Application Report

SLVA927A – November 2017 – Revised April 2019

Basics of Power Switches

Arthur Huang, Emily Roth

ABSTRACT
A Power Switch provides an electrical connection from a voltage source or ground to a load. It saves
power across multiple voltage rails and protects subsystems from damage. It also provides enhanced
component protection, inrush current protection, and minimizes printed-circuit board (PCB) size.
There are several power switch topologies with different functions that address different applications. Load
Switches establish the power switch foundation by providing safe and reliable distribution of power.
Applications typically using load switches include power distribution, power sequencing, inrush current
control, and reduced current leakage. Integrated Power MUX devices are similar to load switches but
allow for multiple input sources. This set of electronic switches is used to select and transition between
two or more input power paths to a single output while also providing input power protection.
eFuses and Hot Swap controllers provide additional input power path protection functions such as current
sense monitoring, current limiting, undervoltage and overvoltage protection, and thermal shutdown. This
makes these devices ideal for hot-plug and transient events that would otherwise damage system
components. These benefits help reduce system maintenance costs and maximize equipment uptime.
Ideal diode, ORing controllers provide protection against reverse-polarity conditions by monitoring an
external FET, significantly reducing power loss, and blocking reverse current. Whenever a transient event
occurs, the controller monitors and adjusts the external FET to prevent damage to upstream components.
Smart high-side switches are for off-board load protection. They provide additional diagnostic telemetry
that monitors the output load current and detects short-circuit and open-load events. Smart high-side
switches have adjustable current limits, allowing for more reliable integration into applications with either
large inrush current startup profiles or low peak currents. Adding a smart high-side switch to a design
leads to a smarter and more robust solution for driving capacitive, inductive, and LED loads.
Low-side switches connect the load to ground instead of providing a connection between a power supply
and the load. By including an integrated flyback diode, low-side switches help eliminate inductive load
transients by dissipating current in a circular loop. This allows them to drive inductive loads such as
solenoids, relays, and motors.
This application report highlights the different topologies within the power switch portfolio, and provides
suggestions in choosing the correct solution for a faster design time.

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Table 1. Power Switch Topology Table

POWER DISTRIBUTION POWER PATH PROTECTION
Power MUX Ideal Diode
eFuse Hot Swap Smart High- Low-Side
Load Switch (2 input, 1 ORing
(Internal FET) (External FET) Side Switch Switch
output) Controller
Voltage Range 0 V to 18 V 2.8 V to 22 V 2.7 V to 60 V ±80 V ±75 V 6 V to 40 V 0 V to 100 V
Max Operating Current 15 A 4.5 A 15 A N/A N/A 12 A 1A
Functions
Inrush Current Control ✓ ✓ ✓ ✓ ✓
Adjustable Current Limit ✓ ✓ ✓ ✓
Reverse Current Blocking ✓ ✓ ✓ ✓ ✓
Current Sense Monitoring ✓ ✓ ✓
Short-Circuit Protection ✓ (1) ✓ ✓ ✓ ✓
Overvoltage Protection ✓ ✓ ✓
Reverse Polarity Protection ✓ ✓ ✓ ✓ ✓
Power Good Signal ✓ ✓ ✓
Inductive Load Compatibility ✓ ✓
Load-Dump Compatibility ✓ ✓ ✓ ✓ ✓
Thermal Shutdown ✓ ✓ ✓ ✓ ✓

(1)
Self protected load switch

Input Protection Power Distribution

Ideal Diode Hot Swap
Controller

Load Switch Load

DC/DC Load
Hot Swap
Ideal Diode Controller
eFuse
eFuse

Load Switch
Load

Output Power
Power
Mux VDS Clamp Protection
Load
High Side Switch
Power Distribution

