Presented by Name: Kanu Ikechukwu Department:Chemistry MATRIC NO:DE:2014/2707 REG NO:ITA/2015/122568

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RIVERSTATE UNIVERSITY OF SCIENCE AND

TECHNOLOGY

THE STRENGTH,LIMITATION,AND TREND OF


INFORMATION AND COMMUNICATION
TECHNOLOGY IN INDUSTRIAL CHEMISTRY

PRESENTED BY
NAME: KANU IKECHUKWU
DEPARTMENT:CHEMISTRY
MATRIC NO:DE:2014/2707
REG NO:ITA/2015/122568
TABLE OF CONTENT

1 INTRODUCTION
2 STRENGTH OF INFORMATION AND COMMUNICATION
TECHNOLOGY IN INDUSTRIAL CHEMISTRY
3 LIMITATION OF INFORMATION AND COMMUNICATION
TECHNOLOGY IN INDUSTRIAL CHEMISTRY
4 TREND OF INFORMATION AND COMMUNICATION
TECHNOLOGY IN INDUSTRIAL CHEMISTRY
5 SUMMARY
INTRODUCTION

• Information procurement, management, and


movement occupy a central position in our modern
world. Chemistry and chemical engineering play a
significant or even enabling role in the majority of
information and communication technologies that
support an industry that collects, processes, displays,
stores, retrieves, and transmits vast quantities of digital
data. Such activities require electronic microcircuits,
lightwavecommunication systems, magnetic and
optical data storage, advanced packaging, and optical
interconnection, to name just a few of the key
technologies involved.
STRENGTH OF INFORMATION AND COMMUNICATION TECHNOLOGY IN
INDUSTRIAL CHEMISTRY

• Optical Fibers
• Since becoming a commercial reality in the early 1980s, optical
fibers have almost completely replaced copper wire in the long-
range transmission of data and voice. The data-transmitting
capacity of optical fiber systems has doubled every year since 1976,
and the optical fiber industry now generates annual revenues of
over $2 billion. Sometimes known as photonics, this technology
utilizes wavelengths of light that are not absorbed by the glass fiber
to transmit signals for telecommunications, data and image
transmission, energy transmission, sensing, display, and signal
processing. The effective propagation of light along an optical fiber
is made possible by a core that has a higher refractive index than
the cladding. The core is produced by doping pure glass with oxides
of phosphorus, germanium, or aluminum, and the cladding consists
of pure silica glass or silica doped with fluorides or boron oxide.
• Several processes are used to manufacture the glass
body from which an optical fiber is drawn. One
example is modified chemical vapor deposition
(MCVD), in which chemicals flowing through a glass
tube produce a deposit on the interior wall when the
outside of the tube is heated by a flame. More than
100 layers with different refractive indices can be
deposited, and when deposition is complete, further
heating collapses the tube to form a glass rod. Glass
rods formed in this way are drawn into a thin fiber and
coated with a polymer to protect the fiber surface from
microscopic scratches and moisture that would
seriously degrade fiber strength.
Optical Interconnection and
Optoelectronic Devices
• A striking trend in information processing is the increasing replacement of
the current electronic devices and systems with hybrids known as
optoelectronic devices or optically interconnected systems; at the extreme
are photonic devices, which are purely light-based. Fiber-optic cables are
finding increasing use for high-speed communication among computer
processors and associated devices. Optical communication supports the
transmission of large amounts of data with substantial immunity from the
electronic noise that can interfere with wire-based communication: two
beams of light can actually cross one another without interfering with the
information content in either.
• New applications of optoelectronics are likely to include high-speed communication between printed
circuit boards and even between chips. Hybrid systems with discrete optical and electronic components
will eventually be replaced by integrated devices containing both optical and electronic elements, which
are manufactured by processes comparable to those used to manufacture modern integrated circuits. For
this to be possible, new materials for conducting light signals will need to be developed.
• The next opportunity for performance enhancement lies in the replacement of the electronic switching
devices for the routing of information in computer systems. Most likely this advance will use
optoelectronic switches that may function by absorbing and reemitting light rather than just by
transmitting it; this technology relies on the nonlinear optical properties of materials. Recent research
indicates that good nonlinear optical properties can be obtained by incorporating certain chemical groups
in organic polymers, aligning the groups in a strong external electric field, and then cross-linking the
polymer to form a rigid three-dimensional structure. This approach is particularly attractive because
polymer fabrication is a well-developed technology, but research chemists must learn how to circumvent
such serious problems as the decay of nonlinear optical properties with device age.
• The all-optical computer, in which the actual digital processing will be done by optical rather than
electronic devices, lies farther in the future. However, optoelectronic devices may become useful in the
near term for recording and retrieval of information. When light passes through certain nonlinear optical
materials, it undergoes frequency doubling. Because information density on optical recording media is
proportional to the frequency of the light used, nonlinear optical materials could significantly enhance the
storage of information on optical media. Someday even greater enhancements might be possible through
the technique of holographic storage, which could allow multiple pieces of data to be stored in the same
physical space within a nonlinear optical material.
Nanofabrication

