BC847 Series: 1. Product Profile
BC847 Series: 1. Product Profile
BC847 Series: 1. Product Profile
1. Product profile
1.1 General description
NPN general-purpose transistors in Surface-Mounted Device (SMD) plastic packages.
Table 1.
Product overview
Type number[1]
Package
NXP
JEITA
JEDEC
BC847
SOT23
TO-236AB
PNP complement
BC857
BC847A
BC857A
BC847B
BC857B
BC847C
BC847W
BC857C
SOT323
SC-70
BC857W
BC847AW
BC857AW
BC847BW
BC857BW
BC847CW
BC847T
BC857CW
SOT416
SC-75
BC857T
BC847AT
BC857AT
BC847BT
BC857BT
BC847CT
BC857CT
BC847AM
SOT883
SC-101
BC857AM
BC847BM
BC857BM
BC847CM
BC857CM
[1]
General-purpose transistors
SMD plastic packages
Three different gain selections
AEC-Q101 qualified
1.3 Applications
General-purpose switching and amplification
BC847 series
NXP Semiconductors
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter voltage
open base
45
IC
collector current
100
mA
DC current gain
hFE
[1]
[1]
110
800
hFE group A
VCE = 5 V; IC = 2 mA
110
180
220
hFE group B
200
290
450
hFE group C
420
520
800
2. Pinning information
Table 3.
Pin
Pinning
Description
Simplified outline
Graphic symbol
base
emitter
collector
3
1
sym021
006aaa144
SOT883
1
base
emitter
collector
3
3
1
Transparent
top view
2
sym021
BC847_SER
2 of 17
BC847 series
NXP Semiconductors
3. Ordering information
Table 4.
Ordering information
Type number[1]
BC847
Package
Name
Description
Version
SOT23
SC-70
SOT323
SC-75
SOT416
SC-101
SOT883
BC847A
BC847B
BC847C
BC847W
BC847AW
BC847BW
BC847CW
BC847T
BC847AT
BC847BT
BC847CT
BC847AM
BC847BM
BC847CM
[1]
4. Marking
Table 5.
Type number
Marking code[1]
Type number
Marking code[1]
BC847
1H*
BC847T
1N
BC847A
1E*
BC847AT
1E
BC847B
1F*
BC847BT
1F
BC847C
1G*
BC847CT
1G
BC847W
1H*
BC847AM
D4
BC847AW
1E*
BC847BM
D5
BC847BW
1F*
BC847CM
D6
BC847CW
1G*
[1]
BC847_SER
Marking codes
3 of 17
BC847 series
NXP Semiconductors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
collector-base voltage
open emitter
50
VCEO
collector-emitter voltage
open base
45
VEBO
emitter-base voltage
open collector
IC
collector current
100
mA
ICM
single pulse;
tp 1 ms
200
mA
IBM
single pulse;
tp 1 ms
100
mA
Ptot
Tamb 25 C
SOT23
250
mW
SOT323
200
mW
150
mW
250
mW
[1]
SOT416
[2]
SOT883
Tj
junction temperature
150
Tamb
ambient temperature
65
+150
Tstg
storage temperature
65
+150
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB with 60 m copper strip line, standard footprint.
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
in free air
Min
Typ
Max
Unit
SOT23
500
K/W
SOT323
625
K/W
SOT416
833
K/W
500
K/W
[2]
SOT883
BC847_SER
[1]
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB with 60 m copper strip line, standard footprint.
4 of 17
BC847 series
NXP Semiconductors
7. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ICBO
collector-base cut-off
current
VCB = 30 V; IE = 0 A
15
nA
VCB = 30 V; IE = 0 A;
Tj = 150 C
IEBO
emitter-base cut-off
current
VEB = 5 V; IC = 0 A
100
nA
hFE
DC current gain
VCE = 5 V; IC = 10 A
hFE group A
170
hFE group B
280
hFE group C
420
110
800
hFE group A
110
180
220
hFE group B
200
290
450
hFE group C
420
520
800
DC current gain
VCEsat
VBEsat
VBE
BC847_SER
VCE = 5 V; IC = 2 mA
collector-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA
90
200
mV
IC = 100 mA; IB = 5 mA
[1]
200
400
mV
base-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA
[2]
700
mV
IC = 100 mA; IB = 5 mA
[2]
900
mV
IC = 2 mA; VCE = 5 V
[2]
base-emitter voltage
580
660
700
mV
IC = 10 mA; VCE = 5 V
770
mV
fT
transition frequency
VCE = 5 V; IC = 10 mA;
f = 100 MHz
100
MHz
Cc
collector capacitance
VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
1.5
pF
Ce
emitter capacitance
VEB = 0.5 V; IC = ic = 0 A;
f = 1 MHz
11
pF
NF
noise figure
IC = 200 A; VCE = 5 V;
RS = 2 k; f = 1 kHz;
B = 200 Hz
10
dB
[1]
[2]
5 of 17
BC847 series
NXP Semiconductors
mgt723
400
hFE
mgt724
1200
VBE
(mV)
1000
(1)
300
(1)
800
(2)
(2)
200
600
(3)
400
(3)
100
200
0
101
10
102
0
101
103
10
102
I C (mA)
VCE = 5 V
VCE = 5 V
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
Fig 1.
