DIFFUSION OF CURRENT INTO CONDUCTORS
J.Edwards* and T.K Saha**
* Research Concentration in Electrical Energy
Queensland University of Technology
** Department of Computer Science and Electrical Engineering
University of Queensland.
Currents are established on the surface of conductors by the propagation of electromagnetic waves
in the insulating material between them. If the load is less than the characteristic impedance of the
insulating material of the line, multiple reflections and retransmissions eventually build up the line
current to that required by the load. The currents are initially established on the surface of the
conductors before diffusing relatively slowly into the interior and gives rise to the skin effect. The
diffusion velocity depends the conductivity, permeability, thickness of the conductor, and the
frequency of the excitation, and such effects of the diffusion process are difficult to conceptually
appreciate. Fortunately, the diffusion of heat into solids is very similar, and will be used as an
analogy to aid understanding. This diffusion is the means whereby current moves into conductors
and flux into of magnetic cores.
(transmission line) to the load as displacement currents
1. INTRODUCTION
in the insulation, at velocities approaching c. The
displacement current builds up the line current on the
Current flow in conductors is often associated with
surface of the conducting cables by multiple
liquid flow in pipes, at least conceptually. The ‘liquid’
reflections, and this current diffuses into the interior of
being the sea of free electrons, in the conduction band the conductor [1]. Thus current changes (electron
of the material, that drift along the conductor with a
accelerations) actually move into the conductors from
velocity that is proportional to the electric field and
the outside surfaces and only have to diffuse through
gives rise to the current, J = σE. This liquid flow
the thickness of the conductors (half the diameter)
analogy is quite reasonable for steady dc currents,
rather than along the whole length of the cable from
giving a conceptual understanding of Ohms law. the power source to the load. If it were not for the
However, while good conductors such as copper displacement current setting up the surface currents in
present little opposition to electrons moving at the first instance, energy transmission, (other than via
constant velocity, they strongly oppose electron relatively steady dc currents) via copper conductors
accelerations, because the relatively large currents
would be virtually impossible because of the long
(J=σE) produce magnetic fields that are much higher
diffusion times and attenuations.
than those produced by displacement currents in free
space. These high magnetic fields move at relatively
The skin effect results from the fact that at the
low velocities since the back emfs induced by their
particular frequency of operation the surface currents
motion cannot be any larger than the driving E field.
only have time to diffuse into the conductor to the skin
These induced emfs generate eddy currents within the
depth in the ¼ period of the supply frequency. Surface
conductor, which also oppose the diffusion due to
currents move into the conductor on the rising part of
associated energy losses. These limited back emfs and the current waveform. Once the surface currents peak
eddy currents cause any changes in the surface and start to fall, the interior currents move back out
electric field (current) to move very slowly into the
towards the surface of the conductor. At 50Hz the skin
interior of conductors and suffer significant.
depth in copper is approx 10mm.
The relatively slow velocity of penetration depends on
the conductivity, and permeability of the material. The
higher the conductivity, permeability, and size of the
conductor, the slower is diffusion velocity. For a very
large copper conductor the penetration velocity at a
frequency 50Hz is approximately 8 m/s. This relatively
low velocity is not very apparent in every day
applications because the currents needed to energise
electrical loads initially propagate along the cable
The same diffusion process also applies to surface
magnetic flux moving into the interior of magnetic
cores, since most cores are electrically conductive.
Surface flux changes produce a driving H field (∆Hs =
∆Bs/µ) that drives any change in surface flux into
interior of the core. The changing flux levels induce
back emfs as they move into the core, with resulting
eddy currents, whose H fields oppose the driving H
field. These induced H fields, due to changing surface
flux levels moving into the interior of the core cannot
be any greater than the driving H field at any point in
the conductor and this is the fundamental reason for
the low diffusion velocity. Eddy current losses also
attenuate the fields and further reduce the diffusion
velocity. The phase velocity for transformer steels at a
50Hz ≈ 110mm/sec resulting in a skin depth of ≈ 0.5mm,
and is the reason for laminating the core.
