TO=0 R=0x34, ACC=12, Z=0, C=1.
/TO=1
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DAA Convert ACC Data Format from DECRSZ Decrease R, Skip if 0
Hexadecimal to Decimal
Syntax: DAA Syntax: DECRSZ R, d
Operation: ACC(hex) → ACC(dec) d = 0, 1.
Status affected: C Operation: R - 1 → dest,
Skip if result = 0
Description: Convert ACC data format from
hexadecimal to decimal after Status affected: --
addition operation and restore
result to ACC. DAA instruction Description: Decrease R first. If d is 0, the
must be placed immediately after result is stored in ACC. If d is 1,
addition operation if decimal format the result is stored back to R.
is required. Please note that If result is 0, the next instruction
interrupt should be disabled before which is already fetched is
addition instruction and enabled discarded and a NOP is executed
after DAA instruction to avoid instead. Therefore it makes this
unexpected result. instruction a two-cycle instruction.
Cycle: 1
Cycle: 1 or 2(skip)
Example: DISI
Example: DECRSZ R, d
ADDAR R,d
instruction2
DAA
instruction3
ENI
R=0x1, d=1, Z=0.
ACC=0x28, R=0x25, d=0.
R=0x0, Z=1, and instruction will
ACC=0x53, C=0.
skip instruction2 execution
because the operation result is
zero.
DECR Decrease R DISI Disable Interrupt Globally

Syntax: DECR R, d Syntax: DISI
d = 0, 1. Operation: Disable Interrupt, 0 → GIE
Operation: R - 1 → dest Status affected: --
Status affected: Z Description: GIE is clear to 0 in order to disable
Description: Decrease R. If d is 0, the result is all interrupt requests.
stored in ACC. If d is 1, the result
Cycle: 1
is stored back to R.
Example: DISI
Example: DECR R, d GIE=1,
before executing instruction: After executing instruction:
R=0x01, d=1, Z=0. GIE=0.
R=0x00, Z=1.
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ENI Enable Interrupt Globally INCR Increase R
Syntax: ENI Syntax: INCR R, d
d = 0, 1.
Operation: Enable Interrupt, 1 → GIE
Operation: R + 1 → dest.
Status affected: --
Status affected: Z
Description: GIE is set to 1 in order to enable all
interrupt requests. Description: Increase R. If d is 0, the result is
stored in ACC. If d is 1, the result
Cycle: 1 is stored back to R.
Example: ENI
Cycle: 1
GIE=0, Example: INCR R, d
After executing instruction: before executing instruction:
GIE=1. R=0xFF, d=1, Z=0.
R=0x00, Z=1.
GOTOA Unconditional Branch INCRSZ Increase R, Skip if 0

Syntax: GOTOA Syntax: INCRSZ R, d
Operation: {TBHP, ACC} → PC d = 0, 1.
Status affected: -- Operation: R + 1 → dest,

Description: GOTOA is an unconditional branch Skip if result = 0
instruction. The content of Status affected: --
TBHP[2:0] is loaded into PC[10:8]
and ACC is loaded into PC[7:0]. Description: Increase R first. If d is 0, the result
is stored in ACC. If d is 1, the result
Cycle: 2 is stored back to R.
If result is 0, the next instruction
Example: GOTOA
which is already fetched is
discarded and a NOP is executed
PC=A0. TBHP=0x02, instead. Therefore it makes this
ACC=0x34. instruction a two-cycle instruction.
PC=0x234 Cycle: 1 or 2(skip)
Example: INCRSZ R, d
instruction2,
instruction3.
R=0xFF, d=1, Z=0.
R=0x00, Z=1. And the program
will skip instruction2 execution
because the operation result is
zero.
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NY8B062E
INT Software Interrupt IORIA OR Immediate with ACC
Syntax: INT Syntax: IORIA i
Operand: -- Operand: 0 ≤ i ＜ 255
Operation: PC + 1 → Top of Stack,
Operation: ACC | i → ACC
001h → PC
Status affected: Z
Status affected: --
Description: OR ACC with 8-bit immediate data
Description: Software interrupt. First, return i. The result is stored in ACC.
address (PC + 1) is pushed onto
the Stack. The address 0x001 is Cycle: 1
loaded into PC[10:0].
Example: IORIA i
Example: INT i=0x50, ACC=0xAA, Z=0.
PC=address of INT code ACC=0xFA, Z=0.
PC=0x01
IOST Load F-page SFR from ACC

