RT8250

3A, 23V, 340kHz Synchronous Step-Down Converter

General Description
The RT8250 is a high-efficiency synchronous step-down
DC/DC converter that can deliver up to 3A output current
from 4.5V to 23V input supply. The RT8250's current mode
architecture and external compensation allow the transient
response to be optimized over a wide range of loads and
output capacitors. Cycle-by-cycle current limit provides
protection against shorted outputs and soft-start eliminates
input current surge during start-up. The RT8250 also
provides output under voltage protection and thermal
shutdown protection. The low current (<3A) shutdown
mode provides output disconnection, enabling easy power
management in battery-powered systems.

Ordering Information
RT8250
Package Type
SP : SOP-8 (Exposed Pad-Option 1)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :
`

RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.

Suitable for use in SnPb or Pb-free soldering processes.

Marking Information

Features
4.5V to 23V Input Voltage Range
1.5% High Accuracy Feedback Voltage
3A Output Current
Integrated N-MOSFET Switches
Current Mode Control
Fixed Frequency Operation : 340kHz
Output Adjustable from 0.925V to 20V
Up to 95% Efficiency
Programmable Soft-Start
Stable with Low-ESR Ceramic Output Capacitors
Cycle-by-Cycle Over Current Protection
Input Under Voltage Lockout
Output Under Voltage Protection
Thermal Shutdown Protection
Thermally Enhanced SOP-8 (Exposed Pad) Package
RoHS Compliant and Halogen Free

Applications
Industrial and Commercial Low Power Systems
Computer Peripherals
LCD Monitors and TVs
Green Electronics/Appliances
Point of Load Regulation of High-Performance DSPs,
FPGAs and ASICs.

Pin Configurations
(TOP VIEW)

RT8250GSP : Product Number

RT8250
GSPYMDNN

YMDNN : Date Code

BOOT
VIN

SW

GND

GND
9

SS

EN

COMP

FB

SOP-8 (Exposed Pad)

DS8250-05 March 2011

www.richtek.com
1

RT8250
Typical Application Circuit
2

VIN
4.75V to 23V

CIN
10Fx2

REN
100k

VIN

RT8250
7 EN
8 SS

CSS
0.1F

BOOT

4,
Exposed Pad(9)

GND

SW 3

CBOOT L1
10nF 10H
R1
26.1k

FB 5
COMP

CC
RC
3.9nF 6.8k

VOUT
3.3V/3A
COUT
22Fx2

R2
10k

CP
NC

Table 1. Recommended Component Selection

VOUT (V)

R1 (k)

R2 (k)

RC (k)

CC (nF)

L (H)

COUT (F)

15

153

10

30

3.9

33

22 x 2

10

97.6

10

20

3.9

22

22 x 2

76.8

10

15

3.9

22

22 x 2

45.3

10

13

3.9

15

22 x 2

3.3

26.1

10

6.8

3.9

10

22 x 2

2.5

16.9

10

6.2

3.9

6.8

22 x 2

1.8

9.53

10

4.3

3.9

4.7

22 x 2

1.2

10

3.9

3.6

22 x 2

Functional Pin Description

Pin No.

Pin Name

Pin Function
Bootstrap for High Side Gate Driver. Connect a 10nF or greater ceramic capacitor

BOOT

VIN

Voltage Supply Input. The input voltage range is from 4.5V to 23V. A suitable large
capacitor must be bypassed with this pin.

SW

Switching Node. Connect the output LC filter between the SW pin and output load.

4,
9 (Exposed Pad)
5

GND
FB

from the BOOT pin to SW pin.

Ground. The exposed pad must be soldered to a large PCB and connected to
GND for maximum power dissipation.
Output Voltage Feedback Input. The feedback reference voltage is 0.925V
typically.
Compensation Node. This pin is used for compensating the regulation control

COMP

loop. A series RC network is required to be connected from COMP to GND. If it is

needed, an additional capacitor should be connected from COMP to GND.
Enable Input. A logic high enables the converter, a logic low forces the converter

EN

SS

www.richtek.com
2

into shutdown mode reducing the supply current to less than 3A. For automatic
startup, connect this pin to VIN with a 100k pull up resistor.
Soft-Start Control Input. The soft-start period can be set by connecting a capacitor
from the SS to GND. A 0.1F capacitor sets the soft-start period to 13ms typically.