The velocity at which a wave penetrates into a
conductive material also depends upon the thickness
of the conductor and frequency of the excitation.
These are difficult to appreciate but fortunately the
diffusion of heat into solids is similar, and will be used
to conceptually understand this diffusion.
2.0 CURRENT DIFFUSION
The high conductivity of good conductors, such as
copper, provide a good medium for electrons to move
at constant velocity (steady dc currents) but opposes
electron acceleration. Accelerating electrons produce
changing magnetic fields with resulting back emfs that
oppose the acceleration. The currents in conductors
(per unit of E) are very much larger than displacement
currents in free space (377 ohms), as also are the
resulting changes in internal magnetic flux levels as
any surface changes in E move into the interior.
Changes in surface current produce the surface electric
field (∆Es= ∆Js/σ) that drives the current changes into
the interior. As these surface current changes move
into the interior, back emfs are induced that can be no
bigger than the driving E field. The high magnetic
fields associated with the high current levels (due to
low conductivity) is the fundamental reason why
electric fields move very slowly into the interior of a
conductor compared with free space. The velocities of
these fields in free space is also limited by back emfs
but in this case the much smaller magnetic fields have
to move at velocity c. These induced emfs, due to the
accelerating electrons, also create eddy currents in the
material that absorb energy and further reduce the
diffusion velocity due to associated losses that reduce
the effective driving E field. These eddy current losses
cause any changing electro-magnetic fields to be
greatly attenuated as they go into the interior of a
conductors.
2.1 Propagation in Conducting Materials
At any point inside the conductor
electromagnetic equations are relevant.
Conduction Current, J = σE
Flux Density, B = µH
following
.......(1a)
...... (1b)
Current Density, i = J + Displacement Current
∂D
∂E
= σE + ε o ε r
∂t
∂t
∂D
∂E
Curl H = i = σE +
= σE + ε o ε r
....... (1c)
∂t
∂t
∂E
For sinusoidal excitation,
= jω E , so
∂t
Displacement Current = jωεoεrE
& Curl H = ( σ + jωεo εr ) E
The displacement current (jωεoεrE) rises with frequency
and for copper equals the conduction current (σE)
when ω = σ/ε ≈ 1019. Thus displacement currents can
be neglected in comparison to the conduction current
at normal frequencies so:
Curl H = σ E .
If they could occur, any net like charges inside a
conductor would repel each other, and quickly move to
the surface with a time constant, τ = εo/σ ≈ 10-19, for
copper. Thus at normal frequencies there is virtually
no charge build up inside the conductor, and the
electric field inside a conductor can be considered to
be divergence free (Div E = 0).
i = σE +
Thus at any point inside a conductor:
Div E = ∇.E = 0
& Curl H ≈ J = σE
...... (2a)
...... (2b)
∂B
∂H
= −µ
.…. (2c)
∂t
∂t
= − jωB = − jωµH , for sinusoids
& ∇. H = ∇ .B = 0
...... (2d)
Now,
Curl E = −
2.2 Electromagnetic Diffusion in Conductors
Taking the Curl of both sides of (2b) we get
Curl Curl H = σ Curl E
Substituting (2c) we get:
Curl Curl H = −σµ
Now, B = µ H so:
∂H
∂t
….. (3a)
∂B
...... (3b)
∂t
Similarly, taking the Curl of (2c) gives
∂Curl B
∂Curl H
Curl Curl E = −
= −µ
∂t
∂t
Substituting Curl H =σ E gives:
∂J
∂E
Curl Curl E = − µ
= −σµ
….. (3c)
∂t
∂t
Now J = σ E so:
∂J
Curl Curl J = −σµ
...... (3d)
∂t
These 4 equations are basically the same, so (3d) can
represent them all on the understanding that J can be
replaced by E, H, or B.