IORAR OR ACC with R
Syntax: IOST F
Syntax: IORAR R, d
Operand: 0 ≤ R ≤ 127 Operand: 5 ≤ F ≤ 15
d = 0, 1. Operation: ACC → F-page SFR
Operation: ACC | R → dest Status affected: --
Status affected: Z Description: F-page SFR F is loaded by content
Description: OR ACC with R. If d is 0, the result of ACC.
is stored in ACC. If d is 1, the Cycle: 1
result is stored back to R.
Example: IOST F
Example: IORAR R, d F=0x55, ACC=0xAA.
R=0x50, ACC=0xAA, d=1, Z=0. F=0xAA, ACC=0xAA.
R=0xFA, ACC=0xAA, Z=0.
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IOSTR Move F-page SFR to ACC LGOTO Unconditional Branch
Syntax: IOSTR F Syntax: LGOTO adr
Operand: 5 ≤ F ≤ 15 Operand: 0 ≤ adr ≤ 2047
Operation: F-page SFR → ACC Operation: adr → PC[10:0].
Status affected: -- Status affected: --
Description: Move F-page SFR F to ACC.
Description: LGOTO is an unconditional branch
Cycle: 1 instruction. The 11-bit immediate
address adr is loaded into
Example: IOSTR F PC[10:0].
before executing instruction: Cycle: 2
F=0x55, ACC=0xAA.
after executing instruction: Example: LGOTO Level
F=0x55, ACC=0x55. before executing instruction:
PC=A0.
PC=address of Level.
LCALL Call Subroutine MOVAR Move ACC to R

Syntax: LCALL adr Syntax: MOVAR R
Operand: 0 ≤ adr ≤ 2047 Operand: 0 ≤ R ≤ 127
Operation: PC + 1 → Top of Stack, Operation: ACC → R

adr → PC[10:0] Status affected: --
Status affected: -- Description: Move content of ACC to R.
Description: The return address (PC + 1) is Cycle: 1
pushed onto top of Stack. The Example: MOVAR R
11-bit immediate address adr is before executing instruction:
loaded into PC[10:0].
R=0x55, ACC=0xAA.
Cycle: 2 after executing instruction:
R=0xAA, ACC=0xAA.
Example: LCALL SUB
PC=A0. Stack level=1
PC=address of SUB, Stack[1]=
A0+1, Stack pointer =2.
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MOVIA Move Immediate to ACC NOP No Operation
Syntax: MOVIA i Syntax: NOP
Operand: 0 ≤ i ＜ 255 Operand: --
Operation: i → ACC Operation: No operation.
Status affected: -- Status affected: --
Description: The content of ACC is loaded with Description: No operation.
8-bit immediate data i.
Cycle: 1
Cycle: 1 Example: NOP
Example: MOVIA i before executing instruction:
before executing instruction: PC=A0
i=0x55, ACC=0xAA. after executing instruction:
after executing instruction: PC=A0+1
ACC=0x55.
MOVR Move R to ACC or R RETIE Return from Interrupt and

