Datasheet - AX5312 12-Bit 10 12 15V DAC MAX5312
Datasheet - AX5312 12-Bit 10 12 15V DAC MAX5312
Datasheet - AX5312 12-Bit 10 12 15V DAC MAX5312
KIT
ATION
EVALU
E
L
B
AVAILA
Ordering Information
Applications
Motor Control
Industrial Process Controls
Industrial Automation
Automatic Test Equipment (ATE)
Analog I/O Boards
Data-Acquisition Systems
PART
MAX5312EAE
TEMP RANGE
PIN-PACKAGE
-40C to +85C
16 SSOP
Pin Configuration
TOP VIEW
SCLK 1
16 LDAC
DIN 2
15 CLR
CS 3
DOUT 4
14 VDD
MAX5312
DGND 5
13 REF
12 VSS
VCC 6
11 AGND
SHDN 7
10 SGND
UNI/BIP 8
OUT
SSOP
SPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxims website at www.maxim-ic.com.
MAX5312
General Description
MAX5312
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC ACCURACY
Resolution
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
Zero-Scale Error
Zero-Scale Temperature
Coefficient
Gain Error
Gain-Error Temperature
Coefficient
12
Bits
1
LSB
Guaranteed monotonic
LSB
Bipolar
0.3
Unipolar
0.5
ppm
FSR/C
Bipolar, no load
Unipolar, no load
Bipolar, no load
Unipolar, no load
LSB
LSB
ppm
FSR/C
RLOAD
CLOAD
-2 x
VREF
+2 x
VREF
k
250
DC Output Resistance
pF
0.5
92
2.00
RREF
15
5.25
22
Shutdown
22
200
_______________________________________________________________________________________
V
k
kHz
(VDD = +15V 5%, VSS = -15V 5%, VCC = +5V 10%, AGND = DGND = SGND = 0V, VREF = 5V, RLOAD = 2k, CLOAD = 250pF,
TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VIH
Input-Voltage Low
VIL
Input Capacitance
0.7 x
VCC
2.4
0.6
0.8
10
10
V
pF
VOH
ISOURCE = 2mA
Output-Voltage Low
VOL
ISINK = 2mA
VCC 0.5
V
0.4
0.2
Tri-State Capacitance
10
pF
DYNAMIC PERFORMANCE
Voltage-Output Slew Rate
2.5
V/s
10
Digital Feedthrough
10
nV-s
130
nV/Hz
VDD
10.80
15.75
VSS
-10.80
-15.75
VCC
5.5
IDD
1.8
mA
ISS
0.75
-2
mA
Digital-Supply Current
ICC
30
200
0.4
0.6
1.7
50
2.4
50
Digital supply
3.5
10
PSRR
2.7
LSB/V
_______________________________________________________________________________________
MAX5312
MAX5312
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
(Note 3)
LSB
STATIC ACCURACY
Resolution
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
12
Bits
Guaranteed monotonic
LSB
Code = 14hex
LSB
Code = 14hex
Gain Error
No load
Gain-Error Temperature
Coefficient
No load
ppm
FSR/C
0.05
2
LSB
ppm
FSR/C
+2 x
VREF
RLOAD
CLOAD
10
k
250
DC Output Resistance
pF
0.5
92
2.00
Input Resistance
15
5.25
22
150
kHz
VIH
Input-Voltage Low
VIL
Input Capacitance
CIN
Input Current
IIN
0.7 x
VCC
2.4
0.6
0.8
10
10
V
pF
VOH
ISOURCE = 2mA
Output-Voltage Low
VOL
ISINK = 2mA
VCC 0.5
V
0.4
0.2
_______________________________________________________________________________________
V
A
(VDD = +15V 5%, VSS = 0V, VCC = +5V 10%, AGND = DGND = SGND = 0V, VREF = 5V, RLOAD = 10k, CLOAD = 250pF,
TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
Tri-State Capacitance
TYP
MAX