Curl Curl B = −σµ
Magnetic Diffusion Equation
Applying the vector identity
Curl Curl J = Grad Div J − ∇2 J
= − ∇2 J
, since Div J = 0
to (4d) gives the Magnetic Diffusion Equation
∂J
∂J
1 2
∇ 2 J = σµ
, or
=
∇ J
...... (4a)
∂t
∂t σµ
where, J can be replaced by E,H, or B.
1
Magnetic Diffusivity, α =
….. (4b)
σµ
The diffusivity α, and hence the penetration speed,
decreases with increase in the conductivity and
permeability of the material.
For copper,
σ = 5.8x107, µ = 4π x10-7, α = 13.7x10-3 m2/sec
For transformer steels,
σ = 2x106, µ = 104 x 4π x10-7, α = 0.04x10-3 m2/sec
2. HEAT CONDUCTIVITY
Heat flow in solids will now be considered to gain a
conceptual understanding of this diffusion.
2.1 Thermal Conductivity
Heat flows in a material from regions of high
temperature to ones at lower temperature, the driving
force being the temperature gradient.
T1
(hot)
Q
T2 (cold)
Fig 1: Steady-State Heat Flow
Fourier’s Law
Heat Flux, Q = − k ∇T
(W/m2 )
where, k = Thermal conductivity, ( W/m oC )
≈ 388 W/m oC ,
for copper
≈ 62 W/m oC ,
for iron
The thermal conductance of the material = kA/L, similar
to G = σA/L for electrical conductance.
In the steady state, if there are no heat sources or
sinks inside the material, the temperature gradient
throughout the material is constant. The heat leaving
the cooler surface is equal to that flowing through the
material from the hot surface and ∇ . Q = 0 .
2.2 Thermal Diffusion
Considering a small internal elemental volume of the
material, the heat flow rate equation is given by [2]:
Heat Flow In – Heat Flow Out
= Change in Internal Energy – Heat Generated
∂ ∂T ∂ ∂T ∂ ∂T
∂T dq
−
k
+ k
+ k
= cρ
∂x ∂x ∂x ∂x ∂x ∂x
∂t
dt
where, c = specific Heat ( J/kg oC )
ρ = density ( kg/m3 )
∂T dq
Thus
k ∇ 2 T = cρ
−
∂t
dt
c
ρ
∂
T
1 dq
∇2 T =
−
k ∂t
k dt
∴
2.2.1 Steady State Conditions
In the steady state the rate of change of internal
energy is zero.
If internal energy sources exist then
1 dq
∇2 T = −
..... Poison’s Equation
k dt
If there are no internal sources then
∇2 T = 0
..... Laplace’s Equation
2.2.2 Unsteady (Changing) Conditions
If there are no internal sources and constant, steady
state conditions have not yet been achieved then:
Net Rate of Heat Flow into an element
= Rate of increase in internal energy
Thermal Diffusion (Fourier Equation)
∂T
k∇ 2 T = cρ
∂t
c
ρ
∂
T
∂
T
∇2 T =
, or
= α∇ 2 T
….(5)
k ∂t
∂t
k
Thermal Conductivity
Therm Diffusivity, α =
=
cρ Thermal Capacitance
≈ 114 x 10-6 m2/sec, for copper
≈ 18 x 10-6 m2/sec, for iron
The material absorbs energy as its temperature rises
and so acts like a capacitance, C = cρ. Any heat
stored in the material has to flow via the conductance
k, so the thermal conductivity aids diffusion while c
and ρ oppose it. Thermal diffusivity is a measure of the
ability of a material to propagate energy compared with
its energy storage requirements. Heat flow can be
modelled with a distributed RC electrical circuit.
The rate of heat flow is directly proportional to the
temperature gradient, and this gradient is the driving
force for the diffusive flow of heat.