DS8250-05 March 2011

RT8250
Function Block Diagram
VIN
Internal
Regulator
Shutdown
Comparator
+
1.2V
5k

VA VCC

Foldback
Control

+
Lockout
Comparator

EN

VA

BOOT
S

100m

SW

0.5V

+
UV
Comparator

2.5V
3V

Current Sense
Slope Comp Amplifier
+
-

Oscillator
340kHz/110kHz

85m

Current
Comparator

VCC

GND

7A
SS

0.925V

+
+ EA
-

COMP

FB

Absolute Maximum Ratings

(Note 1)

Supply Voltage, VIN -----------------------------------------------------------------------------------------Switching Voltage, SW ------------------------------------------------------------------------------------<20ns ---------------------------------------------------------------------------------------------------------BOOT Voltage ------------------------------------------------------------------------------------------------The Other Pins -----------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25C
SOP-8 (Exposed Pad) -------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
SOP-8 (Exposed Pad), JA --------------------------------------------------------------------------------SOP-8 (Exposed Pad), JC -------------------------------------------------------------------------------Junction Temperature ---------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) -----------------------------------------------------------------Storage Temperature Range ------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM (Human Body Mode) --------------------------------------------------------------------------------MM (Machine Mode) -----------------------------------------------------------------------------------------

Recommended Operating Conditions

0.3V to 24V
0.3V to (VIN + 0.3V)
0.3V to (VIN + 3V)
(VSW 0.3V) to (VSW + 6V)
0.3V to 6V
1.333W
75C/W
15C/W
150C
260C
65C to 150C
2kV
200V

(Note 4)

Supply Voltage, VIN ------------------------------------------------------------------------------------------ 4.5V to 23V

Enable Voltage, VEN ----------------------------------------------------------------------------------------- 0V to 5.5V
Junction Temperature Range ------------------------------------------------------------------------------- 40C to 125C
Ambient Temperature Range ------------------------------------------------------------------------------- 40C to 85C

DS8250-05 March 2011

www.richtek.com
3

RT8250
Electrical Characteristics
(VIN = 12V, TA = 25C unless otherwise specified)

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

Shutdown Supply Current

VEN = 0V

--

0.3

Supply Current

VEN = 3 V, V FB = 1V

--

0.7

1.2

mA

0.911

0.925

0.939

--

1250

--

A/V

Feedback Voltage

VFB

4.75V VIN 23V

Error Amplifier Transconductance

GEA

IC = 10A

High-Side Switch On-Resistance

RDS(ON)1

--

100

--

Low-Side Switch On-Resistance

RDS(ON)2

--

85

--

--

10

--

5.5

--

--

1.4

--

High-Side Switch Leakage Current

VEN = 0V, V SW = 0V
Min. Duty Cycle
VBOOT VSW = 4.8V
From Drain to Source

Upper Switch Current Limit

Lower Switch Current Limit
COMP to Current Sense
Transconductance
Oscillation Frequency

GCS

--

5.2

--

A/V

fOSC1

300

340

380

kHz

Short Circuit Oscillation Frequency

fOSC2

VFB = 0V

--

110

--

kHz

Maximum Duty Cycle

DMAX

VFB = 0.8V

--

90

--

Minimum On Time

tON

--

200

--

ns

Logic-High

VIH

2.7

--

--

Logic-Low
Input Under Voltage Lockout
Threshold
Input Under Voltage Lockout
Threshold Hysterisis
Soft-Start Current

VIL

--

--

0.4

3.8

4.2

4.4

--

200

--

mV

VSS = 0V

--

--

CSS = 0.1F

--

13

--

ms

--

150

--

EN Threshold
Voltage

VIN Rising

Soft-Start Period
Thermal Shutdown

T SD

Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. JA is measured in the natural convection at TA = 25C on a high effective thermal conductivity four-layer test board of
JEDEC 51-7 thermal measurement standard. The case position of JC is on the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.

www.richtek.com
4

DS8250-05 March 2011

RT8250
Typical Operating Characteristics
Efficiency vs. Output Current

Output Voltage vs. Output Current

3.33

100

3.32

90

VIN = 23V

3.31

VIN = 12V

70

Output Voltage (V)

Efficiency (%)

80

VIN = 4.75V

60
50
40
30

3.30

VIN = 4.75V

3.29
3.28
3.27

VIN = 12V
VIN = 23V

3.26
3.25

20
10

3.24

VOUT = 3.3V

VOUT = 3.3V
3.23

0
0

0.5

1.5

2.5

0.5

2.5

Reference Voltage vs. Temperature

Reference Voltage vs. Input Voltage

0.940

0.930

0.935

Reference Voltage (V)

