SANKEN ELECTRIC CO., LTD.

http://www.sanken-ele.co.jp/en/
+B
GND
S1
P
D D VCC
S2
LowB
GND
For ErrAmp, Sanken SE series device recommended
For SI, Sanken linear regulator IC recommended
11
33 77
66
44
FB
ROCP
ErrAmp
55
Standby
ON/OFF
Standby
Out
CX
RX
SI
A
B
B
A
STR-W6756
Controller
(MIC)
S/GND OCP/BD SS/OLP
STR-W6756
Description
The STR-W6756 is a quasi-resonant topology IC designed for
SMPS applications. It shows lower EMI noise characteristics
than conventional PWM solutions, especially at greater than
2 MHz. It also provides a soft-switching mode to turn on the
internal MOSFET at close to zero voltage (V
DS
bottom point)
by use of the resonant characteristic of primary inductance
and a resonant capacitor.
The package is a fully molded TO-220, which contains the
controller chip (MIC) and MOSFET, enabling output power up
to 140 W with universal input or 240 W with a 230 VAC input.
The bottom-skip mode skips the first bottom of V
DS
and turns
on the MOSFET at the second bottom point, to minimize an
increase of operating frequency at light output load, improving
system-level efficiency over the entire load range.
There are two standby modes available to reduce the input power
under very light load conditions. The first is Auto-Standby
mode, which is internally triggered by periodic sensing, and
the other is a manual standby mode, which is executed by
clamping the secondary output. In general applications, the
manual standby mode reduces the input power further compared
to Auto-Standby mode.
The soft-start mode minimizes surge voltage and reduces
power stress to the MOSFET and to the secondary rectifying
Features and Benefits
Quasi-resonant topology IC Low EMI noise and soft
switching
Bottom-skip mode Improved system efficiency over
the entire output load by avoiding increase of switching
frequency
Auto-Standby mode Lowers input power at very light
output load condition
Avalanche-guaranteed MOSFET Improves system-level
reliability and does not require V
DSS
derating
650 V / 0.73
Various protections Improved system-level reliability
Quasi-Resonant Topology
Primary Switching Regulators
Typical Application Diagram
Package: 6-pin TO-220
Not to scale
Continued on the next page
Continued on the next page
28103.33
2
SANKEN ELECTRIC CO., LTD.
28103.33
Quasi-Resonant Topology
Primary Switching Regulators
STR-W6756
diodes during the start-up sequence. Various protections such as
overvoltage, overload, overcurrent, maximum on-time protections
and avalanche-energy-guaranteed MOSFET secure good system-
level reliability.
Applications include the following:
Set Top Box
LCD PC monitor, LCD TV
Printer, Scanner
SMPS power supplies
Selection Guide
Part Number Package
STR-W6756 TO-220
Features and Benefits (continued) Description (continued)
All performance characteristics given are typical values for circuit or
system baseline design only and are at the nominal operating voltage and
an ambient temperature, T
A
, of 25C, unless oth er wise stated.
Pulse-by-pulse drain overcurrent limiting
Overvoltage protection (bias winding voltage sensing),
with latch
Overload protection with latch
Maximum on-time limit
Absolute Maximum Ratings at T
A
= 25C
Parameter Symbol Conditions Rating Unit
Drain Current
1
I
D
peak Single pulse 15 A
Maximum Switching Current
2
I
Dmax
T
A
= 20C to 125C 15 A
Single Pulse Avalanche Energy
3
E
AS
Single pulse, V
DD
= 99 V, L = 20 mH, I
Lpeak
= 6.05 A 400 mJ
Input Voltage for Controller (MIC) V
CC
35 V
SS/OLP Terminal Voltage V
SSOLP
0.5 to 6.0 V
FB Terminal Inflow Current I
FB
10 mA
FB Terminal Voltage V
FB
I
FB
within the limits of I
FB
0.5 to 9.0 V
OCP/BD Terminal Voltage V
OCPBD
1.5 to 5.0 V
MOSFET Power Dissipation
4
P
D1
With infinite heatsink 29 W
Without heatsink 1.3 W
Controller (MIC) Power Dissipation P
D2
V
CC
I
CC
0.8 W
Operating Internal Leadframe Temperature T
F
Recommended operation temperature, see cautions 20 to 115 C
Operating Ambient Temperature T
OP
20 to 115 C
Storage Temperature T
stg
40 to 125 C
Channel Temperature T
ch
150 C
1
Refer to figure 2
2
I
DMAX
is the drain current determined by the drive voltage of the IC and the threshold voltage, V
th
, of the MOSFET
3
Refer to figure 3
4
Refer to figure 5
3
SANKEN ELECTRIC CO., LTD.
28103.33
Quasi-Resonant Topology
Primary Switching Regulators
STR-W6756
D
S/GND
OCP/BD
VCC
FB
R
S
Q
Reg and
I
const
OVP
Drive
Control IC
Reg
Protection
Latch
S
R Q
FB
OCP
BSD
BD
Bottom Select
Counter SS/OLP
OLP
Delay
S
R
Q
OSC
Max On
Soft Start
Burst
Control Start
Stop
Burst
Control
4
+
-
+
-
+
-
+
-
+
-
+
-
1
3
6
7
5
Temperature, T
F
(C)
S
a
f
e