T1
T1
T1
B
C
A
T2
(a) ∇ > 0
2
T2
(b) ∇ = 0
2
T2
(c) ∇ < 0
2
Fig2: Unsteady & Steady Heat Flows
In Fig2(a) the heat flowing into point A exceeds that
flowing out so the temperature of point A rises. In
Fig2(b) the heat flowing into point B is equal to that
flowing out so the temperature of B is constant. In
Fig2(c) the heat flowing out of point C exceeds that
flowing in, so the temperature of point C will fall.
3. COMPARISON OF DIFFUSIONS
Thermal Diffusion
At any point in the material
∂T
k
= α ∇ 2T
, where α =
∂t
cρ
In this case T is a scalar so:
∇ 2 T = div of grad T = ∇. ∇T
∂2
∂2
∂ 2
=
+
+
T
∂x 2 ∂y 2 ∂z 2
For one-dimensional diffusion in the x direction:
∂T
∂ 2T
=a
.… (6a)
∂t
∂x 2
Magnetic Diffusion (F = J, E, H, B, or T )
∂F
1
= a∇2F
, where α =
∂t
σµ
Since F is a vector
∇ 2 F = grad of div F - Curl of Curl F
In rectangular co-ordinates this is equal to the vector
sum of the Laplacian operation on the 3 scalar
components of F.
∂2
∂2
∂ 2
∇2F =
+
+
(F a + F y a y + F z a z )
∂x 2 ∂y 2 ∂z 2 x x
For one dimensional diffusion in the x direction let:
∂F y ∂Fy
F = Fy a y , and
=
=0
∂y
∂z
∴∇ F=
2
∴
∂ 2Fy
∂x 2
∂F y
a y , so
=a
∂F y
∂t
ay =a
∂ 2Fy
∂x 2
ay
∂ 2 Fy
…. (6b)
∂t
∂x 2
Although the thermal (6a) and magnetic diffusion
equations (6b), operate on scalar and vector fields
respectively they are essentially the same. In each case
the diffusive flow of the entity is due to the spatial
concentration gradient of the entity itself.
Heat diffusion is opposed by the heat capacitance (cρ)
of the material, and aided by thermal conductivity.
However, in the case of magnetic diffusion both the
electrical conductivity and permeability oppose the
diffusion.
Material
Diffusivity, α (m2/sec)
Thermal
Magnetic
Copper
1.14 x 10-4
137 x 10-4
Transformer Steel
0.18 x 10-4
0.4 x 10-4
The thermal and electrical diffusivities of transformer
steels are similar to each other and give an
appreciation of the slow diffusion rates of surface flux
into magnetic cores laminations. The electrical
diffusivity of copper is approx 100 times its thermal.
Since diffusion velocities are proportional to the √α,
electric fields (and hence surface currents) will diffuse
into copper approx 10 times faster than heat.
These comparisons with heat give some appreciation
of the impossible situation that would exist if currents
had to diffuse longitudinally through the length of
copper conductors instead of transversely across half
their thickness. It is very fortunate that surface
currents are initially established along the length of
conductors at velocities around c, by means of the
displacement currents that flow in the insulating
medium.
4. EXAMPLES OF DIFFUSION
Irrespective of whether we consider electromagnetic or
thermal diffusion the situation is described by
applying the relevant boundary conditions to the
generalised diffusion equation:
∂F
∂2F
=a
∂t
∂x 2
, where F = J, E, B, H or T.
4.1 Semi-Infinite Slab
This is the simplest case for examining diffusion, since
there is only one boundary. Although we could use J,
E, B, H or T, we will use temperature (T) since it gives a
conceptual understanding of this diffusion.
Consider a semi-infinite block, initially at 0oC, whose
exposed surface temperature is suddenly raised to a
constant T s of 100oC, as indicated in Fig 3.
Ts
0
x
Initial Condition
T (x,0) = 0
Boundary Conditions
At surface
T(0,t) = Ts
Deep into Block
T(∞ ,t) = 0
Fig 3: Step Temp at Surface of Semi-Infinite Block
As the temperature of the exposed surface rises, a
temperature gradient is produced which will drive heat
into the material. At any point in the block the rate of
temperature rise must satisfy the diffusion equation.