0.932

0.928
0.926
0.924
0.922

0.930
0.925
0.920
0.915

VIN = 6V, VOUT = 3.3V

VOUT = 3.3V, IOUT = 0A

0.920

0.910
4

10

12

14

16

18

20

22

24

-50

-25

Input Voltage (V)

25

50

75

100

125

Temperature (C)

Frequency vs. Temperature

Frequency. vs. Input Voltage

350

350

345

345

340

340

Frequency (kHz)

Frequency (kHz)

Output Current (A)

Output Current (A)

Reference Voltage (V)

1.5

335
330
325
320
315
310

335
330
325
320
315
310

305

VOUT = 3.3V, IOUT = 0A

300

305

VIN = 12V, VOUT = 3.3V, IOUT = 0A

300
4

10

12

14

16

18

Input Voltage (V)

DS8250-05 March 2011

20

22

24

-50

-25

25

50

75

100

125

Temperature (C)

www.richtek.com
5

RT8250
Current Limit vs. Temperature
7.0

6.5

6.5

6.0

6.0

Current Limit (A)

Current Limit (A)

Current Limit vs. Duty Cycle

7.0

5.5
5.0
4.5
4.0
3.5

5.5
5.0
4.5
4.0
3.5

VOUT = 3.3V
3.0

VIN = 12V, VOUT = 3.3V

3.0

10

20

30

40

50

60

70

80

90

100

-50

-25

25

50

75

100

125

Temperature (C)

Duty Cycle (%)

Power On from EN

Power Off from EN

VEN
(5V/Div)

VEN
(5V/Div)

VOUT
(2V/Div)

VOUT
(2V/Div)

IOUT
(2A/Div)

IOUT
(2A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 3A

VIN = 12V, VOUT = 3.3V, IOUT = 3A

Time (5ms/Div)

Time (1ms/Div)

Power On from VIN

Switching
VOUT
(10mV/Div)

VIN
(5V/Div)
VSW
(10V/Div)
VOUT
(2V/Div)
IL
(2A/Div)

VIN = 12V, VOUT = 3.3V, IOUT = 3A

Time (5ms/Div)

www.richtek.com
6

IL
(2A/Div)

VIN = 12V, VOUT = 3.3V, IOUT = 3A

Time (1s/Div)

DS8250-05 March 2011

RT8250
Load Transient Response

Load Transient Response

VOUT
(200mV/Div)

VOUT
(200mV/Div)

IOUT
(2A/Div)

IOUT
(2A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 0A to 1.5A

Time (100s/Div)

DS8250-05 March 2011

VIN = 12V, VOUT = 3.3V, IOUT = 0A to 3A

Time (100s/Div)

www.richtek.com
7

RT8250
Application Information
The RT8250 is a synchronous high voltage buck converter
that can support the input voltage range from 4.5V to 23V
and the output current can be up to 3A.

can be programed by the external capacitor between SS

pin and GND. The chip provides a 7A charge current for
the external capacitor. If a 0.1F capacitor is used to set
the soft-start and its period will be 13ms(typ.).

Output Voltage Setting

The resistive divider allows the FB pin to sense the output
voltage as shown in Figure 1.
V OUT

R1
FB
RT8250

R2

GND

Figure 1. Output Voltage Setting

The output voltage is set by an external resistive divider
according to the following equation :
VOUT = VFB 1+ R1
R2
Where VFB is the feedback reference voltage (0.925V typ.).
External Bootstrap Diode
Connect a 10nF low ESR ceramic capacitor between the
BOOT pin and SW pin. This capacitor provides the gate
driver voltage for the high side MOSFET.
It is recommended to add an external bootstrap diode
between an external 5V and the BOOT pin for efficiency
improvement when input voltage is lower than 5.5V or duty
ratio is higher than 65%. The bootstrap diode can be a
low cost one such as 1N4148 or BAT54.
The external 5V can be a 5V fixed input from system or a
5V output of the RT8250. Note that the external boot
voltage must be lower than 5.5V.
5V

BOOT
RT8250

10nF

SW

Figure 2. External Bootstrap Diode

Soft-Start
The RT8250 contains an external soft-start clamp that
gradually raises the output voltage. The soft-start timming
www.richtek.com
8

Inductor Selection
The inductor value and operating frequency determine the
ripple current according to a specific input and output
voltage. The ripple current IL increases with higher VIN
and decreases with higher inductance.
V
V
IL = OUT 1 OUT
VIN
f L
Having a lower ripple current reduces not only the ESR
losses in the output capacitors but also the output voltage
ripple. High frequency with small ripple current can achieve
highest efficiency operation. However, it requires a large
inductor to achieve this goal.
For the ripple current selection, the value of I L =
0.2375(IMAX) will be a reasonable starting point. The largest
ripple current occurs at the highest VIN. To guarantee that
the ripple current stays below the specified maximum,
the inductor value should be chosen according to the
following equation :
VOUT
VOUT
L =
1

f
I
V

L(MAX)
IN(MAX)