O
p
e
r
a
t
i
n
g

A
r
e
a

T
e
m
p
e
r
a
t
u
r
e

D
e
r
a
t
i
n
g

C
o
e
f
f
i
c
i
e
n
t

(
%
)
0
20
40
60
80
100
0 20 40 60 100 80 120
Drain-to-Source Voltage, V
DS
(V)
D
r
a
i
n

C
u
r
r
e
n
t
,

I
D

(
A
)
10.00
1.00
0.10
100.00
100 1000 10
1

m
s
0
.
1

m
s
Current limit
due to R
DS(on)
Refer to figure 1 for MOSFET SOA
temperature derating coefficient
Figure 1 MOSFET Safe Operating Area
Derating Curve
Figure 2 MOSFET Safe Operating Area
Drain Current versus Voltage
at T
A
= 25C, Single Pulse
Terminal List Table
Number Name Description Functions
1 D Drain MOSFET drain
2 NC Clipped No connection
3 S/GND Source/ground terminal MOSFET source and ground
4 VCC Power supply terminal Input of power supply for control circuit
5 SS/OLP Soft Start/Overload Protection terminal Input to set delay for Overload protection and Soft Start operation
6 FB Feedback terminal
Input for Constant Voltage Control and Burst (intermittent) Mode
oscillation control signals
7 OCP/BD Overcurrent Protection/Bottom Detection Input for overcurrent detection and bottom detection signals
4
SANKEN ELECTRIC CO., LTD.
28103.33
Quasi-Resonant Topology
Primary Switching Regulators
STR-W6756
Channel J unction Temperature, T
J
(C)
E
A
S

T
e
m
p
e
r
a
t
u
r
e

D
e
r
a
t
i
n
g

C
o
e
f
f
i
c
i
e
n
t

(
%
)
0
20
40
60
80
100
25 50 75 100 125 150
Time, t (s)
T
r
a
n
s
i
e
n
t

T
h
e
r
m
a
l

R
e
s
i
s
t
a
n
c
e
,

R

J
C

(

C
/
W
)
0.001
0.010
0.100
1.000
10.000
100 10 10m 1m 100m 1
Ambient Temperature, T
A
(C)
P
o
w
e
r

