[Proceedings] APEC '92 Seventh Annual Applied Power Electronics Conference and Exposition
... Lo + sin(a)[ I - cos( - wi,,Jt))]} '6 Although the above equations are derived for a thr... more ... Lo + sin(a)[ I - cos( - wi,,Jt))]} '6 Although the above equations are derived for a three-phase, uncoupled VR motor, the same procedure can be applied to other VR motors with more phases and different commutation methods. IV. ... __._____ x, = x2 i2 =---- sin( - wic,,Jt)), . . ...
High-Speed Imaging and Sequence Analysis III, 2001
IBM Research has developed a time resolved imaging technique, Picosecond Imaging Circuit Analysis... more IBM Research has developed a time resolved imaging technique, Picosecond Imaging Circuit Analysis (PICA), which uses single photon events to analyze signals in modern microprocessors on a picosecond time scale. This paper will describe the experimental setup as well as the data management software. A case study of a particularly hard debug problem on a state of the art microprocessor will demonstrate the application of the PICA method.
ABSTRACTAs the limits of traditional CMOS scaling are approached, process integration has become ... more ABSTRACTAs the limits of traditional CMOS scaling are approached, process integration has become increasingly difficult and resulting in a diminished rate of performance improvement over time. Consequently, the search for new two- and three- dimensional sub-system solutions has been pursued. One such solution is a silicon carrier-based System-on-Package (SOP) that enables high-density interconnection of heterogeneous die beyond current first level packaging densities. Silicon carrier packaging contains through silicon vias (TSV), fine pitch Cu wiring and high-density solder pads/joins, all of which are compatible with traditional semiconductor methods and tools. These same technology elements, especially the through silicon via process, also enable three dimensional stacking and integration. An approach to fabricating electrical through-vias in silicon is described, featuring annular-shaped vias instead of the more conventional cylindrical via. This difference enables large-area, un...
Practical multi receiver concentrator photovoltaic systems operating at high solar concentration ... more Practical multi receiver concentrator photovoltaic systems operating at high solar concentration levels up to 2000 suns experience large radiation, thermal and electrical loads in addition to large power density transients under routine operation. These systems require efficient ...
International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034)
Abstract This paper will provide a case study of a particularly difficult debug problem (the Hole... more Abstract This paper will provide a case study of a particularly difficult debug problem (the Holey Shmoo problem) which developed while designing the IBM System/390 G6 637 MHz microprocessor chip. Resolution of this problem involved the use of some of today's ...
This paper reports on the successful application of very-high- performance robotics in the electr... more This paper reports on the successful application of very-high- performance robotics in the electrical testing of multichip modules using only two probes, breaking with the old traditional array of probes as the primary test method. Complete production line tools include two high-speed Hummingbirdt probing robots and precise x-y tables to carry them and a fast, accurate opens-shorts test. To ensure
Proceedings 1992 IEEE International Conference on Robotics and Automation, 1992
The authors describe a high-performance MARC (Multi-Transputer Apparatus for Real-Time Control) s... more The authors describe a high-performance MARC (Multi-Transputer Apparatus for Real-Time Control) system and its application for controlling a three-degree-of-freedom positioning device (minipositioner). Integrated with the IEEE-959 (SBX) bus and INMOS TRAM sites, the MARC system provides the flexibility and extensibility for many industrial applications. Computed torque and near-minimum-time methods were implemented on the system to control and minipositioner for high-speed, point-to-point motion. Experimental data show that the position-servo bandwidth of the device exceeds 273 Hz. The minipositioner is able to move 5 mm in 11 ms, including move time and settling time
2000 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.00CH37056), 2000
The new non-invasive backside timing characterization technique, Picosecond Imaging Circuit Analy... more The new non-invasive backside timing characterization technique, Picosecond Imaging Circuit Analysis (PICA), was applied to the identification and analysis of a race condition which occurred in an early design of the Ll cache of the SI390 microprocessor. The circuit switching activity was visualized in reconstructed slow motion videos of passing and failing conditions. An automated emission waveform extraction and analysis tool was used to perform a quantitative study of the failing condition.
Practical multi receiver concentrator photovoltaic systems operating at high solar concentration ... more Practical multi receiver concentrator photovoltaic systems operating at high solar concentration levels up to 2000 suns experience large radiation, thermal and electrical loads in addition to large power density transients under routine operation. These systems require efficient ...
Variable Reluctance motors are employed in an increasingly wider range of applications. They are ... more Variable Reluctance motors are employed in an increasingly wider range of applications. They are important as direct drive actuators for robots. A characterization of the motors is essential in developing the proper control methods. This paper describes a technique to develop a simple, nonlinear dynamic model from measurements of flux linkage which captures all of the relevant dynamics of the motor over its entire operating regime. A least square data reduction algorithm is presented that handles the analyses in a natural way to generate bivariate polynomials to approximate the flux linkage. Comparisons with a theoretical method and other measurements are presented.
