TDA8925
TDA8925
TDA8925
DATA SHEET
Philips Semiconductors
Product specication
TDA8925
TEST AND APPLICATION INFORMATION SE application Package ground connection Output power Reference design Reference design bill of material Version 2; revision 5 Printed-circuit board Curves measured in reference design PACKAGE OUTLINES SOLDERING Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS
2004 May 06
Philips Semiconductors
Product specication
TDA8925
High efficiency (> 94 %) Operating voltage from 7.5 V to 30 V Very low quiescent current High output power Diagnostic output Usable as a stereo Single-Ended (SE) amplifier Electrostatic discharge protection (pin to pin) No heatsink required. 2 APPLICATIONS
The TDA8925 is a switching power stage for a high efficiency class-D audio power amplifier system. With this power stage a compact 2 15 W self oscillating digital amplifier system can be built, operating with high efficiency and very low dissipation. No heatsink is required. The system operates over a wide supply voltage range from 7.5 V up to 30 V and consumes a very low quiescent current.
Television sets Home-sound sets Multimedia systems All mains fed audio systems. 4 QUICK REFERENCE DATA SYMBOL General VP Iq(tot) Po supply voltage total quiescent current efciency endstage no load connected; VP = 15 V Po = 15 W; RL = 8 ; VP = 15 V RL = 8 ; THD = 10 %; VP = 15 V RL = 6 ; THD = 10 %; VP = 15 V 5 ORDERING INFORMATION TYPE NUMBER TDA8925ST TDA8925J PACKAGE NAME RDBS17P DBS17P DESCRIPTION plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm) plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) VERSION SOT577-2 SOT243-3 7.5 14 15 25 94 30 45 V mA % PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
2004 May 06
Philips Semiconductors
Product specication
TDA8925
VDD2 VDD1 13 5 6 DRIVER HIGH 7 DRIVER LOW VSS1 VDD2 12 DRIVER HIGH 11 DRIVER LOW 8 10
MDB610
TDA8925
4 1 2 9 3 15 TEMPERATURE SENSOR AND current CURRENT PROTECTION temp CONTROL AND HANDSHAKE
BOOT1
OUT1
BOOT2
OUT2
VSS1 VSS2
2004 May 06
Philips Semiconductors
Product specication
TDA8925
handbook, halfpage
1 2 3 4 5 6 7 8 9
EN1 VDD1 BOOT1 OUT1 VSS1 STAB VSS2 OUT2 BOOT2 VDD2 EN2 POWERUP REL2 SW2
4 5 6 7 8 9 10 11 12 13 14 15 16 17
TDA8925ST/J
2004 May 06
Philips Semiconductors
Product specication
TDA8925
The TDA8925 is a two-channel audio power amplifier system using the class-D technology (see Fig.1). The power stage TDA8925S is used for driving the loudspeaker load. It performs a level shift from the low-power digital PWM signal, at logic levels, to a high-power PWM signal that switches between the main supply lines. A 2nd-order low-pass filter converts the PWM signal into an analog audio signal across the loudspeaker. 8.1 Power stage
Temperature and short-circuit protection sensors are included in the TDA8925. In the event that the maximum current or maximum temperature is exceeded the diagnostic output is pulled down to VSS. Since the diagnostic is connected to the enable pins in the application the system shuts down itself. 8.2.1 OVERTEMPERATURE
The power stage contains the high-power DMOS switches, the drivers, timing and handshaking between the power switches and some control logic (see Fig.1). For protection, a temperature sensor and a maximum current detector are built-in on the chip. The following functions are available: Switch (pins SW1 and SW2): digital inputs; switching from VSS to VSS + 12 V and driving the power DMOS switches Release (pins REL1 and REL2): digital outputs; switching from VSS to VSS + 12 V; follow SW1 and SW2 with a small delay. Note: for self oscillating applications this pin is not used. Power-up (pin POWERUP): must be connected to a continuous supply voltage of at least VSS + 5 V with respect to VSS Enable (pins EN1 and EN2): digital inputs; at a level of VSS the power DMOS switches are open and the PWM outputs are floating; at a level of VSS + 12 V the power stage is operational Diagnostics (pin DIAG): digital open-drain output; pulled to VSS if the temperature or maximum current is exceeded.