Syntax: MOVR R, d Enable Interrupt Globally
Syntax: RETIE
Operand: 0 ≤ R ≤ 127
d = 0, 1. Operand: --
Operation: R → dest Operation: Top of Stack → PC
Status affected: Z 1 → GIE
Description: The content of R is move to Status affected: --
destination. If d is 0, destination is Description: The PC is loaded from top of Stack
ACC. If d is 1, destination is R and as return address and GIE is set to
it can be used to check whether R 1.
is zero according to status flag Z
after execution. Cycle: 2
Example: RETIE
Cycle: 1
Example: MOVR R, d GIE=0, Stack level=2.
R=0x0, ACC=0xAA, Z=0, d=0. GIE=1, PC=Stack[2], Stack
after executing instruction: pointer=1.
R=0x0, ACC=0x00, Z=1.
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NY8B062E
RETIA Return with Data in ACC RLR Rotate Left R Through Carry
Syntax: RETIA i Syntax: RLR R, d
Operand: 0 ≤ i ＜ 255 Operand: 0 ≤ R ≤ 127
d = 0, 1.
Operation: i → ACC,
Top of Stack → PC Operation: C → dest[0], R[7] → C,
R[6:0] → dest[7:1]
Status affected: --
Description: ACC is loaded with 8-bit C
R
immediate data i and PC is loaded
b7 b6 b5 b4 b3 b2 b1 b0
from top of Stack as return
address.
Status affected: C
Cycle: 2
Description: The content of R is rotated one bit
Example: RETIA i
to the left through flag Carry. If d is
before executing instruction: 0, the result is placed in ACC. If d
Stack pointer =2. i=0x55, is 1, the result is stored back to R.
ACC=0xAA.
after executing instruction: Cycle: 1
PC=Stack[2], Stack pointer =1.
Example: RLR R, d
ACC=0x55.
R=0xA5, d=1, C=0.
R=0x4A, C=1.
RET Return from Subroutine

RRR Rotate Right R Through Carry
Syntax: RET Syntax: RRR R, d
Operation: Top of Stack → PC d = 0, 1.
Status affected: -- Operation: C → dest[7], R[7:1] → dest[6:0],

R[0] → C
Description: PC is loaded from top of Stack as
return address.
C
Cycle: 2 R
b7 b6 b5 b4 b3 b2 b1 b0
Example: RET
Stack level=2. Status affected: C
Description: The content of R is rotated one bit
PC=Stack[2], Stack level=1. to the right through flag Carry. If d
is 0, the result is placed in ACC. If
d is 1, the result is stored back to
R.
Cycle: 1
Example: RRR R, d
R=0xA5, d=1, C=0.
R=0x52, C=1.
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NY8B062E
SBCAR Subtract ACC and Carry from R SBCIA Subtract ACC and Carry from
Immediate
Syntax: SBCAR R, d
Syntax: SBCIA i
d = 0, 1. Operand: 0 ≤ i ＜ 255
Operation: i + (~ACC) + C → dest
Operation: R + (~ACC) + C → dest
Description: Subtract ACC and Carry from R Description: Subtract ACC and Carry from 8-bit
with 2’s complement immediate data i with 2’s
representation. If d is 0, the result complement representation. The
is placed in ACC. If d is 1, the result is placed in ACC.
result is stored back to R. Cycle: 1
Cycle: 1 Example: SBCIA i
Example: SBCAR R, d (a) before executing instruction:
i=0x05, ACC=0x06, C=0,
(a) before executing instruction:
R=0x05, ACC=0x06, d=1,
ACC=0xFE, C=0. (-2)
C=0,
after executing instruction: (b) before executing instruction:
R=0xFE, C=0. (-2) i=0x05, ACC=0x06, C=1,
(b) before executing instruction:
ACC=0xFF, C=0. (-1)
R=0x05, ACC=0x06, d=1,
C=1, (c) before executing instruction:
after executing instruction: i=0x06, ACC=0x05, C=0,
R=0xFF, C=0. (-1) after executing instruction:
(c) before executing instruction: ACC=0x00, C=1. (-0), Z=1.
R=0x06, ACC=0x05, d=1, (d) before executing instruction:
C=0, i=0x06, ACC=0x05, C=1,
R=0x00, C=1. (-0), Z=1. ACC=0x1, C=1. (+1)
(d) before executing instruction:
R=0x06, ACC=0x05, d=1,
C=1,
after executing instruction: SFUN Load S-page SFR from ACC
R=0x1, C=1. (+1) Syntax: SFUN S
Operand: 0 ≤ S ≤ 21
Operation: ACC → S-page SFR
Status affected: --
Description: S-page SFR S is loaded by content
of ACC.
Cycle: 1
Example: SFUN S
S=0x55, ACC=0xAA.
S=0xAA, ACC=0xAA.
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SFUNR Move S-page SFR to ACC SUBAR Subtract ACC from R
Syntax: SUBAR R, d
Syntax: SFUNR S
Operand: 0 ≤ S ≤ 21 d = 0, 1.
Operation: S-page SFR → ACC
Operation: R – ACC → dest
Status affected: --
Status affected: Z, DC, C
Description: Move S-page SFR S to ACC.
Description: Subtract ACC from R with 2’s
Cycle: 1
complement representation. If d is
Example: SFUNR S 0, the result is placed in ACC. If d
before executing instruction: is 1, the result is stored back to R.
S=0x55, ACC=0xAA.
Cycle: 1
S=0x55, ACC=0x55. Example: SUBAR R, d
R=0x05, ACC=0x06, d=1,
R=0xFF, C=0. (-1)
(b) before executing instruction:
R=0x06, ACC=0x05, d=1,
R=0x01, C=1. (+1)
SLEEP Enter Halt Mode SUBIA Subtract ACC from Immediate