103
103
I C (mA)
VCEsat
(mV)
Fig 2.
1200
VBEsat
(mV)
1000
(1)
800
(2)
102
600
(1)
(3)
(2)
400
(3)
200
10
101
10
102
0
101
103
IC/IB = 20
IC/IB = 10
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
Fig 3.
BC847_SER
10
102
103
I C (mA)
I C (mA)
Fig 4.
6 of 17
BC847 series
NXP Semiconductors
mgt727
600
mgt728
1200
VBE
(mV)
1000
hFE
500
(1)
400
800
(1)
(2)
600
300
(2)
(3)
400
200
(3)
100
0
10-1
10
200
102
0
102
103
101
10
I C (mA)
VCE = 5 V
VCE = 5 V
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
Fig 5.
102
103
I C (mA)
104
VCEsat
(mV)
Fig 6.
1200
VBEsat
(mV)
1000
(1)
103
800
(2)
600
(3)
102
400
(1)
200
(3) (2)
10
101
10
102
0
101
103
IC/IB = 20
IC/IB = 10
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
Fig 7.
BC847_SER
10
102
103
I C (mA)
I C (mA)
Fig 8.
7 of 17
BC847 series
NXP Semiconductors
mgt731
1200
VBE
(mV)
1000
hFE
1000
mgt732
1200
(1)
(1)
800
800
(2)
(2)
600
400
600
(3)
400
(3)
200
200
0
101
10
102
103
0
102
101
10
I C (mA)
VCE = 5 V
VCE = 5 V
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
Fig 9.
102
103
I C (mA)
104
VCEsat
(mV)
1200
VBEsat
(mV)
1000
(1)
103
800
(2)
600
(3)
102
400
(1)
200
(3) (2)
10
101
10
102
103
0
101
I C (mA)
IC/IB = 20
IC/IB = 10
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
BC847_SER
102
103
I C (mA)
10
8 of 17
BC847 series
NXP Semiconductors
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
3.0
2.8
1.1
0.9
3
0.45
0.15
2.5 1.4
2.1 1.2
0.48
0.38
1.9
0.15
0.09
Dimensions in mm
04-11-04
2.2
1.8
1.1
0.8
0.45
0.15
2.2 1.35
2.0 1.15
2
0.4
0.3
0.25
0.10
1.3
Dimensions in mm
04-11-04
BC847_SER
9 of 17
BC847 series
NXP Semiconductors
0.95
0.60
1.8
1.4
3
0.45
0.15
1.75 0.9
1.45 0.7
2
0.30
0.15
0.25
0.10
1
Dimensions in mm
04-11-04
0.50
0.46
0.30
0.22
0.65
0.30
0.22
1.02
0.95
0.20
0.12
0.35
Dimensions in mm
03-04-03
BC847_SER
10 of 17
BC847 series
NXP Semiconductors
10. Soldering
3.3
2.9
1.9
solder lands
solder resist
3
1.7
solder paste
0.6
(3)
0.7
(3)
occupied area
Dimensions in mm
0.5
(3)
0.6
(3)
1
sot023_fr
1.4
(2)
solder lands
4.6
solder resist
2.6
occupied area
Dimensions in mm
1.4
sot023_fw
BC847_SER
11 of 17
BC847 series
NXP Semiconductors
2.65
1.85
1.325
solder lands
solder resist
2.35
0.6
(3)
solder paste
1.3
occupied area
0.5
(3)
Dimensions in mm
0.55
(3)
sot323_fr
3.65 2.1
09
(2)
Dimensions in mm
preferred transport
direction during soldering
sot323_fw
BC847_SER
12 of 17
BC847 series
NXP Semiconductors
2.2
1.7
solder lands
solder resist
1
0.85
2
solder paste
0.5
(3)
occupied area
Dimensions in mm
0.6
(3)
1.3
sot416_fr
R0.05 (12)
solder lands
solder resist
0.9
0.6
0.7
solder paste
0.25
(2)
occupied area
0.3
(2)
0.3
0.4
(2)
0.4
Dimensions in mm
sot883_fr
BC847_SER
13 of 17
BC847 series
NXP Semiconductors
Revision history
Document ID
Release date
BC847_SER v.9
20140923
Modifications:
BC847_SER v.8
BC847_SER v.8
20120820
BC847_BC547_SER v.7
BC847_BC547_SER v.7
20081210
BC847_BC547_SER v.6
BC847_BC547_SER v.6
20050519
BC847_SER
14 of 17
BC847 series
NXP Semiconductors
Product status[3]
Definition
Development
This document contains data from the objective specification for product development.
Qualification
Production
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BC847_SER
15 of 17
BC847 series
NXP Semiconductors
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
BC847_SER
16 of 17
NXP Semiconductors
BC847 series
45 V, 100 mA NPN general-purpose transistors
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
Quality information . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.
Mouser Electronics
Authorized Distributor
NXP:
BC847,235 BC847A,235 BC847A,215 BC847AT,115 BC847AW,135 BC847AW,115 BC847B,235 BC847BM,315
BC847B,215 BC847BT,115 BC847BW,135 BC847BW,115 BC847C,235 BC847CM,315 BC847C,215
BC847CT,115 BC847CW,135 BC847CW,115 BC847,215 BC847T,115 BC847W,135 BC847W,115