NCP 43080
NCP 43080
NCP 43080
Product Preview
Synchronous Rectifier
Controller
The NCP43080 is a synchronous rectifier controller for switch
mode power supplies. The controller enables high efficiency designs
for flyback and quasi resonant flyback topologies.
Externally adjustable minimum offtime and ontime blanking
periods provides flexibility to drive various MOSFET package types
and PCB layout. A reliable and noise less operation of the SR system is
insured due to the Self Synchronization feature. The NCP43080 also
utilizes Kelvin connection of the driver to the MOSFET to achieve high
efficiency operation at full load and utilizes a light load detection
architecture to achieve high efficiency at light load.
The precise turnoff threshold, extremely low turnoff delay time
and high sink current capability of the driver allow the maximum
synchronous rectification MOSFET conduction time. The high
accuracy driver and 5 V gate clamp make it ideally suited for directly
driving GaN devices.
Features
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1
SOIC8
D SUFFIX
CASE 751
MARKING
DIAGRAMS
8
43080x
ALYW G
G
1
1
DFN8
MN SUFFIX
CASE 488AF
43080x
ALYWG
G
1
WDFN8
MT SUFFIX
CASE 511AT
FxMG
G
ORDERING INFORMATION
See detailed ordering and shipping information on page 33 of
this data sheet.
Typical Applications
Notebook Adapters
High Power Density AC/DC Power Supplies (Cell Phone Chargers)
LCD TVs
All SMPS with High Efficiency Requirements
MIN_TON
MIN_TOFF
NCP43080
RTN
D1
MIN_TON
MIN_TOFF
OK1
+Vout
+
Vbulk
TR1
R1
C1
C6
R7
C7
+
C2
C5
R6
D3
R5
VCC
FLYBACK
M2
D4
D6
C3
CONTROL
GND
CIRCUITRY
FB
C4
DRV
M1
CS
R2
R3
R4
D5
R8
OK1
Figure 2. Typical Application Example DCM, CCM or QR Flyback Converter with optional LLD
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NCP43080
+Vout
+
Vbulk
TR1
R1
C1
R3
R4
R9
VCC
SIDE
M2
D4
PRIMARY
C4
C10
R10
D3
ZCD
C9
R11
C8
C2
D6
C3
GND
FLYBACK
CONTROLLER
C7
DRV
M1
R7
COMP CS
R2
R6
R5
C5
R8
C6
Figure 3. Typical Application Example Primary Side Flyback Converter with optional LLD
Vbulk
R18
TR1
R5
C1
C8
R13
R14
C2
C9
+
R17
D3
D8
R12
C7
VCC
QR
CONTROL
CIRCUITRY
ZCD
C4
DRV
FB CS
M3
D4
D7
GND
D1
R1
+Vout
C5
M1
R15
R9
R10
R6
R7
R19
OK1
C3
M2
NCP43080Q
D5
R16
R11
D6
TR2
C6
Figure 4. Typical Application Example QR Converter Capability to Force Primary into CCM Under Heavy
Loads utilizing MAXTON
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NCP43080
PIN FUNCTION DESCRIPTION
ver. A, B, C, D
ver. Q
Pin Name
VCC
MIN_TOFF
MIN_TON
LLD
This input modulates the driver clamp level and/or turns the driver off during light load
conditions.
NC
CS
Current sense pin detects if the current flows through the SR MOSFET and/or its body
diode. Basic turnoff detection threshold is 0 mV. A resistor in series with this pin can
decrease the turn off threshold if needed.
GND
Ground connection for the SR MOSFET driver, VCC decoupling capacitor and for minimum on and off time adjust resistors and LLD input.
