256 Kbit (32Kb X 8) UV EPROM and OTP EPROM: Description
256 Kbit (32Kb X 8) UV EPROM and OTP EPROM: Description
256 Kbit (32Kb X 8) UV EPROM and OTP EPROM: Description
■ ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Device Code: 8Dh
DESCRIPTION
The M27C256B is a 256 Kbit EPROM offered in PLCC32 (C) TSOP28 (N)
the two ranges UV (ultra violet erase) and OTP 8 x 13.4 mm
(one time programmable). It is ideally suited for mi-
croprocessor systems and is organized as 32,768
by 8 bits.
Figure 1. Logic Diagram
The FDIP28W (window ceramic frit-seal package)
has a transparent lid which allows the user to ex-
pose the chip to ultraviolet light to erase the bit pat-
tern. A new pattern can then be written to the
device by following the programming procedure.
VCC VPP
For applications where the content is programmed
only one time and erasure is not required, the
M27C256B is offered in PDIP28, PLCC32 and
15 8
TSOP28 (8 x 13.4 mm) packages.
A0-A14 Q0-Q7
E M27C256B
VSS
AI00755B
VCC
VPP
A12
A14
A13
VPP 1 28 VCC
DU
A7
A12 2 27 A14
A7 3 26 A13 1 32
A6 4 25 A8 A6 A8
A5 5 24 A9 A5 A9
6 23 A11 A4 A11
A4
A3 7 22 G A3 NC
M27C256B A2 9 M27C256B 25 G
A2 8 21 A10
9 20 E A1 A10
A1
A0 10 19 Q7 A0 E
Q0 11 18 Q6 NC Q7
Q1 12 17 Q5 Q0 Q6
17
Q2 13 16 Q4
Q1
Q2
VSS
DU
Q3
Q4
Q5
VSS 14 15 Q3
AI00756
AI00757
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M27C256B
3/16
M27C256B
1.3V
High Speed
3V 1N914
1.5V
0V 3.3kΩ
DEVICE
Standard UNDER OUT
TEST
2.4V CL
2.0V
0.8V
0.4V
CL = 30pF for High Speed
AI01822
CL = 100pF for Standard
CL includes JIG capacitance AI01823B
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M27C256B
Address Transition to
tAXQX tOH E = VIL, G = VIL 0 0 0 0 ns
Output Transition
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Sampled only, not 100% tested.
3. Speed obtained with High Speed AC measurement conditions.
Two Line Output Control For the most efficient use of these two control
Because EPROMs are usually used in larger lines, E should be decoded and used as the prima-
memory arrays, this product features a 2 line con- ry device selecting function, while G should be
trol function which accommodates the use of mul- made a common connection to all devices in the
tiple memory connection. The two line control array and connected to the READ line from the
function allows: system control bus. This ensures that all deselect-
ed memory devices are in their low power standby
a. the lowest possible memory power dissipation,
mode and that the output pins are only active
b. complete assurance that output bus contention when data is desired from a particular memory de-
will not occur. vice.
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M27C256B
Address Transition to
tAXQX tOH E = VIL, G = VIL 0 0 0 0 ns
Output Transition
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Sampled only, not 100% tested.
tAVQV tAXQX
tEHQZ
tGLQV
tELQV tGHQZ
Hi-Z
Q0-Q7
AI00758B
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M27C256B
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M27C256B
A0-A14 VALID
tAVEL
tQVEL tEHQX
VPP
VCC
tVCHEL tGHAX
tELEH tQXGL
PROGRAM VERIFY
AI00759
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M27C256B
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M27C256B
Device Type
M27
Supply Voltage
C = 5V
Device Function
256B = 256 Kbit (32Kb x 8)
Speed
-45 (1) = 45 ns
-60 = 60 ns
-70 = 70 ns
-80 = 80 ns
-90 = 90 ns
-10 = 100 ns
-12 = 120 ns
-15 = 150 ns
-20 = 200 ns
-25 = 250 ns
VCC Tolerance
blank = ± 10%
X = ± 5%
Package
F = FDIP28W
B = PDIP28
C = PLCC32
N = TSOP28: 8 x 13.4 mm
Temperature Range
1 = 0 to 70 °C
3 = –40 to 125 °C
6 = –40 to 85 °C
Options
X = Additional Burn-in
TR = Tape & Reel Packing
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-
vice, please contact the STMicroelectronics Sales Office nearest to you.