• Microelectronic device fabrication begins today with the growth of ultrapure silicon
single crystals as large as 8 inches in diameter and 5 feet in length. These single-crystal
ingots are subsequently cut into wafers that are polished to a high degree of
smoothness. The wafers next enter the lithographic process, first being covered with a
thin insulating film and next coated with an organic material known as a photoresist
that undergoes a chemical transformation upon exposure to light. Careful exposure of
the selected parts of the photoresist to light projected through a mask allows either the
exposed or the unexposed portion of the resist to be selectively dissolved, leading to
Microelectronic device fabrication begins today with the growth of ultrapure silicon
single crystals as large as 8 inches in diameter and 5 feet in length. These single-crystal
ingots are subsequently cut into wafers that are polished to a high degree of
smoothness. The wafers next enter the lithographic process, first being covered with a
thin insulating film and next coated with an organic material known as a photoresist
that undergoes a chemical transformation upon exposure to light. Careful exposure of
the selected parts of the photoresist to light projected through a mask allows either the
exposed or the unexposed portion of the resist to be selectively dissolved, leading to a
relief image. The remaining portion of the resista relief image. The remaining portion of
the resist
Display Technologies

Dramatic improvements have been made in computer display technology in


recent years. But even a high-resolution color graphics screen uses the basic
technology of the cathode ray tube (CRT) that has been familiar to television
viewers for decades. Portable and notebook computers have become the major
driving force for the development of alternative, flatscreen display technologies.
These machines require thin, lightweight displays, and a major research challenge
is presented by the reluctance of users to give up the full color and high resolution
of existing desktop systems. One rapidly evolving display technology is based on
materials known as liquid crystals. Typically, liquid crystals are organic chemicals
that can form a state that is intermediate between the random order of a true
liquid and the highly ordered molecular arrays of a crystalline solid. The molecules
in a liquid crystal will line up in the same direction, but an external force such as
an electric field can cause a change in the collective orientation of these
molecules. If a system is constructed in such a way that the liquid crystals transmit
light in one orientation but not in another, local electric fields can be selectively
applied to generate light or dark spots. Taken together these spots generate an
overall image, a phenomenon that is now widely used in digital wristwatches and
automotive instrument displays.
• The current high point of display development, the thin-film transistor liquid
crystal display (TFT-LCD), is a remarkable device in which each picture element is
driven by its own individual transistor. The liquid crystals used in these displays
constitute a new generation of high-switching-speed materials specifically
synthesized for this application. Full-color high-resolution TFT-LCDs, now found in
the most advanced notebook computers, provide exceptional performance, even
against the high standards of the CRT. This technology may be the forerunner of a
large-screen, flat-panel television that can be hung on the wall like a painting.
• The manufacture of these displays makes extremely high demands on process
control. A single notebook-sized display may contain as many as 1 million thin-film
transistors, every one of which must work properly: the acuity of human vision is
such that even a single bad display element can be a noticeable and unacceptable
defect. The narrow margin for error demands that each of the manufacturing steps
be understood and controlled in great detail through extensive research on
process characterization and modeling. The development of new chemical vapor
deposition techniques for selective repair of defective thin-film transistors may
also be necessary to enhance manufacturing yields.
LIMITATION OF INFORMATION AND COMMUNICATION TECHNOLOGY IN
INDUSTRIAL CHEMISTRY

