EPP2158620 - SMT Programming - E

YAMAHA SMT Assembly System
Surface Mounter
Surface Mounter
Programming Manual
EPP2158620
Safety instructions
Safety instructions
w
Be sure to read these safety instructions before using YAMAHA surface mounters or related products.
Contents
CE marking i
1. Safety ii
1.1 To ensure safety ii
1.1.1 Defining safety ii
1.1.2 Causes of injuries and accidents ii
1.2 Using safety gear ii
1.3 Restrictions on machine use iii
1.3.1 Defining the operator and service personnel iii
1.3.2 Restricting machine operation with passwords iii
1.4 Cautions during machine operation iii
1.5 Cautions during power outages iii
1.6 Cautions regarding ferromagnetic fields iii
1.7 Handling the internal tape cutter iii
1.8 Keeping hands away from moving parts iv
1.9 Handling solvents vi
1.10 Handling the X-ray unit vi
2. Safety message vii

2.1 Safety message and categories in this manual vii
2.2 Typical warning text found in manual viii
2.2.1 Safety instruction viii
2.2.2 Operation and handling precautions ix
2.2.3 Facilities and environmental condition x
3. Warning labels xi
3.1 Warning label format and mark description xi
3.1.1 Warning label format xi
3.1.2 Meaning of marks xi
3.2 Warning labels xii
3.2.1 Handling safety covers xii
3.2.2 Pinching or crushing injury xiii
3.2.3 Effects on human body xiv
3.2.4 Handling each section xvii
3.3 Caution labels xix
3.3.1 Machine damage xix
3.4 Label positions xxiv
SF_SMT_EP153-435
CE marking
This equipment conforms to the EU Machinery Directive 2006/42/EC (description A1 below) and EMC
Directive 2014/30/EU (description A2 below).
However, this equipment does not bear CE marking if a custom order item was installed.
Safety instructions
A1.
Cautions regarding the official language of EU countries and the language used in operation
manuals, CE declarations, operation screen characters, and warning labels when this equipment is
installed in an EU countr y.
• All materials except warning labels are written in English only.
n NOTE
Warning labels only have pictograms or else include warning messages in English, Chinese, Korean and Japanese
language.
A2.
EMC description
• Electromagnetic immunity (Immunity)
Complies with test standards as specified by EN 61000-6-2.
• Electromagnetic emissions (Emission)
Complies with test standards for ISM category: Group 1, Class A, as specified by EN 55011.
n NOTE
Class A equipment is intended for use in industrial environments. If used in other environments, ensuring
electromagnetic compatibility (EMC) might be difficult. Refer to EN 55011 standards for detailed information.
i
1. Safety
To ensure that the machine you purchased is used safely and correctly, always comply with the instructions
and rules in this manual regarding safety. However this manual cannot cover all items regarding safety in
detail. So it is extremely important that the operator or person handling the machine make correct decisions
Safety instructions
regarding safety.
1.1 To ensure safety

To maintain the safety of the operator or person working with this machine, it is essential that it (including
external parts feeders) be installed correctly in compliance with the safety standards and conditions of that
country.
Complying with the safety regulations and laws of that country is the responsibility of the customer who
purchased this machine. The supervisor of this machine must take responsibility to ensure all measures have
been taken for machine safety.
1.1.1 Defining safety

1. Safety has priority over all other operations.
2. Safety is more important than any other task.
3. Safety is the foundation for work efficiency.
4. Safety begins with maintaining (keeping it neat and orderly) the work environment.
1.1.2 Causes of injuries and accidents

Most accidents are not something that occurs but something that are caused. So it is important to make an
effort NOT to cause accidents.
n Hazardous actions
• Ignoring causes of accidents
• Working or operating equipment in cramped locations
• Working in locations or positions where safety cannot be ensured
• Unsafe machine operation and using equipment whose safety cannot be ensured
• Working or operating equipment at speeds where safety cannot be ensured
• Working or operating machines with safety equipment removed
• Performing work or tasks on top of a machine currently in operation
• Playing around or goofing off during work
• Performing maintenance or inspections without wearing safety gear
1.2 Using safety gear

Always wear safety gear when operating or servicing equipment.
Helmet : Use during maintenance work
Safety glasses or goggles : Use around light harmful to eyes and when applying lubricant, etc.
Respiratory gear : Use when handling organic solvents
Safety gloves : Use when applying lubricant, etc.
n Precautions when applying lubricant (grease)
w WARNING
• Inflammation may occur if grease or lubricant gets in the eyes. Before handling the grease or
lubricant, wear safety goggles to ensure it will not come in contact with the eyes.
• Inflammation may occur if the grease or lubricant comes into contact with skin. Be sure to wear
protective gloves to prevent contact with skin.
• Do not take orally or eat the grease or lubricant. Eating will cause diarrhea and vomiting.
ii
1.3 Restrictions on machine use
1.3.1 Defining the operator and ser vice personnel
c CAUTION
Only the operator and service personnel having sufficient knowledge of this machine should handle this machine.
Safety instructions
Operator:
The operator is someone who has been trained by us in machine operation, has a thorough knowledge of the machine
operation manual and demonstrates adequate knowledge of machine operation and safety.
Main tasks of the operator include pre-operation checks, operation (component mounting) and making setups
(changeovers). The machine is only used in normal operating mode.
Ser vice personnel:
The service personnel are those trained by us in machine maintenance as well as safety instruction and demonstrate a
thorough knowledge of safe handling of the machine according to the type and location of machine operation. They must
also understand hazardous sections of the machine and residual risks.
Main tasks of the service personnel include machine maintenance, repair, adjustment and management of the system.
The service personnel may make changes to the machine settings and operation in factory adjustment mode.
1.3.2 Restricting machine operation with passwords

Machine operating levels usable by the operator and service personnel (mentioned above) must be restricted
by password. This prevents the operator and service personnel from using the machine at a higher level than
allowed.
1.4 Cautions during machine operation

• Always make pre-operation checks before turning on the main power switch.
• Do not use an air blow tool when cleaning the machine. (Airborne dust will badly affect machine operation.)
• Stop all machine operation before cleaning around the machine.
• Do not turn off the compressed air during operation.
• Always make periodic inspections to prevent unexpected machine breakdowns.
• Allow only properly trained, experienced workers to perform repair and adjustment.
1.5 Cautions during power outages

If a power outage (blackout) occurs during automatic machine operation, always turn the main power switch
off to prevent faulty operation and equipment damage after power has been restored. Remove items such as
boards that remain inside the machine.
1.6 Cautions regarding ferromagnetic fields

Some YG series machines contain parts generating strong magnetic fields which may cause bodily injury, death,
or device malfunction. Always comply with the following instructions.
• Persons wearing electronic medical devices such as hearing aids and/or cardiac pacemakers must keep away
from the linear motor.
• Persons wearing ID cards, purses, and/or wristwatches must keep away from the linear motor.
• Do not attempt to disassemble the linear motor (including surrounding covers).
• Do not bring tools close to the linear motor.
• Do not bring tools close to the magnetic scale.
• Do not put magnetic materials or objects close to the linear motor.
• Do not touch a portion close to the linear motor during operation or immediately after the operation has been
finished since such part is hot.
1.7 Handling the internal tape cutter

• Never supply electrical power and compressed air to the machine while the covers for the tape cutter are removed.
• Tape cutter maintenance tasks must be performed by YAMAHA service personnel.
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1.8 Keeping hands away from moving parts
During use of this machine, the customer’s equipment and operating conditions might allow the operator’s
hands to come into contact with moving parts.
Use the following safety measure options to avoid possible danger where openings or gaps are found on the
machine.
Safety instructions
■ Dummy feeder
Use dummy feeders as safety measures to fill a gap between tape feeders. Install dummy feeders on the feeder plate the
same way as normal feeders in order to prevent hands from entering.
Prevention of hand entry

Dummy feeder
Clamp lever
Dummy feeder (Wide-size)
Dummy feeder (8mm-size)

91203-L0-20
c CAUTION
To install or remove a dummy feeder, be sure to first press the emergency button and then open the cover. T he
machine has a structure that does not allow installing or removing a dummy feeder when the machine is in operation.
However, inserting a dummy feeder inside the cover during operation may cause serious accidents, so be careful not
to attempt it.
■ One-stop cover (for machines (except for YSM40) with batch change carrier specs.)
If not using a feeder exchange carriage in the machine that is to be used with feeder exchange carriages, install a
one-stop cover in the position where a feeder exchange carriage is to be installed.
Prevention of hand entry

One-stop cover
One-stop cover
91204-L0-10
n NOTE
One-stop covers cannot be installed or removed during operation. The machine must be in a stopped state because
the section where a feeder exchange carriage is to be installed will move up and down for the installation or removal
of the feeder exchange carriage.
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■ Muzzle plate
Use these plates as a safety measure for the board conveyor entrance and exit openings. Each plate is movable, so adjust
the mounting position to match the boards to be produced.
Muzzle plate
Safety instructions
Upper muzzle plate
Board conveyance plane
Lower muzzle plate
91205-L0-00
Upper clearance Lower clearance Remarks
YS100/YS88 8.0 to 38.5mm 1.0 to 31.0mm
YS12, YS12P, YS12F, YS24, YS24X 5.0 to 20.0mm 4.2 to 39.2mm
YSM40 0 to 44.0mm 0 to 39.0mm
Z:LEX (YSM20) 0 to 36.0mm 4 to 40.0mm From board conveyor plane
YC8 13.4 to 80.4mm 4.6 to 39.2mm
YSP 0 to 6.6mm 0 to 26.4mm
YSi-V 0 to 48.0mm 0 to 102mm
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1.9 Handling solvents
Take the following precautions when handling cleaning solvents during solder printing or preparation.
Hazards when handling solvents

Safety instructions
1. Hazards to human health

Organic solvents constantly vaporize and contaminate the surrounding atmosphere. Inhaling or coming in contact with
organic solvent vapor may cause serious damage to human health.
2. Flammability
Organic solvents are highly flammable substances and can easily catch fire if handled improperly.
3. Adverse effects on machines
Some solvent types will damage the cleaning unit, electrical wire sheath and various units used in the solder paste
printer.
To avoid hazards of solvents

1. Be careful not to inhale toxic vapors of solvents for extended periods.
2. Do not use solvents near fire or flame. Keep solvents away from flame or fire.
3. Use only the specified solvent in the correct manner. Do not reuse any solvent repeatedly, and do not mix with other
solvents or chemicals.
1.10 Handling the X-ray unit

Some YS series inspection equipment models contain an X-ray unit. Take the following precautions when using
with an X-ray unit.
1. The X-ray output window of the X-ray source is made of ver y thin ber yllium foil.
· Beryllium in the form of dust particles can cause acute toxicity or chronic toxicity, and may induce respiratory
problems if inhaled.
· To ensure safety, the X-ray unit is designed so that the X-ray window cannot be touched. However, should the X-ray
output window be broken for some reason, immediately turn off the power switch and use extreme care not to inhale
the dust particles.
· Chlorine gas can corrode the beryllium window of the X-ray tube, causing permanent damage to the X-ray tube. Do
not use the X-ray unit in environments where chlorine gases are generated. Take special care when handling samples
such as vinyl chloride materials which may generate chlorine gases.
2. Lead is used in the covers of machines equipped with an X-ray unit.
Although lead is sealed within the covers so that the lead portions cannot be directly touched, use caution since lead is
known as heavy metal having harmful effects.
3. A safety key is provided for machines equipped with an X-ray unit.
The safety key must be managed by the supervisor of the machine.
4. Safety education about X-ray
Appropriate measures are taken for YAMAHA's X-ray unit so that the amount of the X-ray leak to the outside of the
equipment is very small. Therefore, when using this equipment in Japan, it is not necessary to set controlled areas defined
in Article 3 of the Ordinance on Prevention of Ionizing Radiation Hazards.
It is not legally obligated to conduct the safety education, but it is recommended to conduct the education by the
customer.
When operating this equipment outside Japan, the safety education is conducted as required according to the relevant
country's laws, regulations, and standards.
TIP
When conducting the safety education in Japan, the contents stated in “Special Education Standard for Radiography
(Ordinance of the Ministry of Health, Labor and Welfare No. 50)” are recommended. However, the safety education
does not necessarily need to be these contents.
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2. Safety message
This section describes information you should always comply with to prevent unforeseen accidents that might
lead to injury of the operator and others or damage the machine. Hazards and injuries that might result from
ignoring safety instructions and operating the machine incorrectly are categorized as follows.
Safety instructions
2.1 Safety message and categories in this manual
This manual uses the following safety alert symbols, signal words, and format styles according to the degree of
hazard.
n Safety alert symbols and signal words
w WARNING
Indicates a potentially hazardous situation which, if not avoided, could result in death or serious injury.
These are points most essential for protecting the safety of the machine operator, inspector and service
personnel.
c CAUTION
Indicates a potentially hazardous situation which, if not avoided, may result in minor injury, or material loss or damage
to the machine. These points are important for protecting the safety of the machine and data, etc.
n NOTE
Gives helpful information or key points when operating the machine, in a simple and clear manner.
e EMERGENCY STOP
This mark indicates the emergency stop button must first be pressed before continuing the procedure.
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2.2 Typical warning text found in manual
The following are typical warning message text found in the YAMAHA surface mounter or related product
manual.
2.2.1 Safety instruction

Safety instructions
When you see the following cautions or warnings, always read them thoroughly and make sure you fully
understand them.
n Warnings
w WARNING
The signal light (signal tower) installed on the top of the machine is an important device that shows the
operating status of the machine. BEFORE OPERATING THE MACHINE, MAKE SURE THAT EACH LAMP OF THE SIGNAL
TOWER LIGHTS UP CORRECTLY (GREEN DURING OPERATION, YELLOW WHEN ERROR OCCURS OR INTERLOCK IS DETECTED,
AND RED DURING EMERGENCY STOP). NEVER PLACE ANY PART OF THE BODY IN THE HEAD MOVEMENT RANGE WHILE THE
GREEN LIGHT IS ON. (On machines designed to meet EU specifications, green/white/blue lamps are used
instead of green/red/yellow lamps.)
w WARNING
Never allow any part of your body (hands, head) to enter within the machine movement range during
operation.
w WARNING
Be careful when using isopropyl alcohol, since inhaling its fumes over long periods can be hazardous
to health.
n Cautions
c CAUTION
The person operating the machine must have been trained in correct machine operation and safety.
c CAUTION
This machine contains parts generating strong magnetic fields. G reat care should be taken when a part of your body
is put inside the machine for the maintenance work. C autions regarding ferromagnetic fields are described in the
section, “Safety Instructions”, at the beginning of this document. A lways thoroughly read this section to fully
understand its contents.
c CAUTION
The exhaust air blow might strike your face, so be sure to wear safety goggles.
viii
2.2.2 Operation and handling precautions
understand them.
n Warnings
Safety instructions
w WARNING
Inflammation may occur if grease or lubricant gets in the eyes. Before handling the grease, wear safety
goggles to ensure the grease will not come in contact with the eyes.
w WARNING
Inflammation may occur if the grease or lubricant comes into contact with skin. Be sure to wear
protective gloves to prevent contact with skin.
w WARNING
Do not take orally or eat the grease or lubricant. Eating will cause diarrhea and vomiting.
n Cautions
c CAUTION
Always stop the machine before installing the parts feeder into the machine. Hands or other parts of your body might
otherwise be caught in the moving parts.
c CAUTION
During operation only press the emergency stop button in cases of emergency.
c CAUTION
Always turn off the power with the correct procedure. Using hasty or incorrect procedures to turn off power might
damage the flash disk in the machine.
c CAUTION
When installing push-up pins on the push-up plate, set them in positions where they will not interfere with the conveyor
rails or other parts when the push-up plate is raised.
c CAUTION
When the machine you are using is not equipped with a nozzle station, you must change the nozzle by hand if it is not
a specified nozzle. In this case, always first press the emergency stop button.
c CAUTION
If an abnormality occurs during warm-up, immediately stop the machine, find the cause of the problem and eliminate it.
c CAUTION
When storing the grease after use, tightly close the cap of the grease tube or container to prevent dust and moisture
from entering inside. S tore it in a dark place to avoid direct sunlight, and keep away from fire and heating sources.
c CAUTION
After copying board data or system data into a USB flash memory, do not leave that data in the USB flash memory for
a long time. U se the USB flash memory just as a copy medium for backup data. P repare other backup media
(CD , DVD , MO , etc.) to store backup data more safely.
c CAUTION
You can also clean and grease the ball screw after removing the push-up plate. H owever, the push-up plate is heavy.
S o, take great care during handling.
c CAUTION
A strong air flow is exhausted during the cleaning blow. Always remove all nozzles attached to the heads before
starting the cleaning blow. Starting the cleaning blow while the nozzles are still attached may blow the nozzles away
from the heads causing the nozzles to break or become lost.
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2.2.3 Facilities and environmental condition
understand them.
n Warnings
Safety instructions
w WARNING
Always shut off the power and air supply before replacing parts or performing repairs.
w WARNING
During teaching or when making machine adjustments, always keep alert so that you can stop the
machine whenever needed.
w WARNING
Safety devices (safety interlocks) that stop machine operation should always be in good operating
condition.
w WARNING
The machine should never be used in locations with inflammable gas or in extremely dirty or polluted
environments.
w WARNING
• Persons wearing electro-medical devices such as cardiac pacemakers must be kept away from the
head assembly.
• Persons with implanted magnetic metals must be kept away from the head assembly.
• Do not bring ferrous objects such as metal tools and screws close to the parts where a strong
magnetic field warning is indicated.
• Do not bring magnetic cards or objects vulnerable to magnetic fields close to the head assembly.
w WARNING
To avoid the risk of electrical shock, make sure that the power source i s off before connecting the
power cable. A lso make sure that the ground cable i s securely connected to the machine.
n Cautions
c CAUTION
When disconnecting the air hose, be careful not to allow oil, water or impurities to splash outwards. A dditionally, take
great care since a large air exhaust sound is produced when disconnecting the coupler.
c CAUTION
Use a power cable whose conductor cross-section area is greater than 3.5mm2.
x
3. Warning labels
To use the YAMAHA machines safely and correctly, warning labels are attached to the machine body and
peripheral equipment. Check that the information on each warning label is clearly legible and comply with
the instructions.
Safety instructions
3.1 Warning label format and mark description
3.1.1 Warning label format

As shown below, a warning label indicates the degree of hazard by means of a signal word and the color of the
signal word panel. A mark and a pictogram are also used to emphasize the message. Basically, labels attached
to the outside of machines are in 4 languages (English, Chinese, Korean and Japanese) while labels attached to
the inside of the machines are only a pictogram.
Warning label format

Warning message and mark (pictogram) example
Safety alert symbol Signal word
WARNING Signal word panel

Danger : Red
Pinch or crush hazard. Warning : Orange
Caution : Yellow
Mark and pictogram
Message
90K41-000380
91206-L0-00
3.1.2 Meaning of marks

The following 3 types of marks are used on warning labels. Each mark has its own meaning and is typically
used with a pictogram to emphasize the message.
Mark and pictogram

Marks and examples used with pictogram
Warning mark Prohibition mark Instruction mark
WARNING WARNING WARNING
Usage examples
91207-L0-00
Meaning of the above

Definition Shape/Color
examples
Indicates a hazard, how to Yellow triangle with black Risk of electrical shock
avoid the hazard, and potential border. Pictogram is black on
Warning
consequences of ignoring the yellow.
warning.
Indicates a prohibited action to Red circle with slash. Pictogram Do not modify or disassemble
Prohibition avoid the potential hazard. is black and located behind safety cover switch.
slash.
Indicated an action that must Blue circle. Pictogram is white Read the manual to understand
Instruction be taken to avoid the potential on blue. procedure before starting
hazard. operation.
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3.2 Warning labels
Safety instructions
3.2.1 Handling safety covers

Potential
Injury from touching moving parts during machine operation
hazard
To avoid Do not touch or tamper with safety cover switches and do not operate machine if any safety cover
hazard switches were deactivated.
Applicable
All YS series machines, tray changers, etc. Case All case
machines
Potential
Unexpected accidents may occur if safety mechanisms are disabled.
hazard
To avoid Do not remove or disassemble any specified safety mechanism (protective cover, safety cover,
hazard etc.).
Applicable
YS24, YS24X, YSH20, etc. Case All case
machines
Potential
Risk of injury
hazard
To avoid
Be sure to return the cover to its original position before starting the operation.
hazard
Applicable
YSP Case All case
machines
xii
3.2.2 Pinching or crushing injur y
Potential · Hands or fingers might be caught between moving parts and covers, causing injury.
Safety instructions
hazard · Hands or fingers might be pinched by moving parts, causing injury.
To avoid
Never place hands or fingers in machine during operation such as when handling tray magazines.
hazard
Applicable
Z:LEX (YSM20), YSM40, all YS series machines, tray changers Case All case
machines
Potential
Hands or fingers might be pinched or crushed by clamp plate, causing injury.
hazard
To avoid
Never place hands or fingers in the machine when clamping a mask.
hazard
Applicable • Setup
YSP Case
machines • Maintenance
Potential
Injury from tape cutter
hazard
To avoid
Do not put hands into cutter unit while power or compressed air is supplied.
hazard
Applicable
YS series (machines equipped with tape cutter) Case Maintenance
machines
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3.2.3 Effects on human body
Potential
Safety instructions
Electrical shock hazard

hazard
To avoid
Do not touch and disassemble ionizer discharge needles. Keep them away from water.
hazard
Applicable
Machines equipped with ionizer (option) Case All case
machines
To prevent the electric shock or damage.

Do not touch electrodes.
WARNING Do not disassemble this unit.
Keep unit away from water and high
humidity
可造成触电和故障的原因。
别用手触摸电极部位。
警告不可私自拆分部件。
请避免部件接触水分并远离极度潮湿环境。
感電や故障の原因になります。
放電針に手を触れないで下さい。
警告分解はしないで下さい。
電気部に水をかけないで下さい。
Potential
Death, serious injury or equipment malfunction
hazard
To avoid
Observe precautions necessary due to strong magnetic fields.
hazard
Applicable
YS12, YS12P, YS12F, YS24, YS24X, YSH20, etc. Case All case
machines
Potential
hazard
To avoid
Do not touch power supply inside cover.
hazard
Applicable
All machines Case All case
machines
xiv
Potential
Burn hazard
hazard
Safety instructions
To avoid
Heater becomes very hot during and shortly after operation, so do not touch it.
hazard
YSH20 machines equipped with heater (option) Case
Potential
hazard
To avoid
Do not touch while power is supplied.
hazard
Applicable All YS series machines (controller unit) except for inspection
Case Maintenance
machines equipment
Potential
Loss of eyesight
hazard
To avoid
Do not directly look into laser beam.
hazard
Applicable IT options such as barcode readers (Class 2 laser)
Case All case
machines YS series machines (Class 1 laser)
xv
Potential
Electrical shock
hazard
Safety instructions
To avoid
Keep the ionizer away from eyes. Do not disassemble or touch the discharge needles.
hazard
Applicable
Machines equipped with ionizer (option) Case All case
machines
Potential
Electrical shock
hazard
To avoid
Always turn off UPS switch when performing maintenance work.
hazard
Applicable
Machines equipped with UPS (option) Case Maintenance
machines
Potential
Electrical shock
hazard
To avoid
Always turn off UPS switch when performing maintenance work.
hazard
Applicable
machines
xvi
3.2.4 Handling each section
Potential
Safety instructions
Solvent may catch fire.
hazard
To avoid
Keep solvents such as alcohol away from fire or flame.
hazard
All solder paste printers Case
Potential
hazard
To avoid
Before opening covers wait at least 100 seconds after turning power off.
hazard
Applicable
All machines Case Maintenance
machines
Potential
Possible skidding or slipping causing injury
hazard
To avoid
Do not step on base section.
hazard
Applicable
YS24X (machines equipped with sATS II) Case All case
machines
xvii
Potential
Damage to machine or injury to person
hazard
Safety instructions
To avoid Before handling the product (equipment) always read manuals and make sure you fully understand
hazard the contents.
Applicable
Z:LEX (YSM20), YSM40, all YS series machines, etc. Case All case
machines
Potential
Exposure to radiation
hazard
To avoid
Keep covers closed during operation.
hazard
Applicable
YSi-X Case All case
machines
Potential
Risk of injury
hazard
To avoid
Do not open any cover without permission from YAMAMA service personnel.
hazard
Applicable
Maintenance parts for linear motors (strong magnetic fields) Case Maintenance
machines
xviii
3.3 Caution labels
Safety instructions
3.3.1 Machine damage
Potential
Adverse effects on component mounting accuracy
hazard
To avoid
Do not touch camera unit or apply impacts to it.
hazard
All machines Case
Potential
Risk of damage
hazard
To avoid
Remove shipping bolts and clamps before using machine.
hazard
Applicable
YS series machine feeder exchange carriage (option) Case Installation
machines
Potential
Machine damage or malfunction
hazard
To avoid
Connect power only at the specified voltage.
hazard
Applicable
All machines Case Installation
machines
Example for machines that must be connected to 200 VAC
Potential
Machine damage or malfunction
hazard
To avoid
Do not use any solvent, such as alcohol.
hazard
Applicable
All inspection machines Case Maintenance
machines
xix
Potential
Machine damage
hazard
Safety instructions
To avoid
Make sure push-up pins are arranged within specified area.
hazard
Applicable
YS24, YS24X Case Setup
machines
Potential
Machine damage or fire
hazard
To avoid
Do not use other than specified solvent.
hazard
Potential
Machine damage
hazard
To avoid
Always use gauze rolls of proper size.
hazard
xx
Potential
Machine damage
hazard
Safety instructions
To avoid If machine is not to be used for 6 months or more, block off the solvent path to protect solvent
hazard pump.
Applicable
All solder paste printers Case Maintenance
machines
Potential
Might disable machine functions
hazard
To avoid
Periodically replace USP battery since it has a limited service life.
hazard
Applicable
machines
Potential
Machine damage
hazard
To avoid
Read manuals and use correct procedure to operate machine.
hazard
Applicable
YS24X (machines equipped with sATS II) Case All case
machines
xxi
Potential
Could cause machine damage (collisions with head, etc.).
hazard
Safety instructions
To avoid
Verify that no objects have been placed on the batch change carrier's (for YSM40) top cover.
hazard
Applicable
Batch change carrier (YSM40) Case Setup
machines
Potential
The carrier tape could make contact with the head, possibly causing machine damage.
hazard
To avoid When a feeder is extracted from its loaded position, be sure that the feeder has been completely
hazard extracted before pressing it back into its loaded position.
Applicable
YSM40 Case Setup
machines
Potential
Pallet may drop if setting up parts on the parts supply station.
hazard
To avoid
Remove pallets before setting up parts.
hazard
Applicable
cATS (YSM40) Case Setup
machines
xxii
Potential
hazard
Safety instructions
To avoid Verify that no objects have been placed on the batch change carrier's (for YSM40 and Z:LEX (YSM20))
hazard top cover.
Applicable
Batch change carrier (YSM40, Z:LEX (YSM20)) Case Setup
machines
Potential
hazard
To avoid Verify that no objects have been placed on the batch change carrier's (for YSM40 and Z:LEX (YSM20))
hazard top cover.
Applicable
Batch change carrier (YSM40, Z:LEX (YSM20)) Case Setup
machines
xxiii
3.4 Label positions
Warning/caution labels are attached to the YAMAHA products to ensure safe and correct use. Check that the
information on each label is clearly legible and comply with the instructions.
For safety precautions other than those on the labels shown in this section, see the instructions in "1. Safety".
n
Safety instructions
NOTE
When connecting power to this equipment, refer to "Power connection terminals" described in the appendix of the
operator's manual.
n NOTE
The label contents and positions are slightly differ depending on machine model. For the label contents and positions,
refer to the operator's manual for the machine being used.
xxiv
General Contents
About this manual

1. Using this manual i
1.1 Available manuals i
1.2 Manual contents ii
2. Contents of each chapter iii
3. Page layout iv
Chapter 1 Overview of board data

1. Board data structure 1-1
2. Registering and selecting the board name 1-2

2.1 Registering board names 1-2
2.2 Selecting the board data 1-8
3. Flowchart for creating board data 1-10
Chapter 2 Setting the board parameters

1. Creating the board information 2-1
1.1 Board parameters 2-2
1.2 Mount parameters 2-7
1.3 Offset parameters 2-9
1.4 Fiducial parameters 2-11
1.4.1 Board fiducial function 2-12
1.4.2 Block fiducial function 2-12
1.4.3 Local fiducial functions 2-13
2. Creating the component information 2-15

2.1 Creating procedure 2-16
2.2 Basic parameters 2-17
2.3 Pick parameters 2-30
2.5 Vision parameters 2-34
2.6 Shape parameters 2-36
2.7 Option parameters 2-42
2.8 Side-view camera parameters 2-43
3. Component recognition test 2-45

3.1 Parts Adjust mode 2-46
EPP2158620
4. Creating the mark information 2-53
5. Mark recognition test 2-60

5.1 Mark Adjust mode 2-60
6. Editing the solder ball components 2-64

6.1 BGA 2-64
6.2 Flip Chip 2-68
6.2.1 Creating a random ball position (POS) information file 2-72
7. Teach and trace 2-74

7.1 Trace function 2-74
7.2 Auto trace function 2-77
7.3 Teaching function 2-78
7.3.1 Point teaching 2-78
7.3.2 Cursor teaching 2-82
7.3.3 Parts shape teaching 2-86
Chapter 3 Parameters for using options

1. Using component feeders other than tape feeders 3-1
1.1 Wide Multi-Stick feeders 3-1
1.2 Auto/external tray changer 3-5
1.3 MTF (Manual tray feeder) 3-11
2. Coplanarity checker 3-16

2.1 Limitations on using the lead coplanarity checker 3-16
2.2 Machine data setting 3-17
2.3 Setting the board data 3-18
2.3.1 Board information 3-18
2.3.2 Parts information 3-19
2.3.3 Optimizing the parameters in Parts Adjust mode 3-20
2.4 Coplanarity check errors 3-23
3. Force control (YS88) 3-24

3.1 Limitations on using force control 3-24
3.2 Force control setting 3-24
3.2.1 Setting method 3-24
4. Tape cutter 3-27

4.1 Tape cutting during component mounting 3-28
4.2 Tape cutting during board conveying 3-28
4.3 Other settings 3-29
5. Recovery pallet 3-31
Chapter 4 Using the advance functions

1. Board parameters 4-1
1.1 Using the badmark functions 4-1
1.1.1 Badmark parameters 4-3
1.1.2 Creating the badmark information 4-5
1.1.3 Creating a local badmark 4-9
1.2 Using the board edge offset (YSM40) 4-11
2. Parts parameters 4-14

2.1 Using alternative components 4-14
2.1.1 Component switching flow 4-14
2.1.2 Setting the alternative components 4-15
2.2 Using "Parts Group No." 4-17
3. Mark parameters 4-18

3.1 Pattern matching 4-18
3.1.1 Pattern registration 4-19
3.1.2 Using the data for pattern matching 4-23
4. Edit Assistant function 4-24

4.1 Switching to the Edit Assistant screen 4-24
4.2 Selecting a range of rows 4-25
4.3 Editing rows 4-26
4.4 Find and replace 4-27
4.5 Renumber 4-28
5. Recognition image check and save function 4-30
6. Optimizing the data 4-32

6.1 Setting the optimizing conditions 4-33
6.2 Executing the optimization 4-44
7. Smart recognition function 4-46

7.1 Outline of operation 4-47
7.2 Entering component information 4-47
7.3 Creating model data 4-48
7.4 Error messages 4-55
Chapter 5 Using the Editor
1. Multiplying the component data 5-1
2. Renumbering the data 5-2
3. Block offset 5-3

3.1 Creating the block offset data 5-3
3.2 Pitch distribution function 5-6
3.3 Block offset distribution and return 5-8
3.3.1 Block offset distribution 5-8
3.3.2 Block distribution return 5-10
4. Board file format conversion 5-11

4.1 Saving VIOS data in YGX format 5-11
4.2 Saving YGX data in VIOS format 5-13
Chapter 6 Managing the data

1. Data backup 6-1
1.1 Making a backup of board data 6-1
1.1.1 Backing up onto a USB memory device 6-2
1.2 Making a backup of system data 6-7
1.2.1 System backup settings 6-8
1.2.2 Making a backup 6-10
1.3 Restoring the system data 6-14
1.3.1 Restoring a system backup 6-14
1.3.2 Restoring a system full backup 6-17
2. Managing the POS information files 6-21
3. Creating the user database 6-24

3.1 Registering the data into the database 6-24
3.2 Expanding the component database 6-26
4. Production log management 6-27

4.1 Production log types 6-27
4.1.1 Production log (MIS) 6-27
4.1.2 Operation log (Unit Log) 6-29
4.1.3 Other operations 6-31
4.2 Production and operation log settings 6-33
4.2.1 Setting to store production logs per board data 6-33
4.2.2 Specifying the auto-save destination 6-34
4.2.3 History Utility 6-36
Appendix
A1. Specifications A-1
A2. Operator access control A-4

A2.1 Registering a new operator A-4
A2.2 Changing the registered contents A-8
A2.3 Editing groups A-9
A2.4 Editing access levels A-11
A2.5 Import/export function A-13
A2.6 Operator level time limit function A-14
A3. Function for simplifying the vision algorithm setting A-15

A3.1 Selecting an algorithm A-16
A3.2 Changing the edit mode A-17
A3.3 Creating component information A-19
A3.3.1 Special algorithm parameters A-20
A3.3.2 Chip components A-21
A3.3.3 Solder ball components A-25
A3.3.4 IC components A-28
A3.3.5 Specially shaped components A-35
A4. Parts Data Auto Tuning function A-45

A4.1 Overview A-45
A4.1.1 Supported mounter models and versions A-45
A4.1.2 Parts and parameters that can be tuned A-45
A4.2 Functions A-46
A4.2.1 Parts information tuning function A-46
A4.2.2 Tuning result takeover function A-48
A4.3 Setting A-50
A4.3.1 Machine setting A-50
A4.3.2 Parts information A-52
A4.3.3 Software Setting A-52
A5. Function for automatically creating part data A-53

A5.1 Overview A-53
A5.1.2 “Parts Find Best Target” combo box A-54
A5.2 Procedure for automatically creating part recognition data A-55
A5.2.1 Creating the Alignment Type and dimensions automatically A-55
A5.2.2 Automatically creating the dimensions only A-56
A5.2.3 Corrective action when search for optimal values has failed A-57
A5.3 Function details A-58
A5.3.1 Parameters that can be automatically created A-58
A5.3.2 Alignment Type compatible with automatic parameter creation A-59
Index
About this manual
About this manual
Contents
1. Using this manual i

1.1 Available manuals i
1.2 Manual contents ii
2. Contents of each chapter iii
3. Page layout iv
The instruction manual of this machine is written for those who operate
this machine.
Please read this manual carefully for correct operations and pay
special attention to safety precautions.
After reading through this manual, please use this manual as an
occasional reference and keep it within reach.
1. Using this manual
This manual is intended for those who program board data, and describes how to create and edit data
needed for machine operation and board production.
To use the machines safely and correctly, be sure to read this manual thoroughly before use.
About this manual

c CAUTION
Before using the machines, always read the "Safety instructions" in this manual and comply with instructions and rules
regarding safety.
1.1 Available manuals

There are several different manuals available including this manual to help users use the machine effectively
depending on their skills, expertise, and applications. Available manuals are shown below, which may slightly
differ according to the machine model.
n Available manuals
Manuals supplied with machine
The following manuals are supplied with the machine you purchased.
Programming Manual
Maintenance Parts List
Maintenance Manual
Operator's Manual
This manual
Option manuals
The following manuals are supplied with

the optional equipment you purchased.
Tray Component Supply Unit User's Manual
Option Manual
Feeder User's Manual
23000-P2-00
i
1.2 Manual contents
The contents of each manual are briefly explained below.
n Contents of manuals supplied with machine
Operator's Manual Programming Manual

About this manual
This manual is intended for machine operators. It provides This manual is intended for those who program board
an overview of the machine and information necessary to data. It describes how to create and edit data needed for
operate the machine. machine operation and board production.
Maintenance Manual
This manual is for daily and periodic machine maintenance

needed to maintain machine performance. It describes,
for example, how to clean the nozzles and shafts of the
machine you purchased and how to replace filters.
n Other manuals and documents
Option Manual User's Manual
This manual is supplied with each option for surface • Single-volume manual containing all information about
mounters, YHP-2, solder printers and inspection operation, programming, and maintenance. (Green spine)
equipment, and explains how to handle the option. • Manual describing the software-related functions and
software operation. (Yellow spine)
n Contents of option manuals
Maintenance Guide Maintenance Parts List
* Available at training (fee required) This parts list contains service parts
This guide contains maintenance necessary to maintain machine
information needed for maintenance performance.
personnel. Only those who have
received our training are permitted
to perform the tasks described in
this guide because a high skill level
is required to handle or overhaul the
maintenance parts. Machine data
accuracy must be readjusted after this
maintenance.
c CAUTION
The contents of these manuals are subject to change without prior notice. Please be sure to contact our sales office or
representative to obtain the latest information on part names and part numbers.
ii
2. Contents of each chapter
This manual is comprised of the following chapters.
Safety instructions
About this manual

This section provides safety instructions essential when using the machine.
About this manual
Chapter 1 Over view of board data

This chapter explains board data structures and registration.

This chapter describes the basic parameters for board data (board information, parts information, mark information, etc.),
as well as teach/trace functions.

Describes parameter settings needed to use optional units such as tray changers.

This chapter explains the advanced functions including:
• Board data optimization
• Convenient functions for creating data more efficiently. Using these functions may also help you improve the operation
efficiency.

This chapter describes the functions that are only available with the Editor.

This chapter describes how to make a backup of data, as well as how to make use of database.
Appendix
• Describes machine specifications.
• Describes the procedures for registering or changing the operators and passwords.
• Describes the function for simplifying the vision algorithm setting.
• Describes the functions for automatically tuning and creating part data.
Index
The index at the end of this manual helps you quickly find where necessary items are explained.
iii
3. Page layout
The description below shows a typical page layout used in this manual.
About this manual
Typical page layout
4.2 Finishing board production

To finish board production, follow these steps.
Step Stop machine operation.

There are four methods for stopping the machine.
Substep or 1. Emergency stop button:
description of step Press this button to trigger emergency stop. Do not use this button in normal operation.
2. [STOP] button (operation panel):
Pressing the [STOP] button stops the machine immediately. To resume operation, press the [START]
Chapter number 2 button on the operation panel.

3. [Cycle Stop] button:
Pressing this button stops the machine operation just after component mounting on the current
board has been completed.
4. [Convey-out stop] button:
Basic operation
Use this button when you want to finish production just after components have been mounted on
Chapter title the board currently on the conveyor. All boards on the conveyor are carried out after component
mounting, but new boards are not carried in from the upstream side.
Note, Caution
CAUTION
Do not press the emergency stop button during operation except in case of emergency.
or Warning Reset the operation.

Press the [RESET] button on the operation panel. The machine stops operation immediately and returns
to the board production standby status.
Press the [Off] button on the screen.

[Off] button
Figure, picture
or table caption
[Off] button
24226-P1-00
2-32
23001-P2-00
n Step
This describes the procedure for each operation.
n Substep or description of step

This provides detailed information on the steps in the procedure.
n Figure or table caption

This is the title of the figure or table and appears at the upper left.
n Note, Caution or Warning

These are explained in detail in "Safety instructions".
iv
Chapter 1 Overview of board data
Contents
1. Board data structure 1-1
2. Registering and selecting the board name 1-2

2.1 Registering board names 1-2
2.2 Selecting the board data 1-8
3. Flowchart for creating board data 1-10

1. Board data structure
The board data is indexed by each individual board name. Each board type consists of various information
and parameters as shown below. 1
Board data structure
overview of board data

Various parameters
Board
Mount
Offset
Fiducial
Board Badmark
Basic
Board data Parts Pick
Mount
Vision Parts Adjust mode

Mark
Shape
Tray
Option
Side-view camera
Basic
Shape
Vision Mark Adjust mode
23100-P2-00
TIP
Combined board data used for dual-lane machines is a single file of board data that contains two pieces of board
data.
1-1
2. Registering and selecting the board name
1 2.1 Registering board names
To create new board data for production, you must first register the board name. There are some methods for
registering a board name.
1. Registering a new board name

If no basic data is found in the previously registered board data. You should register a new board name with empty data
and then enter necessary data.
2. Utilizing board data already registered

Make a copy of board data which is already registered in the machine.
c CAUTION
Combined board data used for the dual lane cannot be newly created on the operation screen of the machine.
Combined board data can only be created with offline software "P-Tool". When producing boards using combined
board data, the data created with P-Tool must be loaded into the machine.
n The following steps explain the procedure in method 1, "Registering a new board name".
1 Press the [Create] button on the Setup screen.

The "Create Board Data" dialog box appears as shown below.
[Create] button
[Create] button
24100-P2-10
1-2
2 Enter a board name in the "Board Name" box on the [Create] tab.
Select a file format and enter a board name from the keyboard.
1
• When the file format is VIOS, enter the board name within 20 alphanumeric characters.
• When the file format is YGX, up to 260 alphanumeric characters can be entered, but about 40
characters are displayed in the status area.
n NOTE
The following characters can be used in board names.

abcdefghijklmnopqrstuvwxyzABCDEFGHIJKLMNOPQRSTUVWXYZ0123456789_
Spaces cannot be included in a board name. Use underbars instead.
c CAUTION
When a file format other than "YGX" is selected, some information cannot be stored. The functions regarding those
information might not be used.
Entering a board name

Enter board name and press [OK]. Select file format.
24101-P2-10
c CAUTION
An alert dialog appears if a board data with the same name has already been registered. Register it with another
board name in this case. Pressing the [OK] button on the alert dialog box will overwrite the existing board data.
3 Press the [OK] button.

The display returns to the Setup screen.
1-3
4 Save the new board data.
1. Press the [Save] button in the main menu button area.
The "Board data save" dialog box appears.
1 2. Check the drive, folder, and file format to save the board data, and then press the [Save] button in
the "Save board data" dialog box.
Saving the board data

[Save] button Check that the board name to be saved is displayed. [Save] button
24102-P2-10
n NOTE
VIOS format data should be saved in the "No 1" folder.
c CAUTION
When board data is saved in a format other than "YGX", some data such as "side-view camera setting" and "Nozzle
Touch Point Offset" parameter will not be stored.
1-4
■ The following steps explain the procedure in method 2, "Utilizing board data already registered".
1 Press the [Create] button on the Setup screen.

The "Create Board Data" dialog box appears.
2 Open the [Copy] tab and enter a board name in the "Board Name" box.
Select the file format and enter a board name from the keyboard.
1
• When the file format is VIOS, enter the board name within 20 alphanumeric characters.

• When the file format is YGX, up to 260 alphanumeric characters can be entered, but about 40
characters are displayed in the status area.
n NOTE
The following characters can be used in board names.
Spaces cannot be included in a board name. Use underbars instead.
c CAUTION
When a file format other than "YGX" is selected, some information cannot be stored. The functions regarding those
information might not be used.
Entering a board name
Enter board name. Select file format.
24103-P2-10
c CAUTION
An alert dialog appears if board data with the same name has already been registered. Register it with another board
name in this case. Pressing the [OK] button in the alert dialog box will overwrite the existing board data with the same
name.
1-5
3 Select the board data to be copied.
1. Press the [Select File] button on the right of the "Copy from other file" box.
The "Board data select" screen appears. Check the file location and file format.
1 2. Select the board data to be copied and press the [Select] button.
3. The display returns to the [Copy] tab after the board data is selected. The information on the
selected board data is displayed in the "Copy from other file" box.
Selecting the data to be copied

[Select File] button
Select file format.
Check "Location". Select board data.

24104-P2-10
1-6
4 Select the data to be copied.
Among the board data, parts data, and mark data, select the data you want to copy by pressing their
buttons.
Selecting data to be copied

1

Select data to be copied.
24105-P2-10
5 Press the [OK] button to start copying.

The display returns to the Setup screen when the copying is complete.
6 Save the board data.

1. Press the [Save] button in the main menu button area.
2. Check the location and file format to save the board data, then press the [Save] button.
n NOTE
VIOS format data must be saved in the "No 1" folder.
c CAUTION
When board data is saved in a format other than "YGX", some data such as "side-view camera setting" and "Nozzle
Touch Point Offset" parameter will not be stored.
1-7
2.2 Selecting the board data
Follow these steps to select the board data you already registered.
1 1 Press the [Board] button on the Setup screen.

The "Board data select" dialog box appears as shown below, showing the registered board list.
2 Select the board name.

1. Select the file format from the drop-down list.
In dual-lane machines, the [Lane] button is displayed on the "Board data select" screen, so press
that button to display the lane to be used for production. (When producing boards using both lanes,
select "Lane combination".)
Selecting the board name
[Folder] button [Board] button
Check "Location". Select board data. Select file format.

