What is Materials Science/Engineering?

Processing

Materials
Structure Properties

ƒ Ceramics
ƒ Bonding ƒ Mechanical
ƒ Metals
ƒ Order/disorder ƒ Electrical
ƒ Polymers
ƒ Atomic arrangements ƒ Magnetic
ƒ Semiconductors
ƒ Defects ƒ Environmental
ƒ Composites
ƒ Optical
ƒ Thermal
Length scales: atom (Å) -> ~ mm ƒ…
 What is Materials Science?

ƒ Materials Structure
Solid State Physics

Nuclear Materials Structural

Philosophy Physics Science Engineering

10-18 10-14 10-10 10-6 10-2 102 104

m
1 1m

Atom arrangements in a crystal

nm - mm
m

Å - nm

Crystallites “grains” Turbine blade

 CHAPTER 1: MATERIALS SCIENCE &
ENGINEERING

Materials are...
engineered structures...not blackboxes!
Structure...has many dimensions...

Structural feature Dimension (m)

atomic bonding < 10 -10
missing/extra atoms 10-10
crystals (ordered atoms) 10 -8 -10-1
second phase particles 10 -8 -10-4
crystal texturing > 10 -6
1
 Materials Structure - Course Outline

1. Bonding

Aluminum - metallic Sodium chloride (salt) -

ionic
2. The science of describing crystalline
materials: Crystallography
3. Defects in materials

1 nm

“seeing atom arrangements in

crystals”: transmission electron
microscopy of thin Sc2O3 foil
 Structure, Processing, & Properties
• Properties depend on structure
ex: hardness vs structure of steel
(d)

600
Hardness (BHN)

30µm
500 (c)
Data obtained from Figs. 10.21(a)
400 (b) and 10.23 with 4wt%C composition,
(a) and from Fig. 11.13 and associated
4µm discussion, Callister 6e.
300 Micrographs adapted from (a) Fig.
10.10; (b) Fig. 9.27;(c) Fig. 10.24;
30µm
and (d) Fig. 10.12, Callister 6e.
200 30µm

100
0.01 0.1 1 10 100 1000
Cooling Rate (C/s)
• Processing can change structure
ex: structure vs cooling rate of steel
2
 The Materials Selection Process

1. Pick Application Determine required Properties

Properties: mechanical, electrical, thermal,
magnetic, optical, deteriorative.

2. Properties Identify candidate Material(s)

Material: structure, composition.

3. Material Identify required Processing

Processing: changes structure and overall shape
ex: casting, sintering, vapor deposition, doping
forming, joining, annealing.

3
 ELECTRICAL

• Electrical Resistivity of Copper:

6
Ni Adapted from Fig. 18.8, Callister 6e.
t% (Fig. 18.8 adapted from: J.O. Linde,
5 . 32a Ann Physik 5, 219 (1932); and
+ 3
Resistivity, ρ

C.A. Wert and R.M. Thomson,

Cu N i
(10-8 Ohm-m)

Physics of Solids, 2nd edition,

at % Ni
4 . 1 6 t % McGraw-Hill Company, New York,

u +2 . 1 2a 1970.)
C
u +1
3 edC
f orm % Ni
d e a t
2 . 12
u +1
C
1 e ” Cu
r
“Pu
0
-200 -100 0 T (°C)
• Adding “impurity” atoms to Cu increases resistivity.
• Deforming Cu increases resistivity.
4
 THERMAL
• Space Shuttle Tiles: • Thermal Conductivity
--Silica fiber insulation of Copper:
offers low heat conduction. --It decreases when
Fig. 19.0, Callister 6e. you add zinc!
(Courtesy of Lockheed
Missiles and Space
Company, Inc.)
400

Thermal Conductivity
300

(W/m-K)
200

100
0
0 10 20 30 40
Composition (wt%Zinc)
Adapted from Adapted from Fig. 19.4, Callister 6e.
Fig. 19.4W, Callister (Fig. 19.4 is adapted from Metals Handbook:
6e. (Courtesy of Properties and Selection: Nonferrous alloys
Lockheed Aerospace and Pure Metals, Vol. 2, 9th ed., H. Baker,
Ceramics Systems, (Managing Editor), American Society for
Sunnyvale, CA) Metals, 1979, p. 315.)
(Note: "W" denotes
100µm fig. is on CD-ROM.) 5
 MAGNETIC
• Magnetic Storage: • Magnetic Permeability
--Recording medium vs. Composition:
is magnetized by --Adding 3 atomic % Si
recording head. makes Fe a better
recording medium!

Magnetization
Fe+3%Si

Fe

Magnetic Field
Adapted from C.R. Barrett, W.D. Nix, and
Fig. 20.18, Callister 6e. A.S. Tetelman, The Principles of
(Fig. 20.18 is from J.U. Lemke, MRS Bulletin, Engineering Materials, Fig. 1-7(a), p. 9,
Vol. XV, No. 3, p. 31, 1990.) 1973. Electronically reproduced
by permission of Pearson Education, Inc.,
Upper Saddle River, New Jersey.

6
 OPTICAL

• Transmittance:
--Aluminum oxide may be transparent, translucent, or
opaque depending on the material structure.

polycrystal: polycrystal:
single crystal low porosity high porosity

Adapted from Fig. 1.2,

Callister 6e.
(Specimen preparation,
P.A. Lessing; photo by J.
Telford.)

7
 DETERIORATIVE

• Stress & Saltwater... • Heat treatment: slows

--causes cracks! crack speed in salt water!

crack speed (m/s)

10-8 “as-is”
“held at
160C for 1hr
before testing”
Alloy 7178 tested in
10-10 saturated aqueous NaCl
solution at 23C

increasing load
Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation and
Fracture Mechanics of Engineering Materials" (4th ed.), p. 505,
Adapted from Fig. 17.0, Callister 6e. John Wiley and Sons, 1996. (Original source: Markus O.
(Fig. 17.0 is from Marine Corrosion, Causes, Speidel, Brown Boveri Co.)
and Prevention, John Wiley and Sons, Inc.,
4µm
1975.)
--material:
7150-T651 Al "alloy"
(Zn,Cu,Mg,Zr)

Adapted from Fig. 11.24,

Callister 6e. (Fig. 11.24 provided courtesy of G.H.
Narayanan and A.G. Miller, Boeing Commercial
Airplane Company.) 8
 SUMMARY
Course Goals:

• Use the right material for the job.

• Understand the relation between properties,

structure, and processing.

• Recognize new design opportunities offered

by materials selection.