• Challenges of the ICT-based Training System from Instructors’ Perception Implementation of factor
analysis summarizes all challenges into 5 factors given by Table 3. Factor one is composed of the
following challenges. Lack of accurate strategic in IT (information management), existence of
multiple decision centers in using educational technologies in schools, instructors and managers
not taking virtual education seriously. These challenges are clearly related to legal factor. So it was
named legal challenge. Factor two is composed of the following challenges. Low bandwidth; Lack of
appropriate hardware; lack of appropriate software; Lack of appropriate infrastructure for virtual
education; Limited access to internet at home; the limitation of virtual training for operational
techniques. These challenges are related to the technical aspect. So it was named technical
challenge. Factor three is composed of the following challenges. Language barrier, lack of ICT
knowledge and skills; lack of appropriate educational content, lack of appropriate need assessment,
lack of educational planning. Factor tree was labeled as educational methods. Factor four is
composed of the following challenges. High expenses of buying equipment; High expenses for the
recruitment of experts; High expenses of maintenance; High expenses for support and up-to-date
training; High expenses of upgrading and changing pieces; High expenses of preparing digital
content. These challenges are related to the financial aspect. So, factor four was labeled as
economical challenges. Factor five is composed of the following challenges. Prejudiced beliefs of
learners; lack of understanding of advantages and disadvantages of virtual education; Negative
experiences of users; technological phobia; wasting time by surfing the internet. Factor five was
labeled as cultural challenges.
• Challenges of the ICT-based Training System from Students’ Perception Implementation of factor analysis
summarizes all challenges into 8 factors given by Table 4. Factor one is composed of the following challenges. Low
bandwidth; Lack of appropriate hardware; lack of appropriate software; the limitation of virtual training for
operational techniques. These challenges are related to the technical aspect. So, factor one was labeled as
technical challenges. Factor two is composed of the following challenges. High expenses of buying equipment;
High expenses for the recruitment of experts; High expenses of maintenance; High expenses for support and up-
to-date training; High expenses of upgrading and changing pieces; High expenses of preparing digital content.
These challenges are related to the economical aspect. So, factor two was labeled as economical challenges.
Factor three is composed of the following challenges. Limited access to internet at home; Lack of appropriate
infrastructure for virtual education. These challenges are related to the service aspect. So, factor three was labeled
as service challenges. Factor four is composed of the following challenges. Lack of accurate strategic in IT
(information management), instructors and managers not taking virtual education seriously. These challenges are
related to the ICT support aspect. So, factor four was labeled as support challenges. Factor five is composed of the
following challenges. Language barrier, lack of ICT knowledge and skills. These challenges are related to the
educational aspect. So, factor five was labeled as educational challenges. Factor six is composed of the following
challenges. Prejudiced beliefs of learners; lack of understanding of advantages and disadvantages of virtual
education; Negative experiences of users; technological phobia; wasting time by surfing the internet. These
challenges are related to the cultural aspect. So, factor six was labeled as cultural challenges. Factor seven is
composed of the following challenges. Existence of multiple decision centers in using educational technologies in
schools. These challenges are related to the legal aspect. So, factor seven was labeled as legal challenges. Factor
eight is composed of the following challenges. Lack of appropriate educational content, lack of appropriate need
assessment, lack of educational planning. These challenges are related to the educational planning aspect. So,
factor eight was labeled as educational planning challenges. Table 4 represents portion of each factor from the
total common variance. As one may observe that about 70.5 percent of total common variance explained by these
8 factors, which the majority of it has been explained by the technical factor. International Journal of Advanced
Science.
summary
• Information and communication technology
have strengthened and fastened the rate of
chemical procedures carried out in the
laboratory.

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