24106-P2-10
TIP
• Combined board data will be displayed when "Lane combination" is selected with the [Lane] button. Combined
board data is displayed along with an orange icon.
• When combined board data is selected, the board file name and board data name used for production on the
selected lane are displayed on the Setup screen.
1-8
2. Check that the folder containing board data is selected. (The path to the folder is shown in the
"Location" box.) If not, press the [Folder] button and select the folder that contains registered board
data and press the [OK] button.
Selecting the folder

1

Select the folder that contains registered board data and press the [OK] button.
24107-P2-10
3. Line up the cursor with the board data you want to select and press the [Select] button. The
selected board data is loaded and its name is displayed on the status bar of the operation screen.
Selected board name
Selected board name
24108-P2-10
1-9
3. Flowchar t for creating board data
1 The flowchart below shows the basic procedure for creating new board data.
Flowchart for creating board data

Perform shaded items

Create database as needed.
Register and select board name
Create parts information Register data in database
For fiducial mark

Create mark information Register data in database
For badmark
Clamp board
Create board information
Create block offset

information
Create mount information
Create fiducial mark information
Create local badmark information
Check and correct mounting positions
Perform test mounting and correct data
Back up data
To board production
23101-P2-00
1-10
Contents
1. Creating the board information 2-1

1.1 Board parameters 2-2
1.3 Offset parameters 2-9
1.4 Fiducial parameters 2-11
1.4.1 Board fiducial function 2-12
1.4.2 Block fiducial function 2-12
1.4.3 Local fiducial functions 2-13
2. Creating the component information 2-15

2.3 Pick parameters 2-30
2.7 Option parameters 2-42
2.8 Side-view camera parameters 2-43
3. Component recognition test 2-45

3.1 Parts Adjust mode 2-46
4. Creating the mark information 2-53

5. Mark recognition test 2-60

5.1 Mark Adjust mode 2-60
6. Editing the solder ball components 2-64

6.1 BGA 2-64
6.2 Flip Chip 2-68
6.2.1 Creating a random ball position (POS) information file 2-72
7. Teach and trace 2-74
7.1 Trace function 2-74
7.2 Auto trace function 2-77
7.3 Teaching function 2-78
7.3.1 Point teaching 2-78
7.3.2 Cursor teaching 2-82
7.3.3 Parts shape teaching 2-86
1. Creating the board information
Board information includes various parameters such as board size, production methods, and component
mounting positions.
This chapter describes the basic methods for creating board data. After you have obtained a complete
understanding of these methods, begin actual work according to the desired method.
Board information parameters
Data No.
Pattern Name Data No.
2
Type Pattern Name
Skip Type
Setting the board parameters

X, Y, R X, Y
Original Block No Mark
Original Block No
Data No.
Pattern Name
Type
Board Size XY
X1, Y1
Board Size Height
Mark 1
Board Comment
X2, Y2
Prod. Board Counter
Mark 2
Prod. Board Count Max.
Original Block No
Prod. Block Counter
Unloader Counter
Unloader Count Max. Data No.
Board Fix Device Pattern Name
Pre-Fix Timer Skip
Trans Height X, Y, R
Conveyor Timer sec P. No.
Alignment Part Name
Vacuum Check Table
Retry Sequence Head
Precede Pick Bad.
Conveyor Y Speed Fid.
Transfer Type Original Block No
Conveyor Motor Speed
Parts height Carry In
Skip Retry
Mount Interfere Check
Mount Sequence Method
Carried Pos. Check
Carried Pos. Check Value
Carried Pos. Check Detail Setting
Carried Pos. Check Mark
Carried Pos. Check Mark X
Carried Pos. Check Mark Y
Conveyor Transfer Way
Board Edge Pffset Lower Left
Board Edge Pffset Lower Right
Board Edge Pffset Upper Left
Board Edge Pffset Upper Right
23200-P2-40
TIP
When combined board data is selected on a dual-lane machine, the [Lane] button for lane selection is displayed.
Press the [Lane] button to select the lane and make or check settings for that lane.
2-1
1.1 Board parameters
Selecting the [Board] tab opens the screen that allows you to set or check the board parameters.
n NOTE
In the case of combined board data, the lane to be operated should first be selected with the [Lane] button before
making settings.
c CAUTION
When using combined board data, the following parameters can be edited separately for each lane: "A: Board Size",
2
"Board Size Y", "D: Comment", and "E to I" which are parameters for setting the number of boards. All other parameters
cannot be edited separately for each lane. When those parameters are edited even for one lane, they are applied to
both lanes, so used caution.
Board parameter screen

Dual lane: Example of combined board data

[Lane] button
24201-P2-50
TIP
Parameter items displayed on the screen slightly differ according to the machine model and specifications.
Mount Mode (Dual lane: combined board data)

Shows the part mounting method.
• Parallel Lanes
The front head mounts parts only on the front lane, while the rear head only on the rear lane.
• Alternate Lanes
Parts are alternately mounted on the boards on the front lane and rear lane.
Transfer Mode (Dual lane: combined board data)
Select the board transfer method.
• Synchronous Transfer
The part mounting start and end timings for the front and rear lanes are synchronized. This method cannot be used
when the "Mount Mode" parameter is set to "Alternate Lanes". Use this method to synchronize the board carry-out
timings on the front and rear lanes.
• Asynchronous Transfer
The part mounting start and end timings for the front and rear lanes are separately determined.
2-2
A, B: Board Size XY
Enter the length of the board in the XY directions in millimeters. The conveyor width (W-axis) will be adjusted according
to the Y length in automatic operation.
X: Length in the board flow direction
Y: Length in the conveyor width direction
Board Size
X [mm]
Y [mm]
Board
Board flow direction

Conveyor rail
23201-P2-00
C: Board Size Height

Enter the thickness of the board in millimeters.
D: Board Comment
Enter a comment for the board as necessary. You can leave this blank.
E: Prod. Board Counter
Enter the number of boards already produced. Set this value to "0" as a start.
F: Prod. Board Count Max.
Enter the number of boards that should be produced. When this is set to "0", the machine continues to produce boards as
long as they are fed into the machine. When set to other than "0", the machine stops after producing the specified
number of boards. The next board is not fed into the machine.
G: Prod. Block Counter
Enter the number of blocks on one board when producing multi-block boards. (multi-board panels)
H: Unloader Counter
Specify the number of boards transferred into the unloader. Set this value to "0" as a start.
I: Unloader Count Max.
Specify the number of boards that can be stored in one rack of the unloader. When the specified number of boards has
been produced and transferred out into the unloader, the machine stops transfer of the production board until the
unloader replaces the rack. If this is set to "0", the machine continues production without checking the number of boards
transferred out into the unloader. Enter "0" in the following cases.
• The unloader being used provides a rack switching signal output.
• This setting data is to be used for the machine just before reflowing.
J: Board Fix Device
Select "Edge Clamp" as the method for clamping a board. The board is secured on the conveyor with the board edge
clamp and push-up pins.
K: Pre-Fix Timer
The machine starts clamping the board immediately after it passes above the board sensor installed just before the main
stopper. The optimum clamp start timing (delay time with respect to the sensor detection) depends on the board size and
conveyor speed. Use this parameter to set the clamp start timing (0.0 to 1.9 sec.).
L: Trans Height
After components are mounted, the machine permits the conveyor to carry out the board when the push-up unit is
lowered. If components have already been mounted on the reverse side of the board, the push-up unit must be lowered
sufficiently to avoid interference from push-up pins with those components. This parameter specifies the height of the
push-up unit at which the conveyor is allowed to carry out each type of board. Enter the distance in millimeters from the
point where the push-up unit is raised to clamp the board. This distance can be 5 to 50mm.
2-3
M: Conveyor Timer sec
Set to "0.0" sec. for normal shape boards. If specially configured boards (for example, boards with cutout parts or
through-holes) are used and the exit sensor cannot detect them reliably, try setting this timer in the range of 0.0 to 9.9
sec. The conveyor motor continues turning for the specified time even after the board sensor turns off.
N: Alignment
Set to "UseAlign" to check the image of a component by vision recognition during component pickup.
O: Vacuum Check
Set to "Check" to check whether a component is being picked up, by detecting the vacuum level, as well as checking
2
with the vision system.
P: Retr y Sequence
Select the retry method to use when a pickup or recognition error occurs.
• "Group":
Retry is repeated with the head which caused an error, until component mounting specified as one group is complete.
• "Block":
Retry is performed with the head which caused an error after component mounting in one block is complete.
• "Auto":
Retry is performed with any free head after component mounting in one block is complete.
Q: Precede Pick
Set to "NotUse" in most cases. When set to "Use", the head assembly starts moving to pick up and recognize components
as soon as the preceding board has been carried out and the next board is carried in. This will shorten the cycle time.
R: Tray Priority
When tray components are supplied, setting this parameter to "Use" allows the machine to pick up and mount a tray
component according to the supply conditions so as to shorten the cycle time.
V: Conveyor Y Speed (This parameter is displayed only when using the machine with the dual-stage specifications.)
If components move or slide after mounted on the board due to the Y-axis movement, use this parameter to change the
conveyor Y-axis speed.
X: Conveyor Motor Speed
Change this parameter setting if you want to change the conveyor motor speed (board transport speed). The conveyor
motor speed can be increased up to "Standard+50%" (150% of "Standard" speed) or decreased down to "Standard-90%"
(10% of "Standard" speed) in 10% steps.
Y: Parts Height Carr y In (mm)
Set the maximum height of components already mounted on the board in the previous process.
When the head moves across the board, the head travels at a height higher than this setting so that it does not interfere
with any component on the board.
g: Skip Retr y
When a component pickup error or recognition error occurs or components run out, this parameter determines whether
to mount another type of components without retrying the component placement. Set to "Use" if using this function.
i: Mount Interfere Check
Set whether to use the adjacent interference check function.
If a nozzle picks up a component at a position largely deviated from the center of the component and placing that
component on a board may cause interference or contact with adjacent components mounted on the board, this adjacent
interference check function allows the nozzle to discard that component and then retry picking up another component.
Set to "Enable" when using this adjacent interference check function, or set to "Disable" when not using it.
c CAUTION
If the positional deviation is not improved even after retrying component pickup, then a component pickup error will
result. If this pickup error occurs repeatedly, check whether the components are properly supplied and the feeder is
securely installed.
TIP
This parameter is set to "Enable" after optimizing board data using offline software "P-Tool" under the conditions that
nozzle interference check is enabled.
2-4
n: Mount Sequence Method
This function specifies the mounting sequence to prevent interference between mounted components and the nozzle
when mounting narrow-pitch components. Either "Parts Group Number" or "Mount Group Number" can be selected.
However, "Mount Group Number" can be used only when board data has been checked by the P-Tool offline software's
"nozzle interference check".
• Parts Group Number
The mounting sequence is specified for each component group. This setting is selected when specifying the mounting
sequence manually.
• Mount Group Number
2
The mounting sequence is specified for each mount point group. This setting enables a better optimizing result.
However, it does not permit the mounting sequence to be specified manually.
TIP
The "Mount Group Number" can be obtained by performing the automatic group No. setting at the P-Tool (board
editor, optimizer) offline software's "nozzle interference check".

o: Carried Pos. Check (YSM40)
Enables/disables the conveyance position check. The standard setting is "Enable". When enabled, the board's position is
verified by the fiducial camera which checks the board's 1st fiducial mark before the conveyed board is secured.
p: Carried Pos. Check Value (mm) (YSM40)
Inputs the judgment value for the conveyance position check. The input value setting range is 0.0 to 5.0mm. An error
occurs if the board is outside the range specified here. (This parameter is enabled only if the "o: Carried Pos. Check" item
is set as "Enabled".)
q: Carried Pos. Detail Setting (YSM40)
Specified when there are no fiducial marks, etc. The standard setting is "Disabled". (This parameter is enabled only if the
"o: Carried Pos. Check" item is set as "Enabled".)
r: Carried Pos. Check Mark (YSM40)
Inputs the mark No. used for the conveyance position check detailed setting. The input value setting range is 0 to 128.
The recognition status of the mark used for the conveyance position check must be verified by performing a mark position
check, and the mark must then be registered in the mark information. (This parameter is enabled only if the "q: Carried
Pos. Detail Setting" item is set as "Enabled".)
s: Carried Pos. Check Mark X (mm) (YSM40)
Inputs the X-coordinate of the conveyance position check mark. (This parameter is enabled only if the "q: Carried Pos.
Detail Setting" item is set as "Enabled".)
t: Carried Pos. Check Mark Y (mm) (YSM40)
Inputs the Y-coordinate of the conveyance position check mark. (This parameter is enabled only if the "q: Carried Pos.
Detail Setting" item is set as "Enabled".)
u: Conveyor Transfer Way
The conveyor transfer method can be set for each board data. Select the desired method from among “Machine Setting”,
“Normal / Each (YSM40)” and “Fast / Quasi-Simul (YSM40)”.
• Machine Setting
This uses the transfer method that is specified by the machine setting (VmSpec).
• Normal
When component mounting on a board is finished, the finished board is unclamped and starts being transferred to the
conveyor exit. When the finished board has passed the WorkOut sensor on the conveyor, another board at the standby
position is conveyed into the component mounting position.
• Each (YSM40)
next stage or the downstream machine. When finished transferring the board, the next board is conveyed into the
component mounting position.
• Fast
conveyor exit. When the finished board is detected by the WorkOut sensor on the conveyor, another board at the
standby position is conveyed into the component mounting position. The main stopper rises when the finished board
has passed the WorkOut sensor.
• Quasi-Simul (YSM40)
next stage or the downstream machine. The distance between the finished board and the next board is automatically
calculated, and the next board is conveyed into the component mounting position if determined to be safe to do so.
2-5
In dual-lane machines, the same conveyor transfer method should be used for both lanes. If the “Board Transfer Way”
parameter setting is different for each lane, it will be indicated by red. In this case, the conveyor transfer method will be
set as follows:
Lane2
Board parameter Machie setting
Normal/Each Fast/Quasi-Simul Normal/Each Fast/Quasi-Simul
Lane1 Board parameter Normal/Each Normal/Each Normal/Each Normal/Each Normal/Each
2
Fast/Quasi-Simull Normal/Each Fast/Quasi-Simul Normal/Each Fast/Quasi-Simul
Machie setting Normal/Each Normal/Each Normal/Each Normal/Each ---
Fast/Quasi-Simul Normal/Each Fast/Quasi-Simul --- Fast/Quasi-Simul

n NOTE
In dual-lane machines, if the “Conveyor Transfer Way” parameter is different for each lane, it will be set to “Normal/
Each” to ensure safety.
TIP
The “Conveyor Transfer Way” or “Convey Type” (YSM40) parameter on the [Unit]-[Conveyor] screen shows the
conveyor transfer method specified by the machine setting, regardless of the board parameter setting.
x, y, z, 1: Board Edge Offset Lower Left/Lower Right/Upper Left/Upper Left (YSM40)

If the board edge cannot be detected by the board detection sensor due to board shape, press the [Offset Teach] button to
enter a distance from the board edge to the sensor detection position through teaching. The initial value is "0.0". When
the board edge offset function is not used, remain the initial value.
For details about how to set the board edge offsets, see "1.2 Using the board edge offset" in Chapter 4.
Board Edge Offset Lower Left/Lower Right/Upper Left/Upper Left
Board edge Board edge Board edge transfer direction (right m left)
Board
z 1
x y
Sensor detection position

23247-P2-00
n NOTE
• For boards to be used for the lane 1, set "x. Board Edge Offset Lower Left" and "y. Board Edge Offset Lower Right".
• For boards to be used for the lane 2, set "z. Board Edge Offset Upper Left" and "1. Board Edge Offset Upper Right".
2-6
1.2 Mount parameters
Selecting the [Mount] tab opens the screen for specifying the mount parameters such as mounting position data
and component numbers to be mounted.
n NOTE
In the case of combined board data, press the [Lane] button and select the lane to be used, and then make settings.
If "All lanes" is selected, no pattern names can be added.
2
Mount parameter screen
13 [Lane] button

1
2 3 4 5 6 7 8 9 10 11 12
24202-P2-40
1. Execute/Skip
Select "Exec." to mount components with this mount data, or select "Skip" to perform "pass operation" without picking up
and mounting components.
2. Pattern Name
Enter the land pattern name or symbol (ex., R23, U12, etc.) printed on the board.
3. Skip
Place a checkmark when not mounting a component at this mount point.
4. X, Y
For single boards, enter the XY coordinate data of the center of the mounting position relative to the board origin. For
multi-block boards (multi-board panels), enter the position data relative to the reference block. You can also use the
teaching function to enter the XY coordinate data as explained below.
Mounting position relative to board origin

Center of mounting position
Block 1 Block 2
Board origin Block repeat No.1

23204-P2-00
Teaching method for different components
Component type CHIP Tr. SOP QFP

Teaching method 1 or 2-point input 1-point input 2 or 4-point input 2 or 4-point input
Teaching point
: Teaching point
23205-P2-00
2-7
5. R
Enter the angle through which the component must be rotated after recognition before it is mounted on the board. When
the pickup angle is 0 deg., enter the rotating angle from the loading position, with the counterclockwise direction
specified as a plus value when viewed from above. When the pickup angle is 90 deg. or -90 deg., see the table below.
Mounting angle
Loading position
Pickup angle 90o -90o Plus Minus
2
Mounting angle 0o
180o
90o Clock
-90o
23206-P2-00
6. P. No., Part Name

Enter the component number (data No. in the component information) to be mounted. The component name will be input
automatically according to the component number.
7. Table (This parameter is displayed only when using the machine with multiple tables.)
Shows the component placement table.
8. Head
Enter the head number to be used for component mounting.
9. Bad (badmark)
Enter the number of the local badmark to be used for this mount data. Note that this setting is valid only when local
badmarks are set. Enter "0" here when not using the local badmark function.
10. Fid. (fiducial mark)
Enter the fiducial mark number (point, local or 4-point fiducial) to be used for this mount data. Note that this setting is
valid only when local fiducial marks are set. Enter "0" here when not using the fiducial function.
11. Lane (This parameter is displayed only when using the machine with the dual-lane specifications.)
Shows the lane used to mount parts with this board data using both lanes of a dual-lane machine.
12. Original Block No.
Shows the block No. that was automatically allocated to each block after block distribution (with note data) was
performed. For details on block distribution (with note data), refer to "3.3.1 Block offset distribution" in Chapter 5.
13. [Check Box] button
Pressing this button allows the "Skip" column to be edited. Pressing the [Check Box] button again grays out the "Skip"
column and making changes is not possible.
2-8
1.3 Offset parameters
Selecting the [Offset] tab opens the screen for setting the offset data for each block relative to the reference
block of a multi-block board (multi-board panel) consisting of two or more independent printed circuits of the
same type.
n NOTE
making settings.
Offset parameter screen

2 3 4 5 6 7 [Lane] button
2

1
24203-P2-20
1. Board Origin
On the top row in the grid display, enter the XY coordinates of the board origin. For standard machines with the front
conveyor rail fixed, the position where X=5mm and Y=5mm from the front left corner (downstream side) of the board is
specified as X=0.00 and Y=0.00.
Board origin
Y Y
Direction of board flow
5mm 5mm
Front conveyor rail fixed
X X
5mm 5mm
5mm 5mm
Rear conveyor rail fixed
5mm Y
Y 5mm
X X
23207-P2-00
2-9
When setting the board origin at another position as shown below, enter the XY position relative to the "X=5mm, Y=5mm"
coordinates.
Board origin
• Board origin is not at X=5mm, Y=5mm • Board origin is at the board corner
When setting the board origin
Y at this point, enter "X=7.00, Y=7.00". Y
Direction of Direction of
board flow board flow
2 7mm
5mm 5mm
X X
5mm 7mm 5mm
When setting the board origin at the corner of a

board in right-to-left flow (with the front rail fixed),
enter "X=-5.00, Y=-5.00".
23208-P2-00
2. Pattern Name
Enter the block name.
3. Type
The board origin is specified on the top row, and block offset data on the second and subsequent rows. (These cannot be
changed.)
4. Skip
Place a checkmark when not mounting components in this block.
5. XY
Enter the XY coordinates of the origin in each block relative to the board origin. You can use the [Teach] button to enter
the XY data or trace the specified data.
6. R
Enter the rotation angle of each block with respect to the reference block.
R data
Reference block direction Block

Block
Block
Block direction Block

Block
R data 0o 180o 90o -90o

23209-P2-00

Shows the block No. that was automatically allocated to each block when block distribution (with note data) was
2-10
1.4 Fiducial parameters
The fiducial function corrects local distortion or warps on a board that may occur from errors in machining the
board outline and locate pin holes, or board clamping mechanism fluctuations, using recognition results of the
fiducial marks provided on the board.
Selecting the [Fiducial] tab opens the screen for setting fiducial mark parameters and their coordinates. Set
these parameters as explained below when using the fiducial function. Two or four fiducial marks are used as
a set, but it is okay if each mark is different in shape. Fiducial mark data must be registered in the mark
information beforehand. (See "4. Creating the mark information" in this chapter.)
n
2
NOTE
making settings.
Fiducial mark parameter screen

4 5 6 7 8 9 10 [Lane] button
2
3
24208-P2-20
1. Board, Block, Local
Fiducial functions are broadly classified into three types: "Board" fiducial function specified for a board, "Block" fiducial
function specified for each block of a multi-block board, and "Local" fiducial function related to mounting data. The fiducial
function you want to use should be set to "Execute". To change the setting, press the [Edit] button on the right end.
2. Board
On the top row of the grid display, set the board fiducial mark data.
3. Block
On the second row, set the block fiducial mark data.
4. Pattern Name
Enter the fiducial mark name here. (Names cannot be entered on the top and second rows.)
5. Type
On the third or subsequent rows, specify the type of fiducial function you want to use, by selecting from among ""Point",
"Local", "4Local-M" and "4Local-S".
6. X1, Y1
Enter the XY coordinates of Mark 1 relative to the board origin in millimeter. You can teach the position using the [Teach]
button.
7. Mark 1
Enter the mark No. for Mark 1 (mark No. registered as fiducial mark in the mark information).
8. X2, Y2
Enter the XY coordinates of Mark 2 relative to the board origin in millimeter. You can teach the position using the [Teach]
button.
9. Mark 2
Enter the mark No. for Mark 2 (mark No. registered as fiducial mark in the mark information). When this mark is identical
with Mark 1, leave it at "0".
n NOTE
Although you can enter the XY coordinates of each mark by teaching, we recommend using the accurate design
data because the accuracy of these XY coordinate data affect the mounting accuracy.

Shows the block No. that was automatically allocated to each block when block distribution (with note data) was
2-11
1.4.1 Board fiducial function
The board fiducial function corrects the positioning error of the entire board by using a pair of fiducial marks.
This function is particularly effective in correcting the positioning error caused by board clamping mechanism
fluctuations. As shown in the figure below, a pair of fiducial marks must be diagonally located on the entire
board. Enter the XY coordinates (mm) of Mark 1 and Mark 2 relative to the board origin.
Board fiducial marks
Mark 2 (X2, Y2)
2 Mark 1 (X1, Y1)
Board origin
23212-P2-00
1.4.2 Block fiducial function

The block fiducial function corrects the positioning error of each block on a multi-block board (multi-board
panel), by using a pair of fiducial marks provided in the block. This function is particularly effective in
correcting the positioning error caused by board clamping mechanism fluctuations. As shown in the figure
below, a pair of fiducial marks must be diagonally located in each block. Enter the XY coordinates (mm) of
Mark 1 and Mark 2 relative to the board origin.
Block fiducial marks
Mark 1 (X1, Y1)

Mark 2 (X2, Y2)
Reference block origin Block repeat No.2
23213-P2-00
c CAUTION
The block fiducial function can only be used for board data (multi-board panel data using block offset function) with
"Block Offset" specified on the [Offset] tab grid.
2-12
1.4.3 Local fiducial functions
There are three kinds of local fiducial functions relating to mount data: "point fiducial", "local fiducial" and
"4-point fiducial" functions. These are generally called the local fiducial functions.
The local fiducial functions are used to enhance the local mounting position accuracy of individual mount
data, rather than improving the mounting position accuracy on an entire board or block as is done by the
board fiducial or block fiducial function.
1. Point fiducial function

The point fiducial function is used to enhance the mounting position accuracy only of a specific component. In general,
2
as the board size becomes larger, the land pattern layout tends to become inaccurate due to flexing, twist and expansion/
shrinking of the board. Therefore, the point fiducial function is effective when mounting QFP components with a fine
lead pitch on a large board. (Note that the board and block fiducial functions are not effective in this case, although they
are useful in correcting a positioning error caused by the board clamping fluctuations.)
The point fiducial function uses a set of two fiducial marks diagonally located across the land patterns on which you
want to improve mounting position accuracy. It is okay if these two marks are different in shape, but use the same marks

for the same type of component.
Point fiducial marks
Mounting center
Mark 1 (X1, Y1)
Mark 2 (X2, Y2)
23214-P2-00
2. Local fiducial function

The local fiducial function improves the mounting position accuracy of two or more components within a specified area,
by using a pair of fiducial marks. This function is also effective in correcting the mounting position errors when two or
more different types of boards are supplied on the same transfer pallet. The local fiducial marks must be arranged
diagonally across the specified area, but can be different in shape from each other.
Local fiducial marks
Mark 1 (X1, Y1)
Mark 2 (X2, Y2)
Board origin or block offset

23215-P2-00
2-13
3. 4-point fiducial function
The "4-point fiducial" function is used to enhance the mounting position accuracy by recognizing 4 fiducial marks
provided on a board. This function is effective in the following cases.
• Boards with 4 or more fiducial marks which meet the conditions
• Large boards
• Boards made of materials which tend to expand, flex or warp.
(paper phenol, paper, glass epoxy, other flexible materials)
The 4-point fiducial data settings are basically the same as those for point fiducial and local fiducial marks. However,
because the 4-point fiducial function requires 4 XY coordinate points, you must use two data rows ("4Local-M" and
2 "4Local-S") on the [Offset] tab grid in order to register one set of 4-point fiducial marks.
4-point fiducial marks
Mark 4
(200, 200)
Mark 3
(50, 150)
Mark 1 Mark 2
(0, 0) (50, 10) (200, 10)
Board origin
23216-P2-00
2-14
2. Creating the component information
This section explains how to create component data (parts data). Component data has various parameters
for each of the component names (parts names) registered as illustrated below. To set these parameters, it is
convenient to copy sample data of a component with a similar shape from the database and then edit only
the different parameters.
Component information parameters
Alignment Group
Alignment Type
Alignment Module Back, Fore
Light Main, Coax, Side
2
Required Nozzle Lighting Level
Package Auto Threshold

Feeder Type Comp. Threshold
Tape Type Comp. Tolerance
Feed Pitch Search Area
Feed Timer Offset Datum Angle
Feed Speed Comp. Intensity
Reel Diameter Size Multi MACS
Dump Way Offset Recognition
Retry Times
Conveyor Y speed
Database Number
Alternative Parts Side View Camera
Parts Group No. Bring Back Check
Use Feeder Optimize Part Thickness
Pick Pos Correction Reverse Check
Component name (parts name)

Comment
Feeder Set No. (Alignment Group) Package

Position Definition (Alignment Type) Feeder Type
X, Y Algorithm Comp Amount XY
Pick Angle Body Size XY Comp Pitch XY
Pick Height Body Size Z Current Pos XY
Pick Timer sec Ruler Offset Tray Amount XY
Pick Speed Ruler Width Tray Pitch
XY Speed Lead Width Tray Height
Pick&Mount Vacuum Check Lead Number etc.
Pick Vacuum Lead Pitch
Pick Start ReflectLL
Pick Action etc.
Pick Tango
Mount Height
Pick Down
Mount Timer sec
Pick Up
Mount Speed
Force Control
XY Speed
Target Load
Pick&Mount Vacuum Check
Nozzle Touch Point Offset
Mount Vacuum
Mount Action
Mount Tango
Mount Down
Mount Up
Force Control
Target Load
Nozzle Touch Point Offset
23217-P2-30
TIP
Parameters displayed somewhat differ depending on the machine specifications and the selected component type
and package style.
2-15
2.1 Creating procedure
After selecting the board name, press the [Parts] button in the main menu button area to open the component
information screen. Enter the component name and comment in the data No. list on the upper part of the
screen, and set the parameters in the right lower list, as explained below.
1 Press the [Parts] button to open the component information screen.

Component information screen
2
Step 1 Step 2 Step 3 Step5
Step 4
Step 7
24209-P2-00
2 Enter the component name in the "Parts Name" column.

Enter the name printed on the tape reel or on the component itself within 19 alphanumeric characters.
n NOTE
The following characters can be used in component names.
abcdefghijklmnopqrstuvwxyzABCDEFGHIJKLMNOPQRSTUVWXYZ0123456789_!#$%&'¥+-=@(){}[]:.`^~*<>?/|;
Spaces cannot be included in a component name. Use underbars instead.
3 Enter a comment.
Type any desired comment in the "Parts Comment" column as necessary. You can omit entering
comments here.
4 Set the parameters.

While selecting the [Basic], [Pick], [Mount], [Vision], [Shape] tabs etc., set the necessary parameters in
the right lower list.
5 Adjust the parameters in the Parts Adjust mode.

Press the [Adjust] button to open the Parts Adjust screen that allows you to adjust or check the
parameters of the selected component. (For more details, see "3.1 Parts Adjust mode" in this chapter.)
6 Repeat steps 2 to 5 for other components.

Repeat the same procedure from steps 2 to 5 to register all components to be mounted on the board.
7 Save the data.

Press the [Save] button to store the data.
2-16
2.2 Basic parameters
Basic parameters

24210-P2-10
A: Alignment Group
Select from "Chip", "Ball", "IC", "Connector" or "Special".
B: Alignment Type
Specify the type of component by referring to the descriptions below.
n Chip
• Std.Chip (Standard chip)
This setting does not identify the component, but detects the four corners of the component and then calculates the
center and angle of the component. Select this setting first when recognizing box type chips. If the component cannot
be recognized by this setting, try using "Sp.Chip" or "Small Chip".
• Melf Chip
This is specially for Melf chips.
• Bare Chip
This is specially for bare chips.
• Cylinder
This is suited for components with a cylindrical shape and no direction.
• Sp.Chip (Special chip)
This setting has a parameter used to recognize "Lead Width" in addition to the "Std.Chip" setting. Select this to
recognize box type chips which cannot be recognized correctly by the "Std.Chip" setting. If it is still difficult to
recognize the component by this setting, try with "Odd.2Ends".
• Small Chip
This is suited for small chip components such as 0603 whose light-reflecting area is smaller than the actual size.
2-17
n Reference: Alignment Type (Chip components)
Component type Alignment Type
Normal box type chip Std.Chip
Box type chip not recognized by "Std.Chip" since

Sp.Chip
its lead width does not match the outline.
2
Box type chip
Box type chip whose lead width does not match the
chip width, such as tantalum capacitor (Lead width Odd.2Ends
and length should be specified.) Lead width
Small chip component such as 0603 whose

reflecting area is recognized to be smaller than Small Chip
actual component size
Melf chip component Melf Chip

Cylindrical chip
(Melf type) Cylindrical component fed with flat sides facing

up and down, and recognized as a circular or oval Cylinder
shape
Bare chip Normal bare chip Bare.Chip
n Ball
• Simple BGA
This is specially for BGA components. The number of solder balls can be checked, but the solder ball positions and
nicks are not checked.
• BGA
This is specially for BGA components. The solder ball positions can be edited to check the solder ball positions and
nicks.
• FlipChip
This is specially for flip chip components and can be used only when a vision camera unit with a side lighting unit is
used.
n Reference: Alignment Type (Ball components)
BGA
Normal BGA
Simple BGA
BGA Flip chip FlipChip
Mold body is shiny type such as ceramic Odd.Chip
n IC
• 2Ends
This setting has a parameter used for recognizing the lead width and length in addition to the "Std.Chip" setting. Select
this setting to recognize box type chips which cannot be recognized by "Std.Chip" and "Sp.Chip".
• Mini Tr/SOT
This is suitable for mini mold components with the same shape leads in the N and S direction, but whose number of
leads in each direction is different.
2-18
• P-Tr
This is suitable for components having leads in the N and S direction, and whose number of leads in each direction is
different like "Mini-Tr/SOT", and also the shape of opposing leads is different.
• SOP
This is suitable for components having the same shape leads and same number of leads in the E and W direction, and
whose leads protrude out from the molded body.
• SOJ
This is suitable for components having the same shape leads and same number of leads in the E and W direction like
"SOP", but whose leads do not protrude out from molded body.
• QFP
2
This is suitable for components having the same shape leads in four directions of N, S, E and W, and the same number
of oppositely positioned leads (N to S and E to W), and whose lead protrudes out from molded body.
• PLCC
This is suitable for components having the same shape leads in four directions of N, S, E and W, and the same number
of oppositely positioned leads (N to S and E to W) like "QFP", but whose leads do not protrude out from molded body.
• OffLead

This is used for components which can be defined by "Con-NSEW" but some of the leads are not present. Input this
setting for each direction.
n Connector
• Con-E (Connector E)
This is for components having the same leads only in the E direction.
• Con-NSEW (Connector NSEW)
This setting is suited for components having leads in four directions of N, S, E and W, but the number of leads and their
shape in each direction are different. Only one type of lead shape can be set for each direction.
• Odd.Con
Use this setting for connectors suitable for "Con-E" having off leads.
n Reference: Alignment Type (IC/ Connector)
Component with leads

Component with leads protruding from one
protruding from one Con-E
direction.
direction.
Component with leads Oppositely positioned lead shapes are the same Mini-Tr/SOT
protruding from two
directions and the number
of leads oppositely
positioned is different. Oppositely positioned lead shapes are different P-Tr
Leads are formed into a gull-wing and protrude out

Component with leads SOP
from molded body
protruding from two
of leads oppositely
Leads are formed into a J-shape and do not
positioned is the same. SOJ
protrude out from molded body
Leads are formed into a gull-wing and protrude out

Component with leads QFP
from molded body
protruding from four
of leads oppositely
Leads are formed into a J-shape and do not
positioned is the same. PLCC
protrude out from molded body
Component with leads Lead shape differs in each direction Con-NSEW

protruding from four
of leads oppositely
positioned is different. No lead is present in part of lead side OffLead
2-19
n Special
• Special
This is suitable for components having irregularly arranged leads. For example, components having leads in four
directions of N, S, E and W like "Con-NSEW", but whose number of leads and the shape in each direction are different.
Although "Con-NSEW" allows setting only one type of lead shape in each direction, "Special" allows setting two types,
making it usable for various components with irregular shapes. This setting cannot be used with the lead coplanarity
detection.
• Odd.Chip
This setting automatically determines whether to recognize a component as "white" or "black", making it suited for
components such as bare chips which are difficult to judge as reflective or non-reflective against the background
2
(board). This setting is also appropriate for BGA components with a light reflective portion on the body.
• AsMark
This setting recognizes components as a mark and is therefore suited for specially shaped components.
• Sp. Quad
This is used for square or rectangular components which reflect light at the four sides of the package making it difficult
to distinguish the leads from the package.
• Gravity
This detects the center-of-gravity of a target (black or white) in the specified area, allowing reliable recognition of
various components with irregular shapes. When using this setting, test-mount the component after setting the data,
and check the mounting shift (distance from center of mounting position to center of the component). Then enter the
shift amounts in "Cntr. Offset XYR" on the [Shape] tab.
• Ignore
This does not perform image processing.
n Reference: Alignment Type (Special)
Component type Alignment Type Algorithm/Base Alignment
Protrusion on lead detection section makes

Special Special 1 Special
recognition of connector E unstable.
Zigzag with fixed leads Special Special 1 Special
SOJ component leads are detected at the base not

Special Special 1 SOJ
the tip.
Cannot detect leads with mismatched pitch/width

during lead detection.
Lead is detected at the base and not the tip.

Cannot detect leads with mismatched pitch/width.
2-20
C: Required Nozzle
Select the optimum nozzle that matches the component size from among the nozzle types for chip components. When
the parameter values are copied from the YAMAHA database, use the default setting.
n Typical components and suitable nozzles (YS12, YS12P, YS12F, YS24, YS24X)
Size (mm) Nozzle type

Component
L W T Standard type Narrow adjacent type
Box type chip 0.40 0.20 0.13 - 310A, 311A

0.60 0.30 0.25 301A 311A
2
1.00 0.50 0.35 301A 312A
1.60 0.80 0.45 302A 313A
2.00 1.25 0.50 302A 313A
3.20 1.60 0.60 302A 313A
3.20 2.50 2.00 303A 313A

4.50 3.20 3.20 303A 314A
2.00 1.25 302A, 306A 317A
Cylindrical chip 3.45 1.35 302A, 306A 317A
(Melf type component)
6.00 2.50 306A 317A
0.40 0.20 0.20 - 310A
0.60 0.30 0.30 301A 311A
1.00 0.50 0.50 301A 312A
1.60 0.80 0.50 302A 312A
Ceramic capacitor 2.00 1.25 1.25 302A 313A
3.20 1.60 1.25 302A 313A
3.20 2.50 1.50 303A 313A
4.50 3.20 1.90 303A 314A
5.60 5.00 1.90 303A 314A
3.40 1.50 302A 312A
Melf type capacitor
6.00 2.50 306A 317A
2.90 1.60 1.60 302A 312A
3.80 2.90 1.60 303A 314A
Tantalum electrolytic capacitor 4.70 2.60 2.10 303A 314A
6.00 3.20 2.50 303A 314A
7.30 4.30 2.80 303A 314A
4.30 4.30 5.70 303A 314A
Aluminum electrolytic capacitor
6.60 6.60 5.70 303A 314A
Film capacitor 7.30 5.30 3.25 303A 314A
3.20 2.50 2.00 302A 313A
Chip inductor
4.50 3.20 3.20 303A 314A
Semi-variable resistor 4.50 3.80 2.40 303A 314A
2.90 1.50 1.10 302A 313A
Mini-mold transistor
4.00 3.00 1.80 303A 314A
Power transistor 4.60 2.60 1.60 303A 314A
SOP (6 to 28 pins) 6 pin 5.00 4.50 1.50 303A 314A
10 pin 7.60 4.50 1.50 303A 314A
12 pin 10.10 4.50 1.50 303A 314A
20 pin 12.60 5.70 1.50 303A 314A
24 pin 15.30 7.50 2.00 304A 315A
28 pin 17.80 7.50 2.00 304A 315A
PLCC 5×5 to 14×14 303A 314A
10×10 to 32×32 * 1 304A 315A
32×32 to 45×45 * 2 307A 318A
QFP/BGA/CSP 6×6 to 14×14 303A 314A
QFP/BGA 10×10 to 32×32 * 1 304A 315A
32×32 to 45×45 * 2 307A 318A
Connector 5×5 to 10×10 303A, 304A 315A
*1: YS12 handles sizes only from 10mm sq to 20mm sq. *2: These sizes can only be handled by YS24X.
2-21
n Typical components and suitable nozzles (YS100)

Component
Box type chip 0.40 0.20 0.13 - - 310A, 311A 311F

0.60 0.30 0.25 301A 301F 311A 311F
1.00 0.50 0.35 301A 301F 312A 312F
1.60 0.80 0.45 302A 302F 312A 312F
2.00 1.25 0.50 302A 302F 313A 313F
2
3.20 1.60 0.60 302A 302F 313A 313F
3.20 2.50 2.00 302A 302F 313A 313F
4.50 3.20 3.20 303A 303F 314A 314F
Cylindrical chip 2.00 1.25 302A, 306A 302F 317A -
3.45 1.35 302A, 306A 302F 317A -
6.00 2.50 306A - 317A -

Ceramic capacitor 0.40 0.20 0.20 - - 310A -
0.60 0.30 0.30 301A 301F 311A 311F
1.00 0.50 0.50 301A 301F 312A 312F
1.60 0.80 0.50 302A 302F 312A 312F
2.00 1.25 1.25 302A 302F 313A 313F
3.20 1.60 1.25 302A 302F 313A 313F
3.20 2.50 1.50 302A 302F 313A 313F
4.50 3.20 1.90 303A 303F 314A 314F
5.60 5.00 1.90 303A 303F 314A 314F
Melf type capacitor 3.40 1.50 302A 302F 312A 312F
6.00 2.50 306A - 317A -
Tantalum electrolytic capacitor 2.90 1.60 1.60 302A 302F 313A 313F
3.80 2.90 1.60 303A 303F 314A 314F
4.70 2.60 2.10 303A 303F 314A 314F
6.00 3.20 2.50 303A 303F 314A 314F
7.30 4.30 2.80 303A 303F 314A 314F
Aluminum electrolytic capacitor 4.30 4.30 5.70 303A 303F 314A 314F
6.60 6.60 5.70 303A 303F 314A 314F
Film capacitor 7.30 5.30 3.25 303A 303F 314A 314F
Chip inductor 3.20 2.50 2.00 302A 302F 313A 313F
4.50 3.20 3.20 303A 303F 314A 314F
Semi-variable resistor 4.50 3.80 2.40 303A 303F 314A 314F
Mini-mold transistor 2.90 1.50 1.10 302A 302F 313A 313F
4.00 3.00 1.80 303A 303F 314A 314F
Power transistor 4.60 2.60 1.60 303A 303F 314A 314F
SOP (6 to 28 pins) 6 pin 5.00 4.50 1.50 303A 303F 314A 314F
10 pin 7.60 4.50 1.50 303A 303F 314A 314F
12 pin 10.10 4.50 1.50 303A 303F 314A 314F
20 pin 12.60 5.70 1.50 303A 303F 314A 314F
24 pin 15.30 7.50 2.00 304A - 315A -
28 pin 17.80 7.50 2.00 304A - 315A -
PLCC 5×5 to 10×10 303A 303F 314A 314F
10×10 to 20×20 304A - 315A -
20×20 to 45×45 305A - 316A -
QFP 5×5 to 10×10 303A 303F 314A 314F
10×10 to 20×20 304A - 315A -
20×20 to 45×45 305A - 316A -
Connector 5×5 to 10×10 303A 303F 314A 314F
10×10 to 20×20 304A - 315A -
20×20 to 45×45 305A - 316A -
BGA 10×10 to 20×20 304A - 315A -
20×20 to 45×45 305A - 316A -
2-22
n Typical components and suitable nozzles (YS88)
Size (mm)
FNC head
Component
L W T No.1, 2, 3
Box type chip 0.60 0.30 0.23 221F

1.00 0.50 0.35 221F
1.60 0.80 0.45 222F, 229F
2.00 1.25 0.50 222F, 229F
3.20 1.60 0.60 222F, 229F
2
Cylindrical chip 2.00 1.25 222F
3.45 1.35 222F
Ceramic capacitor 0.60 0.30 0.30 221F
1.00 0.50 0.50 221F
1.60 0.80 0.80 222F, 229F
2.00 1.25 1.25 222F, 229F

3.20 1.60 1.25 222F, 229F
3.20 2.50 1.50 223F
4.50 3.20 1.90 223F
5.60 5.00 1.90 223F
Melf type capacitor 3.40 1.50 222F
Tantalum electrolytic capacitor 2.90 1.60 1.60 222F, 229F
3.80 2.90 1.60 223F
4.70 2.60 2.10 223F
6.00 3.20 2.50 223F
7.30 4.30 2.80 223F
Aluminum electrolytic capacitor 4.30 4.30 5.70 223F
6.60 6.60 5.70 223F
10.00 10.00 10.50 224F
Film capacitor 7.30 5.30 3.25 223F
Chip inductor 3.20 2.50 2.00 222F, 229F
4.50 3.20 3.20 223F
Semi-variable resistor 4.50 3.80 2.40 223F
Mini-mold transistor 2.90 1.50 1.10 222F, 229F
4.00 3.00 1.80 223F
Power transistor 4.60 2.60 1.60 223F
SOP (6 to 28 pins) 6pin 5.00 4.50 1.50 223F
10pin 7.60 4.50 1.50 223F
12pin 10.10 4.50 1.50 223F
20pin 12.60 5.70 1.50 223F
24pin 15.30 7.50 2.00 224F
28pin 17.80 7.50 2.00 224F
PLCC 5×5 to 10×10 223F
10×10 to 20×20 224F
20×20 to 45×45 225F
QFP 5×5 to 10×10 223F
10×10 to 20×20 224F
20×20 to 45×45 225F
Connector 5×5 to 10×10 223F
10×10 to 20×20 224F
20×20 to 45×45 225F
BGA 10×10 to 20×20 224F
20×20 to 45×45 225F
n NOTE
If using a custom nozzle (available from YAMAHA as option) designed for the connector, select the corresponding
type from among "Sp. Nozzles A to F". In other cases, select the optimum nozzle that matches the connector size from
among the nozzle types for SOP components.
2-23
n Typical components and suitable nozzles (YC8)
Size (mm)
“Required Nozzle”
Component Nozzle type
L W T setting
3.20 to 4.50 2.50 to 3.20 1.50 to 1.90 Type 63 For 4532 Chp
Ceramic capacitor
5.60 5.00 1.90 Type 63 For 5650 Chp
3.80 2.90 1.60 Type 63 For 4532 Chp
4.70 2.60 2.10 Type 63 For 5650 Chp
Tantalum electrolytic capacitor
6.00 3.20 2.50 Type 63 For 7343 Chp
2
7.30 4.30 2.80 Type 63 For 7343 Chp
4.30 4.30 5.70 Type 63 For ALC S
Aluminum electrolytic capacitor 6.60 6.60 5.70 Type 63 For ALC M
10.00 10.00 10.50 Type 64 For QFP 20mm
Chip film capacitor 7.30 5.30 3.25 Type 63 For 7343 Chp
3.20 2.50 2.00 Type 63 For 4532 Chp
Chip inductor
4.50 3.20 3.20 Type 63 For 4532 Chp
Semi-fixed trimmer 4.50 3.80 2.40 Type 63 For VR L
Mini-mold transistor 4.00 3.00 1.80 Type 63 For 4532 Chp
Power transistor 4.60 2.60 1.60 Type 63 For 5650 Chp
5.00 4.50 1.50 Type 63 For SOP 10mm
7.60 4.50 1.50 Type 63 For SOP 10mm
10.10 4.50 1.50 Type 63 For SOP 20mm
SOP (6 to 28 pins)
12.60 5.70 1.50 Type 63 For SOP 20mm
15.30 7.50 2.00 Type 64 For SOP 30mm
17.80 7.50 2.00 Type 64 For SOP 30mm
5×5 to 10×10 Type 63 For QFP 10mm
PLCC 10×10 to 32×32 Type 64 For QFP 20mm
QFP 10×10 to 32×32 Type 64 For QFP 20mm
2-24
n Typical components and suitable nozzles (YSM40 MU head and HS head)

Component HEAD
Box type chip MU/HS 0.40 0.20 0.13 510A 510A

MU/HS 0.60 0.30 0.25 501A 511A
MU/HS 1.00 0.50 0.35 501A 512A
MU/HS 1.60 0.80 0.45 502A 513A
MU/HS 2.00 1.25 0.50 502A 513A
2
MU/HS 3.20 1.60 0.60 502A 513A
MU/HS 3.20 2.50 2.00 503A 513A
MU 4.50 3.20 3.20 503A 514A
MU 2.00 1.25 502A, 506A 518A
Cylindrical chip MU 3.45 1.35 502A, 506A 518A
MU 6.00 2.50 506A 518A

MU/HS 0.40 0.20 0.20 510A 510A
MU/HS 0.60 0.30 0.30 501A 511A
MU/HS 1.00 0.50 0.50 501A 512A
MU/HS 1.60 0.80 0.50 502A 512A
Ceramic capacitor MU/HS 2.00 1.25 1.25 502A 513A
MU/HS 3.20 1.60 1.25 502A 513A
MU/HS 3.20 2.50 1.50 503A 513A
MU 4.50 3.20 1.90 503A 514A
MU 5.60 5.00 1.90 503A 514A
MU/HS 3.40 1.50 502A 512A
Melf type capacitor
MU 6.00 2.50 506A 517A
MU/HS 2.90 1.60 1.60 502A 512A
MU 3.80 2.90 1.60 503A 514A
Tantalum electrolytic capacitor MU 4.70 2.60 2.10 503A 514A
MU 6.00 3.20 2.50 503A 514A
MU 7.30 4.30 2.80 503A 514A
MU 4.30 4.30 5.70 503A 514A
MU 6.60 6.60 5.70 503A 514A
Film capacitor MU 7.30 5.30 3.25 503A 514A
MU/HS 3.20 2.50 2.00 502A 513A
Chip inductor
MU 4.50 3.20 3.20 503A 514A
Semi-variable resistor MU 4.50 3.80 2.40 503A 514A
MU/HS 2.90 1.50 1.10 502A 513A
MU 4.00 3.00 1.80 503A 514A
Power transistor MU 4.60 2.60 1.60 503A 514A
SOP (6 to 28 pins) 6 pin MU 5.00 4.50 1.50 503A 514A
10 pin MU 7.60 4.50 1.50 503A 514A
12 pin MU 10.10 4.50 1.50 503A 514A
20 pin MU 12.60 5.70 1.50 503A 514A
24 pin MU 15.30 7.50 2.00 504A 515A
28 pin MU 17.80 7.50 2.00 504A 515A
PLCC MU 5×5 to 14×14 503A 514A
MU 10×10 to 32×32 504A 515A
MU 32×32 to 45×45 507A 318A
QFP/BGA/CSP MU 6×6 to 14×14 503A 514A
QFP/BGA MU 10×10 to 32×32 504A 515A
MU 32×32 to 45×45 507A 518A
Connector MU 5×5 to 10×10 503A, 504A 515A
2-25
n Typical components and suitable nozzles (YSM40 FL head)

Component
L W T Standard type
Box type chip 0.40 0.20 0.13 Custom nozzle

0.60 0.30 0.25 61A
1.00 0.50 0.35 61A
1.60 0.80 0.45 62A
2.00 1.25 0.50 62A
2
3.20 1.60 0.60 62A
3.20 2.50 2.00 62A
4.50 3.20 3.20 63A
Cylindrical chip 2.00 1.25 62A
3.45 1.35 62A
6.00 2.50 66A *1

Ceramic capacitor 0.40 0.20 0.20 Custom nozzle
0.60 0.30 0.30 61A
1.00 0.50 0.50 61A
1.60 0.80 0.50 62A
2.00 1.25 1.25 62A
3.20 1.60 1.25 62A
3.20 2.50 1.50 62A
4.50 3.20 1.90 63A
5.60 5.00 1.90 63A
Melf type capacitor 3.40 1.50 62A
6.00 2.50 66A *1
Tantalum electrolytic capacito 2.90 1.60 1.60 62A
3.80 2.90 1.60 63A
4.70 2.60 2.10 63A
6.00 3.20 2.50 63A
7.30 4.30 2.80 63A
Aluminum electrolytic 4.30 4.30 5.70 63A
capacitor
6.60 6.60 5.70 63A
Film capacitor 7.30 5.30 3.25 63A
Chip inductor 3.20 2.50 2.00 62A
4.50 3.20 3.20 63A
Semi-variable resistor 4.50 3.80 2.40 63A
Mini-mold transistor 2.90 1.50 1.10 62A
4.00 3.00 1.80 63A
Power transistor 4.60 2.60 1.60 63A
SOP 6~28pin 6 pin 5.00 4.50 1.50 63A
10 pin 7.60 4.50 1.50 63A
12 pin 10.10 4.50 1.50 63A
20 pin 12.60 5.70 1.50 63A
24 pin 15.30 7.50 2.00 64A
28 pin 17.80 7.50 2.00 64A
PLCC 5×5 to 14×14 63A
10×10 to 32×32 64A
32×32 to 45×45 65A
QFP/BGA/CSP 6×6 to 14×14 63A
QFP/BGA 10×10 to 32×32 64A
32×32 to 45×45 65A
Connector 5×5 to 10×10 63A, 64A
*1: The Type 66A nozzle is a nonstandard special-order item.
2-26
n Typical components and suitable nozzles (Z:LEX(YSM20) HM/FM head)

Component
Box type chip 0.40 0.20 0.13 310A / 3010A 310A / 3110A
0.60 0.30 0.25 301A 311A
1.00 0.50 0.35 301A 312A
1.60 0.80 0.45 302A 312A
2.00 1.25 0.50 302A 313A
2
3.20 1.60 0.60 302A 313A
3.20 2.50 2.00 302A 313A
4.50 3.20 3.20 303A 314A
2.00 1.25 302A, 306A 317A
Cylindrical chip 3.45 1.35 302A, 306A 317A
6.00 2.50 306A 317A

0.40 0.20 0.20 310A / 3010A 310A / 3110A
0.60 0.30 0.30 301A 311A
1.00 0.50 0.50 301A 312A
1.60 0.80 0.50 302A 312A
Ceramic capacitor 2.00 1.25 1.25 302A 313A
3.20 1.60 1.25 302A 313A
3.20 2.50 1.50 302A 313A
4.50 3.20 1.90 303A 314A
5.60 5.00 1.90 303A 314A
3.40 1.50 302A 312A
Melf type capacitor
6.00 2.50 306A 317A
2.90 1.60 1.60 302A 313A
3.80 2.90 1.60 303A 314A
Tantalum electrolytic capacitor 4.70 2.60 2.10 303A 314A
6.00 3.20 2.50 303A 314A
7.30 4.30 2.80 303A 314A
4.30 4.30 5.70 303A 314A
6.60 6.60 5.70 303A 314A
Film capacitor 7.30 5.30 3.25 303A 314A
3.20 2.50 2.00 302A 313A
Chip inductor
4.50 3.20 3.20 303A 314A
Semi-variable resistor 4.50 3.80 2.40 303A 314A
2.90 1.50 1.10 302A 313A
4.00 3.00 1.80 303A 314A
Power transistor 4.60 2.60 1.60 303A 314A
SOP (6 to 28 pins) 6 pin 5.00 4.50 1.50 303A 314A
10 pin 7.60 4.50 1.50 303A 314A
12 pin 10.10 4.50 1.50 303A 314A
20 pin 12.60 5.70 1.50 303A 314A
24 pin 15.30 7.50 2.00 304A 315A
28 pin 17.80 7.50 2.00 304A 315A
PLCC 5×5 to 14×14 303A 314A
10×10 to 32×32 304A 315A
32×32 to 45×45 307A 318A
QFP/BGA/CSP 6×6 to 14×14 303A 314A
QFP/BGA 10×10 to 32×32 304A 315A
32×32 to 45×45 307A 318A
Connector 5×5 to 10×10 303A, 304A 315A
2-27
D: Package
Select the type of component feed.
• "Tape"
Select this setting when using a tape feeder which supplies components on paper tape, embossed tape or adhesive
tape.
• "Stick"
Select this setting when using a wide multi-stick feeder.
• "Tray"
Select this setting when using an external component supply unit such as sATS, sATSII, ATS15, cATS and dYTF.
2
E: Feeder Type
Shows the feeder type to be used for component supply.
This parameter is automatically set when "R: Tape Type" is specified.
R: Tape Type
Set this parameter when "D: Package" is set to "Tape".
Select the tape type from the drop-down list, and "E: Feeder Type" is automatically set. See the table below to make the
correct setting.
"Package" "Tape Type" "Feeder Type" Tape feeder type
Tape 8mm 8mmTape 8mm tape feeder (including 8mm 1005 and 0603)
12mm 12mmLongPitch 12mm tape feeder (including 12mm emboss)
16mm 16mmEmboss 16mm tape feeder
4mm 4mmTape 4mm tape feeder
Select these settings when using a tape feeder

other than above feeders.
Tape A - D Tape A - D
Note that you must make necessary settings in
"Feeder specification information".
Spare 1 - 10 Spare 1 -10
F: Pitch Index
Select the component feed pitch from the drop-down list.
n NOTE
This parameter is not displayed when the "Reference of feeder pitch" parameter in machine data is set to "Feeder
setup".
2-28
P: Feed Speed
Select the tape feed speed from the drop-down list.
Q: Reel Diameter Size
Specify the tape reel diameter. (This parameter appears when "R: Tape Type" is set to "8mm".) Select "7 inch" or "Large
(Over 7 inch)".
This setting will be used for data optimization to determine whether the tape reel can be installed or not.
TIP
Seven-inch reels of 8mm tape components can be installed either in the upper or lower position of a feeder cart's reel
holder, while large diameter (over 7 inches) reels can only be installed in the lower position of the feeder cart's reel
2
holder.
Components other than 8mm tape components can only be installed in the lower position of the feeder cart's reel
holder.
T: Feed Timer Offset

Specify the vibration time (component transfer time) of the feeder. (This parameter appears when "E: Feeder Type" is set to

"MultiStick" or "WideMultiStk".)
The default parameter is "Normal (0)" and it vibrates for 2 seconds. Set a parameter within the range of +4.0 to -3.5
depending on the condition of component.
G: Dump Way
This specifies the location where a component will be dumped if an error such as recognition error has occurred. Set to
"Dump POS" for chip components and small components. Set to "Sp. Dump Back" for tray components if you want to
return them to the tray. When a QFP dump station (option) is used, set to "Station".
H: Retr y Times
This determines how many times the machine will retry the same operation if an error such as a recognition error has
occurred. The number of retries can be set from "NO RETRY" to "14". When this retry setting is greater than the machine
data retry setting, the machine data has priority.
I: Conveyor Y speed (This parameter is displayed only when using the machine with the dual-stage specifications.)
If components tend to move or slide (such as tall components) just after mounted on the board due to the Y-axis
movement, set this parameter to a lower speed to prevent it. Select the optimum speed from among
"FAST", "MIDDLE","SLOW" and "VERY SLOW".
J: Database Number
Shows the database number when the parameter values were copied from the database.
When you want to copy the parameter values from the database, press the [Database] button to open the database list.
Then select the copy source data and press the [Set] button to make a copy.
Database list
Press this button.