GND pin should be wired directly to the SR MOSFET source terminal/soldering point
using Kelvin connection. DFN8 exposed flag should be connected to GND
DRV
MAX_TON
MIN_TON
Description
Supply voltage pin
ELAPSED
ADJ
DISABLE
Minimum ON time
generator
EN
Disable detection
&
V DRV clamp
modulation
LLD
V_DRV
control
VDD
100A
CS
CS_ON
CS
detection
DRIVER
DRV Out
DRV
CS_OFF
Control logic
CS_RESET
VDD
RESET
MIN_TOFF
ADJ
Minimum OFF
time generator
ELAPSED
DISABLE
EN
VCC managment
UVLO
VCC
GND
NC
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NCP43080
ELAPSED
MIN_TON
ADJ
DISABLE
Minimum ON time
generator
EN
Disable detection
&
V DRV clamp
modulation
LLD
V_DRV
control
VDD
100mA
CS
CS_ON
CS
detection
DRIVER
DRV Out
DRV
CS_OFF
Control logic
CS_RESET
VDD
RESET
MIN_TOFF
ADJ
Minimum OFF
time generator
ELAPSED
EN
DISABLE
VCC managment
UVLO
VCC
ELAPSED
MAX_TON
ADJ
Maximum ON time
generator
GND
EN
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NCP43080
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VCC
0.3 to 37.0
VMIN_TON,
VMIN_TOFF,
VMAX_TON, VLLD
0.3 to VCC
VDRV
0.3 to 17.0
Supply Voltage
MIN_TON, MIN_TOFF, MAX_TON, LLD Input Voltage
VCS
4 to 150
VCS_DYN
10 to 150
IMIN_TON, IMIN_TOFF,
IMAX_TON, ILLD
10 to 10
mA
RqJA_SOIC8
160
C/W
RqJA_DFN8
80
C/W
RqJA_WDFN8
160
C/W
TJMAX
150
Storage Temperature
TSTG
60 to 150
ESDHBM
2000
ESDHBM
1000
ESDMM
200
ESDCDM
750
ESDCDM
250
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device meets latchup tests defined by JEDEC Standard JESD78D Class I.
Symbol
Min
VCC
TJ
40
Max
Unit
35
125
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
ELECTRICAL CHARACTERISTICS
40C TJ 125C; VCC = 12 V; CDRV = 0 nF; RMIN_TON = RMIN_TOFF = 10 kW; VLLD = 0 V; VCS = 1 to +4 V; fCS = 100 kHz, DCCS =
50%, unless otherwise noted. Typical values are at TJ = +25C
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
VCC rising
VCCON
8.3
8.8
9.3
VCC falling
VCCOFF
7.3
7.8
8.3
SUPPLY SECTION
VCC UVLO (ver. B & C)
VCCHYS
VCCON
4.20
4.45
4.80
VCC falling
VCCOFF
3.70
3.95
4.20
1.0
VCC rising
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VCCHYS
0.5
tSTART_DEL
75
V
125
ms
NCP43080
ELECTRICAL CHARACTERISTICS
40C TJ 125C; VCC = 12 V; CDRV = 0 nF; RMIN_TON = RMIN_TOFF = 10 kW; VLLD = 0 V; VCS = 1 to +4 V; fCS = 100 kHz, DCCS =
50%, unless otherwise noted. Typical values are at TJ = +25C
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
ICC
3.3
4.0
5.6
mA
B, D, Q
3.8
4.5
6.0
A, C
4.5
6.0
7.5
B, D, Q
7.7
9.0
10.7
A, C
20
25
30
SUPPLY SECTION
Current Consumption,
RMIN_TON = RMIN_TOFF = 0 kW
A, C
B, D, Q
Current Consumption
ICC
ICC_UVLO
ICC_DIS
40
50
60
1.5
2.0
2.5
mA
75
125
mA
55
70
mA
40
55
ns
35
ns
40
DRIVER OUTPUT
Output Voltage RiseTime
tr
tf
20