This paper reports on the successful application of very-high-performance robotics in the electri... more This paper reports on the successful application of very-high-performance robotics in the electrical testing of multichip modules using only two probes, breaking with the old traditional array of probes as the primary test method. Complete production line tools include two high-speed Hummingbirdt probing robots and precise x-y tables to carry them and a fast, accurate opens-shorts test. To ensure fast
Three-dimensional (3D) silicon integration of active devices with through-silicon vias (TSVs), th... more Three-dimensional (3D) silicon integration of active devices with through-silicon vias (TSVs), thinned silicon, and silicon-to-silicon fine-pitch interconnections offers many product benefits. Advantages of these emerging 3D silicon integration technologies can include the following: power efficiency, performance enhancements, significant product miniaturization, cost reduction, and modular design for improved time to market. IBM research activities are aimed at providing design rules, structures, and processes that make 3D technology manufacturable for chips used in actual products on the basis of data from test-vehicle (i.e., prototype) design, fabrication, and characterization demonstrations. Three-dimensional integration can be applied to a wide range of interconnection densities (,10/cm 2 to 10 8 /cm 2 ), requiring new architectures for product optimization and multiple options for fabrication. Demonstration test structures, which are designed, fabricated, and characterized, are used to generate experimental data, establish models and design guidelines, and help define processes for future product consideration. This paper 1) reviews technology integration from a historical perspective, 2) describes industry-wide progress in 3D technology with examples of TSV and silicon-silicon interconnection advancement over the last 10 years, 3) highlights 3D technology from IBM, including demonstration test vehicles used to develop ground rules, collect data, and evaluate reliability, and 4) provides examples of 3D emerging industry product applications that could create marketable systems.
56th Electronic Components and Technology Conference 2006, 2006
In the past, traditional CMOS scaling has been one of the principal levers to achieve increased s... more In the past, traditional CMOS scaling has been one of the principal levers to achieve increased system-level performance.
56th Electronic Components and Technology Conference 2006, 2006
A silicon-based system-on-package (SOP) is described. Novel capabilities of SOP are expected to e... more A silicon-based system-on-package (SOP) is described. Novel capabilities of SOP are expected to enable lower cost, more efficient and higher performance electronic systems. Newly developed technology elements include: electrical silicon through-vias, fine-pitch, high bandwidth wiring, fine pitch solder interconnection, fine pitch known-good-die, and advanced microchannel cooling. Applications may range from miniaturized consumer products such as integrated function cell phones to
[Proceedings] APEC '92 Seventh Annual Applied Power Electronics Conference and Exposition
... Lo + sin(a)[ I - cos( - wi,,Jt))]} '6 Although the above equations are derived for a thr... more ... Lo + sin(a)[ I - cos( - wi,,Jt))]} '6 Although the above equations are derived for a three-phase, uncoupled VR motor, the same procedure can be applied to other VR motors with more phases and different commutation methods. IV. ... __._____ x, = x2 i2 =---- sin( - wic,,Jt)), . . ...
High-Speed Imaging and Sequence Analysis III, 2001
IBM Research has developed a time resolved imaging technique, Picosecond Imaging Circuit Analysis... more IBM Research has developed a time resolved imaging technique, Picosecond Imaging Circuit Analysis (PICA), which uses single photon events to analyze signals in modern microprocessors on a picosecond time scale. This paper will describe the experimental setup as well as the data management software. A case study of a particularly hard debug problem on a state of the art microprocessor will demonstrate the application of the PICA method.
ABSTRACTAs the limits of traditional CMOS scaling are approached, process integration has become ... more ABSTRACTAs the limits of traditional CMOS scaling are approached, process integration has become increasingly difficult and resulting in a diminished rate of performance improvement over time. Consequently, the search for new two- and three- dimensional sub-system solutions has been pursued. One such solution is a silicon carrier-based System-on-Package (SOP) that enables high-density interconnection of heterogeneous die beyond current first level packaging densities. Silicon carrier packaging contains through silicon vias (TSV), fine pitch Cu wiring and high-density solder pads/joins, all of which are compatible with traditional semiconductor methods and tools. These same technology elements, especially the through silicon via process, also enable three dimensional stacking and integration. An approach to fabricating electrical through-vias in silicon is described, featuring annular-shaped vias instead of the more conventional cylindrical via. This difference enables large-area, un...
Practical multi receiver concentrator photovoltaic systems operating at high solar concentration ... more Practical multi receiver concentrator photovoltaic systems operating at high solar concentration levels up to 2000 suns experience large radiation, thermal and electrical loads in addition to large power density transients under routine operation. These systems require efficient ...
International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034)
Abstract This paper will provide a case study of a particularly difficult debug problem (the Hole... more Abstract This paper will provide a case study of a particularly difficult debug problem (the Holey Shmoo problem) which developed while designing the IBM System/390 G6 637 MHz microprocessor chip. Resolution of this problem involved the use of some of today's ...