Figure 1. Typical Power Switch Use Cases

Contents
1 Load Switches ................................................................................................................ 3
2 Power Multiplexing........................................................................................................... 4
3 eFuses ........................................................................................................................ 5
4 Hot Swap...................................................................................................................... 6
5 Ideal Diode, ORing Controllers............................................................................................. 7
6 Smart High-Side Switches .................................................................................................. 8
7 Low-Side Switches ......................................................................................................... 10
8 References .................................................................................................................. 10
Trademarks

2 Basics of Power Switches SLVA927A – November 2017 – Revised April 2019

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www.ti.com Load Switches

1 Load Switches

VIN VOUT

ON Control
Logic QOD

CT GND

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Figure 2. Load Switch Block Diagram

Integrated load switches are electronic switches that turn power rails on and off. When the internal FET
turns on, current flows from the input to output and passes power to the downstream circuitry. When the
device is enabled, the rise time of the output voltage (VOUT) can be controlled by adjusting the capacitance
on an external pin (CT pin). When the device is disabled, the fall time of VOUT is controlled through the
quick output discharge (QOD). QOD pulls the output to ground whenever the device is turned off,
preventing the output from floating or entering an undetermined state.
Some common functions of load switches include power savings, power sequencing, and inrush current
control. Power savings is important in applications looking to minimize current dissipation and maximize
power efficiency. By disconnecting the supply from a load or subsystem, the switch minimizes power
drawn from inactive loads. Power sequencing is important in applications where individual voltage rails
need to be turned on and off in a specific order. By configuring the CT and QOD pins, the ramp-up and
power-down timing can be adjusted. Inrush current control protects systems that contain large bulk
capacitors near the load. When power is initially applied to the system, charging these capacitors can
result in a large inrush current that exceeds the nominal load current. If left unaddressed, this can cause
voltage rails to fall out of regulation due to the drop, resulting in the system entering an undesired state.
Load switches can mitigate the inrush current by using the CT pin to manage the rise time of the power
rail. This leads to a linear output slew rate with no voltage dips or external regulators required.

Table 2. Load Switch Examples (1)

VOLTAGE MAX
DESCRIPTION DEVICES TYPICAL Ron PACKAGE
RANGE CURRENT
TPS22918 1 V to 5.5 V 2A 52 mΩ SOT
Adjustable rise time, adjustable QOD
TPS22810 2.7 V to 18 V 2A 79 mΩ SOT
TPS22915 1.05 V to 5.5 V 2A 37 mΩ CSP
Space-constrained applications
TPS22916 1 V to 5.5 V 2A 60 mΩ CSP
Self protected with controlled rise time TPS22919 1.6 V to 5.5 V 1.5 A 90 mΩ SOT
Lowest ON-resistance, power good indication TPS22990 1 V to 5.5 V 10 A 3.9 mΩ SON
Fast turn-on time (≤ 65 µs), Power Good indication,
TPS22971 0.65 V to 3.6 V 3A 6.7 mΩ DSBGA
QOD, thermal shutdown

(1)
TI.com/LoadSwitches for more information about load switches.

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2 Power Multiplexing

BFET1 HFET1
IN1 SS
Temp
SNS CSS

Control Logic
+ Gate Drivers

OUT

Protecion

Temp
IN2 SNS
BFET2 HFET2

Figure 3. Power MUX Block Diagram

Integrated Power MUX devices allow a system to transition between different power sources seamlessly.
If the main power supply fails, power multiplexing allows the system to switch to a backup power supply,
such as a battery, to preserve operating conditions. Power multiplexing can also provide switching
between two different voltage levels for subsystems that operate at two different voltages. In this scenario,
to prevent reverse current flow from VOUT into one of the VIN channels, reverse current protection (RCP)
blocks current from flowing back through the body diode. Power multiplexing also contains adjustable
current limits. If the current exceeds the threshold set by the switch, the switch clamps the channel and
prevent current from exceeding the limit. Furthermore, if the current limit forces the device to reach higher
temperatures, thermal shutdown turns off the switch until it can operate at safe conditions again. Similar to
load switches, power MUX switches also contain inrush current control to prevent large transient current
events.
Power MUX devices can switch between different power rails in three general ways: manually,
automatically, or both. Manual switchovers occur with an external GPIO. Whenever you want to switch
between power rails, the enable pin is toggled and the output is powered by the other power rail.
Automatic switchover occurs whenever the primary power supply fails or is disconnected. When the
device detects the voltage drop, it automatically switches to the backup power rail. There are some Power
MUX solutions which offer the flexibility to be used in an automatic configuration and to be controlled by a
manual control signal. This method can have a default (automatic) priority, but can then be overridden by
an external microcontroller if needed.