If the junction temperature (Tj) exceeds 150 C, then pin DIAG becomes LOW. The diagnostic pin is released if the temperature is dropped to approximately 130 C, so there is a hysteresis of approximately 20 C. 8.2.2 SHORT-CIRCUIT ACROSS THE LOUDSPEAKER
TERMINALS
When the loudspeaker terminals are short-circuited this will be detected by the current protection. If the output current exceeds the maximum output current of 3 A, then pin DIAG becomes LOW. Using pin DIAG in combination with the enable pins the system will shut down immediately, and restart again. The result is that the output current is limited at the overcurrent detection level.
2004 May 06
Philips Semiconductors
Product specication
TDA8925
UNIT V V A C C C V V V
V V V
VALUE 40 1.5
11 QUALITY SPECIFICATION In accordance with SNW-FQ611 if this device is used as an audio amplifier.
2004 May 06
Philips Semiconductors
Product specication
TDA8925
MAX. 30 45 10
UNIT
V mA mA
14.3
Switch inputs (pins SW1 and SW2) HIGH-level input voltage LOW-level input voltage 10 0 15 2 V V
Control outputs (pins REL1 and REL2) HIGH-level output voltage LOW-level output voltage 10 0 15 2 V V
Diagnostic output (pin DIAG, open-drain) LOW-level output voltage output leakage current 0 9 0 referenced to VSS VPOWERUP = 12 V 5 150 1.0 50 V A V V V A V A C C
Enable inputs (pins EN1 and EN2) HIGH-level input voltage LOW-level input voltage hysteresis voltage input current referenced to VSS referenced to VSS 15 300
Temperature protection temperature activating diagnostic VDIAG = VDIAG(LOW) hysteresis on temperature diagnostic VDIAG = VDIAG(LOW)
Current protection IO(ocpl) Note 1. Temperature sensor or maximum current sensor activated. overcurrent protection level 3.5 A
2004 May 06
Philips Semiconductors
Product specication
TDA8925
MAX.
UNIT
1. VP = 15 V; RL = 8 ; fi = 1 kHz; fosc = 310 kHz; Rs = 0.1 (series resistance of filter coil); Tamb = 25 C; measured in reference design (SE application) shown in Fig.5; unless otherwise specified. 2. Indirectly measured; based on Rds(on) measurement. 3. Total Harmonic Distortion (THD) is measured in a bandwidth of 22 Hz to 20 kHz (AES 17 brickwall filter). When distortion is measured using a low-order low-pass filter a significantly higher value will be found, due to the switching frequency outside the audio band. Measured using the typical application circuit, given in Fig.5. 4. Efficiency for power stage.
2004 May 06
Philips Semiconductors
Product specication
TDA8925
UNIT
PWM outputs (pins OUT1 and OUT2); see Fig.3 tr tf tblank tPD tW(min) Rds(on) rise time fall time blanking time propagation delay minimum pulse width on-resistance of the output transistors 30 30 70 200 220 0.2 ns ns ns ns ns
2004 May 06
10
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dbook, full pagewidth
2004 May 06
12 k
Philips Semiconductors
VDD2 13
TDA8925
EN1 4 SW1 1 REL1 2 STAB 9 DIAG 3 TEMPERATURE SENSOR AND current CURRENT PROTECTION temp CONTROL AND HANDSHAKE DRIVER HIGH
DRIVER LOW VSS1 VDD2 12 DRIVER HIGH 11 DRIVER LOW 8 VSS1 10 VSS2 VOUT2 V BOOT2 15 nF OUT2 VOUT1 V 2VP
11
12 V
POWERUP 15
V VREL1 VSTAB
V VDIAG VSW2
12 V 0
V VREL2
MDB613
Product specication
TDA8925
Philips Semiconductors
Product specication
TDA8925
For SE application the application diagram as shown in Fig.5 can be used. 15.2 Package ground connection
The heatsink of the TDA8925 is connected internally to VSS. 15.3 Output power
The output power in SE self oscillating class-D applications can be estimated using the formula 2 RL ------------------------------------------- V P R L + R ds(on) + R s P o(1%) = ----------------------------------------------------------------2 RL VP The maximum current I O(max) = ------------------------------------------should not exceed 3 A. R L + R ds(on) + R s Where: RL = load impedance Rs = series resistance of filter coil Po(1%) = output power just at clipping. The output power at THD = 10 %: Po(10%) = 1.25 Po(1%). 15.4 Reference design
The reference design for a self oscillating class-D system for the TDA8925 is shown in Fig.5. The Printed-Circuit Board (PCB) layout is shown in Figs 6, 7 and 8. The bill of materials is given in Section 15.5.1.
