FLUXKESTERRMALIQUID186-18_www.macdermidalpha.com_scout
FLUXKESTERRMALIQUID186-18_www.macdermidalpha.com_scout
FLUXKESTERRMALIQUID186-18_www.macdermidalpha.com_scout
186 Flux-Pen®
Mildly Activated Rosin Flux-Pen for Leaded and Lead-free Alloys
Product Description
Kester 186 Flux-Pen is specifically designed for leaded and lead-free rework of conventional
and surface mount circuit board assemblies. 186 Flux-Pen under MIL-F-14256, was QPL
approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues
after soldering are non-corrosive and non-conductive. 186 Flux-Pen has been developed for use
in critical applications where difficult assemblies are to be soldered, but process requirements
stipulate use of Type RMA flux. 186 Flux-Pen possess high thermal stability for soldering multi-
layer assemblies which require higher temperatures. Exposure to high preheat temperatures
does not degrade solubility of the residue in normal cleaning solvents. There is no surface
insulation resistance degradation caused by the flux residue. The use of a minimum of ionic
activating agents and the inactive nature of the residue permits leaving the residue on circuit
board assemblies for many applications. The flux residue is also moisture and fungus resistant.
Performance Characteristics:
High thermal stability
Improves soldering performance
Eliminates the need and expense of cleaning
Classified as ROL1 per J-STD-004 & J-STD-004B
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS)
Directive. Additional RoHS information is located at
https://www.kester.com/downloads/environmental.
Physical Properties
Specific Gravity: 0.879
Anton Paar DMA @ 25 °C
186 Flux-Pen
Technical Data Sheet
Issue: 07 February 2024 Page 1 of 3
TECHNICAL DATA SHEET
Reliability Properties
Copper Mirror Corrosion: Low
IPC-TM-650, Method 2.3.32
Flux Application
186 Flux-Pen is applied to circuit boards via Flux-Pen for rework of printed wire assemblies.
Process Considerations
186 Flux-Pen should only be applied to areas that will be fully heated by the soldering iron or
other reflow tool. Care should be taken to avoid flooding the assembly. The surface tension has
been adjusted to help the flux form a thin film on the board surface allowing rapid solvent
evaporation.
Cleaning
186 Flux-Pen flux residues are non-conductive, non-corrosive and do not require removal in
most applications.
186 Flux-Pen
Technical Data Sheet
Issue: 07 February 2024 Page 2 of 3
TECHNICAL DATA SHEET
Recycling Services
We provide safe and efficient recycling services to help companies meet their
environmental and legislative requirements and at the same time, maximize
the value of their waste streams.
Our service collects solder dross, solder scrap, and various forms of solder
paste waste. Please contact your local sales representative for recycling
capabilities in your area or link here.
Contact Information
To confirm this document is the most recent version, please contact
[email protected]
Also read carefully warning and safety information on the Safety Data Sheet. This data sheet contains technical information required for safe and economical operation of this product. READ IT THOROUGHLY
PRIOR TO PRODUCT USE. Emergency safety directory assistance: US 1 202 464 2554, Europe + 44 1235 239 670, Asia + 65 3158 1074, Brazil 0800 707 7022 and 0800 172 020, Mexico 01800 002 1400 and (55)
5559 1588
DISCLAIMER: All statements, technical information and recommendations contained herein are based on tests we believe to be reliable, but the accuracy or completeness thereof is not guaranteed. No
statement or recommendation shall constitute a representation unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OF MERCHANTABILITY, WARRANTY OF FITNESS
FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY IS MADE. The following warranty is made in lieu of such warranties and all other warranties, express, implied, or statutory. Products are warranted to
be free from defects in material and workmanship at the time sold. The sole obligation of seller and manufacturer under this warranty shall be to replace any noncompliant product at the time sold. Under no
circumstances shall manufacturer or seller be liable for any loss, damage or expense, direct, indirect, incidental or consequential, arising out of the inability to use the product. Notwithstanding the foregoing, if
products are supplied in response to a customer request that specifies operating parameters beyond those stated above, or if products are used under conditions exceeding said parameters, the customer by
acceptance or use thereof assumes all risk of product failure and of all direct, indirect, incidental and consequential damages that may result from use of the products under such conditions, and agrees to
exonerate, indemnify, defend and hold harmless MacDermid, Incorporated and its affiliates therefrom. No suggestion for product use nor anything contained herein shall be construed as a recommendation to
use any product in a manner that infringes any patent or other intellectual property rights, and seller and manufacturer assume no responsibility or liability for any such infringement.
© 2019 MacDermid, Inc. and its group of companies. All rights reserved. “(R)” and “TM” are registered trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries.
186 Flux-Pen
Technical Data Sheet
Issue: 07 February 2024 Page 3 of 3