Table 3. Integrated Power MUX Examples (1)

RECOMMENDED TYPICAL
DESCRIPTION DEVICE MAX CURRENT PACKAGE
VOLTAGE RANGE Ron
Automatic priority and manual override, adjustable
TPS2120 2.8 V to 22 V 3 A, each channel 62 mΩ CSP
current limit
Automatic priority and manual override, fast output
TPS2121 2.8 V to 22 V 4.5 A, each channel 56 mΩ QFN
switchover, adjustable current limit

(1)
TI.com/PowerMux for more information about power multiplexing.

4 Basics of Power Switches SLVA927A – November 2017 – Revised April 2019

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www.ti.com eFuses

3 eFuses

VIN VOUT
OVP

EN/UVLO Control
Logic

dVdT

Current ILIM

GND Limit

Copyright © 2017, Texas Instruments Incorporated

Figure 4. eFuse Block Diagram

eFuses are integrated power protection switches that provide voltage and current protection during fault
events. These include short-circuit, overcurrent, overvoltage, undervoltage, and temperature events that
might otherwise damage downstream loads. During a short-circuit transient event, the current through the
eFuse increases very rapidly. The eFuse enables a fast-trip current threshold that terminates this rapid
increase in less than 200 ns, protecting the supply. If an overvoltage event occurs on the input (VIN), the
eFuse monitors the voltage across the internal FET and clamps the output voltage until the input falls
below the overvoltage threshold. eFuses also come with built-in overtemperature protection that shuts
down the FET if the junction temperature exceeds 150°C (typical). The eFuse either remains off (latch-off
version) or attempts to restart (auto retry version) the device after the junction temperature decreases.
eFuses offer many additional features similar to load switches including adjustable inrush current control
and reverse current protection.
Managing current flow from an active power bus to a subsidiary system can be a challenging task. As a
device is inserted or removed from a live supply, it is possible to see a very large spike in current during
the initial capacitor charging. An eFuse or Section 4 controller ensures the safe insertion and operation of
these systems. Unlike hot swap controllers, eFuses contain an integrated FET which minimizes total
solution size. This allows eFuses to be used in applications such as power multiplexing. By using two
eFuses, each eFuse can control a power rail while providing reverse current protection for its respective
supply. eFuses are also UL 2367 certified, cutting down on system testing time.

Table 4. eFuse Examples (1)

RECOMMENDED MAX
TYPICA PACKAG
DESCRIPTION DEVICE VOLTAGE CURRE
L Ron E
RANGE NT
Overvoltage or undervoltage clamp, QOD using FLT pin,
TPS2595 2.7 V to 18 V 4A 34 mΩ SON
adjustable current limit
Lowest Ron circuit-breaker device, accurate load monitoring,
TPS25982 2.5 V to 24 V 15 A 3 mΩ QFN
adjustable transient fault management
Back to back FETs, status monitoring, thermal shutdown, internal
TPS25942A 2.7 V to 18 V 5A 42 mΩ QFN
reverse current blocking
Reverse polarity protection, current sense output, adjustable SOP and
TPS2660 4.2 V to 55 V 2A 150 mΩ
current limit QFN
TPS1663 SOP and
Power limiting, overvoltage cut-off or voltage clamping functionality 4.5 V to 60 V 6A 31 mΩ
QFN
SOP and
Power limiting, reverse current blocking, reverse polarity protection TPS2663 4.5 V to 60 V 6A 31 mΩ
QFN

(1)
Visit www.ti.com/efuses for more information about eFuses.