UNITS
10
pF
2.5
V/s
DYNAMIC PERFORMANCE
Voltage-Output Slew Rate
Output Settling Time
10
Digital Feedthrough
10
nV-s
130
nV/Hz
VDD
VSS
VCC
IDD
ISS
Digital-Supply Current
ICC
30
PSRR
10.80
15.75
0
2.7
V
V
5.5
1.8
mA
0.75
-2
mA
200
0.04
Analog supply
1.7
50
Digital supply
3.5
10
LSB/V
A
_______________________________________________________________________________________
MAX5312
MAX5312
SYMBOL
CONDITIONS
MIN
TYP
SCLK Frequency
SCLK Clock Period
tCP
tCH
tCL
tCSS
tCSH
MAX
UNITS
10
MHz
100
ns
45
ns
45
ns
40
ns
15
10
ns
tDS
20
ns
tDH
10
ns
tLD
tLDS
tDO1
tCS0
tCSE
tCSD
tCS1
CS Pulse-Width High
tCSW
tCLR
50
ns
100
50
100
80
10
CLOAD = 20pF
120
50
+2.7V VCC +3.6V
200
100
ns
ns
120
ns
ns
ns
ns
50
ns
_______________________________________________________________________________________
ns
INTEGRAL NONLINEARITY
vs. REFERENCE VOLTAGE
0.4
0.3
0.5
MAX5312 toc02
0.50
MAX5312 toc01
0.5
DIFFERENTIAL NONLINEARITY
vs. INPUT CODE
0.45
0.4
0.3
0.40
0.2
0.1
0
-0.1
0.35
DNL (LSB)
INL (LSB)
0.30
0.25
-0.2
0.1
0
-0.1
-0.2
0.20
-0.3
-0.3
0.15
-0.4
-0.4
0.10
-0.5
0
1024
2048
2.0
4096
3072
2.5
3.0
3.5
4.0
4.5
5.0
5.5
1024
2048
4096
3072
VREF (V)
DIFFERENTIAL NONLINEARITY
vs. REFERENCE VOLTAGE
INTEGRAL NONLINEARITY
vs. TEMPERATURE
DIFFERENTIAL NONLINEARITY
vs. TEMPERATURE (WORST-CASE CODES)
0.8
0.6
0.40
INL (LSB)
0.35
0.30
0.25
0.20
0.15
0.10
2.5
3.0
3.5
4.0
4.5
5.0
1.0
0.8
0.6
0.4
0.4
0.2
0.2
DNL (LSB)
0.45
MAX5312 toc05
1.0
MAX5312 toc04
0.50
2.0
-0.5
0
-0.2
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
-40
-15
10
35
60
CODE = 9FFhex
-0.2
-0.4
5.5
MAX5312 toc06
INL (LSB)
0.2
DNL (LSB)
MAX5312 toc03
INTERGRAL NONLINEARITY
vs. INPUT CODE
CODE = 7FFhex
-40
85
-15
10
35
60
VREF (V)
TEMPERATURE (C)
TEMPERATURE (C)
MAX5312 toc08
MAX5312 toc07
5V/div
CS
5V/div
CS
2V/div
VOUT
5V/div
0
VOUT
85
5V/div
CS
VOUT
100mV/div
t = 10.0s/div
t = 10.0s/div
t = 4.00s/div
_______________________________________________________________________________________
MAX5312
2.5
MAX5312 toc11
50
CS
5V/div
MAX5312 toc10
CODE = 014hex
49
VOUT (mV)
VOUT (mV)
VOUT
100mV/div
46
CODE = 800hex
2.0
48
47
MAX5312 toc12
45
44
1.5
1.0
0.5
43
42
9.998
MAX5312 toc13
CODE = FFFhex
9.999
-15
10
35
85
60
CODE = FFFhex
VOUT (mV)
VOUT (mV)
9.995
-9.995
9.995
9.993
-9.997
-9.998
9.992
35
85
60
-40
-15
10
35
2.5
2.5
2.0
1.5
1.0
1.0
0.5
0.5
VDD (V)
14.78
60
2.0
1.5
13.76
15.80
VSS = -15V
3.5
IDD (mA)
IDD (mA)
4.0
3.0
12.74
35
3.0
11.72
10
TEMPERATURE (C)
MAX5312 toc16
VSS = 0V
3.5
0
10.70
-15
TEMPERATURE (C)
-40
85
60
MAX5312 toc17
10
85
-9.994
TEMPERATURE (C)
CODE = 000hex
-9.993
-9.996
-15
60
-9.992
9.994
-40
35
9.996
9.994
10
9.996
9.997
-15
TEMPERATURE (C)
9.997
9.998
-40
TEMPERATURE (C)
MAX5312 toc15
0
-40
MAX5312 toc14
t = 4.00s/div
VOUT (mV)
MAX5312
0
10.70
11.72
12.74
13.76
14.78
VDD (V)
_______________________________________________________________________________________
15.80
