LM385
LM385
LM385
ORDERING INFORMATION
VZ ORDERABLE TOP-SIDE
TA PACKAGE†
TOLERANCE PART NUMBER MARKING
Tube of 75 LM385D-1-2
SOIC (D) 385-12
Reel of 2000 LM385DR-1-2
SOP (PS) Reel of 2000 LM385PSR-1-2 L385-12
2% Tube of 1000 LM385LP-1-2
TO-226 / TO-92 (LP) 385-12
Reel of 2000 LM385LPR-1-2
Tube of 150 LM385PW-1-2
TSSOP (PW) 385-12
0°C
0 C to 70
70°C
C Reel of 2000 LM385PWR-1-2
Tube of 75 LM385BD-1-2
SOIC (D) 385B12
Reel of 2000 LM385BDR-1-2
Tube of 1000 LM385BLP-1-2
1% TO-226 / TO-92 (LP) 385-12
Reel of 2000 LM385BLPR-1-2
Tube of 150 LM385BPW-1-2
TSSOP (PW) 385B12
Reel of 2000 LM385BPWR-1-2
Tube of 75 LM285D-1-2
SOIC (D) 285-12
−40°C
−40 C to 85
85°C
C 1% Reel of 2000 LM285DR-1-2
TO-226 / TO-92 (LP) Tube of 1000 LM285LP-1-2 285-12
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
!"#$ % &'!!($ #% )'*+&#$ ,#$( Copyright 2005, Texas Instruments Incorporated
!,'&$% &!" $ %)(&&#$% )(! $-( $(!"% (.#% %$!'"($%
%$#,#!, /#!!#$0 !,'&$ )!&(%%1 ,(% $ (&(%%#!+0 &+',(
$(%$1 #++ )#!#"($(!%
symbol
ANODE CATHODE
schematic
CATHODE
Q13
7.5 kΩ 600 kΩ
Q12
Q7
200 kΩ
Q4
Q11
50 kΩ
Q3
Q10
Q1 300 kΩ
20 pF 20 pF
Q2 Q9
Q5
Q6 Q8
Q14
100 kΩ 500 Ω 60 kΩ
ANODE
NOTE A: Component values shown are nominal.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Reverse current, IR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Forward current, IF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA
Package thermal impedance, θJA (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
LP package . . . . . . . . . . . . . . . . . . . . . . . . . . 140°C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) − TA)/θJA. Operation at the absolute maximum TJ of 150°C can affect reliability.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
IZ = I(min) 25°C 1 1 1
Change in
reference to 1 mA‡ Full range 1.5 1.5 1.5
∆VZ mV
voltage with IZ = 1 mA 25°C 12 20 20
current to 20 mA Full range 30 30 30
Long-term
change in
∆VZ/∆t IZ = 100 µA 25°C ±20 ±20 ±20 ppm/khr
reference
voltage
Minimum
IZ(min) reference Full range 8 10 8 15 8 15 µA
current
Reference IZ = 100 µA, 25°C 0.2 0.6 0.4 1 0.4 1
zz Ω
impedance f = 25 Hz Full range 1.5 1.5 1.5
IZ = 100 µA,
Broadband
Vn f = 10 Hz to 25°C 60 60 60 µV
noise voltage
10 kHz
† Full range is −40°C to 85°C for the LM285-1.2 and 0°C to 70°C for the LM385-1.2 and LM385B-1.2.
‡ I(min) = 10 µA for the LM285-1.2 and 15 µA for the LM385-1.2 and LM385B-1.2
§ The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified temperature
range.