24211-P2-00
2-29
2.3 Pick parameters
Pick parameters
2
24212-P2-00
A: Feeder Set No.

Enter the feeder set number of the position on the feeder plate (feeder knockpin position) at which the feeder is installed.
This parameter setting is unnecessary when the "Use Feeder Optimize" parameter on the [Option] tab is set to "Yes".
When using an MTF (manual tray feeder), enter the feeder set number near a position at which the MTF is installed on
the feeder plate. When using a tray changer or ATS (auto tray stacker), use the default setting.
B: Position Definition
Set to "Automatic" when the "Package" parameter is set to "Tape". (The component pickup position will be calculated
automatically.) Set to "Teaching" when stick feeders or tray feeders are used. (See "1. Using component feeders other than
tape feeders" in Chapter 3.) (See "1. Using component feeders other than tape feeders" in Chapter 3.)
C, D: XY (pickup position)
Enter the position at which the head picks up a component from the feeder. These parameters are skipped when the
"Position Definition" parameter is set to "Automatic".
When stick feeders or tray feeders are used, enter the pickup position by teaching. (See "1. Using component feeders
other than tape feeders" in Chapter 3.)
E: Pick Angle (deg)
• This parameter specifies the angle through which the mounter head rotates to pick up a component on the feeder. This
setting determines the orientation of the component (recognition reference) when it is recognized and displayed on the
operation monitor. Normally, set this parameter to 0 deg for horizontally long components in the loading position on
the feeder, and set to 90 deg for vertically long components.
• The pickup angle for transistors must be specified so that their leads face the NS directions. Set this parameter to 0 deg
for vertically long components (molded package is vertically long) in the loading position on the feeder, and set to 90
deg for horizontally long components. Select the correct pickup angle by referring to the table below.
• The pickup angle for SOP components must be specified so that their leads face the EW directions. Set this parameter
to 0 deg for horizontally long components (molded package is horizontally long) in the loading position, and set to 90
deg for vertically long components. Select the correct pickup angle by referring to the table below.
• The pickup angle of connectors must be specified so that their leads face the E direction. Select the correct pickup
angle according to the loading position of the component as shown in the table below.
2-30
Pick Angle (deg)
N Box type chip N Melf
E N E N
Loading position S N E W Loading position S N E W
W S W S
Pickup angle 0o 90o Pickup angle 0o 90o
N SOP N QFP
2
E N E N
Loading position S N E W Loading position S N E W
W S W S
Pickup angle 0o 90o Pickup angle 0o 90o

N Mini-mold transistor
N N
Recognition
reference
S S
Loading position
Pickup angle 0o 90o 0o 90o
N Connector E
N
Recognition
E W
reference
S
Loading position
Pickup angle 0o 180o 90o -90o

23218-P2-10
F: Pick Height (mm)

This is the Z-axis height offset value used when the head lowers to pick up a component. Set this parameter to "0.0" in
normal operation.
If you want to lower the Z-axis height during component pickup, enter a plus value. Conversely, if you want to raise the
Z-axis height, enter a minus value.
G: Pick Timer sec
This parameter specifies the time duration (in seconds) for which the head stays in the lowered position after detecting
the reference pickup vacuum pressure when picking up a component. For small components such as chip components, it
is okay to set this parameter to "0.00". This setting applies to the external tray changer when connected.
H: Pick Speed (%)
This is the Z-axis speed when the head moves down to pick up a component. Set this parameter to 100 (%) in most cases.
If you want to reduce the speed, enter a smaller value.
I: XY Speed (%)
This is the speed at which the head moves in the XY directions to pick up and mount a component. Set this parameter to
100 (%) in most cases. If you want to reduce the speed, enter a smaller value.
J: Pick&Mount Vacuum Check
Set this parameter to "NORMAL CHK" in most cases. If you want to check pickup errors and mount errors more strictly
(head return without mounting the component), set to "SPECIAL CHK".
For example, when using QFP or BGA components and you want to check pickup errors and mount errors (erroneous
head return without mounting the component) more strictly, set this parameter to "SPECIAL CHK".
n NOTE
When this parameter is set to "NORMAL CHK", the machine controls the ascent timing of the head from the lowered
position during component pickup or mounting. This parameter setting is valid only when the "Vacuum Check"
parameter on the [Board] tab is set to "Check".
2-31
K: Pick Vacuum (%)
This is the reference vacuum pressure used for checking the pickup vacuum level. Use the default setting and adjust it as
needed in the Parts Adjust mode. (See "3.1 Parts Adjust mode" in this chapter.)
L: Pick Start
This parameter specifies the timing to start vacuum generation when the head picks up a component. When set to
"Normal", vacuum generation starts before the head moves down. When set to "Bottom", vacuum generation starts after
the head has moved down. Set this parameter to "Normal" in most cases.
M: Pick Action
2
This specifies the nozzle descent movements during component pickup or mounting. Set this parameter to "Normal" in
most cases. Setting this parameter to "DETAIL" allows you to set the "Pick Tango", "Pick Down" and "Pick Up" parameters.
N: Pick Tango
Set this parameter to "NORMAL" in most cases. When higher accuracy is required to pick up a small component, set to
"INTOL". (This parameter can be selected only when the "Pick Action" parameter is set to "DETAIL".
O, P: Pick Down, Pick Up

Select the nozzle descent or ascent sequence that best matches the component. (These parameters can be selected only
when the "Pick Action" parameter is set to "DETAIL".)
Q: Force Control (YSM40 FL head, Z: LEX(YSM20) FM head)
Set whether or not to perform force control. Set to"Yes "High Accuracy" when using force control.
R: Target Load (YSM40 FL head, Z:LEX(YSM20) FM head)
Enter the target load according to the head being used. The target load can be entered in 0.1N steps from 0.0 to 60.0N,
but the usable range is from 5.0N to 25.0N.
S: Nozzle Touch Point Offset
Set the length from the top surface of the component to the position where the nozzle tip makes contact with the
component.
2-32
2.4 Mount parameters
Mount parameters

24213-P2-00
A: Mount Height (mm)

This is the Z-axis height offset value used when the head lowers to mount a component. Set this parameter to "0.0" in
normal operation.
If you want to lower the Z-axis height during component mounting, enter a plus value. Conversely, if you want to raise
the Z-axis height, enter a minus value.
B: Mount Timer sec
This parameter specifies the time duration (in seconds) for which the head stays in the lowered position after detecting
the reference mount vacuum pressure when mounting a component. In most cases, it is okay to set this parameter to
"0.00". If pickup or mount operation is unstable, set a longer timer value. This setting applies to the external tray changer
when connected.
C: Mount Speed (%)
This is related to the "Pick Speed" setting in the Pick parameters. (The setting value changes simultaneously as the "Pick
Speed" setting is changed.)
D: XY Speed (%)
This is related to the "XY Speed" setting in the Pick parameters. (The setting value changes simultaneously as the "XY
Speed" setting in the Pick parameters is changed.)
E: Pick&Mount Vacuum Check
Set this parameter to "NORMAL CHK" in most cases. If you want to check pickup errors and mount errors more strictly
(head return without mounting the component), set to "SPECIAL CHK".
n NOTE
When this parameter is set to "NORMAL CHK", the machine controls the ascent timing of the head from the lowered
position during component pickup or mounting. This parameter setting is valid only when the "Vacuum Check"
parameter on the [Board] tab is set to "Check".
F: Mount Vacuum (%)

This is the reference vacuum pressure used for checking the mount vacuum level. Use the database default setting and
adjust it as needed in the Parts Adjust mode. (See "3.1 Parts Adjust mode" in this chapter.)
G: Mount Action
This is related to the "Pick Action" setting in the Pick parameters. (The setting value changes simultaneously as the Pick
Action setting is changed.)
H: Mount Tango
Set this parameter to "NORMAL" in most cases. When higher accuracy is required to pick up a small component, set to
"INTOL". (This parameter can be selected only when the Mount Action parameter is set to "DETAIL".
I, J: Mount Down, Mount Up
Select the nozzle descent or ascent sequence that best matches the component. (These parameters can be selected only
when the Mount Action parameter is set to "DETAIL".)
K: Force Control (YSM40 FL head, Z: LEX(YSM20) FM head)
Set whether or not to perform force control. Set to "Yes (Simplicity)" when using force control.
L: Target Load (YSM40 FL head, Z:LEX(YSM20) FM head)
Enter the target load according to the head being used. The target load can be entered in 0.1N steps from 0.0 to 60.0N,
but the usable range is from 5.0N to 25.0N.
M: Nozzle Touch Point Offset
Set the length from the top surface of the component to the position where the nozzle tip makes contact with the
component.
2-33
2.5 Vision parameters
Vision parameters
2
24214-P2-10
A, B: Alignment Module Fore, Back

This parameter specifies the lighting method for recognizing a component. Use the default settings ("Fore" and "Back") in
most cases.
In the case of the YS12,YS12P,YS24 and Z:LEX (YSM20) HM head, when "B: Alignment Module Fore" is selected, 8mm or
larger components are recognized with a multi-vision camera, while components smaller than 8mm are recognized with
a scan camera.
"Fore Scan Camera" (YS12, YS12P, YS24 and Z:LEX (YSM20) HM head only)
The "Fore Scan Camera" check box is usually selected by default. If this check box is cleared, the scan camera will not be
used for component recognition. Clear this check box if you want to use the multi-vision camera for recognition of all
components.
D to F: Light Main, Coax
Select the lighting methods that best match the component. Use the default setting ("Light Main" and "Light Coax"
selected) in most cases.
H: Lighting Level
This parameter specifies the reflected light brightness. Normally, use the default setting and then optimize it in the Parts
Adjust mode described later.
I: Auto Threshold
This parameter specifies whether to use the function that automatically calculates a threshold level for chip component
recognition from the acquired image.
J: Comp. Threshold
This parameter specifies the threshold level used to discern the light-reflecting part (lead) from the background during
component recognition. Normally, use the default setting and then optimize it in the Parts Adjust mode described later.
This parameter is skipped for BGA components.
K: Comp. Tolerance
This parameter specifies the tolerance for recognizing a component, in an allowable error percentage of 0 to 100%. The
larger the percentage, the greater the tolerance. First use the default setting and then gradually increase it while checking
the recognition status in the Parts Adjust mode described later. A tolerance of about 30% is usually appropriate, although
depending on the type of component.
L: Search Area (mm)
This parameter specifies the area within which the component leads are searched. As this value is set larger, the search
area is extended, but with a loss in the image processing speed. First use the default setting and then optimize it in the
Parts Adjust mode described later.
N: Datum Angle
This parameter specifies the angle of component shape definition. Use the default setting in most cases.
O: Comp. Intensity
This parameter specifies the threshold level used to measure the intensity in the outline area of a component after it is
successfully identified by normal vision recognition. If the measured intensity level is lower than this threshold, the
recognition result is viewed as an error. (This parameter is valid only when "Alignment Type" is set to "Std.Chip".)
2-34
P: Multi MACS
Select this parameter when using the "multi MACS" correction.
k: Offset Recognition (YSM40 only)
On the MU and HS heads, there are cases in which the components are recognized away from the center of the camera.
This setting selects the offset recognition method which is used at that time. The standard setting is "Auto".
• Auto
The recognition method is determined according to the offset type and the component size.
For rounded-corner components (MELF chips, etc.) and ball components (BGA, etc.) offset types, the recognition result
changes if recognition occurs away from the camera's center. Therefore, recognition occurs at the camera's center.
2
• Possible
Offset recognition occurs without regard to the offset type.
• Impossible
Recognition always occurs at the camera's center.
2-35
2.6 Shape parameters
Set these parameters after specifying "Alignment Type". (If "Alignment Type" is undefined, the following
parameters are not displayed.
For information about parameters which are displayed when "Algorithm" is set to other than "Normal", refer to
"A3. Function for simplifying the vision algorithm setting" in Appendix.)
n Chip components
Chip components
2
24215-P2-20
A, B: Body Size XY
Enter the correct dimensions (mm) measured with a vernier caliper or micrometer.
C: Body Size Z
Enter the correct thickness (mm) measured with a vernier caliper or micrometer.
D: Ruler Offset
This parameter specifies the distance inward from the lead end to an imaginary line used to detect the lead. Use the
default setting in most cases.
E: Lead Width
Enter the width of the leads provided on both ends of the component. This can be checked later in the Parts Adjust mode.
(Standard box type chip components do not use this parameter.)
Shape parameters for chip components
B
D A : Body Size X
N
B : Body Size Y
Top view B C : Body Size Z
C N E W
E D : Ruler Offset
S W S
A
A
B
D A : Body Size X
B : Body Size Y
C C : Body Size Z
E
N E D : Ruler Offset
W
A S E : Lead Width
23219-P2-00
2-36
Check Many Adsorption
This parameter checks whether two or more components are being picked up simultaneously.
• "Check"
Makes this check. An error occurs if an extra edge (lead, etc.) is found outside the component.
• "No Check"
Does not make this check.
TIP
This parameter can be used for standard chip and small chip components.
2
n Mini-mold transistors and SOT
A, B: Body Size XY
Enter the correct dimensions (mm) including the leads, measured with a vernier caliper or micrometer.
C: Body Size Z

D: Ruler Offset
E: Ruler Width
Enter the width of an imaginary line used to measure the lead width and pitch. Set this parameter to "1 to 2" for
components with a lead length of 0.0 to 0.3mm, and to "2 to 3" for components with a lead length longer than 0.3mm.
Use the default setting in most cases.
F, G: Lead Number NS
Enter the number of leads existing in the N and S directions.
Mini-mold transistor and SOT lead direction
Pickup angle 0o 90o

N N
Loading position S N S N
S S
23220-P2-00
H, I: Lead Pitch NS
Enter the correct lead pitch (lead-to-lead spacing).
J: Lead Width
Enter the correct lead width.
K: ReflectLL
Enter the projected length of leads which reflect light during recognition. Use the default setting in most cases.
Shape parameters for mini-mold transistors
H
B A : Body Size X
N B : Body Size Y
C D C : Body Size Z
Bottom view E W D : Ruler Offset
A H : Lead Pitch
E N S
J : Lead Width
S
W J K K : Reflect LL
23221-P2-00
2-37
n SOP
A, B: Body Size XY
C: Body Size Z
D: Ruler Offset
2 E: Ruler Width
Enter the width of the imaginary line used to measure the lead width and pitch. Set this parameter to "1 to 2" for
F: Lead Number
Enter the number of leads existing in the E or W direction.
G: Lead Pitch
H: Lead Width
I: ReflectLL
Enter the projected length of leads which reflect light during recognition.
Shape parameters for SOP
B I A : Body Size X
Bottom view G B : Body Size Y
N C : Body Size Z
C H G : Lead Pitch
N
E W E H : Lead Width
S W
A S I : Reflect LL
23222-P2-00
n QFP
A, B: Body Size XY
C: Body Size Z
D: Ruler Offset
Enter the distance from the end of the leads to an imaginary line used to measure the lead width and pitch. Use the
E: Ruler Width
F, G: Lead Number NE
Enter the number of leads existing in the N and E directions. For the component direction, see the QFP pickup angle
table.
H: Lead Pitch
I: Lead Width
J: ReflectLL
2-38
K: Bumper Mask
This parameter is used for QFPs with bumpers. Enter the distance in millimeters from the cross point of the imaginary
detection lines so as to specify the area by which bumpers are masked and not detected during component recognition.
Set this parameter to a value between 0 and 10.0 in 0.25mm steps. Enter "0.00" for normal QFPs with no bumpers.
Shape parameters for QFP
I K
K
H A : Body Size X
K K B : Body Size Y
2
C C : Body Size Z
J H : Lead Pitch
B Bottom view I : Lead Width
S J : Reflect LL
E
W K : Bumper Mask
K K
N
K K
A

23223-P2-00
n Simple BGA
A, B: Body Size XY
Enter the correct dimensions measured with a vernier caliper or micrometer.
C: Body Size Z
Enter the correct thickness measured with a vernier caliper or micrometer.
D: Dot Amount
Enter the total number of ball terminals of the BGA component.
E, F: Dot number NE
Enter the number of ball terminals arrayed in the N and E directions. If the number of terminals per array differs from
each other, enter the largest number of terminals per array.
G: BGA pitch
Enter the spacing between ball terminals.
H: BGA diameter
Enter the diameter of ball terminals.
Shape parameters for BGA component (Simple BGA setting)
E
A : Body Size X
B
B : Body Size Y
C : Body Size Z
D : Dot Amount
N H F E : Dot number N
E
C W F : Dot number E
A S
G : BGA pitch
Side view C H : BGA diameter
G Bottom view
23224-P2-00
2-39
n BGA
The following parameters are displayed when "Alignment Type" is set to "BGA".
A, B: Body Size XY
Enter the correct dimensions measured with a vernier caliper or micrometer.
C: Body Size Z
Enter the correct thickness measured with a vernier caliper or micrometer.
D, E, F: Cntr. Offset XYR
Enter the pickup position offset (positional shift) relative to the center of the component.
2 G: Dot Amount
Enter the total number of ball terminals of the BGA component.
H, I: Dot number NE
Enter the number of ball terminals arrayed in the N and E directions. If the number of terminals per array differs from
each other, enter the largest number of terminals per array.

J: BGA pitch N
Enter the spacing between ball terminals displayed on the N (North) side of the vision monitor.
K: BGA pitch E
Enter the spacing between ball terminals displayed on the E (East) side of the vision monitor.
L: BGA diameter
Enter the diameter of the ball terminals.
M: Binar y Level
The Comp Threshold parameter is invalid when "Alignment Type" is set to "BGA" or Simple BGA". Instead, the binary
level can be adjusted with this parameter. For example, if the white portion in the image appears larger than the actual
area, enter a plus value. (For more details, see "Adjusting the Binary Level" explained later in this section.)
Shape parameters for BGA component
H A : Body Size X
B B : Body Size Y
C : Body Size Z
G : Dot Amount
N I H : Dot number N
E L K
C W I : Dot number E
A S
J : BGA pitch N
K : BGA pitch E
Side view C
J Bottom view L : BGA diameter
23225-P2-00
2-40
n Connector E
A, B: Body Size XY
C: Body Size Z
D, E, F: Cntr. Offset XYR
Enter the lead position offset (positional shift) relative to the center of the component.
G: Ruler Offset
H: Ruler Width
2

I: LeadNumber
Enter the number of leads existing on one side.
J: Lead Pitch
K: Lead Width
L: ReflectLL
Enter the projected length of leads which reflect light during recognition. Use the default setting in most cases.
Shape parameters for connector E
A : Body Size X
L B : Body Size Y
J C : Body Size Z
C
B S J : Lead Pitch
W K
A E K : Lead Width
N
L : Reflect LL
Bottom view
23226-P2-00
2-41
2.7 Option parameters
Option parameters
2
24216-P2-00
A: Alternative Parts
This parameter specifies an alternative component number which can be used if the current component runs out. When
not needed to specify any alternative component, leave it at "0". (For details on alternative components, see "2.1 Using
alternative components" in Chapter 4.)
B: Parts Group No.
When a nozzle lowers to mount a low-profile component after tall components have been mounted on the board, the
neighboring nozzles may interfere with those tall components. To avoid this, components can be grouped by height so
that they are mounted in the desired order (0 to 99). When no mounting order is needed, set this parameter to "0".
C: Use Feeder Optimize
Set to "Yes" when you want to change the feeder set positions according to results obtained with the Optimizer function.
(See "6. Optimizing the data" in Chapter 4.) Set to "No" if you do not want to change the feeder set positions.
E: Pick Pos Correction
Set to "Use" when correcting the pickup position automatically.
2-42
2.8 Side-view camera parameters
These parameters are displayed when the machine is equipped with a side-view function or side-view camera.
Side-view camera parameters

24217-P2-00
A: Side View Camera

Sets the recognition mode of the side-view camera or side-view function. Select the mode from the drop-down list box.
"NotUse"
Does not perform recognition using the side-view camera or side-view function.
"Normal Mode"
Performs recognition using the side-view camera or side-view function in Normal mode.
The machine recognizes the component based on the "thickness recognition tolerance" that is ±50% of the "C: Body Size
Z (mm)" parameter value specified on the [Shape] tab.
"Detail Mode"
Performs recognition using the side-view camera or side-view function in Detail mode.
When this mode is selected, set the "C: Part Thickness (mm)" parameter to the desired value as the allowable thickness
based on the "C: Body Size Z (mm)" parameter value specified on the [Shape] tab. The machine then recognizes the
component using this value as the "thickness recognition tolerance".
B: Bring Back Check
Sets whether or not to use the "bring back" check. Select from the drop-down list box.
"NotUse"
The side-view camera or side-view function does not check whether the nozzle brings the component back without
placing it on the board.
"Use"
The side-view camera or side-view function checks whether the nozzle brings the component back after placing or
discarding it.
C: Part Thickness (mm)
This parameter is available only when the "A: Side View Camera" parameter is set to "Detail Mode".
Set the allowable component thickness from 0.000 to 99.999 mm based on the "C: Body Size Z (mm)" parameter value on
the [Shape] tab. The value set here is used as the "thickness recognition tolerance" when the side-view camera or
side-view function recognizes the component.
The larger the setting, the greater the tolerance.
c CAUTION
Setting the tolerance too large or too small might cause component placement errors or other problems.
2-43
D: Reverse Check (inverted component check)
This parameter is available when the "A: Side View Camera" parameter is set to "Normal Mode" or "Detail Mode". Select
"Use" to check the front and back sides of a picked up component with the side view camera or side-view function, or
select "NotUse" if this check is not needed.
"Use"
Checks if the front and back sides of a component are inverted while recognizing it with the side-view camera or
side-view function. Also simultaneously checks whether the picked up component size fits within the angle-of-view of
the side-view camera or side-view function.
"NotUse"
2
Does not make this check with the side-view camera or side-view function.
2-44
3. Component recognition test
After setting the basic parameters, you should check whether the parameter settings are appropriate. While
performing a vision test in "Parts Adjust" mode, you can also find and determine an optimum value for each
parameter.
Typical flow chart in Parts Adjust mode
Select component data

2
Open Parts Adjust screen

Enter feeder set number
Check head & nozzle

Perform component pickup
to be used
Check pickup/mount
Teach component position
vacuum levels
NG
Perform vision test and check result Error occurred
OK
Optimize parameters Display defined outline
Perform vision test again
No recognition error
Discard component
Exit Parts Adjust mode
23227-P2-00
2-45
3.1 Parts Adjust mode
1 Set up the component feeder.

Unless you use a tray changer, install the feeder with components you want to check, onto the feeder
plate. Be sure that the feeder set position matches the number previously set for " Feeder Set No." of the
Pick parameters. If the Feeder Set No. has not yet been determined, you can specify it on the Parts
Adjust screen, so install the feeder at a position you can easily access.
2 Select the component data.
2
On the Parts screen, line up the cursor with the component data you want to check.
3 Press the [Parts Adjust] button to enter the Parts Adjust mode.
The Parts Adjust screen appears as shown below.
Parts Adjust screen

Press the [Parts Adjust] button to open the Parts Adjust screen.
24218-P2-00
2-46
4 Enter the feeder set number.
Enter this parameter for components whose feeder position is unspecified. Move the cursor to "Feeder
Set No." in the parameter item list, and then enter the number of the feeder plate position at which the
feeder is installed.
Feeder position input screen
Set feeder position

Step5
Step6
24219-P2-20
5 Check the head and nozzle to be used.

The head number and nozzle type to be used are shown on the screen. To change the head number,
select it from the Head drop-down list. If you want to change the nozzle type, select the nozzle from
Nozzle Type drop-down list.
TIP
The Nozzle Type drop-down list shows the nozzles that can pick up the selected component using the selected head.
6 Check the Alignment Camera setting.

This shows the camera used to recognize the selected component. In most cases, this setting should be
set to "Auto Select". If an optional camera is installed, it can be selected from the Alignment Camera
drop-down list.
TIP
The Alignment Camera drop-down list shows the cameras that can be used to recognize the selected component.
7 Perform component pickup.

Press the [Pick Up] button on the Parts Adjust screen to start component pickup.
2-47
8 Check and adjust the reference pickup/mount vacuum levels.
To check the reference vacuum levels used to determine whether or not a component is being picked
up by a nozzle, follow these steps.
1. Press the [Vacuum] button to open the Adjust Vacuum Level window.
Adjust Vacuum Level window
2
A B
A: Data bar
Shows the reference pickup and mount vacuum level settings.
B: Level bar
Shows the actual vacuum level currently being measured.
C: Upper green zone

Represents the reference pickup vacuum level setting when a component is
picked up by the nozzle.
D: Lower green zone

Represents the reference mount vacuum level setting when no component is
picked up by the nozzle.
24220-P2-10
2. Check the reference mount vacuum level.

Check that the Level bar overlaps with the upper green zone on the Data bar. If not, increase the
reference mount vacuum level (Mount %) with the UP arrow button.
3. Check the reference pickup vacuum level.
Press the emergency stop button, then remove by hand the component being picked up. Now
e check that the Level bar is within the lower green zone on the Data bar. If the Level bar exceeds the
green area and overlaps with the center pink zone, adjust the reference pickup vacuum level (Pick
%) with the UP arrow button. After having adjusted it, cancel the emergency stop button and press
the [READY] button.
4. Press the [Pick Up] button to perform component pickup again.
9 Press the [Test] button to perform a vision test.

Perform this test several times. If no error is detected, each parameter is appropriate so advance to the
next step.
2-48
■ Image recognition check method 1 (Outline definition)
1. Carefully check the image of the component displayed on the screen, and then press the [Draw Shape] button. An
outline of the component appears on the screen, based on the settings defined in component information. Confirm
whether it matches the component image obtained by the vision test. If the angle does not match, exit the Parts Adjust
mode and then correct the "Pick Angle" setting in the Pick parameters.
"Draw Defined Shape" screen
Component image obtained by vision test
2
Defined component
outline

24252-P2-00
2. Check to see if the Shape parameters such as the component size and number of leads are correct. To check this, set
the "Monitor Mode" of the Part Adjust screen to "Vision Result", and then perform a vision test again. The recognition
results will be displayed on the screen. Then check to see if the Shape parameter settings match the results obtained.
Correct the settings as necessary.
3. Return to the Parts Adjust screen and press the [Find Best] button to optimize the component parameters. The machine
automatically finds and enters the optimum values for the component parameters.
4. Press the [Test] button to perform a vision test again.
Repeat this test several times. If there is no error, the adjustment is complete. Return the "Monitor Mode" setting of the
Parts Adjust screen to "None".
■ Image recognition check method 2 (Monitor mode)

If an error occurred during the vision test or recognition was successful but not stable, you can check the image by
switching the monitor mode.
• Vision Result
This mode allows checking the center of component and parameter values, such as "Lead Number", "Lead Pitch", and
"Lead Width" settings.
Monitor mode "Result"
Displays number of leads, lead pitch, lead width, etc.
24253-P2-00
2-49
• Binar y Image
This mode allows checking the binary image, center of component, parameter values, and search area. The recognition
results are displayed along with the search area used to detect the lead ends.
Monitor mode "Binary"
Displays recognition results.
2 Displays search
area.
24254-P2-00
• Detection range
This mode allows checking the search area and the detected lead ends. Cross marks are displayed to indicate the lead
ends along with the search area used to detect the lead ends.
Monitor mode "Detection range"
Cross (+) mark indicates lead end.
Displays search
area.
24255-P2-00
• Datum Pos.
This mode allows checking the end of a lead pin. A cross mark is displayed to indicate the end of a lead (pin).
Monitor mode "Datum Pos."
Cross (+) mark indicates lead end.
24256-P2-00
2-50
• Find Line
This mode allows checking the lead pin detection line. A straight line is displayed across the detected lead pins.
Monitor mode "Find Line"
Straight line indicates detection line.

24257-P2-00
• Edge Pos.
This mode allows checking the center of each lead pin. (If the lead pin edge is round, the recognized result may not
accurate, so use caution.)
Monitor mode "Edge Pos."
Indicates the center of lead pin.
24258-P2-00
• Last Pos.
This mode allows checking the center of component and the side-to-side center lines. The center of component and the
side-to-side center lines are displayed.
Monitor mode "Last Pos."
Displays the center of component and side-to-side center lines.
24259-P2-00
2-51
• Detail Setting
The [Monitor Setting] button appears when this mode is selected. Pressing the [Monitor Setting] button opens the dialog
box shown below, allowing you to customize the monitor mode by checking the items you want to display on the screen.
Each item can be selected separately for "Success" and "Error".
Monitor mode "Detail Setting"

Check the items you want to display.
2
24260-P2-00
■ Intensity level difference check for lead detection (Histogram)

Pressing the [Grey] button opens the "Histogram" screen that allows you to check how much the lead portions are
brighter than the background. Press the [Horizontal] or [vertical] button, and a red cursor line appears that is different
from the cross hairs. Use the arrow buttons to move the red cursor line onto the lead image. The intensity level of each
lead is displayed as a blue line indicating the contrast profile along the red line.
Histogram
Profile along vertical cursor line
Displays intensity profile of leads (blue line).
Place cursor line (red) on leads.
Press [Horizontal] or [Vertical] button.

24261-P2-00
0 Discard the component.

To discard the component at the dumping position, press the [Dump] button. If you do not want to
dump the component automatically, follow the procedure below.
1. Press the emergency stop button and remove the component by hand from the nozzle.
e 2. Press the [Dump] button to stop vacuum generation.
q Exit the Parts Adjust mode.

Press the [OK] button on the Parts Adjust screen to exit the Parts Adjust mode.
2-52
4. Creating the mark information
This section describes how to create mark information for fiducial marks used on a board. Mark information
has various parameters for each mark registered. To set these parameters, copy sample data of a mark with
a similar shape from the database and edit only the different parameters.
Optimal parameter values can also be found by making checks and adjustments in Mark Adjust mode.
Mark parameters
Mark Type
Database Number
Badmark Mark Rev
2

Shape Type
Mark Out Size
(Mark Out Size XY)
(Area)
(Outline)
Mark Name
Mark Comment
(Mark Type) Surface Type
Algorithm Type
Mark Threshold
Tolerance
Search Area XY
Outer Light
Inner Light
Coaxial Light
IR Outer Light
IR Inner Light
Cut Outer Noise
Cut inner Noise
Sequence
23229-P2-10
TIP
Parameters displayed somewhat differ depending on the selected "Mark Type" or "Shape Type".
2-53
4.1 Creating procedure
Pressing the Mark button in the menu button area opens the mark information screen as shown below. Enter
the mark name and comment in the upper grid of the screen, and set the parameters in the right lower grid, as
explained below.
Mark information screen
Step 1 Step 2 Step 3 Step 5
2
Step 7 Step 4
24222-P2-00
1 Press the [Mark] button to open the Mark screen.

2 Enter the mark name in the Mark Name column.
Enter a different name for each mark within 19 alphanumeric characters. A space cannot be included
in the name.
3 Enter a comment.
Type any desired comment in the Mark Comment column as necessary. You can omit entering
comments here.

While selecting the [Basic], [Shape], and [Vision] tabs, set the necessary parameters in the lower right
list.
5 Adjust the parameters in the Mark Adjust mode.

Press the [Mark Adjust] button to open the Mark Adjust screen that allows you to adjust or check the
parameters of the selected mark. (For more details, see "5.5 Mark Adjust mode" in this chapter.)
6 Repeat the above steps for other marks.

Repeat the same procedure from step 2 to register all marks to be used.
7 Save the data.

Press the [Save] button to store the data.
2-54
4.2 Basic parameters
Basic parameters
2 1 [Database] button

24223-P2-00
1. Mark Type
Select the mark type from the drop-down list. Select "Fiducial" when using a fiducial mark, and select "Badmark" when
using a badmark. If using a fiducial mark as a badmark, select "Fid for Bad". The item selected here will be displayed on
the Mark Type column in the data No. list (upper grid).
2. Database Number
Shows the database number when the parameter values were copied from the database.
When you want to copy the parameter values from the database, press the [Database] button to open the database list.
Then select the copy source data and press the [Set] button to make a copy.
Database list
24224-P2-00
2-55
4.3 Shape parameters
Shape parameters
2
24225-P2-00
Shape Type
The Shape Type can be selected from the following 5 types.
Shape Type settings
Setting Description Example
Circle Select to detect a circular mark.
Square/Oblong Select to detect a square or rectangular mark.
Triangle Select to detect an equilateral triangular mark.
Sp. Shape Select to detect a special mark other than above.
Corner Select to detect a corner of a pattern as a mark.
23230-P2-00
2-56
A, B: Mark Out Size XY (mm)
Referring to the table below, enter the correct mark size measured with a ruler. This parameter is not displayed when
"Mark Type" on the [Basic] tab is set to "Badmark". The "Search Area" parameters appear instead.
Mark Out Size settings
Shape Type Example Mark Out Size setting
Circle
2
Enter the diameter.
Square/Oblong Y
Enter the length of each side.
X

Triangle Enter the length of one side.
Y Enter the X length in the MarkOutSize X, and

Sp. Shape
the Y length in the MarkOutSize Y.
X
Corner Enter the length of the shorter side displayed

within the search area.
23231-P2-00
C: Area (mm 2)
Enter the area of the mark in units of square millimeters. This parameter is displayed only when "Shape Type" on the
[Shape] tab is set to "Sp. Shape".
D: Outline (mm)
Enter the perimeter length of the mark in units of millimeters.
This parameter is displayed only when "Shape Type" on the [Shape] tab is set to "Sp. Shape".
n NOTE
A recognition error may occur due to environmental conditions such as illumination. In such cases, enter a larger
value than previously used in "Tolerance" on the [Vision] tab, or set the tolerance to 100%, then perform a vision test in
the Mark Adjust mode and enter the obtained area and perimeter data. Return the tolerance to the original value
after the data is obtained.
2-57
4.4 Vision parameters
Vision parameters
2
24226-P2-00
A: Surface Type
This specifies the bright and dark relation between the mark surface and board (surrounding area). Select "NonReflect"
when the mark is darker than the surrounding area, and select "Reflect" when the mark is brighter than the surrounding
area, as shown below.
Surface Type settings
Setting NonReflect Reflect
Brightness comparison Board is brighter than mark. Mark is brighter than board.
Mark Mark
Image
Board Board
23233-P2-00
B: Algorithm Type
There are 6 algorithm types selectable for mark recognition.
• Normal
In typical recognition, all types of marks should be set to "Normal". Try setting to other parameters if the mark cannot
be recognized with the "Normal" setting.
• Special 1
Select this if the mark cannot be recognized by the "Normal" setting.
• Special 2
Select this if the mark which cannot be recognized by the "Normal" setting has a cutout area.
• PTRN Outline, PTRN GrayLev, PTRN Whole
Select these parameters when the Shape Type parameter is set to "Pattern". For more details, refer to "3.1 Pattern
matching" in Chapter 4.
C: Mark Threshold
This is the threshold level for binary image used to recognize the mark. An optimum threshold level can be found in the
Mark Adjust mode explained later in this section.
D: Tolerance (%)
This specifies a tolerance percentage for the mark size when the mark is recognized with the vision system. (Typically
this should be set to "30".)
2-58
E, F: Search Area XY (mm)
As a general guide, set these parameters to the mark diameter plus 3mm. For example, when the mark diameter is 1mm,
set these parameters to "4mm" as shown below. If other marks (such as resist, silk print, other patterns) exist in this search
area, make the "Search Area" setting smaller so that only the mark is detected.
TIP
The "Search Area" parameters are displayed on the [Shape] tab when "Mark Type" on the [Basic] tab is set to
"Badmark".
Search Area
Search Area
2
Mark

1
4 Board
23234-P2-00
G to K: Light level
Lighting for recognizing a mark is divided into several zones. Light level in each zone is displayed here. Optimum light
levels can be found in the Mark Adjust mode explained later.
L, M: Cut Outer Noise, Cut Inner Noise
When the mark image is digitized and shown in binary (black and white), noise may appear outside or inside the mark.
In this case, adjusting these parameter values in the Mark Adjust mode (described later) can cut the noise.
N: Sequence
Set to "Normal" in most cases. If the recognition speed is important select "Quick", or if recognition accuracy is important
select "Fine".
2-59
5. Mark recognition test
5.1 Mark Adjust mode
This operation checks whether the parameter settings are correct. For parameters which are unspecified, the
optimal values can be obtained by performing a vision test. The following adjustment procedure is explained
for cases where "Mark Type" on the [Basic] tab is set to "Fiducial".
2
1 Select the mark data.
Open the mark information screen and line up the cursor with the mark data you want to check.
2 Press the [Mark Adjust] button to enter the Mark Adjust mode.
The Mark Adjust screen appears as shown below.
Mark Adjust screen

Example of YS24
Step 4 Step 5 Step 6 Select the table.

24227-P2-20
TIP
On the machines having two or more tables, the "Table Select" drop-down list appears.
2-60
3 Set the board on the conveyor and clamp it.
4 Teach the mark position.
1. Select the table to use for teaching. (Perform this step only for the machines with multiple tables.)
2. Press the [Move Head] button to open the Move Head window.
3. Use the arrow buttons to position the moving camera above the mark so the mark is aligned with the
cross cursor on the vision monitor as shown in the table below.
4. Press the [Close] button to return to the Mark Adjust screen.
2
Mark teaching positions
Shape Type Teaching point Example
Circle, Square Center of mark

Triangle, Sp. Shape

Corner Corner of mark
: Cross cursor at center of screen

23235-P2-00
5 Adjust the light levels for the mark.

Press the [Mark Light] button to open the light level adjustment screen. Adjust the light level in each
lighting zone so that the entire mark is clearly and uniformly seen with a high contrast to the
background.
Mark lighting adjustment
24228-P2-00
As a general guide for adjusting mark lighting, tr y these suggestions.

• Copper foil, gold plating
Light up the "Outer Level", "Inner Level" and "Coaxial Level" (at "+1" light level).
If the mark is dark, then try increasing the "Inner Level".
• Solder leveler
Light up the "Outer Level", "Inner Level" and "Coaxial Level" (at "+1" light level).
If the mark surface is uneven and the mark contours appear faint and hard to see on the screen,
then try increasing the Outer Level.
• Metal mark on ceramic board

Light up the "Inner Level" and "Coaxial Level" (at "+1" light level).
If the ceramic portion is too bright, try lighting up the "IR Outer Level" and/or IR Inner Level" only.
2-61
6 Press the [Test] button to perform a vision test.
Repeat this test several times. If no error is detected, each parameter is appropriate so advance to the
next step. If an error occurs, make adjustments with the procedure below.
1. Press the [Cancel] button to exit the Mark Adjust mode and check whether the parameter settings
(Mark Type, Shape Type, Algorithm Type, etc.) are correct.
2. After checking the parameters, enter the Mark Adjust mode and press the [Test] button again to run
the same test. When no errors occur, move to the next step.
3. If an error still occurs, press the [Find Best] button to find an optimum threshold level.
4. After the optimum threshold level has been found, run the vision test again.
2
If no errors occur, go to the next step.
5. If the optimum threshold level could not be obtained, press the [Check] button.
A binary image appears on the vision monitor according to the current parameter settings as shown
below.
Threshold level check
Binary mark image

24229-P2-00
6. Adjust the threshold level as suggested below, so that the mark image is clearly displayed.
Binary image check
State Image Countermeasure Remarks
All white Increase the threshold level with Adjust it till the mark is displayed.
the arrow buttons.
All black Decrease the threshold level with the Adjust it till the mark is displayed.
arrow buttons.
Noise within mark Increase the Cut Inner Noise level on Recognition time becomes longer
the Mark Adjust screen. as the Cut Inner Noise level is increased.
Noise outside of mark Increase the Cut Outer Noise level on Recognition time becomes longer
the Mark Adjust screen. as the Cut Outer Noise level is increased.
Other than mark in Reduce the Search Area size. Refer to "Search Area"
search area explained previously.
23236-P2-00
7. Press the [Find Best] button again to find an optimum threshold level.
If the result is successful, next run a vision test. When no error occurs, advance to the next step.
8. If the vision test result is a fail, enter a larger value in the "Tolerance" parameter on the Mark Adjust
screen, then press the [Find Best] button again.
2-62
7 Check that the mark can be recognized even if it has moved.
Check that the mark can be recognized in any location within the search area.
When the other mark used as a pair of fiducial marks has the same shape (except for spacial shapes),
you also need to check that it can be recognized under the same conditions.
1. Press the [Move Head] button to open the Move Head window.
2. Use the arrow buttons to move the mark slightly from the center of the search area.
3. Return the Mark Adjust screen and run a vision test once more.
If no error occurs, the parameter settings are satisfactory. If an error occurred, press the [Check]
button to display a binary image and then adjust the threshold level.
Final check for mark recognition

2

Center of search area Search Area
23237-P2-00
8 Exit the Mark Adjust mode.

Press the [OK] button to exit the Mark Adjust mode.
2-63
6. Editing the solder ball components
Position information on solder balls can be edited in the Parts Adjust mode to improve recognition accuracy.
This is particularly effective in recognizing micro BGA components such as CSP and randomly arranged
solder balls. To edit the solder ball information, The "Alignment Type" parameter on the Basic tab must be set
to "BGA" or "FlipChip"
6.1 BGA
2 1 Open the Parts Adjust screen of the BGA.

Select the BGA you want to edit and press the [Adjust] button to open the Parts Adjust screen.
2 Press the [BGA] button to open the BGA edit screen.

Parts Adjust window

[BGA] button
Press the [BGA] button to open the BGA edit screen.

24230-P2-10
2-64
3 Edit the ball position data.
On the BGA ball edit screen, edit the ball position data so that it matches the actual ball arrangement.
The ball display should be set to ON (dark color) at positions where the ball exists and to OFF (light color)
where it does not exist. To switch ON or OFF, place the mouse on the target ball and double-click the
mouse or press the [Set] or [Reset] button.
BGA ball edit screen
Use the arrow buttons to move the edit position.

[Set] button
[Reset] button
24231-P2-10
4 Register the edited data.

When you have edited the ball information, press the [OK] button to register it.
5 Press the [Test] button to run a vision test.

Repeat the vision test a few times. If no error occurs, the BGA ball data is appropriate.
If an error occurs, proceed to the next section "Adjusting the Binary Level".
n NOTE
When you want to check nicks on the solder balls or it is difficult to recognize balls under "Light Main" illumination,
select "Side" only.
2-65
n Binar y level correction
If the mold part of the BGA package reflects light during recognition of the balls, the reflected light may be
misdetected as a ball, resulting in a ball area recognition error. To avoid this type of error, increasing the ball
area will prove effective. This is called "binary level correction".
1 Set the "Monitor Mode" to "Find Line".

On the Parts Adjust screen, set the "Monitor Mode" to "Find Line".
"Monitor Mode" setting for binary level correction
2
Select "Find Line".

24232-P2-10

If the mold part of the BGA is displayed in white on the vision monitor, you will need to adjust the binary
level as described below.
3 Exit the Parts Adjust mode.

Press the [OK] button to temporarily exit the Parts Adjust mode.
2-66
4 Adjust the "Binary Level" value on the [Shape] tab screen.
Enter a value which is estimated from the percentage of the mold part area displayed in white versus
the entire area of the balls.
Binary Level adjustment

Adjust "Binary Level".
24233-P2-00
5 Run a vision test again.

Return to the Parts Adjust mode and press the [Test] button. When no error occurs, the binary level is
correct.
6 Save the settings.
2-67
6.2 Flip Chip
When "Alignment Type" is set to "FlipChip, you can edit the ball positions that are randomly arranged.
There are two editing methods: one method lets you directly enter numerical values on the screen and the
other method allows you to load the data in a "random ball position (POS) information file" you have created
on an external PC in advance. Refer to the next section "6.2.1" for instructions on how to create a "random ball
position (POS) information file".
TIP
When a "random ball position (POS) information file" you created before is available, you can load and use it.
2 c CAUTION
Only the files created in formats specified by YAMAHA can be loaded.
1 Open the Parts Adjust screen.

Select the flip chip component you want to edit and press the [Adjust] button to open the Parts Adjust
screen.
2 Open the Random Ball Edit screen.

Press the [Random Ball] button on the Pars Adjust screen to open the Random Ball edit screen.
[Random Ball] button
Press this button.

24234-P2-10
2-68
n When entering the numerical values on the screen, proceed to steps 3 to 5 below.
3 Define the reference ball positions.

The balls located as close to the periphery as possible in each of the upper right, upper left, lower right
and lower left corners should be defined as the reference balls, as shown below. However, it is not so
important which balls you select. Set the reference balls to 0 to 7 in the "Datum Ball Position" column in
the data entry grid on the Random Ball Edit screen.
Reference ball positions
Y+ b: Reference balls
b1
2
b0

b4 b6
X– X+
b5 b7
b2 b3
Y–
23238-P2-00
n NOTE
Select "- - -" for the balls other than the reference balls.
4 Enter the XY positions.

Enter the precise coordinate data from the center of the component
5 Enter the ball size.

In the "Ball Diameter" column, enter the same value as indicated in row C "Std. Ball Diameter" in the
upper grid.
Random Ball Edit screen
24235-P2-10
2-69
n When loading a file to set the random ball positions, proceed to steps 3 to 5 below.
3 Press the [Read POS] button on the Random Ball Edit screen.
The "POS Information File Select" dialog box appears.
4 Select the folder that contains random ball position (POS) information files.
Use the [Folder] button to select the folder that contains random ball position (POS) information files.
(The path to the folder is shown in the "Location" box.) The contents of the folder are displayed as a list.
For information on how to store the random ball position (POS) information files into the "No.1" folder,
refer to "2. Managing the POS information files" in Chapter 6.
2 Loading a random ball position (POS) information file

24236-P2-10
2-70
5 Select the file and load it.
Select the file and press the [OK] button to load it.
l When the file is loaded:
The display returns to the Random Ball Edit screen and the data in the loaded file is displayed.
Check the correct data is displayed. Edit this data as needed on this screen.
Loading a random ball position (POS) information file

File successfully loaded

24237-P2-10
l When the file is not loaded:

An error message appears. After checking the message, open the random ball position (POS)
information file on an external PC using a text editor and correct the data. Then load the file again.
Error loading a random ball position (POS) information file

Error message
24238-P2-00
2-71
Repeat the vision test a few times. If no error occurs, the random ball editing is satisfactory.
If an error occurs, use the [Find Best] button to obtain the optimal values or the [Draw Shape] button to
check the component outline.
7 Save the settings.
6.2.1 Creating a random ball position (POS) information file

To create and edit a "random ball position (POS) information file" on an external PC, use a text editor.
2
This file is specifically used with YAMAHA surface mounters and contains 3 types of data. These are the
"Standard ball diameter (default ball size) ", "Reference ball position" and "Ball position", which can be loaded
onto the "Random Ball Edit" screen. Besides these, you can enter a comment and reference data.
Random ball position (POS) information file

Creation example
23239-P2-00
c CAUTION
Comply with the following restrictions when entering data.
• Use only alphabetic characters, numbers, symbols and decimal points in the data.
• Use only a space or tab to separate the characters in the data. Spaces and tabs can also be mixed or used
consecutively.
• A line starting with a double slash (//) is a comment.
A comment can be used as a memo (or note) when editing random ball position (POS) information.
When a double slash (//) appears within a line, the data from that point onwards is recognized as a comment.
1 Enter the standard ball diameter (default ball size).

This figure is assigned to the diameter of all balls.
Enter the "#DIAMETER x.xxx".
Standard ball diameter

Entry example
23240-P2-00
Data entered here appears in the "Std. Ball Diameter" field on the "Random Ball Edit" screen.
c CAUTION
Always enter this data on the first line of the 3 data types for loading.
If not entered on the first line, then a data error occurs and the data cannot be loaded onto the "Random Ball Edit"
screen.
2-72
2 Enter the ball position data.
Enter the position data for all balls.
1. Decide the reference balls from 0 to 7, the same as in step 3 in the previous section "6.2".
2. Enter the XY coordinates for the reference balls and all other balls. Always enter the X coordinate
first, although there are no particular restrictions on the order that the ball positions are entered.
l To enter the reference ball position:

Enter the "X coordinate" and "Y coordinate" after first entering "#POSn". For example, when the
reference ball position is "0", enter "#POS0 x.xxx (X coordinate) y.yyy (Y coordinate)". Always enter all
data for reference balls 0 to 7.
l To enter ball positions for other than reference balls:

Enter "#POS x.xxx (X coordinate) y.yyy (Y coordinate).
Always enter all data for balls other than reference balls.
2

Reference ball position and other ball position
Entry example
Numbers are entered as comments for checking the number of balls.
Reference ball
position
Ball position
23241-P2-00
Data entered here appears in the "X (mm)" and "Y (mm)" fields on the "Random Ball Edit" screen.
TIP
When the number of balls is large, giving a number to each ball helps you check the number of balls you have
entered.
3 Save the data and quit.

When finished entering all data, check that all required data has been entered and there is no
unwanted data, and then save the data.
Any name can be used as the file name when saving but enter ".POS" as the file extension. The data
can be saved in any desired location such as a USB memory device, floppy disk or a PC on the network.
c CAUTION
When saving data to a USB memory device, always use the USB memory device specified by YAMAHA.
n NOTE
Use the Board Explorer when storing the "Random ball position (POS) information file" created on an external PC, into
the "No.1" folder. For details, see "2. Managing the POS information files" in Chapter 6.
2-73
7. Teach and trace
7.1 Trace function
The trace function automatically moves the teaching unit such as the camera or head to the target position.
This is mainly used to check the input XY coordinate data.
n NOTE
2
When using the trace function from board information of combined board data, the lane to be operated should first
be selected and displayed with the [Lane] button.
1 Clamp a board on the conveyor.

Use the [width] button and other buttons on the Unit screen to clamp a board on the conveyor.
2 Press the [Teach] button to open the Teach (trace) screen.