Syntax: SLEEP Syntax: SUBIA i
Operand: -- Operand: 0 ≤ i ＜ 255
Operation: 00h → WDT, Operation: i – ACC → ACC
00h → WDT prescaler Status affected: Z, DC, C
1 → /TO
Description: Subtract ACC from 8-bit immediate
0 → /PD data i with 2’s complement
Status affected: /TO, /PD representation. The result is placed
in ACC.
Description: WDT and Prescaler0 are clear to
0. /TO is set to 1 and /PD is clear Cycle: 1
to 0.
Example: SUBIA i
IC enter Halt mode.
Cycle: 1 i=0x05, ACC=0x06.
Example: SLEEP after executing instruction:
before executing instruction: ACC=0xFF, C=0. (-1)
/PD=1, /TO=0. (b) before executing instruction:
after executing instruction: i=0x06, ACC=0x05, d=1,
/PD=0, /TO=1. after executing instruction:
ACC=0x01, C=1. (+1)
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SWAPR Swap High/Low Nibble in R T0MD Load ACC to T0MD
Syntax: SWAPR R, d Syntax: T0MD
d = 0, 1. Operation: ACC → T0MD
Operation: R[3:0] → dest[7:4]. Status affected: --
R[7:4] → dest[3:0] Description: The content of T0MD is loaded by
Status affected: -- ACC.
Description: The high nibble and low nibble of Cycle: 1

R is exchanged. If d is 0, the result Example: T0MD
is placed in ACC. If d is 1, the before executing instruction:
result is stored back to R. T0MD=0x55, ACC=0xAA.
Cycle: 1 after executing instruction:
T0MD=0xAA.
Example: SWAPR R, d
R=0xA5, d=1.
R=0x5A.
TABLEA Read ROM data T0MDR Move T0MD to ACC
Syntax: TABLEA Syntax: T0MDR

Operand: -- Operand: --
Operation: T0MD → ACC
Operation: ROM data{ TBHP, ACC } [7:0]
→ ACC Status affected: --
ROM data{TBHP, ACC} [13:8] Description: Move the content of T0MD to ACC.
→ TBHD.
Cycle: 1
Status affected: --
Example: T0MDR
Description: The 8 least significant bits of ROM before executing instruction
pointed by {TBHP[2:0], ACC} is T0MD=0x55, ACC=0xAA.
placed to ACC. after executing instruction
The 6 most significant bits of ROM ACC=0x55.
pointed by {TBHP[2:0], ACC} is
placed to TBHD[5:0].
Cycle: 2
Example: TABLEA
TBHP=0x02, CC=0x34.
TBHD=0x01.
ROM data[0x234]= 0x35AA
TBHD=0x35, ACC=0xAA.
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XORAR Exclusive-OR ACC with R
Syntax: XORAR R, d
d = 0, 1.
Operation: ACC ⊕ R → dest
Status affected: Z
Description: Exclusive-OR ACC with R. If d is 0,
the result is placed in ACC. If d is
1, the result is stored back to R.
Cycle: 1
Example: XORAR R, d
R=0xA5, ACC=0xF0, d=1.
R=0x55.
XORIA Exclusive-OR Immediate with