TYPICAL CHARACTERISTICS†
ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ
REVERSE VOLTAGE REVERSE CURRENT
100 16
ÎÎÎÎÎÎÎ
TA = −55°C to 125°C
ÎÎÎÎÎÎ
TA = −55°C to 125°C
10
8
4
1
0.1 −4
0 0.2 0.4 0.6 0.8 1 1.2 1.4 0.01 0.1 1 10 100
VR − Reverse Voltage − V IR − Reverse Current − mA
Figure 1 Figure 2
ÎÎÎÎ
1.2 1.245
ÎÎÎÎ
TA = 25°C
1.24
V Z − Reference Voltage − V
V F − Forward Voltage − V
0.8
1.235
0.4 1.23
1.225
0 1.220
0.01 0.1 1 10 100 −55 −35 −15 5 25 45 65 85 105 125
IF − Forward Current − mA TA − Free-Air Temperature − °C
Figure 3 Figure 4
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS†
400
300
1
200
Vn
100
0.1 0
0.01 0.1 1 10 100 10 100 1k 10 k 100 k
Figure 5 Figure 6
ÎÎÎÎÎ ÎÎÎ
70
ÎÎÎÎÎ ÎÎÎ
IZ = 100 µA RC Low Pass
60 TA = 25°C Output
ÎÎÎÎ
1.5
Input and Output Voltages − V
Output Noise Voltage − µV
50
40
ÎÎÎÎ
100 µA
R
1
0.5
VI
36 kΩ
VO
30 0
20
5
10
Input
0 0
0.1 1 10 100 0 100 500 600
f − Cutoff Frequency − kHz t − Time − µs
Figure 7 Figure 8
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
APPLICATION INFORMATION
IO ≈ 58 µA
+ 5.1 kΩ V+
Mercury Cell 100 kΩ ±1% 2.00 kΩ ±1%
R
1.345 V LM334
− cw cw
V−
10 kΩ 500 Ω
953 Ω† 412 Ω‡
LM385-1.2
±1% ±1%
+
Type K −
Meter
† Adjust for 11.15 mV at 25°C across 953 Ω
‡ Adjust for 12.17 mV at 25°C across 412 Ω
V+ 2.3 V ≤ V+ ≤ 30 V
LM334
R
V− 2.74 kΩ
1.2 V
LM385-1.2
9V
499 kΩ
1.2 V
LM385-1.2
PACKAGING INFORMATION
Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
LM285D-1-2 ACTIVE SOIC D 8 75 Pb-Free CU NIPDAU Level-2-250C-1 YEAR
(RoHS)
LM285DR-1-2 ACTIVE SOIC D 8 2500 Pb-Free CU NIPDAU Level-2-250C-1 YEAR
(RoHS)
LM285LP-1-2 ACTIVE TO-92 LP 3 1000 None Call TI Level-NC-NC-NC
LM385BD-1-2 ACTIVE SOIC D 8 75 Pb-Free CU NIPDAU Level-2-250C-1 YEAR
(RoHS)
LM385BDR-1-2 ACTIVE SOIC D 8 2500 Pb-Free CU NIPDAU Level-2-250C-1 YEAR
(RoHS)
LM385BLP-1-2 ACTIVE TO-92 LP 3 1000 None Call TI Level-NC-NC-NC
LM385BLPR-1-2 ACTIVE TO-92 LP 3 2000 None Call TI Level-NC-NC-NC
LM385BPW-1-2 ACTIVE TSSOP PW 8 150 Pb-Free CU NIPDAU Level-1-250C-UNLIM
(RoHS)
LM385BPWR-1-2 ACTIVE TSSOP PW 8 2000 Pb-Free CU NIPDAU Level-1-250C-UNLIM
(RoHS)
LM385D-1-2 ACTIVE SOIC D 8 75 Pb-Free CU NIPDAU Level-2-250C-1 YEAR
(RoHS)
LM385DR-1-2 ACTIVE SOIC D 8 2500 Pb-Free CU NIPDAU Level-2-250C-1 YEAR
(RoHS)
LM385LP-1-2 ACTIVE TO-92 LP 3 1000 None Call TI Level-NC-NC-NC
LM385LPR-1-2 ACTIVE TO-92 LP 3 2000 None Call TI Level-NC-NC-NC
LM385PSR-1-2 ACTIVE SO PS 8 2000 Pb-Free CU NIPDAU Level-2-260C-1 YEAR/
(RoHS) Level-1-235C-UNLIM
LM385PW-1-2 ACTIVE TSSOP PW 8 150 Pb-Free CU NIPDAU Level-1-250C-UNLIM
(RoHS)
LM385PWR-1-2 ACTIVE TSSOP PW 8 2000 Pb-Free CU NIPDAU Level-1-250C-UNLIM
(RoHS)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 17-Feb-2005
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
0.210 (5,34)
0.170 (4,32)
Seating
Plane
0.157 (4,00) MAX
0.050 (1,27)
C
0.105 (2,67)
0.095 (2,41)
0.055 (1,40)
0.045 (1,14)
1 2 3
0.539 (13,70)
0.460 (11,70)
1.260 (32,00)
0.905 (23,00)
0.650 (16,50)
0.020 (0,50) MIN
0.610 (15,50) 0.098 (2,50)
0.384 (9,75)
0.335 (8,50)
0.114 (2,90)
0.094 (2,40)
0.114 (2,90) 0.169 (4,30)
DIA
0.094 (2,40) 0.146 (3,70)
0.266 (6,75)
0.234 (5,95)
0.512 (13,00)
0.488 (12,40)
0,30
0,65 0,10 M
0,19
14 8
0,15 NOM
4,50 6,60
4,30 6,20
Gage Plane
0,25
1 7
0°– 8°
A 0,75
0,50
Seating Plane
PINS **
8 14 16 20 24 28
DIM
4040064/F 01/97
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