24AA1025/24LC1025/24FC1025: 1024K I C Serial EEPROM
24AA1025/24LC1025/24FC1025: 1024K I C Serial EEPROM
24AA1025/24LC1025/24FC1025: 1024K I C Serial EEPROM
Features: A1 2 7 WP
SCL
7
3 8 9 10
SDA
6
IN
15
13 14
SDA
OUT
(protected)
WP 11 12
(unprotected)
SDA
SCL 1 2 3 4 5 6 7 8 9 1 2 3
The transmitter must release the SDA line at this The receiver must release the SDA line at this
point allowing the receiver to pull the SDA line low point so the transmitter can continue sending
to acknowledge the previous eight bits of data. data.
B A A A A A A A A A A A A
1 0 1 0 1 0 R/W • • • • • •
0 15 14 13 12 11 10 9 8 7 0
A A A A
BUS ACTIVITY C C C C
K K K K
X = “don’t care” bit
Did Device No
Acknowledge
(ACK = 0)?
Yes
Next
Operation
Control S
BUS ACTIVITY T
Byte Data n Data n + 1 Data n + 2 Data n + X
MASTER O
P
SDA LINE P
A A A A N
C C C C O
BUS ACTIVITY K K K K A
C
K
XXXXXXXX 24LC1025
TXXXXNNN I/P e3 13F
YYWW 0928
XXXXXXXT 24L1025I
XXXXYYWW SN e3 0928
NNN
13F
XXXXXXXX 24LC1025
TXXXXXXX I/SM e3
YYWWNNN 0928 13F
Note: For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
* Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.
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Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
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Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Revision A (02/2005)
Original release.
Revision B (09/2005)
Section 1.0 Electrical Characteristics: revised Ambient
Temperature; Revised Table 1-1; Revised Section 2.1
and Section 2.5.
Revision C (04/2006)
Revised Features, Maximum Read Current and Table
1-1, D9; Revised Table 2-1, VCC; Revised Section 6.3.
Revision D (01/2007)
Revised Device Selection Table; Features Section;
Changed 1.8V to 1.7V; Revised Tables 1-1, 1-2, 2-1;
Revised Product ID System; Replaced Package
Drawings.
Revision E (03/2007)
Replaced Package Drawings (Rev. AM).
Revision F (10/2008)
Corrections on the Device Selection Table; Corrections
on the Description; Corrections on the AC Characteris-
tics table; Corrections on the Pin Function Table;
Corrections on the Product ID System; Updated
Package Drawings.
Revision G (01/2010)
Added 8-Lead SOIC Package.
Revision H (01/2011)
Revised PDIP Package Type Diagram; Revised
Section 1.0 Electrical Characteristics; Revised SOIC
Package Marking Information (3.90mm).
Revision J (07/2011)
Revised Table 1-2: AC Characteristics.
Revision K (04/2012)
Revised document title (removed CMOS); Revised
Section 5.1.
Revision L (08/2013)
Features Section: Revised ESD Protection to 4000V.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
== ISO/TS 16949 == devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Authorized Distributor
Microchip:
24AA1025-I/SN 24AA1025T-I/SN 24LC1025-E/SN 24LC1025-I/SN