A [Teach] button is available on the [Mount], [Offset], [Fiducial] and [Badmark] tabs of the Board screen
and on the Parts screen.
Opening the Teach (trace) screen

Example of YS24
24239-P2-10
TIP
On the machines having two or more tables, the "Table Select" drop-down list appears.
2-74
3 Set the trace conditions.
Refer to the following explanations to set the trace conditions.
Teach (trace) condition setting

Example of YS24
2
1

2
3 4 Axis move keys

24240-P2-10
1. Table Select (Perform this step only for the machines with multiple tables.)
Select the table to use for trace.
2. Teaching Unit
Select the teaching (trace) unit to move it to a target position, from "Camera", "First Head" or "Last
Head". Normally, select "Camera" to view the trace point on the vision monitor.
3. Step Mode (inching mode)

Use this mode to move the teaching (trace) unit in specified steps (mm). As long as the [Step Mode]
button is depressed, the inching mode takes priority over other motions so that continuous
movement will not change to high-speed movement even if an axis move key is kept pressed.
[Step Mode] button

When this button is depressed, the teaching unit moves a specified distance (mm) each time you
press an axis move key. The inching distance can be set from 0.000 to 10.000 mm.
4. Speed
Set the speed (%) to move the teaching unit. This speed can be set from 1 to 100 by pressing the UP
arrow button. Press an axis move key to start moving the teaching unit at the specified speed. When
the axis move key is kept pressed, continuous movement changes to high-speed movement. Using a
slow speed ("10" or "20") is recommended for safety, although you may at first feel the movement is
slow.
2-75
5. [Setting] button (fiducial correction)
Pressing the [Setting] button displays the dialog box for "fiducial correction". You can select whether
to correct board distortions using fiducial marks during trace or teaching. To do this, select the
"Fiducial Adjustment" check box in the dialog box and press the [OK] button. The board fiducial
marks will be automatically recognized to perform more accurate trace or teaching. Note that the
accurate fiducial mark data and coordinates must be set in advance to use this function.
Fiducial correction dialog box
2
24241-P2-00
4 Select the data to be traced.

Select the data row to be traced.
5 Check the surrounding area for safety.

Upon performing a trace, the teaching (trace) unit will start to move. Stay out of the axis movement
range.
6 Press the [Trace] button.

The teaching (trace) unit moves to the target position specified in step 4.
Performing a trace
Select data row to be traced.
24242-P2-10
2-76
7.2 Auto trace function
This function automatically traces data continuously, and can be used with "Mount" data or "Parts" data on the
Board screen. When used with "Mount" data, successive mount points are continuously traced. When used
with "Parts" data, successive pickup points are continuously traced.
n NOTE
When using the auto trace function from board information of combined board data, the lane to be operated should
first be selected and displayed with the [Lane] button.
1 Clamp a board.
Clamp a board on the conveyor.
2
2 Open the "Mount" or "Parts" data screen, and press the [Teach] button.

Set the "table","teaching (trace) unit", "speed", and "fiducial correction".
See the previous section "7.1 Trace function" for the setting methods.
4 Specify the data row.

Select the data row from which to start a trace.
5 Check the surrounding area for safety.

Upon performing a trace, the teaching (trace) unit will start to move. Stay out of the axis movement
range.
6 Press the [Auto] button and start a trace.

With the [Auto] button depressed, press the [Trace Next] button to perform continuous trace, starting
from the data row selected in step 4 towards the end of data rows. To stop continuous trace before
reaching the data end, press the [Auto] button.
With the [Auto] button depressed, press the [Trace Previous] button to perform continuous trace,
starting from the data row selected in step 4 towards the top of data rows. To stop continuous trace
before reaching the top data row, press the [Auto] button.
Performing an auto trace
Select data row to start auto trace.
24243-P2-00
2-77
7.3 Teaching function
The teaching function is used to teach the machine position such as XY coordinate values using a teaching unit
(camera or head). There are teaching methods available, "point teaching", "cursor teaching", and "parts shape
teaching".
n NOTE
When using the teach function from board information of combined board data, the lane to be operated should first
be selected and displayed with the [Lane] button.
2
7.3.1 Point teaching
Point teaching is further divided into "one-point input" and "multi-point input". The "one-point input" allows the
teaching data to be directly entered. The "multi-point input" gives the center coordinates in the multiple
positions which are specified.
1 Clamp a board.

Set the "table","teaching unit", "speed", and "fiducial correction".
For details about how to set the coordinates, see "7.1 Trace function" in this Chapter.
3 Select the item (data) to perform teaching.

4 Move the teaching unit to the target position.
Stay out of the axis movement range and then move the teaching unit to the target position using the
axis move keys.
Moving the teaching unit
Select data row to perform teaching.
Use the axis move keys to move to target position.

24244-P2-00
2-78
5 Adjust the lighting levels as needed.
If the target image is not clearly displayed on the vision monitor, press the [Light] button and adjust the
lighting levels.
Mark Light screen

24245-P2-00
If the "Outer Level" and "Inner Level" are OFF or set to "0", increase these lighting levels to about "+4" and
check that the target image is clearly displayed on the vision monitor. The "Coaxial Level" should be set
to "0".
If the surface of the target is glossy or uneven, using the "IR Outer Level" and "IR Inner Level" infrared
lighting may be effective.
Lighting level adjustment
24246-P2-00
TIP
The mark lights include the "Outer Level", "Inner Level", "Coaxial Level", "IR Outer Level" and "IR Inner Level". The "Outer
Level", "Inner Level" and "Coaxial Level" are used when viewing a thick component that has a flat surface. The "IR
Outer Level" and "IR Inner Level" emit infrared light and are used for marks whose surface is uneven or reflects light, or
when the characters on the surface are hard to read.
Set the lighting levels to an optimum value between "-1" and "+5" while viewing the image on the vision monitor, so
that the target image is clearly seen.
2-79
6 Press the [Teach] button to perform teaching input.
There are two ways to perform teaching input: "one-point input" and "multi-point input".
1. One-point input
Check that the target position is aligned with the center of the vision monitor, and then press the
[Teach] button. The teaching data is input to the data item (XY coordinates) you selected in step 3.
Teaching
One-point input
2
Target teaching position (XY)
Board origin
23243-P2-00
2. Multi-point input
There are two ways to perform multi-point input.
Input method 1:
First move the teaching unit to the first teaching point (1) and press the [Set Point] button. Next
move the teaching unit to the second teaching point (2) and press the [Teach] button. The center
coordinates (XY) of the two points are input to the data item (XY coordinates) you selected in step 3.
The number of teaching points (2 in this case) is shown in the "Count" box.
Teaching
Multi-point input
2
2nd teaching point
1
1st teaching point
Center coordinates (XY)
Board origin
23244-P2-00
2-80
Input method 2:
This method uses the [ClickMove] button at the lower right of the vision monitor and the [Set Point]
button to specify multiple teaching points. All teaching points must be displayed within the vision
monitor.
First move the teaching unit to a position near the center of target patterns so that all teaching
points are displayed within the vision monitor, and press the [ClickMove] button. The mouse pointer
changes to a cross cursor when it is placed on the vision monitor. Then click at the first teaching
point (1) with the mouse and press the [Set Point] button. Next click at the second teaching point
with the mouse and press the [Set Point] button. Repeat this operation at the other teaching points
(such as third and fourth points), but press the [Teach] button after clicking at the last teaching point
2
(fourth point in the example below). The center coordinates (XY) of the multiple points are input as
the teaching position. The number of teaching points (4 in this case) is shown in the "Count" box.
TIP
When the [Click Move] button is pressed and the mouse pointer is placed within the vision monitor, the mouse pointer
changes to a cross pointer. Place the cross pointer at the position you want to teach and press the left mouse button.

The camera will move to the teaching position to display it in the center of the vision monitor.
Teaching
Multi-point input
Vision monitor
4 3
4th teaching point 3rd teaching point
Center coordinates (XY)
2
1 2nd teaching point
1st teaching point
Cross cursor
23245-P2-00
c CAUTION
If you want to cancel the previous teaching point you specified, click the [Clear] button. A previous teaching point is
canceled each time the [Clear] button is pressed. However, the teaching points cannot be canceled once the [Teach]
button is pressed. In this case, redo the teaching from the beginning.
2-81
7.3.2 Cursor teaching
In cursor teaching, a teach window with any desired size is displayed on the vision monitor, and the position
data at the center of the window is obtained. The cursor teaching allows obtaining a more accurate value than
with normal teaching. Note that this function cannot be used unless the marks and patterns fit in the vision
monitor.
1 Open the cursor teach screen.

Press the [Cursor] tab to open the cursor teach screen.
2 Clamp a board.
2 Clamp a board on the conveyor.
3 Set the teaching conditions.

Set the "table", "teaching unit", "speed", and "fiducial correction".
4 Select the item (data) to perform teaching.

Cursor teach screen
Select data row to perform teaching.
24247-P2-00
5 Move the teaching unit (camera) to the target position.

Check safety and stay out of the axis movement range, open the [Point] tab to return to the point
teach screen, and move the teaching unit (camera) to the target position using the axis move keys.
6 Adjust the lighting levels as needed.

If the target image is not clearly displayed on the vision monitor, press the [Light] button and adjust the
lighting levels.
If the "Outer Level" and "Inner Level" are OFF or set to "0", increase these lighting levels to about "+4" and
check that the target image is clearly displayed on the vision monitor. The "Coaxial Level" should be set
to "0".
If the surface of the target is glossy or uneven, using the "IR Outer Level" and "IR Inner Level" infrared
lighting may be effective.
2-82
7 Adjust the teach window size and position.
Press the [Cursor] tab to re-open the cursor teach screen.
Then adjust the teach window size and position as explained below, so that the target patterns or marks
fit in the teach window.
Teach window display screen
Teach window

Pattern
24248-P2-00
1. Crosshairs are displayed on the vision monitor as the guide lines. The red frame displayed on the
vision monitor is the teach window. Adjust the teach window size and position using the [Start], [End],
[Move] and arrow buttons.
2. Press the [Start] button.
When this button is pressed, the top and left sides of the teach window frame changes to bold lines.
The teach window can be enlarged or reduced with the arrow keys, using the lower right corner of
the window as a stationary point. The window size can also be adjusted by dragging the mouse after
placing the mouse cursor on the frame (mouse cursor changes to a 2-way arrow).
Teach window display – Moving top and left sides
Teach window
Pattern Stationary point
24249-P2-00
2-83
3. Press the [End] button.
When this button is pressed, the right and bottom sides of the teach window frame changes to bold
lines. The teach window can be enlarged or reduced with the arrow keys, using the upper left corner
of the window as a stationary point. The window size can also be adjusted by dragging the mouse
after placing the mouse cursor on the frame (mouse cursor changes to a 2-way arrow).
Teach window display – Moving right and bottom sides
Stationary point Teach window
2
Pattern
24250-P2-00
4. Press the [Move] button.

When this button is pressed, the teach window frame changes to bold lines on all sides. The entire
window can be moved with the arrow keys, or by dragging the mouse after placing the mouse
cursor in the window (mouse cursor changes to a 4-way arrow). The window size can also be
adjusted by dragging the mouse after placing the mouse cursor on the frame.
Teach window display – Moving entire window
Teach window
Pattern
24251-P2-00
2-84
5. Adjust the teach window to enclose the pattern or mark as shown below.
Teach window
For pattern For mark
Pattern Mark
Teach window
23246-P2-00 2
8 Press the [Teach] button.
The center position coordinates of the teach window are input as the teaching position.
2-85
7.3.3 Parts shape teaching
In parts shape teaching, the parts shape defined in the parts information (hereafter referred to as "definition
shape") is displayed on the vision monitor and it is matched to the land pattern to find the mounting position
coordinates.
By matching the definition shape to the land pattern, the correct teaching can be performed for even parts that
are difficult to find the center position in the normal teaching.
c CAUTION
The parts shape teaching is not applicable to parts using the specific recognition algorithm. (See "About parts shape
2
teaching compatible/incompatible parts" described later.)
When selecting a part that is not applicable to the parts shape teaching, the following error message will appear and
the operation cannot be performed.
Parts shape teaching

Example of error screen
24262-P2-00
1 Clamp a board.
2 On the [Board]-[Mount] tab screen, press the [Teach] button to open the Teach
screen.
Select data, for which you want to perform the teaching from the Teach screen.
[Board]-[Mount] screen
Teach screen
Select data.
24263-P2-00
2-86
3 Set the conditions and press the [Trace] button.
1. Set the table, teaching unit, speed, and fiducial correction.
Select the camera in "Teaching Unit" and check on [Fiducial Correction].
2. Press the [Trace] button to move the teaching unit (camera) to the target position.
Teaching screen

24264-P2-00
4 Open the Parts shape teaching screen.

Press the [Parts Shape] tab to open the Parts shape teaching screen. The definition shape and land
pattern are displayed on the vision monitor.
[Parts Shape] tab screen
Definition shape
2465-P2-00
2-87
5 Adjust the definition shape display position.
1. Operate the arrow button so that the definition shape displayed on the vision monitor meets the
land pattern so as to adjust the definition shape display position. (The movement amount can be
selected with the [1Pixel] button or [10Pixel] button.)
2. Press the [Teach] button. When pressing the [Teach] button, the center position coordinates of the
definition shape are then entered.
Parts Shape screen
2 Match the definition shape to the land pattern.

The center position coordinates of the definition shape are entered.

24266-P2-00
6 Press the [Trace] button.

The teaching unit (camera) moves to the coordinate position acquired in Step 5.
At this time, check that the center point of the vision monitor meets the center points of the definition
shape and land pattern.
When the part size is large and the entire definition shape is not displayed on the vision monitor,
decrease the display magnification to display the entire shape.
Parts Shape screen

Trace
Check the center point.

24267-P2-00
2-88
■ About parts shape teaching compatible/incompatible parts
The parts shape teaching is not applicable to parts using the specific recognition algorithm.
For details about parts shape teaching compatible or incompatible parts by recognition algorithm, see the table below.
Supported by parts shape

Alignment Group Alignment Type Algorithm teach
Support / Non-support
Chip Std.Chip Normal Support
1: Chamfer Lead Support
2
2: Check Lead Brightness Support
3: Check Direction Support
4: Check Center Brightness Support
5: Retry Lead Center Search Support

8: Chip Array Support
Melf Chip Normal Support
Bare.Chip Normal Support
12: Size Fitting Support
14: Small Bare Chip Support
Cylinder Normal Non-support
Sp.Chip Normal Support
Small Chip Normal Support
Ball Simple BGA Normal Support
1: Check Polarity Support
3: Simple White BGA Support
BGA Normal Support
4: White BGA Support
7: CGA Support
12: Ball Circularity Check Support
Simple FlipChip Normal Support
1: Outside Bump Recognition Support
FlipChip Normal Support
2: Simple High Speed Support
IC 2Ends Normal Support
10: Check Upside-Down Support
Mini-Tr/SOT Normal Support
P-Tr Normal Support
SOP Normal Support
1: Side Lead Fitting Support
6: Check Global Lead Bend Support
7: Direction Check by Lead Width Support
8: Check Lead Position Support
SOJ Normal Support
2-89
Supported by parts shape
Alignment Group Alignment Type Algorithm teach
Support / Non-support
IC QFP Normal Support
4: Check Lead Length Support
PLCC Normal Support
2 2: NS Base Search
3: WE Base Search
4: Check Direction
Support
Support
Support
OffLead Normal Support

Connector Con-E Normal Support
Con-NSEW Normal Support
Odd.Con Normal Support
Special Special 1: Side Lead Fitting Support
2: Long Connector Support
9: Insertion-Component Support
Odd.Chip Normal Support
AsMark Normal Non-support
1: Mark Line Non-support
2: 2 Objects Non-support
3: 4 Objects Non-support
4: General Non-support
6: Check Direction Non-support
8: 2 Objects (Angle of Terminal) Non-support
Sp.Quad Normal Non-support
When “Center Detection

Algorithm” is“Center of :
3: Check Direction
Non-support
“Apex of Rectangle” : Support
8: Shield Frame Support
When “Center Detection

Algorithm” is“Center of :
10: Check Upside-Down
Non-support
“Apex of Rectangle” : Support
11: 4 Corner Fitting Support
Gravity Normal Non-support
Ignore Normal Non-support
Smart Recognition Normal Non-support
2-90
Contents
1. Using component feeders other than tape feeders 3-1

1.1 Wide Multi-Stick feeders 3-1
1.2 Auto/external tray changer 3-5
1.3 MTF (Manual tray feeder) 3-11
2. Coplanarity checker 3-16

2.1 Limitations on using the lead coplanarity checker 3-16
2.2 Machine data setting 3-17
2.3 Setting the board data 3-18
2.3.1 Board information 3-18
2.3.2 Parts information 3-19
2.3.3 Optimizing the parameters in Parts Adjust mode 3-20
2.4 Coplanarity check errors 3-23
3. Force control (YS88) 3-24

3.1 Limitations on using force control 3-24
3.2 Force control setting 3-24
3.2.1 Setting method 3-24
4. Tape cutter 3-27

4.1 Tape cutting during component mounting 3-28
4.2 Tape cutting during board conveying 3-28
4.3 Other settings 3-29
5. Recovery pallet 3-31

1. Using component feeders other than tape feeders
1.1 Wide Multi-Stick feeders
When using wide multi wide multi stick feeder components, make the following settings.
1 Set a stick feeder on the feeder plate.

Install the stick feeder on the feeder plate, at a position that meets the following two conditions.
1. Within the working range of the moving camera:
The moving camera is used for teaching the component pickup position.
2. On the front feeder plate:
The component information is specified based on the component supply from the front feeder plate.
2 Select the component data.

Open the Parts screen, and select the data row of the component which is supplied by the wide multi
3
stick feeder.
3 Set "Package" of the Basic parameters to "Stick".

On the [Basic] tab screen, set the "Package" parameter to "Stick".
Selecting the component
Parameters for using options
24300-P2-00
3-1
4 Set "Feeder Type" of the Basic parameters.
Form the lower drop-down list box, select "WideMultiStk" or "MultiStick".
Select "Feeder Type".
3 5 Set "Feed Timer Offset" of the Bacsic parameters.

The Feed timer offset is a parameter that determines the vibration time (component transfer time) of the
24301-P2-00
feeder.
The default parameter is "Normal (0)" and it vibrates for 2 seconds.

Set a parameter within the range of +4.0 to -3.5 depending on the condition of component.
n NOTE
The timer value registered in the machine is originally set to 2 seconds. If a parameter of -2.0 or less is selected, the
calculated value will be 0 or less second and the parameter will be invalidated. In that case, the "Normal (0)" will be
applied.
6 Set "Feeder Set No." of the Pick parameters.

Enter the number of the feeder set position (target mark position) at which the stick feeder knockpins
are inserted into the feeder plate.
Enter the feeder set position
Enter the feeder set position.
24302-P2-00
3-2
7 Set "Position Definition" of the Pick parameters.
Form the lower drop-down list box, select "Teaching" or "Relative".
n About "Position Definition"

This is a parameter to specify the method for obtaining the coordinates of a component pickup position.
Automatic:
When "Automatic" is selected, the machine automatically calculates the pickup position based on the feeder
plate reference position. Select this setting when using components whose pickup position is independent of
the component size, such as tape feeders.
Teaching:
Select "Teaching" when using components whose pickup position varies depending on the component type,
such as multi-stick feeders. In this case, you must teach the pickup position with respect to the machine origin.
Since the feeder set position has to be fixed when "Teaching" is selected, the data optimization mode is not
applied.
Relative:
As with "Teaching", select this setting when using components whose pickup position varies depending on the
component type, such as multi-stick feeders. In this case, however, the pickup position will be a distance from
the reference pickup position (feeder positioning knockpin) of an 8mm tape feeder. Unlike "Teaching", the data
optimization can be applied. Off-line data input is also possible.
3
c CAUTION

When you make off-line settings, enter the correct XY distance from the feeder knockpin to the component pickup
point in the X and Y parameter fields.
8 Move the teaching unit to the feeder set position by trace.

Before teaching the pickup position on the wide multi-stick feeder, use the trace function to move the
teaching unit to a point near the pickup position as explained blow.
1. Set the Position Definition parameter to "Automatic".
The XY coordinates of the feeder set position specified in Step 6 are automatically entered in the X
and Y parameter fields.
2. Press the [Teach] button to open the trace window.
Teach / Trace window
Set the trace conditions.

24303-P2-00
3. Check the trace conditions ("camera" is set in the "Teaching Unit" field and a value ranging from 20
to 40 is set in the "Speed" field).
4. Press the [Trace] button to execute the trace. The teaching unit then moves to the coordinate
position set in the X and Y parameter fields.
3-3
9 Teach the pickup position.
Referring to the procedure below, teach the coordinates of the component pickup position.
1. Change the Position Definition parameter to "Relative".When you do not want to change the feeder
set position by data optimization after creating the board data, set this parameter to "Teaching".
2. Press the [Teach] button to open the teach window.
3. Use the arrow buttons to move the head so that the cross cursor is positioned at the center of the
component and then press the [Teach] button to input the teaching position.
TIP
If it is difficult to position the cross cursor at the center of the component, use the [ClickMove] button. When you place
the cursor after pressing the [ClickMove] button, the pointer cursor changes to the [+] cursor. Position the [+] cursor at
the center of the component and click the mouse. The head automatically moves to the position you clicked
(centerof component).
Teaching position
Component
3
Cross cursor
(Teaching position)
22300-P2-00
Relative teaching
Feeder positioning
Pickup point
knockpin
22301-P2-00
3-4
1.2 Auto/external tray changer
When using an auto tray stacker (ATS) or external tray changer to supply components, make the following
parameter settings.
c CAUTION
The following settings apply to the YS88, YS100, YS12F, YS24X (single-lane / dual-lane), YC8, YSM40 (2-beam) and Z:LEX
(YSM20), and do not apply to the YS12, YS12P, YS24 , YS24X (dual-stage) and YSM40 (4-beam).
1 Make the component setups.

Set the tray components on the pallets.
2 Select the component.

Open the Parts screen and line up the cursor with the tray component supplied from the ATS or tray
changer.

24304-P2-00
3 Set the "Package".

On the [Basic] tab, set the "Package" to "Tray".
4 Set the "Feeder Type".

On the [Basic] tab, set the "Feeder Type" according to the tray feeder type you are using.
• sATS/sATSII : Set to "Auto TC".
• ATS15 : Set to "Auto TC".
• cATS/cATS10 : Set to "Auto TC".
• dYTF : Set to "Ext. TC".
3-5
5 Set the "Position Definition".
On the [Pick] tab, set the "Position Definition" to "Teaching".
Position Definition
24305-P2-00
3 6 Set the "Use Feeder Optimize" to "No".

On the [Option] tab, set the "Use Feeder Optimize" to "No".
7 Set the Tray parameters.

Open the [Tray] tab and set each parameter as follows.
Tray parameters
24306-P2-00
A, B: Comp. Amount XY
Enter the number of components in the XY directions on a tray. When using a tray shown in the figure below, for
example, set the "Comp. Amount X" to "5" and the "Comp. Amount Y" to "4".
C, D: Comp Pitch XY
Enter the component pitch (center to center spacing) in millimeters in the XY directions.
3-6
E, F: Current Pos. XY
These parameters indicate which row and column on a tray the component is currently picked up from. The row and
column on a tray are counted from the tray origin (see the reference below). Normally, enter "1" in both the "Current Pos.
X" and "Current Pos. Y" parameters when you have created new component information.
Since these parameters automatically change as the components are picked up, so you can check which row and column
on the tray the components have been used from.
TIP
The pallet origin is the front left corner of the pallet when viewed from the pallet extract neck. The tray origin is the
center of the component on the tray which is nearest the pallet origin.
Comp Amount / Current Pitch / Current Pos. settings
Y-Comp. Amount Current Pos. X Current Pos. Y
4
1,4 2,4 3,4 4,4 5,4
Y-CompPitch
3
1,3 2,3 3,3 4,3 5,3
2
1,2 2,2 3,2 4,2 5,2
1
1,1 2,1 3,1 4,1 5,1
Tray origin
1 2 3 4 5 X-Comp. Amount

Pallet origin
X-CompPitch
23302-P2-00
Pallet origin and tray origin
Tray origin
X
Pallet origin
Pallet extract neck
23303-P2-00
G, H: Tray Amount XY
These parameters specify the number of trays set in the XY directions on a pallet. For example in Figure A below, enter
"2" for the "Tray Amount X" parameter, and "1" for the "Tray Amount Y" parameter. In the case of Figure B, enter "1" for
the "Tray Amount X" parameter, and "2" for the "Tray Amount Y" parameter.
I, J: Tray Pitch XY
These parameters set the center to center spacing of the adjacent trays on a pallet. For example in Figure A below, enter
"150.00" for the "Tray Pitch X" parameter, and "0.00" for the "Tray Pitch Y" parameter. In the case of Figure B, enter
"0.00" for the Tray "Pitch X" parameter, and "100.00" for the "Tray Pitch Y" parameter. When only one tray is set on a
pallet, both the "Tray Pitch X" and "Tray Pitch Y" parameters should be "0.00".
3-7
K, L: Current Tray XY
These parameters indicate which row and column on a pallet the tray is currently used. Normally, enter "1" for both
"Current Tray X" and "Current Tray Y" parameters. When you specify "1" for these parameters, the machine starts pickup
from the tray placed closest to the pallet origin. Normally, enter "1" in both XY parameters.
Tray Amount / Tray Pitch settings
A Tray B
150.00
1, 2
100.00
1, 1 2, 1 1, 1
Pallet origin
X-CurrentTray Y-CurrentTray
23304-P2-00
3
M: Tray Height
Enter the thickness (mm) of the tray.
Tray height
Component Tray
A B
Tray height = A - B
23305-P2-00
N, O: Pallet No. Start, Pallet No. Last

These parameters indicate the pallet positions in a magazine (pallet storage) where the components to be used are stored.
For example, when the components are stored on the pallets No. 3 to No. 5, enter "3" in the "Pallet No. Start" and "5" in
the "Pallet No. Last".
Pallet No. Start / Pallet No. Last
3
4
5
23306-P2-00
P: Pallet No. Current

Enter the pallet position No. to start from for component pickup. Normally enter the same value as specified for "Pallet
No. Start". This parameter automatically changes as components on each pallet are used up, so you can check which
pallet in the magazine is currently being used.
Q: Pallet Pitch Z
Specify the vertical spacing of pallets stored in the magazine.
"Normal" : Select when storing pallets at normal spacing.
"×2" : Select when storing pallets at double spacing.
"×3" : Select when storing pallets at triple spacing
"×4" : Select when storing pallets at quadruple spacing.
3-8
8 Enter the component pickup position.
Open the [Pick] tab and enter the pickup XY position which is viewed as the tray origin, as explained
below.
Pickup position
Y
Pickup position: Ymm

X
Pallet origin Pickup position: Xmm
23307-P2-00
n When using an auto tray changer (sATS, wATS, etc.)

1. On the [Pick] tab, enter "0.00" in the "X (mm)" and "Y (mm)" fields.
2. With the "X (mm)" and "Y (mm)" fields selected (highlighted), press the [Teach] button.
3
The teach (trace) window appears.

3. Set the teaching conditions. (Select "First Head" as the teaching unit and set the speed to around "10".)
4. Press the [Trace] button to perform trace.
The pallet specified by the "Pallet No. Start" parameter on the [Tray] tab will be drawn out and set on the stage. The
teaching unit will then move to the pallet origin (X=0.00, Y=0.00).
5. Using the arrow keys on the [Point] tab, move the teaching unit and align it with the tray origin position that is the
center of the component in the tray pocket closest to the pallet origin. (In most cases, the component in the front left
corner on the tray as viewed from the front of the mounter.)
6. Press the [Teach] button on the [Point] tab to teach and enter the current position in the "X (mm)" and "Y (mm)" fields.
n When using an external tray changer (dYTF, etc.)
1. Open the [Pick] tab and enter about "10.00" in the "X (mm)" and "Y (mm)" fields.
2. With the "X (mm)" and "Y (mm)" fields selected (highlighted), press the [Teach] button.
The teach (trace) window appears.
3. Set the teaching conditions. (Select "First Head" as the teaching unit and set the speed to about "10".)
4. Press the [ACTIVE] button on the teaching panel of the external tray changer and then press the [TRACE] button.
The pallet specified by the "Pallet No. Start" parameter on the [Tray] tab will be drawn out and set on the stage. The
beam pointer will then move to the XY position you set in step 1.
Teaching panel
External tray changer
[ACTIVE] button [TRACE] button
SCROLL SCROLL
ACTIVE TRACE
UP DOWN
MULTI
SPEED CLEAR
TEACH
[Arrow] keys [TEACH] button

23308-P2-00
3-9
5. Using the [Arrow] keys on the teaching panel, move the beam pointer and align it with the center of the component in
the tray pocket closest to the pallet origin.
6. Press the [TEACH] button on the teaching panel to teach and enter the current position in the "X (mm)" and "Y (mm)"
fields.
n NOTE
For more details on how to use the tray changers and teaching panel, refer to the "Optional Equipment manual".
TIP
The pickup position "X (mm)", "Y (mm)" for an auto tray changer or external tray changer can also be entered with an
offline program. In this case, enter the pickup position offset relative to the pallet origin.
3
3-10
1.3 MTF (Manual tray feeder)
When using an MTF (manual tray feeder), set the component parameters as explained below.
c CAUTION
The following settings apply to the YS100, YS12P and YS12F only, and do not apply to the YS12, YS88, YS24, YS24X, YC8,
YSM40 and Z:LEX (YSM20).
1 Make the component setups.

Set the components on the tray.
2 Select the component.

Open the component information and line up the cursor with the tray component to be supplied from
the MTF.

24326-P2-00
3 Set the "Package".

On the [Basic] tab, set the "Package" to "Tray".
4 Set the "Feeder Type".

On the [Basic] tab, set the "Feeder Type" to "Fix. TF".
3-11
5 Set the "Feeder Set No.".
On the [Pick] tab, set the "Feeder Set No." to a number from 101 to 108 (101 to 107 if an optional dump
station is installed).
When using a single kind of tray component, enter "101". When using 2 or more kinds of tray
components, enter 102, 103... and so on.)
Pick parameters
"Position Definition"
3
Enter a number from 101 to 108 (107).
24327-P2-00
6 Adjust the conveyor width.

1. Open the [Unit] - [Conveyor] tab screen.
2. Press the [Width] button.
The Conveyor Width dialog box appears. Enter the board width in millimeters and press the [OK]
button.
The conveyor width will be adjusted to the board width.
3. Press the [Parts] button to return to the component information screen.
7 Set the "Position Definition".

On the [Pick] tab, set the "Position Definition" to "Teaching".
"Use Feeder Optimize" parameter setting
24328-P2-00
8 Set the "Use Feeder Optimize".

On the [Option] tab, set the "Use Feeder Optimize" to "No".
3-12
9 Set the Tray parameters.
Open the [Tray] tab and set each parameter as follows.
Tray parameters
3
24329-P2-00

A, B: Comp. Amount XY
Enter the number of components in the XY directions on a tray. When using a tray shown in the figure below, for
example, set the "Comp. Amount X" to "5" and the Comp. Amount Y to "4".
C, D: Comp Pitch XY
Enter the component pitch (center to center spacing) in millimeters in the XY directions.
E, F: Current Pos. XY
These parameters indicate which row and column on a tray the component is currently picked up from. The row and
column on a tray are counted from the tray origin (see below). Normally, enter "1" in both the "Current Pos. X" and
"Current Pos. Y" parameters when you have created new component information.
Since these parameters automatically change as the components are picked up, so you can check which row and column
on the tray the components have been used from.
c CAUTION
The MTF (manual tray feeder) is installed to the movable conveyor rail. The conveyor width must be adjusted to the
board width before setting component information used with the MTF.
Comp Amount / Current Pitch / Current Pos. settings
Y-Comp. Amount Current Pos. X Current Pos. Y
4
1,4 2,4 3,4 4,4 5,4
Y-CompPitch
3
1,3 2,3 3,3 4,3 5,3
2
1,2 2,2 3,2 4,2 5,2
1
1,1 2,1 3,1 4,1 5,1
Tray origin
1 2 3 4 5 X-Comp. Amount
Pallet origin
X-CompPitch
23302-P2-00
G, H: Tray Amount XY
These parameters specify the number of trays set in the XY directions on a pallet. For example in Figure A on the next
page, enter "2" for the "Tray Amount X" parameter, and "1" for the "Tray Amount Y" parameter. In the case of Figure B,
enter "1" for the "Tray Amount X" parameter, and "2" for the "Tray Amount Y" parameters.
3-13
I, J: Tray Pitch XY
These parameters set the center to center spacing of the adjacent trays on a pallet. For example in Figure A below, enter
"15.00" for the "Tray Pitch X" parameter, and "0.00" for the "Tray Pitch Y" parameter. In the case of Figure B, enter "0.00"
for the "Tray Pitch X" parameter, and "10.00" for the "Tray Pitch Y" parameter. When only one tray is set on a pallet, both
the "Tray Pitch X" and "Tray Pitch Y" parameters should be "0.00".
K, L: Current Tray XY
These parameters indicate which row and column on a pallet the tray is currently used. Normally, enter "1" for both
"Current Tray X" and "Current Tray Y" parameters. When you specify "1" for these parameters, the machine starts pickup
from the tray placed closest to the pallet origin. Normally, enter "1" in both XY parameters.
Tray Amount / Tray Pitch settings
150.00
1, 2
100.00
3 1, 1 2, 1 1, 1
X-CurrentTray Y-CurrentTray
Figure A Figure B
22309-P2-00
M: Tray Height
Enter the thickness (mm) of the tray.
Tray height
Component Tray
A B
Tray height = A - B
23305-P2-00
N, O: WastedSpace Left, Light

This setting is not necessary.
P: CountOutStop
When this parameter is set to "Exist", the machine automatically stops when the specified number of components are
used up. When set to "Nothing", the machine returns to the first position to continue component pickup after the
specified number of components are used up. Normally set this parameter to "Nothing".
3-14
0 Enter the component pickup position.
Enter the pickup XY position which is viewed as the tray origin, as explained below.
1. Open the Pick tab and enter "0.00" in the "X(mm)" and "Y(mm)" fields.
2. With the cursor still positioned on the XY columns, press the [Teach] button. The trace window
appears.
3. Set the trace conditions as follows.
Teaching unit : First head (Head1)
Speed : Slow speed (about 10)
4. Press the [Trace] button to perform trace.
Head 1 of the mounter moves to the machine origin.
5. Move the teaching unit to the tray origin position.
Use the arrow buttons on the Point tab screen to move the teaching unit directly above the center
of the component which is located nearest the machine origin. This component is usually located in
the front left corner on the pallet as viewed from the front of the mounter.
6. Press the [Teach] button to enter the pickup position data in the "X(mm)" and "Y(mm)" fields.
c CAUTION
The MTF (manual tray feeder) is installed to the movable conveyor rail. The conveyor width must be adjusted to the
board width before setting component information used with the MTF.
3
3-15
2. Coplanarity checker
2.1 Limitations on using the lead coplanarity checker
There are the following limitations on using the lead coplanarity checker.
c CAUTION
This function can only be used with the YS88, YS100, YS24X, YSM40 (MU/FL) and Z:LEX (YSM20) and cannot be used
with the YS12, YS12P, YS12F, YS24, YC8 and YSM40 (HS).
1. Even when components subjected to coplanarity check are picked up by the heads at the same timing, they are not
recognized simultaneously if the recognition "pass" count (see below) is different.
2. The cycle time will be longer because the number of images to acquire increases to perform coplanarity check.
n Recognition "pass" count
3
The recognition "pass" count indicates how many times the component passes over the multi-vision cameras (or the
number of images to be acquired with the multi-vision cameras).
2 pass count: SOP standard mode and QFP fast mode
3 pass count: BGA standard mode
4 pass count: QFP standard mode
■ Applicable components
Coplanarity check can be performed on components for which the Alignment Type parameter is set to the following:
• SOP, QFP, OffLead, Con-E, Con-NSEW, Odd. Con, or BGA
3-16
2.2 Machine data setting
To enable the coplanarity check function, the following machine data must be set correctly. The necessary
setting has been made at factory prior to shipping when your machine is equipped with a coplanarity checker.
1 Open the machine data window.

Press the [Machine] button to open the machine data window (VmSpec window).
2 Set the "Co-Planarity Checker" parameter.

In the left-pane tree view, select "Setting" - "Machine Information" - "Installation Setting", and then set
the "Co-Planarity Checker" parameter to "Atable Exist".
Machine data setting

[Save] button Set this parameter to "A-table Exist".

24309-P2-00
3 Save the machine data.

Click the [Save] button (floppy disk icon) to save the machine data and then close the machine data
window with the [Close] button in the upper right corner of the window.
3-17
2.3 Setting the board data
In addition to the standard multi-vision camera for component recognition, the coplanarity checker uses a
custom multi-vision camera specifically designed for lead coplanarity measurements. The 3D image of a
component is detected by these two cameras to measure coplanarity of leads. This section explains the board
data parameters that must be set to use the coplanarity checker.
2.3.1 Board information

Press the [Board] button, select the [Board] tab and set the "3D Co-Planarity" parameter to "Use". If this
parameter is set to "NotUse", the coplanarity checker will not be used, regardless of the "3D Co-Planarity
Threshold" parameter setting on the [Parts]-[Vision] tab.
Board information screen
3
Set to "Use".
24310-P2-00
3-18
2.3.2 Parts information
To check lead coplanarity of individual components, make the following setting on the Parts screen.
1 Open the Parts screen.

Press the [Parts] button to open the Parts screen and select the component for which you want to
check lead coplanarity.
2 Open the [Vision] tab and set the "3D Co-Planarity Threshold" parameter.
The "3D Co-Planarity Threshold" parameter determines the tolerance range of lead coplanarity and can
be set from 50 to 300 in 10 micron steps. The smaller this value, the more strict the coplanarity check
becomes. Set to "NotUse" if you do not want to check lead coplanarity of the selected component.
Parts information screen

Set "Inspection Mode". Set to a value other
than "NotUse".
24311-P2-00
3 Set the "Height Check" parameter.

When you want to check the front and back of an SOP or QFP, enter the criterion value here. In most
cases, set a value which is about 70% of the component height (thickness). Leave this parameter set to
"0.00" when not checking the front and back.
4 Set the "Inspection Mode" parameter.

Set to "Standard" in most cases.
n Inspection Mode
Inspection Mode Component type Inspection sequence Notes
When leads exist only on the WE sides of the

package, a 2-pass operation is performed. If
Components with wire "Standard" is selected for components that go
4-pass operation
leads out of the field of view when rotated 90 degrees,
Standard
an error will result. Select "Fast" for those
components.
BGA 3-pass operation
The inspection time will be reduced, but

accuracy may drop depending on the component
Components with wire types because the inspection is simplified.
Fast 2-pass operation
leads When selecting "Fast", it is advisable to prepare
a good component and a bad component and to
make sure whether they are correctly checked.
3-19
2.3.3 Optimizing the parameters in Parts Adjust mode
1 Open the Parts Adjust screen.

After selecting the component for coplanarity check, press the [Parts Adjust] button and then press the
[3D] button.
Parts Adjust screen
3
24312-P2-10
3-20
2 Run a vision test.
Press the [Test] button to run a vision test of the selected component. The component will be recognized
by the standard multi-vision camera and co-planarity check camera, and the lead coplanarity
measured.
After the component is recognized, the coplanarity measurement results are displayed in the Result box.
When you want to check the detailed recognition results at each "Pass", press the [Co-Planarity] button
to open the "Co-Planarity Checker dialog" window.
n NOTE
If you do not want to measure the lead coplanarity, the "3D Co-Planarity Threshold" parameter on the [Parts] – [Vision]
tab should be set to "NotUse".
”Co-planarity Checker dialog” window

[Test] button

24313-P2-00
3 Press the [Find Best] button to optimize vision parameters.

In addition to the vision parameters for the standard multi-vision camera, the parameters for coplanarity
check – "3D Threshold", "3D Main Lighting Level", "3D Coax Lighting Level", "3D Side Lighting Level", "3D
Bright Area" (ball lead components) - will be optimized. Other parameters should be entered manually
as needed.
n Vision parameters
Parameters for coplanarity check
Parameter Description
Enter the allowable coplanarity value. A coplanarity error is detected if non-uniformity of the lead bottom
3D Co-Planarity Threshold
plane exceeds this value. Set this parameter to "NotUse" if you do not want to check lead coplanarity.
This is the threshold level used to process an image recognized by the coplanarity check camera. An
3D Threshold
optimal threshold level will be found with the [Find Best] button in Parts Adjust mode.
This is the main lighting level used to recognize an image with the coplanarity check camera. An optimal
3D Main Lighting Level
lighting level will be found with the [Find Best] button in Parts Adjust mode.
This is the coaxial lighting level used to recognize an image with the coplanarity check camera. An
3D Coax Lighting Level
optimal lighting level will be found with the [Find Best] button in Parts Adjust mode.
This is the side lighting level used to recognize an image with the coplanarity check camera. An optimal
3D Side Lighting Level
lighting level will be found with the [Find Best] button in Parts Adjust mode.
This is the ratio (%) of the bright area (light-reflecting solder ball area) to the entire package area, which
3D Bright Area should be detected when recognizing a ball lead component such as BGA with the coplanarity check
camera. This ratio will be found with the [Find Best] button in Parts Adjust mode.
Set this parameter when checking the front and back of a component such as SOP and QFP. In most
3D Height Check
cases, set a value which is about 70% of the component thickness.
Inspection Mode Select "Normal" in most cases. You can also select "Fast" for components with wire leads.
3-21
4 Check the test results
1. Coplanarity check results are displayed in the lower grid of the "Co-planarity Checker dialog"
window. If the "Max-Min Co-planarity" value is larger than the "3D Co-Planarity Threshold" value you
set in the [Parts] - [Vision] tab grid, a coplanarity error occurs.
2. If the absolute value of "Component thickness (Body Size Z) – Detected component thickness" is
larger than the "3D Height Check" parameter setting, then a recognition height error will occur
during automatic operation.
Result display Allowable value set in

Error [Parts] - [Vision] tab grid
3
Error number Coplanarity value Recognition height

24314-P2-00
3-22
2.4 Coplanarity check errors
Possible errors that may occur during coplanarity check are listed below.
n NOTE
When a coplanarity error (vertical misalignment of a lead from the seating plane) is detected, an error Ea209 (see
table below) is issued.
n Error list
Coplanarity check errors
Error No. Error message and description
A lead coplanarity error occurred during 3D coplanarity

measurement. Coplanarity of a lead or ball is outside the
Ea209 3D COPLANARITY ERROR
tolerance range specified by the "3D Co-Planarity Threshold"
parameter on the [Parts]-[Vision] tab.
3D COPLANARITY CHECKER Component body shape could not be detected correctly during
Ea210
3
RECOGNITION ERROR 3D coplanarity measurement. Check the component.
3D COPLANARITY CHECKER
Lead or ball height could not be detected correctly during 3D
Ea211 HEIGHT RECOGNITION
coplanarity measurement. Check the component.
ERROR
3D COPLANARITY CHECKER A bent lead or some dust was detected during 3D coplanarity
Ea212
LEAD BEND ERROR measurement. Check the component.

This error occurs if the absolute value of "Component thickness
(Body Size Z) – Detected component thickness" is greater than
3D COPLANARITY CHECKER
Ea214 the value specified in the "3D Height Check" parameter. The
PLANE HEIGHT ERROR
component might not be picked up correctly. Check to see if the
head picks up the component correctly.
n NOTE
The above error numbers appear in the Error Number field in the Coplanarity Checker dialog window. Error numbers
other than above appear when an ordinary recognition error occurs.
3-23
3. Force control (YS88)
3.1 Limitations on using force control
Force control is only available for the YS88 equipped with a simple force control option. There are the
following limitations:
• YS88 simple force control is for placing connector components on a board.
• YS88 force control only supports component placement. While a nozzle is moving down, the press force is switched to
the target value and the component is placed on the board at that force.
• Simple force control cannot be used with buffering (spring-action) nozzles.
• Supported board data format is "YGX" only.
3.2 Force control setting
3.2.1 Setting method

3 c CAUTION
Open the "VmSpec" screen to set the parameters in steps 1 to 3 below. (To open the "VmSpec" screen, press the
[Machine] button in the main menu button area.) An administrator right is required to open and change the VmSpec"
settings.
1 Set the parts information mode.

On the "Installation Setting" view, set "Parts Info. Mode" to "V3.0 Extended".
"VmSpec" screen
Parts Info Mode
24322-P2-00
c CAUTION
The "Force Control" and "Target Load" parameters in the Parts information cannot be saved unless this setting is correct.
3-24
2 Set "Force Control" to "Exist".
On the "Installation Setting" view, set "Force Control" to "Exist".
"VmSpec" screen
Force Control
24323-P2-00
c CAUTION
Simple force control cannot be performed unless this setting is correct. 3
3 Set the head to perform force control.