85
VSS = 0V
2.2
2.5
2.1
-1.0
-2.0
IDD (mA)
2.0
-1.5
IDD (mA)
ISS (mA)
MAX5312 toc20A
VDD = 15V
MAX5312 toc19
3.0
MAX5312 toc18
1.5
2.0
1.9
-2.5
1.0
-3.0
-4.0
-15.80
1.7
0
-14.78
-13.76
-12.74
-11.72
-10.70
-40
-15
10
35
-40
85
60
-15
10
35
85
60
VSS (V)
TEMPERATURE (C)
TEMPERATURE (C)
-0.60
-0.65
-0.70
-0.75
-0.80
ICC
3
2
ISS
1
0
-1
10
35
-40
85
60
-15
10
35
0
-1
-2
ISS
-4
85
60
IDD
-40
-15
TEMPERATURE (C)
TEMPERATURE (C)
0.135
MAX5312 toc23A
CODE = FFFhex
10.000
9.995
35
60
85
10
TEMPERATURE (C)
MAX5312 toc23B
-15
CODE = 014hex
0.125
0.115
0.105
VOUT (V)
9.990
VOUT (V)
-40
-3
-0.90
-0.95
ICC
IDD
MAX5312 toc22
-0.85
-0.55
MAX5312 toc21
-0.50
MAX5312 toc20B
-0.45
ISS (mA)
1.8
0.5
-3.5
9.985
9.980
0.095
0.085
9.975
0.075
9.970
0.065
9.965
0.055
0.045
9.960
0
12
IOUT (mA)
16
20
0.2
0.4
0.6
0.8
1.0
1.2
IOUT (mA)
_______________________________________________________________________________________
MAX5312
CODE = FFFhex
10.000
9.995
-9.975
9.990
VOUT (V)
-9.980
-9.985
-9.990
9.985
9.980
9.975
-9.995
9.970
-10.000
9.965
-16
-12
-8
-4
12
16
3072
2048
IOUT (mA)
IOUT (mA)
UNIPOLAR REFERENCE
INPUT BANDWIDTH
BIPOLAR REFERENCE
INPUT BANDWIDTH
10
6
REF = 0.2VP-P + 5.0VDC
3
0
0.1
0.01
RESPONSE (dB)
RESPONSE (dB)
-3
-6
2048
3072
-6
-9
-12
-12
4096
-15
0.01
0.1
10
100
1000
0.01
0.1
MAX5312 toc29A
VDD
MAX5312 toc29B
20V/div
VCC
5V/div
10
FREQUENCY (kHz)
FREQUENCY (kHz)
-3
-9
-15
1024
VDD
VCC
5V/div
VREF
5V/div
VREF
5V/div
VOUT
2V/div
VOUT
1V/div
t = 10.0s/div
4096
MAX5312 toc28
MAX5312 toc26
100
1024
20
MAX5312 toc27
-20
0.1
0.01
9.960
-10.005
10
MAX5312 toc25
-9.970
10.005
CODE = 000hex
MAX5312 toc24B
MAX5312 toc24A
-9.965
VOUT (V)
MAX5312
t = 10.0s/div
______________________________________________________________________________________
100
1000
MAX5312 toc30B
MAX5312 toc30A
VDD
20V/div
20V/div
VCC
5V/div
VDD
VCC
5V/div
10V/div
10V/div
VSS
VSS
VOUT
2V/div
VOUT
1V/div
t = 10.0s/div
t = 10.0s/div
MAX5312 toc32
MAX5312 toc31
VOUT
VOUT
5V/div
5V/div
VSHDN
VSHDN
2V/div
2V/div
t = 100s/div
t = 100s/div
UNIPOLAR
SOFTWARE-SHUTDOWN RESPONSE
BIPOLAR
SOFTWARE-SHUTDOWN RESPONSE
MAX5312 toc33A
MAX5312 toc33B
CS
CS
5V/div
5V/div
VOUT
VOUT
10V/div
5V/div
t = 40.0s/div
t = 40.0s/div
______________________________________________________________________________________
11
MAX5312
Pin Description
12
PIN
NAME
SCLK
Serial-Clock Input. Data is shifted from DIN into the internal register on the rising edge of SCLK. Data is
clocked out at DOUT on the falling edge of SCLK. SCLK is active only while CS is low.
DIN
Serial-Data Input. DIN is the data input port for the serial interface. Clock data in on the rising edge of SCLK.
CS
DOUT
DGND
VCC
SHDN
UNI/BIP
OUT
FUNCTION
Active-Low Chip-Select Input. CS activates the serial interface. Drive CS low to initiate serial communication.