RDRV_SOURCE
1.2
RDRV_SINK
0.5
IDRV_SOURCE
IDRV_SINK
VDRVMAX
VDRVMIN
VDRVLLDMIN
9.0
9.5
10.5
4.3
4.7
5.5
7.2
7.8
8.5
4.2
4.7
5.3
3.6
4.0
4.4
0.0
0.4
1.2
CS INPUT
Total Propagation Delay From CS
to DRV Output On
tPD_ON
35
60
ns
tPD_OFF
12
23
ns
CS Bias Current
VCS = 20 mV
Guaranteed by Design
VCS = 150 V
ICS
105
100
95
mA
75
40
mV
mV
0.6
0.4
mA
VTH_CS_ON
120
VTH_CS_OFF
VTH_CS_RESET
0.4
0.5
ICS_LEAKAGE
RMIN_TON = 0 W
tON_MIN
35
55
75
ns
RMIN_TOFF = 0 W
tOFF_MIN
190
245
290
ns
RMIN_TON = 10 kW
tON_MIN
0.92
1.00
1.08
ms
RMIN_TOFF = 10 kW
tOFF_MIN
0.92
1.00
1.08
ms
RMIN_TON = 50 kW
tON_MIN
4.62
5.00
5.38
ms
RMIN_TOFF = 50 kW
tOFF_MIN
4.62
5.00
5.38
ms
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NCP43080
ELECTRICAL CHARACTERISTICS
40C TJ 125C; VCC = 12 V; CDRV = 0 nF; RMIN_TON = RMIN_TOFF = 10 kW; VLLD = 0 V; VCS = 1 to +4 V; fCS = 100 kHz, DCCS =
50%, unless otherwise noted. Typical values are at TJ = +25C
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
VMAX_TON = 3 V
tON_MAX
4.3
4.8
5.3
ms
VMAX_TON = 0.3 V
tON_MAX
41
48
55
ms
IMAX_TON
105
100
95
mA
Disable Threshold
VLLD_DIS
0.8
0.9
1.0
Recovery Threshold
VLLD_REC
0.9
1.0
1.1
LLD INPUT
Disable Hysteresis
Disable Time Hysteresis
0.1
tLLD_DISH
45
ms
tLLD_DIS_REC
7.0
fLPLLD
VLLD_DISH
VLLDMAX
12.5
16.0
ms
10
13
kHz
2.0
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
TYPICAL CHARACTERISTICS
4.7
9.3
4.6
9.1
VCCON
4.4
8.7
4.3
8.5
4.2
4.1
VCCOFF
4.0
VCCON
8.9
VCC (V)
VCC (V)
4.5
8.3
8.1
VCCOFF
7.9
3.9
7.7
3.8
7.5
7.3
40 20
3.7
40 20
20
40
60
TJ (C)
80
100
120
20
40
60
TJ (C)
80
100
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120
NCP43080
TYPICAL CHARACTERISTICS
6
TJ = 55C
TJ = 25C
120
TJ = 85C
TJ = 125C
100
ICC_UVLO (mA)
ICC (mA)
4
TJ = 0C
3
TJ = 20C
TJ = 40C
2
1
80
60
40
20
0
0
10
15
20
25
30
0
40
35
20
20
60
80
100
VCC (V)
TJ (C)
30
120
60
CDRV = 10 nF
CDRV = 10 nF
50
20
40
ICC (mA)
25
15
10
30
20
CDRV = 1 nF
5
CDRV = 1 nF
10
CDRV = 0 nF
CDRV = 0 nF
0
40
20
20
40
60
80
100
0
40 20
120
20
40
60
80
100
120
TJ (C)
TJ (C)
70
65
ICC_DIS (mA)
ICC (mA)
40
60
55
50
45
40
40
20
20
40
60
80
100
120
TJ (C)
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NCP43080
TYPICAL CHARACTERISTICS
0
90
92
0.2
94
0.4
98
ICS (mA)
ICS (mA)
96
100
102
104
TJ = 125C
TJ = 85C
TJ = 55C
TJ = 25C
TJ = 0C
TJ = 20C
TJ = 40C
0.6
0.8
1.0
106
108
110
40
1.2
20
20
40
60
80
100
1.4
1.0 0.8 0.6 0.4 0.2
120
0.4
0.6
VCS (V)
2.5
50
VTH_CS_ON (mV)
30
2.0
ICC (mA)
0.2
TJ (C)
3.0
TJ = 125C
TJ = 85C
TJ = 55C
TJ = 25C
TJ = 0C
TJ = 20C
TJ = 40C
1.5
1.0
0.5
0
4
0.8 1.0
70
90
110
130
150
40 20
20
40
60
80
100
VCS (V)
TJ (C)
1.0
120
0.60
VTH_CS_RESET (V)
VTH_CS_OFF (mV)
0.5
0
0.5
1.0
0.55
0.50
0.45
1.5
2.0
40
20
20
40
60
80
100
0.40
40
120
20