Select "Force Control Specifications" and set the "Force Control" for the target head to "Use".
"VmSpec" screen
Head
24324-P2-00
3-25
4 Open the [Parts] - [Mount] tab and set the following parameters.
K. Force Control
Set whether or not to perform force control. Set to "Yes (Simplicity)" when using force control.
L: Target Load (N)

Enter the target load (force) in 0.1N steps from 10 to 30N.
[Parts] - [Mount] tab

K: Force Control, L: Target Load
3
24325-P2-00
3-26
4. Tape cutter
Tape cutters are internally installed as options for the YS series.
c CAUTION
This function is not available for the YC8.
■ Tape cutting during automatic operation

There are two types of tape cutting during automatic operation. Both types can be jointly used.
Machine Operation
During component mounting Tape is cut during component mounting after completion of pickup.
During board conveying Tape is cut while each board is conveyed to exit after component mounting.
3
■ Tape cutter open/close timing
Tape cutter operates according to the following timing.
Machine Cutter operation Operation details
Return to origin Opens all tape cutters immediately after

close → open

During machine power-off return-to-origin operation.
First closes tape cutters and then opens to cut
During start of automatic operation tape.
open → close → open
During reset of automatic operation Reset is done only when a component is
discarded.
Restrictions (caution)
■ Cautions for tape cutting during board conveying
Use caution when using board data where there is a large component feed length per feeder for each board, since the
tape that was cut off might hang up on the tape eject slot and does not reach the trash box.
Hang-ups usually tend to occur when cutting paper tape to a length in excess of about 240mm or when cutting embossed
tape whose width is more than 44mm or thickness is more than 15mm to a length in excess of about 160mm.
■ Setting the standard cut length and maximum cut length

Hang-ups tend to occur during tape cutting performed during component mounting if the standard cut length and
maximum cut length were set to a large figure. Set these to a shorter figure if the tape does not easily eject after tape
cutting.
Hang-ups usually tend to occur when cutting paper tape to a length in excess of about 240mm or when cutting embossed
tape whose width is more than 44mm or thickness is more than 15mm to a length in excess of about 160mm.
n NOTE
Operation buttons will be disabled during emergency stop or if an interlock is triggered.
3-27
4.1 Tape cutting during component mounting
Tape is cut during component mounting based on the actual feed length (tape feed length) that the tape is fed
from the feeder.
• Tape feed length
This is the length calculated for each feeder from the feed pitch and the tape feed count of the components during
component pickup. Tape cut length is decided during component mounting based on the longest tape length fed into one
cutter.
Tape feed length
3
24330-P2-00
• Feed pitch
Feed pitch is calculated using the feed pitch set (in memory) for the SS feeder at each station, or the feed pitch set in the
board data.
• Tape cut timing
Tape is cut after component recognition during the mounting operation.
However, no component is mounted if the tape cutting has not finished before feeding of the next component group for
pickup starts.
• Tape cutting conditions
Tape must be cut during component mounting, in the period from "Standard cut length" to "Maximum cut length" that
were preset in the machine settings.
1. Tape is always cut when tape feed length exceeds maximum cut length.
2. Tape is usually cut when tape feed length exceeds the standard cut length.
n NOTE
Tape feed length being counted when tape cutting ends normally is reset.
■ Delaying the tape cutting

• If feeders on multiple tape cutters are simultaneously longer than the standard cut length and shorter than the
maximum cut length, then the tape with longer feed lengths are cut, and cutting of tape with shorter feed lengths is
delayed.
• Even if longer than the standard cut length, the tape cutting is delayed to allow component mounting to proceed in
cases where the number of heads used in this pickup group is fewer than the specified number of heads.
4.2 Tape cutting during board conveying

All tape cutters can operate with no special restrictions while a board is being conveyed to the exit after
component mounting is completed.
However, if there has been no tape feed whatsoever in tape feeders installed on the rear feeder plate since the
last tape cutting, then the rear tape cutters will not operate.
• Tape cut timing
Tape cutting operates at the timing that the boards are unclamped and conveyed to the exit after component mounting is
completed.
• Tape cutting conditions
Tape cutting is performed each time a board is conveyed to the exit after completing component mounting, and tape
cutting starts on all tape cutters that are set enabled.
3-28
4.3 Other settings
■ Setting to use tape cutter

To use the tape cutter function, open the machine setting screen ("VmSpec" screen) and set the "Tape Cutter Drive Unit"
parameter to "Exist". The tape cutter function is disabled if set to "None".
Setting to use the tape cutter
24331-P2-00
3
■ Shared tape-cutter settings

1. Cut in Mounting
Set this parameter to "Enable" when cutting tape while components are mounted.
2. Cut in Transporting
Set this parameter to "Enable" when cutting tape while boards are conveyed.
3. Tape cut retr y
When this parameter is set to "1" or more, even if the cutter fails to cut tape, automatic operation will still continue and
the tape cutting will be repeatedly attempted at the next timing until the tape is cut or the retry count specified here is
reached. (The retry count can be set from 0 to 255.)
If you do not want the tape cutting to be retried, set this parameter to "0".
<Other operations when tape cutting is retried>
• The number of times that the tape cutting has continuously failed is counted for each cutter and is reset when the tape
cutting is complete.
• If the tape cutting fails while the "Maximum Cut Length" is reached, an error occurs and the machine stops.
Shared tape-cutter settings
1 2 3
24332-P2-00
3-29
■ Setting for each tape cutter
The following parameters can be set separately for the front and rear cutters. "Cutter 1" indicates the front cutter, and
"Cutter 2" indicates the rear cutter.
1. Cutter Use
Set this parameter to "Use" to use the cutter.
When set to "Not Use", the cutter will not operate except for the operation performed by pressing the [Cutter 1] and
[Cutter 2] buttons on the Unit screen.
2. Standard Cut Length (mm)
This setting is used only when the "Cut in Mounting" parameter is set to "Enable".
Basically, the tape is cut each time the tape feed length reaches this length. However, the tape cutting may be skipped in
some cases depending on the conditions.
3. Maximum Cut Length (mm)
This setting is used only when the "Cut in Mounting" parameter is set to "Enable".
The tape is always cut each time the tape feed length reaches this length.
3 n NOTE
When setting these parameters, the "Standard Cut Length (mm)" must be shorter than the "Maximum Cut Length
(mm)".
Setting for each tape cutter
1 2 3
24333-P2-00
n NOTE
Cutter 3 and Cutter 4 are for custom spec quad cutters.
3-30
5. Recover y pallet
The tray changer for the YS series can be equipped with recovery pallets that retrieve defective parts
detected by the recognition camera without damaging them. When using recovery pallets, the following
parameters must be set.
■ Setting for using recover y pallets

When using recovery pallets, press the [Machine] button to open the machine setting screen ("VmSpec" screen) and
select "Machine Information" - "Installation Setting". In the "Option" group, set the "Recovery Pallet" parameter to "Exist".
Setting for using recovery pallets

Set this parameter.
24334-P2-00
■ Setting maximum part sizes (Xmm, Ymm)

When changing maximum part sizes, press the [Machine] button to open the machine setting screen ("VmSpec" screen)
and select "Machine Data" - "Tray Changer" – "Position. In the "Recovery Pallet" row, set the "Max Part Size X" and "Max
Part Size Y" parameters as needed. Maximum part sizes usable by the machine are set as default values at the time of
shipment.
Maximum part sizes
Set these parameters.
Enter recovery
pallet No. here.
24335-P2-00
n NOTE
The "Maximum Part Size X" and "Maximum Part Size Y" parameters respectively correspond to the "Body Size X" and
"Body Size Y" parameters in the parts information.
3-31
• Number of parts that can be stored in one pallet
The table below shows the number of parts that can be stored when the sATSII is used. The number of parts that can be
stored in one pallet differs depending on the tray changer model.
Maximum Part Size Number of parts Number of parts Number of parts that can be
X/Y in X in Y stored in one pallet
20mm 11 7 77
32mm 8 5 40
45mm 6 3 18
n NOTE
The number of parts in X and Y directions is automatically calculated by taking account of the pickup position error
(deviation from center position) and the accessible range in the pallet. Parts will be placed at a constant pitch in a
matrix without narrowing the space between parts.
■ Setting the recover y pallet No.
3 Set the pallet number for using recovery pallets. One recovery pallet (one shelf) can be set in any desired position of
each magazine. Set to "0" when not using recovery pallets.
n NOTE
When setting board data, do not set the "Pallet No. Start" and "Pallet No. Last" parameters in the [Parts] - [Tray] tab to
the pallet No. specified as the recovery pallets or to the pallet No. that may cause the returned defective parts to
interfere with the lower or upper pallet. Set those parameters by taking account of the size of parts to be returned
and the "Pallet Pitch Z" parameter in the [Parts] - [Tray] tab, because an error may occur during loading of the board
data if there is a possibility of causing interference with other pallets. In this case, the "Pallet No. Start" and "Pallet No.
Last" parameter settings must be changed.
c CAUTION
Avoid placing a pallet (which is not to be used) in the shelf position just above the recovery pallet. That pallet may
interfere with the parts returned to the recovery pallet when the recovery pallet is stored back in the magazine.
■ Setting the disposal method

Press the [Parts] button, select the [Basic] tab, and set the "G. Dump Way" parameter to "Recovery Unit".
Setting the disposal method
Set here.
24336-P2-00
n NOTE
On the YS24X, recovery pallets can only be used for parts on the B-table. When retrieving parts on the A-table without
damaging them, dump stations must be used.
■ Recover y pallet operation

The recovery pallet operates as follows:
• When using the upper and lower magazines, defective parts are returned to the recovery pallet in the magazine from
which those parts are supplied. (Defective parts supplied from magazine 1 are returned to the recovery pallet in
magazine 1.)
• If one recovery pallet becomes full, then defective parts will be returned to the other pallet that is not full.
• When tape components supplied from the B-table side are returned, they are placed in the recovery pallet that was last
used.
3-32
Contents
1. Board parameters 4-1

1.1 Using the badmark functions 4-1
1.1.1 Badmark parameters 4-3
1.1.2 Creating the badmark information 4-5
1.1.3 Creating a local badmark 4-9
1.2 Using the board edge offset (YSM40) 4-11
2. Parts parameters 4-14

2.1 Using alternative components 4-14
2.1.1 Component switching flow 4-14
2.1.2 Setting the alternative components 4-15
2.2 Using "Parts Group No." 4-17
3. Mark parameters 4-18

3.1 Pattern matching 4-18
3.1.1 Pattern registration 4-19
3.1.2 Using the data for pattern matching 4-23
4. Edit Assistant function 4-24

4.1 Switching to the Edit Assistant screen 4-24
4.2 Selecting a range of rows 4-25
4.3 Editing rows 4-26
4.4 Find and replace 4-27
4.5 Renumber 4-28
5. Recognition image check and save function 4-30
6. Optimizing the data 4-32

6.1 Setting the optimizing conditions 4-33
6.2 Executing the optimization 4-44
7. Smart recognition function 4-46

7.1 Outline of operation 4-47
7.2 Entering component information 4-47
7.3 Creating model data 4-48
7.4 Error messages 4-55
1. Board parameters
1.1 Using the badmark functions
The badmark function permits the machine to cancel component mounting if the machine detects a badmark
affixed to the specified position on a board.
Badmark function
The machine mounts components when no badmarks are detected.
4
The machine skips mounting components when a badmark is detected.
23400-P2-00
Badmarks are broadly classified into two types: one is specified for the board data and the other is for the
mount data. These badmarks are further divided by their functions into "Board badmark", "Block badmark" and
"Local badmark".
Using the advance functions

n Board badmark
A board badmark is affixed on a board and used to determine whether or not the machine searches for block badmarks
on the board. For example, when a multi-block board (multi-board panel) with no faulty blocks (no block badmarks) is
fed to the machine, it is a loss of time to search for block badmarks on that board. The board badmark function permits
the machine to search for block badmarks only when the board badmark is detected. If no board badmark is detected,
the machine mounts components on all blocks of the board without searching for block badmarks.
n Block badmark
A block bad mark is affixed to each block which is defective. The machine mounts components only on blocks with no
badmark affixed. For example, if Block B is defective in a multi-block board (multi-board panel) consisting of 4 blocks (A,
B, C and D), affix a block badmark on Block B so that the block badmark function allows the machine to skip mounting
on Block B. Components will be mounted only on Blocks A, C and D.
c CAUTION
The block badmark function can only be used for multi-block board data with "block offset" specified on the Offset
tab screen.
n Local badmark
A local badmark is specified for each mount data. If the machine detects this badmark, it skips mounting a component at
that position.
4-1
n Badmark operation
The flow chart below shows typical methods for setting a board badmark and block badmark.
Badmark operation flows
Start
Search board badmark
Detected Not detected
Search block badmark
Detected Not detected
Operation Operation Operation

not performed for performed for performed for
the block the block all blocks
23401-P2-00
4
4-2
1.1.1 Badmark parameters
Selecting the [Badmark] tab opens the screen for setting badmark mark parameters and their coordinates. Set
these parameters as explained below when using the badmark function. Two or four badmarks are used as a
set, but it is okay if each mark is different in shape. Badmark mark data must be registered in the mark
information beforehand.
n NOTE
In the case of combined board data, the lane to be operated should first be selected and displayed with the [Lane]
button before making settings.
Badmark parameter screen
4 5 6 7 8
2
3

24400-P2-10
1. Board, Block, Local

Badmark functions are broadly classified into three types: "Board" badmark function specified for a board, "Block"
badmark function specified for each block of a multi-block board (multi-board panel), and "Local" badmark function
related to mounting data. The badmark function you want to use should be set to "Execute". To change the setting, press
the [Edit] button on the right end.
2. Board
On the top row in the grid display, set the board badmark data.
3. Block
On the second row in the grid display, set the block badmark data.
4. Pattern Name
Enter the badmark name here. (No names can be entered on the top and second rows.)
5. Type
Badmark function types are specified here. (These cannot be changed.)
6. X, Y
Enter the XY coordinates of the badmark relative to the board origin in millimeters. You can teach the position using the
[Teach] button.
7. Mark
Enter the mark No. for the badmark (mark No. registered as mark in the mark information).
4-3
9. Sort
Shows the badmark recognition sort settings. To change the settings, press the [Sort] button to open the "Sort Type For
Badmark" dialog and change the parameters.
Badmark recognition sort settings
24453-P2-00
• Sort
Select either of "No sort" or "Near mark".
• Starting Point
Set the local badmark that should first be recognized.
• Prior Direction
Set the direction in which to recognize boards.
Badmark sort setting example
4 "Starting Point" is set at front left

When "Prior Direction" is set to "X Direction" When "Prior Direction" is set to "Y Direction"
Badmark
23454-P2-00
n NOTE
The data display on the screen does not change even after setting the data in the "Sort Type For Badmark" dialog.
The setting data will be applied when board production is started.
4-4
1.1.2 Creating the badmark information
To create mark information to be used for badmarks, follow these steps.
1 Open the mark information screen.

Press the [Mark] button in the menu button area to open the mark information screen.
2 Enter mark information.

Enter the mark name, comment, and mark type.
The "Mark Type" parameter must be set to "Badmark".

Step 2
Step 1

24403-P2-00
4-5
3 Enter the vision parameters.
Open the [Vision] tab and set the "Surface Type" parameter to "Reflect" when the mark is brighter than
the board or set it to "Non-Reflect" when darker.
TIP
An optimal value for the "Mark Threshold" parameter is obtained with Mark Adjust mode explained later, so leave the
default value as is. The badmark function is used only to determine whether a mark is present or not, so there are no
strict conditions on the shape parameters such as "Shape Type" and "Mark Out Size".
4
[Vision] tab Surface Type and Mark Threshold

24448-P2-00
4 Clamp the board on the conveyor.

Open the Mark Adjust screen by pressing the [Mark Adjust] button, then use the [Convey In] button to
clamp the board on the conveyor. Skip this step when the board is already clamped on the conveyor.
4-6
5 Enter the search area.
On the Mark Adjust screen, set the "Search Area XY" parameters. The setting can be from 0.00 to 9.99
(mm). The larger the parameter values, the larger the search area.
The machine detects a badmark depending on whether it is reflective or non-reflective within the
search area, so the search area should be slightly smaller than the badmark to be detected. The values
set in the "Search Area XY" parameters define the XY size of the search area.
TIP
On the machines having two or more tables, the "Table Select" drop-down list appears. Select the table to check the
logs.
Mark Adjust screen
[Mark Adjust] button

Search Area XY
24449-P2-10
■ Mark search area
Mark search area

Mark
Enter this size in millimeters.
Mark search area
Badmark Badmark
Mark search area Mark search area
23403-P2-00
4-7
6 Set the Mark Threshold parameter.
The optimal threshold for recognizing a badmark can be found with the following procedure.
1. On the Mark Adjust screen, press the [Find Best] button to open the "Badmark Find Best" screen.
Finding optimal threshold for badmark
Threshold
4 2
24450-P2-10
2. Teach the non-mark area on the board.

Move the head (camera) to a position on the board where no marks and patterns are present, and
then press the [Undetected] button. The threshold for detecting the non-mark area is entered in the
box to the right of the [Undetected] button.
3. Teach the badmark area.
Move the head (camera) to the badmark on the board. Use the [Move Cursor] and [Select Cursor]
buttons on the "Badmark Find Best" screen as needed to adjust the badmark threshold search area
(red frame) on the vision monitor. Then press the [Detected] button. The threshold for detecting the
badmark is entered in the box to the right of the [Detected] button. At the same time, the mid value
between the two threshold values is displayed in the "Threshold" box. This value is used as the optimal
threshold when detecting the badmark.
7 Return to the mark information screen.

Press the [OK] button to return to the mark information screen.
4-8
1.1.3 Creating a local badmark
A local badmark is specified for each mount data. When a local badmark is detected at a component mounting
point, this function cancels component mounting at that point. To use this local badmark function, make the
following settings.
c CAUTION
The following steps are explained assuming that you already have the complete board data needed for component
mounting. If you are not finished with creating the board data, complete the board data and then create the local
badmarks.
1 Create the mark information.

As with other badmarks, you must first create the mark information on the local badmarks to be used.
2 Open badmark information screen.

Press the [Board] button and then select the [Badmark] tab.
The badmark information screen appears.
n NOTE
3 Set the local badmark information.
4
Badmark information screen
1 4 2 3
24402-P2-00
1. Pattern Name
Enter the pattern names for local badmarks.
4-9
2. X, Y
Enter the XY coordinates (mm) of the badmark relative to the board origin (or block repeat
reference point).
Local badmark XY coordinates
N Relative to board origin

Badmark
Board origin
N Relative to block repeat reference point

Badmark
Block repeat reference point
4
23402-P2-00
c CAUTION
You can enter the XY data of local badmarks by teaching. In this case, set the board origin data (or block repeat
reference point) correctly before teaching.
3. Mark
Enter the mark data No. to be used for local badmarks.
4. Local
Leave this item set to the default ("Execute").
4 Enter the badmarks.

1. Open the [Mount] tab and line up the cursor with the mount data row where you want to set the
local badmark function.
2. In the "Bad." column, enter the local badmark No. you have set on the [Badmark] tab.
[Mount] tab
[Mount] tab Local badmark No.
24401-P2-00
n NOTE
The local badmark function can also be utilized for automatic switching of production board types.
4-10
1.2 Using the board edge offset (YSM40)
The board edge may not be detected by the board detection sensor depending on the board shape.
This function sets a deviation in response position of the board detection sensor when detecting the board
notch or edge shape to offset the board stop position.
As a distance from the board edge to the sensor detection position is set, the correct transfer to the board
clamp position is performed.
n NOTE
The version of the software that can use this function is V4.42STD R1.000 or higher.
1 Select the board edge to be set and press the [Teach] button.
The dialog box appears, allowing you to select the board edge, for which you want to perform the
teaching. Select desired board edge and press the [OK] button.
Board edge offset

[Teach] button - Board Edge Offset Distance Teach dialog box

Select the board edge to be set.
[Teach] button
24455-P2-00
Board Edge Offset Lower Left/Lower Right/Upper Left/Upper Left
Board edge Board edge Board edge transfer direction (right m left)
Board
z 1
z : Board Edge Offset Upper Left

1 : Board Edge Offset Upper Right
y : Board Edge Offset Lower Right
x y
x : Board Edge Offset Lower Left
Sensor detection position
23412-P2-00
n NOTE
• For boards to be used for the lane 1, set "x. Board Edge Offset Lower Left" and "y. Board Edge Offset Lower Right".
• For boards to be used for the lane 2, set "z. Board Edge Offset Upper Left" and "1. Board Edge Offset Upper Right".
4-11
2 Follow the message to set a board at the entrance.
The message screen appears. Follow the instructions to set the board at the carry-in port, and then press
the [OK] button.
After the board has been transferred to the board clamp position, the fiducial camera moves to the
position where the board detection sensor starts responding and the Teach screen will appear.
Board edge offset

Message screen
4 24456-P2-00
3 Perform the teaching.

Operate the arrow buttons to display the board edge at the center of the screen, and then press the
[Teach] button.
Teach screen
Example of board edge lower left teaching
Operate these buttons to display the board edge at the center.
24457-P2-00
TIP
When pressing the [Convey Board] button, the board is moved to the entrance or exit, and then it is transferred to the
detection sensor again.
When you want to perform the teaching again or make the check again with the values obtained from the teaching,
press this button to perform the operation again.
4-12
4 Press the [Close] button to close the Teaching screen.
The screen returns to the previous screen and the teaching values are then set.
Teaching completion
Example of "x Board Edge Offset Lower Left"
The value is entered.
4
24458-P2-00
4-13
2. Par ts parameters
2.1 Using alternative components
When components in a feeder is used up during operation, the alternative component function allows the
machine to continue picking up components from another feeder specified as alternative components.
2.1.1 Component switching flow

In the alternative component function, component feed is switched in the operation flow explained below.
When the components in the current feeder run out, the machine allows automatic switching to the alternative
component feeder without interrupting operation. When one cycle using alternative components is complete,
the machine stops and a message asking you to resupply the components then appears.
Component switch flow

Tape feeder/stick feeder components
Running
Out of components
4 Automatically switches
to alternative components
Is one cycle NO
using alternative component group
complete?
YES
Were components NO
resupplied during running?
YES
Machine stops
23405-P2-00
4-14
2.1.2 Setting the alternative components
1 Select the source component.

Press the [Assistant] button on the top right of the Parts information screen to display the edit panel in
the lower area of the screen. Then, from the component data list in the upper grid, select the source
component to create the alternative component data.
2 Copy the selected component data.

Press the [Copy] button on the [Row Edit] tab.
Selecting the source component

24404-P2-00
3 Paste the component data.

Select an empty row in the component data list and press the [OwPaste] button. For example, paste
the data onto data rows No. 12 and No. 13 to use two tape feeders as alternative components.
Pasting the data as alternative components
24405-P2-00
4-15
4 Close the Edit Assistant mode screen and select the [Option] tab.
Press the [Assistant] button again to return to the normal screen and select the [Option] tab.
5 Specify the alternative component numbers.

When data No.12 and No.13 in the component data list are used as alternative components for data
No. 1, make the settings as follows.
1. Select data No.1 and set the "Alternative Parts" parameter to "12".
The settings above mean that the alternative component for No. 1 is No.12, that for No.12 is No.13,
and that for No.13 is No.1, just like making a loop as an alternative component group.
Then, open the [Pick] tab and in the "Feeder Set No." field enter the feeder position number where
you will install the feeders of the alternative components.
c CAUTION
Data No. for alternative components must make a loop.
Alternative component number settings
4
Set to "12".
Set to "13".
Set to "1".
24406-P2-00
4-16
2.2 Using "Parts Group No."
Use "Parts Group No." on the [Parts]-[Option] tab when components must be mounted in a specific order, for
example in the following cases.
1. Short (low profile) components should be mounted before mounting tall components to prevent the nozzles from
interfering with mounted components.
2. Components should be mounted on a component (chip on chip, etc.).
Components can be grouped by a number specified in the "Parts Group No." parameter. When data
optimization is executed after setting the "Parts Group No." parameter, the mount sequence is determined so
that a component group of the smallest number will be mounted first. For example, when all components are
classified into group 1 and group 2. Components of group 2 are mounted after components of group 1 have
been mounted. (In the example below, component No. 9 (set to group 2) is mounted after other components
(set to group 1) have been mounted.
Setting "Parts Group No."

Set to "1" to mount
components first.
Set to "2" to mount

components after
group 1.
24407-P2-00
c CAUTION
Numbers specified in the "Parts Group No." parameter determines the order of mounting components, but this order is
enabled only after executing data optimization. Always execute data optimization to enable the "Parts Group No."
parameter settings.
All components must be classified into any group, so a number of 1 or larger must be given to the "Parts Group No."
parameter of all components. For example, if you want to mount a kind of components after other components have
been mounted, set that kind of components to group 2 and all other components to group 1.
4-17
3. Mark parameters
3.1 Pattern matching
Pattern matching is a function for correcting board dimensional or reference hole errors, positioning errors
occurring from the board clamping mechanism, or local distortion of the board. To use this function, the image
of a particular board pattern must be registered as the template. Errors or distortion are corrected by comparing
the template you registered with an actual pattern being recognized. Pattern matching is useful when the
fiducial function cannot be used, for example, if the board has no fiducial marks or the mark does not match
any mark recommended by YAMAHA.
n NOTE
Any pattern can be used, but the pattern image should be smaller than about 1/4th of the monitor and must meet
the following conditions.
Pattern conditions
• Each pattern clearly contrasts with the board. (It is okay if the outline of each pattern is definite.)
• A pair of patterns are diagonally opposing on the board.
Pattern conditions
4 No good OK OK
Low contrast
Board Board
No good OK
Not the same direction
23406-P2-00
c CAUTION
Pattern matching requires a longer recognition time than normal mark recognition and its accuracy may drops slightly
when compared to cases using round or square marks. It is not necessary to use pattern matching for marks which
can be correctly recognized with "Algorithm Type" set to "Normal".
4-18
3.1.1 Pattern registration
To utilize pattern matching, you must register the reference pattern as a template.
1 Decide on the pattern.

Decide which pattern you want to use for pattern matching. Select a pair of patterns that meet the
conditions explained previously.
2 Enter the pattern name in the mark information.

Open the Mark screen and, in the Mark Name column, enter the name that you can easily identify as a
pattern.

Set the parameters as follows.
1. On the [Basic] tab, set "Mark Type" to "Fiducial".
2. On the [Vision] tab, set "Algorithm Type" to "PTRN Outline" or "PTRN GrayLev" or "PTRN Whole".
• PTRN Outline:
In most cases, select this parameter for pattern matching. When the outline is definite, the pattern
can be recognized even if uneven brightness portions are present inside the pattern.
• PTRN GrayLev:
Selecting this parameter is more effective in recognizing a pattern whose brightness is uniform inside
the pattern. This parameter setting requires a longer time to recognize a pattern than in the "PTRN
Outline" setting and also the data size will be larger.
4
• PTRN Whole:
This parameter is effective when you want to acquire a pattern including its details. Since the entire
pattern is recognized at a lower compression ratio, this parameter setting requires a longer
recognition time than in the "PTRN GrayLev" setting and also the data size will be even larger.
Pattern setting

Set to "PTRN Outline", "PTRN GrayLev" or "PTRN Whole".
Enter the pattern name.

24408-P2-00
Pattern recognition types
PTRN outline PTRN Graylev

(Uneven brigtness, (Uniform brighness)
but definite outline)
23407-P2-00
4-19
4 Press the [Mark Adjust] button to open the Mark Adjust screen.
TIP
logs.
Mark Adjust screen
4
[Convey In] button
24409-P2-10
5 Set the board on the conveyor and clamp it.

Press the [Convey In] button to transport the board onto the conveyor and clamp it.
6 Move the head so the pattern is displayed in the center of the vision monitor.
Use the [Move Head] button to move the head. When the head is positioned, press the [Close] button
to return to the Mark Adjust screen.
7 Press the [Pattern] button.

The Pattern registration screen appears as shown below.
Pattern registration screen
24410-P2-00
4-20
8 Decide on the pattern size.
Using the cursor selection buttons and arrow buttons, adjust the window size and position to enclose the
entire pattern. The function of each button is as follows.
• [Start] button
The window can be enlarged or reduced with the arrow keys, using the lower right corner of the
window as a stationary point.
• [End] button
The window can be enlarged or reduced with the arrow keys, using the upper left corner of the
window as a stationary point.
• [Move] button
The entire window moves with the arrow keys.
• [Center Offset] button

Press this button when you want to shift the reference position from the center of the window. (The
reference position is displayed as a pink cross cursor.)
• [1 Pixel / 10 Pixel] buttons

Press these buttons to change the distance that the window moves each time you press an arrow
button.
Window movement and adjustment
[End] button [Start] button [Move] button
Stationary point
4

Stationary point Entire window moves
Enclose the pattern.

Pattern
23408-P2-00
9 Save the pattern data.

Check that the center of the pattern is within the window and then press the [Save Pattern] button.
0 Check the pattern image.

Pressing the [Draw Pattern] button displays the pattern image that has been obtained. Check the
shape.
q Return to the Mark Adjust screen.

Press the [Close] button to return to the Mark Adjust screen.
4-21
w Perform a vision test.
Press the [Test] button and check to see if the pattern is correctly recognized. Repeat this test several
times. When no error occurs, the pattern data is appropriate.
If an error occurs, check whether "Search Area" on the [Vision] tab is appropriate. If the search area is
too large so that other marks are located within the search area, then reduce the search area.
Conversely, if the search area is too small, then enlarge the search area.
Search area adjustment
Search area
Search area is too large, so Search area is too small, so the target
other marks are recognized. pattern is not inside the search area.
Reduce the search area Enlarge the search area.
23409-P2-00
e Close the Mark Adjust screen.
4
Press the [OK] button to close the Mark Adjust screen.
r Save the data.

Press the [Save] button in the main menu button area and save the data.
4-22
3.1.2 Using the data for pattern matching
Pattern matching can be used in the same way as the fiducial marks. In this case, enter the mark No. registered
as the pattern in the Mark 1 and Mark 2 columns on the [Board] - [Fiducial] tab screen. (The figure below
shows an example when using pattern matching as board fiducial marks.)
n NOTE
Example of using pattern matching
Set mark No. registered as pattern in

Set to "Execute". "Mark 1" and "Mark 2" columns.

24411-P2-00
4-23
4. Edit Assistant function
The Adjust Assistant function allows you to edit, search and replace data within the selected row range.
n NOTE
When editing board information of combined board data in the Edit Assistant mode, the lane to be operated should
first be selected and displayed with the [Lane] button.
4.1 Switching to the Edit Assistant screen

When you press the [Assistant] button on the top right of the screen, the Edit Assistant screen appears in the
lower part, showing the [Row Edit], [Replace] and [Renumber] tabs. To return to the previous screen, press the
[Assistant] button again.
Switching to the Edit Assistant screen
[Assistant]
button
4 Button is depressed
when selected.
24412-P2-00
4-24
4.2 Selecting a range of rows
To select a range of rows on the data grid display, use the [Row Selection] or [All Selection] button. The
selected rows will be highlighted.
n To select a range of rows
• Click the start row of the range you want to select while the [Row Selection] button is still not depressed.
• Next, press the [Row Selection] button and then click the last row of the range you want to select.
You can also use the [Jump] button to specify the row number in the "Jump" dialog box that appears. The range of the
selected rows can be changed by pressing the cursor up/down keys, or the [Move row up] or [Move row down] button
on the left of the [Assistant] button.
• To cancel selecting the rows, click the [Row Selection] button when it is depressed.
Selecting a range of rows
Start row for

selecting row range.
[Row Selection]
button should not yet
4
be selected (depressed).

Click the last row in
the range you want to select.
[Row Selection]
button is depressed.
Enter the last row number

in the range you want to select.
24413-P2-00
n To select all rows

Pressing the [All Selection] button selects all rows on the grid display and also allows editing rows.
4-25
4.3 Editing rows
c CAUTION
Rows on the data grid display cannot be edited if sorted by a column other than the "No." column. To edit rows, the
data grid display must be sorted in an ascending order by the "No." column.
The various buttons on the [Row Edit] tab are for editing rows selected on the grid display.
Editing buttons arranged on the [Row Edit] tab
24414-P2-00
n [Insert] button
Inserts blank rows into a position just above the selected range. The inserted blank rows equal the number of rows in the
selected range.
4
n [Copy] button
Copies the rows in the selected range into the Clipboard.
n [OwPaste] button
Pastes the Clipboard data over the selected range. The previous data that were overwritten will be lost. Nothing is pasted
if there is no data in the Clipboard.
n [InsPaste] button
Inserts the Clipboard data into a position just above the selected range. Nothing is pasted if there is no data in the
Clipboard.
n [Delete] button
Deletes the rows in the selected range. The rows below the deleted range shift upwards.
n [Clear] button
Clears the rows in the selected range. The cleared rows are left blank.
n [Cut(Del)] button
Cuts (deletes) the rows in the selected range and copies them into the Clipboard. The rows below the deleted range shift
upwards.
n [Cut(Clr)] button
Clears the rows in the selected range and copies them into the Clipboard. The cleared rows are left blank.
4-26
4.4 Find and replace
Drop-down lists under the [Replace] tab allow you to find or replace the desired data.
n NOTE
When no specific range is selected in the data grid display, search and replace will be performed on all rows.
Selecting the item to find (Drop-down list box)
Item you want to find Value you want to find
24415-P2-00
n Find what - Item (Drop-down list box)

Specify the item you want to find. When you want to find from among all items, specify "ALL".
n Find what - Value (Drop-down list box)
4
Specify the value or setting you want to find.
Selecting the item to be replaced (Drop-down list box)

Item whose value or Value or setting to use Command buttons
setting you want to replace for replacing the item
24416-P2-00
n Replace with - Item (Drop-down list box)

Specify the item whose value or setting you want to replace.
n Replace with - Value (Drop-down list box)

Specify the value or setting you want to use to replace. When the item to be replaced is an "...Offset" parameter, specify
the offset value that you want to add to the current value.
n Command buttons
• [Find] button
Finds data that matches the search conditions. Each time you press the [Find] button, the next data that matches the
search conditions is highlighted.
• [Replace] button
Replaces the data that matches the search conditions, with the specified value or setting. Each time you press the
[Replace] button, a matching data item is replaced and highlighted.
• [ALL Replace] button
Replaces all the data that match the search conditions, with the specified value or setting. A case-sensitive search is
performed when the "Match Case" check box is checked.
4-27
4.5 Renumber
You can sort the data in ascending or descending order by a specified data item.
The items shown on the [Renumber] tab differ depending on which screen is currently opened.
• When the Board screen is opened:
You can sort the mount, offset, fiducial mark, and badmark in ascending or descending order by a specified data item.
• When the Parts screen is opened:
You can renumber all rows while removing blank rows or rearrange the data into the rows with the same number as
feeder set No.
[Renumber] tab
Board screen
4
24417-P2-00
n Order
This is the priority level used to sort the data. Up to 10 priority levels can be specified.
n Item
Select the item by which you want to sort the data. The selectable items are displayed in the drop-down list that appears
by double clicking.
n Direction
Select "Upper" to sort the data in ascending order or "Lower" to sort in descending order.
n [Renumber] button
Pressing the [Renumber] button sorts the data according to the conditions you selected.
n NOTE
When no data rows are selected in the upper grid, all data rows are sorted.
4-28
[Renumber] tab
Parts screen
n Sort parts in order

24418-P2-00
4
Renumbers all effective rows from No. 1 while removing blank rows.
n Sort parts in Feeder Set No.

Rearranges the data into the rows with the same number as feeder set No.
4-29
5. Recognition image check and save function
This function allows you to check and save the image that was recognized immediately before the machine
stopped during automatic operation. You can use the saved image data to analyze recognition errors that
stopped the machine.
n How to use
1 Press the [Img Check] button.

On the [Vision] tab of the [Monitor] screen, press the [Img Check] button. The "Vision Check & Save"
dialog box appears.
[Img Check] button
4
Press this button.
24419-P2-00
2 Select the image.

Select the image you want to check or save, by specifying the camera No. from the "Camera No."
drop-down list and the head No. from the "Head No." drop-down list.
Selecting the image
Select the camera.

Select the head.
24420-P2-00
4-30
3 Save the image.
1. Press the [Image Save/Open] button in the "Vision Check & Save" dialog box.
2. Select the folder and enter the file name.
3. Press the [Save] button.
Saving the image
Select the folder.

Enter the file name to save the image.
24421-P2-00
4-31
6. Optimizing the data
Production board data can be automatically rewritten into more efficient data by carrying out optimization.
The methods for optimizing the "feeder set position", "head No." and "mounting order" are explained in this
section. Use the [Optimizer] button in the main menu button area to carry out optimization.
[Optimizer] button
4
[Optimizer] button
24426-P2-10
4-32
6.1 Setting the optimizing conditions
This section explains the methods for setting the conditions to optimize board data.
1 Press the [Create] button to set the optimizing conditions.

The "Set optimization parameters" screen appears.
Opening the "Set optimization parameters" screen

Step2 Step2
Step8
Step7
Step3 Step6
Step4
Step5
Step9 Step11
24434-P2-50
4-33
2 Select the board to be optimized.
1. Press the [Select] button to open the "Board data select" dialog box. Then select the board data to
be optimized and press the [Select] button.
Selecting the board data

Example of Dual lane
4
24435-P2-50
2. Check the save board name, type, and path under "Save Board". Then press the [Select] button to
open the "Board data select" dialog box and change the board name, type and/or path as needed.
TIP
When board data other than combined board data is selected on dual-lane machines, the "Mount Lane" drop-down
list box is displayed. Specify the lane to use for part mounting.
Changing the save board name, etc.

[Mount Lane] box
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3 Select the feeder position setting method.
Select the desired method from the "Feeder Set Condition" drop-down list.
Selecting the feeder position setting method
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■ Feeder position setting methods
Setting method Target area Description
Optimizes only the component placement sequence and placement

head. Feeder positions are not optimized.
All Parts Fixed Within each machine
An optimization error occurs with parts whose feeder positions are
unspecified.
Optimizes the component placement sequence and placement head,
Move Within Within each feeder and also optimizes the feeder positions within each feeder plate.
Feeder Plate plate Parts with feeder positions unspecified will be optimized within the
machine.
Optimizes the component placement sequence and placement heads,
Within each machine
4
Move Within and also optimizes the feeder positions within each feeder table.
Front and rear
Table Parts with feeder positions unspecified will be optimized within the
separately
machine.
Optimizes the component placement sequence and placement heads,
YS24, YS24X, YSM40
Move Within and also optimizes the feeder positions within each stage.
and Z:LEX (YSM20)
Stage Parts with feeder positions unspecified will be optimized within the
Within each stage
machine.

Move Within Optimizes the component placement sequence and placement heads,
Within each machine
Machine and also optimizes the feeder positions within each machine.
4 Select the target parts.

When you have selected "Move Within Machine" in step 3, select "All Parts" or "Only set position
undecided parts".
"All Parts"
Optimizes all parts registered in the board data.
"Only set position undecided parts"
Optimizes parts whose feeder set numbers ("A: Feeder Set No." parameter on the [Parts]-[Pick] tab)
are "0" or invalid.
5 Set the execution level.

Select "Standard" or "Short Calculation Time".
"Standard"
Performs optimization using standard processing.
"Short Calculation Time"
Performs optimization more quickly than standard mode.Optimization results are not as good as
standard mode.
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6 Set the finish condition. (Setting for YSM40 4-beam only)
When you have selected "Move Within Machine" from the "Feeder Set Condition" drop-down list in step
3, set the following items.
"Distribution Count"
Enter the number of times you want to repeat the optimization task.
"Execution Time"
Enter the length of time during which to perform optimization.
c CAUTION
The time taken to complete optimization may exceed the time specified here depending on the process. In this case,
the optimization ends at a breakpoint.
"When CT is not improved"

While repeating the optimization task, if the cycle time does not improve more than the best cycle
time previously obtained, a specified number of times in a row, then the optimization will end.
7 Select the execution options.

Set the necessary conditions.
[Exec Option] tub
4
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"Height difference to permit overtaking"

Select the "Height difference to permit overtaking" check box when you want to perform component
placement in the order of lower height components as much as possible.
"Parts division rate change"
When some feeders that contain the same kind of parts exist by multiplying parts, the optimizer
equalizes cycle time by changing the rate of mount point contained in these feeders.
"Decide pallet number automatically"
When there are tray parts in the board data, the optimizer decides pallet placement of tray parts.
"Parts set pos quantity arrangement"
This setting specifies whether or not multiple same-component feeders can be loaded.
"Dual Lane" (displays only in dual-lane systems)
Specifies whether or not multiple feeders can be loaded at each lane.
Prohibit : Multiple feeders cannot be loaded.
Allow : Multiple feeders can be loaded.
"Each lane"
For components which cannot be mounted due to pickup and mounting position restrictions, this
setting specifies whether or not multiple feeders can be loaded at the same lane. (Component
mounting may become possible if multiple feeders are loaded.)
Prohibit : Multiple feeders cannot be loaded.
As required : Multiple feeders can be loaded.
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8 Create a basic condition template as needed.
The optimizing conditions you have set in steps 3 to 6 can be registered as a template, which can then
be used as a basic condition template common to other board data.
• To register a template
Press the [Entry] button to open the "Template List Information" screen. Enter the template name and
press the [Save] button. A check mark is placed in the "Basic Condition Template" check box in the
"Set optimization parameters" screen and the template is registered in the list.
Registering a basic condition template
Enter the template name.
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• To set a registered template as the basic conditions.
4
Press the [Select] button to open the "Template List Information" screen. Select the template and
press the [Read] button. A check mark is placed in the "Basic Condition Template" check box in the
"Set optimization parameters" screen and the selected template is set.
When you want to edit the template, clear the "Basic Condition Template" check box, edit the
conditions, and register that template again.

Setting the basic conditions
Select a template.
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9 Press the [Detail] button to set the detailed conditions.
When the screen below appears, set the necessary conditions by opening the [Fixed Board], [Stage],
[Plate], and [Nozzle] tabs.
[Fixed Board]
n NOTE
Fixed boards refer to board data using the feeder set positions which are determined and not to be changed by
optimization.
On the [Fixed Board] tab, you can specify fixed boards so that their feeder positions will be referenced (will not be
changed) during optimization. You do not have to specify fixed boards unless necessary to reference them during
optimization.
Moreover, the same operation can be performed for linked boards (processing them as fixed boards)
"Set detail optimization parameters" screen

Fixed Board
4
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To set a fixed board, press the [Add] button to open the "Board data select" screen and select the fixed board data. After
optimization is finished with a fixed board specified, the feeder set positions will be determined as follows:
Parts with the same name as those registered for the fixed board
These parts are set in the feeder positions used by the fixed board.
Parts with a different name from those registered for the fixed board
These parts are set in the feeder positions not used by the fixed board.
n NOTE
When the "Copy of parts parameters from the fixed board" check box is checked, the optimized board data will be
updated to match the fixed board parts information. Leave this check box cleared if you want to retain the parts
information of the board data to be optimized.
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[Stage], [Stage / Lane] (dual-lane machines only)
Stage / Lane setting

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Stage
Set the part mounting stage to perform data optimization.
To perform optimization on all part mounting stages , mark the "Execute optimization on all stages" check box.
When selecting the desired mounting stage, clear the "Execute optimization on all stages" check box and then mark the
check box in the "Execute" column of the stage where optimization should be performed.
c 4
CAUTION
Optimization is performed on each stage, but the cycle time is estimated for the machine. If there is a stage that is not
to be optimized while the other stages are to be optimized, then it is necessary that the cycle time on that stage can
Lane (dual-lane machines only)

Set the part lane (displayed only for dual-lane machines) to perform data optimization.Normally, optimization should be
performed at all lanes.
To perform optimization on all part lanes, mark the "Execute optimization on all lanes" check box.
When selecting the desired lane, clear the "Execute optimization on all stages" check box and then mark the check box
in the "Execute" column of the lane where optimization should be performed.
[Plate]
Plate setting
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Set the feeder plates on which component feeders are installed to perform optimization. To perform optimization on all
feeder plates, select the "Execute optimization on all feeder plates" check box. To select a feeder plate individually, clear
the "Execute optimization on all feeder plates" check box and select the check box in the "Execute" column.
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The feeder plate numbers are designated as follows:
Feeder plate No. for plate setting

Common to right-to-left and left-to-right flows (YS12, YS12P, YS12F, YS88, YS100, YS24, YS24X, YC8)
Fixed 60-feeder plate on front and rear sides Fixed 60-feeder plate on front side (YS12P)
(YS12, YS24)
Rear
Plate 2
Plate 1
Plate 1 Front
Front
24-feeder carts on front and rear sides 24-feeder carts on front side (YS12F)
(YS12, YS88, YS100, YS24, YS24X)
Rear
Plate 4 Plate 3
Plate 1 Plate 2
Plate 1 Plate 2 Front
Front
24-feeder carts on front and rear sides + sATS 24-feeder carts on front side + ATS15 (YS12F)
(YS88, YS100)
Rear Rear
Plate 2 sATS ATS15
4 Plate 1 Plate 2 Plate 1 Plate 2
Front Front
24-feeder carts on front side and fixed 14-feeder 24-feeder plate on front side + fixed 60-feeder plate
plate on rear side + sATSII (YS24X) on rear side (YS24, YS24X )
Rear Rear
Plate 3 sATSII Plate 3
Plate 1 Plate 2 Plate 1 Plate 2
Front Front
Fixed 14-feeder plates on front side + ATS15 (YC8) Fixed 14-feeder plates on front side (YC8)
Front
ATS15
Plate 1 Plate 2
Plate 1 Plate 2 Front
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Feeder plate No. for plate setting
Common to right-to-left and left-to-right flows (YSM40, Z:LEX (YSM20) )
46-feeder carts on front and rear sides (YSM40) 46-feeder carts on front side and fixed 12-feeder carts
on rear side + cATS (YSM40)
Rear Rear
Plate 2 Plate 2 cATS
Plate 1 Plate 1
Front Front
12-feeder plates + C-ATS on front side and 12-feeder plates + C-ATS on front and
46-feeder carts on rear side (YSM40) rear sides (YSM40)
Rear Rear
Plate 2 Plate 2 cATS
cATS Plate 1 cATS Plate 1

Front Front
70-feeder carts on front and rear sides Feeder exchange carriage with 32-feeder carts
(Z:LEX (YSM20) ) on front and rear side (Z:LEX (YSM20))
Rear Rear
Plate 2 Plate 4 Plate 3
Plate 1 Plate 1 Plate 2

Front Front
4
32-feeder carts on front side + cATS10 and 32-feeder
carts on rear side + cATS10 (Z:LEX (YSM20))
Rear
Plate 4 cATS10
cATS10 Plate 2

Front
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[Nozzle]
Nozzle setting
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The nozzle to be used for the optimization can be set for each head and each table (machines with multiple tables only).
Select the desired nozzle setting method from the "Nozzle Suggestion" drop-down list.
"Auto"
Automatically determines the nozzle used with each head by optimization.
"Edit"
Selecting this item allows each column in the lower grid to be edited. You can manually set the
nozzle used with each head, by selecting it from the drop-down list.
When "Auto" is selected, the nozzle for each head is automatically determined by optimization.
"Current"
Uses the nozzles currently specified (determined by the preceding optimization) for heads that are
set to "ManualNzlChg" (manual nozzle change).
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"Mount / Transfer Mode" (dual-lane machines only)
Mount Mode
Dual lane
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When producing boards using both lanes of a dual-lane machine, set the Mount/Transfer Mode.
"Auto"
Select this item to determine the mount/Transfer mode by optimization.
"Edit"
When this item is selected, the mount mode box and Transfer mode box becomes active allowing
4
you to set the mount/transfer mode manually for each machine.
Mount mode
Auto Parallel Lanes Alternate Lanes
Transfer mode
Determines the transfer mode
Auto --- ---
by optimization.
Parts are alternately mounted

on the boards on the front
lane and rear lane. Set this
The front head mounts parts item when you want to reduce
only on the front lane, while the transfer time loss. (The
Asynchronous Transfer ---
the rear head only on the rear transfer time loss is reduced
lane. since a board is transferred to
one lane while parts are being
mounted on the board on the
other lane.)
The mounting START and
COMPLETION timing is
synchronized at the two lanes.
If mounting is completed at
Synchronous Transfer --- one head before the other, Not selectable *1
the idle (mounting completed)
head then assists the working
head to shorten the production
time.
*1 If the "Mount Mode" is "Alternating Lanes", "Asynchronous transfer" is the resulting output.
"Current"
Performs optimization using the mount mode that was determined when optimization was last
performed.
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0 Create a detailed condition template as needed.
The optimizing conditions you have set in step 8 can be registered as a template, which can then be
used as a detailed condition template common to other board data.
• To register a template
Press the [Entry] button to open the "Template List Information" screen. Enter the template name and
press the [Save] button. A check mark is placed in the "Detail Condition Template" check box in the
"Set optimization parameters" screen and the template is registered in the list.
Registering a detailed condition template
Enter the template name.
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• To set a registered template as the detailed conditions.
4
Press the [Select] button to open the "Template List Information" screen. Select the template and
press the [Read] button. A check mark is placed in the "Detail Condition Template" check box in the
"Set optimization parameters" screen and the selected template is set.
When you want to edit the template, clear the "Detail Condition Template" check box, edit the
conditions, and register that template again.

Setting the detailed conditions
Select a template.
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q Save the setting file.

By default the setting file name is identical with the name of the board data to be optimized. Enter the
desired name if you want to change the default name.
After confirming the name of the setting file, press the [Save setting] button.
n NOTE
To optimize another board data, repeat the above procedure.
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6.2 Executing the optimization
After setting the optimization conditions, follow these steps to optimize the board data.
1 Select the board data to be optimized.

The left pane of the Optimizer screen shows a list of the board data for which you have set optimization
conditions. Line up the cursor with the board data to be optimized, and press the [Right arrow] button.
The board data is loaded and its name appears in the list in the right pane.
TIP
The same operation can be performed by selecting "Add Target" from the File menu, or clicking the [Add Target]
button on the toolbar, or double-clicking the target file.
Selecting the board data to be optimized
4
Press this button to load the board data from the left list into the right list.
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4-44
2 Press the [Execute] button to start optimization.
All of the selected board data will be optimized and the results displayed.
The optimization results will be automatically saved when optimization is complete.
3 Check the results.

Optimization result display
4
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TIP
When the "Save result information for each board" radio button in the "Common Setting" dialog box ("Maintenance"-
"Common Setting") has been selected, pressing the [Result View] button in the Optimizer screen displays the result
information screen allowing you to check the optimization results.
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7. Smar t recognition function
Use of this function makes it possible to easily create component information on parts with different shapes
and sizes.
To use this function, there are restrictions and cautions shown below. Thoroughly read the restrictions and
cautions to strictly observe them.
■ Applicable models and machine software versions

The following describes the models and software versions that can use this function.
Item name Target
Model VGOS V30, V40 series mounters
Machine software version V3.32STD R1.000 or later or V4.32STD R1.000 or later
■ Applicable board file format and part database format

The following describes the board file format and part database format that can be operated by this function.
Conditions Setting item
Board file format YGX
4
Part database format FDX
■ Restrictions
There are restrictions on use of this function as described below.
• The smart recognition part pickup and mounting operations may vary depending on the version of the machine
software that is used to create the part data.

• In the version V3.42STD R1.000 or later or V4.42STD R1.000 or later, the pickup and mounting operations are not
restricted.
• In the version earlier than V3.42STD R1.000 or earlier than V4.42STD R1.000, the maximum number of smart
recognition parts that can be recognized in the same pickup group is “1”. When mounting the smart recognition
parts continuously, the mounting operation is performed one-by-one.
• When a part with the model data having many edges is recognized, the recognition result process is not completed
until the head moves to the mounting position completely. As a result, waiting time is produced until the mounting
operation starts.
• The part data for the smart recognition can be saved in the environment described below.
VGOS V30, V40 and P-TOOL (YGX format only)
• To use the smart recognition, install also the VGOS V21 with the compatible version. If this software is not the
compatible version, the smart recognition part is used for the production, causing the part recognition error to occur.
c CAUTION
If the board data holding the part data for the smart recognition is saved in an environment other than that shown
above, the data will be deleted.
• After [Smart Recognition] has been changed to “Use” or “Not Use” in the Installation Setting, be sure to restart the
machine. Otherwise, the part recognition error may occur.
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7.1 Outline of operation
This smart recognition function is intended to achieve a recognition algorism with general versatility or high
robustness.
A part shape model is created from the captured part image, and then the part positioning is made based on
this model. According to this, parts that cannot be recognized or are difficult to define with the existing
algorism can be recognized.
■ Parts not applicable to the smart recognition

The following parts are not applicable to the smart recognition.
• Parts with data that can be created using the alignment group [Chip], [IC], or [Connector].
• Parts with data that can be created using the alignment group [Special] - alignment type [Special], [Odd Chip], [Mark],
[Sq. Quad], or [Gravity].
• Ball parts
• Parts with a lead width of 0.3 mm or less
• Micro or large parts that cannot create data satisfying the part shape model registration conditions (the number of
registration points is 100 or more and less than 1000).
c CAUTION
When recognizing a lead part with the smart recognition, the lead pitch and lead bend cannot be checked.
4
7.2 Entering component information
Before creating a model using the smart recognition, it is necessary to enter component information as
described below.
Menu Edit item

1. Open the [Basic] tab. Select [Special] in [A. Alignment Group] and [Smart Recognition] in [B.
Alignment Type]. Additionally, set [F. Pitch Index]. (For details, see “2. Creating component
information” in Chapter 2.)
↓ 2. Open the [Vision] tab. Set [H. Lighting Level] and [L. Search Area (mm)].
(For details, see “2. Creating component information” in Chapter 2.)
3. Open the [Shape] tab. Set outside dimensions A to C.