2004 May 06
12
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C39 R32 2.2 nF 100 R3 1 k C19 2.2 nF C20 2.2 nF R5 220 k 3 2 U2A 8 LM393 1 4 1 J3 2 C17 100 nF C15 22 F (100 V) S1 power-ON R14 15 k R25 2 k DZ1 36 V Q1 BC848 R16 C38 100 nF DZ2 3.3 V 1 k Q2 BC856 R17 5.6 k C37 220 pF VSSP C6 470 F (35 V) R12 2 k STAB (U1,9) R34 3.9 k R2 10 k
mdb614
Philips Semiconductors
L1 CON1 supply +14.5 V 1 2 3 14.5 V C1 100 nF C2 100 nF bead C3 470 F (35 V) C4 470 F (35 V) L2 bead R1 10 k VDDP R33 3.9 k R9 1 k C14 22 F (100 V) STAB (U1,9) C16 100 nF R11 2 k 22 F (100 V) C5 470 F (35 V) VSSP VDDP VDDP C28 560 pF C29 560 pF VSSP VDDP
2 J1 1
R19 5.6 VSSP C9 220 nF VDD1 VDD2 13 7 6 OUT1 BOOT1 STAB C24 1 F L3 33 H
C7
LS1 8
VSSP VDDP
C40 In1
R30 39 k VDDP
13
In2
47 nF 3.9 k
U1 9 TDA8925ST/J
12 11 BOOT2 OUT2
R8
C41
39 k
VSS2
LS2 8
R21 5.6
Product specication
TDA8925
2.2 nF 150
Philips Semiconductors
Product specication
TDA8925
R24 pin 1 C28 R1 R11 R32 C8 C45 R35 C26 R19 C36 C26 R21 R33 C31 R34 C9 R12 C25 R2 C16 C30 R31 R15 C37 R13 U2 R4 R14 Q1 R9 C22 C21 R28 R7 R17 R6 R10 C17 C41 Q2 C2 C1 R8 C40 R16 C24 V GND DD R25 IN2 C38 IN1 R30
C34
C11 R22
C35
R29
R3 C19 C50 R5
R23
OUT1 C12
OUT2 C13
22 V
Bottom silk
MDB615
Bottom copper
MDB617
2004 May 06
14
Philips Semiconductors
Product specication
TDA8925
TDA8925ST
J2 J1 C7 C6 L4 DZ1 C4 L2 C32 C33 S1 DZ2 Con3 Con2 Con1 CO2 CO1 L1 C3 C27 U1 state of D art VP typ +/- 15 V 2 x 15 W in 8 single layer demo PCB v2r4 RL 1 2003 C14 C15 J3
VDD
GND
VSS
Out1
Out2
Top silk
15.5 15.5.1
Reference design bill of material Version 2; revision 5 DESCRIPTION TDA8925ST LM393AD TYPE Philips Semiconductors, SOT577-2 National, SO8 alternatives: TI semiconductors and On semiconductors used as jumper used as jumper, optional COMMENTS
COMPONENT U1 U2
DZ1 DZ2 Q1 Q2 L1, L2 L3, L4 S1 CON1 CON2, CON3 CO1, CO2 J1, J2, J3 Capacitors C37
36 V Zener diode 3.3 V Zener diode BC848 transistor BC856 transistor bead 33 H coil power-on switch VSS, GND, VDD connector Out2, Out1 connector In1, In2 connector wire
BZX-79C36V, DO-35 BZX-79C3V3, DO-35 NPN, SOT23 PNP, SOT23 Murata BL01RN1-A62 Toko 11RHBP-330M ws PCB switch, SACME 09-03290-01 Augat 5KEV-03 Augat 5KEV-02 Cinch Farnell 152-396 Jumpers, D = 0.5 mm
220 pF/50 V
SMD0805
2004 May 06
15
Philips Semiconductors
Product specication
TDA8925
COMMENTS 50 V is OK
C1, C2, C16, C17, 100 nF/50 V C26, C38 C8, C9, C10, C11, 220 nF/50 V C34, C35 C32, C33 C24, C25 C7, C14, C15, C27 C3, C4, C5, C6 C18, C23, C36 Resistors R10, R26, R28, R29 R24 R19, R21 R22, R23 R35 R32 R9 R3, R4, R16 R11, R12 R25 R7, R8, R33, R34 R17 R1, R2, R15 R13, R14 R30, R31 R5, R6 R18, R20, R27 0 0 5.6 /0.25 W 22 /1 W 150 100 1 k 1 k 2 k 2 k 3.9 k 5.6 k 10 k 15 k 39 k 220 k these resistors have been removed 470 nF/63 V 1 F/16 V 22 F/100 V 470 F/35 V these capacitors have been removed
SMD1206 SMD0805 SMD1206 SMD2512 SMD1206 SMD1206 SMD1206 SMD0805 SMD1206 SMD0805 SMD0805 SMD0805 SMD0805 SMD0805 SMD0805 SMD0805
used as jumpers short-circuited in a new printed-circuit board layout 1206 due to dissipation 2512 due to dissipation used as jumper used as jumper used as jumper used as jumpers
15.5.2
PRINTED-CIRCUIT BOARD
The printed-circuit board dimensions are 8.636 5.842 cm; single-sided copper of 35 m; silk screen on both sides; 79 holes; 94 components (32 resistors and 41 capacitors). 2004 May 06 16
