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    Filament Evaporation 2. Flash Evaporation 3. Electron-Beam Evaporation 4. Sputtering Filament Evaporation

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    Muhammad Osama
    This document discusses the metallization process used in integrated circuit fabrication. A conducting metal such as aluminum is deposited onto the entire wafer surface through vacuum deposition methods like filament evaporation. This connects the individual circuit pathways and allows the chip to function properly. Aluminum is commonly used because it adheres well to silicon and silicon dioxide and has high conductivity. Alloys with copper or silicon are also used to improve performance. After patterning the final metal layer, a passivation layer is deposited to protect the circuit from damage.

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    Filament Evaporation 2. Flash Evaporation 3. Electron-Beam Evaporation 4. Sputtering Filament Evaporation

    Uploaded by

    Muhammad Osama
    17 views2 pages
    This document discusses the metallization process used in integrated circuit fabrication. A conducting metal such as aluminum is deposited onto the entire wafer surface through vacuum deposition methods like filament evaporation. This connects the individual circuit pathways and allows the chip to function properly. Aluminum is commonly used because it adheres well to silicon and silicon dioxide and has high conductivity. Alloys with copper or silicon are also used to improve performance. After patterning the final metal layer, a passivation layer is deposited to protect the circuit from damage.

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    speech for fyp 2

    Original Title

    MetallIzation

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    This document discusses the metallization process used in integrated circuit fabrication. A conducting metal such as aluminum is deposited onto the entire wafer surface through vacuum deposition methods like filament evaporation. This connects the individual circuit pathways and allows the chip to function properly. Aluminum is commonly used because it adheres well to silicon and silicon dioxide and has high conductivity. Alloys with copper or silicon are also used to improve performance. After patterning the final metal layer, a passivation layer is deposited to protect the circuit from damage.

    Copyright:

    © All Rights Reserved
    Download as DOCX, PDF, TXT or read online from Scribd
    Download as docx, pdf, or txt
    17 views2 pages

    Filament Evaporation 2. Flash Evaporation 3. Electron-Beam Evaporation 4. Sputtering Filament Evaporation

    Uploaded by

    Muhammad Osama
    This document discusses the metallization process used in integrated circuit fabrication. A conducting metal such as aluminum is deposited onto the entire wafer surface through vacuum deposition methods like filament evaporation. This connects the individual circuit pathways and allows the chip to function properly. Aluminum is commonly used because it adheres well to silicon and silicon dioxide and has high conductivity. Alloys with copper or silicon are also used to improve performance. After patterning the final metal layer, a passivation layer is deposited to protect the circuit from damage.

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    Download as docx, pdf, or txt
    of 2

    Metallization is the fabrication step in which proper interconnection of circuit

    elements is made.
    A conducting metal, such as aluminum, is deposited on the entire surface of a
    wafer.
    This step connects the individual horizontal and vertical conductive pathways
    on the chip, allowing it to function properly.
    to make ohmic contact to the devices
    connect these to the bonding pads on the chip's edge
    Aluminum is a popular metal used to interconnect ICs
    why Aluminum?
    adheres well to both silicon and silicon dioxide
    can be easily vacuum deposited (since it has a low boiling point)
    has high conductivity.
    Alloys of aluminum used for performance-related reasons
    Cu to reduce electromigration effects
    Si to reduce formation of metal "spikes"
    Metal layers are vacuum-deposited
    following methods:
    1. Filament Evaporation
    2. Flash Evaporation
    3. Electron-beam Evaporation
    4. Sputtering

    onto

    wafers

    by

    one

    of

    the

    Filament Evaporation
    Gradually heating a filament (any form) of the metal to be evaporated.
    1. The metal is placed in a basket.
    2. Electrodes are connected to either side of the basket and a high current
    passed through it, causing the basket to heat.
    3. As power (and therefore heat) is increased, the metallic filament partially
    melts and is eventually vaporized.
    4. In this way, atoms of aluminum break free from the filament and deposit
    onto the wafers

    Problems of contamination but simplest

    Passivation
    After the last metal layer is patterned, a final dielectric layer (passivation) is
    deposited to protect the circuit from damage and contamination.
    Openings are etched in this film to allow access to the top layer of metal by
    electrical probes and wire bonds.

    The very next step is


    Characterization is done to determine various properties, such as:
    Resistance (up to micro and Nano level)
    Resistivity is important for devices because it contributes to:
    Device series resistance
    Capacitance
    Threshold voltage
    Other parameters
    Mobility
    I-V Curve

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