(For details, see “2. Creating component information” in Chapter 2.)
↓ Press the [Parts Adj] button to open the Parts Adjust screen.
Press the [Create Model] button. Then, create model data while referring to “A5.3 Creating model
data”.
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7.3 Creating model data
Create model data for the smart recognition in the following manner.
Model data creation flow
1. Picking up a part
2. Capturing an image
7. Specifying the center of parts
3. Specifying an edge detection frame

8. Moving to the Vision Test screen
4. Correcting the image angle

9. Specifying the recognition conditions
5. Moving to the Create Model screen 10. Vision Test
6. Adjusting the detected edges 11. Saving the model data
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4
■ Basic structure of Create Model screen
Screen structure
1 3
4
2 5
24459-P2-00
1. Vision window
This window displays the captured part image or edge image.
2. Display check boxes
You can select an image type that is displayed in the vision window.
3. Operation process window
This window allows you to operate a series of model creation processes, Get Image → Create Model → Vision Test. The
window is displayed in the wizard format.
4. Guidance message
Appropriate message suitable for work step to be operated is displayed.
5. Screen change buttons
[Next] : Moves to the next screen.
[Back] : Returns to the previous screen.
[OK] : Saves the model data you are creating into the parts adjust data and returns to the Parts Adjust screen.
[Cancel] : Cancels all of the model data you are creating and returns to the Parts Adjust screen.
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The following describes each step (model data creation flow) in detail.
1. Picking up a part
Press the [Pick Up] button on the Get Image screen to pick up a part. This step is not needed when the head already picks
up a part.
2. Capturing an image
Press the [Get Image] button to capture a recognition image of the part.
The recognition operation with the part recognition camera is executed to display the recognized image in the vision
window.
If an error, such as “Part is not picked up at the center of the nozzle.” or “Pickup angle of the part rotates largely.” occurs,
press the [Dump] button to dispose of the part and restart the operation from the step, Picking up a part.
Get Image screen
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Recognition image
4

24461-P2-00
3. Specifying an edge detection frame

Drag a portion in the vision window to specify an edge detection frame so that it encloses the whole part.
Note that the whole image is specified as an edge detection frame in the initial status when the image is captured
completely. You can move to the next work step even when the edge detection frame is not specified. In this case, an
object other than the part may be detected incorrectly as an edge.
Therefore, you must specify a minimal range to enclose the whole part.
Edge detection frame
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4. Correcting the image angle
To create a model for the smart recognition, rotate the part so that it stands straight (0°). This angle becomes the reference
for mounting angle 0°. So, be sure to set this angle precisely.
Rotate Image screen
24463-P2-00
Image after rotation
4
24464-P2-00
1. Rotating the image

You can rotate the image in the range specified by the edge detection frame in a specified direction.
2. Image rotation angle
You can specify an image rotation angle.
5. Moving to the Create Model screen

Press the [Next] button to move to the Create Model screen.
When the screen is changed, the edges are detected automatically from the captured image and the vision window
changes to the image superimposing of the detected edge image on the captured part image.
An error may occur if the detected edges are too many or too few.
If the edge detected status is difficult to see, check on only the [Detected Edge] check box.
Superimposed image
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6. Adjusting the detected edges
You can adjust the automatically detected edges.
In the smart recognition, if the number of edges is too many, the recognition process takes a long time. Conversely, if the
number of edges is too few, the possibility of incorrect part recognition increases.
Make the adjustments as described below.
Item Contents
Change edge If the number of edges is too many or too few, change the threshold value for the edge detection
threshold value to decrease or increase the number of edges.
Compress If the number of edges is too many, compress the edges to reduce the number of edges.
Erase edge Manually delete portions where an object other than part is detected or edges that are not used
manually for the model creation.
Create Model screen
5
4
6
4
7

8
11
9 10
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1. Edge Num
Shows the number of current edges.
If the number of edges enters an unusual value range shown below, the background color changes to give the warning.
• 500 or more : Yellow
• 0 to 99 or 1000 or more : Red
If the number of edges enters a range shown above, adjust the threshold value or compress the edges to put the number
of edges in the correct value range.
2. Edge Threshold (Edit)
Enter an edge threshold value to change it.
3. Edge Threshold (Slide bar)
Drag the slide bar with the mouse to change the threshold value to a desired level.
4. Edge Threshold (Slide bar button)
Each time you press the button, the edge threshold value increases or decreases “1”.
5. Compress Manual
When [Manual] in the Compress area is checked on, the manual compress level becomes valid.
6. Manual compress level
Select an edge manual compress level.
You can select a level ranging from “1/1” to “1/10”.
At this time, the edge compress level determined by the automatic compress is displayed in gray.
7. Erase edge manually
When this check box is checked on, the manual edge erase becomes valid.
As this check button is checked on, the buttons (8 to 11) become valid.
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8. Erase edge manually (Point)
Changes the edge manual erase to the point erase mode.
In the vision window, the mouse cursor changes to the eraser mark, allowing you to erase the edge at the portion you
drag with the mouse.
9. Erase edge manually (Rectangle)
Changes the edge manual erase to the rectangle erase mode.
You can erase all edges in the area you have dragged with the mouse in the vision window at once.
10. Erase edge manually (Undo)
Restores the edge erase operation to the previous status.
When you have made the point erase, pressing this button will not undo the edge erase operation point-by-point, but
undo the edge erase operation you have made using one mouse drag operation.
11. Erase edge manually (Undo All)
Restores the edge erase operation to its original status.
c CAUTION
• Note that the adjustment status of the detected edges is deleted and you need to restart the operation from the
edge detection when the Create Model screen returns to the Get Image screen.
• Note that the adjustment status of the detected edges is deleted and you need to restart the edit operation from
the beginning if you compress the edges manually after completion of the manual edge erase operation.
7. Specifying the center of parts

Specify the center of parts.
4
Move to the Create Model screen. When the edges are detected, a rectangular circumscribing the detected edges is
enclosed by a green dotted line and its center is automatically specified for the center of parts.
Therefore, if you adjust the detected edges, the rectangular circumscribing the detected edges may change. So, be sure to
specify the center of parts again.
Pressing the [Auto] button will specify the center of parts again.
Additionally, if you want to intentionally shift the center of parts, you can specify the center of parts manually.
Center of Parts screen
4 2
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1. Auto center of parts detection
The center of parts is detected automatically. The circumscribed rectangular and the center of parts are displayed in the
vision window.
Circumscribed rectangular : Maximum and minimum XY coordinates of the portion where the edges exist are enclosed
by a rectangular.
Center of parts : Intersection point that divides the circumscribed rectangular into two equal parts.
2. Manual center of parts detection (Move target selection)
Start : Changes to the mode, in which the center of parts detection frame is resized with its lower right portion fixed.
End : Changes to the mode, in which the center of parts detection frame is resized with its upper left portion fixed.
Move : Changes to the mode, in which the whole of the center of parts detection frame is moved.
After you have selected a desired mode, press the move button (4) to move the frame to the specified position.
3. Manual center of parts detection (Movement amount selection)
When resizing or moving the center of parts detection frame, press a desired button to select a one movement amount.
4. Manual center of parts detection (Move)
Resizes or moves the center of parts detection frame in the mode you have selected using the manual center of parts
detection (Move target selection) and manual center of parts detection (Movement amount selection).
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8. Moving to the Vision Test screen
Press the [Next] button to move to the Vision Test screen.
The model data for the smart recognition is created based on the data you have created on the Create Model screen.
9. Specifying the recognition conditions

Specify the recognition conditions for the smart recognition.
Item Description
If the reflection of the part is dark, set a threshold value lower than that you have created on
Edge Threshold the Create Model screen. This can detect more edges.
It is recommended to set a value of 20 or more.
Judgement standard for the match level (edge superimposing level) between the model data
and recognition image.
Minimum Match Level If the match level becomes lower than this value, the recognition error occurs.
If you decrease the match level excessively, this may cause incorrect part recognition or
incorrect error judgement.So, it is recommended to set a value of 80 or more.
Detectable part angle setting.
Angle Search Area
It is recommended to set a value of 20° or less.
Recognition Condition Setting screen

24468-P2-00
n NOTE
The edge threshold value described above is intended for the recognition and different from the edge threshold
value on the Create Model screen.
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10. Vision Test
The vision test is executed with the created model data and recognition condition setting.
This test checks whether or not the recognition result has any fault.
Vision Test
1 2
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1. Visio n Test
Executes the vision test.
4 2. Monitor Mode
Changes the display mode of the recognition result displayed in the vision window.
Mode Description
None Displays only the part image.
Vision Result Displays the numeric values related to the recognition result.
Detection Range Displays the edge detection range.
Model Displays the model.
Edge Pos. Displays the detected edges.
Last Pos. Displays the center of parts.
Used to display superimposed various results. (To do so, you need to set items to be
Detail Setting
displayed in the vision window.)
3. Recognition Result (X, Y, R, Match)

Displays the recognition result.
X, Y, R: Displays the deviation amount between the recognition standard and recognition result.
Match: Displays the match level of the recognition result.
4. Recognition Result (Message)
Displays the recognition result message.
If the recognition is failed, the cause of the error and error No. are displayed.
11. Saving the model data

Press the [OK] button to save the model data you have created.
c CAUTION
When pressing the [OK] button, the screen returns to the Parts Adjust screen while the parts adjust data retains the
model data you have created. Note that the model data you have created is cancelled if you press the [Cancel]
button on the Parts Adjust screen.
4-54
7.4 Error messages
The following describes the errors that may appear during operation and their corrective actions.
Code Error name and contents
SMART RECOGNITION DATA READ ERROR
State It was failed to load the smart recognition data.

Ea2755 Model data is invalid.
Cause
Model data does not exist.
Corrective action Check that the model creation is completed successfully.
Smart Recognition Error
As a result of the detected edge check, the part might not be the smart recognition part.
State
Review the cause and corrective action, and then capture the image again.
Ea12815
Cause The number of detected edges is too few.
1. Make the setting so that the edge detection frame encloses the whole part.
Corrective action
2. Change the light settings (light type and lighting level).
As a result of the detected edge check, no edges could be detected.

State
Review the cause and corrective action, and then capture the image again.
Ea12816
Cause The number of detected edges is zero (0).
1. Pick up the part at the center of the nozzle.

Corrective action
4
2. Change the light settings (light type and lighting level).
As a result of the detected edge check, the work area overflow occurred.
State
Ea12817 Review the cause and corrective action, and then capture the image again.
Cause The edge detection range is too wide.

Corrective action If the edge detection frame is too wide, set a minimal range to enclose the whole part.
The number of edges is illegal.

State
Check the following items.
The number of edges is as below.
Cause 0 - 99
1000 -
Adjust the number of edges to 100 – 999 as follows.
Ea12818
In case of 0 - 99
1. Undo to erased edges.
2. Down edge threshold.
Corrective action 3. Down compress level.
In case of 1000 -
1. Erase the unnecessary edges.
2. Up edge threshold.
3. Up compress level.
State The capturing of the smart recognition image was not completed.
Cause The capturing of the image necessary to create the smart recognition model was not completed.
Corrective action Pick up the part and capture the image again.
State No edges could be detected.

Ea12821
Cause It was failed to detect edges.
Corrective action Review the component information.
4-55
This chapter describes the functions that can only be performed with the Editor. (To open
the Editor screen, press the [Editor] button in the main menu button area.)
Contents
1. Multiplying the component data 5-1
2. Renumbering the data 5-2
3. Block of fset 5-3

3.1 Creating the block offset data 5-3
3.2 Pitch distribution function 5-6
3.3 Block offset distribution and return 5-8
3.3.1 Block offset distribution 5-8
3.3.2 Block distribution return 5-10
4. Board file format conversion 5-11

4.1 Saving VIOS data in YGX format 5-11
4.2 Saving YGX data in VIOS format 5-13
1. Multiplying the component data
This function allows component data to multiply into two or more units of the same data. This means that the
same components can be supplied from multiple feeders. When a large amount of the same components are
used for one board, this function shortens the time required to produce a board.
1 Manipulate the tree view to display the parts information in the main view.
2 Select the data row of the component to be multiplied.
3 Multiply the selected component.
1. On the Tool menu, select "Parts Information Support" - "Multiply Parts".
The "Multiply Parts" dialog box appears.
"Multiply Parts" command

Tree view Main view
Using the Editor

24500-P2-00
2. In the "Multiply No." box, set the desired number you want to obtain.
"Multiply Parts" dialog box
Enter the number to multiply data.
24501-P2-00
3. Check the "Select Alternative Parts Loop" check box if the component is used as an alternative
component.
4. Click the [Multiply] button.
Component multiplication is performed.
5. When the dialog box appears indicating the component multiplication has been completed, click
the [OK] button. The dialog box closes.
5-1
2. Renumbering the data
The "Renumber" command allows you to remove the component data that is not used in mount information
and renumber the data.
1 Manipulate the tree view to display the parts information in the main view.
2 Place the cursor in any data row.
3 Renumber the component data.
1. On the Tool menu, select "Parts Information Support" - "Renumber Parts".
The Renumber dialog box appears.
"Renumber" command
5
Using the Editor
24502-P2-00
2. Select the "Renumber to Parts Name" or "Renumber to Set No." option button.
3. Place a check mark in the "Renumber" check box.
If you want to delete the unused component data at the same time as the data is renumbered,
select the "Delete" check box.
TIP
If you only want to delete the data that is not in use, place a check mark only in the "Delete" check box. (Clear the
"Renumber" check box.)
4. Check the contents and click the [Execute] button.

5. A dialog box appears when the specified task is complete. Click the [OK] button to return to the
previous screen.
5-2
3. Block offset
A multi-block board (also called multi-board panel) is a printed circuit board consisting of two or more
independent printed circuits of the same type. Each printed circuit on a multi-block board is called a "block".
Setting the block offset allows the machine to repeat the same mounting operation in each block on a board,
based on the reference block data. This function therefore greatly saves the time required for creating data
on multi-block boards.
Block offset function
The offset
function allows you Multi-block board
to change the entire Block (multi-board panel)
board data just by
editing the data for the
reference block.
23500-P2-00
3.1 Creating the block offset data
1 Display the "Offset" screen.

Click the [Offset] icon in the tree view or the [Offset] tab in the main view.
The block offset information is displayed in the main view.
Block offset information display
2 3 4 5 6 7
Using the Editor

1
24503-P2-10
1. Board Offset
Enter the XY coordinates of the board origin.
2. Pattern Name
Enter the block name.
c CAUTION
Spaces cannot be used. Use underbars ( _ ) for spaces.
3. Type
The board origin is specified in the top row, and block offset is specified in the second and subsequent rows. (These
items cannot be changed.)
5-3
4. Skip
Mark the check box when not mounting components in the block. No components will be mounted in the block with the
"Skip" check box marked. (To mark or clear each check box, the [Check Box] button on the upper left should be
depressed.)
Selecting the Skip check box
A check mark appears.
24504-P2-00
5. X, Y
Enter the XY coordinates of the origin of each block relative to the board origin. Usually, the board origin is specified at
the same position as the reference block origin, so enter "0.00, 0.00" as the XY coordinates.
XY data
Board origin and reference block origin
Reference block origin
Board origin
Y
X
5
Board origin is at the same position Board origin is at a position other than
as reference block origin reference block origin
23501-P2-00
6. R
Enter "0.00" for the reference block.
Using the Editor
R data
Reference block Block

(Block offset No.1)
Block
Block
Block
Block
Other blocks
R 0o 180o 90o -90o

23502-P2-00

2 Set the reference block offset data.

The block closest to the machine origin is normally viewed as the reference block. Enter this reference
block offset data in the No. 1 row.
5-4
3 Set the offset data on other blocks.
On the second and subsequent rows, set the offset data on other blocks.
When board origin is at the same position as reference block origin
Block 4 Block 5 Block 6

40
Board origin = Reference block origin
0
-5
-5 0 50 100
23503-P2-00
"Offset" screen display when board origin is

at the same position as reference block origin
5
24505-P2-00
When board origin is at a position other than reference block origin
Reference block origin
Using the Editor

55

15
Board origin
0 10 60 110
23504-P2-00
"Offset" screen display when board origin is

at a position other than reference block origin
24506-P2-00
5-5
3.2 Pitch distribution function
This function allows you to create block offset data at a specified pitch by entering the block pitch and the
number of blocks.
1 Enter the block offset No. 1.

Enter the XY coordinates in row No.1, which are used as the reference position for other blocks. You do
not have to enter these coordinates if the reference position is the same as the board origin position.
2 Perform pitch distribution.

Select "Block Offset" – "Pitch Distribute" from the Tool menu.
c CAUTION
The following conditions must be met to perform pitch distribution.
• No offset data is entered for blocks other than block No.1.
• Offset coordinates after pitch distribution will be set within the range from -999.999 to 999.999.
• The number of blocks after pitch distribution does not exceed 512.
Selecting "Pitch Distribute" command
5
Using the Editor
No.1 offset data
24507-P2-00
5-6
3 Enter the block pitch and the number of blocks.
Enter the block pitch and the number of blocks in the X and Y directions, then press the [OK] button.
Pitch distribution will start.
Pitch distribution
Board origin
X Reference position in block No.1
23505-P2-00
4 Check the distributed block offset data.

After pitch distribution is complete, the offset data distributed in each block is displayed, so check the
offset data. The "Skip" check boxes are all cleared after pitch distribution. If there are blocks where you
want to skip mounting components, press the [Check Box] button and then mark the "Skip" check.
Block offset data after pitch distribution
Using the Editor
"Skip" check box

Block offset data distributed at specified pitch
24508-P2-00
5-7
3.3 Block offset distribution and return
Component mounting data can be easily distributed to all blocks by using the block offset distribution function,
or the distributed data can be returned to the original state. Since the mounting data distributed to each block
is viewed as the data on a single-block board, it can be optimized to improve the production cycle time. So
use the original data when editing the mounting data, then distribute it to all blocks using this block offset
distribution function and optimize the distributed data to use for board production.
3.3.1 Block offset distribution

To perform block offset distribution, follow these steps.
1 Select "Block Offset" – "Block Distribute".

From the Tool menu, select "Block Offset" – "Block Distribute".
2 Select the block offset distribution type.

When a dialog box for selecting the block distribution type appears, do the following:
1. From the upper drop-down list box, select "Block Distribute (with Note Data)" when you want to retain
the original data or select "Block Distribute (without Note Data)" if not necessary to retain the original
data.
2. Form the lower drop-down list box, select "Block Repeat" or "Column Repeat". Then click the [OK]
button.
Block distribution type

"Block Repeat" "Column Repeat"
Distribution of all mount data is Distribution of each mount data row is
repeated by the number of blocks. repeated by the number of blocks.
Before distribution After distribution Before distribution After distribution

1 P01 1 P01 1 P01 1 P01
2 P02 2 P02 2 P02 2 P01
3 P03 3 P03 3 P03 3 P01
5
4 4 P01 4 4 P01
5 5 P02 5 5 P01
6 6 P03 6 6 P01
7 7 P01 7 7 P02
8 8 P02 8 8 P02
9 9 P03 9 9 P02
10 10 P01 10 10 P02
11 11 P02 11 11 P02
Using the Editor
12 12 P03 12 12 P02
13 13 P01 13 13 P03
14 14 P02 14 14 P03
15 15 P03 15 15 P03
16 16 P01 16 16 P03
17 17 P02 17 17 P03
18 18 P03 18 18 P03
23506-P2-00
c CAUTION
Unless "Block Distribute (with Note data)" is selected, the original data will not be retained. The distributed data cannot
be returned to the original state with the "Block Distribute Return" command described later.
5-8
3 Perform block offset distribution.
When the "Block Distribution" dialog appears, check the contents and click the [Yes] button.
4 Check the message and click the [OK] button.

A dialog box appears when the block offset distribution is complete. Click the [OK] button to finish.
Block offset
Distribution
Step 2
Step 3
24509-P2-10
5 Check the distributed result.

When "Block Distribute (with Note Data)" was selected, check that the original data remains as "Note"
data.
5
n NOTE
When "Block Distribute (with Note Data)" is performed, block No. is allocated to each distributed block and is
Using the Editor

displayed in the "Original Block No." column.
Block offset distribution

"Block Distribute (with Note Data)"
Original data remains as "Note" data.

24510-P2-10
5-9
3.3.2 Block distribution return
To return the distributed data back to the original data, follow these steps.
c CAUTION
This task is possible only when the block offset distribution was executed with the "Block Distribute (with Note Data)"
command.
1 Select the "Block Offset" - "Block Distribute Return".

From the Tool menu, select "Block Offset" - "Block Distribute Return".
2 Check the items to be changed.

In the "Block Distribution Return" dialog that appears, check the items to be changed and click the [Yes]
button.
3 Click the [OK] button.

A dialog box appears when the block offset return is complete. Click the [OK] button to finish.
Block offset
Return
Step 2
5 Step 3
Using the Editor
24511-P2-10
4 Check the returned result.

Check that the original data that was kept as "Note" data is now restored.
Block offset distribution

Example of return
Original data is restored.

24512-P2-10
5-10
4. Board file format conversion
This section explains how to use the Editor to perform data conversion between VIOS format board data and
YGX format board data.
c CAUTION
This operation cannot be performed for combined board data.
4.1 Saving VIOS data in YGX format
1 Open the VIOS board data.

1. Select "Open Board Data" from the File menu or click the [Open Board Data] button on the toolbar.
The "Board data select" dialog box then appears.
2. Select "VIOS" from the "File Type" drop-down list box.
3. Click the [Folder] button to open the folder ("No.1" folder) that contains the board data you want to
convert.
4. Select the board data you want to convert, and click the [Select] button.
Opening VIOS data list
Using the Editor

Click this button to open the board data list. Select "VIOS". Select the board data you want to convert.
24513-P2-00
5-11
2 Save the board data in YGX format.
1. Select "Save Board Data As" from the File menu.
2. Select "YGX (*.ygx)" from the "File Type" drop-down list box and enter a file name in the "Data Name"
box.
3. Check the folder to save the board data. If you want to change the folder, click the [Folder] button
and select the folder ("No. 1" folder) in the save destination.
4. Click the [Save] button.
c CAUTION
VIOS data does not contain "side-view camera settings" and "Nozzle Touch Point Offset" parameter. You will need to
make those settings if you use them after converting the data into YGX format.
Saving board data in YGX format
5
Using the Editor
Enter a file name for YGX board data. Select "YGX (*.ygx)".
24514-P2-00
5-12
4.2 Saving YGX data in VIOS format
1 Open the YGX board data.

1. Select "Open Board Data" from the File menu or click the [Open Board Data] button on the toolbar.
The "Board data select" dialog box then appears.
2. Select "YGX (*.ygx)" from the "File Type" drop-down list box.
3. Click the [Folder] button to open the folder ("No.1" folder) that contains the board data you want to
convert.
4. Select the board data you want to convert, and click the [Select] button.
Opening YGX data list
Click this button to open the board data list. Select "YGX (*.ygx)". Select the board data you want to convert.
5
24515-P2-00
Using the Editor
5-13
2 Save the board data in VIOS format.
1. Select "Save Board Data As" from the File menu.
2. Select "VIOS" from the "File Type" drop-down list box and enter a file name in the "Data Name" box.
3. Check the folder to save the board data. If you want to change the folder, click the [Folder] button
and select the folder ("No. 1" folder) in the save destination.
4. Click the [Save] button.
Saving board data in VIOS format
5 Select "VIOS". Enter a file name for VIOS board data.
24516-P2-00
c CAUTION
Using the Editor
VIOS format data must be stored in the "No. 1" folder, otherwise it will not work.
c CAUTION
Some parameters such as "Side-view camera settings" and "Nozzle Touch Point Offset" stored in YGX format board
data will not be saved.
5-14
Contents
1. Data backup 6-1

1.1 Making a backup of board data 6-1
1.1.1 Backing up onto a USB memory device 6-2
1.2 Making a backup of system data 6-7
1.2.1 System backup settings 6-8
1.2.2 Making a backup 6-10
1.3 Restoring the system data 6-14
1.3.1 Restoring a system backup 6-14
1.3.2 Restoring a system full backup 6-17
2. Managing the POS information files 6-21
3. Creating the user database 6-24

3.1 Registering the data into the database 6-24
3.2 Expanding the component database 6-26
4. Production log management 6-27

4.1 Production log types 6-27
4.1.1 Production log (MIS) 6-27
4.1.2 Operation log (Unit Log) 6-29
4.1.3 Other operations 6-31
4.2 Production and operation log settings 6-33
4.2.1 Setting to store production logs per board data 6-33
4.2.2 Specifying the auto-save destination 6-34
4.2.3 History Utility 6-36
1. Data backup
Production board data and system data can be backed up. This section explains how to make a backup of
these data.
1.1 Making a backup of board data

A backup copy of board data can be stored on a USB memory device or on a network drive (including on-line
software). When board data is saved in YGX format, it can be stored in any location. However, when using a
USB memory device, the data should be stored in a predetermined location.
n When using a USB memor y device

When using a USB memory device, you need to create a "board folder" to make a directory named "No1". Backup data
should be stored in that directory. Refer to "1.1.3 Backing up onto a USB memory device".
c CAUTION
Use a USB memory device (supplied with the machine or purchased from YAMAHA sales reps) specified by YAMAHA
Motors Co., Ltd. Using a USB memory device other than specified might cause problems. Do not use any other type of
USB memory device with YAMAHA surface mounters and related machines.
c CAUTION
Before operating the USB drive to copy data, always close the media access door to prevent dust from adhering to
the USB port and to protect the USB memory device from electrostatic noise.
c CAUTION
After copying board data or system data into a USB memory device, do not leave that data in the USB memory device
for a long time. Use the USB memory device just as a copy medium for backup data. Prepare other backup media
(CD, DVD, MO, etc.) to store the backup data.
6
managing the data
6-1
1.1.1 Backing up onto a USB memor y device
Follow the steps below to backup data to a USB memory device using the Board Explorer.
When using a USB memory device, you need to create a "board" folder to make a directory (folder) named
"No1". Backup data should be stored there.
TIP
You may use the [Save] button to save board data to a USB memory device.
1 Insert a USB memory device into the USB port.

Insert a specified USB memory device into the USB port of the machine.
USB port
YS100
Insert a USB memory device into this USB port.
23601-P2-10
TIP
The following confirmation dialog box appears when a USB memory device is inserted into the USB port of the YSM40.
Click “Scan and fix (recommended)”.
Dialog box for confirming the YSM40 USB memory
6
managing the data
Click “Scan and fix (recommended)”.
24662-P2-00
6-2
2 Check the USB memory device connection.
Check the indicator on the lower left of the operation screen.
The connection is complete when the USB memory device icon appears red.
The connection is incomplete if the USB memory device icon is grayed out. Try reconnecting the USB
memory device.
Checking the USB memory device connection
Connected Not connected
Icon appears "red". Icon is grayed out.
24605-P2-00
3 Open the Board Explorer.

Press the [Board Explorer] button on the Setup screen.
4 Press the [Media] button.

The "Media Select" dialog box appears.
5 Select the media and create a board folder.

1. In the "Media Select" dialog box, select the media (USB memory device) and press the [Create
Folder] button. When the keyboard dialog box appears, enter a folder name and press the [OK]
button.
Selecting the media

Select the media (USB memory device).
6
managing the data
Enter a folder name.
24606-P2-00
6-3
2. Select the folder you have just created, and press the [Board folder making] button.
The "Board Folder Making" dialog box appears. Check the message and press the [Yes] button.
Making a board folder
Select the folder.
24607-P2-00
3. When the setting is complete, press the [OK] button in the "Media select" dialog box to close it.
4. After returning to the Board Explorer window, check the "Folder" box to see if the "No1" folder is
created.
Checking the folder
6
managing the data
Check that a folder named "No1" is created.
24608-P2-00
6 Select the file format.

Select the file format from the "File Format" drop-down list box.
6-4
7 Select the board data you want to back up.
Line up the cursor with the board data you want to back up. You can select multiple board data by
selecting them while holding down the [Ctrl] key or [Shift] key. When you want to select all board data
in the list, press the [All Selected] button.
In the case of combined board data, the lane to be operated should first be selected and displayed
with the [Lane] button before selecting board data.
8 Designate the copy destination.

Press the [Media] button on the left when copying from right to left, or press the [Media] button on the
right when copying from left to right.
Selecting the copy destination
Copy from right to left Copy from left to right
[Copy]
button
24609-P2-00
9 Press the [Copy] button.

A confirmation dialog box appears. Press the [Yes] or [All] button to make a copy to the USB memory
device.
Copy confirmation dialog box 6

managing the data
24610-P2-00
6-5
0 Rename the board data as needed.
When you want to change the board name so that you can easily identify it as backup data, press the
[Rename] button. When the keyboard dialog box appears, enter a new name and press the [OK]
button.
Rename
Enter a new name for backup data.
24611-P2-00
6
managing the data
6-6
1.2 Making a backup of system data
System data can be backed up by two methods: system backup and system full backup. The backup data can be
stored either on a USB memory or network drive.
n System backup
This function backs up only the machine setting information.
The backed up data is used to register the machine to offline software. For safety reasons, making a system backup is
recommended before upgrading the application software or changing the machine settings.
When restoring system data using the data acquired by the system backup function, only the machine setting parameters
will be restored.
If for some reason the flash disk in the machine is destroyed, the system backup data can be used to restore the machine
settings. However, the system and application software must be reinstalled before restoring the machine settings.
n NOTE
The memory capacity required for storing backup data depends on the machine model, but should be at least 50MB
including a margin.
n System full backup

This function backs up all data stored in the flash disk in the machine.
This backup data contains all information including the machine application software, OS, board data, and production
logs.
If for some reason the flash disk in the machine is destroyed, the system full backup data can be used to restore all data
necessary for machine operation into a new replacement flash disk.
A personal computer and dedicated software are needed to restore the system full backup data.
To use this backup function, the machine software version must be V3.27std R2.000 or later.
n NOTE
The memory for storing backup data must have a free space larger than the flash disk in the machine. The flash disk
capacity may differ depending on the machine model, so check it on the VmSpec screen before making a backup.
Checking the disk capacity

[Check Capacity] button
6
24663-P2-00
managing the data
c CAUTION
Use a USB memory device (supplied with the machine or purchased from YAMAHA sales reps) specified by YAMAHA
Motors Co., Ltd. Using a USB memory device other than specified might cause problems. Do not use any other type of
USB memory device with YAMAHA surface mounters and related machines.
c CAUTION
Before copying data to the USB memory device, always close the media access door to prevent dust from adhering
to the USB port and to protect the USB memory device from electrostatic noise.
c CAUTION
After copying board data or system data into a USB memory device, do not leave that data in the USB memory device
for a long time. Use the USB memory device just as a copy medium for backup data. Prepare other backup media
(CD, DVD, MO, etc.) to store the backup data.
6-7
1.2.1 System backup settings
Make the following settings to back up system data. These system backup settings are also used to make a
system full backup.
Press the [Software Setting] button on the Setup screen to open the "Setting" screen, and press the [System
Backup] button on the [Basic] tab. The "System backup setting" dialog box then appears. Make the necessary
settings and press the [OK] button.
Making the system backup settings
Enter the folder name.
24612-P2-00
"Folder is fixed"
• Select this check box to automatically create a folder under the name you have entered in the
"Folder Name" text box and back up the system data into that folder.
6 • When this check box is cleared, a dialog box will appear when you back up the system data,
allowing you to select the folder to store the system data.
"Folder Name"
• Enter the folder name to store the system backup data. This is used only when the "Folder is fixed"
managing the data
check box is selected.
c CAUTION
Do not add the drive name to the folder name.
n NOTE
A suffix “-FULL-” is added to the folder name for system full backup.
6-8
"The date is attached to the name of a folder"
When this check box is selected, the system data will be backed up in the folder whose name
includes the date.
n NOTE
If you back up the system data twice or more a day, a number (2), (3) ... will be added to the end of each folder
name.
Path setting for saving or restoring data

• When “Media” is selected:
The system backup data is stored in the USB memory connected to the machine. If no USB memory is
connected, an error message “No media are found” appears.
• When “Network Folder” is selected:
A dialog box for selecting a folder appears when you back up system data. Select the folder to store
the system backup data.
6
managing the data
6-9
1.2.2 Making a backup
The following steps describe how to back up system data using a USB memory device.
1 Insert a USB memory into the USB port.

Insert the USB memory into the USB port of the machine.
2 Check the USB memory connection.

The indicator on the lower left of the operation screen shows the connection status.
The connection is complete when the USB memory icon appears red.
The connection is incomplete if the USB memory icon is grayed out. Try reconnecting the USB memory.
3 Open the “System backup” screen.

On the Setup screen, press the [Software Setting] button under “Utility”.
“System backup” screen
USB memory icon

24616-P2-00
6
managing the data
6-10
4 Start making a backup.
n To make a system backup:
1. Press the [Backup] button.
2. A confirmation message appears asking if you want to make a backup file. Check the location
where the system backup data will be stored and then press the [Yes] button.
System backup will start.
3. Another message appears when system backup is complete. Press the [OK] button to close the
message screen.
System backup
Check the location where the
6
backup data will be stored.
24617-P2-00
4. When returned to the “System backup” screen, press the [Close] button to exit it.
managing the data
6-11
n To make system full backup:
1. Press the [Full Backup] button.
2. A confirmation message appears asking if you want to make a backup file. Check the location
where the system full backup data will be stored and then press the [Yes] button.
System full backup will start. It will take about 20 minutes to complete.
c CAUTION
If you want to cancel the backup, press the ESC key on the keyboard.
The data being created will not be deleted even if the backup is cancelled (or fails).
3. Another message appears when system full backup is complete. Press the [OK] button to close the
message screen.
System full backup
6 Check the location where the

backup data will be stored.
24618-P2-00
4. When returned to the “System backup” screen, press the [Close] button to exit it.
managing the data
6-12
5. Check that three files were created in the destination folder.
These files are used to restore the system full backup.
Full backup data
24623-P2-00
c CAUTION
The files created by system full backup contain the machine settings, network settings, and board data, so keep them
very carefully.
6
managing the data
6-13
1.3 Restoring the system data
System data can be restored by using either the system backup data or system full backup data.
1.3.1 Restoring a system backup

The system backup data can be restored on the machine.
The following steps describe how to restore the machine setting information using the system backup data
stored in a USB memory device.
1 Press the [System Backup] button on the Setup screen.

The "System backup" screen appears.
Starting the "System backup" screen
24613-P2-10
6
managing the data
6-14
2 Restore the system backup data.
1. Insert the USB memory device that contains the system backup data, into the USB port on the
machine, and then press the [Restore] button on the "System backup" screen.
2. The "Media Select" screen appears. Select the system backup data you want to restore and press
the [OK] button.
Selecting the system backup data
24614-P2-10
6
managing the data
6-15
3. A confirmation dialog box appears asking if you want to restore the backup data. Press the [Yes]
button to start restoring the system data.
4. When the system data has been restored, a "Restore Completed" dialog box appears. Press the [OK]
button to close the dialog box.
Restoring the system data
24615-P2-00
5. When returned to the "System backup" screen, press the [Close] button to exit it.
Restoring the system backup data is now complete.
6
managing the data
6-16
1.3.2 Restoring a system full backup
To restore the system full backup data, use the dedicated software installed on a PC.
The following steps describe how to restore system data into a flash disk using the system full backup data
stored in a USB memory device.
n Required components and devices

• Flash disk (parts No. and name: KHL-M4255-00 FLASH DISK)
• Data acquired by system full backup
• PC (Windows XP or later)
• Card reader or memory card adapter
c CAUTION
Always use a YAMAHA genuine flash disk. Using other flash disks may cause malfunction.
n NOTE
Use a PC with any of the following OS: Windows XP Professional (32 bits) / Windows Vista (32 bits) / Windows 7 (32 bits /
64 bits)
n Restoring onto a USB memor y device
1 Connect the USB memory to the PC.

1. Insert the USB memory containing the system full backup data into the USB port of the PC.
2. A dialog box appears asking you to select what you want Windows to do. Select “Using Windows
Explorer to open a folder to display a file” and click the [OK] button. The “REMOVABLE” screen then
appears.
TIP
If the data acquired by system full backup is stored on the network, select the folder containing the system full backup
data you want to restore.
2 Start the restore software.

1. Double-click the folder that was created by system full backup.
2. The folder contains three files. Double-click the “VgosSystemFullBackup.exe” file, and the restore
software starts up.
Starting the restore software
6
Double-click this file. managing the data
24630-P2-00
6-17
3 Restore the system data.
When the “VgosSystemFullBackup” dialog box appears, check that the backup data is for the machine
where you want to restore and click the [Next] button. The “FLASH DISK” dialog box then appears.
c CAUTION
If a flash disk is connected to the PC, remove it and then click the [Next] button.
Checking the machine
Check here.
24631-P2-00
4 Connect the flash disk.

Insert the flash disc into the card reader and then connect the card reader to the PC, it is detected by
the PC and displayed in the dialog box. The [Next] button becomes active, and click it to continue.
When flash disk is connected
Detected flash disk
6
Managing the data
24632-P2-00
c CAUTION
· Windows Explorer may automatically start when a flash disk is connected to the PC.
If any application automatically starts, quit it.
· If the flash disk is not detected even after connecting it to the PC, remove the flash disk and then reconnect it again.
· Restoring will write the system full backup data over the data in the flash disk.
6-18
5 Check the settings for restore and start restoring the backup data.
1. When the “RESTORE” dialog box appears, check the flash disk drive and the path to the system full
backup data.
2. After checking, select the “Determine” check box, and the [Execute] button appears.
3. Click the [Execute] button to start the restore process.
Checking the restore settings and executing restore
Flash disk drive

Path to the system full backup data
“Determine” check box
[Execute] button
24633-P2-00
4. When finished restoring the system data, the “Success” dialog box appears. Click the [OK] button,
and the [Next] button in the “RESTORE” dialog box changed to the [Finish] button.
5. Click the [Finish] button to finish the restore process.
Restore process is complete

6
managing the data
24634-P2-00
6-19
6 Install the flash disk into the machine.
Install the new flash disk containing the restored system data into the machine.
Restoring the system full backup data is now complete.
6
managing the data
6-20
2. Managing the POS information files
Use the Board Explorer to copy the "random ball position (POS) information files" you created on an external
PC into the "No.1" folder or move them from the "No.1" folder to another location, or delete them.
TIP
Once the component information is created using a "random ball position (POS) information file" and stored in the
database, you can delete that file. For instructions on how to store data into the database, refer to "3. Creating the
user database" in this chapter.
c CAUTION
Be careful so that the "No.1" folder capacity is not exceeded.
c CAUTION
When exchanging POS data using a USB memory device, always use the USB memory device specified by YAMAHA.
1 On the Setup screen, press the [Board Explorer] button.

The Board Explorer window appears.
2 Select the "Others" radio button and select "POS Information".

Also use the [Media] buttons to specify the folders in the left and right panes.
The random ball position (POS) information stored in each specified folder files is displayed as a list.
Board Explorer
POS Information
6
managing the data
24619-P2-00
3 Select the POS information file you want to manipulate.

Line up the cursor with the file you want to copy, move or delete. You can select multiple files by
selecting them while holding down the [Ctrl] key or [Shift] key. When you want to select all files in the
list, press the [All Selected] button.
6-21
4 Make file manipulation.
1. To copy files:
Press the [R. to L.] button when copying from right to left, or press the [L. to R.] button when copying
from left to right. Then select the file or files you want to copy and press the [Copy] button. When a
confirmation dialog box appears, press the [Yes] or [All] button to copy the file or files.
Copying the POS information files
24620-P2-00
6
managing the data
6-22
2. To move files:
Press the [R. to L.] button when moving from right to left, or press the [L. to R.] button when moving
from left to right. Then select the file or files you want to move and press the [Move] button. When a
confirmation dialog box appears, press the [Yes] or [All] button to move the file or files.
Copying the POS information files
24621-P2-00
3. To delete files:
Select the file or files you want to delete and press the [Delete] button. When a confirmation dialog
box appears, press the [Yes] or [All] button to delete the file or files.
Deleting the POS information files
6
managing the data
24622-P2-00
6-23
3. Creating the user database
Registering components (or marks) in the user database will prove convenient if they are not included in the
YAMAHA database or they are used very frequently.
The user database should be registered in the user area of the database. The user database should be
registered in the user area of the database. The user database area can be from No. 1001 onward for the
component database and from No. 1 to No. 149 for the mark database. The registered data in this area will
be retained even if the software version is upgraded.
3.1 Registering the data into the database

To register the component or mark data you created into the user database, follow these steps.
1 Select the board name.

On the Setup screen, press the [Board] button and select the board name.
2 Open the Parts screen or Mark screen.

Press the [Parts] button or [Mark] button in the main menu button area.
3 Select the copy source data.

Line up the cursor with the component data or mark data you want to copy from.
4 Open the database list.

Press the [Database] button on the [Basic] tab. The database list appears.
Database list
Copy source
6
managing the data
24624-P2-10
6-24
5 Press the [New] button and designate the database number.
The database number input dialog box appears. Enter the database number under which the data will
be stored. Leave blank to store the data in the first free number.
Database number input dialog box
Enter the database number where data should be copied.
24625-P2-10
6 Press the [OK] button to copy the data into the database.
All items of the selected data including the data name and comment will be copied. Press the [Clear]
button to return to the database list.
Database registration message
6
managing the data
24626-P2-10
7 Press the [Close] button to close the database list.

If you want to copy other data into the database, repeat the above procedure.
6-25
3.2 Expanding the component database
Normally, up to 3000 components can be registered in the component database. Using the expansion process
allows registering up to 16,000 components. However, keep the following points in mind if expanding the
component database.
• The maximum number of components you can register in the database includes the YAMAHA component
data area, so it does not equal the actual amount of data usable by the customer.
• The database cannot be expanded if registering components automatically by database matching.
To register components automatically, first expand the YAMAHA database by making new registrations and
then do database matching.
n How to expand the database

1. You can expand the database automatically by simply registering new components in the database from No. 3001
onwards.
2. The following confirmation message appears when you first register component data in a non-expanded database from
No. 3001 onwards. Select [Yes] to expand the database.
Message for expanding the database
24627-P2-00
6 n NOTE
This confirmation message only appears when first registering data from No. 3001 onwards. This message does not
appear if the database is already expanded, even if making an entry from No. 3001 onwards.
3. To return an expanded database to its standard size, delete all data from No. 3001 onwards. This will restore the
database to its standard specifications.
managing the data
6-26
4. Production log management
4.1 Production log types
This machine stores production logs per machine and per board data.
The production logs are broadly grouped into 2 types. One is a log history and the other is a machine
operation data count log.
The log history is mainly a log of errors and program tasks, and a log of board-related items. These logs can be
viewed on the production log data screen (MIS screen) that opens when you press the [MIS] button.
The operation data count log is a collection of error rates and operations for each head, nozzle, and
component, which can be viewed on the screen (Unit Log screen) that opens when you press the [Unit Log]
button.
TIP
In the production log data, board data names are handled as program names.
4.1.1 Production log (MIS)

Pressing the [MIS] button opens the "MIS" screen with the [Error Log], [Board Log] and [Program Log] tabs. The
[MIS by Board] tab also appears if the fucntion for storing production logs per board data is enabled. For how
to enable that fucntion, refer to "4.2.1 Setting to store production logs per board data" described later on.
Production log ("MIS" screen)

[Error Log] tab
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6
Error Log
managing the data
Displays error and operation logs.
One error or one operation is listed in one data row. Up to 1000 rows can be displayed.
Board Log
Displays production logs per board.
One data row is used to record one board. Up to 1000 rows can be displayed.
TIP
On the machines having two or more stages, the "Stage Select" drop-down list appears. Select the stage to check the
logs.
Program Log
Displays production results per lot, with one lot treaded as the interval from the loading of a program (board data) until
switching over to the next program.
One data row is used to record one lot. Up to 1000 rows can be displayed.
TIP
logs.
6-27
MIS by Board
Displays proudction logs per board data, which are sub-divided into "Board Info", "Parts Info", and "Head Info".
n Items displayed on the "MIS" screen

[Error Log], [Board Log] and [Program Log] tabs
Items to be displayed on these tabs can be viewed by pressing the [Option] button on the lower right of the "MIS"
screen. Pressing the [Option] button opens the "Setting Grid View" screen as shown below. Selecting each item in the
left-hand list shows the contents of that item on the right side.
[MIS by Board] tab
On the [Board Info] sub-tab, selecting each item in the left-hand list shows the contents of that item on the right side.
Items to be displayed on the [Parts Info] and [Head Info] sub-tabs can be viewed by pressing the [Option] button on
the lower right of the "MIS" screen, as in the case of the [Error Log], [Board Log] and [Program Log] tabs.
"Setting Grid View" screen

[MIS]-[Board Log] tab
Select item. Description of the selected item is displayed.
24657-P2-10
6
managing the data
6-28
4.1.2 Operation log (Unit Log)
Pressing the [Unit Log] button opens the "Unit Log" screen with the [Head], [Nozzle], [Feeder], [Conveyor] and
[Parts] tabs.
TIP
In the unit log, the head, nozzle, conveyor and feeder operation logs are further divided into 3 groups: "Operator",
"Service" and "Total". The "Operator" and "Service" operation logs can be cleared as needed. The "Total" operation logs
cannot be cleared, as these are used for maintenance.
Operation log ("Unit Log" screen)

[Head]-[Operator] tab
24629-P2-00
Head
The [Head] tab screen displays information on operation logs for each head of the machine. You can check how
frequently each head was used or head-related errors occurred.
TIP
logs.
The following error rates are displayed on the lower part of this screen.
Down Error Rate (%)
Shows the percentage of the total head down error count divided by the total head down count for all heads.
Blow Error Rate (%)
6
Shows the percentage of the total blow error count divided by the total blow count for all heads.
Pickup Error Rate (%)
managing the data
Shows the percentage of the total pickup error count divided by the total pickup count for all heads.
FNC Error Rate (%)
Shows the percentage of the total FNC change error count divided by the total FNC change count for all heads.
ANC Error Rate (%)
Shows the percentage of the total ANC change error count divided by the total ANC change count for all heads.
Nozzle
The [Nozzle] tab screen displays information on operation logs for each nozzle of the machine. You can check how
frequently each nozzle was used or nozzle-related errors occurred. From the "Nozzle Select" drop-down list, select the
nozzle to check the logs.
TIP
logs.
The pickup error rate is displayed on the lower part of this screen.
6-29
Feeder
The [Feeder] tab screen displays information on operation logs relating to the feeders installed in the machine. You can
check how frequently each feeder was used or feeder-related errors occurred.
The pickup error rate is displayed on the lower part of this screen.
Conveyor
The [Conveyor] tab screen displays information on operation logs relating to the conveyor units in the machine. You can
check how frequently each conveyor unit was used or errors occurred.
TIP
logs.
The operation error rate is displayed on the lower part of this screen.
Parts
The [Parts] tab screen displays information on operation logs relating to components used by the machine.
This information is divided into two groups which are displayed on the [Current data] sub-tab and [Reenact data]
sub-tab. The [Current data] sub-tab shows information on component data currently used for board production, while the
[Reenact] sub-tab shows a log of production results for components used in the past.
The following error rates are displayed on the lower part of this screen.
Pickup Error Rate (%)
Shows the percentage of the total pickup error count of all components divided by the total quantity of all
components that were used.
Vision Error Rate (%)
Shows the percentage of the total recognition error count of all components divided by the total quantity of all
No Parts Error Rate (%)
Shows the percentage of the total "no component" error count of all components divided by the total quantity of all
Nozzle Error Rate (%)
Shows the percentage of the total nozzle error count of all components divided by the total quantity of all
n Items displayed on the "Unit Log" screen

Items to be displayed on each tab of the "Unit Log" screen can be viewed by pressing the [Option] button on the lower
right of the "Unit Log" screen. Pressing the [Option] button opens the "Setting Grid View" screen as shown below.
Selecting each item in the left-hand list shows the contents of that item on the right side.
"Setting Grid View" screen

[Unit Log]-[Head] tab
6
Select item. Description of the selected item is displayed.
managing the data
24658-P2-00
6-30
4.1.3 Other operations
Production and operation log data can be saved or deleted, and each log data item hidden or re-displayed on
the screen as needed.
Log data operation and setting buttons
[Save Log] button [Option] button
[Clear] button
[Reset] button
24644-P2-00
[Save Log] button

Pressing the [Save Log] button opens the "Save Logged File" dialog box. You can save the desired log data currently stored
in the system, into any location such as an external medium (USB memory and floppy disk) or network drive.
1. Press the [Save Log] button to open the "Save Logged File" dialog box.
2. Press the [Media] and [Folder] buttons, and set the location to save the log data.
3. Name the file and press the [Save] button.
The file of the log data will be saved in the specified location. A file extension (.csv) will be automatically assigned to
each file.
Saving the log data
6
managing the data
24645-P2-00
TIP
If you want to save all production log data to an external medium at one time, make settings on the "History Utility"
screen. For information on the "History Utitiliy" screen, refer to "4.2.3 History Utility" described later on.
6-31
[Clear] button (on "MIS" screen only)
Use this button to delete all log data currently displayed on the screen. Data cannot be deleted in rows.
When a confirmation dialog box appears, press the [Yes] button to delete the log data.
c CAUTON
Data cannot be recovered once deleted, so use caution.
[Reset] button ("Unit Log" screen only)

Use this button to reset the contents currently displayed on the screen.
1. Press this button to open the "Setting Reset Item" dialog box, select the reset method, and press the [OK] button.
2. When a conformation dialog box appears, press the [Yes] button to reset the selected items.
"Setting Reset Item" dialog box

[Nozzle] tub
Select reset method.
24656-P2-10
TIP
If you want to clear/reset all production log data to an external medium at one time, make settings on the "History
Utility" screen. For information on the "History Utitiliy" screen, refer to "4.2.3 History Utility" described later on.
[Option] button
Pressing the [Option] button opens the "Setting Grid View" screen that allows you to show or hide each log data item.
Check the items you want to display, and uncheck the items you do not want to display.
Selecting the items to display
6
managing the data
24646-P2-00
6-32
4.2 Production and operation log settings
Using the [Software Setting] and [History] buttons on the Setup screen, you can make settings for production logs.
4.2.1 Setting to store production logs per board data

When the function for storing production logs per board data is enabled, you can manage the production logs
per board data, as well as the ordinary production logs.
n NOTE
・ When the function for storing production logs per board data is enabled, a production log is saved each time
board data is saved. If the board data is renamed, the production logs for that board data are also copied under
the renamed board data name.
・ Deleing board data also deletes the production logs for that board data.
・ When board data is changed, the production logs for that board data recorded up until that point is saved in a
file. If the newly loaded board data has a file of production logs, the contents of those logs are also loaded, and
new logs will be added.
1 Press the [Setup] - [Software Setting] button.

The "Setting" screen will appear. Open the [History] tab.
2 Press the [MIS by Board] button.

The "Setting MIS by Board" screen then appears. Make the necessary settings.
Setting to store production logs per board data
6
managing the data
24659-P2-10
Enable MIS by Board

Select this check box to enable the function for storing production logs per board data. The [MIS by
Board] tab then appears on the "MIS" screen, allowing you to view production logs per board data.
Add details into the file

When this check box is selected, the error count for each head is added to the "Parts Info" sub-tab, and
the error count for each nozzle to the "Head Info" sub-tab when the production log file is saved.
Ser ver Path

If you want to save the production log file to a server, set the path to the server. Only the production log
file will be saved in the server in the path. (Board data will not be saved there.)
3 When the setting is complete, press the [OK] button.

This returns to the "Setting" screen. Press the [Close] button on the "Setting" screen.
6-33
4.2.2 Specifying the auto-save destination
Log data can be automatically saved in the specified locations at the time when the machine is turned off. To
specified the save destination, follow these steps.
1 Press the [Software Setting] button on the Setup screen.

The "Setting" screen then appears. Open the [History] tab.
2 Press the [MIS] or [Unit log] button.

• Press the [MIS] button to set the save destination of production log data.
The "MIS Setting" dialog box appears.
• Press the [Unit Log] button to set the save destination of operation log data.
The "Unit Log Setting" dialog box appears.
3 Set the server paths.

1. Press the [Browse] button and specify the path to each folder where the log data will be stored. (You
can directly enter the paths in each path entry box.)
2. After specifying the folders, press the [OK] button.
Log data will be automatically saved in the folders specified here.
Specifying the destination to save log data
24643-P2-20
6
n File names automatically saved
Item Display item File name example
Error log ErrLog20080422.csv
MIS Board log PcbLog20080422.csv

managing the data
Program log LotLog20080422.csv
Head Head20080422.csv
Nozzle Nozl20080422.csv
Unit log Feeder Feeder20080422.csv
Conveyor Conv20080422.csv
Parts Part20080422.csv
TIP
Each file is automatically named when saved. It consists a predetermined log name (ErrLog, PcbLog, Part, Feeder,
etc.) followed by a number representing the date such as "20080422" (April 22, 2008). A new file is created each day.
6-34
4 Press the [History] button on the “Setting” screen.
The “Setting Detail History” dialog box then appears.
“Setting Detail History” dialog box
24661-P2-20
5 Select the check boxes as needed.