D
i
s
s
i
p
a
t
i
o
n
,

P
D
1

(
W
)
0
5
10
15
20
25
30
0 20 40 60 80 100 120 140 160
P
D1
= 1.3 W at T
A
25C
Without heatsink
With infinite heatsink
P
D1
= 29 W at T
A
25C
Figure 3 MOSFET Avalanche Energy Derating Curve
V
DD
= 99 V, L = 20 mH, I
L
= 3.6 A
Figure 4 Transient Thermal Resistance
Figure 5 MOSFET Power Dissipation versus Temperature
5
SANKEN ELECTRIC CO., LTD.
28103.33
Quasi-Resonant Topology
Primary Switching Regulators
STR-W6756
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Test Conditions Min. Typ. Max. Units
ELECTRICAL CHARACTERISTICS for Controller (MIC)
1
, valid at T
A
= 25C, V
CC
= 20 V, unless otherwise specified
Power Supply Start-up Operation
Operation Start Voltage V
CC(ON)
V
CC
= 020 V 16.3 18.2 19.9 V
Operation Stop Voltage V
CC(OFF)
V
CC
= 208.8 V 8.8 9.7 10.6 V
Circuit Current In Operation I
CC(ON)
6 mA
Circuit Current In Non-Operation I
CC(OFF)
V
CC
= 15 V 100 A
Oscillation Frequency f
osc
19 22 25 kHz
Soft Start Operation Stop Voltage V
SSOLP(SS)
V
SS/OLP
increasing 1.1 1.2 1.4 V
Soft Start Operation Charging Current I
SSOLP(SS)
V
SS/OLP
= 0 V 710 550 390 A
Normal Operation
Bottom-Skip Operation Threshold Voltage 1 V
OCPBD(BS1)
0.720 0.665 0.605 V
Bottom-Skip Operation Threshold Voltage 2 V
OCPBD(BS2)
0.485 0.435 0.385 V
Overcurrent Detection Threshold Voltage V
OCPBD(LIM)
V
OCP/BD
falling 0.995 0.940 0.895 V
OCP/BD Terminal Outflow Current I
OCPBD
V
OCP/BD
= 0.95 V 250 100 40 A
Quasi-Resonant Operation Threshold Voltage 1 V
OCPBD(TH1)
V
OCP/BD
falling 0.28 0.40 0.52 V
Quasi-Resonant Operation Threshold Voltage 2 V
OCPBD(TH2)
V
OCP/BD
rising 0.67 0.80 0.93 V
FB Terminal Threshold Voltage V
FB(OFF)
V
FB
rising 1.32 1.45 1.58 V
FB Terminal Inflow Current (Normal Operation) I
FB(ON)
V
FB
= 1.6 V 600 1000 1400 A
Standby Operation
Standby Operation Start Voltage V
CC(S)
V
CC
= 015 V, V
FB
= 1.6 V 10.3 11.1 12.1 V
Standby Operation Start Voltage Interval V
CC(SK)
V
CC(SK)
= V
CC(S)
V
CC(OFF) 1.10 1.35 1.65 V
Standby Non-Operation Circuit Current I
CC(S)
V
CC
= 10.2 V, V
FB
= 1.6 V 20 56 A
FB Terminal Inflow Current, Standby Operation I
FB(S)
V
CC
= 10.2 V, V
FB
= 1.6 V 4 14 A
FB Terminal Threshold Voltage, Standby Operation V
FB(S)
V
CC
= 15 V, V
FB
rising 0.55 1.10 1.50 V
Minimum On Time t
ON(MIN)
0.65 1.00 1.35 s
Protection Operation
Maximum On Time t
ON(MAX)
27.5 32.5 39.0 s
Overload Protection Operation Threshold Voltage V
SSOLP(OLP)
4.0 4.9 5.8 V
Overload Protection Operation Charging Current I
SSOLP(OLP)
V
SS/OLP
= 2.5 V 16 11 6 A
Overvoltage Protection Operation Voltage V
CC(OVP)
V
CC
= 030 V 25.5 27.7 29.9 V
Latch Circuit Holding Current
2
I
CC(H)
V
CC(OFF)
0.3 V 45 140 A
Latch Circuit Release Voltage
2
V
CC(La.OFF)
V
CC
= 306 V, OVP operating 6.0 7.2 8.5 V
ELECTRICAL CHARACTERISTICS for MOSFET, valid at T
A
= 25C, unless otherwise specified
Drain-to-Source Breakdown Voltage V
DSS
I
D
= 300 A 650 V
Drain Leakage Current I
DSS
V
DS
= 650 V 300 A
On Resistance R
DS(on)
I
D
= 2.2 A 0.73
Switching Time t
f
400 ns
Thermal Resistance R
ch-F
Channel to internal frame 1.5 C/W
1
Current polarity with respect to the IC: positive current indicates current sink at the terminal named, negative current indicates source at the
terminal named.
2
The latch circuit means a circuit operated OVP and OLP.
6
SANKEN ELECTRIC CO., LTD.
28103.33
Quasi-Resonant Topology
Primary Switching Regulators
STR-W6756
PACKAGE DIMENSIONS, TO-220
10.0 0.2
4.2 0.2
2.8 0.2

3
.
2

0
.
2
2.6 0.1
(
2

R
1
)
Terminal dimension at case surface
5.08 0.6
0.65
+0.2
0.1
0.740.15
0.45
+0.2
0.1
1
6
.
9

0
.
3
1
0
.
4

0
.
5
5
.
0

0
.
5
7
.
9

0
.
2
4

0
.
2
0
.
5
2
.
8
(
5
.
4
)
Gate Burr
Branding
XXXXXXXX
XXXXXXXX
XX XX
Gate burr: 0.3 mm (max.)
Terminal core material: Cu
Terminal treatment: Ni plating and solder dip
Leadform: 2003
Weight (approximate): 2.3 g
Dimensions in millimeters
Drawing for reference only
Branding codes (exact appearance at manufacturer discretion):
1st line, type: STR
2nd line, subtype: W6756
3rd line, lot: YM DD
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the 2-digit date