ACC
Syntax: XORIA i
Operand: 0 ≤ i ＜ 255
Operation: ACC ⊕ i → ACC
Status affected: Z
Description: Exclusive-OR ACC with 8-bit
immediate data i. The result is
stored in ACC.
Cycle: 1
Example: XORIA i
i=0xA5, ACC=0xF0.
ACC=0x55.
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5. Configuration Words
Item Name Options
1 High Oscillator Frequency 1. I_HRC 2. E_HXT 3. E_XT

2 Low Oscillator Frequency 1. I_LRC 2. E_LXT
1. 1MHz 2. 2MHz 3. 4MHz
3 High IRC Frequency
4. 8MHz 5. 16MHz 6. 20MHz
1. 8MHz > FHOSC > 6MHz 2. 10MHz > FHOSC ≧ 8MHz

4 High Crystal Oscillator 3. 12MHz > FHOSC ≧ 10MHz 4. 16MHz > FHOSC ≧ 12MHz
5. 20MHz > FHOSC ≧ 16MHz 6. 20MHz
5 Instruction Clock 1. 2 oscillator period 2. 4 oscillator period

1. Watchdog Enable (Software control)
6 WDT
2. Watchdog Disable (Always disable)
7 WDT Event 1. Watchdog Reset 2. Watchdog Interrupt
8 Timer0 Source 1. EX_CKI0 2. Low Oscillator (I_LRC/E_LXT)
9 PA.5 1. PA.5 is I/O 2. PA.5 is reset
10 PA.7 1. PA.7 is I/O 2. PA.7 is instruction clock output
11 Startup Time 1. 140us 2. 4.5ms 3. 18ms 4. 72ms 5. 288ms
12 WDT Time Base 1. 3.5ms 2. 15ms 3. 60ms 4. 250ms
13 LVR Setting 1. Register Control 2. LVR Always On
1. 1.6V 2. 1.8V 3. 2.0V 4. 2.2V 5. 2.4V
14 LVR Voltage
6. 2.7V 7. 3.0V 8. 3.3V 9. 3.6V 10. 4.2V
15 VDD Voltage 1. 3.0V 2. 4.5V 3. 5.0V
16 Sink current (exclude PA5) 1. Large 2. Normal
17 Comparator Input pin select 1. Enable 2. Disable
18 Read Output Data 1. I/O Port 2. Register
19 E_LXT Backup Control 1. Auto Off 2. Register Off
20 EX_CKI0 to Inst. Clock 1. Sync 2. Async
21 Startup Clock 1. Fast (I_HRC/E_HXT/E_XT) 2. Slow (I_LRC/E_LXT)
22 Input Schmitt Trigger 1 Enable 2. Disable (0.5VDD)
23 Input High Voltage (VIH) 1. 0.7VDD 2. 0.5VDD
24 Input Low Voltage (VIL) 1. 0.3VDD 2. 0.2VDD
25 PWM2 output 1. PA4 2. PB2
26 PWM4 output 1. PA3 2. PA7 3. Dispable
Table 37 Configuration Words
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NY8B062E
6. Electrical Characteristics
6.1 Absolute Maximum Rating
Symbol Parameter Rated Value Unit
VDD - VSS Supply voltage -0.5 ~ +6.0 V
VIN Input voltage VSS-0.3V ~ VDD+0.3 V
TOP Operating Temperature -40 ~ +85 °C
TST Storage Temperature -40 ~ +125 °C
6.2 DC Characteristics
(All refer FINST=FHOSC/4, FHOSC=16MHz@I_HRC, WDT enabled, ambient temperature TA=25°C unless otherwise specified.)
Symbol Parameter VDD Min. Typ. Max. Unit Condition
3.3 FINST=20MHz @ I_HRC/2
2.2 FINST=20MHz @ I_HRC/4
2.7 FINST=16MHz @ E_HXT/2
2.0 FINST=16MHz @ E_HXT/4
FINST=8MHz @ I_HRC/4 & I_HRC/2
VDD Operating voltage -- 2.0 -- 5.5 V