• "Remember the lot log" check box
When this check box is selected, the board data that was in use when the machine power was
turned off will be loaded again the next time the power is turned on, in order to take over its
operation history data.
• "Mch line of the Lot log does not output" check box
The lot logs of machines equipped with multiple stages or dual lanes include the “Stage” or “Lane”
column. Select this check box if you do not want to display the “Mch” row in the “Stage” or “Lane”
column.
• "Feeder Log Use UseNo Mode" check box
When this check box is selected, the number in the “Set No.” field in the file created when the
“Feeder” log of “Unit Log” is saved will start from “1”.
When this check box is cleared, the number in the “Set No.” field will start from “0”.
• "Multi Language Output" check box
6
When this check box is selected, the operation history data can be saved or loaded in multi-
language mode.
• "FullASCII Output" check box
When this check box is selected, characters not applicable to this machine (illegal characters) are
converted automatically in the file read process.
managing the data
Illegal characters (example): !#$%&@*<>?/, etc.
• "Parts history management with both parts name and comment" check box
Use this option when changing the “log” display on the [Parts] - [Past Data] tab of the Unit Log
screen. When checked, the parts with the same name will be displayed in different rows if their
comments differ.
• Same Board Name taking over LotPartsLog
When this check box is checked on, the current production board, lot log, and production log are
succeeded as the board data with the same name as the name of the board data that is currently
loaded is selected when the board is changed.
n NOTE
This function is enabled only when selecting the board data by pressing the [Board] button on the Setup screen.
This function is disabled when changing the board using "automatic setup function" of IT Option and "remote control
function" of YFact.
6-35
• "History output setting of specified time" check box
Select this check box when you want to specify the time to output the operation history data.
After selecting this check box, enter the time in military time (24-hour clock format) in the “Specified
time” box. By making this setting, the machine automatically outputs and saves the operation history
data at the specified time every day.
When the “After the history output, the unit logs are reset” check box is selected, the “Unit log” data
will be reset after the production history data is output.
• "Limit size of total history" box
When you want to set a limit on the total amount of operation history data to be saved, enter it
here. An alarm will occur when the free space of the destination approaches the limit size specified
here. No limit will be placed when set to "0".
6 When finished setting, press the [OK] button.

The display returns to the “Setting” screen, and press the [Close] button to close it.
4.2.3 Histor y Utility

The History Utility allows you to save production logs to an external storage medium at one time or clear/reset
them at one time
On the Setup screen, pressing the [History] button opens the "History Utility" screen as shown below.
History Utility
6 Check the necessary items.

24660-P2-10
To save logs at one time:

1. Check the check boxes next to the items you want to save, and press the [Save] button.
managing the data
2. When the "Media Select" screen appears, check or select the storage medium and press the [OK] button.
3. A confirmation dialog appears. Press the [Yes] button to save the selected items.
4. Another dialog appears when the selected items have been saved. Press the [OK] button to close the dialog box.
TIP
Production logs are saved in a folder named "My History" in the external storage medium.
To clear/reset logs at one time:

1. Check the check boxes next to the items (MIS) you want to clear or the items (Unit log) you want to reset, and press
the [Clear/Reset] button.
2. A confirmation dialog appears. Press the [Yes] button to clear/reset the selected items.
c CAUTION
Deleted data cannot be restored, so be careful.
6-36
Appendix
Appendix
Contents
A1. Specifications A-1
A2. Operator access control A-4

A2.1 Registering a new operator A-4
A2.2 Changing the registered contents A-8
A2.3 Editing groups A-9
A2.4 Editing access levels A-11
A2.5 Import/export function A-13
A2.6 Operator level time limit function A-14
A3. Function for simplifying the vision algorithm setting A-15

A3.1 Selecting an algorithm A-16
A3.2 Changing the edit mode A-17
A3.3 Creating component information A-19
A3.3.1 Special algorithm parameters A-20
A3.3.2 Chip components A-21
A3.3.3 Solder ball components A-25
A3.3.4 IC components A-28
A3.3.5 Specially shaped components A-35
A4. Parts Data Auto Tuning function A-45

A4.1 Overview A-45
A4.1.2 Parts and parameters that can be tuned A-45
A4.2 Functions A-46
A4.2.1 Parts information tuning function A-46
A4.2.2 Tuning result takeover function A-48
A4.3 Setting A-50
A4.3.1 Machine setting A-50
A4.3.2 Parts information A-52
A4.3.3 Software Setting A-52
A5. Function for automatically creating part data A-53

A5.1 Overview A-53
A5.1.2 “Parts Find Best Target” combo box A-54
A5.2 Procedure for automatically creating part recognition data A-55
A5.2.1 Creating the Alignment Type and dimensions automatically A-55
A5.2.2 Automatically creating the dimensions only A-56
A5.2.3 Corrective action when search for optimal values has failed A-57
A5.3 Function details A-58
A5.3.1 Parameters that can be automatically created A-58
A5.3.2 Alignment Type compatible with automatic parameter creation A-59
A1. Specifications
n YS series specifications (YS12, YS12P, YS12F, YS100, YS88, YC8, YS24, YS24X)
Appendix
Specifications
Item
YS12 YS12P YS12F YS100 YS88 YC8 YS24 YS24X
Function guaranteed: 15 to 35°C

Operating ambient temperature
Accuracy guaranteed: 20 to 28°C
Operating ambient humidity 20 to 80% (no condensation), optimal range: 50 to 60%
Noise level under 78dB
Power requirement (voltage and frequency) 3-phase 200/208/220/240/380/400/416V AC ±10%, 50/60Hz
Average power consumption (kW) 1.1 0.8 1.0 0.75 0.75 0.64 2.0
Power cable (conductor cross-section area) 2.5mm 2 or more 5.5mm 2 or more
Overvoltage category * 1 Category III
Pollution degree * 1 Degree 2
Supply air pressure * 2 0.45MPa or more
*6
Air flow rate Main unit Average consumption (l/min ANR) 120 120 120 110 110 50 260
Maximum
(l/min ANR) 310 310 310 290 240 90 420
instantaneous flow rate
Main unit Average consumption (l/min ANR) --- --- --- 120 120 --- --- ---
and sATS Maximum
(l/min ANR) --- --- --- 300 250 --- --- ---
Main unit Average consumption (l/min ANR) --- --- --- --- --- --- --- 270
and sATS II Maximum
(l/min ANR) --- --- --- --- --- --- --- 430
Main unit Average consumption (l/min ANR) --- --- --- 170 170 --- --- ---
and dYTF Maximum
(l/min ANR) --- --- --- 350 300 --- --- ---
Main unit Average consumption (l/min ANR) --- --- 130 --- --- 60 --- ---
and ATS15 Maximum
(l/min ANR) --- --- 320 --- --- 100 --- ---
Board transport height * 3 900 mm ± 10 mm
Number of mounting points * 4 10,000 points
Data Number of part types 255 types per board
Number of fiducial marks * 5 128 sets per board
*1: Conforms to IEC60664-1.

*2: Use clean, dry air passed through an air dryer and filter. This pressure is different from the air pressure setting for the
machine. Air flow rate is only for the main unit.
*3: Distance from the floor surface to the upper surface of conveyor belt.
*4: Decreases with the number of boards, blocks and fiducial marks.
*5: When using 2-point fiducial mode.
*6: Air flow rate values apply to machines equipped with a tape cutter. (A flow rate included for the tape cutter.)
c CAUTION
Conveyor's board sensors may fail to detect a production board if it has a slit or cutout.
n NOTE
For more detailed information not listed above, please refer to specification sheets.
A-1
n Specifications (YSM40)
Specifications
Item MU head HS head FL head
2-beam 4-beam 2-beam 4-beam 2-beam 4-beam

Appendix

Noise level Under 78dB
Average power consumption 3.2kW
Power cable (conductor cross-section area) 5.5mm 2 or more
*6
Air flow rate Main unit Average consumption (Nl/min ANR) 30 110 160 30
Maximum
(Nl/min ANR) 140 180 240 140
Main unit Average consumption (Nl/min ANR) 40 --- 120 --- 40 ---
and cATS
Maximum
(front or rear) (Nl/min ANR) 150 --- 190 --- 150 ---
Main unit Average consumption (Nl/min ANR) 50 --- 130 --- 50 ---
and cATS
Maximum
(front and rear) (Nl/min ANR) 160 --- 200 --- 160 ---

c CAUTION
n NOTE
A-2
n Specifications (Z:LEX (YSM20))
Specifications
Item HM head FM head
1-beam 2-beam 1-beam 2-beam
Appendix
Noise level Under 78dB
Average power consumption 1.79kW
Power cable (conductor cross-section area) 10mm 2 or more
*6
Air flow rate Main unit Average consumption (L/min ANR) 140 240 80 170
Maximum
(L/min ANR) 290 380 110 310

c CAUTION
n NOTE
A-3
A2. Operator access control
To operate this machine, operators must log in with a valid name. This means that the operator names must
be registered in advance in order to use this machine. This section explains how to register or change
operator names, set a password, and set or edit the access level.
Appendix
n NOTE
We recommend registering the operator names and setting their access levels before attempting to use this machine.
A2.1 Registering a new operator

This section describes how to register a new operator, make group settings, and set an access level and
password.
1 Press the [Operator] button to open the "ID WINDOW" screen.

2 Specify an operator and enter the password.
1. Select "Administrators" from the "GROUP NAME" drop-down list and select "Administrator" from the
"OPERATOR NAME" list.
2. Enter the password and press the [OK] button.
When the password is matched, the initial screen (Setup screen before selecting board data)
appears.
n NOTE
Operators can only be registered by the "Administrator" whose access level is set to 10.
"ID WINDOW" screen
Select "Administrators".
Select "Administrator".
24000-P2-00
A-4
When the "Setting" screen appears, open the [Operator] tab and press the [Operator] button. The "EDIT
OPERATOR" screen then appears.
Operator setting
Appendix
1
24003-P2-00
1. GROUP NAME
Two group names "Administrators" and "Operators" are registered by default. New groups can be registered as needed by
the administrator or the registered groups can be deleted. Refer to "B.2.2 Editing groups" explained later on.
2. Operator list
This list shows the operator names and their access levels registered in each group.
TIP
In each group, an operator is registered by default, such as "Administrator" or "Default Operator".
3. [INS] button
Pressing this button opens the "EDIT OPERATOR" screen. Register a new operator and set the password and access level.
4. [DEL] button
Use this button to delete a registered operator. Select the operator you want to delete and then press this button.
c CAUTION
The "Administrator" and "Default Operator" that are registered by default cannot be deleted.
5. [EDIT] button
Press this button when you want to change a registered operator name, access level, and/or password.
c CAUTION
The "Administrator" and "Default Operator" names that are registered by default cannot be changed.
A-5
4 Press the [INS] button to register an operator.
The "EDIT OPERATOR" screen appears. Set each item as explained below.
"EDIT OPERATOR" screen

Appendix
1
6
5
3
24004-P2-00
1. OPERATOR NAME
Register the name of an operator who will use this machine. Enter the operator name using alphanumeric characters. The
number of input characters is not limited, but about only 35 characters will appear in the "OPERATOR NAME" box of the
"EDIT OPERATOR" screen.
n NOTE
The following characters can be used in operator names.
Double quotation marks ( " ) and commas ( , ) cannot be used.
2. LEVEL (access level)

These levels restrict access to machine operations. Levels 0 to 10 are available. Allowable or prohibited operation items
are assigned by default to each level as shown below.
Select an appropriate access level from the "LEVEL" drop-down list
TIP
When you want to change the predetermined conditions, refer to "A2.4 Editing access levels" explained later.
n NOTE
The Level 0 operation range is the most restrictive, while the Level 10 operation range allows full access.
■ Default access level conditions
Access Level Conditions
This is the default level at machine start-up.

0 Operator Minimum functions such as log-in, help, version information, and speed
setting are enabled.
Only operation items needed for automatic operation are available.
1, 2 Operator [RUN] and [STOP] can be used, but data editing and conveyor setups
are prohibited.
These levels allow automatic operation and data editing.
3, 4 Operator
Creating new data and saving edited data are prohibited.
These levels allow editing and saving data.
5, 6 Operator
Data can be optimized and saved.
These levels allow managing machine operation logs. Operation logs
7, 8 Operator
can be reset as needed.
This administrator level allows all operations including adjustments.
9 Administrator
Application software settings and adjustments are also allowed.
This administrator level allows all operations including adjustments.
10 Administrator Application software settings, adjustments, and operator group
registration or deletion (Ver. 3.XX only) are also allowed.
n NOTE
Higher access levels include all operation items available at lower levels. For example, a Level 4 operator can perform
all operations permitted for Levels 0 to 4.
A-6
3. PASSWORD
Enter a password of up to 31 alphanumeric characters. Only 31 characters will be set even if you enter more than 31
characters.
TIP
No password can be set for pre-registered "Default Operator".
Appendix
4. VERIFICATION OF PASSWORD
To prevent typing mistakes, again enter the password you have just entered in the "PASSWORD" box.
5. GROUP
Set the operator name in a group.
Select the group where the operator name should be registered. You can select "Administrators" or "Operators" or any
group you have registered, by checking the corresponding check box.
6. OPERATOR ID
Enter the operator ID (barcode) here if required.
5 Press the [OK] button to save the settings.

The display then returns to the "EDIT OPERATOR" screen. Check that the added operator name now
appears in the "OPERATOR NAME" list and then press the [Close] button to finish the operator editing.
A-7
A2.2 Changing the registered contents
The access level and password of a registered operator can be changed. Also refer to the previous section
"A2.1 Registering a new operator" for on-screen operation.

Appendix
The "Setting" screen appears.
2 Open the [Operator] tab and press the [Operator] button.

The "EDIT OPERATOR" screen appears.
3 Select the group name and then the operator.

After selecting the group, select the operator whose contents you want to change from the "OPERATOR
NAME" list.
4 Press the [EDIT] button.

The "EDIT OPERATOR" screen changes to allow editing the setting. Change the setting of each item.
TIP
The "Administrator" is allowed to change all operators' passwords.
A-8
A2.3 Editing groups
This section describes how to rename or add a group, or add or delete an operator.
n NOTE
Only operators with an administrator level (Level 10) are allowed to perform this task.
Appendix
2 Open the [Operator] tab and press the [Group] button.

The "Group Edit" screen appears.
"Group Edit" screen
24005-P2-00
1. GROUP NAME, Heads

This shows a list of the registered groups and the number of operators registered in each group.
2. [INS] button
Pressing this button opens the following screen that allows you to add a new group. Enter the new group name in the
"GROUP NAME" box and press the [OK] button.
"Group Edit" screen
Enter group name.
24006-P2-00
A-9
3. [EDIT] button
Use this button to change the name of a registered group, or add an operator, or change the access level.
Pressing this button displays a list of the operators you registered on the "EDIT OPERATOR" screen, including the
operators registered by default.
The operators with the check boxes in the "Entry" column checked belong to the group shown in the "GROUP NAME"
box.
Appendix
• To change the group name:

Enter a new name in the "GROUP NAME" box.
• To add an operator to the group:
In the "Entry" column, place a check mark in the check box for the operator you want to add. The same operator can
be registered in two or more different groups.
c CAUTION
The "Administrator" operator in the "Administrators" group cannot be unregistered (check mark cannot be removed).
The "Default Operator" in the "Operators" group cannot be unregistered (check mark cannot be removed).
• To change the access level:

Click the "LEVEL" field to display the drop-down list, and select the desired access level.
c CAUTION
The "Administrator" and "Default Operator" access levels cannot be changed.
"Group Edit" screen
Enter a new name to

change the current
group name.
Select the group.
Place a check mark next to

the operator you want to
add to the group.
Select a level from the list that drops down.
24007-P2-00
[DEL] button
Use this button to delete a registered group. Select the group you want to delete and press this button. When a
confirmation dialog box appears, press the [OK] button.
n NOTE
If an operator was only registered in the group you have deleted, that operator is automatically registered in the
"Operators" group that is registered by default.
c CAUTON
The pre-registered "Administrators" and "Operators" groups cannot be deleted.
A-10
A2.4 Editing access levels
This section describes how to change the access level settings.
c CAUTION
Level 0 and Level 10 settings cannot be changed.
Appendix
n NOTE
Only operators with an administrator level (Level 10) are allowed to perform this task.
TIP
• The settings for each level are functioning independently. For example, the conditions you set for Level 1 are not
automatically assigned to Level 2. You can make the settings in such a way that the buttons enabled for Level 1
are disabled for Level 2 and are again enabled for Level 3.
• By default, Level 0 is set to the most restrictive access so that almost all operations are prohibited, while Level 10 is
set to allow full access.

2 Open the [Operator] tab and press the [Level] button.

The "LEVEL EDIT" screen appears.
"LEVEL EDIT" screen
24009-P2-00
A-11
3 Set the items.
On the "LEVEL EDIT" screen, add or remove (enable or disable) each item.
TIP
When the top hierarchy "Window" in the left-pane tree view is selected, the buttons in the main menu button areas of
the operation screen can be enabled or disabled, by selecting or deselecting the corresponding items in the right-
pane list.
Appendix
When an item in the second hierarchy is selected, the submenu buttons, parameter tabs and input grids that will be
displayed with a main menu button can be enabled or disabled.
When an item in the third hierarchy is selected, the buttons on each parameter tab or dialog box that subsequently
opens can be enabled or disabled.
1. In the left-pane tree view, select an item you want to set. The detailed items are then displayed in the right-pane list.
2. In the right-pane list, each item can be enabled or disabled or hidden at each level, by clicking the corresponding
check box. See the table below for the check box's state.
Disable Items (buttons, etc.) are grayed out on the operation screen.
Enable Items (buttons, etc.) are displayed on the operation screen and become active.
Hide Items (buttons, etc.) are not displayed on the operation screen.
Editing each item
Select item you want to set. Select item you want to enable, disable, or hide.
Level
24011-P2-00
TIP
At Level 10, all items are set to "Enable" and other settings cannot be selected.
At Level 0, only "Disable" or "Hide" can be selected.
4 When the settings are complete, press the [OK] button.

The display returns to the [Operator] tab screen. Press the [Close] button to close the screen.
A-12
A2.5 Import/export function
This function allows you to import or export "operator information" and "level information" between machines.
When a machine or production line is added, you can easily copy the operator information and settings using
this function.
Appendix
2 Open the [Operator] tab and press the [Import/Export] button.

The "Import & Export" screen appears.
"Import & Export" screen
24012-P2-00
1. Press the [Browse] button and specify the file path in the "Import/Export File Path" box.
2. Under "Import/Export Information", select the information to import or export by checking the
corresponding check box or both check boxes.
3. Press the [Import] or [Export] button.
c CAUTION
• The folder selected in the "Import/Export File Path" box cannot be renamed.
• If both check boxes under "Import/Export Information" are cleared, the [Import] and [Export] buttons are grayed
out, so you cannot perform any operation.
4. When the import or export process is complete, press the [Close] button to close the "Import &
Export" screen.
The display returns to the "Setting" screen. Press the [Close] button to exit it.
A-13
A2.6 Operator level time limit function
When the machine has not been operated for a certain time, this function automatically logs out the currently
logged-in operator and logs in with a predetermined operator. For example, if an administrator is forgetting to
log out without changing the operator, then the administrator mode is automatically cancelled and the
specified operator logs in the machine.
Appendix

2 Open the [Operator] tab and press the [Operator Time Limit] button.
The "Operator Level Time Limit" screen appears.
3 Set the time limit and operator name, then press the [OK] button.
1. Set the time limit and the operator to whom the machine should return when the time limit is up.
• Time limit [minutes]

When the time limit specified here is up, the operator is automatically switched.
Set the time limit in minutes. Entering "0" disables this function.
• Returning operator name

When the machine has not been operated for the specified time limit, the operator is automatically
switched from the current operator to the operator specified here.
"Operator Level Time Limit" screen
24013-P2-00
2. Press the [OK] button to close the "Operator Level Time Limit" screen.
The display returns to the "Setting" screen. Press the [Close] button to exit it.
A-14
A3. Function for simplifying the vision algorithm setting
This function allows you to easily edit the shape parameters for specially shaped components. There are
some limitations and precautions when using this function.
Appendix
■ Applicable machine models and software
This function can be used with the following machine models and software versions.
Machine models YS12, YS12P, YS12F, YS88, YS100, YS24, YS24X, YSM40, Z:LEX(YSM20)
Machine software V3.05stdR1.000 onward
n NOTE
In the following descriptions, machine software versions prior to V3.05stdR1.00 are referred to as "old version software"
while software versions from V3.05stdR1.00 onward are referred to as "new version software".
■ Usable board file formats and part database formats

This function can be used with the following board file formats and part database (component database)
formats.
Board file formats YGX, VIOS, VIOS-Text
Part database formats FDX, FD
■ Board data compatibility

Compatibility between board data created with old version and new version software is described below.
Take the following precautions when using board data and component data created with new version software
along with data created from old version software.
• When using board data created with old version software by loading it with new version software:
When component shape information defined by special algorithm is opened with new version software, it is displayed on
the detailed edit mode screen. If you want to edit it on the simple edit mode screen, change the "Edit Mode" parameter to
"Simplicity". For more information on detailed edit mode and simple edit mode, refer to "A3.2 Changing the edit mode"
explained later on.
• When using board data created with new version software by loading it with old version software:
Component shape information defined by special algorithm is displayed on the [Parts]-[Shape] tab screen that was
opened when the "Alignment Type" parameter was set to "Special", regardless of which edit mode (detailed or simple
mode) is selected.
c CAUTION
If YGX format board data is saved on a machine using old version software, the component shape information edited
in detailed edit mode will be rewritten, so use caution.
■ Component data compatibility

Compatibility between part databases (component databases) created with old version and new version
software is described below.
• When using the part database created with old version software by loading it with new version software:
Component shape information created by special algorithm is displayed on the detailed edit mode screen.
If you want to edit it on the simple edit mode screen, then change the "Edit Mode" parameter to "Simplicity".
• When using the part database created with new version software by loading it with old version software:
Component information defined by special algorithm is displayed with component shape parameters that were opened
when the "Alignment Type" parameter was set to "Special".
c CAUTION
On an FDX format database, if component data is registered in the part database (by "database reverse set") on a
machine using old version software, the component shape information edited in detailed edit mode will be rewritten,
so use caution.
A-15
A3.1 Selecting an algorithm
There are two methods for selecting a vision algorithm. One method selects it from the "Algorithm" parameter.
The other selects it from the "Vision Algorithm Select" screen.
1. Selecting from the "Algorithm" parameter
Appendix
On the [Parts]-[Shape] tab, select a special algorithm (other than "Normal) from the "Algorithm" parameter drop-down
list". The screen then changes to display additional parameters that are relevant to the selected special algorithm.
Selecting a special algorithm
Set to an algorithm other than "Normal".

24700-P2-00
2. Selecting from the "Vision Algorithm Select" screen

On the [Parts]-[Shape] tab, press the [Algorithm] button to display the "Vision Algorithm Select" screen.
Then select a special algorithm from the tree view on the right of this screen. A detailed description of the selected
algorithm appears on the left, along with an illustration of component shape. Referring to these, select the desired
algorithm from the tree view and press the [OK] button. The "Vision Algorithm Select" screen then closes and the selected
algorithm is set in the "Algorithm" parameter on the [Shape] tab.
"Vision Algorithm Select" screen
Shows a description
of the selected
algorithm.
Shows an illustration
of component shape
for the selected
algorithm.
Select an algorithm.
24701-P2-00
TIP
To return to the normal algorithm, change the "Algorithm" parameter on the [Shape] tab back to "Normal".
A-16
A3.2 Changing the edit mode
When the "Algorithm" parameter on the [Shape] tab is set to an item other than "Normal", the "Edit Mode"
parameter appears allowing you to select the edit mode.
There are two edit modes: "simple edit mode" and "detailed edit mode".
Simple edit mode
Appendix
To enter simple edit mode, set the "Edit Mode" parameter on the [Shape] tab to "Simplicity".
In simple edit mode, only the parameter items that must be set are displayed on the [Shape] tab, with typical values
automatically defined according to the component shape.
Selecting simple edit mode
Select "Simplicity".
24702-P2-00
TIP
Numbers are assigned to algorithm items in the "Algorithm" drop-down list. These numbers correspond to algorithms
from "Special 0" to "Special 20" which were used with the old version software.
Detailed edit mode

To enter detailed edit mode, set the "Edit Mode" parameter on the [Shape] tab to "Details".
In detailed edit mode, all the "Shape" parameters are displayed on the [Shape] tab. However, the "Alignment Group" and
"Alignment Type" parameters cannot be changed. When changing these parameters, the edit mode should be set to the
simple edit mode.
c CAUTION
If the combination of "Base Alignment" and "Algorithm", which was set in detailed edit mode, is not in simple edit
mode, then the "Edit Mode" parameter field is grayed out so that it cannot be changed.
To find information about the "Base Alignment" and "Algorithm" combination, see the "A3.3.1 Special algorithm
parameters" explained later on.
Selecting detailed edit mode
Select "Details".
24703-P2-00
TIP
The "Vision Algorithm Select" screen cannot be used in detailed edit mode.
A-17
c CAUTION
Typical values are set automatically in simple edit mode. This means that if simple edit mode is switched to detailed
edit mode, then parameters that were already set in simple edit mode might be lost or destroyed. (An alert message
appears as shown below.)
Before switching the edit mode, always make a backup of the component data. Since the parameters cannot be
restored if lost or destroyed, be extra careful when switching the edit mode.
Appendix
Alert message when switching the edit mode
24704-P2-00
A-18
A3.3 Creating component information
This section describes how to set component information parameters by using the function for simplifying the
vision algorithm setting. The flow chart below shows the basic procedure for creating component information.
Flow chart for creating component information
Appendix
Start Register data as needed.
Select component
Algorithm
See "A3.1 Selecting an algorithm".

NO
Special component?
YES
Switching between NO
simple edit mode Simple mode?
and detailed edit mode
YES
Simple edit mode screen Detailed edit mode screen
Same editing method

as in regular screen
Determine parameters
Register data
End
in database
23700-P0-00
A-19
A3.3.1 Special algorithm parameters
This section explains parameters that are displayed when the "Algorithm" parameter for ordinary components
such as chip components is set to an algorithm other than "Normal" or when the edit mode for special
components is set to simple edit mode.
n NOTE
Appendix
Make every effort to set the parameters correctly while checking the component image in Parts Adjust mode.
TIP
For common parameters, refer to "2.6 Shape parameters" in Chapter 2, "Setting the board parameters".
■ Special algorithm list
Alignment Group Alignment Type Available algorithms
Chip Std.Chip 1: Chamfer Lead

2: Check Lead Brightness
3: Check Direction
4: Check Center Brightness
5: Retry Lead Center Search
8: Chip Array
Bare Chip 12: Size Fitting
BGA Simple BGA 1: Check Polarity
3: Simple White BGA
BGA 4: White BGA
7: CGA
Simple FlipChip 1: Outside Bump Recognition
FlipChip 2: Simple High Speed
IC 2 Ends 3: Check Direction
Mini-Tr/SOT 4: Check Upside-Down
SOP 1: Side Lead Fitting
6: Check Global Lead Bend
7: Direction Check by Lead Width
QFP 1: Side Lead Fitting
4: Check Lead Length
PLCC 1: Side Lead Fitting
2: NS Base Search
3: WE Base Search
4: Check Direction
Special Special 1: Side Lead Fitting
2: Long Connector
AsMark 1: Mark Line
2: 2 Objects
3: 4 Objects
4: General
6: Check Direction
8: 2 Objects (Angle of Terminal)
Sp. Quad 3: Check Direction
8: Shield Frame
11: 4 Corner Fitting
TIP
• About the "Check Direction" algorithm for "Std. Chip" (standard chip components)
If the recognized component direction is wrong (rotational offset is 45 degrees or more, or less than -45 degrees), then
that component will be discarded. However, the component can be rotation-mounted only when using the "Direction
Check by Lead Width" algorithm for SOP.
A-20
A3.3.2 Chip components
This section describes the algorithms available when the "Alignment Group" is set to "Chip" and the "Alignment
Type" to "Std.Chip" or "Bare Chip".
■ Std.Chip (standard chip)
Appendix
1: Chamfer Lead
This algorithm can be used for chip components with chamfered (beveled) corners.
Chip component
"1: Chamfer Lead" component
N N
E Bottom view
S W W E
23701-P0-00
Chamfer Direction
Specify the chamfered corner direction. Select from among "NW", "NE", "SW" and "SE".
2: Check Lead Brightness

This algorithm can be used for standard chip components. Though it recognizes a component the same way as the
"Normal" algorithm, the conditions to check the brightness can be set in more detail. When the "Comp. Intensity"
parameter is preset (this is automatically set by vision test), the brightness of the electrode area is checked to determine
whether the component is present or not. This algorithm is also effective in preventing nozzle recognition errors.
Chip component
"2: Check Lead Brightness" component
N N
E Bottom view
S W W E
23702-P0-00
Check Many Adsorption

This parameter checks whether two or more components are being picked up simultaneously.
• "Check"
Makes this check. An error occurs if an extra edge (lead, etc.) is found outside the component.
• "No Check"
Comp. Intensity
This parameter specifies the brightness level threshold used to measure the contour of a component, which is performed
after normal component recognition has succeeded.
The minimum brightness of the electrode area is measured when a vision test is run. If the measured brightness is higher
than the threshold value specified here, the component recognition will be viewed as successful. If the brightness is
lower than the threshold value, then an error will result.
Check Algorithm
This parameter specifies the method for checking component brightness.
• "A: Lead Brightness"
Checks only the brightness of leads based on the threshold set by the "Comp. Intensity" parameter.
• "A & Symmetry"
In addition to checking the brightness of leads, this draws a vertical line through the center of the component, and
checks whether the brightness is symmetric along that line.
• "A & Difference"
In addition to checking the brightness of leads, this draws a horizontal line through the center of the component, and
checks whether the brightness is uniform along that line.
A-21
Trapezoid Tolerance (%)
Specifies the allowable range (0 to 255%) for correctly recognizing a trapezoidal component.
When this parameter is set to "0", the component is considered a rectangle so no check is made. The larger the value
entered here, the wider the allowable range. In other words, a larger difference in length is allowed between the upper
base and the lower base of a trapezoid.
TIP
Appendix
An error occurs if the value calculated from the following equation is larger than the value specified here.
Difference between upper and lower electrode widths / narrower electrode width × 100%
3: Check Direction
This algorithm can be used to identify the direction of chip components. When you define a circular region (detection
circle) for brightness measurement, the average brightness of that region is compared with the average brightness of
another circular region which is set at a position 180 degrees opposite (rotated) the circular region you defined, and thus
identifying the component direction. This algorithm is applicable for components having a polarity mark on the
recognition surface.
Chip component
"3: Check Direction" component (bottom view)
N
W E
Brightness measurement S
region (detection circle)
0˚ +180˚
Symmetrically rotated position
23703-P0-00
Check Type
If the average brightness of the circular region you have defined is brighter than the symmetrically rotated circular region,
set this parameter to "White". If darker, set it to "Black".
Check Direction
This parameter specifies the angle to rotate the component for identifying the direction.
• "2 Angle"
Select this to identify the component direction by rotating it 0 degrees and 180 degrees.
• "4 Angle"
Select this to identify the component direction by rotating it 0 degrees, 90 degrees, 180 degrees and 270 degrees.
Min. Brightness Difference
Sets the minimum contrast between the circular region you have defined and the symmetrically rotated circular region,
in a range from 0 to 255. Normally set this parameter to "0".
An error occurs if the difference between the average brightness of the circular region you defined and that of the
symmetrically rotated circular region is smaller than the value set here.
Direction Mark Diameter (mm)
Specifies the diameter of the detection circle. Use the Parts Adjust mode to check the component image and find an
appropriate diameter value.
Direction Mark Center X, Y
Specifies the center position of the detection circle. Enter the distance from the center of the component to the center of
the detection circle.
A-22
4: Check Center Brightness
This algorithm can be used to identify the front and back sides of a chip component. When you specify a circle (Check
Diameter) where brightness is to be checked, the average brightness of the specified region in the center of the
component is measured to determine whether it is the front or back side.
Chip component
Appendix
"4: Check Center Brightness" component (bottom view)
N
W E
S
Region where brightness
is measured
(Check Diameter)
OK NG
23704-P0-00
Check Threshold
The average brightness of the "Check Diameter" region is compared with the threshold value specified here in order to
identify the front and back sides.
Check Diameter (mm)
Specifies the diameter of the circle where brightness must be checked.
NG Type
Specifies conditions for identifying errors.
• "Black"
An error occurs if the average brightness of the "Check Diameter" region is lower than the "Check Threshold" value.
• "White"
An error occurs if the average brightness of the "Check Diameter" region is higher than the "Check Threshold" value.
5: Retr y Lead Center Search

This algorithm can be used for chip components whose edge positions in the width direction cannot be clearly
recognized. Use this algorithm, for example, on components whose electrodes (leads) contrast poorly with the
background.
Chip component
"5: Retry Lead Center Search" component
Bottom view N
N
E
W W E
S
S
Contrast between electrode (lead)

and background is poor.
23705-P0-00
Angle Correction
If the component mounting angle is not stable or accurate due to tiny burrs remaining on the component edges that
interfere with the detection line, then setting this parameter to "On" will usually improve the angle accuracy.
A-23
8: Chip Array
This algorithm is useful when positioning a resistor array or capacitor array component by using the electrodes (leads).
The method for recognizing electrodes differs according to the electrode type (Lead Type).
Chip component
"8: Chip Array" component
Appendix
N N
E Bottom view
Lead Type: Convex (Resistor)
W
S W E
S
B
Lead Type: Flat (Capacitor)
Lead
Detection line position
23706-P0-00
Ruler Width ("A" in above figure)

This specifies the width of a line for detecting the leads. Setting a large value will reduce effects of noise on the leads as
long as the lead width can be properly seen.
Lead Number
Enter the number of leads on either the E or W side.
Lead Pitch (mm)
Enter the accurate spacing between leads.
Lead Width (mm) ("B" in above figure)
Enter the width of a lead.
ReflectLL (mm)
Lead Type
This specifies the lead contour.
When the leads protrude from the body as shown in the upper part of the above figure, set this parameter to "Convex
(Resistor)". When the leads do not protrude from the body (as in the lower part), set this to "Flat (Capacitor)".
■ Bare Chip
12: Size Fitting
This algorithm can be used for chip components that the "Normal" algorithm cannot recognize correctly due to brightness
variations or shading (uneven reflections) on the recognition surface. This algorithm extracts the edges close to the
contour dimensions while changing the threshold level.
Bare chip component

"12: Size Fitting" component
N Bottom view N
E
S W W E
S
23707-P0-00
A-24
A3.3.3 Solder ball components
This section describes the vision algorithms when the "Alignment Group" parameter is set to "Ball" and the
"Alignment Type" parameter is set to "Simple BGA", "BGA", "Simple FlipChip" or "FlipChip".
■ Simple BGA
Appendix
1: Polarity Check
This algorithm can be used by simple parameter setting in order to recognize BGA (ball grid array) components whose
solder balls (except for the polarity ball) are arranged at all positions on an equally-spaced grid. Only one specified
position on the grid is checked to find whether a solder ball is present or not.
Simple BGA
"1: Polarity Check" component
N Bottom view N
W
E W E
S
S
Origin
Polarity ball
23708-P0-00
Column of Polarity Ball, Row of Polarity Ball

Specifies the position (column and row) on the grid used to check whether a solder ball is present. (Origin: Top left as
viewed from bottom)
Polarity Ball
Specifies conditions for identifying errors.
• "Exist"
An error occurs if no solder ball is detected at the position on the grid specified by the "Column of Polarity Ball" and
"Row of Polarity Ball" parameters.
• "None"
An error occurs if a solder ball is detected at the position on the grid specified by the "Column of Polarity Ball" and
"Row of Polarity Ball" parameters.
3: Simple White BGA

This algorithm is can be used by simple parameter setting in order to recognize white-substrate BGA components whose
solder balls are arranged at all positions in an equally-spaced grid pattern. This algorithm checks the number of solder
balls but does not check whether individual solder balls are present.
Simple BGA
"3: Simple White BGA" component
N Bottom view N
W
E W E
S
S
23709-P0-00
Ball Exist Threshold Level

Specifies the detection threshold for extracting each solder ball image. Normally set this parameter to "0".
If the difference in color density between a solder ball area and the substrate is larger than the threshold level specified
here, then it is extracted as a solder ball.
A-25
■ BGA
4: White BGA
This algorithm can be used for BGA components with a white substrate. It checks whether solder balls are present at ball
positions specified by ball position information. To find information on how to set the ball positions, see "6. Editing the
ball components" in Chapter 2.
Appendix
BGA
"4: White BGA" component
N Bottom view N
W
E
S W E
S
23710-P0-00
Ball Exist Threshold Level

Specifies the detection threshold to extract each solder ball image. Normally set this parameter to "0".
If the difference in color density between a solder ball area and the substrate is larger than the threshold level specified
here, then it is extracted as a solder ball.
7: CGA
This algorithm can be used for CGA (column grid array) components. It checks whether pins are present at the ball
positions specified by ball position information. To find information on how to set the ball positions, see "6. Editing the
ball components" in Chapter 2.
BGA
"7: CGA" component
N Bottom view N
W
S E
W E
S
23711-P0-00
Excessive Ball Check

This parameter specifies whether to raise the recognition error when the number of recognized pins is greater than the
number of pins specified by ball position information.
• "Check"
Makes this check and issues a recognition error if a pin is present at a position not specified by ball position
information.
• "No Check"
Does not make this check, so no recognition error occurs even if a pin is present at a position not specified by ball
position information.
Binar y Level Correction
The component threshold level cannot be set for CGA components. Instead, the binary level can be corrected in the
range from -128 to +127.
For example, if an area that appears white is larger than the actual area, then enter a positive value. (See "Binary level
correction" in "6.1 BGA" in Chapter 2 for more information.)
A-26
■ Simple FlipChip
1: Outside Bump Recognition
This algorithm can recognize components whose solder balls are arranged at an equal pitch on each side of the
component body, by using simple parameter setting for only peripheral solder balls.
Appendix
Simple FlipChip
"1: Outside Bump Recognition" component
N Bottom view N
W
E W E
S
S
23712-P0-00
Check Pitch
This parameter specifies whether to make a strict check of the solder ball pitch.
Method of Auto Binarize
This parameter specifies the binarization method when the "Comp. Threshold" parameter is "0".
• Brightness Distinction
Automatically calculates the threshold level at which the separation between black and white becomes most obvious.
Use this setting when there is good (high) contrast between the solder balls and the substrate.
• Area Size Distinction
Determines the threshold level so that the areas defined as solder balls appear white. Use this setting when there are
no light-reflecting portions other than solder balls and there are no solder balls on the inner side.
Check Bump Position
This parameter specifies whether to check the deviation between the detected bump position and the defined bump
position.
Retr y Trace
When this parameter is set to "On" and if a bump fails to be detected, a retry will be performed to find that bump based
on the detected bump information.
The recognition rate for low-contrast components might improve by setting this parameter to "On".
Cut Outer Noise, Cut Inner Noise
Specifies the amount of noise to remove.
Excessive removal of noise in the image processing will also reduce the amount of information.
Object Type
Specifies whether the objects (solder balls) to be detected are "White" or "Black".
Noise Cut Order
Specifies the noise removal priority. Normally, the higher the priority, the greater the noise removal effect will be.
■ FlipChip
2: Simple High Speed
This algorithm can be used for components with randomly arranged solder balls. At least two pairs of reference balls (near
the four corners) which are set by ball position information should be included. This algorithm detects the solder balls by
tracing the ball contour.
FlipChip
"2: Simple High Speed" component
N Bottom view
N
E
W W E
S
S
23713-P0-00
Cut Outer Noise, Cut Inner Noise
Specifies the amount of noise to remove. Excessive removal of noise in the image processing will also reduce the amount
of information.
Object Type
Specifies whether the objects (solder balls) to be detected are "White" or "Black".
Noise Cut Order
Specifies the noise removal priority. Normally, the higher the priority, the greater the noise removal effect will be.
A-27
A3.3.4 IC components
This section describes the algorithms available when the "Alignment Group" is set to "IC" and the "Alignment
Type" to "2Ends", "Mini-Tr/SOT", "SOP", "QFP" or "PLCC".
■ 2Ends
Appendix
3: Check Direction
This algorithm can be used to identify the direction of components with two leads, such as two-terminal diodes. When
you define a circular region (detection circle) for brightness measurement, the average brightness of that region is
compared with the average brightness of another circular region which is set at a position 180 degrees opposite
(symmetrically rotated) the circular region you defined, and thus the component direction is identified. This algorithm is
applicable for components having a polarity mark on the recognition surface.
2Ends
N Bottom view N
E
W W E
S Brightness measurement
region (detection circle) S
Symmetrically rotated
position
+0˚ -180˚
23714-P0-00
Check Type
If the average brightness of the circular region you have defined is brighter than the symmetrically rotated circular region,
set this parameter to "White". If darker, set it to "Black".
Check Direction
• "2 Angle"
• "4 Angle"
This parameter sets the minimum contrast between the circular region you have defined and the symmetrically rotated
circular region, in a range from 0 to 255. Normally set this parameter to "0".
This parameter specifies the diameter of the detection circle. Use the Parts Adjust mode to check the component image
and find an appropriate diameter value.
This parameter specifies the center position of the detection circle. Enter the distance from the center of the component
to the center of the detection circle.

This algorithm can be used to identify the front and back sides of a component with two leads, such as two-terminal
diodes. When a rectangular region (Check-area Size XY) for brightness measurement is specified, the brightness variation
(dispersion) of that region is checked to determine whether it is the front or back side. This algorithm is applicable for
components having printed characters on the molded area of the pickup surface.
2Ends
"10: Check Upside-Down" component
N Bottom view N
E
W
A
S W E
S
Check area
OK NG
23715-P0-00
A-28
Threshold of 3-sigma
This parameter sets the threshold of brightness variation (3 sigmas) for identifying the component front and back sides.
The brightness variation of the region specified by "Check-area Size XY" is compared with the threshold set here.
Threshold of Average
Normally set this parameter to "0".
Appendix
TIP
This parameter should usually be set to "0". In some cases, setting it to a value other than "0" may prevent errors that
occur frequently. However, even if this parameter is set to other than "0", a recognition error will occur when all of the
following three conditions are met.
1. The "NG Condition" parameter is set to "Dispersion".
2. Brightness variation of the check area is higher than the value specified by the "Threshold of 3-sigma" parameter.
3. Average brightness of the check area is higher than the threshold set here.
Check-area Offset Enable

This parameter sets whether to offset (shift) the check area from the center.
• "Enable"
Offsets the check area from the center according to the values specified by the "Check-area Offset XY" parameters.
• "Disable"
Sets the check area in the center of the component.
NG Condition
This parameter specifies conditions for identifying recognition errors.
• "Dispersion"
An error occurs if the measurement value is larger than the threshold specified by the "Threshold of 3-sigma"
parameter.
• "Non Dispersion"
An error occurs if the measurement value is smaller than the threshold specified by the "Threshold of 3-sigma"
parameter.
Check-area Size X, Check-area Size Y
These parameters specify the size of the area where brightness variation is to be checked. Use the Parts Adjust mode to
check the component image and find an appropriate size.
Check-area Offset X, Check-area Offset Y
These parameters specify an offset to shift the area where brightness variation is to be checked. Enter the distance from
the center of the component to the center of the check area (rectangular region). The offset values entered here will be
used only when the "Check-area Offset Enable" parameter is set to "Enable".
■ Mini-Tr/SOT
This algorithm can be used to identify the front and back sides of a mini-mold transistor or SOT component. When a
rectangular region (Check-area Size XY) for brightness measurement is specified, the brightness variation (dispersion) of
that region is checked to determine whether it is the front or back side. This algorithm is applicable for components
having printed characters on the molded area of the pickup surface.
Mini-Tr/SOT
E N Bottom view N
S W
A W E
S
Check area
OK NG
23716-P0-00
NG Condition
See the algorithm "10: Check Upside-Down" described in "2Ends".
A-29
■ SOP
1: Side Lead Fitting
This algorithm can be used for SOP components that the "Normal" algorithm cannot recognize correctly due to uneven
reflections on the leads. To recognize a component, this algorithm checks the positional relation between the leads while
detecting the edge leads and then extracts the lead image that best matches the specified combination of leads.
Appendix
SOP
"1: Side Lead Fitting" component
Bottom view N
N
E
S W W E
S
23717-P0-00
Excessive Lead Check

This parameter specifies whether to check the number of leads during component recognition in order to prevent the
wrong components from being supplied, which have leads of the same shape as the settings but have a different number
of leads.
• "Check"
Makes this check and issues a recognition error if the number of leads of the supplied component is more than the
setting, even if the lead width and pitch are identical.
• "No Check"
This algorithm can be used to identify the front and back sides of an SOP component. It compares the lead pitch near the
tip of each lead with the lead pitch near the base of each lead, in order to check whether the front and back sides of the
component is inverted.
The method for recognizing components differs depending on which camera, single-vision camera or multi-vision
camera, is used. (See below.)
When using a multi-vision camera for component recognition, change the component direction so that the leads are
arranged on the N and S sides. At this point, also change the "Datum Angle" parameter on the [Vision] tab.
SOP
Single-vision camera Bottom view N
recognition W E
S
OK NG
Multi-vision camera Bottom view

recognition N
W E
S
OK NG
23718-P0-00

See the algorithm "1: Side Lead Fitting " described above.
A-30
6: Check Global Lead Bend
This algorithm is useful for checking the bend of all leads of an SOP component. It measures the bend of an entire lead
array based on the deviation between the lead array center near the tip and the lead array center near the base.
SOP
"6: Check Global Lead Bend" component (bottom view)
Appendix
OK No Good N
W E
S
Lead bend angle
23719-P0-00
Lead Bend Tolerance (degrees)

A recognition error occurs if the absolute value of the sum of the lead bend angles measured on each side is larger than
the value set here. Normally set this parameter to "0".
See the description of the algorithm "1: Side Lead Fitting ".
7: Direction Check by Lead Width

This algorithm can be used to identify the direction of SOP components with polarity leads. It checks the wide lead
position of each lead array to identify the component direction.
SOP
"7: Direction Check by Lead Width" component (bottom view)
N
1 1 1 1
W E
2 2 2 2
S
3 3 3 3
4 4 4 4
5 5 5 5
6 6 6 6
7 7 7 7
8 8 8 8
+0˚ +180˚
23720-P0-00
Position of Wide Lead W, E

These parameters specify the wide lead position, counting from the end of the lead array. Set this parameter to "0" if no
wide lead exists on that side. The component direction will not be checked when both parameters are set to "0". In the
above example, the wide leads are W:2 and E:2.
A-31
■ QFP
This algorithm can be used for QFP components that the "Normal" algorithm cannot recognize correctly due to uneven
Appendix
If the edge lead detection is not stable, then using this algorithm might improve it.
QFP
"1: Side Lead Fitting" component
N Bottom view N
E
S W W E
S
23721-P0-00

This parameter specifies whether to check the number of leads during component recognition in order to prevent the
wrong components from being supplied, which have leads of the same shape as the settings but have a different number
of leads.
• "Check"
• "No Check"
4: Check Lead Length

This algorithm is useful for checking the lead length of QFP components. It checks whether the distance between a
straight line drawn through the tips of the edge leads and the tip of each lead is less than the specified range (Lead
Length Tolerance).
QFP
"4: Check Lead Length" component (bottom view)
N
W E
S
23722-P0-00
Lead Length Tolerance (mm)

A recognition error occurs if the difference between the straight line through the tips of the edge leads and the tip of
each lead is greater than the value set here. The setting range is from 0.00 to 2.55 mm.
A-32
■ PLCC
This algorithm can be used for PLCC components that the "Normal" algorithm cannot recognize correctly due to uneven
Appendix
PLCC
"1: Side Lead Fitting" component Bottom view N
N
E W E
S W
S
Top (tip)
Root (base)
23723-P0-00
Lead Search
This parameter specifies the position ("Top" or "Root") of each lead to detect the leads for positioning reference.
• "Top"
Detects the top (tip) of each lead facing outward.
• "Root"
Detects the root (base) of each lead facing inward.
This parameter specifies whether to check the number of leads during component recognition in order to prevent the wrong
components from being supplied, which have leads of the same shape as the settings but have a different number of leads.
• "Check"
• "No Check"
Lead Search Filer
This parameter specifies whether to exclude objects other than the leads during detection of the edge leads. Select from
among "No", "1" and "2".
Right Angle Fitting
This parameter specifies the method for extracting the edge leads used as the reference for lead detection. Normally set
this parameter to "Off".
• "Off"
Extracts the edge leads based on the normal positional relation between the leads.
• "On"
Extracts the edge leads using the method that gives priority to the perpendicularity of two adjacent sides.
TIP
If it is difficult to detect the correct edge leads due to, for example, large brightness variations, then setting the "Right
Angle Fitting" parameter to "On" improves the recognition rate.
2: NS Base Search
This algorithm can be used for PLCC components that the "Normal" and "Side Lead Fitting" algorithms cannot recognize
correctly due to unclear images of the leads on the W and E sides. It first recognizes only the leads on the N and S sides,
just like recognizing an SOJ component. Then, based on that result, the leads on the W and E sides are detected.
PLCC
"2: NS Base Search" component (bottom view) N
W E
S
Top (tip)
Root (base)
23724-P0-00
Lead Search, Excessive Lead Check

See the algorithm "1: Side Lead Fitting" described above.
A-33
3: WE Base Search
This algorithm can be used for PLCC components that the "Normal" and "Side Lead Fitting" algorithms cannot recognize
correctly due to unclear images of the leads on the N and S sides. It first recognizes only the leads on the W and E sides,
just like recognizing an SOJ component. Then, based on that result, the leads on the N and S sides are detected.
PLCC
Appendix
"3. WE Base Search" component (bottom view) N
W E
S
23725-P0-00
Lead Search, Excessive Lead Check

4: Check Direction
This algorithm can be used to identify the direction of PLCC and QFP components. When you define a circular region
(detection circle) for brightness measurement, the average brightness of that region is compared with the average
brightness of another circular region which is set at a position 180 degrees opposite (symmetrically rotated) the circular
region you defined, and thus the component direction is identified. This algorithm is applicable for components having a
polarity mark on the recognition surface.
PLCC
N
Brightness measurement
region (detection circle) W E
S
Symmetrically rotated
position
+0˚ +180˚
23726-P0-00
Lead Search, Excessive Lead Check, Lead Search Filter, and Right Angle Fitting
Check Type
If the brightness of the circular region you have defined is brighter than the symmetrically rotated circular region, set this
parameter to "White". If darker, set it to "Black".
Check Direction
• "2 Angle"
• "4 Angle"
Judgment Method
This parameter specifies the action to take after identifying the component direction.
• "Error"
A recognition error occurs if an incorrect angle is detected.
• "Angle correction"
Corrects the angle and mounts the component on the board.
This parameter specifies the center position of the detection circle. Enter the distance from the center (origin position) of
the component to the center of the detection circle.
A-34
A3.3.5 Specially shaped components
This section describes the algorithms available when the "Alignment Group" is set to "Special" and the
"Alignment Type" to "Special", "AsMark" or Sp.Quad".
■ Special
Appendix
This algorithm can be used for components with leads of different shapes and pitches along the same direction. To
recognize a component, this algorithm checks the positional relation between the leads while detecting the edge leads
and then extracts the lead image that best matches the specified combination of leads.
TIP
Up to two groups of leads can be set for each of the NSEW directions. (Parameters L, M, N and O)
Special
"1: Side Lead Fitting" component N Bottom view N
E
S W
W E
S
23727-P0-00
L. Excessive Lead Check