∂T ( x, t )
∂ 2 T ( x, t )
= α ∇ 2 T ( x, t ) = α
, for 0 < x < ∞
∂t
∂x 2
Taking the Laplace Transform and inserting the
boundary conditions gives.
T ( x, s ) =
Ts − x
e
s
s
x
⇒ T ( x, t) = Ts erfc
4a t
a
where, erfc ( x) = 1 − erf ( x) = 1 −
2
∞
Consider a plate of thickness L, whose exposed
surface temperature is raised as shown below.
− y2
∫ e .dy
p x
The temperature at an internal surface, distance x into
the block at time t, is given by.
x
T ( x, t) = Ts erfc
…. (8a)
4a t
where, Ts = 100oC, α = 1.14x10-4
Temperatures in the copper block are as follows.
TEMPERATURE DIFFUSION INTO COPPER BLOCK (Semi-Infinite)
100
Diffusivity = 0.000114
90
80
5 Secs
Temperature
70
60
1 Sec
50
40
Ts
0
0
Fig 4: Step Temp at Surface of Insulated Plate
In this case the temperature gradient at the insulated
face is always zero since there is no heat flow out of
this surface. Using (8a), and a series of images to
satisfy the boundary conditions gives:
∞
x
2 nL + x
+ T s ∑ (− 1) n erfc
T ( x, t ) = Ts erfc
n =1
4a t
4 at
∞
2nL − x
− ∑ ( −1) n erfc
….(8b)
n=1
4at
Heat diffusion into a copper plate 20mm thick is as
shown below.
200 mSecs
30
TEMPERATURE DIFFUSION INTO 20mm COPPER PLATE (insulated at far face)
100
50 mSecs
20
80
Diffusivity = 0.000114
2
4
6
8
10
12
Distance (mm)
14
16
18
70
20
Temperature and electromagnetic diffusions into
copper & steel blocks after 50msecs are shown below.
Temperature
0
It can be seen that the temperature diffuses fairly
slowly into the block. After 5 secs the temperature at
20mm is only 55% because material beyond 20mm still
requires heat, and acts like a heat sink.
100
50
40
200 mSecs
30
50 mSecs
20
10 mSecs
10
0
2
4
6
8
10
12
Distance (cm)
14
16
18
20
The temperature diffuses faster into plates since there
is no heat sinking beyond the plate thickness. The end
surface of the plate at 20mm rises to 96% after 5 secs.
This helps to appreciate how current & flux diffusion
velocities reduce with material thickness, although in
these cases it is due to reductions in eddy currents.
DISTRIBUTIONS AFTER 50 mSECS
90
J,E (Copper), Diff = 0.0137
80
1 Sec
60
0
DIFFUSSION INTO LARGE BLOCKS (Semi-infinite)
Entity, F = (E, J, H, B) or T
5 Secs
90
10 mSecs
10
0
Insulation Initial Condition
T (x,0) = 0
Boundary Conditions
At exposed surface
T(0,t) = Ts
At insulated surface
x
∇ T(L,t) = 0
L
70
60
Temp (Copper), Diff = 0.000114
50
40
B,H (Trans Steel), Diff = 0.00004
30
20
Temp (Iron), Diff = 0.000018
10
0
0
2
4
6
8
10
12
Distance (mm)
14
16
18
20
It can be seen that that electrical diffusion rates for
copper are approx 10 times the thermal ones.
4.2 Semi-Infinite Plate (insulated at far surface)
4.3 Surface Current Diffusion into Copper Plate
In this case surface current changes diffuse into the
copper from both sides of the plate. No diffusion flows
cross the centre line, that in terms of the analogous
heat flow can be considered a perfectly insulating
surface. With this refinement Eq (8b) can be used to
graph current diffusions into copper plate copper plate
20mm thick as follows.