FINST=8MHz @ E_HXT/4 & E_HXT/2
FINST=4MHz @ I_HRC/4 & I_HRC/2
1.8
FINST=4MHz @ E_XT/4 & E_XT/2
FINST=32KHz @ I_LRC/4 & I_LRC/2
1.6
FINST=32KHz @ E_LXT/4 & E_LXT/2
5V 4.0 -- --
V RSTb (0.8 VDD)
3V 2.4 -- --
5V 3.5 -- -- All other I/O pins, EX_CKI0/1, INT0/1
VIH Input high voltage V
3V 2.1 -- -- CMOS option (0.7 VDD)
5V 2.5 -- -- All other I/O pins, EX_CKI0/1
V
3V 1.5 -- -- TTL option (0.5 VDD)
5V -- -- 1.0
V RSTb (0.2 VDD)
3V -- -- 0.6
5V -- -- 1.5 All other I/O pins, EX_CKI0/1, INT0/1
VIL Input low voltage V
3V -- -- 0.9 CMOS option (0.3 VDD)
5V -- -- 1.0 All other I/O pins, EX_CKI0/1
V
3V -- -- 0.6 TTL option (0.2 VDD)
5V -- 18 -- VOH=4.0V
IOH Output high current mA
3V -- 10 -- VOH=2.0V
Output low current 5V -- 40 --
IOL mA VOL=1.0V
(Large current) 3V -- 25 --
Output low current 5V -- 26 --
IOL mA VOL=1.0V
(Normal current) 3V -- 16 --
5V -- 43 --
IIR IR sink current mA VOL=1.0V
3V -- 28 --
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NY8B062E
Symbol Parameter VDD Min. Typ. Max. Unit Condition
Normal Mode
5V -- 1.7 --
mA FHOSC=20MHz @ I_HRC/2 & E_HXT/2
3V -- 0.7 --
5V -- 1.4 --
3V -- 0.5 --
5V -- 1.6 --
3V -- 0.6 --
5V -- 1.3 --
3V -- 0.5 --
5V -- 1.3 --
3V -- 0.5 --
5V -- 1.1 --
3V -- 0.4 --
5V -- 1.1 --
mA FHOSC=4MHz @ I_HRC/2 & E_XT/2
3V -- 0.4 --
IOP Operating current
5V -- 1.0 --
3V -- 0.4 --
5V -- 1.0 --
3V -- 0.3 --
5V -- 1.0 --
3V -- 0.3 --
Slow Mode
5V -- 11 -- FHOSC disabled,
uA
3V -- 6.1 -- FLOSC=32KHz @ I_LRC/2
5V -- 11 -- FHOSC disabled,
uA
3V -- 4.9 -- FLOSC=32KHz @ E_LXT/2
5V -- 7.3 -- FHOSC disabled,
uA
3V -- 4.3 -- FLOSC=32KHz @ I_LRC/4
5V -- 8.5 -- FHOSC disabled,
uA
3V -- 3.6 -- FLOSC=32KHz @ E_LXT/4
5V -- 3.8 -- Standby mode, FHOSC disabled,
ISTB Standby current uA
3V -- 2.6 -- FLOSC=32KHz @ I_LRC/4
5V -- -- 0.5
uA Halt mode, WDT disabled.
3V -- -- 0.2
IHALT Halt current
5V -- -- 5.0
uA Halt mode, WDT enabled.
3V -- -- 3.0
5V -- 50 --
KΩ Pull-High resistor (not include PA5)
3V -- 100 --
RPH Pull-High resistor
5V -- 85 --
KΩ Pull-High resistor (PA5)
3V -- 85 --
5V -- 50 --
RPL Pull-Low resistor KΩ Pull-Low resistor
3V -- 100 --
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NY8B062E
6.3 OSC Characteristics
(Measurement conditions VDD Voltage, TA Temperature are equal to programming conditions.)
Parameter Min. Typ. Max. Unit Condition
I_HRC deviation by socket ±1 % Socket installed directly on writer.
I_HRC deviation by handler ±3 % Handler condition with correct setup.
I_LRC deviation by handler ±5 %
6.4 Comparator / LVD Characteristics