Inductor Core Selection

The inductor type must be selected once the value for L
is known. Generally speaking, high efficiency converters
can not afford the core loss found in low cost powdered
iron cores. So, the more expensive ferrite or
mollypermalloy cores will be a better choice.
The selected inductance rather than the core size for a
fixed inductor value is the key for actual core loss. As the
inductance increases, core losses decrease. Unfortunately,
increase of the inductance requires more turns of wire
and therefore the copper losses will increase.
Ferrite designs are preferred at high switching frequency
due to the characteristics of very low core losses. So,
design goals can focus on the reduction of copper loss
and the saturation prevention.

DS8250-05 March 2011

RT8250
Ferrite core material saturates hard, which means that
inductance collapses abruptly when the peak design
current is exceeded. The previous situation results in an
abrupt increase in inductor ripple current and consequent
output voltage ripple.
Do not allow the core to saturate!
Different core materials and shapes will change the size/
current and price/current relationship of an inductor.
Toroid or shielded pot cores in ferrite or permalloy materials
are small and do not radiate energy. However, they are
usually more expensive than the similar powdered iron
inductors. The rule for inductor choice mainly depends
on the price vs. size requirement and any radiated field/
EMI requirements.
CIN and COUT Selection
The input capacitance, C IN, is needed to filter the
trapezoidal current at the source of the high side MOSFET.
To prevent large ripple current, a low ESR input capacitor
sized for the maximum RMS current should be used. The
RMS current is given by :
V
IRMS = IOUT(MAX) OUT
VIN

VIN
1
VOUT

This formula has a maximum at VIN = 2VOUT, where

I RMS = I OUT /2. This simple worst-case condition is
commonly used for design because even significant
deviations do not offer much relief.
Choose a capacitor rated at a higher temperature than
required. Several capacitors may also be paralleled to
meet size or height requirements in the design.
For the input capacitor, a 10F x 2 low ESR ceramic
capacitor is recommended. For the recommended
capacitor, please refer to table 3 for more detail.
The selection of COUT is determined by the required ESR
to minimize voltage ripple.
Moreover, the amount of bulk capacitance is also a key
for COUT selection to ensure that the control loop is stable.
Loop stability can be checked by viewing the load transient
response as described in a later section.
The output ripple, VOUT , is determined by :
1

VOUT IL ESR +
8fC
OUT

DS8250-05 March 2011

The output ripple will be highest at the maximum input

voltage since IL increases with input voltage. Multiple
capacitors placed in parallel may be needed to meet the
ESR and RMS current handling requirement. Dry tantalum,
special polymer, aluminum electrolytic and ceramic
capacitors are all available in surface mount packages.
Special polymer capacitors offer very low ESR value.
However, it provides lower capacitance density than other
types. Although Tantalum capacitors have the highest
capacitance density, it is important to only use types that
pass the surge test for use in switching power supplies.
Aluminum electrolytic capacitors have significantly higher
ESR. However, it can be used in cost-sensitive applications
for ripple current rating and long term reliability
considerations. Ceramic capacitors have excellent low
ESR characteristics but can have a high voltage coefficient
and audible piezoelectric effects. The high Q of ceramic
capacitors with trace inductance can also lead to significant
ringing.
Higher values, lower cost ceramic capacitors are now
becoming available in smaller case sizes. Their high ripple
current, high voltage rating and low ESR make them ideal
for switching regulator applications. However, care must
be taken when these capacitors are used at input and
output. When a ceramic capacitor is used at the input
and the power is supplied by a wall adapter through long
wires, a load step at the output can induce ringing at the
input, VIN. At best, this ringing can couple to the output
and be mistaken as loop instability. At worst, a sudden
inrush of current through the long wires can potentially
cause a voltage spike at VIN large enough to damage the
part.
Checking Transient Response
The regulator loop response can be checked by looking
at the load transient response. Switching regulators take
several cycles to respond to a step in load current. When
a load step occurs, VOUT immediately shifts by an amount
equal to ILOAD (ESR) also begins to charge or discharge
COUT generating a feedback error signal for the regulator
to return VOUT to its steady-state value. During this recovery
time, VOUT can be monitored for overshoot or ringing that
would indicate a stability problem.

www.richtek.com
9

RT8250
Thermal Considerations

Layout Consideration

For continuous operation, do not exceed the maximum

operation junction temperature 125C. The maximum
power dissipation depends on the thermal resistance of
IC package, PCB layout, the rate of surroundings airflow
and temperature difference between junction to ambient.
The maximum power dissipation can be calculated by
following formula :

Follow the PCB layout guidelines for optimal performance

of the RT8250.