SLVA927A – November 2017 – Revised April 2019 Basics of Power Switches 5

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4 Hot Swap
Rsns
VIN VOUT

GATE

Rpg
OVP Telemetry PG
Isns Gate Logic
Control

Control Logic
UVLO

TIMER PWR GND

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Figure 5. Hot Swap Block Diagram

Hot Swap controllers drive an external MOSFET that protects the system against hot swap events. Hot
Swap controllers do not integrate a MOSFET as eFuses do. The external MOSFET allows hot swap
controllers to operate at higher voltages and currents than eFuse devices. The controller monitors the gate
voltage of the external FET and adjusts the voltage depending on the situation. When the device is
inserted into a live power system, the controller measures the inrush current across RSNS. If the value
exceeds the programable current limit, the gate voltage is lowered and limits the current passing
downstream. If the power dissipated across the FET exceeds the programmable power limit, then the gate
voltage is reduced to lower the current flowing through RSNS. The overvoltage and undervoltage pins also
clamp the voltage whenever the input voltage is not within specified thresholds.
To ensure that the external MOSFET remains within safe operating area (SOA), the hot swap controller
regulates the current limit at higher VDS voltages. The device also includes an assortment of telemetry that
monitors the operating conditions. The Power Good (PG) signal turns on whenever the power rail reaches
regulation, and some hot swap controllers contain PMBus monitoring that allows real-time feedback on the
device status.
Since hot swap controllers operate by controlling an external RSNS and MOSFET, they do not contain an
innate current limit. The external components allow you to customize the solution size and power
requirements to fit their application.

Table 5. Hot Swap Examples (1)

DESCRIPTION DEVICE RECOMMENDED VOLTAGE RANGE PACKAGE
18-V analog devices, small footprint, easy-to-use TPS247xx 2.5 V to 18 V SOP or QFN
Meets 240-V requirements for high-end applications, similar to TPS247xx TPS2477x 2.5 V to 18 V QFN
LM25066A,
PMBus and I2C communication, balance between efficiency and accuracy 2.9 V to 17 V QFN
LM25066I
Higher voltage applications, PMBus and I2C communication, external FET
LM5066 10 V to 80 V PWP
temperature and failure sensing
Higher voltage applications, SOA protection, current limit LM5069 9 V to 80 V SOP
Negative voltage support, SOA protection, PMBus and I2C communication LM5064 –10 V to –80 V SOP
Negative voltage support with dual current limit, soft-start disconnect,
TPS2352x –10 V to –80 V SOP
ORing support, –200 V maximum rating
Circuit breaker function for severe current events, programmable fault
LM5067 –9 V to –80 V SOP
timer, PG output

(1)
Visit www.ti.com/hotswap for more information about Hot Swap controllers.

6 Basics of Power Switches SLVA927A – November 2017 – Revised April 2019

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www.ti.com Ideal Diode, ORing Controllers

5 Ideal Diode, ORing Controllers

VIN VOUT

Anode Cathode
GATE

Current
Pulldown

Control Logic

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Figure 6. Ideal Diode Block Diagram