(VDD=5V, VSS=0V, TA=25°C unless otherwise specified.)
Symbol Parameter Min. Typ. Max. Unit Condition
VIVR Comparator input voltage range 0 -- 5 V FHOSC=1MHz
TENO Comparator enable to output valid -- 20 -- us FHOSC=1MHz
ICO Operating current of comparator -- 135 -- uA FHOSC=1MHz, P2V mode
ILVD Operating current of LVD -- 150 -- uA FHOSC=1MHz, LVD=4.3V
ELVD LVD voltage error -- -- 3 % FHOSC=1MHz, LVD=4.3V
6.5 ADC Characteristics

(VDD=5V, VSS=0V, TA=25°C unless otherwise specified.)
Symbol Parameter Min. Typ. Max. Unit Condition
VREFH VREFH input voltage 2V -- VDD V Ext. reference voltage
VREF4 Int. 4V reference voltage, VDD=5V 3.96 4 4.04 V
VREF Int. VDD reference voltage, VDD=5V -- VDD -- V
Internal reference supply voltage VREF+0.5 -- -- V Minimum supply voltage

ADC analog input voltage 0 -- VREFH V
IOP(ADC) ADC current consumption -- 0.5 -- mA
ADCLK ADC Clock Frequency 32K -- 1M Hz
ADCYCLE ADC Conversion Cycle Time 16 -- 1/ADCLK SHCLK=2 ADC clock
ADCsample ADC Sampling Rate -- -- 125 K/sec VDD=5V
DNL Differential Nonlinearity ±1 -- -- LSB

VDD=5.0V, AVREFH=5V,
INL Integral Nonlinearity ±2 -- -- LSB
FADSMP=62.5K
NMC No Missing Code 10 11 12 Bits
109 Ver. 1.1 2021/07/16

NY8B062E
6.6 Characteristic Graph
6.6.1 Frequency vs. VDD of I_HRC, I_LRC
6.6.2 Frequency vs. Temperature of I_HRC
110 Ver. 1.1 2021/07/16

NY8B062E
6.6.3 Frequency vs. Temperature of I_LRC
6.6.4 Low Dropout Regulator vs. Temperature
111 Ver. 1.1 2021/07/16

NY8B062E
6.6.5 Pull High Resistor vs. VDD
6.6.6 VIH/VIL vs. VDD
112 Ver. 1.1 2021/07/16

NY8B062E
6.7 Recommended Operating Voltage
Recommended Operating Voltage (Temperature range: -40°C ~ +85°C)
LVR: Recommended
Frequency Min. Voltage Max. Voltage LVR: default (25°C)
(-40°C ~ +85°C)
20M/2T 3.3V 5.5V 3.6V 3.6V
16M/2T 3.0V 5.5V 3.3V 3.6V
20M/4T 2.2V 5.5V 2.4V 2.7V
16M/4T 2.0V 5.5V 2.2V 2.4V
8M(2T or 4T) 2.0V 5.5V 2.2V 2.4V
≦6M(2T or 4T) 1.8V 5.5V 2.0V 2.2V
113 Ver. 1.1 2021/07/16

NY8B062E
6.8 LVR vs. Temperature
6.9 LVD vs. Temperature
114 Ver. 1.1 2021/07/16

NY8B062E
6.10 LDO vs. Temperature
7. Die Pad Diagram
115 Ver. 1.1 2021/07/16

NY8B062E
8. Package Dimension
8.1 8-Pin Plastic SOP (150 mil)
Note: For 8-pin SOP, 100 units per tube.
116 Ver. 1.1 2021/07/16