This parameter specifies whether to check the number of leads in order to prevent the wrong components from being
supplied, which have leads of the same shape as the settings but have a different number of leads.
• "Check": Makes this check and issues a recognition error if the number of leads of the supplied component is more
than the setting, even if the lead width and pitch are identical.
• "No Check": Does not make this check.
M. Lead Length Tolerance
A recognition error occurs if the difference between the straight line through the tips of the edge leads and the tip of
each lead is greater than the value set here. The setting range is from 0.1 to 25mm (or 0.01 to 2.50mm for QFP). See also
the algorithm "4: Check Lead Length" described in "QFP".
2: Long Connector
This algorithm can be used for components with a suction clip or similar part that makes it difficult to detect the tips of
the leads near the center. This algorithm checks the number of leads, but uses only the specified number of leads at both
ends to perform positioning.
Special
"2: Long Connector" component
N
Bottom view
W E
S
23728-P0-00
L. Detecting Number of Side Leads

Specifies the number of leads at both ends that are used for component positioning. For example, setting this parameter to
"5" means that 5 leads each from both ends are specified. The positioning is performed by detecting these specified leads.
M. Excessive Lead Check
This parameter specifies whether to check the number of leads in order to prevent the wrong components from being
supplied, which have leads of the same shape as the settings but have a different number of leads.
• "Check": Makes this check and issues a recognition error if the number of leads of the supplied component is more
than the setting, even if the lead width and pitch are identical.
• "No Check": Does not make this check.
A-35
■ AsMark
1: Mark Line
This algorithm can be used for rectangular components whose outline may partly extend beyond the detection range. If
one side of the outline extends beyond the detection range, the center position and angle of a component are estimated
using the other remaining sides.
Appendix
TIP
Since the detection line can be set at any position, this algorithm can also be used for components whose outline has
concave or convex portions.
AsMark
Mark Line Bottom view N
W E
S
23729-P0-00
TIP
The center and tilt of a component are detected using multiple lines as shown in the figure below.
The approximate center-of-gravity and tilt of the component are first found as the characteristic amounts. Based on
these, lines 1 and 2 are set so they intersect the component at edge points P1 to P4. Line 3 is then drawn that
connects the center of P1 and P2 and the center of P3 and P4. The slope of line 3 is considered as the tilt of the
component. In addition, lines 5, 6, 7 and 8 are set in parallel with line 3 to find edge points P5 to P8. The center of the
component is then calculated by averaging these points.
Mark Line
Line 4
P3
P1
P5
Line 5
P7
Line 7
Line 3 G Line 6
P6
Line 8
P8
P4
P2
Line 2
Line 1
23730-P0-00
Detection Direction
Specifies the direction used for detecting the component (the direction in which the component does not extend beyond
the detection range). Normally set this parameter to "Auto".
Right Line Offset (mm)
Enter the distance "A" shown in the figure below. When set to "0", one fourth of the detected X size is applied.
AsMark
A
Right Line Offset (bottom view) N
W E
Y S
X
23731-P0-00
A-36
Right Center Offset (mm)
Enter the distance "A" shown in the figure below. When set to "0", one fourth of the detected Y size is applied.
AsMark
Right Center Offset (bottom view)
N
Appendix
A
Y W E
S
X
23732-P0-00
Left Line Offset (mm)

Enter the distance "A" shown in the figure below. When set to "0", one fourth of the detected X size is applied.
AsMark
Left Line Offset (bottom view) A N
W E
Y S
X
23733-P0-00
Left Center Offset (mm)

Enter the distance "A" shown in the figure below. When set to "0", one fourth of the detected Y size is applied.
AsMark
Left Center Offset (bottom view)
N
A W E
Y
S
23734-P0-00
2: 2 Objects
This algorithm can be used for components with two distinctive terminals. It detects the center position by averaging the
center-of-gravity of each terminal. The tilt is found from the slope of a straight line connecting the centers-of-gravity of
the two terminals.
TIP
This algorithm extracts the terminal images based on their areas, and so can also be used to recognize complex-
shaped terminals.
AsMark
"2: 2 Objects" component (bottom view)
N
W E
S
23735-P0-00

This parameter specifies the binarization method when the "J. Comp. Threshold" parameter on the [Vision] tab is set to "0".
• "Brightness Distinction"
Use this setting when there is good (high) contrast between the terminals and the substrate.
• "Area Size Distinction"
Determines the threshold level so that the areas defined as terminals appear white. Use this setting when there are no
light-reflecting portions other than terminals.
A-37
Pickup by Terminal Shape
This parameter sets whether to check the shape of terminals when the terminal images are extracted.
• "Use": Checks the shapes of terminal-like objects when their mages are extracted.
• "NotUse": Check only the areas of terminals.
Detection Angle
Appendix
This parameter sets whether to check the component direction when the upper and lower terminals of the component are
different in shape and size.
• "±90 Deg": Does not check the direction.
• "±180 Deg": Checks the direction.
Method of Size Check
This parameter specifies the method for checking the size of the rectangle circumscribing the terminals, which was
obtained from a vision test.
• "Body Size": Compares the size with the outside dimensions in the component data.
• "Terminal Circumscribed Size: Compares the size with the circumscribed rectangle of the terminals in the component data.
Set this parameter when the "J. Comp. Threshold" parameter on the [Vision] tab is set to "0" and the "Method of Auto
Binarize" parameter to "Area Size Distinction".
If there is a white portion other than the terminals to be detected, specify the ratio of the white portion to the area of the
terminals.
Terminal Width N (mm), Terminal Length N (mm)
Enter the width and length on the N side.
When the "Terminal Length N" parameter is set to "0", the terminal is viewed as a circular terminal with a diameter of
"Terminal Width".
Find PosY N (mm)
This parameter specifies the Y-direction center-of-gravity position of the terminal on the N side. Enter the distance from
the center of the component to the center of the terminal.
Terminal Width S (mm), Terminal Length S (mm)
Enter the width and length on the S side.
When the "Terminal Length S" parameter is set to "0", the terminal is viewed as a circular terminal with a diameter of
"Terminal Width".
Find PosY S (mm)
This parameter specifies the Y-direction center-of-gravity position of the terminal on the S side. Enter the distance from
the center of the component to the center of the terminal.
3: 4 Objects
This algorithm can be used for rectangular components with terminals in the 4 corners as shown below. Positioning is
performed based on the inner edges of each terminal.
AsMark
"3: 4 Objects" component (bottom view) N
W E
S
23736-P0-00
Dir of Terminal Width Check

Not used.
Ruler Offset N/W
Not used.
Ruler Offset S/E
Not used.
Terminal Width (mm), Terminal Length (mm)
Enter the width and size of the terminals.
When the "Terminal Length" parameter is set to "0", the terminal is viewed as a circular terminal with a diameter of
"Terminal Width".
A-38
4: General
This algorithm is useful for components with 3 or more distinctive terminals. It extracts the terminal images based on
their areas, and so can also be used to recognize complex-shaped terminals.
AsMark
"4: General" component (bottom view)
Appendix
N
W E
S
23737-P0-00
P. Check Pitch
This parameter specifies whether to make a strict check of the terminal pitch.
Set this parameter to "On" when making this check, or set it to "Off" when not making this check.
Q. Method of Auto Binarize
This parameter specifies the binarization method when the "J. Comp. Threshold" parameter on the [Vision] tab is set to
"0". Select either "Brightness Distinction" or "Area Size Distinction".
R. Check Terminal Position
This parameter specifies whether to check the deviation between the detected terminal position and the defined terminal
position.
Set this parameter to "On" when checking the terminal position, or set it to "Off" when not making this check.
S. Terminal Pickup Algorithm
This parameter specifies the method for extracting the image of a corner terminal. Normally set this parameter to
"Strictness".
TIP
If it is difficult to extract the corner terminal image, setting this parameter to "Tolerance Synchronization" might improve
the recognition rate.
T. Retr y Trace
This parameter specifies whether to perform a retry if a terminal fails to be detected, based on the successfully detected
terminal information. Set this parameter to "On" when using this retry function, or set it to "Off" when not using.
TIP
When recognizing components whose terminals contrast poorly with the substrate, setting this parameter to "On"
might improve the recognition rate.
U. Best Arrangement Angle Detection

During component recognition, the defined shape is rotated 90 degrees each, at 4 angles or 2 angles, in order to
calculate the angle of the electrode arrangement closest to the component definition.
This parameter specifies the method for detecting the electrode arrangement angle. Select from among "Off", "180-Deg
Symmetry" and "Non-Rotation Symmetry".
Use "180-Deg Symmetry" or "Non-Rotation Symmetry" when the component supply angle varies in excess of 45 degrees.
Note, however, that if this parameter is applied to components with 90-degree symmetry, then those components might
be mounted on the board at the wrong angle.
A-39
V. Center Detection Algorithm
This parameter specifies the method for calculating the center position of the component.
• "Circumscribed Rectangle"
Finds the center of a rectangle circumscribing the group of detected terminals as the center of the component.
• "Apex of Rectangle"
Creates a rectangle by drawing a straight line along each side that passes through the center of the terminal on each
Appendix
side (average center-of-gravity of terminals on each side), and finds the center of that rectangle as the center of the
component.
• "All Lead Center"
Averages the center-of-gravity positions of all terminals and corrects the average value using the offset amount
calculated from the defined shape to find the center position.
W. Pre Threshold
Not used.
6: Check Direction
This algorithm can be used for identifying the direction of components that are represented by a single contour and have
a clearly defined main axis. When you specify a circular region (detection circle) for brightness measurement, the
average brightness of that region is compared with the average brightness of another circular region which is set at a
position 180 degrees opposite (symmetrically rotated) the circular region you specified, and thus the component
direction is identified. This algorithm is applicable for components having a polarity mark on the recognition surface.
AsMark
"6: Check Direction" component
N Bottom view N
E
S W W E
S
region (detection circle)
Symmetrically rotated position +0˚ +180˚

23738-P0-00
Angle Line (N, S, W, E)

Set these parameters when the "Angle Detection Method" parameter is set to "Straight Line".
Select the direction to use for calculating the tilt of the component. Set each of these parameter to either "Select" or "No
Select".
If all of these parameters are set to "No Select", all directions are used for calculation.
Angle Detection Method
This parameter specifies the method for calculating the tilt angle of the component.
• "Feat"
Finds the tilt of the main axis for the detected contour as the tilt of the component.
• "Straight Line"
Draws straight lines in the directions specified by "Angle Line" and finds the average slope of those straight lines as the
tilt of the component.
Check Type
If the brightness of the circular region you have defined is brighter than the symmetrically rotated circular region, set this
parameter to "White". If darker, set it to "Black".
Check Direction
• "2 Angle"
• "4 Angle"
A-40
Appendix
to the center of the brightness measurement region (detection circle).
8: 2 Objects (Angle of Terminal)
This algorithm can be used for components with two distinctive terminals whose angle needs to be corrected using the
straight lines on the terminal edges. The average center-of-gravity position of the two terminals is found as the center of
the component, and the slope of the straight lines on the terminal edges is found as the angle of the component.
AsMark
"8: 2 Objects (Angle of Terminal)" component
N Bottom view N
E
S W W E
S
23739-P0-00

Set this parameter when the "J. Comp. Threshold" parameter on the [Vision] tab is set to "0" and the "Method of Auto
Binarize" parameter to "Area Size Distinction".
If there is a white portion other than the terminals to be detected, specify the ratio of the white portion to the area of the
terminals.
Max. Angle-Correction (deg)
An error occurs if the difference between the angle formed by lines A and B (see below) and the angle formed by lines C
and B is larger than the value specified here. In the figure, line A is the straight line that connects the centers of gravity of
the upper and lower terminals, line B is the straight line along the terminal edge, and line C is the straight line
perpendicular to line B.
Max. Angle-Correction (deg)

N
B W E
S
C
A
A: Straight line that connects centers of gravity (tilted)

B: Straight line along terminal edge
C: Straight line perpendicular to line B (tilt of component body)
23740-P0-00
Terminal Width N, S (mm), Terminal Length N, S (mm)

Enter the width and length on the N and S sides.
When the "Terminal Length" parameters are set to "0", the terminal is viewed as a circular terminal with a diameter of
"Terminal Width".
Find PosY N, Y S (mm)
These parameters specify the Y-direction center-of-gravity positions of the terminals on the N and S sides. Enter the
distance from the center of the component to the center of each terminal.
A-41
■ Sp.Quad
3: Check Direction
This algorithm can be used to identify the direction of rectangular components. When you define a circular region
(detection circle) for brightness measurement, the average brightness of that region is compared with the average
brightness of another circular region which is set at a position 180 degrees opposite (symmetrically rotated) the circular
Appendix
region you defined, and thus the component direction is identified. This algorithm is applicable for components having a
polarity mark on the recognition surface.
Sp.Quad
N
region (detection circle) W E
S
Symmetrically rotated position
0˚ +180˚
23741-P0-00
Check Type
If the average brightness of the circular region you have defined is brighter than the symmetrically circular region, set
this parameter to "White". If darker, set it to "Black".
Check Direction
• "2 Angle"
• "4 Angle"
Center Detection Algorithm
This parameter specifies the method for calculating the center position of the component.
• "Center of Gravity"
Finds the center-of-gravity of the detected contour as the center of the component.
• "Apex of Rectangle"
Creates a rectangle by drawing a straight line along each side of the component and finds the center of that rectangle as
the center of the component. This is effective in recognizing components with a chamfered corner as shown below,
because the "Center of Gravity" setting may shift the center of the component by a distance equal to the chamfered area.
"Apex of Rectangle"
A rectangle is created by drawing a line
along each side.
Center shift Center of rectangle = center of component

Center does not shift.
NG OK
23746-P0-00

This parameter specifies the binarization method when the "J. Comp. Threshold" parameter on the [Vision] tab is set to
"0".
This parameter specifies the diameter of the detection circle.
A-42
to the center of the detection circle.
8: Shield Frame
This algorithm can be used for shield components. It finds the component angle by finding the slope of lines (average
Appendix
angle of lines "a" to "h" in the figure below) that should be horizontal or vertical when the component is placed in the
correct orientation. The center of the circumscribed rectangle ("A" in the figure below) that indicates the component
angle is also found as the center of the component. Note that the outline should mostly consist of horizontal or vertical
straight lines connected to each other to form a continuous contour.
Sp.Quad
"8: Shield Frame" component
N
Bottom view a A N
E
S W b W E
c S
h
d
Center of component
g
f
e
23742-P0-00

This algorithm can be used to identify the front and back sides of a rectangular component. When a rectangular region
(Check-area Size XY) for brightness measurement is specified, the brightness variation (dispersion) of that region is
checked to determine whether it is the front or back side.
Sp.Quad
"10: Check Upside-Down" component (bottom view)
N
W E
A S
Check area
OK NG
23743-P0-00
This parameter sets the threshold of brightness variation (3 sigmas) for identifying the component front and back sides.
The brightness variation of the region specified by "Check-area Size XY" is compared with the threshold set here.
Normally set this parameter to "0".
TIP
This parameter should usually be set to "0". In some cases, setting it to a value other than "0" may prevent errors that
occur frequently. However, even if this parameter is set to other than "0", a recognition error will occur when all of the
following three conditions are met.
1. The "NG Condition" parameter is set to "Dispersion".
2. Brightness variation of the check area is higher than the value specified by the "Threshold of 3-sigma" parameter.
3. Average brightness of the check area is higher than the threshold set here.
Center Detection Algorithm

See the description of the algorithm "3: Check Direction".
A-43
This parameter sets whether to offset (shift) the check area from the center.
• "Enable"
Offsets the check area from the center according to the values specified by the "Check-area Offset XY" parameters.
• "Disable"
Sets the check area in the center of the component.
Appendix
NG Condition
This parameter specifies conditions for identifying recognition errors.
• "Dispersion"
An error occurs if the measurement value is larger than the threshold specified by the "Threshold of 3-sigma" parameter.
• "Non Dispersion"
An error occurs if the measurement value is smaller than the threshold specified by the "Threshold of 3-sigma" parameter.
These parameters specify the size of the area where brightness variation is to be checked. Use the Parts Adjust mode to
check the component image and find an appropriate size.
These parameters specify an offset to shift the area where brightness variation is to be checked. Enter the distance from
the center of the component to the center of the check area (rectangular region). The offset values entered here will be
used only when the "Check-area Offset Enable" parameter is set to "Enable".
11: 4 Corner Fitting
This algorithm can be used for positioning a component that is approximately rectangular, by using straight lines near the
4 corners.
Sp.Quad
"11: 4 Corner Fitting" component N
Bottom view W E
S
23744-P0-00
Start position of edge detection (mm)

Specifies the distance from the edge of the rectangular portion to the straight line with an accurate length. ("A" in the
figure below)
Edge detection width
Specifies the length of the straight line with an accurate length. ("B" in the figure below)
Sp.Quad
"Start position of edge detection" and "Edge detection width" component
N
A B W E
S
23745-P0-00
Rectangle Size X, Y (mm)

Specifies the size of the rectangular portion.
A-44
A4. Par ts Data Auto Tuning function
A4.1 Over view
Appendix
The Parts Data Auto Tuning function creates appropriate parameters for recognizing parts based on the results
of recognizing multiple parts during production.
• Reduces the number of parts discarded as recognition errors
When using parts with variations in size or when using parts whose size differs between multiple suppliers, this function
helps reduce the number of parts discarded as recognition errors. This results in reducing the time needed to change part
data and also minimizes the number of parts that may be discarded.
• Takes over the tuning results
This function also automatically takes over the tuning results to other board data when certain conditions are met. Taking
over the tuning results makes it unnecessary to redo data tuning from the beginning for other board data.
A4.1.1 Supported mounter models and versions

This function can be used with the following surface mounter models and versions.
Supported mounter models YS series mounters Z:TA (YSM40), Z:LEX (YSM20)
Supported versions V3.45STD R1.000 or later V4.45 R1.000 or later
A4.1.2 Parts and parameters that can be tuned

Auto tuning is performed on the following Alignment Type, Algorithm, and parameters.
Alignment Type, Algorithm Parameters
Body Size Lead Align Size

Alignment Group Alignment Type Algorithm Tolerance
XY Width XY
Normal ✓ ✓
Chamfer Lead ✓ ✓ ✓
Check Lead Brightness ✓ ✓ ✓
Std. Chip Check Direction ✓ ✓ ✓
Check Center Brightness ✓ ✓ ✓
Retry Lead Center

✓ ✓ ✓
Search
Chip Chip Array ✓ ✓ ✓
Melf Chip Normal ✓ ✓ ✓
Normal ✓ ✓
Bare Chip Size Fitting ✓ ✓
Small Bare Chip ✓ ✓
Sp. Chip Normal ✓ ✓
Small Chip Normal ✓ ✓
✓: Supported, Blank: Not supported
c CAUTION
Even when only one item is displayed as the “Lead Width” parameter, tuning is performed on both “Lead Width N1”
and “Lead Width S1” internally. However, if “Edit Mode” is set to “Details” and both “Lead Number E” and “Lead
Number W” are set to 1 or more, then tuning will be performed on “Lead Width E1” and “Lead Width W1”.
A-45
A4.2 Functions
The Parts Data Auto Tuning function roughly consists of two functions, one for tuning parts information and one
for taking over the tuning results.
A4.2.1 Parts information tuning function

Appendix
This function performs tuning on parts information.

• Measures the size and lead width of parts during recognition in automatic operation, then calculates the average value
each time recognizing one pickup group and reflects it in the parts information.
• When the tolerance tuning is enabled and the specified number of samples (number of parts) is reached, this function
further calculates the tolerance and reflects it in the parts information. When the specified number of samples is
exceeded, the oldest sample is discarded and a new sample is added to always perform tuning using the latest samples.
n NOTE
When the size and lead width of parts have been successfully measured, those parts are added to the samples even
if a recognition error occurs with those parts. (Except for cases where either of the size or lead width of parts exceeds
the “Sample Allowable Ratio” setting)
Parts Data Auto Tuning flow
<Flow in one pickup group> <Flow of one head>
Start tuning processing

Pick up parts
One head
Are parts compatible with tuning?

Recognize parts No
Make a note of recognition results of Yes

“Body Size XY” and “Lead Width”
Are size and lead width within

Place parts
No sample allowable ratio?
Yes
Tuning processing Add samples
Old samples are deleted
Calculate average of part size

XY and lead width
Is specified number of
samples reached? No
Yes
Calculate tolerance
Reflect tuning results in parts information
One head
End tuning processing
23401-P5-00
A-46
c CAUTION
If the tuning target parameters (“Body Size XY”, “Lead Width”, “Tolerance” “Alignment Group”, “Alignment Type”,
“Algorithm”) are manually changed, the sample information will be initialized to redo tuning from the first point since
the results of those changes have priority.
If “Insert” or “Delete” or “Renumber” is performed on the [Parts] - [Edit Assistant] screen, the sample information on all
parts will be initialized to redo tuning on all parts from the first point.
Appendix
■ Tuning status display of each part
The tuning status of each part can be checked in the “Tuning” column on the [Monitor] - [Pick Rate] - [Parts Info] tab as
shown below.
• The “Tuning” column shows the “current number of samples / number of samples in machine setting” value.
• A dash ( - ) is displayed for parts with no tuning performed.
Tuning status
Current number of samples
Number of samples in machine setting
Tuning not performed

24401-P5-00
A-47
A4.2.2 Tuning result takeover function
This function takes over the tuning results to other board data.
• Once tuning is performed, the tuning results can be directly used for other board data that uses the same combination
of the feeder and parts.
Specifically, when you load board data or remove the feeder after performing tuning on part data, the tuning results are
Appendix
written in a parts information takeover file.

• After loading the board data or at the timing of installing the feeder, the tuning results are loaded from the parts
information takeover file.
• Even when you have saved the board data by manually entering the turning target parameters (“Body Size XY”, “Lead
Width”, “Tolerance” etc.) in the parts information, those parameter settings are also written in a takeover file and
passed to other board data.
■ Parts information takeover specifications
Item Feeders with feeder ID Feeders with no feeder ID
Feeder type Tape, multi-stick, etc Stick, bulk, tray, etc.
File name Feeder_(Feeder ID)@(Part name).sts Feeder_(Part name).sts
· Parts information related to tuning (“Body Size XY”, “Lead Width”, “Tolerance”,
“Alignment Group”, “Alignment Type”, “Algorithm” etc.)
File contents
· Past sample information
* Includes “Pick Height” if the pickup height teaching function is used.
· At the time of loading board data
Takeover timing (loading) · At the timing of loading board data
· At the time of installing the feeder
· “Feeder ID” and “Part Name” are · “Part Name” is identical
identical · “Alignment Type” and “Algorithm” are
· Feeder is installed when loading board identical
data
Takeover conditions
· Write conditions are not met when
installing the feeder
· “Alignment Type” and “Algorithm” are
identical
· Immediately before loading board data · Immediately before loading board data
Write timing · At the time of turning power off · At the time of turning power off
· At the time of removing the feeder
· Parts data has been tuned
or
· Board data has been saved after manually editing “Body Size XY”, “Lead Width”,
Write conditions
“Tolerance” etc.
* “Body Size XY” etc. are also written when the pickup height write conditions are met
while using the pickup height teaching function.
Deletion timing and · At the time of loading board data (When the number of takeover files has exceeded
conditions 2000 while the server path is not specified, the files are deleted from the oldest one.)
c CAUTION
• It is not possible to disable the tuning result takeover function only.
• If the “pickup height teaching” function is enabled and the “Parts Data Auto Tuning” function is OFF, no tuning results
are saved in a takeover file. Therefore, no tuning results will be taken over even when the Parts Data Auto Tuning
function is returned to ON later on.
• Even when “SET FROM DATABASE ALL” or “Fixed Board Matching” is enabled, the tuning result takeover function has
priority.
A-48
TIP
• The location to save takeover files can be specified from the [Software Setting] button. (See “A.4.3.3 Software
Setting”.)
• If writing in a part information takeover file or loading a takeover file failed, the error “Ea12994: Failed to write parts
data take over file” or “Ea12995: Failed to read parts data take over file” is recorded in the error log.
Appendix
Tuning result takeover flow
: Write
Start machine
: Load
<Takeover file>
Install feeder A
(Does not write)
Load board data 1

Feeder A (parts 1)
Uses parts 1 and parts 2
Install feeder B (parts 2) Feeder B (parts 2)
Start production using board data 1
Feeder A (parts 1)
Change feeder A to feeder C
Uses information during tuning

(Does not load)
Finish production using board data 1
Remove feeder B Feeder B (parts 2)
Load board data 2 Feeder C (parts 1)
Uses parts 1 and parts 2

Turn power off
(Does not write)
23402-P5-00
A-49
A4.3 Setting
A4.3.1 Machine setting

To enable the “Parts Data Auto Tuning” function, press the [Machine] button to open “Setting” – “Specification
Information” – “Parts Data Auto Tuning Spec” and set the “Parts Data Auto Tuning” parameter to ON. Also
Appendix
change other parameter settings if necessary.
Setting items 1/2
Select this item. Set these parameters.

24402-P5-00
■ Parts Data Auto Tuning settings

Default
Parameter name Setting Description
value
Set whether to enable (ON) or disable (OFF) the Parts Data
Parts Data Auto
ON/OFF OFF Auto Tuning function. When set to OFF, the Part Information
Tuning
Takeover function is also disabled.
Specify the number of latest samples to use for calculation.
If this number of samples is exceeded, a new sample is
YSM40, YSM20 added by deleting the oldest sample. The “Body Size”
: 10 to 100 and “Lead Width” tuning results are reflected in the parts
Sample Amount 40
YS series information (from the first point) even if the specified
: 10 to 40 number of samples is not reached. The “Tolerance” tuning
results are reflected in the parts information after the
specified number of samples is reached.
Set whether to save the tuning results (Body Size XY, Lead
Width, Tolerance, etc.) in board data and also whether to
register in the part database (by “database reverse set”).
Save Tuning Result Use / Not Use Not Use When set to “Not Use”, the results after tuning are not
saved. Instead, the settings at the time of loading the board
data (or the changes if the settings have been manually
changed) are saved.
“Weighted Average”
Calculates the weighted average using the specified
number of samples and reflects it in the parts information.
Even if there are large variations between parts reels, for
example, the weight of latest samples is large, the tuning
can be performed without delay.
Size XY, Lead Width Simple Average / Weighted
“Simple Average”
Tuning Method Weighted Average Average
Calculates the simple average using the specified number
of samples and reflects it in the parts information. Select
“Simple Average” in the following cases:
1. Variations in part size are small and quickly accessing
latest samples is not necessary.
2. To register part data in the part database after production.
When the recognized part sizes are outside this “Sample
Allowable Ratio (%)” setting (plus or minus side) on the
Size XY, Lead Width
basis of the “Body Size” (previous tuning results) in the
Sample Allowable 0 to100 20
parts information, the recognized part sizes are not added
Ratio (%)
to the samples. However, if set to “0”, this setting will be
disabled.
A-50
Setting items 2/2
Appendix
Select this item. Set these parameters.
24403-P5-00
■ Parts Data Auto Tuning settings

Default
Parameter name Setting Description
value
Set whether to perform tolerance tuning. To use this item,
Tolerance
Use/Not Use Not Use the “Tolerance Tuning” parameter in the parts information
Tuning Target
must also be set to “Use”.
“Normal”
Calculates the tolerance based on the standard deviation
for the specified number of samples. The tolerance varies
according to the latest deviations, and so this allows stable
production with an appropriate tolerance. The variation
range is from the “Upper Limit” to the “Lower Limit”.
Tolerance “Widen”
Normal/Widen Normal
Tuning Method The tolerance is extended (up to the upper limit) each
time a recognition error occurs so that the parts can be
recognized. Once the tolerance is extended, it will not be
reduced. This is suitable in the following cases:
1. To reduce the number of parts that might be discarded.
2. To check variations in parts.
3. To register part data in the part database after production.
Set the upper limit of the tolerance used to perform
Tolerance tolerance tuning. The “Upper Limit” setting must be larger
1 to 100 30
Upper Limit (%) than the “Lower Limit” setting. If not, the error message
“Ea24747: Board data error” will appear.
Set the lower limit of the tolerance used to perform
Tolerance
1 to 100 5 tolerance tuning. This is not used when the “Tuning
Lower Limit (%)
Method” is set to “Widen”.
A-51
A4.3.2 Parts information
Whether to perform part data tuning can be set for each part on the [Parts] - [Option] tab.
• When you have created new board data or loaded existing board data:
The “Parts Data Auto Tuning” is set to “Use” for all parts.
• When not performing tuning on parts:
Appendix
Set the “Parts Data Auto Tuning” to “Not Use” for those parts. The “Tolerance Tuning” is also set to “Not Use” for all
parts, so set it to “Use” for the parts on which you want to perform tolerance tuning.
• When performing tuning at the time of starting production but not performing it in mass production:
Before starting production, on the [Parts] - [Assistant] - [Replace] tab, change the “Parts Data Auto Tuning” setting to “Not
Use”.
Tuning setting
Parts information
24404-P5-00
■ [Parts] – [Option] settings
Parameter Setting Default Description
Parts Data Set whether or not to enable the Parts Data Auto Tuning
G Use/Not Use Use
Auto Tuning function.
Set whether to perform tolerance tuning.
H Tolerance Tuning Use/Not Use Not Use When the “Parts Data Auto Tuning” is set to “Not Use”, the
Tolerance Tuning” is grayed out.
A4.3.3 Software Setting

The parts information takeover files are stored by default in the location “D:\Machine\Status\Parts TakeOver\”,
but this location can be changed to a server so that the tuning results are taken over between machines. To
change the location to store the part information takeover files, press the [Software Setting] button on the Setup
screen to open the Setting window. Select the [Monitor] tab and press the [Parts Data Take Over] button to
open the “Parts Data Take Over Setting” window. Then set the path to the server in the “Server Path” box.
Location to store
Specify the location to store files.
24405-P5-00
c CAUTION
Files in the specified folder might be erased automatically, so do not store files other than part information takeover
files (“Feeder_*.sts”) in that folder.
A-52
A5. Function for automatically creating par t data
A5.1 Over view
Appendix
This function automatically creates part data and recognition data from the images of parts. This allows creating
highly accurate part data in a short time without relying on the operator’s skill.
■ Features
• Displays a “Parts Find Best Target” combo box on the Parts Adjust screen.
• Automatically creates the parameters by pressing the [Find Best] button after selecting the target item to find optimal
values.
• Adds the “Defined Shape” item in the “Monitor Mode” combo box.
• Allows overlaying the recognized image of the parts with the defined shape of the parts on the vision monitor.
• Also displays the “Alignment Group”, “Alignment Type”, “Algorithm”, “Body Size X” and “Body Size Y” parameters in
the parts information grid, making it easier to check or change the settings.
■ Limited items
There are the following limitations on this function.
1. Cannot create the Alignment Type and dimensions even if the [Find Best] button is pressed in the following cases:
• The [Find Best] button was pressed after opening the Parts Adjust screen from a pickup error screen or recognition
error screen during automatic operation.
• The [Find Best] button was pressed on the Random Ball Edit screen or on the Pin Position Edit screen.
• The [Find Best] button was pressed after selecting the parts that should be recognized with the single-vision camera.
2. Cannot automatically create part data for solder ball components with randomly arranged solder balls.
3. Creates recognition data with the “Datum Angle” parameter set to “Normal” as the angle of the component shape
definition is 0 degrees.
4. The dimensions of parts (Body Size XY, Reflect LL, Lead Width) may differ from the actual dimensions since they are
measured based on the electrode positions and how they reflect light.
5. Cannot automatically create part data for large components that should be recognized by dividing their image.
6. May create data for recognizing a nozzle shape if this function is performed with a head that picks up no parts.
7. Uses the multi-vision camera when the machine is equipped with both a scan camera and a multi-vision camera.
A-53
A5.1.1 Supported mounter models and versions
This function can be used with the following surface mounter models and versions.
Supported mounter models YS series mounters Z:TA (YSM40), Z:LEX (YSM20)
Supported versions V3.46STD R1.000 or later V4.50STD R1.000 or later

Appendix
A5.1.2 “Parts Find Best Target” combo box
“Parts Find Best Target”

Combo box
Select the target item

from this combo box.
22501-P5-00
■ Selectable items in the “Parts Find Best Target” combo box
Item Press the [Find Best] button to:
Perform tuning to automatically optimize the parameters such as “Lighting Level”

Light
and “Comp. Threshold” etc.
Automatically create the parameters such as “Body Size XY” without changing
Size, Light
“Alignment Type” and also find the optimal values for “Lighting Level” etc.
Automatically create the parameters such as “Alignment Type” and “Body Size
Type, Size, Light
XY” and also find the optimal values for “Lighting Level” etc.
n NOTE
• For details on the parameters that can be automatically created, see “A5.3.1 Parameters that can be automatically
created”.
• To prevent inadvertent changes in the “Parts Find Best Target” combo box, the operator level can be set for each
operator.
A-54
A5.2 Procedure for automatically creating part recognition data
A5.2.1 Creating the Alignment Type and dimensions automatically

The following describes how to automatically set the Alignment Type and dimensions.
Appendix
1 Set the basic parameters of parts. Step 1 Basic parameter setting
On the Parts screen, select the part data to
create the parameters and enter the
following information.
[Basic]: Required Nozzle, Package, Tape
Type
[Pick]: Feeder Set No.
[Shape]: Body Size X, Body Size Y, Body Size Z
24502-P5-00
n NOTE
• It is not necessary to set the exact values for the “Body
Size X” and “Body Size Y” since they are used to
determine a rough imaging area of the camera.
• The first image will be captured with “Light Main” and
“Light Coax” turned ON (“Light Side” turned OFF)
and “Lighting Level” set to 7/8, so it is not necessary
to make the settings for lighting.
2 Pick up a part.
1. Press the [Parts Adjust] button to open
the Parts Adjust screen.
2. Specify the head number to use and Step 3 Selecting the target item to find optimal values
press the [Pick] button.
3. The head moves and picks up a part.
3 Perform automatic setting for the

Alignment Type.
Select “Type, Size, Light” from the “Parts Find
Best Target” combo box and press the [Find
Best] button.
The Alignment Type and outside dimensions
are automatically determined from the
image of the part, and other parameters
such as “Lighting Level” and “Comp.
Threshold” are also optimized.
24503-P5-00
Step 4 Display of optimized results

4 Finish the setting.
It is successful when a message appears in
the Result box, stating that the optimal
values have been found.
The optimal values such as the outside
dimensions can be checked in the grid
above the Result box. Note that changes in
the outside dimensions are not displayed in
the Result box.
24504-P5-00
TIP
The Monitor Mode automatically changes to “Defined
Shape” and allows checking the recognized part
image overlaid with the defined shape of the part on
the vision monitor.
n NOTE
If failed to find the optimal values, see “A5.2.3
Corrective action when search for optimal values has
failed”.
A-55
A5.2.2 Automatically creating the dimensions only
The following describes how to automatically set the dimensions only without changing the Alignment Type.
1 Set the basic parameters of the Step 1 Basic parameter setting

parts.
On the Parts screen, select the part data to
Appendix
create the parameters, and enter the

following information.
[Basic]: Required Nozzle, Package, Tape
Type
[Pick]: Feeder Set No.
[Shape]: Body Size X, Body Size Y, Body Size Z
24502-P5-00
n NOTE
• It is not necessary to set the exact values for the “Body
Size X” and “Body Size Y” since they are used to
determine a rough imaging area of the camera.
• The first image will be captured with “Light Main” and
“Light Coax” turned ON (“Light Side” turned OFF) and
“Lighting Level” set to 7/8, so it is unnecessary to
make the settings for lighting.
2 Pick up a part.
1. Press the [Parts Adjust] button to open
the Parts Adjust screen.
2. Specify the head number to use and
press the [Pick] button.
3. The head moves and picks up a part.
3 Perform automatic measurement of Step 3 Selecting the target item to find optimal values
dimensions.
Select “Size, Light” from the “Parts Find Best
Target” combo box and press the [Find Best]
button.
The dimensions are automatically
determined from the image of the part, and
other parameters such as “Lighting Level”
and “Comp. Threshold” are also optimized.
24505-P5-00
4 Finish the setting.

It is successful when a message appears in
the Result box, stating that the optimal
values have been found.
The optimal values such as the outside
dimensions can be checked in the grid
above the Result box. Note that changes in
the outside dimensions are not displayed in
the Result box.
TIP
The Monitor Mode automatically changes to “Defined
Shape” and allows checking the recognized part
image overlaid with the defined shape of the part on
the vision monitor.
n NOTE
If failed to find the optimal values, see “A5.2.3
Corrective action when search for optimal values has
failed”.
A-56
c CAUTION
• After automatically creating the part data, if the
side-view camera fails to recognize the part size, then
the “Side View Camera” parameter setting is
automatically changed to “Not Use”.
• After automatically creating the part data, if the
Appendix
Alignment Type does not support coplanarity check,
then the “3D Coplanarity Threshold” parameter setting
remains unchanged.
A5.2.3 Corrective action when search for optimal values has failed
■ When automatically creating the Alignment Type and dimensions

Try the following settings:
1. If the entire part does not fit within the image, then enlarge the “Body Size X” and Body Size Y” settings.
2. If the entire part does not fit within the image, then enlarge the “Search Area” settings.
3. If the image is defocused, then change the “Body Size Z”.
4. Manually select the Alignment Type and automatically create only the dimensions.
■ When automatically creating the dimensions only

Try the following settings:
1. If the entire part does not fit within the image, then enlarge the “Body Size X” and Body Size Y” settings.
2. If the entire part does not fit within the image, then enlarge the “Search Area” setting.
3. If the image is defocused, then change the “Body Size Z” setting.
4. Include the Alignment Type to automatically create the part data.
n NOTE
If using the parts that cannot be defined by the existing algorithms, use the function described in “7. Smart recognition
function” in Chapter 4.
A-57
A5.3 Function details
A5.3.1 Parameters that can be automatically created

The table below shows the parameters that can be automatically created by the setting in the “Parts Find Best
Target” combo box.
Appendix
■ Parameters that can be automatically created by the setting in the “Parts Find Best Target” combo box
Item Type, Size, Light Size, Light Light
[Vision] – “Light Main”
*1 *1
[Vision] – “Light Coax” ✓ ✓
[Vision] – “Light Side”
[Vision] – “Lighting Level” ✓ ✓ ✓
[Vision] – “Comp Threshold” ✓ ✓ ✓
[Vision] – “Comp Tolerance” ✓ ✓
[Vision] – “Search Area” ✓ ✓ ✓
*2 *2 *2
[Vision] – “3D Threshold” ✓ ✓ ✓
*2 *2 *2
[Vision] – “3D Main Lighting Level” ✓ ✓ ✓
*2 *2 *2
[Vision] – “3D Coax Lighting Level” ✓ ✓ ✓
*2 *2 *2
[Vision] – “3D Side Lighting Level” ✓ ✓ ✓
*2 *2 *2
[Vision] – “3D Bright Area” ✓ ✓ ✓
[Shape] – “Alignment Type” ✓
[Shape] – “Base Alignment” ✓
[Shape] – “Algorithm” ✓
[Shape] – “Body Size X” ✓ ✓
[Shape] – “Body Size Y” ✓ ✓
[Shape] – “Ruler Offset (NSEW)” ✓ ✓ ✓
[Shape] – “Ruler Width” ✓ ✓
[Shape] – “Lead Group (NSEW)” ✓ ✓
[Shape] – “Lead Number (NSEW)” ✓ ✓
[Shape] – “Lead Pitch (NSEW)” ✓ ✓
*3
[Shape] – “Lead Width (NSEW)” ✓ ✓ ✓
[Shape] – “Reflect LL (NSEW)” ✓ ✓
[Shape] – “Find PosX (NSEW)” ✓ ✓
[Shape] – “Find PosY (NSEW)” ✓ ✓
[Shape] – “Vision Option (1 to 4)” ✓ ✓
✓: Supported, Blank: Not supported
*1: In the case of ball components, the “Light Side” parameter is set to ON if the side lighting is more suitable.
*2: These parameters will be created only when the selected Alignment Type supports coplanarity check and also a value is set in the “3D
Co-planarity Threshold” parameter.
*3: This parameter will be created only for “Sp. Chip” (special chip) and “Melf Chip”.
A-58
A5.3.2 Alignment Type compatible with automatic parameter creation
• When search for optimal values is performed with “Type, Size, Light” selected in the “Parts Find Best Target” combo
box, one of the Alignment Type and Algorithm parameter settings marked by a check mark (✔) in the table below will
be selected.
• When “Size, Light” is selected in the “Parts Find Best Target” combo box, search for optimal values will be performed
Appendix
only on the parts with the Alignment Type and Algorithm parameter settings marked by a check mark (✔) in the “Size,
Light” column in the table below.
• For the Alignment Type and Algorithm parameter settings with no check mark in the “Size, Light” column, the “Size,
Light” item is not listed in the “Parts Find Best Target” combo box.
Supported: ✔, Not supported: Blank
Alignment Group Alignment Type Algorithm Type, Size, Light Size, Light
0 Normal ✓ ✓
1 Chamfer Lead ✓
2 Check Lead Brightness ✓
Std. Chip 3 Check Direction ✓
4 Check Center Brightness ✓
5 Retry Lead Center Search ✓
8 Chip Array
Chip
Melf chip 0 Normal ✓
0 Normal ✓
Bare Chip 12 Size Fitting ✓
14 Small Bare Chip
Cylinder 0 Normal
Sp. Chip 0 Normal ✓
Small Chip 0 Normal
0 Normal ✓
2Ends 3 Check Direction ✓
10 Check Upside-Down ✓
0 Normal ✓ ✓
Mini-Tr/SOT
P-Tr 0 Normal ✓ ✓
0 Normal ✓ ✓
1 Side Lead Fitting ✓
SOP
6 Check Global Lead Bend
Direction Check by Lead

7 ✓
IC Width
8 Check Lead Position ✓
SOJ 0 Normal ✓ ✓
0 Normal ✓ ✓
QFP 1 Side Lead Fitting ✓
4 Check Lead Length ✓
0 Normal ✓ ✓
PLCC 2 NS Base Search ✓
3 WE Base Search ✓
4 Check Direction ✓
OffLead 0 Normal ✓
A-59
Supported: ✔, Not supported: Blank
Alignment Group Alignment Type Algorithm Type, Size, Light Size, Light
Con-E 0 Normal ✓ ✓
Connector Con-NSEW 0 Normal ✓ ✓

Appendix
Odd.Con 0 Normal ✓
0 Normal ✓ ✓
Simple BGA 1 Check Polarity ✓
3 Simple White BGA
0 Normal ✓ ✓
4 White BGA
BGA 7 CGA ✓
Ball
12 Ball Circularity Check ✓
0 Normal
Simple Flip Chip
1 Outside Bump Recognition
0 Normal
Flip Chip
2 Simple High Speed
Special 2 Long Connector ✓
9 Insertion-Component
Odd Chip 0 Normal
0 Normal ✓ ✓
1 Mark Line ✓
2 2 Objects ✓
AsMark 3 4 Objects ✓
4 General ✓
Special 6 Check Direction ✓
8 2 Objects (Angle of Terminal) ✓
0 Normal ✓ ✓
Sp.Quad 8 Shield Frame ✓
11 4 Corner Fitting
Gravity 0 Normal
Ignore -
Smart Recognition -
A-60
Index C
CE marking i
Function for automatically creating part
data A-53
INDEX
Chip components 2-36 Function for simplifying the vision algorithm
Component information 2-15 setting A-15
4-point fiducial function 2-14
Basic parameters 2-17 H
A
Creating procedure 2-16 History Utility 6-36
Alignment Type 2-17 Mount parameters 2-33
L
Ball 2-18 Option parameters 2-42
Chip 2-17 Local fiducial function 2-13
Pick parameters 2-30
Connector 2-19 Shape parameters 2-36 M
IC 2-18 Vision parameters 2-34 Mark Adjust mode 2-60
Special 2-20 Component recognition test 2-45 [Mark] button 2-54
Alternative components 4-14 Histogram 2-52 Mark information 2-53
Setting the alternative components 4-15 Monitor mode 2-49
Basic parameters 2-55
Alternative Parts 2-42 Outline definition 2-49
Creating procedure 2-54
Automatically creating part recognition Connector 2-41 Shape parameters 2-56
data A-55 Conveyor Timer sec 2-4 Vision parameters 2-58
Automatic measurement of dimensions A-56 Coplanarity checker 3-16 Mark recognition test 2-60
Automatic setting for the Alignment Type A-55 [Create] button 1-2,1-5 Mini Tr / SOT 2-37
B Cursor teaching 2-82 Mount vacuum level 2-48
Badmark function D MTF (Manual tray feeder) 3-11

Block badmark 4-1 Data backup 6-1 N
Board badmark 4-1 Backup of board data 6-1 Nozzles 2-21
Local badmark 4-9 Backup of system data 6-7 O
Badmark functions 4-1 Database
Operator access control A-4
Local badmark 4-1 Database list 6-24
Editing access levels A-11
Badmark parameters 4-3 User database 6-24
Import/export function A-13
BGA 2-40 YAMAHA database 6-24
Operator level time limit A-14
Random Ball Edit screen 2-71 Database Number 2-29
Registering a new operator A-4
BGA component 2-64 Defined Shape A-53,A-55,A-56 Optimizing the data
Binary level correction 2-66 Dummy feeder iv Optimizing conditions 4-33
Random ball position file 2-72 Dump Way 2-29 Original Block No. 2-8,2-10,2-11,4-3,5-4
[Read POS] button 2-70
E P
Block offset 5-3
Edit Assistant function 4-24 Package 2-28
Block distribution return 5-10
Editing rows 4-26 Parameters that can be automatically A-58
Block offset distribution 5-8
Find and replace 4-27
Creating the block offset data 5-3 [Parts Adjust] button 2-46
Renumber 4-28
[Board] button 1-8 Parts Adjust mode 2-46
Selecting a range of rows 4-25
Board data [Parts] button 2-16
Edit Assistant screen 4-24
Flowchart for creating board data 1-10 Parts Data Auto Tuning A-50,A-52
Editor
Registering board names 1-2 Parts Data Auto Tuning function A-45
Multiplying the component data 5-1
Selecting the board data 1-8
Renumbering the data 5-2 Parts Data Auto Tuning Spec A-50
Utilizing board data already registered 1-5
F Parts Data Take Over Setting A-52
Board data optimization 4-32
Feeder Set No. 2-30 Parts Find Best Targe A-58
Executing the optimization 4-44
Feeder Type 2-28 Parts Find Best Target A-53,A-54,A-59
Board data structure 1-1
Fiducial mark function Parts Group No. 2-42,4-17
Board file format conversion 5-11
4-point fiducial function 2-14 Parts information
Saving VIOS data in YGX format 5-11
Saving YGX data in VIOS format 5-13 Block fiducial function 2-12 → See component information.
Board information 2-1 Board fiducial function 2-12
Parts information takeover specifications A-48
Local fiducial function 2-13
Board parameters 2-2 Parts information tuning function A-46
Point fiducial function 2-13
Fiducial parameters 2-11
Parts shape teaching 2-86
Mount parameters 2-7 Fiducial parameters
Pattern matching 4-18
Offset parameters 2-9 Local fiducial functions 2-13
Pattern registration 4-19
Board Origin 2-9 Flip Chip 2-68
Pick Tango 2-32
Board Size XY 2-3 Force control 3-24
Pickup vacuum level 2-48
FullASCII Output 6-35
Pitch distribution function 5-6
S-1
Point fiducial function 2-13
Point teaching 2-78
INDEX
Multi-point input 2-80

One-point input 2-80
POS information file 6-21
Production log 6-27
Q
QFP 2-38
R
Recognition image check 4-30
Recognition image save 4-30
Recovery pallet 3-31
Required Nozzle 2-21
Retry Times 2-29
Row Edit 4-26
[Row Selection] button 4-25
S
Safety ii
Safety message vii
Shape parameters
BGA 2-40
Chip components 2-36
Connector 2-41
Mini Tr / SOT 2-37
QFP 2-38
Simple BGA 2-39
SOP 2-38
Side-view camera
Side-view camera parameters 2-43
Smart recognition function 4-46
Solder ball components 2-64
SOP 2-38
Specifications A-1
System data
Restoring the system data 6-14
T
Tape cutter 3-27
Tape Type 2-28
Teaching function 2-78
Cursor teaching 2-82
Point teaching 2-78
Trace function 2-74
Auto trace function 2-77
Trans Height 2-3
Tray changer 3-5
Tuning result takeover function A-48
U
Use Feeder Optimize 2-42
W
Warning labels xi
Wide Multi Stick feeders 3-1
S-2
Programming Manual August 2015
Version 6.20

EPP2158620 - SMT Programming - E

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YAMAHA SMT Assembly System

2. Safety message vii

1.1 To ensure safety

1.1.1 Defining safety

1.1.2 Causes of injuries and accidents

1.2 Using safety gear

n Precautions when applying lubricant (grease)

1.3.2 Restricting machine operation with passwords

1.4 Cautions during machine operation

1.5 Cautions during power outages

1.6 Cautions regarding ferromagnetic fields

1.7 Handling the internal tape cutter

Prevention of hand entry

Dummy feeder (Wide-size)

Dummy feeder (8mm-size)

Prevention of hand entry

Board conveyance plane

Lower muzzle plate

Upper clearance Lower clearance Remarks

YS100/YS88 8.0 to 38.5mm 1.0 to 31.0mm

YS12, YS12P, YS12F, YS24, YS24X 5.0 to 20.0mm 4.2 to 39.2mm

YSM40 0 to 44.0mm 0 to 39.0mm

Z:LEX (YSM20) 0 to 36.0mm 4 to 40.0mm From board conveyor plane

YC8 13.4 to 80.4mm 4.6 to 39.2mm

YSP 0 to 6.6mm 0 to 26.4mm

YSi-V 0 to 48.0mm 0 to 102mm

Hazards when handling solvents

1. Hazards to human health

To avoid hazards of solvents

1.10 Handling the X-ray unit

n Safety alert symbols and signal words

2.2.1 Safety instruction

3.1.1 Warning label format

Warning label format

WARNING Signal word panel

Mark and pictogram

3.1.2 Meaning of marks

Mark and pictogram

Warning mark Prohibition mark Instruction mark

WARNING WARNING WARNING

Meaning of the above

3.2.1 Handling safety covers

Electrical shock hazard

To prevent the electric shock or damage.

Example for machines that must be connected to 200 VAC

About this manual

2. Contents of each chapter iii

Chapter 1 Overview of board data

2. Registering and selecting the board name 1-2

3. Flowchart for creating board data 1-10

Chapter 2 Setting the board parameters

2. Creating the component information 2-15

3. Component recognition test 2-45

5. Mark recognition test 2-60

6. Editing the solder ball components 2-64

7. Teach and trace 2-74

Chapter 3 Parameters for using options

2. Coplanarity checker 3-16

3. Force control (YS88) 3-24