20
40
60
80
TJ (C)
TJ (C)
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10
100
120
NCP43080
0.80
200
0.75
180
0.70
160
0.65
140
ICS_LEAKAGE (nA)
VTH_CS_RESET (V)
TYPICAL CHARACTERISTICS
0.60
0.55
0.50
0.45
TBD
100
80
60
0.40
40
0.35
0.30
20
0
40
10
15
20
25
30
35
20
20
40
60
80
100
VCC (V)
TJ (C)
60
24
55
22
120
20
50
18
tPD_OFF (ns)
tPD_ON (ns)
120
45
40
35
16
14
12
10
30
25
6
20
20
40
60
80
100
4
40
120
20
20
40
60
80
100
120
TJ (C)
TJ (C)
75
1.08
70
1.06
65
1.04
tMIN_TON (ms)
tMIN_TON (ns)
20
40
60
55
50
1.02
1.00
0.98
45
0.96
40
0.94
35
40
20
20
40
60
80
100
0.92
40
120
20
20
40
60
80
100
120
TJ (C)
TJ (C)
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NCP43080
TYPICAL CHARACTERISTICS
5.4
290
5.3
280
270
tMIN_TOFF (ns)
tMIN_TON (ms)
5.2
5.1
5.0
4.9
240
230
210
4.7
4.6
40
20
20
40
60
80
100
200
190
40
120
20
20
40
60
80
100
120
TJ (C)
TJ (C)
1.08
5.4
1.06
5.3
1.04
5.2
tMIN_TOFF (ms)
tMIN_TOFF (ms)
250
220
4.8
1.02
1.00
0.98
5.1
5.0
4.9
0.96
4.8
0.94
4.7
0.92
40
20
20
40
60
80
100
4.6
40
120
20
20
40
60
80
100
TJ (C)
TJ (C)
1.04
1.08
1.03
1.06
1.02
1.04
tMIN_TOFF (ms)
tMIN_TON (ms)
260
1.01
1.00
0.98
120
1.02
1.00
0.98
0.96
0.96
0.94
0.94
092
0.92
0
10
15
20
25
30
35
10
15
20
25
30
VCC (V)
VCC (V)
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35
NCP43080
TYPICAL CHARACTERISTICS
5.5
10.4
VCC = 12 V, CDRV = 0 nF
VCC = 12 V, CDRV = 1 nF
VCC = 12 V, CDRV = 10 nF
VCC = 35 V, CDRV = 0 nF
VCC = 35 V, CDRV = 1 nF
VCC = 35 V, CDRV = 10 nF
VDRV (V)
10.0
9.8
5.1
VDRV (V)
10.2
VCC = 12 V, CDRV = 0 nF
VCC = 12 V, CDRV = 1 nF
VCC = 12 V, CDRV = 10 nF
VCC = 35 V, CDRV = 0 nF
VCC = 35 V, CDRV = 1 nF
VCC = 35 V, CDRV = 10 nF
5.3
9.6
4.9
4.7
9.4
4.5
9.2
9.0
40 20
20
40
60
80
4.3
40 20
120
100
20
40
60
80
100
120
TJ (C)
TJ (C)
50
5.3
TJ = 125C
TJ = 85C
TJ = 55C
TJ = 25C
45
40
TJ = 0C
TJ = 20C
TJ = 40C
5.2
5.1
tMAX_TON (ms)
35
30
25
20
5.0
4.9
4.8
4.7
15
4.6
10
4.5
5
0
4.4
0
0.5
1.0
1.5
2.0
2.5
4.3
40
3.0
20
20
40
60
80
100
120
VMAX_TON (V)
TJ (C)
55
53
51
tMAX_TON (ms)
tMAX_TON (ms)
49
47
45
43
41
40
20
20
40
60
80
100
TJ (C)
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120
NCP43080
APPLICATION INFORMATION
General description
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NCP43080
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NCP43080
VDS = VCS
ISEC
V TH_CS _RESET (RSHIFT _CS*ICS )
VTH_CS_OFF (RSHIFT _CS*ICS )
VTH_CS _ON (RSHIFT _CS*ICS )
VDRV
Turnon delay
Min ONtime
tMIN_TON
Min OFFtime
tMIN_TOFF
t
The tMIN_TON and t MIN_TOFF are adjustable by R MIN_TON and RMIN_TOFF resistors
Figure 38. CS Input Comparators Thresholds and Blanking Periods Timing in LLC
VDS = VCS
ISEC
VTH_CS_RESET (RSHIFT_CS*ICS )
VTH_CS_OFF (RSHIFT_CS*ICS )
VTH_CS _ON (RSHIFT_CS*ICS )
