Stencil Opening

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 Objective

After finish this modules you should able to know:

 Perform the stencil aperture openings for SMT components.

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 Overview
How the stencil design opening/aperture looks like?
HOMEPLATE
SQUARE
RECTANGLE

CIRCLE
INVERTED HOMEPLATE or
BOW TIE

OBLONG

DIAMOND
D-SHAPE

W-width
L-length
R-radius

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 Checkplots

Checkplot

We shall need to fill in these columns.

Once finish send it back to stencil house.

4
 Overview
Why there are differences in aperture shapes?
Because to offer benefits of less paste, consistent paste release and reduce or eliminated solder balling.

SHAPE PURPOSE
Minimize the solder ball trap
under component. Fast
capillary action on the
HOMEPLATE component.

Minimize the solder ball trap

under component. Slow
INVERTED capillary action on the
HOMEPLATE component

RECTANGLE Provide sufficient solder paste

ROUND BGA solder bump apertures

Minimize the solder ball trap

under component. Slow
capillary action on the
D-SHAPE component

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 Jabil Stencil Design Guidelines

Jabil stencil design guideline has been accommodate on these design rules.

Stencil
Design
Rules

Design Rule 3
Design Rule 1 The finest pitch
Aspect Ratio component.

Design Rule 2
Area Ratio

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 Stencil Design Rules 1
Aspect Ratio
Aspect Ratio – This is defined as the ratio between the plate thickness and the width of
the aperture opening. This ratio should be at least >= 1.5. This factor is critical
when determining the thickness of the stencil.

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 Stencil Design Rules 2
Area Ratio
Area Ratio – The ratio between the pad pulling tension and the aperture retaining the
tension. This ratio should be at least 0.66 or greater. This factor is also critical
where determining the thickness of the stencil.

SHAPE FORMULA

ROUND

RECTANGULAR

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 Stencil Design Rules 3
Finest pitch component
The finest pitch component on the whole assembly will normally determine the overall
stencil thickness after taking into consideration the aspect ratio of the most fine
pitch device on the assembly

Pitch Measurement Thickness Recommendation

lower or equal to 10mils 4mils

11mils to 150 mils 5mils

151 mils and above 6mils

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 Stencil Design Guidelines

1. Chip Component Aperture

-0201
-0402
-Others
2. QFP & SOIC

3. BGA & CSP

STENCIL DESIGN
GUIDELINES

4. PTH Hole Stencil Design

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 Chip Component
Example of chip components such as resistor, capacitor and fuse.
Chip Packaging Pitch Aperture Recommendation
..0201 20 Square or rectangular 1 to 1 openings.
..0402 35 until ~59 Square or rectangular 1 to 1 openings.
..0603 60
..0805 90
..1206 137
Square or rectangular with 20% reduction on
Bigger size of packaging Bigger size of pitch the width and 10 % reduction on the length

10% Reduction

Pitch
Rectangular Design with reduction on three sides

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 QFP & SOIC

Chip Packaging Pitch Aperture Recommendation

QFP/SOIC 16 above Oblong or rectangular with 20% reduction on the width

Our stencil thickness is 5 mils.

Aperture
Opening

10% reduction
Pad

Pitch
QFP SOIC 10% reduction

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 BGA & CSP

Our stencil thickness is 5 mils recommendation on 1 to 1 opening

to all BGAs and CSPs.

Ball Grid Array (BGA) Chip Scale Package (CSP)

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 Exercises 1
TOP side of apertures

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 Exercises 2
BOTTOM side of apertures

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Thank you

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