Philips Semiconductors
Product specication
TDA8925
MDB620
10
(1)
1
(1)
101
(2) (3)
101
(2)
102
102
103 102
101
10
Po (W)
102
103 10
102
103
104
fi (Hz)
105
handbook, halfpage
100 (%) 80
MDB622
handbook, halfpage
MDB619
SVRR (dB) 20
60
40
40
60
20
0 0 4 8 12 16 20 Po (W)
2 8 SE; VP = 15 V; fi = 1 kHz.
VP = 15 V; Vripple(p-p) = 2 V. (1) Both supply lines in phase. (2) One supply line (VSS) rippled. (3) One supply line (VDD) rippled. (4) Both supply lines in antiphase.
2004 May 06
17
Philips Semiconductors
Product specication
TDA8925
handbook, halfpage
100 S/N 80
MDB621
handbook, halfpage
cs
MDB623
(dB)
(dB) 20
60
40
40
60 (1)
(2)
20
80
0 102
101
10
Po (W)
102
100
10
102
103
104
fi (Hz)
105
handbook, halfpage
35 G (dB) 30
MDB624
handbook, halfpage
25
MDB625
Po (W)
21
25
17
20
13
(1)
15
(2)
10
10
102
103
104
fi (Hz)
105
5 10
12
14
16
18 VP (V)
20
2004 May 06
18
Philips Semiconductors
Product specication
TDA8925
SOT577-2
non-concave D x Dh
Eh
A2
B j E
A L e2 c Q
1 Z e e1
17 w M
bp
v M
L1
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 13.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D(1) 24.0 23.6 d 20.0 19.6 Dh 10 E(1) 12.2 11.8 e 2.54 e1 1.27 e2 2.54 Eh 6 j 3.4 3.1 L 3.75 3.15 L1 3.75 3.15 Q 2.1 1.8 v 0.6 w 0.4 x 0.03 Z (1) 2.00 1.45
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT577-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
2004 May 06
19
Philips Semiconductors
Product specication
TDA8925
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm)
SOT243-3
non-concave x Dh
D Eh
A2
B j E A
L3 L Q 1 Z e e1 w M 17 m e2 c v M
bp
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-3 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION A 17.0 15.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 e1 e2 Eh 6 j 3.4 3.1 L 8.4 7.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.6 w 0.25 x 0.03 Z (1) 2.00 1.45
1.27 5.08
2004 May 06
20
Philips Semiconductors
Product specication
TDA8925
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 17.3 Manual soldering
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 17.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. 17.4
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING WAVE suitable(1) not suitable
suitable
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. For PMFP packages hot bar soldering or manual soldering is suitable.
2004 May 06
21
Philips Semiconductors
Product specication
TDA8925
This data sheet contains data from the objective specication for product development. Philips Semiconductors reserves the right to change the specication in any manner without notice. This data sheet contains data from the preliminary specication. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specication without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specication. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN).
II
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 20 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2004 May 06
22
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofces addresses send e-mail to: [email protected].
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
R30/02/pp23
May 06