VDRV
Turnon delay
Min ONtime
tMIN_TON
Min OFFtime
tMIN_TOFF
t
The tMIN_TON and tMIN_TOFF are adjustable by RMIN_TON and RMIN_TOFF resistors
Figure 39. CS Input Comparators Thresholds and Blanking Periods Timing in Flyback
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NCP43080
If no RSHIFT_CS resistor is used, the turn-on, turn-off and
VTH_CS_RESET thresholds are fully given by the CS input
specification (please refer to electrical characteristics table).
The CS pin offset current causes a voltage drop that is equal
to:
V RSHIFT_CS + R SHIFT_CS * I CS
(eq. 1)
Figure 40. SR System Connection Including MOSFET and Layout Parasitic Inductances in LLC Application
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NCP43080
Figure 41. Waveforms From SR System Implemented in LLC Application and Using MOSFET in TO220 Package
With Long Leads SR MOSFET channel Conduction Time is Reduced
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NCP43080
Figure 42. Waveforms from SR System Implemented in LLC Application and Using MOSFET in SMT Package with
Minimized Parasitic Inductance SR MOSFET Channel Conduction Time is Optimized
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NCP43080
VDS = VCS
VTH_CS_RESET
VTH_CS_OFF
VTH_CS_ON
t MIN_TOFF
Not complete
t MIN_TOFF > IC
is not activated
t MIN_TOFF
Complete
t MIN_TOFF
activates IC
t MIN_TOFF is stopped
due to VDS drops
below VTH_CS_RESET
t MIN_TON
Min ONtime
VDRV
VCC
VCCON
t1
t3
t2 t4
t5 t7
t6
t9
t8
t10
Self Synchronization
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NCP43080
Figure 46. Internal Connection of the MIN_TON Generator (the MIN_TOFF Works in the Same Way)
V ref
R Ton_min
(eq. 5)
V ref
I R_MIN_TON
+ Ct
V ref
Vref
(eq. 7)
(eq. 8)
(eq. 6)
+ C t @ R MIN_TON
RMIN_TON
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NCP43080
10
9
8
tMIN_TON (ms)
7
6
5
4
3
2
1
0
0
10
20
30
40
50
60
70
80
90 100
RMIN_TON (kW)
tMIN_TOFF (ms)
8
7
6
5
4
3
2
1
0
0
10
20
30
40
50
60
70
80
90 100
RMIN_TOFF (kW)
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NCP43080
Maximum tON adjustment
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NCP43080
VDS = VCS
ISEC
V TH_CS _RESET (RSHIFT _CS*ICS )
VTH_CS_OFF (RSHIFT _CS*ICS )
VTH_CS _ON (RSHIFT _CS*ICS )
Primary virtual ZCD
detection delay
V DRV
Turnon delay
Min ONtime
t MIN _TON
Min OFFtime
tMIN _TOFF
Max ONtime
tMAX _TON
The tMIN _TON and tMIN _TOFF are adjustable by R MIN _TON and R MIN _TOFF resistors, t MAX_TON is adjustable by R MAX_TON
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NCP43080
VDRVCLAMP
ICC
VDRVMAX
VLLD_DIS VLLD_REC
VCC VLLD
VLLD_MAX
Figure 52. LLD Voltage to Driver Clamp and Current Consumption Characteristic (DRV Unloaded)
VCCVLLD