PD(MAX) = ( TJ(MAX) TA ) / JA

Keep the traces of the main current paths as short and

wide as possible.

Put the input capacitor as close as possible to the device

pins (VIN and GND).

SW node is with high frequency voltage swing and

should be kept at small area. Keep sensitive
components away from the SW node to prevent stray
capacitive noise pick-up.

Place the feedback components to the FB pin and

COMP pin as close as possible.

The GND pin and Exposed Pad should be connected to

a strong ground plane for heat sinking and noise
protection.

Where T J(MAX) is the maximum operation junction

temperature, TA is the ambient temperature and the JA is
the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT8250, the maximum junction temperature is 125C. The
junction to ambient thermal resistance JA is layout
dependent. For PSOP-8 package, the thermal resistance
JA is 75C/W on the standard JEDEC 51-7 four-layers
thermal test board. The maximum power dissipation at TA
= 25C can be calculated by following formula :

Input capacitor must be placed

as close to the IC as possible.
SW
GND
V IN

PD(MAX) = (125C 25C) / (75C/W) = 1.333W for

PSOP-8 package
The maximum power dissipation depends on operating
ambient temperature for fixed T J(MAX) and thermal
resistance JA. For RT8250 package, the Figure 3 of
derating curve allows the designer to see the effect of
rising ambient temperature on the maximum power
dissipation allowed.

CS

The feedback
components must be
connected as close to
the device as possible.

C IN
BOOT
V OUT
C OUT

L1

SS

EN

COMP

FB

VIN

SW
GND

GND

CC

CP

RC

R1
V OUT
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace.

R2
GND

Maximum Power Dissipation (W)

1.6

Four-Layer PCB

Figure 4. PCB Layout Guide

1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0

25

50

75

100

125

Ambient Temperature (C)

Figure 3. Derating Curve for RT8250 Package

www.richtek.com
10

DS8250-05 March 2011

RT8250
Table 2. Suggested Inductors for Typical Application Circuit
Component Supplier

Series

Dimensions (mm)

TDK

VLF10045

10 x 9.7 x 4.5

TAIYO YUDEN

NR8040

8x8x4

Table 3. Suggested Capacitors for CIN and COUT

Component Supplier

Part No.

Capacitance (F)

Case Size

MURATA

GRM31CR61E106K

10

1206

TDK

C3225X5R1E106K

10

1206

TAIYO YUDEN

TMK316BJ106ML

10

1206

MURATA

GRM31CR60J476M

47

1206

TDK

C3225X5R0J476M

47

1210

TAIYO YUDEN

EMK325BJ476MM

47

1210

MURATA

GRM32ER71C226M

22

1210

TDK

C3225X5R1C226M

22

1210

DS8250-05 March 2011

www.richtek.com
11

RT8250
Outline Dimension

M
EXPOSED THERMAL PAD
(Bottom of Package)

Y
J

C
I
D

Dimensions In Millimeters

Symbol

Dimensions In Inches

Min

Max

Min

Max

4.801

5.004

0.189

0.197

3.810

4.000

0.150

0.157

1.346

1.753

0.053

0.069

0.330

0.510

0.013

0.020

1.194

1.346

0.047

0.053

0.170

0.254

0.007

0.010

0.000

0.152

0.000

0.006

5.791

6.200

0.228

0.244

0.406

1.270

0.016

0.050

2.000

2.300

0.079

0.091

2.000

2.300

0.079

0.091

2.100

2.500

0.083

0.098

3.000

3.500

0.118

0.138

Option 1

Option 2

8-Lead SOP (Exposed Pad) Plastic Package

Richtek Technology Corporation

Richtek Technology Corporation

Headquarter

Taipei Office (Marketing)

5F, No. 20, Taiyuen Street, Chupei City

5F, No. 95, Minchiuan Road, Hsintien City

Hsinchu, Taiwan, R.O.C.

Taipei County, Taiwan, R.O.C.

Tel: (8863)5526789 Fax: (8863)5526611

Tel: (8862)86672399 Fax: (8862)86672377

Email: [email protected]

Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.

www.richtek.com
12

DS8250-05 March 2011