1 2 3 4 5 6 7
Terminal dimensions at case surface
6P1.27 0.15 = 7.62 0.15
Terminal dimension at lead tips
View B
0.5
View A
0.5
Leadframe plating Pb-free. Device composition
includes high-temperature solder (Pb >85%),
which is exempted from the RoHS directive.
7
SANKEN ELECTRIC CO., LTD.
28103.33
Quasi-Resonant Topology
Primary Switching Regulators
STR-W6756
Because reliability can be affected adversely by improper
storage environments and handling methods, please observe
the following cautions.
Cautions for Storage
Ensure that storage conditions comply with the standard
temperature (5C to 35C) and the standard relative
humidity (around 40% to 75%); avoid storage locations
that experience extreme changes in temperature or
humidity.
Avoid locations where dust or harmful gases are present
and avoid direct sunlight.
Reinspect for rust on leads and solderability of the
products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and
other standard test periods, protect the products from
power surges from the testing device, shorts between
the product pins, and wrong connections. Ensure all test
parameters are within the ratings specified by Sanken for
the products.
Remarks About Using Silicone Grease with a Heatsink
When silicone grease is used in mounting the products on
a heatsink, it shall be applied evenly and thinly. If more
silicone grease than required is applied, it may produce
excess stress.
Volatile-type silicone greases may crack after long periods
of time, resulting in reduced heat radiation effect. Silicone
greases with low consistency (hard grease) may cause
cracks in the mold resin when screwing the products to a
heatsink.
Our recommended silicone greases for heat radiation
purposes, which will not cause any adverse effect on the
product life, are indicated below:
Type Suppliers
G746 Shin-Etsu Chemical Co., Ltd.
YG6260 Momentive Performance Materials Inc.
SC102 Dow Corning Toray Co., Ltd.
Cautions for Mounting to a Heatsink
When the flatness around the screw hole is insufficient, such
as when mounting the products to a heatsink that has an
extruded (burred) screw hole, the products can be damaged,
even with a lower than recommended screw torque. For
mounting the products, the mounting surface flatness should
be 0.05 mm or less.
Please select suitable screws for the product shape. Do not
use a flat-head machine screw because of the stress to the
products. Self-tapping screws are not recommended. When
using self-tapping screws, the screw may enter the hole
diagonally, not vertically, depending on the conditions of hole
before threading or the work situation. That may stress the
products and may cause failures.
Recommended screw torque: 0.588 to 0.785 Nm (6 to 8
kgfcm).
For tightening screws, if a tightening tool (such as a driver)
hits the products, the package may crack, and internal
stress fractures may occur, which shorten the lifetime of
the electrical elements and can cause catastrophic failure.
Tightening with an air driver makes a substantial impact.
In addition, a screw torque higher than the set torque can
be applied and the package may be damaged. Therefore, an
electric driver is recommended.
When the package is tightened at two or more places, first
pre-tighten with a lower torque at all places, then tighten
with the specified torque. When using a power driver, torque
control is mandatory.
Soldering
When soldering the products, please be sure to minimize
the working time, within the following limits:
2605C 101 s (Flow, 2 times)
38010C 3.50.5 s (Soldering iron, 1 time)
Soldering should be at a distance of at least 2.0 mm from
the body of the products.
Electrostatic Discharge
When handling the products, the operator must be
grounded. Grounded wrist straps worn should have at
least 1 M of resistance from the operator to ground to
prevent shock hazard, and it should be placed near the
operator.
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor
mats.
When using measuring equipment such as a curve tracer,
the equipment should be grounded.
When soldering the products, the head of soldering irons
or the solder bath must be grounded in order to prevent
leak voltages generated by them from being applied to the
products.
The products should always be stored and transported in
Sanken shipping containers or conductive containers, or
be wrapped in aluminum foil.
8
SANKEN ELECTRIC CO., LTD.
28103.33
Quasi-Resonant Topology
Primary Switching Regulators
STR-W6756
The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod-
ucts herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semicon-
ductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equip-
ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
Anti radioactive ray design is not considered for the products listed herein.
Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribu-
tion network.
The contents in this document must not be transcribed or copied without Sanken's written consent.