tLLD_DISH
tLLD_DISH
tLLD_DISH
tLLD_DISH
VLLD_REC
DISABLE MODE
NORMAL
DISABLE MODE
tLLD_DIS_R
tLLD_DIS_R
NORMAL
ICC
NORMAL
VLLD_DIS
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NCP43080
RTN
Vmodul
To DRV clamp
VCC
LLD
GND
To disable
logic
NCP43080
Figure 54. NCP43080 Light Load and No Load Detection Principle in Flyback Topologies
VC2
VC3
VLLD_REC
VLLDMAX
VLLD_DIS
VDRV
VDRVMAX
IC enters
disable mode
t
Figure 55. NCP43080 Driver Clamp Modulation Waveforms in Flyback Application Entering into Light/No Load
Condition
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NCP43080
IOUT
VCCVLLD
VLLD_REC
VLLDMAX
VLLD_DIS
VDRVMAX
IC enters
disable mode
VDRV
t
Figure 56. NCP43080 Driver Clamp Modulation Circuitry Transfer Characteristic in Flyback Application
Vmodul
To DRV clamp
VCC
LLD
GND
To disable
logic
NCP43080
RTN
Vmodul
To DRV clamp
VCC
LLD
GND
To disable
logic
NCP43080
circuit consists of R1, R2, R3, C2, C3 and diodes D1, D2.
The NCP43080 enters disable mode in low load condition,
when VCCVLLD drops below VLLD_DIS (0.9 V). Disable
mode ends when this voltage increase above VLLD_REC
(1.0 V) Figure 59 shows how LLD voltage modulates the
driver output voltage clamp.
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27
NCP43080
Normal operation
Skip operation
VCS 1
VCS 2
VC2
V LLDMAX
V CC V LLD
(V C3)
V LLD_REC
V LLD_DIS
V DRVMAX
DRV clamp
IC enters
disable mode
VCCVLLD
IC enters
disable mode
VLLDMAX
VLLD_REC
VLLD_DIS
VDRVMAX
DRV clamp
IOUT
t
Figure 59. NCP43080 Driver Clamp Modulation Circuitry Characteristic in LLC Application
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NCP43080
behavior is shown in Figure 60. Operation waveforms for
this option are provided in Figure 61. Capacitor C2 is
charged to maximum voltage when LLC is switching. When
there is no switching in skip, capacitor C2 is discharged by
R2 and when LLD voltage referenced to VCC falls below
VLLD_DIS IC enters disable mode. Disable mode is ended
when LLC starts switching.
Vmodul
To DRV clamp
VCC
LLD
GND
To disable
logic
NCP43080
RTN
Vmodul
To DRV clamp
VCC
LLD
GND
To disable
logic
NCP43080
Figure 60. NCP43080 Light Load Detection in LLC Application Other Option
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29
NCP43080
Normal operation
Skip operation
VCS1
VCS2
VC2
VLLDMAX
VCCVLLD
VLLD_DIS
DRV clamp
VLLD_REC
IC enters
disable mode
VDRVMAX
Figure 61. NCP43080 Light Load Detection Behavior in LLC Application Other Option
Power Dissipation Calculation
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30
NCP43080
it will need to be measured. Please note that the input
capacitance is not linear (as shown Figure 62) and it needs
to be characterized for a given gate voltage clamp level.