Serial-Data Output. DOUT is the data output port for the serial interface. Data shifted into DIN appears at
DOUT 16.5 clock cycles later, valid on the falling edge of SCLK. DOUT is high impedance when CS is high.
Digital Ground
Digital Power Input. VCC ranges from +2.7V to +5.5V. Bypass VCC with a 0.1F and 1.0F capacitor to
Active-Low Shutdown Input. SHDN places the device into low-power shutdown mode. When shut down
REF and DOUT are high impedance, drive SHDN low to place the device into shutdown mode.
Unipolar/Bipolar-Select Input. UNI/BIP selects unipolar or bipolar output. In unipolar mode, the analog
output range is 0 to (+2 x VREF). In bipolar mode, the analog output range is (-2 x VREF) to (+2 x VREF).
Drive UNI/BIP high for unipolar output. Drive UNI/BIP low for bipolar output. Dual supplies are required for
bipolar operation.
Analog Output. OUT is the output port for the DAC. Read OUT relative to SGND.
10
SGND
Signal Ground. SGND is the ground-reference node for the output amplifiers internal feedback resistors.
Connect SGND directly to AGND. (See Figure 1.)
11
AGND
Analog Ground. AGND is the ground return for VDD and VSS.
12
VSS
Negative Power Input. Bypass VSS with a 0.1F and 1.0F capacitor to AGND. If operating with a single
supply, connect VSS to AGND.
13
REF
External Reference Input. Apply an external reference voltage of +2V to +5.25V to REF to determine the
output voltage range. In unipolar mode, the output range is from 0 to (+2 x VREF). In bipolar mode, the
output range is from (-2 x VREF) to (+2 x VREF).
14
VDD
Positive Power Input. Bypass VDD with a 0.1F and 1.0F capacitor to AGND.
15
CLR
Active-Low Clear Input. CLR clears input and DAC registers and resets the DAC output to 0V. Drive CLR
low to assert the clear condition.
16
LDAC
Active-Low Load Input. Use LDAC to update the DAC register. LDAC is an asynchronous control input.
Drive low to force an update.
______________________________________________________________________________________
Serial Interface
An SPI-/QSPI-/MICROWIRE-compatible serial interface
allows complete control of the DAC through a 16-bit
control word. The first 4 bits form the control bits that
determine register loading and software-shutdown
functions. The last 12 bits form the DAC data. The 16bit word is entered MSB first.
Table 1 shows the serial-data format. Table 2 shows
the interface commands.
The MAX5312 can be programmed while in shutdown.
The serial interface contains three registers: a 16-bit shift
register, a 12-bit input register, and a 12-bit DAC register
(Figure 1). The shift register accepts data from the serial
interface. The input register acts as a holding register for
data going to the DAC register and isolates the shift register from the DAC register. The DAC register controls
the DAC ladder and thus the output voltage. Any update
in the DAC register updates the output voltage.
2R
2R
VDD
VCC
SW2
A1
REF
SW1
12-BIT DAC
SW3
12
LDAC
CLR
A2
OUT
2R
DAC REGISTER
2R
12
SGND
INPUT REGISTER
12
DOUT
SERIAL INTERFACE
AND CONTROL
MAX5312
AGND
SHDN
VSS
DGND
______________________________________________________________________________________
13
MAX5312
Detailed Description
MAX5312
The MAX5312 uses an inverted DAC ladder architecture to convert the digital input into an analog output
voltage. The digital input controls weighted-switches
that connect the DAC ladder nodes to either REF or
GND (Figure 4). The sum of the weights produces the
analog equivalent of the digital-input word and is then
buffered at the output.
DATA BITS
MSB
LSB
C3
C2
C1
C0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
INPUT DATA
FUNCTION
C3
C2
C1
C0
D11D0
Load input and DAC registers from shift register; DAC output updated.
XXXXXXXXXXXX Load DAC register from input register; DAC output updated; input register unchanged.
X = Dont care.
*All unlisted commands are reserved commands. Do not use.
COMMAND EXECUTED
CS
SCLK
1
DIN
C3
8
C2
C1
C0
D11
D10
D9
D8
9
D7
16
D6
D5
D4
D3
D2
D1
D0
14
______________________________________________________________________________________
(1)
tCSW
CS
tCS0
tCSS
tCP
tCSH
tCS1
SCLK
tCH
tDS
DIN
tCL
tDH
LSB
MSB
tCSE
tCSD
tDO1
DOUT
tLDS
tLD
LDAC
2R
2R
MAX5312
SW2
2R
2R
2R
2R
2R
SW1
OUT
D0
1
D1
1
D10
1
D11
1
SW3
2R
REF
2R
AGND
SGND
DAC REGISTER
UNI/BIP
CONTROL LOGIC
15
MAX5312
2 VREF
212
4 VREF
212
Output Amplifiers
The output-amplifier section can be configured as
either unipolar or bipolar by the UNI/BIP logic input.