Ideal diode controllers control an external FET and, similar to a regular diode, can block reverse current
whenever a reverse voltage event occurs. Whenever one of these events occur, the controller shuts off
the FET and uses the body diode to prevent any transients from damaging upstream components. The
controller can also prevent against ground shorts at the input (VIN) by using the same method.
Ideal diode controllers can also protect against reverse polarity conditions, commonly caused by
connecting a battery incorrectly or mis-wiring a power supply. If you accidentally switch the polarity on
VIN, an additional diode from the controller to GND can be included to prevent damage to the IC or the
power source. The controller also significantly lowers power dissipation normally found across diodes. By
driving the external FET instead of a diode, the voltage drop typically found across diode solutions can be
minimized.
Ideal diodes can also act as ORing controllers. Basic power redundancy architecture contains two or more
power supplies connected to a single load. ORing solutions allow the system to switch between power
sources if one were to fail, and can even connect power sources in parallel. This allows for uninterrupted
power and saves on redundant power supply costs.
(1)
Table 6. Ideal Diode Controller Examples
RECOMMENDED TYPICAL FORWARD
DESCRIPTION DEVICE VOLTAGE QUIESCENT VOLTAGE PACKAGE
RANGE CURRENT THRESHOLD
Fast turnoff, voltage sensing TPS241x 3 V to 16.5 V N/A 10 mV SOP and SOIC
Automotive qualified, low Iq, high efficiency LM74700-Q1 3.2 V to 65 V 80 µA 20 mV SOT
Low side ORing controller, FET diagnostics LM5051 –6 V to –100 V 69 µA 45 mV SOIC
(2)
Low Iq, reverse current protection, integrated FET LM66100 1.5 V to 5.5 V 0.2 µA 79 mV SC-70

(1)
Visit www.ti.com/idealdiode for more information about Ideal diode controllers.
(2)
Typical forward voltage at Iout = 1 A.

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6 Smart High-Side Switches

Drain (VS)
VIN VDS Clamp

Diagnostics
Diagnostics
and Gate Logic
Protection

Current Sense Current VOUT

Limit/Sense

CL

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Figure 7. Smart High-side Switch Block Diagram

Smart high-side switches reliably drive off-board loads. These switches contain highly-adjustable and
selectable current limits that enable a system to be optimally designed for specific loads. By connecting an
external resistor to set the current-limit threshold, the switch protects the load and power supply from
overstressing during short-circuits to GND events or power-up conditions. This enables more reliable
designs by minimizing transient currents and supply droops. When the threshold is reached, a closed loop
activates and clamps the output current to the set value. A fault is then reported on the CS pin.
These switches also offer highly-accurate current sensing to provide real-time diagnostics to the system. A
current mirror sources current from VIN, reflecting this as voltage on the Current Sense (CS) pin. The CS
pin does not need to be calibrated, and can serve as a diagnostics report pin. Whenever an open load or
short happens, the voltage on the CS pin falls to 0 V. Whenever a current limit, thermal event, or an open
load or short in the off state occurs, the voltage is pulled up to its maximum threshold. High-accuracy
current monitoring and adjustable current limit are ideal for industrial applications like programmable logic
controllers, motor valves, servo drives, and control units.
Another functionality of smart high-side switches is load-dump compatibility, which allows these devices to
connect directly to a 12-V battery without concerns about typical voltage and current transients. Additional
protection includes mitigation of large inrush current events that would otherwise damage downstream
components.
Smart high-side switches can be AEC-Q100 certified, allowing full integration into many automotive
applications that require a low on-resistance and high voltage tolerances to accommodate voltage spikes
and inrush current events. Some of these applications include front and rear lighting, seat heating,
infotainment, cluster, powertrain, and ADAS.
(1) (2)
Table 7. Smart High-Side Examples
CURRENT
RECOMMENDED
SENSE CONTINUOUS LOAD TYPICA PACKA
DESCRIPTION DEVICE VOLTAGE
ACCURA CURRENT L Ron GE
RANGE
CY
Selectable current limit for design flexibility, low RON,
TPS1HA08-Q1 3 V to 40 V ±5% at 1 A 0 A to 12 A 8 mΩ SOP
small footprint, thermal sensing

Low standby current, highly accurate current sense, TPS1H100-Q1 3.5 V to 40 V ±3% at 1 A 0 A to 4 A 100 mΩ SOP
thermal shutdown TPS27S100 3.5 V to 40 V ±3% at 1 A 0 A to 4 A 80 mΩ SOP
Multi-channel support, fast hardware interrupts, low
TPSxH160-Q1 3.4 V to 40 V ±3% at 1 A 0 A to 1.8 A per channel 160 mΩ SOP
standby current, loss of GND diagnostics

(1)
Additional devices in various typical RON values are available.
(2)
Visit ti.com/smarthighsideswitch for more information about smart high-side switches.