Step 2 Gate Drive Losses Calculation:
Where:
VCC
VCLAMP
Cg_ZVS
C iss + C gs ) C gd
(eq. 9)
C rss + C gd
C oss + C ds ) C gd
Figure 62. Typical MOSFET Capacitances
Dependency on VDS and VGS Voltages
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NCP43080
P DRV_IC +
1
@ C g_ZVS @ V CLAMP 2 @ f SW @
2
R DRV_SINK_EQ
1
) @ C g_ZVS @ V CLAMP 2 @ f SW @
2
Where:
RDRV_SINK_EQ
R DRV_SOURCE_EQ
(eq. 10)
Where:
PDRV_IC
PCC
RqJA
TA
(eq. 11)
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32
(eq. 12)
NCP43080
PRODUCT OPTIONS
OPN
Package
UVLO [V]
Pin 5 function
NCP43080ADR2G
SOIC8
4.5
4.7
NC
NCP43080AMTTWG
WDFN8
4.5
4.7
NC
NCP43080DDR2G
SOIC8
4.5
9.5
NC
NCP43080DMNTWG
DFN8
4.5
9.5
NC
NCP43080DMTTWG
WDFN8
4.5
9.5
NC
NCP43080QDR2G
SOIC8
4.5
9.5
MAX_TON
Usage
ORDERING INFORMATION
Device
NCP43080ADR2G
Package
Package marking
Packing
Shipping
SOIC8
43080A
SOIC8
(PbFree)
WDFN8
(PbFree)
DFN8
(PbFree)
NCP43080DDR2G
43080D
NCP43080QDR2G
43080Q
NCP43080AMTTWG
WDFN8
NCP43080DMTTWG
NCP43080DMNTWG
FA
FD
DFN8
43080D
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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33
NCP43080
PACKAGE DIMENSIONS
SOIC8 NB
CASE 75107
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
X
A
8
0.25 (0.010)
1
4
Y
G
C
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
0.10 (0.004)
H
D
0.25 (0.010)
Z Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm
inches
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34
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
NCP43080
PACKAGE DIMENSIONS
DFN8 4x4
CASE 488AF
ISSUE C
A
B
PIN ONE
REFERENCE
0.15 C
2X
0.15 C
2X
0.10 C
8X
0.08 C
L1
DETAIL A
OPTIONAL
CONSTRUCTIONS
TOP VIEW
EXPOSED Cu
DETAIL B
A
A1
SIDE VIEW
MOLD CMPD
A3
A1
DETAIL B
(A3)
NOTE 4
ALTERNATE
CONSTRUCTIONS
SEATING
PLANE
D2
DETAIL A
K
e
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. DETAILS A AND B SHOW OPTIONAL
CONSTRUCTIONS FOR TERMINALS.
8X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.25
0.35
4.00 BSC
1.91
2.21
4.00 BSC
2.09
2.39
0.80 BSC
0.20
0.30
0.50
0.15
SOLDERING FOOTPRINT*
8X
2.21
0.63
E2
5
8X
4.30 2.39
b
0.10 C A B
0.05 C
PACKAGE
OUTLINE
NOTE 3
BOTTOM VIEW
8X
0.80
PITCH
0.35
DIMENSIONS: MILLIMETERS
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NCP43080
PACKAGE DIMENSIONS
WDFN8 2x2, 0.5P
CASE 511AT
ISSUE O
D
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
L1
PIN ONE
REFERENCE
0.10 C
2X
2X
0.10 C
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
TOP VIEW
EXPOSED Cu
DETAIL B
0.05 C
0.05 C
A1
A3
SIDE VIEW
e/2
MOLD CMPD
DETAIL B
A
8X
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
2.00 BSC
0.50 BSC
0.40
0.60
--0.15
0.50
0.70
ALTERNATE
CONSTRUCTIONS
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
DETAIL A
7X
1
DIM
A
A1
A3
b
D
E
e
L
L1
L2
7X
PACKAGE
OUTLINE
0.78
L2
2.30
8
5
8X
BOTTOM VIEW
b
0.10 C A
0.05 C
0.88
1
B
8X
NOTE 3
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
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NCP43080/D