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M27C256B
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M27C256B
Table 13. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Mechanical Data
millimeters inches
Symbol
Typ Min Max Typ Min Max
A 5.72 0.225
A1 0.51 1.40 0.020 0.055
A2 3.91 4.57 0.154 0.180
A3 3.89 4.50 0.153 0.177
B 0.41 0.56 0.016 0.022
B1 1.45 – – 0.057 – –
C 0.23 0.30 0.009 0.012
D 36.50 37.34 1.437 1.470
D2 33.02 – – 1.300 – –
E 15.24 – – 0.600 – –
E1 13.06 13.36 0.514 0.526
e 2.54 – – 0.100 – –
eA 14.99 – – 0.590 – –
eB 16.18 18.03 0.637 0.710
L 3.18 4.10 0.125 0.161
S 1.52 2.49 0.060 0.098
∅ 7.11 – – 0.280 – –
α 4° 11° 4° 11°
N 28 28
Figure 8. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Outline
A2 A3 A
A1 L α
B1 B e C
eA
D2
eB
D
S
N
∅ E1 E
1
FDIPW-a
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M27C256B
Table 14. PDIP28 - 28 pin Plastic DIP, 600 mils width, Package Mechanical Data
millimeters inches
Symbol
Typ Min Max Typ Min Max
A 4.445 0.1750
A1 0.630 0.0248
A2 3.810 3.050 4.570 0.1500 0.1201 0.1799
B 0.450 0.0177
B1 1.270 0.0500
C 0.230 0.310 0.0091 0.0122
D 36.830 36.580 37.080 1.4500 1.4402 1.4598
D2 33.020 – – 1.3000 – –
E 15.240 0.6000
E1 13.720 12.700 14.480 0.5402 0.5000 0.5701
e1 2.540 – – 0.1000 – –
eA 15.000 14.800 15.200 0.5906 0.5827 0.5984
eB 15.200 16.680 0.5984 0.6567
L 3.300 0.1299
S 1.78 2.08 0.070 0.082
α 0° 10° 0° 10°
N 28 28
Figure 9. PDIP28 - 28 pin Plastic DIP, 600 mils width, Package Outline
A2 A
A1 L α
B1 B e1 C
eA
D2 eB
D
S
N
E1 E
1
PDIP
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M27C256B
Table 15. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Mechanical Data
millimeters inches
Symbol
Typ Min Max Typ Min Max
A 3.18 3.56 0.125 0.140
A1 1.53 2.41 0.060 0.095
A2 0.38 – 0.015 –
B 0.33 0.53 0.013 0.021
B1 0.66 0.81 0.026 0.032
CP 0.10 0.004
D 12.32 12.57 0.485 0.495
D1 11.35 11.51 0.447 0.453
D2 4.78 5.66 0.188 0.223
D3 7.62 – – 0.300 – –
E 14.86 15.11 0.585 0.595
E1 13.89 14.05 0.547 0.553
E2 6.05 6.93 0.238 0.273
E3 10.16 – – 0.400 – –
e 1.27 – – 0.050 – –
F 0.00 0.13 0.000 0.005
R 0.89 – – 0.035 – –
N 32 32
Figure 10. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline
D A1
D1 A2
1 N
B1
E2
e
E3 E1 E F
B
0.51 (.020) E2
1.14 (.045)
D3 A
R CP
D2 D2
PLCC-A
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M27C256B
Table 16. TSOP28 - 28 lead Plastic Thin Small Outline, 8 x 13.4 mm, Package Mechanical Data
millimeters inches
Symbol Typ Min Max Typ Min Max
A 1.250 0.0492
A1 0.200 0.0079
A2 0.950 1.150 0.0374 0.0453
B 0.170 0.270 0.0067 0.0106
C 0.100 0.210 0.0039 0.0083
CP 0.100 0.0039
D 13.200 13.600 0.5197 0.5354
D1 11.700 11.900 0.4606 0.4685
e 0.550 – – 0.0217 – –
E 7.900 8.100 0.3110 0.3189
L 0.500 0.700 0.0197 0.0276
α 0° 5° 0° 5°
N 28 28
Figure 11. TSOP28 - 28 lead Plastic Thin Small Outline, 8 x 13.4 mm, Package Outline
A2
1 N
e
B
N/2
D1 A
D CP
DIE
TSOP-a A1 α L
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M27C256B
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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