CURRENT DIFFUSION INTO 20mm COPPER PLATE (Diffusivity = 0.0137)
100
10 mSec
90
80
5 mSecs
70
Current
60
50
40
2 mSecs
30
20
1 mSec
10
0.01 mSec
0.05 mSec
0
0
2
4
6
8
10
12
Distance (mm)
14
16
18
20
Centre line currents (at 10mm depth) reach approx 75%
of the surface currents after 5msecs.
4.3 Surface Flux Diffusion into Laminations
The case for surface flux diffusion into a transformer
steel lamination 1mm thick is indicated below.
FLUX DIFFUSION INTO 1mm STEEL LAMINATION (Diffusivity = 0.00004)
10 mSec
80
Magnetic Flux
60
2 mSecs
40
30
1 mSec
10
0
0
0.01 mSec
0.1
0.2
0.3
0.05 mSec
0.4
0.5
0.6
Distance (mm)
0.7
0.8
0.9
1
In this case centre line flux levels (at 0.5mm depth)
reach approx 85% of the surface flux after 5msecs.
4.5 Sinusoidal Excitations at Surface of Block
Consider the flow of sinusoid surface temperatures
into a semi-infinite block as indicated below.
+Ts
+ +
In Out
0
−
x
δ Sin (ωt
−
−x )
δ
x
δ Sin( ωt
−x −π )
δ
4
…. (9a)
…. (9b)
2α
…. (9c)
ω
& Phase Velocity, u = ωδ
…. (9d)
The amplitude of these wave is attenuated by 1/e =
0.37 in one radian length, δ, of the propagating wave.
The magnetic field H in conductors lags the electric
field E by 450 due to the magnetic fields resulting from
conduction rather than displacement currents losses. E
& H fields in non-conductive materials are in phase .
70
20
E = Ese
where, Skin Depth , δ =
5 mSecs
50
Magnetic Diffusion with Sinusoids.
Whether it is surface current or flux that diffuses into a
conductive material, both E & H fields are produced
whose amplitudes decrease as they go further in [3].
H = H se
100
90
through the surface of the block for the first 90o of the
waveform and back out for the next 90o. Similarly
negative heat flows in and out of the block during the
negative half cycle of the surface temperature. The
lower the frequency the greater is the time for the heat
to penetrate into the material before it moves back out.
Thus the penetration depth reduces with increase in
frequency. The rate of change of surface temperature
increases with frequency and so do the spatial
temperature gradients in the material. As gradients are
the driving force for this diffusive flow, the diffusion
velocity in the material increases with excitation
frequency.
- In Out
x
-Ts
0
Fig 5: Sinusoidal Temp at Surface of Large Block
The diffusive flows depend upon the spatial gradient
of the temperature. Heat flows into the block as the
surface temperature rises and out of the block when
the surface temperature falls. Positive heat flows in
Diffusion Type
Copper –Elect
Copper -Therm
TraSteel-Mag
TraSteel -Therm
Diffus α
137x10-4
1.14x10-4
0.40x10-4
0.18x10-4
SkDepth δ
9.34 mm
0.85mm
0.51mm
0.34mm
Ph Vel u
2.93m/s
0.27m/s
0.16m/s
0.11m/s
5. CONCLUSIONS
Liquid flow in pipes gives a good realistic analogy
only for constant dc current flows in conductors since
good conductors are a hostile medium for electrons to
accelerate in. All changes have to diffuse in and out of
conductors through their longitudinal surfaces, and a
good analogy for this is heat flow in solids.
References
[1] J.Edwards,T.K.Saha,”Establishment of Current in
Electrical Cables via Electromagnetic Energies & the
Poyting Vector”, AUPEC’98 ,Vol2 385-388, Sept 98.
[2] F.Kreith,”Principles of Heat Transfer”, 1973.
[3] P.Lorrain, D.Corson,”Electromagnetic Fields and
Waves”,2nd ed, pp 471-481, Freeman, 1970.