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(1) (2)
Table 7. Smart High-Side Examples (continued)
CURRENT
RECOMMENDED
SENSE CONTINUOUS LOAD TYPICA PACKA
DESCRIPTION DEVICE VOLTAGE
ACCURA CURRENT L Ron GE
RANGE
CY
TPS2HB08-Q1 +3/-8% at
Dual-channel, programmable current limit 3 V to 28 V 0 A to 8 A per channel 8 mΩ SOP
1A
Inductive load negative clamp with optimized slew rate, TPSxH000-Q1
3.4 V to 40 V - 0 A to 1A 1Ω SOP
global fault report
Highly accurate current limit, supports full diagnostics TPS1H200-Q1
3.4 V to 40 V - 0 A to 2.5 A 200 mΩ SOP
with the digital status output

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7 Low-Side Switches
Vcc Vcc

Load 1

IN1

Load 2

IN2

Load 7

IN7

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Figure 8. Low-Side Switch Block Diagram

Low-side switches are used to connect and disconnect ground from a load, unlike the rest of the power
switch topologies. This configuration allows low-side switches to drive inductive loads; an internal flyback
diode prevents inductive transients from damaging the circuit and components. Whenever the switch is
opened, the inductive transients flow through the flyback diode and dissipate throughout the load. This
makes these devices ideal for motors, solenoids, and relays.
Low-side switches consists of two designs: Darlington pair arrays and low-side MOSFET solutions.
Darlington pair solutions can support higher voltage applications due to the higher voltage ratings of the
integrated BJTs, while the MOSFET solutions have lower on-resistances and lower leakage currents. Most
of the low-side switches contain seven channels, which can be tied in parallel to support higher current
operation.

Table 8. Low-side Switch Examples

RECOMMENDED MAX NUMBER OF
DESCRIPTION DEVICE PACKAGE
VOLTAGE RANGE CURRENT CHANNELS
SOIC, SOP,
500 mA per
Darlington pair BJTs, higher voltage support ULN2003A 0 V to 50 V 7 and DIP
channel
Packages
500 mA per
Darlington pair BJTs, 8-channel support ULN2803A 0 V to 50 V 8 SOIC
channel
Low-side MOSFET solutions, low on-resistance and current 600 mA per
TPL7407LA 0 V to 30 V 7 SOIC or SOP
leakage, power efficient channel

8 References
1. Texas Instruments, Basics of Load Switches Application Report
2. Texas Instruments, What is an eFuse? Application Report
3. Texas Instruments, Robust Hot Swap Design Application Report
4. Texas Instruments, Adjustable Current Limit of Smart High Side Switch Application Report

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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (November 2018) to A Revision ................................................................................................ Page

• Changed content in abstract. ............................................................................................................ 1

• Edited application report for clarity. ..................................................................................................... 1
• Changed headings, row 3, and row 7 in table 1. ...................................................................................... 2
• Added table notes to table 1. ............................................................................................................ 2
• Changed the caption for the Typical Power Switch Use Cases figure. ............................................................ 2
• Changed row 3 in table 2. ............................................................................................................... 3
• Changed content in section 2. ........................................................................................................... 4
• Changed row 1 and 2 in table 3. ........................................................................................................ 4
• Changed rows 2, 5, and 6 in table 4. ................................................................................................... 5
• Changed title and row 1, 2, and 4 in table 6. .......................................................................................... 7
• Changed content in section 6. ........................................................................................................... 8
• Changed rows 4, 5, and 6 in table 7. ................................................................................................... 8

SLVA927A – November 2017 – Revised April 2019 Revision History 11

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