With UNI/BIP forced low, SW1 and SW2 in Figure 4 are
closed, and SW3 is open. This configuration channels
the DAC output through two output stages to generate
the 2 x VREF output swing. The first amplifier generates the VREF voltage range and the second amplifier
increases it by two. When configured for bipolar operation, the MAX5312 must be driven with dual 12V to
15V power supplies.
With UNI/BIP forced high, switches SW1 and SW2 are
open, and SW3 is closed. This configuration channels
the DAC output through only a single gain stage to generate a 0 to (2 x VREF) output swing.
Daisy Chaining
SPI-/QSPI-/MICROWIRE-compatible devices can be
daisy chained to reduce I/O lines from the host controller (Figure 7). Daisy chain devices by connecting
the DOUT of one device to the DIN of the next, and
connect the SCLK of all devices to a common clock.
Data is shifted out of DOUT 16.5 clock cycles after it is
shifted into DIN, and is available on the rising edge of
the 17th clock cycle. The SPI-/QSPI-/MICROWIRE-compatible serial interface normally works at up to 10MHz,
but must be slowed to 6.0MHz if daisy chaining. DOUT
is high impedance when CS is high.
Shutdown
Shutdown is controlled by software commands or by the
SHDN logic input. The SHDN logic input can be implemented at any time. The SPI-/QSPI-/MICROWIRE-compatible serial interface remains fully functional, and the device
is programmable while shut down. When shut down, the
MAX5312 supply current reduces to 3.5A, DOUT is high
impedance, and OUT is pulled to SGND through the internal feedback resistors of the output amplifier (Figure 1).
When coming out of shutdown, or during device powerup, allow 350s for the output to stabilize.
LSB
+2 x VREF (1 / 2048)
-2 x VREF (1 / 2048)
+2 x VREF (1 / 4096)
16
ANALOG OUTPUT
UNIPOLAR (UNI/BIP_ = HIGH)
______________________________________________________________________________________
4 x VREF
4096
+2047
+2046
+2045
+2044
+1
0
-1
3
2
1
-2045
-2048
4 x VREF
2 x VREF
2049
2048
2047
1 LSB =
4095
4094
4093
4092
-2046
FFC
FFD
FFE
FFF
801
800
7FF
000
001
002
003
FFC
FFD
FFE
FFF
801
800
7FF
-2047
000
001
002
003
2 x VREF
4096
MAX5312
1 LSB =
Applications Information
Power Supplies
______________________________________________________________________________________
17
MAX5312
CS
CS
TO OTHER
SERIAL DEVICES
MAX5312
MAX5312
SCLK
DIN
MAX5312
SCLK
DOUT
DIN
DIN
SCLK
DOUT
DIN
DOUT
Chip Information
TRANSISTOR COUNT: 3280
TECHNOLOGY: BiCMOS
18
______________________________________________________________________________________
SSOP.EPS
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
0.068
0.078
1.73
1.99
A1
0.002
0.008
0.05
0.21
0.010
0.015
0.25
0.38
C
D
0.20
0.09
0.004 0.008
SEE VARIATIONS
0.205
0.212
0.0256 BSC
5.20
INCHES
D
D
D
D
D
5.38
MILLIMETERS
MIN
MAX
MIN
MAX
0.239
0.239
0.278
0.249
0.249
0.289
6.07
6.07
7.07
6.33
6.33
7.33
0.317
0.397
0.328
0.407
8.07
10.07
8.33
10.33
N
14L
16L
20L
24L
28L
0.65 BSC
0.301
0.311
7.65
7.90
0.025
0
0.037
8
0.63
0
0.95
8
A
C
B
e
A1
D
NOTES:
1. D&E DO NOT INCLUDE MOLD FLASH.
2. MOLD FLASH OR PROTRUSIONS NOT TO EXCEED .15 MM (.006").
3. CONTROLLING DIMENSION: MILLIMETERS.
4. MEETS JEDEC MO150.
5. LEADS TO BE COPLANAR WITHIN 0.10 MM.
PROPRIETARY INFORMATION
TITLE:
21-0056
REV.
1
1
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 19
2003 Maxim Integrated Products
Printed USA
MAX5312
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)