NY8B062E
9. Ordering Information
P/N Package Type Pin Count Package Width Shipping
NY8B062E Die -- -- --
Tape & Reel: 2.5K pcs per Reel
NY8B062ES8 SOP 8 150 mil
Tube: 100 pcs per Tube
117 Ver. 1.1 2021/07/16

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DATA SHEET

Jul. 16, 2021

1.0 2021/01/18 Formal release. -

10, 14, 15, 20, 32, 48,

2 Ver. 1.1 2021/07/16

1.2 NY8B062E 與 NY8B062D 的主要差異 ......................................................................................... 10

1.4 Pin Description ............................................................................................................................... 15

2. Memory Organization .............................................................................................................. 17

3. Function Description ............................................................................................................... 21

3 Ver. 1.1 2021/07/16

4 Ver. 1.1 2021/07/16

3.8 Timer2 / PWM2 / Buzzer2 .............................................................................................................. 65

3.11 IR Carrier ....................................................................................................................................... 71

3.14 Analog-to-Digital Convertor (ADC) ................................................................................................. 75

5 Ver. 1.1 2021/07/16

4. Instruction Set ......................................................................................................................... 90

5. Configuration Words ............................................................................................................. 106

6. Electrical Characteristics ...................................................................................................... 107

6.2 DC Characteristics ....................................................................................................................... 107

6.5 ADC Characteristics ..................................................................................................................... 109

7. Die Pad Diagram .................................................................................................................... 115

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8.2 14-Pin Plastic SOP (150 mil) ........................................................................................................ 116

9. Ordering Information ............................................................................................................. 117

7 Ver. 1.1 2021/07/16

在省電的模式下如待機模式(Standby mode) 與睡眠模式(Halt mode)中，有多種事件可以觸發中斷喚醒NY8B062E

 2Kx14 bits EPROM。

 128 bytes SRAM。

 PA[5, 3:0] 及 PB[3:0] 可選擇輸入時使用內建下拉電阻。

 PA[7:0] 及 PB[5:0] 可選擇輸入時使用上拉電阻。

 所有I/O腳輸出可選擇一般灌電流(Normal Sink Current)或大灌電流(Large Sink Current)，除PA5 外。

8 Ver. 1.1 2021/07/16

 內建十一加一通道 12 位元類比數位轉換器(Analog to Digital Converter)。

9 Ver. 1.1 2021/07/16

1.2 NY8B062E 與 NY8B062D 的主要差異

Item Function NY8B062E NY8B062D

ADC offset Calibration *

2 ADC power consumption 500uA @5V 3mA @5V

3 Internal LDO ±0.5% ±1.0%

4 Input Schmitt Trigger Enable/Disable ---

5 PWM channel PWM1, 2, 3, 4 PWM1, 2, 3

*註: 需要增加 ADC 零點校準初始化程式 (可參考 NYIDE 範例程式)

10 Ver. 1.1 2021/07/16

 Wide operating temperature: -40°C ~ 85°C.

 128 bytes SRAM.

11 Ver. 1.1 2021/07/16

 PB[5:0] have features of Open-Drain output.

 PA[5] have feature of input or open-drain output.

 8-level hardware Stack.

 Direct and indirect addressing modes for data access.

 One 8-bit up-count timer (Timer0) with programmable prescaler.

 Three 10-bit reload or continuous down-count timers (Timer1, 2, 3).

 Four 10-bit resolution PWM (PWM1, 2, 3, 4) output.

 Three buzzer (BZ1, 2, 3) output.

 Built-in high-precision Low-Voltage Detector (LVD).

 Built-in 11+1 channel high-precision 12-bit ADC.

 Built-in high-precision Voltage Comparator.

 Built-in Power-On Reset (POR).

 Built-in Low-Voltage Reset (LVR).