This paper reports on the successful application of very-high- performance robotics in the electr... more This paper reports on the successful application of very-high- performance robotics in the electrical testing of multichip modules using only two probes, breaking with the old traditional array of probes as the primary test method. Complete production line tools include two high-speed Hummingbirdt probing robots and precise x-y tables to carry them and a fast, accurate opens-shorts test. To ensure
Proceedings 1992 IEEE International Conference on Robotics and Automation, 1992
The authors describe a high-performance MARC (Multi-Transputer Apparatus for Real-Time Control) s... more The authors describe a high-performance MARC (Multi-Transputer Apparatus for Real-Time Control) system and its application for controlling a three-degree-of-freedom positioning device (minipositioner). Integrated with the IEEE-959 (SBX) bus and INMOS TRAM sites, the MARC system provides the flexibility and extensibility for many industrial applications. Computed torque and near-minimum-time methods were implemented on the system to control and minipositioner for high-speed, point-to-point motion. Experimental data show that the position-servo bandwidth of the device exceeds 273 Hz. The minipositioner is able to move 5 mm in 11 ms, including move time and settling time
2000 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.00CH37056), 2000
The new non-invasive backside timing characterization technique, Picosecond Imaging Circuit Analy... more The new non-invasive backside timing characterization technique, Picosecond Imaging Circuit Analysis (PICA), was applied to the identification and analysis of a race condition which occurred in an early design of the Ll cache of the SI390 microprocessor. The circuit switching activity was visualized in reconstructed slow motion videos of passing and failing conditions. An automated emission waveform extraction and analysis tool was used to perform a quantitative study of the failing condition.
Practical multi receiver concentrator photovoltaic systems operating at high solar concentration ... more Practical multi receiver concentrator photovoltaic systems operating at high solar concentration levels up to 2000 suns experience large radiation, thermal and electrical loads in addition to large power density transients under routine operation. These systems require efficient ...
Variable Reluctance motors are employed in an increasingly wider range of applications. They are ... more Variable Reluctance motors are employed in an increasingly wider range of applications. They are important as direct drive actuators for robots. A characterization of the motors is essential in developing the proper control methods. This paper describes a technique to develop a simple, nonlinear dynamic model from measurements of flux linkage which captures all of the relevant dynamics of the motor over its entire operating regime. A least square data reduction algorithm is presented that handles the analyses in a natural way to generate bivariate polynomials to approximate the flux linkage. Comparisons with a theoretical method and other measurements are presented.
This paper reports on the successful application of very-high-performance robotics in the electri... more This paper reports on the successful application of very-high-performance robotics in the electrical testing of multichip modules using only two probes, breaking with the old traditional array of probes as the primary test method. Complete production line tools include two high-speed Hummingbirdt probing robots and precise x-y tables to carry them and a fast, accurate opens-shorts test. To ensure fast
Three-dimensional (3D) silicon integration of active devices with through-silicon vias (TSVs), th... more Three-dimensional (3D) silicon integration of active devices with through-silicon vias (TSVs), thinned silicon, and silicon-to-silicon fine-pitch interconnections offers many product benefits. Advantages of these emerging 3D silicon integration technologies can include the following: power efficiency, performance enhancements, significant product miniaturization, cost reduction, and modular design for improved time to market. IBM research activities are aimed at providing design rules, structures, and processes that make 3D technology manufacturable for chips used in actual products on the basis of data from test-vehicle (i.e., prototype) design, fabrication, and characterization demonstrations. Three-dimensional integration can be applied to a wide range of interconnection densities (,10/cm 2 to 10 8 /cm 2 ), requiring new architectures for product optimization and multiple options for fabrication. Demonstration test structures, which are designed, fabricated, and characterized, are used to generate experimental data, establish models and design guidelines, and help define processes for future product consideration. This paper 1) reviews technology integration from a historical perspective, 2) describes industry-wide progress in 3D technology with examples of TSV and silicon-silicon interconnection advancement over the last 10 years, 3) highlights 3D technology from IBM, including demonstration test vehicles used to develop ground rules, collect data, and evaluate reliability, and 4) provides examples of 3D emerging industry product applications that could create marketable systems.
56th Electronic Components and Technology Conference 2006, 2006
In the past, traditional CMOS scaling has been one of the principal levers to achieve increased s... more In the past, traditional CMOS scaling has been one of the principal levers to achieve increased system-level performance.
56th Electronic Components and Technology Conference 2006, 2006
A silicon-based system-on-package (SOP) is described. Novel capabilities of SOP are expected to e... more A silicon-based system-on-package (SOP) is described. Novel capabilities of SOP are expected to enable lower cost, more efficient and higher performance electronic systems. Newly developed technology elements include: electrical silicon through-vias, fine-pitch, high bandwidth wiring, fine pitch solder interconnection, fine pitch known-good-die, and advanced microchannel cooling. Applications may range from miniaturized consumer products such as integrated function cell phones to
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